Dynamic low-oxygen structure and plasma cleaning machine with same

Abstract

The invention discloses a dynamic low-oxygen structure on the first aspect, which comprises a cover plate with a cleaning channel arranged in the middle in a penetrating manner; the cleaning module is arranged on the first side of the cover plate; the heating table is arranged on the second side of the cover plate, a cleaning area is arranged on the side, close to the cover plate, of the heating table, and a cleaning cavity is formed by the cleaning area and the second side of the cover plate; the steel belt is arranged on the cleaning module; the first gas channel is arranged on one side of the heating table; secondly, the invention discloses a plasma cleaning machine which comprises the dynamic low-oxygen structure. The cleaning area is arranged at the top of the heating table, the cleaning cavity is formed between the cleaning area and the cover plate, the cleaning module drives the steel belt to move, dynamic sealing of the cleaning channel is achieved, protective gas is inflated through the first gas channel and the second gas channel, the oxygen content in the cleaning cavity is reduced, and the wafer cleaning effect is guaranteed; the consumption of protective gas is reduced, the production cost is reduced, the equipment size is reduced, and meanwhile online unmanned automatic production is achieved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor production, and in particular to a dynamic low-oxygen structure and a plasma cleaning machine having the same. Background Art

[0002] Wafer processing is an important process in the semiconductor industry, and plasma cleaning is a part of the wafer processing process. The main function of plasma cleaning is to remove pollutants and residues on the surface of the wafer to ensure the quality and stability of wafer processing.

[0003] Plasma cleaning technology in a low-oxygen environment provides cleaner and more stable processing conditions for semiconductor manufacturing, which can effectively improve product quality and manufacturing efficiency.

[0004] Current plasma cleaning machines generally adopt a non-online type, usually by first placing the pre-cleaned wafers into a material box, and then placing the material box into a plasma cleaning chamber, then sealing the chamber, filling the chamber with a protective gas, and then cleaning. However, the above-mentioned plasma cleaning machine has the following problems: the equipment is large in size, consumes a lot of protective gas, has high production costs, and is difficult to control the oxygen content in the chamber. It cannot realize automatic loading and unloading, cannot be combined with a production line, can only be used alone, requires manual cooperation, and has low production efficiency. Summary of the invention

[0005] In view of the shortcomings of the prior art, the present invention aims to provide a dynamic low-oxygen structure and a plasma cleaning machine having the same, so as to solve the problems raised in the above background technology. To achieve the above purpose, the present invention adopts the following technical solutions:

[0006] In a first aspect, the present invention discloses a dynamic hypoxic structure, comprising: a cover plate, a cleaning channel is provided through the middle of the cover plate;

[0007] A cleaning module, disposed on the first side of the cover plate, with a working end thereof being slidably connected to the cleaning channel;

[0008] A heating platform is arranged on the second side of the cover plate, a cleaning area is arranged on the side of the heating platform close to the cover plate, and when the heating platform is close to the cover plate, the cleaning area and the second side of the cover plate form a cleaning chamber;

[0009] a steel belt, disposed on the cleaning module and located on the second side of the cover plate, for closing the cleaning channel around the cleaning module when the cleaning module moves;

[0010] The first gas channel is arranged at one side of the heating platform and communicated with the cleaning chamber.

[0011] Optionally, the heating platform is provided with a frame around it, the frame is higher than the cleaning area, and the first gas channel is provided on the frame on one side of the cleaning area.

[0012] Optionally, an exhaust channel is provided through the frame of the cleaning area on a side away from the first gas channel.

[0013] Optionally, a supporting module is further included, the supporting module includes a Y-axis assembly and a Z-axis assembly, the Z-axis assembly is arranged at the working end of the Y-axis assembly, and the heating platform is arranged on the Z-axis assembly.

[0014] Optionally, the support module further comprises a plurality of support rods, which are respectively arranged on the peripheral side of the Z-axis assembly, respectively penetrate the heating platform, and are respectively slidably connected to the heating platform.

[0015] Optionally, a second gas channel is arranged on the second side of the cover plate surrounding the cleaning channel and corresponding to the steel belt.

[0016] Optionally, the cleaning module includes a Y-axis module and a cleaning head, wherein the cleaning head is disposed at a working end of the Y-axis module and is slidably connected to the cleaning channel.

[0017] Optionally, rollers are rotatably provided on the cover plates at both ends of the cleaning channel, and the steel belt is rollingly connected to the two rollers, and its two ends are connected to two sides of the cleaning head respectively.

[0018] Optionally, the support module further includes an X-axis assembly, and the Y-axis assembly is disposed at a working end of the X-axis assembly.

[0019] In a second aspect, the present invention discloses a plasma cleaning machine, wherein the plasma cleaning machine comprises the above-mentioned dynamic low-oxygen structure.

[0020] The beneficial effect compared with the prior art is that, by adopting the above scheme, a cleaning area is arranged on the top of the heating table, so that a cleaning chamber is formed between the cleaning area and the cover plate, and the steel belt is driven to move by the cleaning module to realize dynamic sealing of the cleaning channel; the cleaning chamber is filled with protective gas through the first gas channel and the second gas channel, and the gap between the steel belt and the cover plate is sealed, thereby reducing the oxygen content in the cleaning chamber, ensuring the wafer cleaning effect, and at the same time greatly reducing the consumption of protective gas and reducing production costs; the wafer is cleaned by the cross-movement of the cleaning module and the heating table, which greatly reduces the size of the equipment; and online unmanned automated production is realized through the cooperation of the support module and the external manipulator. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of the dynamic hypoxic structure of the present invention;

[0022] Figure 2 It is a schematic diagram of the heating platform structure of the present invention;

[0023] Figure 3 It is a schematic diagram of the support module structure of the present invention;

[0024] Figure 4 It is a structural schematic diagram of a part of the support module and the support rod of the present invention;

[0025] Figure 5 It is a schematic diagram of the cross-sectional structure of the cover plate, the steel belt and the second gas channel of the present invention;

[0026] Figure 6 It is a schematic diagram of the cleaning head structure of the present invention;

[0027] Figure 7 It is a schematic diagram of the steel strip structure of the present invention;

[0028] As shown in the above drawings: 1. cover plate; 2. cleaning module; 3. heating table; 4. steel belt; 5. first gas channel; 6. cleaning channel; 7. air inlet connector; 30. wafer; 31. cleaning area; 32. frame; 8. exhaust channel; 9. wafer table; 10. support module; 11. Y-axis assembly; 12. Z-axis assembly; 13. support rod; 14. second gas channel; 15. roller; 17. air inlet head; 18. through hole; 21. Y-axis module; 221. plasma; 22. cleaning head; 15. roller; 16. X-axis assembly. DETAILED DESCRIPTION

[0029] To facilitate the understanding of the present invention, the present application is described in more detail below in conjunction with the accompanying drawings and specific embodiments; the accompanying drawings show preferred embodiments of the present application; however, the present application can be implemented in many different forms and is not limited to the embodiments described in this specification; on the contrary, the purpose of providing these embodiments is to make the understanding of the disclosed content of the present application more thorough and comprehensive.

[0030] It should be noted that, unless otherwise clearly stipulated and limited, the terms "set", "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be directly connected or indirectly connected through an intermediate medium, or it can be internal communication between two elements; for ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances; the terms "vertical", "horizontal", "left", "right", "front", "rear" and similar expressions used in this specification are for illustrative purposes only.

[0031] At the same time, it should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence; it should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0032] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by technicians in the technical field to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not used to limit this application.

[0033] In a first aspect, the present invention discloses a dynamic hypoxic structure, such as Figure 1-2 As shown, it includes a cover plate 1, a cleaning module 2, a heating platform 3, a steel belt 4 and a first gas channel 5. The cover plate 1 is horizontally arranged, and a cleaning channel 6 is vertically penetrated through the middle of the cover plate 1. The cleaning module 2 is arranged above the cover plate 1, and its working end is horizontally slidably connected with the cleaning channel 6; the heating platform 3 is arranged below the cover plate 1, and a cleaning area 31 is arranged on the top surface of the heating platform 3. When the heating platform 3 is close to the cover plate 1, the cleaning area 31 and the bottom surface of the cover plate 1 form a cleaning chamber; the steel belt 4 is arranged on the cleaning module 2 and is located on the bottom surface of the cover plate 1, and is used to close the cleaning channel 6 around the cleaning module 2 when the cleaning module 2 moves; the first gas channel 5 is arranged on one side of the top surface of the heating platform 3 and is connected with the cleaning chamber.

[0034] When cleaning the wafer 30, the wafer 30 is located in the cleaning area 31 of the heating platform 3. The heating platform 3 moves upward so that the cleaning area 31 and the bottom surface of the cover plate 1 form a cleaning chamber. The steel belt 4 and the cleaning module 2 close the cleaning channel 6. The protective gas enters the cleaning chamber through the first gas channel 5 and discharges the oxygen in the cleaning chamber. When the cleaning module 2 moves horizontally, it drives the steel belt 4 to move, keeps the volume of the cleaning chamber stable, and achieves a stable oxygen concentration in the cleaning chamber.

[0035] The dynamic low-oxygen structure forms a cleaning chamber between the cleaning area and the cover plate by setting a cleaning area on the top of the heating table. The cleaning module drives the steel belt to move, thereby realizing dynamic sealing of the cleaning channel, greatly reducing the size of the equipment. The cleaning chamber is filled with protective gas through the first gas channel, thereby reducing the oxygen content in the cleaning chamber, and at the same time greatly reducing the consumption of protective gas and reducing production costs.

[0036] In one embodiment, Figure 2As shown, a frame 32 is arranged around the top surface of the heating platform 3, and the frame 32 is higher than the cleaning area 31, so that a cleaning chamber is formed between the cleaning area 31 and the cover plate 1, and a first gas channel 5 is arranged on the frame 32 on one side of the cleaning area 31, so as to facilitate the entry of protective gas at one end inside the cleaning chamber, thereby promoting the discharge of oxygen in the cleaning chamber.

[0037] In one embodiment, the first gas channel 5 is configured to be groove-shaped, and a plurality of gas inlet connectors 7 are provided on the frame 32 at the bottom of the first gas channel 5. The plurality of gas inlet connectors 7 are respectively connected to the first gas channel 5 to facilitate the protective gas to quickly and fully enter the cleaning chamber from one end.

[0038] In one embodiment, Figure 2 As shown, an exhaust channel 8 is opened through the frame 32 of the cleaning area 31 on the side away from the first gas channel 5. The exhaust channel 8 and the first gas channel 5 are arranged opposite to each other. When the protective gas enters from one end of the cleaning chamber, the oxygen is discharged from the exhaust channel 8, which can quickly reduce the oxygen content in the cleaning chamber.

[0039] In one embodiment, Figure 2 As shown, in order to speed up the oxygen exhaust speed, a plurality of exhaust channels 8 are provided and arranged at intervals on the frame 32 away from the first gas channel 5 .

[0040] In one embodiment, Figure 2 As shown, a wafer table 9 is provided in the middle of the cleaning area 31 for placing the wafer 30, and the height of the wafer table 9 is greater than the height of the cleaning area 31 and less than the height of the frame 32, so as to facilitate the placement of the wafer 30 and keep the wafer 30 in the cleaning chamber.

[0041] In one embodiment, Figure 3-4 As shown, it also includes a supporting module 10, which includes a Y-axis component 11 and a Z-axis component 12. The Z-axis component 12 is arranged at the working end of the Y-axis component 11, and the heating table 3 is arranged on the Z-axis component 12. The Y-axis component 11 is used to drive the Z-axis component 12 to move along the front and rear directions, so as to cooperate with the cleaning module 2 to adjust the position of the wafer 30. The Z-axis component 12 is used to drive the heating table 3 to move along the vertical direction, so that the heating table 3 is close to or away from the cover plate 1.

[0042] In one embodiment, the support module 10 further includes a plurality of support rods 13, which are respectively arranged on the peripheral sides of the Z-axis assembly 12, a plurality of through holes 18 are arranged on the heating platform, and the plurality of support rods correspond one by one to the plurality of through holes 18 and are slidably connected.

[0043] In this embodiment, there are three support rods. Support rod 3 is used to place wafer 30 and connect to an external robot to facilitate the external robot to take and place wafer 30. Support rod 3 moves with Y-axis assembly 11, but does not move with Z-axis assembly 12. When placing wafer 30, Z-axis assembly 12 drives heating table 3 to descend, and the external robot lifts wafer 30 from the bottom and places wafer 30 on multiple support rods 13. After the robot leaves, Z-axis assembly 12 drives heating table 3 to rise, so that wafer 30 falls on wafer table 9. After heating table 3 rises into place, the distance between the bottom surface of cover plate 1 and frame 32 is controlled within 1MM, thereby maintaining the volume of cleaning chamber.

[0044] In one embodiment, Figure 5 , 7 As shown, the bottom surface of the cover plate 1 is surrounded by the cleaning channel 6 and is provided with a second gas channel 14 corresponding to the steel belt 4. The outlet of the second gas channel 14 is located at the gap between the steel belt 4 and the cover plate 1. When the cover plate 1 and the cleaning area 31 form a cleaning chamber, an air inlet head 17 is provided above the cover plate. The air inlet head 17 is connected to the second gas channel 14. The protective gas enters from the second gas channel 14. After encountering the steel belt 4, the protective gas flows into the cleaning chamber along the gap between the steel belt 4 and the cover plate 1, and assists in removing the oxygen inside the cleaning chamber. Another part is reflected after encountering the steel belt 4, preventing external oxygen from flowing into the cleaning chamber from the gap between the steel belt 4 and the cover plate 1, maintaining the low oxygen environment of the cleaning chamber, and the protective gas is filled through the first gas channel 5 and the second gas channel 14, so that the oxygen concentration in the cleaning chamber can be stably maintained within 100ppm, thereby reducing the usage of the protective gas and reducing the oxygen concentration in the cleaning area 31.

[0045] In one embodiment, Figure 1 , 6 As shown, the cleaning module 2 includes a Y-axis module 21 and a cleaning head 22 . The cleaning head 22 is disposed at the working end of the Y-axis module 21 and is slidably connected to the cleaning channel 6 .

[0046] During operation, the Y-axis module 21 drives the cleaning head 22 to move in the front-rear direction, and the width of the cleaning head 22 matches the width of the cleaning chamber to seal the cleaning chamber in the area of ​​the cleaning head 22 .

[0047] In one embodiment, Figure 7As shown, rollers 15 are rotatably provided on the cover plates 1 at the front and rear ends of the cleaning channel 6, and the steel belt 4 is respectively connected to the two rollers 15 in a rolling manner, and its two ends are respectively connected to the front and rear sides of the cleaning head 22. The two rollers 15 can maintain a fixed distance between the top surface of the steel belt 4 and the cover plate 1. When the cleaning head 22 moves, it drives the steel belt 4 to rotate, and the two cooperate to dynamically close the entire cleaning channel 6. In this embodiment, two tensioning rollers are further provided under the support module 10, so that the steel belt 4 is wrapped around the two tensioning rollers, so that the support module 10 is located in the wrapped steel belt 4, while maintaining the upper section of the steel belt 4. Interference between the lower section of the steel belt 4 and the support module 10 is avoided.

[0048] In one embodiment, Figure 3 As shown, the support module 10 also includes an X-axis assembly 16, and the Y-axis assembly 11 is arranged at the working end of the X-axis assembly 16; the X-axis assembly 16 is used to drive the heating table 3 to move in the front-to-back direction, and cross the movement direction of the cleaning module 2, thereby reducing the size of the equipment and facilitating an external manipulator to load materials from the front side, thereby realizing automatic loading and unloading, and facilitating integration with the production line, thereby improving production efficiency.

[0049] During cleaning, the plasma 221 emitted by the cleaning head 22 starts cleaning from the left side of the wafer 30, and the X-axis assembly 16 drives the wafer 30 to move from front to back, so that one-third of the left side of the entire wafer 30 passes through the cleaning head 22, and then the Y-axis module 21 drives the cleaning head 22 to move a certain distance to the right, and then the X-axis assembly 16 drives the wafer 30 to move forward, so that the middle part of the entire wafer 30 passes through the cleaning head 22, at this time, two-thirds of the cleaning of the wafer 30 is completed, and finally the Y-axis module 21 drives the cleaning head 22 to move a certain distance to the right, and the X-axis assembly 16 drives the wafer 30 to move backward to complete the cleaning of the entire wafer 30.

[0050] In one embodiment, the length of the cover plate in the Y-axis direction is at least greater than the moving distance of the heating platform 3 in the Y-axis direction, and the length of the cover plate in the X-axis direction is at least greater than twice the length of the heating platform 3 in the X-axis direction. Compared with the movement of the wafer 30 in the X-axis and Y-axis directions, when the cleaning module 2 is fixed, the area of ​​the cover plate 1 is reduced by 40%, and the size of the equipment is also reduced.

[0051] In a second aspect, the present invention discloses a plasma cleaning machine, which includes the above-mentioned dynamic low-oxygen structure.

[0052] It should be noted that the above-mentioned technical features are further combined with each other to form various embodiments not listed above, which are all deemed to be within the scope of the present invention; and, for ordinary technicians in this field, they can be improved or transformed according to the above description, and all these improvements and transformations should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A dynamic hypoxic structure, characterized in that: include: A cover plate, wherein a cleaning passage is provided through the middle thereof; A cleaning module, disposed on the first side of the cover plate, with a working end thereof being slidably connected to the cleaning channel; A heating platform is arranged on the second side of the cover plate, a cleaning area is arranged on the side of the heating platform close to the cover plate, and when the heating platform is close to the cover plate, the cleaning area and the second side of the cover plate form a cleaning chamber; a steel belt, disposed on the cleaning module and located on the second side of the cover plate, for closing the cleaning channel around the cleaning module when the cleaning module moves; The first gas channel is arranged at one side of the heating platform and communicated with the cleaning chamber.

2. A dynamic hypoxic structure according to claim 1, characterized in that: The heating platform is provided with a frame around it, the frame is higher than the cleaning area, and the first gas channel is provided on the frame at one side of the cleaning area.

3. A dynamic hypoxic structure according to claim 2, characterized in that: An exhaust channel is formed through the frame of the cleaning area at a side away from the first gas channel.

4. A dynamic hypoxic structure according to claim 1, characterized in that: It also includes a supporting module, which includes a Y-axis component and a Z-axis component. The Z-axis component is arranged at the working end of the Y-axis component, and the heating platform is arranged on the Z-axis component.

5. A dynamic hypoxic structure according to claim 1, characterized in that: The support module further comprises a plurality of support rods, which are respectively arranged on the peripheral side of the Z-axis assembly, respectively penetrate the heating platform, and are respectively slidably connected to the heating platform.

6. A dynamic hypoxic structure according to claim 1, characterized in that: The second side of the cover plate surrounds the cleaning channel and is provided with a second gas channel corresponding to the steel belt.

7. A dynamic hypoxic structure according to claim 1, characterized in that: The cleaning module comprises a Y-axis module and a cleaning head. The cleaning head is arranged at the working end of the Y-axis module and is slidably connected with the cleaning channel.

8. A dynamic hypoxic structure according to claim 1, characterized in that: Rollers are rotatably arranged on the cover plates at both ends of the cleaning channel, and the steel belt is rollingly connected to the two rollers, and its two ends are connected to the two sides of the cleaning head respectively.

9. A dynamic hypoxic structure according to claim 1, characterized in that: The supporting module also includes an X-axis assembly, and the Y-axis assembly is arranged at a working end of the X-axis assembly.

10. A plasma cleaning machine, characterized in that: The plasma cleaning machine comprises the dynamic low-oxygen structure according to any one of claims 1-9.

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