Alignment apparatus, film forming apparatus, alignment method, and method for manufacturing electronic device

Abstract

The invention provides an alignment device, a film forming apparatus, an alignment method, and a method for manufacturing an electronic device, which can further improve the accuracy of position adjustment of a mask and a substrate. Provided is an alignment device which is characterized by being provided with: an electrostatic adsorption plate (20) that holds a substrate (S); a support member (30) that supports the electrostatic adsorption plate (20); a position adjustment mechanism (100) that moves the support member (30) with respect to at least one of a first direction parallel to the film formation surface of the substrate (S) and a second direction perpendicular to the film formation surface, and that adjusts the position of the substrate (S) and the mask (M) placed on the mask stage (41); and a fine movement position adjustment member (200) that performs position adjustment of the mask (M) and the substrate (S) by causing the electrostatic adsorption plate (20) to perform fine movement.

Description

Technical Field

[0001] The present invention relates to an alignment device, a film forming device, an alignment method and a method for manufacturing an electronic device. Background Art

[0002] In the manufacture of electronic devices such as organic EL display devices, a thin film is formed on a substrate via a mask. As a pre-treatment for film formation, the position adjustment (alignment) of the mask and the substrate is performed. For example, the position adjustment is performed by moving a support member that supports an electrostatic adsorption plate (electrostatic chuck) that holds the substrate in a direction parallel to the film formation surface of the substrate and in a direction perpendicular to the film formation surface (see Patent Document 1).

[0003] However, in recent years, the size of substrates has been increasing, and with this, the size of the device has also been increasing. In addition, the vacuum chamber in the film forming device has become larger, and on the other hand, with the weight limit, the rigidity of the components constituting the vacuum chamber tends to decrease, and the influence of vibration will also increase. Therefore, it is difficult to adjust the position of the mask and the substrate with high precision by simply adjusting the position of the support member as in the above-mentioned technology.

[0004] Prior Art Literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2022-57673 Summary of the invention

[0007] Problems to be solved by the invention

[0008] An object of the present invention is to provide an alignment device, a film forming device, an alignment method, and a method for manufacturing an electronic device that can further improve the accuracy of position adjustment between a mask and a substrate.

[0009] Means for solving problems

[0010] The present invention adopts the following means to solve the above-mentioned problems.

[0011] That is, the alignment device of the present invention is characterized by comprising:

[0012] a substrate holding member that holds a substrate;

[0013] a supporting member that supports the substrate holding member;

[0014] a position adjustment mechanism that moves the support member relative to at least one of a first direction parallel to a film forming surface of the substrate and a second direction perpendicular to the film forming surface to adjust the positions of the mask mounted on the mask stage and the substrate; and

[0015] A fine movement position adjustment component is configured to adjust the positions of the mask and the substrate by finely moving the substrate holding member.

[0016] Furthermore, the film forming apparatus of the present invention is characterized by comprising:

[0017] The alignment device as described above; and

[0018] A film forming source is configured to form a thin film on the substrate via the mask in a state where the positions of the mask and the substrate are adjusted by the alignment device.

[0019] In addition, the alignment method of the present invention is characterized by having:

[0020] a first position adjustment step in which a support member supporting a substrate holding member is moved relative to at least one of a first direction parallel to a film forming surface of a substrate held by the substrate holding member and a second direction perpendicular to the film forming surface using a position adjustment mechanism to adjust the positions of the mask mounted on the mask stage and the substrate; and

[0021] A second position adjustment step is performed in which the positions of the mask and the substrate are adjusted by slightly moving the substrate holding member using a fine-motion position adjustment device.

[0022] Furthermore, the method for manufacturing an electronic device of the present invention is characterized by having a film forming step in which, after the positions of the mask and the substrate are adjusted by the alignment method, a thin film is formed on the substrate via the mask using a film forming source.

[0023] Effects of the Invention

[0024] As described above, according to the present invention, the accuracy of positional adjustment between the mask and the substrate can be further improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic structural diagram of the film forming device of Example 1.

[0026] Figure 2 This is a top view of the support member of Example 1.

[0027] Figure 3 This is an illustration of position adjustment.

[0028] Figure 4 This is a schematic structural diagram showing a part of the supporting member of Example 2.

[0029] Figure 5 This is a schematic structural diagram of the film forming device of Example 3.

[0030] Figure 6 It is an explanatory diagram of an organic EL display device.

[0031] Description of Reference Numerals

[0032] 1, 1A: film forming device 10: vacuum chamber 20, 20A: electrostatic adsorption plate 30, 30A: support member 31: workbench 32: support column 32a: first rigid part 32b: second rigid part 32c: attenuation body 33: holding part 34: vibration reduction mechanism part 40, 40A: mask support member 41: mask stage 45: support column 46: mask stage 47: vibration reduction mechanism part 48: actuator 50: evaporation source 60: Control unit 70 magnet plate 100: position adjustment mechanism 110: substrate Z actuator 120: alignment workbench 121: chamber fixing part 122: actuator part 123: connection part 200, 200A: fine-motion position adjustment component 210, 250: fixing part 220, 260: movable part 270: optical scale 280: optical encoder C: alignment camera M: mask M1: alignment mark S: substrate S1: alignment mark. DETAILED DESCRIPTION

[0033] Hereinafter, embodiments of the present invention will be described in detail. However, the following embodiments only illustrate preferred structures of the present invention, and the scope of the present invention is not limited to these structures. In addition, unless otherwise specified, it is not intended that the scope of the present invention is limited to the hardware structure and software structure, processing flow, manufacturing conditions, size, material, shape, etc. of the device in the following description.

[0034] (Example 1)

[0035] Reference Figure 1~Figure 3 , an alignment device, a film forming device having an alignment device, an alignment method, and a method for manufacturing an electronic device according to Example 1 of the present invention are described. The film forming device of this embodiment is a device that deposits a film forming material on the surface of a substrate via a mask to form a thin film. As film forming methods, vacuum evaporation and sputtering can be exemplified. By aligning the substrate and the mask and performing film formation, a thin film having a pattern corresponding to the opening pattern of the mask is formed on the substrate. When multiple layers are formed on a substrate, the layers that have been formed up to the previous step are sometimes referred to as "substrate". In order to form a thin film via a mask with high precision, the film forming device of this embodiment adjusts the relative position of the substrate and the mask for alignment.

[0036] As the material of the substrate, examples include glass, semiconductors such as silicon, thin films of polymer materials, metals, etc. can be exemplified. In addition, as the substrate, examples include a silicon wafer or a substrate with a thin film of polyimide or the like stacked on the substrate. As film-forming materials, examples include organic materials, inorganic materials (metals, metal oxides), etc. can be exemplified. As a mask, an example of a metal mask having an opening pattern corresponding to a thin film pattern formed on the substrate can be exemplified. As electronic devices manufactured by the manufacturing method of this embodiment, examples include semiconductor devices, magnetic devices, electronic components, various electronic devices, optical components, light-emitting elements, photoelectric conversion elements, touch screens, display devices with light-emitting elements (such as organic EL display devices), lighting devices (such as organic EL lighting devices), sensors with photoelectric conversion elements (such as organic CMOS image sensors), etc. can be exemplified. It is particularly suitable for the manufacture of organic light-emitting elements such as OLEDs and organic photoelectric conversion elements such as organic thin-film solar cells.

[0037] Hereinafter, the direction parallel to the film forming surface of the substrate is referred to as the first direction, and the direction perpendicular to the film forming surface of the substrate is referred to as the second direction. Figure 1 In the XYZ axis shown, the X-axis direction and the Y-axis direction are included in the first direction, and the Z-axis direction is equivalent to the second direction. In addition, the rotation around the Z axis is set to the θ direction. The θ direction is also included in the first direction. In this embodiment, the XY plane is parallel to the horizontal plane, and the Z direction is parallel to the vertical direction.

[0038] <Film forming equipment>

[0039] Figure 1 This is a schematic structural diagram of the film forming apparatus 1 of Example 1, and is a diagram showing the schematic structure of the film forming apparatus 1 in a cross-sectional manner. The film forming apparatus 1 forms a film on the film forming surface of the substrate S via the mask M. In the film forming apparatus 1, a series of film forming processes are performed, such as the transfer of the substrate S and / or the mask M between the conveying device that carries the substrate S and the mask M from the outside to the film forming apparatus 1, the adjustment (alignment) of the relative position of the substrate S and the mask M, the fixing of the mask M and the substrate S, and film formation.

[0040] The film forming apparatus 1 has a vacuum chamber 10. The interior of the vacuum chamber 10 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen. In addition, the film forming apparatus 1 includes an electrostatic adsorption plate 20 (electrostatic chuck (ESC)) as a substrate holding member for holding a substrate S, a support member 30 for supporting the electrostatic adsorption plate 20, a mask support member 40 for supporting a mask M, and an evaporation source 50 as a film forming source. The electrostatic adsorption plate 20, the lower part of the support member 30, the mask support member 40, and the evaporation source 50 are arranged inside the vacuum chamber 10.

[0041] The support member 30 integrally includes a flat workbench 31, a support column 32 extending in the Z-axis direction (second direction), and a holding portion 33 for holding the electrostatic adsorption plate 20. A mask stage 41 for mounting the mask M is provided on the mask support member 40. In addition, the mask M has an opening pattern corresponding to the thin film formed on the film forming surface of the substrate S. As the mask M, for example, a metal mask having a structure in which a metal foil having an opening pattern is stretched on a frame with high rigidity can be used. In this embodiment, after the substrate S and the mask M are aligned, the substrate S is placed on the mask M and a film is formed.

[0042] The evaporation source 50 is composed of a crucible for accommodating the evaporation material, a heater for heating the crucible, a baffle that can be opened and closed for controlling the scattering of the evaporation material, an evaporation rate monitor, etc. The film forming device 1 may also have a driving mechanism for moving the evaporation source 50. Through the action of the driving mechanism, the evaporation source 50 is moved while the film is formed, thereby making the film thickness on the substrate S uniform. The driving mechanism may also be a structure as follows: the evaporation source 50 is retreated to a predetermined position (original position) other than during film formation, and the evaporation source 50 is moved when film formation starts. Since the film forming device 1 of this embodiment is a vacuum evaporation device, the evaporation source 50 that heats the film forming material (evaporation material) and evaporates it is used as the film forming source. However, the film forming source is not limited to the evaporation source 50, and for example, it may be a sputtering device using a sputtering target. The evaporation source 50 plays a role in forming a film on the substrate S through the mask M after the substrate S and the mask M are in close contact.

[0043] In addition, a cooling plate may be provided to suppress the temperature rise of the substrate S during film formation. By cooling the substrate S with the cooling plate, the deterioration and degradation of the organic material can be suppressed. The cooling plate may also serve as a magnet plate to improve the adhesion between the substrate S and the mask M during film formation by attracting the mask M with magnetic force. Figure 1 2 also shows a structure in which a magnet plate 70 is provided. The magnet plate 70 is configured to be movable up and down, and by bringing the magnet plate 70 close to the substrate S after the substrate S and the mask M are aligned, the mask M can be attracted by magnetic force, and the adhesion between the substrate S and the mask M can be improved.

[0044] In addition, the film forming device 1 has a control unit 60. The control unit 60 has the function of controlling various mechanisms and the evaporation source 50 and controlling film formation. The control unit 60 can be composed of a computer having a processor, memory, storage, I / O, etc. In this case, the function of the control unit 60 is realized by the processor executing a program stored in the memory or storage. As a computer, a general-purpose personal computer can be used, and an embedded computer or PLC (programmable logic controller) can also be used. Alternatively, a circuit such as ASIC or FPGA can be used to constitute part or all of the functions of the control unit 60. In addition, the control unit 60 can be set for each film forming device 1, or one control unit can control multiple film forming devices 1.

[0045] Furthermore, the film forming apparatus 1 of the present embodiment has a function as an alignment device for positionally adjusting (aligning) the substrate S and the mask M. As main components for achieving this function, a position adjustment mechanism 100 and a fine-motion position adjustment member 200 are provided.

[0046] The position adjustment mechanism 100 has a function of moving the support member 30 in at least one of a first direction parallel to the film forming surface of the substrate S and a second direction perpendicular to the film forming surface to adjust the positions of the mask M and the substrate S mounted on the mask stage 41 .

[0047] The position adjustment mechanism 100 is described in more detail below. The position adjustment mechanism 100 includes a substrate Z actuator 110 that moves the entire support member 30 up and down along the Z-axis direction (second direction) at the upper portion of the outer side of the vacuum chamber 10. The actuator is composed of, for example, a motor and a ball screw, a motor and a linear guide, and the like.

[0048] In addition, the position adjustment mechanism 100 is provided with an alignment stage 120 at the upper portion of the outer side of the vacuum chamber 10. The alignment stage 120 can move the substrate S in the first direction (more specifically, move in the XY direction and rotate in the θ direction) to change the relative position of the substrate S and the mask M. The alignment stage 120 includes: a chamber fixing portion 121 connected and fixed to the vacuum chamber 10; an actuator portion 122 for performing XYθ movement; and a connection portion 123 connected to the support member 30.

[0049] As the actuator unit 122, an actuator formed by stacking an X actuator, a Y actuator, and a θ actuator may also be used. In addition, a UVW type actuator in which a plurality of actuators cooperate may also be used. Regardless of the type of the actuator unit 122, it is possible to drive the substrate S in accordance with the control signal sent from the control unit 60 and move it along the first direction. If it is a stacked type actuator, the control signal is equivalent to the motion amount information of each XYθ actuator, and if it is a UVW type actuator, the control signal is equivalent to the motion amount information of each UVW actuator.

[0050] The fine motion position adjustment member 200 has a function of adjusting the positions of the mask M and the substrate S by acting on the support member 30 and finely moving the electrostatic adsorption plate 20. The fine motion position adjustment member 200 will be described in more detail below.

[0051] The fine movement position adjustment component 200 of the present embodiment has a function of performing position adjustment by deforming a part of the support member 30 , and more specifically, has a function of deforming a part of the support member 30 by utilizing a magnetic force.

[0052] The fine position adjustment member 200 includes a fixing member 210 fixed to the mask support member 40 and a movable member 220 fixed to the holding portion 33 of the support member 30. Figure 2 In FIG. 1 , with respect to the plan view showing the main structure of the support member 30 , the position where the fixing member 210 is provided is indicated by a dotted line.

[0053] By changing the current value flowing through the coil built into the stator 210, the required thrust can be generated by utilizing the Lorentz force generated with respect to the magnet built into the movable member 220. If necessary, each coil built into the stator 210 can be covered with a water cooling jacket and actively cooled by flowing a refrigerant.

[0054] In this embodiment, the movable member 220 is arranged at four corners of the upper surface of the holding portion 33 of the supporting member 30. The fixing member 210 is respectively arranged to be opposite to these movable members 220. Although simplified in the figure, the movable member 220 and the fixing member 210 are structures that generate thrust in the three directions of XYZ according to each combination. In order to generate thrust in the three directions of XYZ, three coils are also provided in the fixing member 210. As a result, it is possible to cause force (magnetic force) to act on the corners of the holding portion 33 of the supporting member 30 in the XYZ direction.

[0055] According to the above structure, by controlling the amount of current supplied to the coil built into each fixing member 210, the magnetic force can be applied to the corner of the retaining portion 33 of the supporting member 30, and a part of the support portion 32 can be deformed together with the retaining portion 33, so that the electrostatic adsorption plate 20 can be slightly moved.

[0056] An alignment method using the alignment device configured as described above will be described. Figure 3 An example of the positional relationship between the alignment mark M1 for the mask formed on the mask M and the alignment mark S1 for the substrate formed on the substrate S is shown. In addition, these alignment marks are arranged to be photographed by the alignment camera C provided in the film forming apparatus 1. The alignment camera C is arranged on the outer upper surface of the vacuum chamber 10, and a through hole is provided in the electrostatic adsorption plate 20 at a portion corresponding to the field of view of the alignment camera C, or a portion corresponding to the field of view is composed of a light-transmitting member. Thus, the alignment mark M1 and the alignment mark S1 can be photographed by the alignment camera C.

[0057] The sensor of the alignment camera C is preferably a sensor that is sensitive to infrared wavelengths, in which case the alignment mark M1 can be photographed through the substrate S. In addition, in order to ensure the mark contrast within the field of view and improve the mark recognition rate, it is desirable to adopt the following structure: a light source is set on the mask stage 41 and light is irradiated from the bottom of the mask M, and the light is received by the sensor of the alignment camera C.

[0058] Figure 3 (a) shows an example of the positional relationship between the alignment mark M1 and the alignment mark S1 before alignment. First, the position adjustment is performed by moving and adjusting the entire support member 30 using the position adjustment mechanism 100 (first position adjustment process). That is, the control unit 60 uses the substrate Z actuator 110 to move the support member 30 so that the substrate S adsorbed on the electrostatic adsorption plate 20 moves to a predetermined alignment position. In this state, the control unit 60 moves and adjusts the alignment workbench 120 based on the image data captured by the alignment camera C, thereby adjusting the position of the substrate S so that the distance between the alignment mark M1 and the alignment mark S1 falls within a preset threshold. In addition, the position adjustment is performed until a plurality of alignment marks M1 and alignment marks S1 fall within the threshold. Figure 3 (b) shows an example of the positional relationship between the alignment mark M1 and the alignment mark S1 after the position adjustment by the position adjustment mechanism 100 .

[0059] Next, position adjustment is performed by the fine-motion position adjustment component 200 (second position adjustment process). That is, the control unit 60 controls the amount of current to the coils respectively built into the plurality of fixtures 210 based on the image data obtained by the alignment camera C in the state where the position adjustment using the position adjustment mechanism 100 is performed. As a result, the electrostatic adsorption plate 20 is finely moved, and the position of the substrate S is adjusted so that the distance between the alignment mark M1 and the alignment mark S1 falls within a preset threshold. In addition, the above threshold when the position adjustment is performed by the fine-motion position adjustment component 200 is set to a value smaller than the above threshold when the position adjustment is performed by the position adjustment mechanism 100. Figure 3 (c) shows an example of the positional relationship between the alignment mark M1 and the alignment mark S1 after the position adjustment based on the fine-motion position adjustment component 200. Here, since the fine-motion position adjustment component 200 of this embodiment can also adjust the Z-axis direction (second direction) of the electrostatic adsorption plate 20, it is also possible to adjust the parallelism between the electrostatic adsorption plate 20 (or the substrate S adsorbed on the electrostatic adsorption plate 20) and the mask M. This point is explained below. Generally speaking, since the film-forming material accumulates in the opening part through which the film-forming material passes over time, the mask M is usually replaced with a new mask M every several dozen times or so. As the size of the mask M increases, its flatness tends to decrease. Therefore, even if the flatness of the mask stage 41 is kept constant, the parallelism between the electrostatic adsorption plate 20 and the mask M sometimes changes due to the replacement of the mask M. Therefore, by pre-setting sensors (not shown) for measuring the distance between the electrostatic adsorption plate 20 (or the substrate S adsorbed on the electrostatic adsorption plate 20) and the mask M at a plurality of locations, and performing adjustments based on the fine-motion position adjustment component 200 so as to make the distances at each location equal (in reality, the difference in the distances at each location is made to fall within a preset threshold), the parallelism between the electrostatic adsorption plate 20 and the mask M (the parallelism between the substrate S and the mask M) can be optimized. Thus, even when the mask M is replaced with a new one, after alignment, when the substrate S and the mask M are brought into contact and film formation is performed, the close contact between the substrate S and the mask M can be improved, and the film formation accuracy can be improved.

[0060] After the above position adjustment (alignment) is performed, the substrate S is placed on the mask M, and a film forming operation (film forming step) of forming a thin film on the substrate S via the mask M is performed using the evaporation source 50 .

[0061] As described above, in this embodiment, after the position adjustment by the position adjustment mechanism 100 is performed, the position adjustment by the fine-motion position adjustment member 200 is performed. Therefore, even if it is difficult to perform high-precision position adjustment of the mask M and the substrate S by the position adjustment by the position adjustment mechanism 100 alone due to the enlargement of the film forming apparatus 1, the vibration of the vacuum chamber 10, etc., the position adjustment by the fine-motion position adjustment member 200 can improve the accuracy of the position adjustment.

[0062] (Example 2)

[0063] exist Figure 4 2 shows the embodiment 2 of the present invention. In this embodiment, the structure of the supporting member is different from that of the above-mentioned embodiment 1. Since the other structures and functions are the same as those of the embodiment 1, the same reference numerals are marked on the same structural parts and their description is omitted.

[0064] Figure 4 : is a schematic structural diagram showing a part of the supporting member of the present embodiment, showing the appearance near the supporting member. In the film forming device of the present embodiment, since only the structure related to the support portion is different from that of the embodiment 1, only the structure related to the support portion will be described in the following description. The supporting member of the present embodiment also includes a support portion 32 and a holding portion 33 for holding the electrostatic adsorption plate 20. In the present embodiment, the support portion 32 has a first rigid portion 32a and a second rigid portion 32b, and the second rigid portion 32b is arranged on the side closer to the portion for holding the electrostatic adsorption plate 20 than the first rigid portion 32a, and has lower rigidity than the first rigid portion 32a.

[0065] As described in Example 1, by controlling the amount of current supplied to the coil built into the fixing member 210, a magnetic force acts on the corner of the holding portion 33 of the support member 30, a part of the support portion 32 is deformed together with the support portion 33, and the electrostatic adsorption plate 20 is slightly moved. Therefore, when the rigidity of the support portion 32 is high, the support portion 32 is difficult to deform, and therefore, the electrostatic adsorption plate 20 is difficult to slightly move. By adopting a structure in which the support portion 32 has a second rigid portion 32b with low rigidity as in this embodiment, the electrostatic adsorption plate 20 can be easily slightly moved. Therefore, compared with Example 1, the position adjustment based on the fine position adjustment component 200 can be performed more smoothly. However, when the structure having the second rigid portion 32b with low rigidity is adopted, the influence of the vibration transmitted from the vacuum chamber 10 to the electrostatic adsorption plate 20 through the support member increases. Therefore, it is desirable that the second rigid portion 32b is provided with a damping body 32c composed of a damping material. Thereby, the vibration transmitted to the electrostatic adsorption plate 20 can be suppressed.

[0066] (Example 3)

[0067] exist Figure 5 Embodiment 3 of the present invention is shown in the above-mentioned embodiment 1. In the above-mentioned embodiment 1, the following situation is shown: the fine-motion position adjustment component is configured to adjust the position of the mask and the substrate by acting on the supporting member and causing the substrate holding member to move slightly. In contrast, in the present embodiment, the following situation is shown: the fine-motion position adjustment component is configured to adjust the position of the mask and the substrate by acting on the substrate holding member and causing the substrate holding member to move slightly. Since other structures and functions are the same as those in embodiment 1, the same structural parts are marked with the same figure marks, and their descriptions are appropriately omitted. In addition, the same as shown in embodiment 1 Figure 1 Similarly, in Figure 5 In the XYZ axes shown, the X-axis direction and the Y-axis direction are also included in the first direction, and the Z-axis direction corresponds to the second direction.

[0068] Figure 5 This is a schematic structural diagram of the film forming apparatus 1A of Example 3, and is a diagram showing the schematic structure of the film forming apparatus 1A in a cross-sectional manner. The film forming apparatus 1A of this embodiment also includes a vacuum chamber 10, an electrostatic adsorption plate 20A (electrostatic chuck (ESC)), a support member 30A, a mask support member 40A, an evaporation source 50, and a control unit 60.

[0069] The support member 30A of this embodiment also integrally includes a flat worktable 31 and a support column 32 extending in the Z-axis direction (second direction). In addition, in the support member 30A of this embodiment, a vibration reduction mechanism 34 is fixed to the lower part of the support column 32. The electrostatic adsorption plate 20A is fixed via the vibration reduction mechanism 34. Thus, the transmission of vibration to the electrostatic adsorption plate 20A can be suppressed.

[0070] The mask support member 40A includes a support column 45 extending in the Z-axis direction (second direction), a mask stage 46 supporting the mask M, a vibration reduction mechanism 47 for reducing vibration of the mask stage 46, and an actuator 48 for moving the support column 45 in the Z-axis direction. Since the mask stage 46 is fixed to the support column 45 via the vibration reduction mechanism 47, it is possible to reduce the transmission of vibration to the mask stage 46.

[0071] The film forming source is not limited to the evaporation source 50, and may be, for example, a sputtering device using a sputtering target as described in Example 1. Also, as described in Example 1, a cooling plate for suppressing the temperature rise of the substrate S may be provided, or a structure in which a magnet plate 70 is provided may be adopted.

[0072] Furthermore, the film forming apparatus 1 of this embodiment has a function as an alignment device for performing position adjustment (alignment) between the substrate S and the mask M. As main structures for performing this function, a position adjustment mechanism 100 and a fine position adjustment member 200A are provided. Since the position adjustment mechanism 100 is the same as that described in the first embodiment, its description is omitted.

[0073] The fine motion position adjustment member 200A of this embodiment has a function of adjusting the positions of the mask M and the substrate S by acting on the electrostatic attraction plate 20A and finely moving the electrostatic attraction plate 20A. More specifically, the fine motion position adjustment member 200A adopts a structure that finely moves the electrostatic attraction plate 20A by using magnetic force.

[0074] The fine position adjustment component 200A includes: a fixed part 250, which is set on the mask stage 46; and a movable part 260, which is set on the electrostatic adsorption plate 20A. By changing the current value flowing in the coil built into the fixed part 250, it is possible to generate the required thrust by utilizing the Lorentz force generated relative to the magnet built into the movable part 260, which is the same as in Example 1. The fixed part 250 and the movable part 260 are arranged in multiple places. And, similarly to Example 1, the movable part 260 and the fixed part 250 are structures that generate thrust in the three directions of XYZ according to each combination. In order to generate thrust in the three directions of XYZ, three coils are also provided in the fixed part 250.

[0075] According to the above structure, by controlling the amount of current supplied to the coils built into each fixing part 250, it is possible to cause magnetic force to act on each movable part 260, so that the electrostatic adsorption plate 20A can be slightly moved. In addition, in the present embodiment, a plurality of optical scales 270 are arranged on the electrostatic adsorption plate 20A, and optical encoders 280 are respectively provided at positions of the mask stage 46 that are opposite to each optical scale 270. Thus, since the relative positional relationship between the electrostatic adsorption plate 20A and the mask stage 46 can be measured with high precision, high-precision alignment can be performed.

[0076] The alignment method using the alignment device configured as above is the same as that of Embodiment 1 except for the position adjustment by the fine movement position adjustment member 200A (second position adjustment step). Therefore, the position adjustment by the fine movement position adjustment member 200A will be mainly described.

[0077] In this embodiment, before the substrate S held on the electrostatic adsorption plate 20A comes into contact with the mask M placed on the mask stage 46, position adjustment is performed by the position adjustment mechanism 100 (first position adjustment process). After the first position adjustment process, the substrate S is placed on the mask M, and after the substrate S and the mask M come into contact, position adjustment is performed by the fine-motion position adjustment member 200A in a state where they are in contact (second position adjustment process).

[0078] In the position adjustment based on the fine-motion position adjustment component 200A, the control unit 60 controls the amount of current to the coils respectively built into the plurality of fixtures 250 based on the image data obtained by the alignment camera C in the state where the position adjustment using the position adjustment mechanism 100 is performed. As a result, the electrostatic adsorption plate 20A is finely moved, and the position of the substrate S is adjusted so that the distance between the alignment mark M1 and the alignment mark S1 falls within a preset threshold. In addition, the above threshold when the position adjustment based on the fine-motion position adjustment component 200A is performed is set to a value smaller than the above threshold when the position adjustment based on the position adjustment mechanism 100 is performed, which is the same as in Example 1.

[0079] After the above position adjustment (alignment) is performed, a film forming operation (film forming step) of forming a thin film on the substrate S via the mask M is performed using the evaporation source 50 .

[0080] As described above, in this embodiment, the position adjustment by the fine-motion position adjustment member 200A is also performed after the position adjustment by the position adjustment mechanism 100. Therefore, even if it is difficult to perform high-precision position adjustment of the mask M and the substrate S by the position adjustment by the position adjustment mechanism 100 alone due to the enlargement of the film forming apparatus 1A, the vibration of the vacuum chamber 10, etc., the position adjustment by the fine-motion position adjustment member 200A can improve the accuracy of the position adjustment.

[0081] In addition, in the present embodiment, a structure in which a coil is provided on the mask stage 46 and a magnet is provided on the electrostatic adsorption plate 20A is shown. However, a structure in which a magnet is provided on the mask stage and a coil is provided on the electrostatic adsorption plate can also be adopted. However, it is necessary to provide wiring for energizing the coil, and there is a concern that the reaction force of the bending of the wiring itself may affect the fine alignment. Therefore, for the object to be moved and adjusted, it is desirable to adopt a structure in which a magnet is provided instead of a coil. In the present embodiment, the above-mentioned structure is adopted.

[0082] <Method for manufacturing electronic device>

[0083] Next, an example of a method for manufacturing an electronic device using the film forming apparatus of each of the above-described embodiments is described. Hereinafter, as an example of an electronic device, the structure of an organic EL display device is shown, and a method for manufacturing the organic EL display device is exemplified.

[0084] First, the organic EL display device to be manufactured will be described. Figure 6 (a) is an overall view of the organic EL display device 150. Figure 6 (b) shows the cross-sectional structure of one pixel.

[0085] like Figure 6 As shown in (a), in the display area 151 of the organic EL display device 150, a plurality of pixels 152 having a plurality of light-emitting elements are arranged in a matrix. The details will be described later, and each of the light-emitting elements has a structure having an organic layer sandwiched by a pair of electrodes. In addition, the pixel mentioned here refers to the smallest unit that can display the desired color in the display area 151. In the case of the organic EL display device of this embodiment, the pixel 152 is composed of a combination of a first light-emitting element 152R, a second light-emitting element 152G, and a third light-emitting element 152B that emit light different from each other. The pixel 152 is usually composed of a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but it can also be a combination of a yellow light-emitting element, a blue light-emitting element, and a white light-emitting element, as long as it is at least one color, and it is not particularly limited.

[0086] Figure 6 (b) Yes Figure 6Schematic diagram of partial cross-section at line AB in (a). The pixel 152 is composed of a plurality of light-emitting elements, each of which has a first electrode (anode) 154, a hole transport layer 155, any one of the light-emitting layers 156R, 156G, and 156B, an electron transport layer 157, and a second electrode (cathode) 158 on a substrate 153. Among them, the hole transport layer 155, the light-emitting layers 156R, 156G, 156B, and the electron transport layer 157 are equivalent to organic layers. In addition, in this embodiment, the light-emitting layer 156R is an organic EL layer that emits red light, the light-emitting layer 156G is an organic EL layer that emits green light, and the light-emitting layer 156B is an organic EL layer that emits blue light. The light-emitting layers 156R, 156G, and 156B are formed into patterns corresponding to the light-emitting elements (sometimes also referred to as organic EL elements) that emit red light, green light, and blue light, respectively. In addition, the first electrode 154 is formed separately for each light-emitting element. The hole transport layer 155, the electron transport layer 157, and the second electrode 158 may be formed in common in the plurality of light-emitting elements 152R, 152G, and 152B, or may be formed for each light-emitting element. In addition, in order to prevent the first electrode 154 and the second electrode 158 from being short-circuited due to foreign matter, an insulating layer 159 is provided between the first electrode 154. Furthermore, since the organic EL layer is degraded by moisture and oxygen, a protective layer 140 is provided to protect the organic EL element from moisture and oxygen.

[0087] exist Figure 6 In (b), the hole transport layer 155 and the electron transport layer 157 are shown as one layer, but they may be formed of a plurality of layers including a hole blocking layer and an electron blocking layer depending on the structure of the organic EL display element. In addition, a hole injection layer may be formed between the first electrode 154 and the hole transport layer 155, and the hole injection layer has an energy band structure that allows holes to be smoothly injected from the first electrode 154 to the hole transport layer 155. Similarly, an electron injection layer may be formed between the second electrode 158 and the electron transport layer 157.

[0088] Next, an example of a method for manufacturing an organic EL display device will be described in detail.

[0089] First, a circuit (not shown) for driving the organic EL display device and the substrate 153 on which the first electrode 154 is formed are prepared.

[0090] Acrylic resin is formed by spin coating on the substrate 153 having the first electrode 154 formed thereon, and the acrylic resin is patterned by photolithography to form an opening in the portion having the first electrode 154 formed thereon, thereby forming the insulating layer 159. The opening corresponds to a light emitting region where the light emitting element actually emits light.

[0091] The substrate 153 on which the insulating layer 159 is patterned is carried into the first organic material film forming device, and the substrate is held by the substrate support table and the electrostatic chuck, and the hole transport layer 155 is formed as a common layer on the first electrode 154 in the display area. The hole transport layer 155 is formed by vacuum evaporation. In fact, since the hole transport layer 155 is formed to be larger than the display area 151, a high-precision mask is not required.

[0092] Next, the substrate 153 formed with the hole transport layer 155 is carried into the second organic material film forming device and held by the substrate support table and the electrostatic chuck. The substrate and the mask are aligned, the substrate is placed on the mask, and the light-emitting layer 156R emitting red light is formed on the portion of the substrate 153 where the element emitting red light is arranged.

[0093] Similar to the film formation of the light-emitting layer 156R, the light-emitting layer 156G emitting green light is formed by the third organic material film-forming device, and the light-emitting layer 156B emitting blue light is formed by the fourth organic material film-forming device. After the film formation of the light-emitting layers 156R, 156G, and 156B is completed, the electron transport layer 157 is formed in the entire display area 151 by the fifth film-forming device. The electron transport layer 157 is formed as a common layer on the light-emitting layers 156R, 156G, and 156B of the three colors.

[0094] The substrate on which the electron transport layer 157 has been formed is moved in a metallic vapor deposition material film forming apparatus to form a film of the second electrode 158 .

[0095] Thereafter, the process is moved to a plasma CVD device to form a protective layer 140 , thereby completing the organic EL display device 150 .

[0096] If the substrate 153 with the patterned insulating layer 159 is exposed to an atmosphere containing moisture and oxygen from the time when it is carried into the film forming device until the film forming of the protective layer 140 is completed, the light-emitting layer composed of the organic EL material may be degraded by moisture and oxygen. Therefore, in this embodiment, the substrate is carried in and out of the film forming device in a vacuum atmosphere or an inert gas atmosphere.

Claims

1. An alignment device, characterized in that: The alignment device comprises: a substrate holding member that holds a substrate; a supporting member that supports the substrate holding member; a position adjustment mechanism that moves the support member relative to at least one of a first direction parallel to a film forming surface of the substrate and a second direction perpendicular to the film forming surface to adjust the positions of the mask mounted on the mask stage and the substrate; and A fine movement position adjustment component is configured to adjust the positions of the mask and the substrate by finely moving the substrate holding member.

2. The alignment device according to claim 1, characterized in that The fine movement position adjustment unit acts on the support member to finely move the substrate holding member, thereby adjusting the positions of the mask and the substrate.

3. The alignment device according to claim 2, characterized in that: After the position adjustment by the position adjustment mechanism, the position adjustment by the fine-motion position adjustment member is performed.

4. The alignment device according to claim 2 or 3, characterized in that: The fine motion position adjustment component performs position adjustment by deforming a portion of the support member.

5. The alignment device according to claim 4, characterized in that: The supporting member comprises: a first rigid portion; and A second rigid portion is provided on a side closer to a portion for holding the substrate holding member than the first rigid portion and has lower rigidity than the first rigid portion.

6. The alignment device according to claim 5, characterized in that The second rigid part is provided with a damping body made of damping material.

7. The alignment device according to claim 4, characterized in that The fine movement position adjustment device deforms a portion of the support member by utilizing a magnetic force.

8. The alignment device according to claim 1, characterized in that The fine-motion position adjustment component acts on the substrate holding member to finely move the substrate holding member, thereby adjusting the positions of the mask and the substrate.

9. The alignment device according to claim 8, characterized in that The fine-motion position adjustment unit finely moves the substrate holding member by utilizing a magnetic force.

10. The alignment device according to claim 8 or 9, characterized in that: The position adjustment by the position adjustment mechanism is performed before the substrate held by the substrate holding member comes into contact with the mask mounted on the mask stage, and the position adjustment by the fine movement position adjustment unit is performed after the substrate comes into contact with the mask.

11. A film forming device, characterized in that: The film forming device comprises: The alignment device according to any one of claims 1 to 10; and A film forming source is configured to form a thin film on the substrate via the mask in a state where the positions of the mask and the substrate are adjusted by the alignment device.

12. An alignment method, characterized in that: The alignment method has: a first position adjustment step in which a position adjustment mechanism is used to move a support member that supports a substrate holding member relative to at least one of a first direction parallel to a film forming surface of a substrate held by the substrate holding member and a second direction perpendicular to the film forming surface, thereby adjusting the positions of a mask placed on a mask stage and the substrate; as well as A second position adjustment step is performed in which the positions of the mask and the substrate are adjusted by slightly moving the substrate holding member using a fine-motion position adjustment device.

13. The alignment method according to claim 12, characterized in that: In the second position adjustment step, the positions of the mask and the substrate are adjusted by using the fine-motion position adjustment means to act on the support member to finely move the substrate holding member.

14. The alignment method according to claim 13, characterized in that: In the second position adjustment step, the fine position adjustment device deforms a portion of the support member by magnetic force.

15. The alignment method according to claim 12, characterized in that: In the second position adjustment step, the positions of the mask and the substrate are adjusted by using the fine movement position adjustment means to act on the substrate holding member and finely move the substrate holding member.

16. The alignment method according to claim 15, characterized in that: In the second position adjustment step, the substrate holding member is slightly moved by the magnetic force using the fine movement position adjustment means.

17. The alignment method according to claim 15, characterized in that: The first position adjustment step is performed before the substrate held by the substrate holding member comes into contact with the mask placed on the mask stage. The second position adjustment step is performed after the substrate and the mask come into contact with each other.

18. A method for manufacturing an electronic device, characterized in that: The method for manufacturing an electronic device includes a film forming step, in which a thin film is formed on the substrate via the mask using a film forming source after the positions of the mask and the substrate are adjusted by the alignment method according to any one of claims 13 to 17.

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