Vacuum suction nozzle, bonding equipment and method

Abstract

The invention provides a vacuum suction nozzle, a bonding device and a bonding method. The vacuum suction nozzle is characterized in that the vacuum suction nozzle comprises a body which is internally provided with a cavity, one end of the cavity is communicated with a vacuum mechanism, and the other end of the cavity is aligned with a skin with a hole to form a deformable adsorption part; and the telescopic part is positioned in the cavity, extrudes the skin through one end of the spherical surface of the telescopic part, and adjusts the height of the spherical surface of the adsorption part, so that the to-be-bonded piece is adsorbed into a corresponding convex spherical surface shape.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a vacuum nozzle, a bonding device, a bonding method, and a computer-readable storage medium. Background Art

[0002] Since the chip bonding accuracy is at the nanometer level, any slight change in parameters will cause a huge deviation in bonding accuracy. The standard for chip bonding is to achieve bonding by photographing the chip target and the wafer target with a camera. In order to prevent bubbles from being generated during chip bonding, a spherical nozzle is generally used to make the center of the chip contact the position to be bonded first, and then release the chip. However, even for the targets of the same batch of chips, the positions are very different during the etching process. If only one spherical height nozzle is used to bond the chip, the greater the change in the chip target position, the lower the bonding accuracy.

[0003] The spherical height of existing spherical nozzles is not adjustable. When the position of the chip target changes greatly, the nozzle is usually replaced to match the spherical height required by the chip target. However, this method not only has poor replacement consistency, but also requires a longer calibration time, which has an adverse effect on the joint bonding accuracy and efficiency, thereby affecting the actual production capacity of the machine.

[0004] In order to overcome the above-mentioned defects of the prior art, the art is in urgent need of a vacuum nozzle technology to adapt to the bonding requirements of chips with various marking positions, so as to improve the joint bonding accuracy and efficiency of multiple chips, thereby improving the actual production capacity of the machine. Summary of the invention

[0005] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0006] In order to overcome the above-mentioned defects of the prior art, the present invention provides a vacuum nozzle, a bonding device, a bonding method, and a computer-readable storage medium, which are used to adapt to the bonding requirements of chips with various marking positions, so as to improve the joint bonding accuracy and efficiency of various chips, thereby improving the actual production capacity of the machine.

[0007] Specifically, a vacuum suction nozzle provided according to the first aspect of the present invention includes: a main body, a cavity is provided inside thereof, wherein one end of the cavity is connected to a vacuum mechanism, and the other end thereof is aligned with a skin with a hole to form a deformable adsorption portion; and a telescopic portion, which is located inside the cavity and squeezes the skin through one end of its spherical surface to adjust the spherical height of the adsorption portion so as to adsorb the part to be bonded into a corresponding convex spherical shape.

[0008] Furthermore, in some embodiments of the present invention, the body is fixedly mounted on a bonding head, wherein the bonding head is provided with the vacuum mechanism, which is connected to the cavity via a vent hole to adsorb the part to be bonded, wherein the part to be bonded is selected from a plurality of chips with different marking positions.

[0009] Furthermore, in some embodiments of the present invention, the telescopic part adopts piezoelectric ceramics, a first end of which is fixedly connected to the bonding head, and a spherical second end of which squeezes the skin and expands and contracts in a direction close to or away from the skin according to the received voltage to adjust the spherical height of the adsorption part.

[0010] Furthermore, in some embodiments of the present invention, the vacuum nozzle also includes a controller, which is configured to: obtain the marking position information of the part to be bonded, and determine the driving voltage corresponding to the spherical height based on this; and provide the driving voltage to the piezoelectric ceramic to drive it to expand and contract in a direction close to or away from the skin, so as to adjust the adsorption portion to a spherical height corresponding to the marking position information.

[0011] Furthermore, in some embodiments of the present invention, the vacuum nozzle also includes a 3D camera for collecting 3D point cloud data of the skin to fit the spherical adsorption surface of the adsorption part, wherein the controller is further configured to negatively feedback adjust the driving voltage according to the maximum height difference of the fitted spherical adsorption surface and / or the spherical adsorption area of ​​the area above a preset height threshold.

[0012] Furthermore, in some embodiments of the present invention, the first end of the telescopic part is connected to a driving part, and the second spherical end thereof squeezes the skin, wherein the driving part drives the telescopic part to move toward or away from the skin according to a received control signal to adjust the spherical height of the adsorption part.

[0013] In addition, the bonding equipment provided according to the second aspect of the present invention includes: a wafer chuck, used to adsorb the wafer to be bonded; and a bonding head, on which is provided a vacuum suction nozzle as described in any one of the first aspects of the present invention, used to adsorb the chip to be bonded into a corresponding raised spherical shape according to the marked position of the chip to be bonded, and then bond it from the inside out to the target position of the wafer.

[0014] In addition, the bonding method provided according to the third aspect of the present invention includes the following steps: adsorbing the wafer to be bonded via the wafer chuck of the bonding device as described in the second aspect of the present invention; and determining the spherical height of the adsorption portion of the vacuum suction nozzle on the bonding head of the bonding device according to the marked position of the chip to be bonded, and adsorbing the chip into a corresponding raised spherical shape via the vacuum suction nozzle, and then bonding the chip from the inside out to the target position of the wafer.

[0015] Further, in some embodiments of the present invention, the bonding device is used to jointly bond multiple chips with different marking positions to the wafer, wherein the step of determining the spherical height of the adsorption portion of the vacuum suction nozzle on the bonding head of the bonding device according to the marking position of the chip to be bonded, adsorbing the chip into a corresponding raised spherical shape via the vacuum suction nozzle, and then bonding the chip to the target position of the wafer from the inside out includes: responding to an instruction to bond a first chip, determining its corresponding first spherical height according to a first marking position of the first chip, adsorbing the first chip into a corresponding first spherical shape via the vacuum suction nozzle, and then bonding it to the first position of the wafer from the inside out; and responding to an instruction to bond a second chip, determining its corresponding second spherical height according to a second marking position of the second chip, adsorbing the second chip into a corresponding second spherical shape via the vacuum suction nozzle, and then bonding it to the second position of the wafer from the inside out.

[0016] In addition, the computer-readable storage medium provided according to the fourth aspect of the present invention stores computer instructions, which, when executed by a processor, implement the bonding method as described in the third aspect of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0018] Figure 1 A schematic structural diagram of a vacuum nozzle provided according to some embodiments of the present invention is shown.

[0019] Figure 2 A schematic structural diagram of an adsorption portion provided according to some embodiments of the present invention is shown.

[0020] Figure 3 A schematic structural diagram of a telescopic portion provided according to some embodiments of the present invention is shown.

[0021] Figure 4The deformation simulation spectrum of the suction nozzle under the force of the driving device is shown.

[0022] Figure 5 A schematic structural diagram of a 3D camera fitting adsorption unit provided according to some embodiments of the present invention is shown.

[0023] Figure 6 A schematic diagram of the deformation structure of a spherical adsorption surface provided according to some embodiments of the present invention is shown.

[0024] Figure 7 A schematic flow chart of a bonding method provided according to some embodiments of the present invention is shown.

[0025] Reference numerals:

[0026] 10 Vacuum nozzle

[0027] 20 Adsorption unit

[0028] 201 Ontology

[0029] 202 Cavity

[0030] 203 Skinning

[0031] 2031 Ventilation Hole

[0032] 30 Telescopic part

[0033] 301 Drive unit

[0034] 302 sphere

[0035] 40 3D Camera DETAILED DESCRIPTION

[0036] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0037] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0039] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0040] As mentioned above, since the chip bonding accuracy is at the nanometer level, any slight change in parameters will cause a huge deviation in bonding accuracy. The standard for chip bonding is to achieve bonding by photographing the chip target and wafer target with a camera. In order to prevent bubbles from being generated during chip bonding, a spherical nozzle is generally used to make the center of the chip contact the position to be bonded first, and then release the chip. However, even for targets of the same batch of chips, the positions during the etching process are very different. If only one spherical height nozzle is used to bond the chip, the greater the change in the chip target position, the lower the bonding accuracy.

[0041] The spherical height of existing spherical nozzles is not adjustable. When the position of the chip target changes greatly, the nozzle is usually replaced to match the spherical height required by the chip target. However, this method not only has poor replacement consistency, but also requires a longer calibration time, which has an adverse effect on the joint bonding accuracy and efficiency, thereby affecting the actual production capacity of the machine.

[0042] In order to overcome the above-mentioned defects of the prior art, the present invention provides a vacuum nozzle, a bonding device, a bonding method, and a computer-readable storage medium, which are used to adapt to the bonding requirements of chips with various marking positions, so as to improve the joint bonding accuracy and efficiency of various chips, thereby improving the actual production capacity of the machine.

[0043] In some non-limiting embodiments, the vacuum nozzle provided in the first aspect of the present invention can be configured in the bonding device provided in the second aspect of the present invention, and the bonding method provided in the third aspect of the present invention can be implemented based on the bonding device provided in the second aspect of the present invention. Specifically, the bonding device includes a processor and a memory. The memory includes but is not limited to the computer-readable storage medium provided in the fourth aspect of the present invention, on which computer instructions are stored. When the computer instructions are executed by the processor, the bonding method described in the third aspect of the present invention is implemented.

[0044] Specifically, the bonding device includes a wafer chuck and a bonding head. The wafer chuck is used to absorb the wafer to be bonded. The bonding head is provided with a vacuum suction nozzle 10, which is used to absorb the chip to be bonded into a corresponding convex spherical surface 302 shape according to the marked position of the chip to be bonded, and then bond it from the inside out to the target position of the wafer.

[0045] Please refer to Figure 1 to Figure 3 , Figure 1 A schematic structural diagram of a vacuum nozzle provided according to some embodiments of the present invention is shown. Figure 2 A schematic structural diagram of an adsorption portion provided according to some embodiments of the present invention is shown. Figure 3 A schematic structural diagram of a telescopic portion provided according to some embodiments of the present invention is shown.

[0046] like Figure 1 As shown, the vacuum nozzle 10 includes a body 201 and a telescopic portion 30. A cavity 202 is provided inside the body 201, wherein one end of the cavity 202 is connected to the vacuum mechanism, and the other end thereof is aligned with a perforated skin 203 to form a deformable adsorption portion 20. The telescopic portion 30 is located inside the cavity 202, and squeezes the skin 203 through one end of its spherical surface 302 to adjust the height of the spherical surface 302 of the adsorption portion 20, so as to adsorb the bonded part into the corresponding convex spherical surface 302 shape.

[0047] like Figure 2 As shown, the body 201 is fixedly mounted on a bonding head, wherein the bonding head has a vacuum mechanism, which is connected to the cavity 202 via the vent hole 2031 to absorb the part to be bonded, wherein the part to be bonded is selected from a variety of chips with different marking positions.

[0048] In some embodiments, the cavity 202 of the body 201 may also be directly connected to an external vacuum mechanism.

[0049] like Figure 3As shown, the telescopic part 30 can be made of piezoelectric ceramics (for example, nano piezoelectric ceramics), the first end of which is fixedly connected to the bonding head, and the second end of its spherical surface 302 squeezes the skin 203 and expands and contracts in a direction close to or away from the skin 203 according to the received voltage to adjust the height of the spherical surface 302 of the adsorption part 20.

[0050] In some embodiments, the vacuum nozzle 10 also includes a controller, which is configured to: obtain the marking position information of the part to be bonded, and determine the driving voltage corresponding to the height of the spherical surface 302 based on this; and provide a driving voltage to the piezoelectric ceramic to drive it to expand and contract in a direction close to or away from the skin 203, so as to adjust the adsorption part 20 to the height of the spherical surface 302 corresponding to the marking position information.

[0051] Please refer to Figure 4 , Figure 4 The deformation simulation spectrum of the suction nozzle under the force of the driving device is shown.

[0052] like Figure 4 As shown in the figure, when the skin 203 is squeezed by the spherical surface 302, a local bulge will be generated in the contact area, and the skin 203 can return to its original state after the sphere is removed. Red represents the largest height change of the skin 203, followed by green, and the smallest blue. Among them, the highest point of red is about 32 microns, and the height difference of the yellow area is 16 microns to 24 microns.

[0053] Please refer to Figure 5-6 , Figure 5 A schematic structural diagram of a 3D camera fitting adsorption unit provided according to some embodiments of the present invention is shown. Figure 6 A schematic diagram of the deformation structure of a spherical adsorption surface provided according to some embodiments of the present invention is shown.

[0054] like Figure 5-6 As shown, the vacuum nozzle 10 also includes a 3D camera 40 for collecting 3D point cloud data of the skin 203 to fit the spherical adsorption surface of the adsorption portion 20, wherein the controller is further configured to: according to the maximum height difference d of the fitted spherical adsorption surface, and / or the spherical adsorption area of ​​the area above the preset height threshold, negative feedback adjust the driving voltage to ensure smooth negative feedback control of the spherical surface 302 to improve the bonding accuracy.

[0055] Those skilled in the art can understand that the structure of the telescopic part 30 is only some non-limiting implementation modes provided by the present invention, which is intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than to limit all functions or all working modes of the telescopic part 30.

[0056] In some embodiments, the first end of the telescopic portion 30 is connected to a driving portion 301, and the second end of the spherical surface 302 thereof presses the skin 203, wherein the driving portion 301 drives the telescopic portion 30 to move toward or away from the skin 203 according to the received control signal to adjust the height of the spherical surface 302 of the adsorption portion 20. In some embodiments, the driving portion 301 may be made of piezoelectric ceramics.

[0057] Here, the bonding device is used to bond multiple chips with different marking positions to a wafer. It only needs to adjust the height of the spherical surface 302 of the adsorption part 20 through the telescopic part 30 to adapt to the bonding requirements of multiple chips with different marking positions, thereby effectively avoiding the need to replace the suction nozzle and re-leveling, so as to improve the joint bonding accuracy and efficiency of multiple chips.

[0058] The following will describe the working principle of the above-mentioned bonding device and vacuum nozzle 10 in combination with some embodiments of the bonding method. Those skilled in the art will understand that these embodiments of the bonding method are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than to limit all functions or all working modes of the vacuum nozzle 10 and the bonding device. Similarly, the vacuum nozzle 10 and the bonding device are also only some non-limiting implementation methods provided by the present invention, and do not constitute a limitation on the implementation subject or execution order of each step in the bonding method.

[0059] Please refer to Figure 7 , Figure 7 A schematic flow chart of a bonding method provided according to some embodiments of the present invention is shown.

[0060] like Figure 7 As shown, the bonding device may firstly absorb the wafer to be bonded via the wafer chuck of the bonding device.

[0061] Afterwards, according to the marked position of the chip to be bonded, the height of the spherical surface 302 of the adsorption portion 20 of the vacuum suction nozzle 10 on the bonding head of the bonding equipment is determined, and the chip is adsorbed into the corresponding raised spherical surface 302 shape through the vacuum suction nozzle 10, and then the chip is bonded to the target position of the wafer from the inside out.

[0062] Specifically, in response to the instruction to bond the first chip, the height of the first spherical surface 302 corresponding to the first chip is determined according to the first mark position of the first chip, and the first chip is adsorbed into the corresponding shape of the first spherical surface 302 via the vacuum nozzle 10, and then bonded to the first position of the wafer from the inside out. In response to the instruction to bond the second chip, the height of the second spherical surface 302 corresponding to the second chip is determined according to the second mark position of the second chip, and the second chip is adsorbed into the corresponding shape of the second spherical surface 302 via the vacuum nozzle 10, and then bonded to the second position of the wafer from the inside out.

[0063] In summary, the vacuum nozzle 10, bonding equipment, bonding method, and computer-readable storage medium provided by the present invention can be used to adapt to the bonding requirements of chips with various marking positions to improve the joint bonding accuracy and efficiency of multiple chips, thereby improving the actual production capacity of the machine.

[0064] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0065] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in a RAM memory, a flash memory, a ROM memory, an EPROM memory, an EEPROM memory, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor so that the processor can read and write information from / to the storage medium. In an alternative, a storage medium may be integrated into a processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and the storage medium may reside in a user terminal as discrete components.

[0066] In one or more exemplary embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented as a computer program product in software, each function may be stored on or transmitted by a computer-readable medium as one or more instructions or codes. Computer-readable media include both computer storage media and communication media, including any medium that facilitates the transfer of a computer program from one place to another. Storage media may be any available medium that can be accessed by a computer. As an example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, disk storage or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of an instruction or data structure and can be accessed by a computer. Any connection is also properly referred to as a computer-readable medium. For example, if the software is transmitted from a website, a server, or other remote source using a coaxial cable, a fiber optic cable, a twisted pair, a digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwaves, the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwaves are included in the definition of the medium. Disk and disc as used herein include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu-ray disc, wherein disk often reproduces data magnetically, while disc reproduces data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0067] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A vacuum nozzle, characterized in that: include: The body has a cavity inside, wherein one end of the cavity is connected to the vacuum mechanism, and the other end is aligned with a skin with holes to form a deformable adsorption portion; as well as The telescopic part is located inside the cavity and squeezes the skin through one end of its spherical surface to adjust the spherical height of the adsorption part so as to adsorb the part to be bonded into a corresponding convex spherical shape.

2. The vacuum nozzle according to claim 1, characterized in that: The body is fixedly mounted on a bonding head, wherein The bonding head is provided with the vacuum mechanism, which is connected to the cavity via the vent hole to absorb the part to be bonded, wherein the part to be bonded is selected from a plurality of chips with different marking positions.

3. The vacuum nozzle according to claim 2, characterized in that: The telescopic part is made of piezoelectric ceramics, a first end of which is fixedly connected to the bonding head, and a spherical second end of which squeezes the skin and, according to the received voltage, telescopes toward or away from the skin to adjust the spherical height of the adsorption part.

4. The vacuum nozzle according to claim 3, characterized in that: The vacuum nozzle also includes a controller, which is configured to: Obtaining the marking position information of the to-be-bonded component, and determining the driving voltage corresponding to the spherical surface height accordingly; as well as The driving voltage is provided to the piezoelectric ceramic to drive it to expand or contract in a direction close to or away from the skin, so as to adjust the adsorption portion to a spherical height corresponding to the mark position information.

5. The vacuum nozzle according to claim 4, characterized in that: The vacuum nozzle further includes a 3D camera for collecting 3D point cloud data of the skin to fit the spherical adsorption surface of the adsorption portion, wherein the controller is further configured to: The driving voltage is adjusted in a negative feedback manner according to the maximum height difference of the fitted spherical adsorption surface and / or the spherical adsorption area of ​​the region above a preset height threshold.

6. The vacuum nozzle according to claim 2, wherein: The first end of the telescopic part is connected to a driving part, and the second end of its spherical surface squeezes the skin, wherein the driving part drives the telescopic part to move towards or away from the skin according to a received control signal to adjust the spherical height of the adsorption part.

7. A bonding device, characterized in that: include: Wafer chuck, used to absorb the wafer to be bonded; as well as A bonding head is provided with a vacuum suction nozzle as described in any one of claims 1 to 6, which is used to absorb the chip to be bonded into a corresponding convex spherical shape according to the marked position of the chip to be bonded, and then bond it from the inside out to the target position of the wafer.

8. A bonding method, characterized in that: The following steps are involved: Adsorbing the wafer to be bonded via the wafer chuck of the bonding device as claimed in claim 7; and According to the marked position of the chip to be bonded, the spherical height of the adsorption part of the vacuum suction nozzle on the bonding head of the bonding equipment is determined, and the chip is adsorbed into a corresponding raised spherical shape through the vacuum suction nozzle, and then the chip is bonded to the target position of the wafer from the inside out.

9. The bonding method according to claim 8, characterized in that: The bonding device is used to bond a plurality of chips with different marking positions to the wafer, wherein the steps of determining the spherical height of the adsorption portion of the vacuum suction nozzle on the bonding head of the bonding device according to the marking position of the chip to be bonded, adsorbing the chip into a corresponding convex spherical shape via the vacuum suction nozzle, and then bonding the chip from the inside out to the target position of the wafer include: In response to an instruction to bond the first chip, determine the first spherical height corresponding to the first chip according to the first mark position of the first chip, adsorb the first chip into the corresponding first spherical shape through the vacuum nozzle, and then bond it to the first position of the wafer from the inside out; and In response to the instruction to bond the second chip, the corresponding second spherical height is determined according to the second mark position of the second chip, and the second chip is adsorbed into the corresponding second spherical shape through the vacuum nozzle, and then bonded to the second position of the wafer from the inside out.

10. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the bonding method according to claim 8 or 9 is implemented.

Images