TO247P package

Abstract

The invention relates to the technical field of semiconductor packaging, and provides TO247P packaging which comprises a shell, a frame and a plurality of chips, one side outside the shell is connected with a cooling fin, the frame comprises a chip seat and supporting legs, the chip seat is a ceramic substrate, the front side and the back side of the ceramic substrate are both covered with metal sheets, and the supporting legs are connected with the metal sheets. The chip seat is connected to the inner side wall of the shell, a connecting port is formed in the connecting position of the chip seat and the shell, the chip seat can penetrate through the connecting port to be connected with the cooling fin, the supporting legs are connected to one side of the chip, and the chip is connected to the chip seat. By using the package, the problem that a layer of insulating pad is padded between the existing base and the radiating fin, so that the overall thermal resistance of the device is increased, and the heat dissipation of the chip is influenced is solved. The chip seat using the ceramic substrate can enable the package to achieve internal insulation without affecting the heat conduction effect, the situation that an insulation pad is used for insulation in the existing package is reduced, and the heat dissipation problem of the chip is improved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor packaging, in particular to a TO247P packaging. Background Art

[0002] The semiconductor production process consists of wafer manufacturing, wafer testing, chip packaging and post-packaging testing. After plastic packaging, a series of operations are required, such as post-curing, cutting and molding, electroplating and printing. The typical packaging process is: dicing, loading, bonding, plastic packaging, deburring, electroplating, printing, cutting and molding, appearance inspection, finished product testing, packaging and shipment.

[0003] In chip packaging applications, especially TO247P packaging, high-power devices often face the problem of large power dissipation. If this limit value is exceeded in actual working conditions, the device may suffer irreversible damage. Effective heat dissipation can significantly reduce power dissipation and ensure that the chip works in a relatively safe working environment. At present, the common heat dissipation method for electronic devices is to lock the bottom plate and the heat sink to achieve a heat transfer effect. The heat generated by the chip in the working state is mainly dissipated through the path from the bottom plate to the heat sink. There is a layer of insulating pad between the bottom plate and the heat sink, which undoubtedly increases the overall thermal resistance of the device.

[0004] Therefore, how to reduce the overall thermal resistance of the device and improve the heat transfer and dissipation generated by the chip is the direction that the chip packaging industry should think about. Summary of the invention

[0005] The purpose of the present invention is to solve the problem that a layer of insulating pad is placed between the bottom plate and the heat sink of the device in the prior art, which increases the overall thermal resistance of the device and thus affects the heat dissipation of the chip, and provides a TO247P package.

[0006] In order to achieve the above object, the technical solution adopted by the present invention is:

[0007] A TO247P package comprises a shell, a frame and a plurality of chips, wherein a heat sink is connected to one side of the shell, the frame comprises a chip seat and legs, the chip seat is a ceramic substrate, both the front and back sides of the ceramic substrate are covered with metal sheets, the chip seat is connected to the inner side wall of the shell, a connection port is provided at the connection between the chip seat and the shell, the chip seat can be connected to the heat sink through the connection port, the legs are connected to one side of the chip, and the chip is connected to the chip seat.

[0008] The present invention adopts a TO247P package, the interior of the shell is a hollow structure, the chip seat can be inserted into the inner wall of the shell for fixing, and the fixing method can adopt common clamping, bonding, embedding, etc. The legs are connected to one side of the chip seat, and the legs are used to connect other devices with the chip. The chip seat adopts the ceramic substrate, and the front and back sides of the ceramic substrate are covered with metal. The connection between the chip seat and the shell is provided with a connection port, and the chip seat can be connected to the heat sink through the connection port. Since the ceramic itself has an insulating effect, the use of ceramic sheets in the package can reduce the conduction of electrons from the chip side to the heat sink, thereby improving the heat dissipation rate of the heat sink to the chip; the ceramic also has good thermal conductivity, and can conduct the heat on the chip to the heat sink for cooling, thereby reducing the temperature of the chip. The chip seat using the ceramic substrate can make the package internally insulated without affecting the thermal conductivity, reducing the use of insulating pads for insulation in the existing package, reducing the overall thermal resistance of the device, and thus improving the problem of heat dissipation of the chip.

[0009] As a preferred solution of the present invention, the frame is a LF CLIP frame, and the frame further comprises a plurality of legs, and the legs are used to connect all the chips to the legs.

[0010] By adopting the above technical solution, the LF CLIP frame can be directly connected to the chip, and this structure replaces the means of connecting the frame and the chip using bonding wires in the prior art. The frame can be connected to a plurality of chips through a plurality of the pins, reducing the packaging time required for temporary bonding wires in the prior art. The chip controls the opening or closing of other devices through the signal line.

[0011] As a preferred embodiment of the present invention, the leg includes a first leg, a second leg and a third leg, the first leg, the second leg and the third leg are arranged side by side, the second leg is arranged between the first leg and the third leg, the second leg and the third leg are both connected to the chip, the first leg is connected to the chip through a signal line, the first leg can be connected to a control device, and the connection control device is used to control the chip to transmit signals to the second leg and the third leg.

[0012] The first leg can be connected to a control device to control the chip, so as to control the second leg and the third leg to transmit signals through the chip, and the second leg and the third leg are both connected to the chip and working components.

[0013] As a preferred solution of the present invention, a plurality of the frames can be connected into a whole via a connecting plate.

[0014] The frame can be connected into a whole by using the connecting plate according to actual needs, thereby improving the stability of the connection between the package and the heat sink.

[0015] As a preferred solution of the present invention, the connecting plate is an integrated structure.

[0016] As a preferred solution of the present invention, the connecting port is a rectangular opening.

[0017] As a preferred solution of the present invention, the shell is made of plastic material.

[0018] As a preferred solution of the present invention, the shell is made of epoxy resin material.

[0019] As a preferred embodiment of the present invention, the metal sheet is a copper sheet.

[0020] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0021] A TO247P package adopts this new packaging structure. It uses a copper-clad structure on both sides of the ceramic substrate to replace the traditional frame welding method, which can effectively achieve internal insulation. When the product is used, it does not need to be mounted with an insulating gasket, but can be directly welded to the heat sink, thereby improving the product's heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a front view schematic diagram of a TO247P package;

[0023] Figure 2 This is a schematic diagram of the internal structure of a TO247P package;

[0024] Figure 3 This is a connection diagram of a TO247P package frame;

[0025] Figure 4 It is a connection diagram of several frames of a TO247P package;

[0026] Icon: 1-housing; 2-frame; 21-chip holder; 22-leg; 221-first leg; 222-second leg; 223-third leg; 23-foot; 3-chip; 4-connecting board. DETAILED DESCRIPTION

[0027] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0028] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0029] Example 1

[0030] like Figure 1 As shown, a TO247P package used in the present invention comprises a housing 1, a frame 2 and a plurality of chips 3. The housing 1 is a rectangular parallelepiped structure made of plastic. Figure 2 As shown, the frame 2 includes a chip holder 11 and three legs 12. The chip holder 21 is a ceramic substrate, and the front and back sides of the ceramic sheet are covered with metal sheets, which are copper sheets. The legs 22 are connected to one side of the chip holder 21. The chip holder 21 is bonded to the inner wall of the housing 1. A connection port is provided at the connection between the chip holder 21 and the housing 1. The chip holder 21 can be connected to the heat sink through the connection port. The chip 3 is connected to the chip holder 21, and the chip holder 21 is used to support the chip 3. Figure 3 As shown, the leg 22 includes a first leg 221, a second leg 222 and a third leg 223, the first leg 221, the second leg 222 and the third leg 223 are arranged side by side, the second leg 222 is arranged between the first leg 221 and the third leg 223, the second leg 222 and the third leg 223 are respectively connected to the chip 3, the first leg 221 is connected to the chip 3 through a signal line, the first leg 221 can be connected to the control device, and the control device can control the chip 3 to transmit signals to the second leg 222 and the third leg 223.

[0031] The frame 2 is a LF CLIP frame, and the LF CLIP frame also includes a plurality of legs 21, which can connect all chips 3 to the third leg 223, and the number of legs 21 is consistent with the number of chips 3. The first leg 221 is connected to the chip 3 through a signal line, and the chip 3 controls the opening or closing of other devices through the signal line. The chip 3 can connect the control device to control the opening and closing of the second leg 222 and the third leg 223 through the first leg 221. The housing 1 is made of epoxy resin in plastic material. When a TO247P package described in this embodiment and a TO247P package connected by a traditional welding wire are used in the same environment for testing, the temperature of the TO247P package of this embodiment is 103.488°C, and the temperature of the TO247P package connected by a traditional welding wire is 128.768°C. Compared with the TO247P package connected by a traditional welding wire, the TO247P package of this embodiment can improve the heat dissipation performance of the product by 20%.

[0032] Example 2

[0033] On the basis of Example 1, Figure 4As shown, the present invention adopts a TO247P package, and a plurality of the frames 2 can be connected as a whole through a connecting plate 4 to meet the actual use requirements. The connecting plate 4 is an integrated structure.

[0034] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A TOP247P package, comprising a housing (1), a frame (2) and a plurality of chips (3), wherein a heat sink is connected to one side of the housing (1), and the frame (2) comprises a chip seat (21) and legs (22), wherein: The chip seat (21) is a ceramic substrate, and the front and back sides of the ceramic substrate are covered with metal sheets. The chip seat (21) is connected to the inner wall of the shell (1). A connection port is provided at the connection between the chip seat (21) and the shell (1), and the chip seat (21) can be connected to the heat sink through the connection port. The leg (22) is connected to one side of the chip (3), and the chip (3) is connected to the chip seat (21).

2. The package of TOP247P according to claim 1, characterized in that: The frame (2) is a LF CLIP structure. The frame (2) further comprises a plurality of legs (23). The legs (23) are used to connect all the chips (3) to the legs (22).

3. The package of TOP247P according to claim 2, characterized in that: The leg (22) comprises a first leg (221), a second leg (222) and a third leg (223); the first leg (221), the second leg (222) and the third leg (223) are arranged side by side; the second leg (222) is arranged between the first leg (221) and the third leg (223); the second leg (222) and the third leg (223) are both connected to the chip (3); the first leg (221) is connected to the chip (3) via a signal line; the first leg (221) can be connected to a control device; the connection control device is used to control the chip (3) to transmit signals to the second leg (222) and the third leg (223).

4. A TOP247P package according to any one of claims 1 to 3, characterized in that: A plurality of the frames (2) can be connected into a whole via a connecting plate (4).

5. The package of TOP247P according to claim 4, characterized in that: The connecting plate (4) is an integrated structure.

6. A TOP247P package according to any one of claims 1 to 3, characterized in that: The connecting port is a rectangular opening.

7. A TOP247P package according to any one of claims 1 to 3, characterized in that: The housing (1) is made of plastic material.

8. The package of TOP247P according to claim 7, characterized in that: The shell (1) is made of epoxy resin material.

9. A TOP247P package according to any one of claims 1 to 3, characterized in that: The metal sheet is a copper sheet.

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