Heat dissipation device and manufacturing method of heat dissipation device

Abstract

The invention discloses a heat dissipation device and a manufacturing method of the heat dissipation device, the heat dissipation device comprises a cover body, a uniform flow assembly and a bottom plate assembly, the bottom plate assembly comprises a heat dissipation cavity, a plurality of heat conduction pieces are arranged in a first area of the heat dissipation cavity at first intervals, and a plurality of heat conduction pieces are arranged in a second area of the heat dissipation cavity at second intervals; the third area of the flow uniformizing assembly comprises a plurality of first flow uniformizing channels and a plurality of first liquid discharging channels, the first flow uniformizing channels are provided with a plurality of first liquid outlet holes at third intervals, the first liquid outlet holes are communicated with the first flow uniformizing channels and the first area, and the fourth area of the flow uniformizing assembly comprises a plurality of second flow uniformizing channels and a plurality of second liquid discharging channels; a plurality of second liquid outlet holes are formed in the second uniform flow channel at fourth intervals, the second liquid outlet holes communicate with the second uniform flow channel and the second area, and the first liquid drainage channel communicates with the first area and the second uniform flow channel; the cover body is provided with a liquid inlet and a liquid outlet, the liquid inlet is communicated with the first uniform flow channel, and the second liquid discharge channel is communicated with the second area and the liquid outlet.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation equipment, and in particular to a heat dissipation device and a method for manufacturing the heat dissipation device. Background Art

[0002] With the rapid development of social informatization, more requirements are put forward for the performance of electronic equipment, which leads to the continuous increase of single-chip functional modules. The chip shows a trend of increasing integration and area at the same time, making the uneven distribution of chip power more and more obvious, resulting in multiple local "hot spots" with high heat flux density on the chip. The temperature non-uniformity caused by local "hot spots" can cause thermal stress in large-area chips, causing chip warping or even breakage, seriously affecting the reliability and life of the chip.

[0003] However, most of the heat dissipation devices in the related art dissipate heat from a uniform heat source, and have a poor heat dissipation effect on non-uniform heat-generating chips. Summary of the invention

[0004] The present application discloses a heat dissipation device and a method for manufacturing the heat dissipation device, which can improve the heat dissipation effect of a chip with non-uniform heat generation.

[0005] In order to solve the above problems, this application adopts the following technical solutions:

[0006] In a first aspect, an embodiment of the present application discloses a heat dissipation device, comprising: a cover body, a flow uniforming component and a base plate component, wherein: the base plate component comprises a heat dissipation chamber, a first area of ​​the heat dissipation chamber arranges a plurality of heat-conducting parts at a first interval, and a second area of ​​the heat dissipation chamber arranges a plurality of heat-conducting parts at a second interval, wherein the first interval is smaller than the second interval; the flow uniforming component at least covers the heat dissipation chamber, a third area of ​​the flow uniforming component comprises a plurality of first flow uniforming channels and a plurality of first drainage channels, the first flow uniforming channels and the first drainage channels are arranged alternately, the first flow uniforming channel is provided with a plurality of first liquid outlet holes at a third interval, the first liquid outlet holes connect the first flow uniforming channel and the first area, and a fourth area of ​​the flow uniforming component comprises a plurality of second flow uniforming channels and a plurality of second drainage channels The second uniform flow channel and the second drainage channel are arranged alternately, the second uniform flow channel is provided with a plurality of second liquid outlet holes at a fourth interval, the second liquid outlet holes connect the second uniform flow channel and the second area, the first drainage channel connects the first area and the second uniform flow channel; the cover body covers the uniform flow component, the cover body is provided with a liquid inlet and a liquid outlet, the liquid inlet connects the first uniform flow channel, and the second drainage channel connects the second area and the liquid outlet; when the chip is in an installed state, the surface of the bottom plate component away from the uniform flow component contacts the chip, the fifth area of ​​the chip corresponds to the first area, and the sixth area of ​​the chip corresponds to the second area, wherein the temperature of the fifth area is higher than the temperature of the sixth area.

[0007] In a second aspect, an embodiment of the present application discloses a method for manufacturing a heat dissipation device, comprising: bonding a liquid separator plate, a jet plate, a frame plate and a bottom plate in sequence to form a first main body; and connecting a cover body to the first main body.

[0008] The embodiment of the present application provides a heat dissipation device, by arranging denser heat-conducting parts in the first area of ​​the heat dissipation chamber of the base plate component, and arranging sparser heat-conducting parts in the second area of ​​the heat dissipation chamber of the bottom component, when the chip is in the installed state, the high heat flux density area of ​​the chip corresponds to the first area, and the low heat flux density area of ​​the chip corresponds to the second area, and the heat dissipation chamber is covered with a flow-uniform component, the third area of ​​the flow-uniform component corresponds to the first area of ​​the heat dissipation chamber, the fourth area of ​​the flow-uniform component corresponds to the second area of ​​the heat dissipation chamber, and the plurality of first flow-uniform channels on the third area of ​​the flow-uniform component are connected to the liquid inlet on the cover body, and the first flow-uniform channels A plurality of first liquid outlet holes are arranged at a third interval, the first liquid outlet holes connect the first uniform flow channel and the first area, a plurality of first drainage channels on the third area of ​​the uniform flow component connect the first area and a plurality of second uniform flow channels on the fourth area of ​​the uniform flow component, a plurality of second liquid outlet holes are arranged at a fourth interval on the second uniform flow channel, the second liquid outlet holes connect the second uniform flow channel and the second area, a plurality of second drainage channels on the fourth area of ​​the uniform flow component connect the second area and the liquid outlet on the cover body, so that the high heat flux density area of ​​the chip can be dissipated first, and then the low heat flux density area of ​​the chip can be dissipated, thereby improving the heat dissipation effect of the non-uniform heat generation chip. Moreover, by dissipating the heat of the chip through the heat dissipation device provided in the present application, the thermal stress caused by the local temperature difference of the chip can be eliminated, and the service life and reliability of the chip can be ensured. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 A schematic diagram of the structure of a heat dissipation device disclosed in an embodiment of the present application;

[0010] Figure 2 A schematic diagram of the structure of a base plate assembly disclosed in an embodiment of the present application;

[0011] Figure 3 A schematic diagram of the arrangement of a flow-uniform channel and a liquid discharge channel on a flow-uniform component disclosed in an embodiment of the present application;

[0012] Figure 4 A schematic diagram of a chip disclosed in an embodiment of the present application;

[0013] Figure 5 A schematic diagram of the structure of a heat conducting member disclosed in an embodiment of the present application;

[0014] Figure 6 A cross-sectional view of a heat dissipation device disclosed in an embodiment of the present application;

[0015] Figure 7 A schematic diagram of the structure of a jet plate disclosed in an embodiment of the present application;

[0016] Figure 8 A flow chart of a method for manufacturing a heat dissipation device disclosed in an embodiment of the present application;

[0017] Fig. 9 This is a processing flow chart of a base plate disclosed in an embodiment of the present application. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0019] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0020] The present application discloses a heat dissipation device and a method for manufacturing the heat dissipation device. Figure 1 is a schematic diagram of the structure of a heat dissipation device disclosed in an embodiment of the present application, Figure 2 This is a schematic diagram of the structure of a base plate assembly disclosed in an embodiment of the present application. Figure 3 This is a schematic diagram of the arrangement of a flow-uniform channel and a liquid discharge channel on a flow-uniform component disclosed in an embodiment of the present application. Figure 4 A schematic diagram of a chip disclosed in an embodiment of the present application.

[0021] like Figures 1 to 4As shown, the heat dissipation device disclosed in the present application includes: a cover body 100, a uniform flow component 200 and a bottom plate component 300, wherein: the bottom plate component 300 includes a heat dissipation chamber, a first area 321 of the heat dissipation chamber arranges a plurality of heat conductive members 322 at a first interval, and a second area 323 of the heat dissipation chamber arranges a plurality of heat conductive members 322 at a second interval, wherein the first interval is smaller than the second interval; the uniform flow component 200 at least covers the heat dissipation chamber, the third area 201 of the uniform flow component 200 includes a plurality of first uniform flow channels 211 and a plurality of first drainage channels 212, the first uniform flow channels 211 and the first drainage channels 212 are alternately arranged, the first uniform flow channel 211 is provided with a plurality of first liquid outlet holes 221 at a third interval, the first liquid outlet holes 221 connect the first uniform flow channel 211 and the first area 321, the fourth area 202 of the uniform flow component 200 includes a plurality of second uniform flow channels 213 and a plurality of second drainage channels 214, the second uniform flow The channel 213 and the second drainage channel 214 are arranged alternately, the second uniform flow channel 213 is provided with a plurality of second liquid outlet holes 223 at a fourth interval, the second liquid outlet holes 223 connect the second uniform flow channel 213 and the second area 323, the first drainage channel 212 connects the first area 321 and the second uniform flow channel 213; the cover body 100 covers the uniform flow component 200, the cover body 100 is provided with a liquid inlet 110 and a liquid outlet 120, the liquid inlet 110 connects the first uniform flow channel 211, and the second drainage channel 214 connects the second area 323 and the liquid outlet 120; when the chip is in the installed state, the surface of the bottom plate component 300 away from the uniform flow component 200 contacts the chip, the fifth area 401 of the chip corresponds to the first area 321, and the sixth area 402 of the chip corresponds to the second area 323, wherein the temperature of the fifth area 401 is higher than the temperature of the sixth area 402.

[0022] It should be noted that the height of the heat conducting member 322 is smaller than the height of the heat dissipation chamber. For example, Figure 5 As shown, the height h of the heat conducting member 322 is pin It can be 0.7 to 0.8 times the height of the heat dissipation chamber. In addition, the thickness of the cover 100 can be 300-500 um, and the diameters of the liquid inlet 110 and the liquid outlet 120 can be 5-8 mm.

[0023] The multiple first flow-uniform channels 211 and the multiple first drainage channels 212 on the third region 201 of the flow-uniform component 200 can be arranged alternately along the preset direction of the flow-uniform component 200, for example, along the preset direction of the flow-uniform component 200, in the order of 1, 3, 5 first drainage channels 212, 2, 4, 6 first flow-uniform channels 211. The liquid outlets can be arranged in one row or in multiple rows along the flow-uniform channel. Exemplarily, the preset direction can be a direction perpendicular to the line connecting the liquid inlet 110 and the liquid outlet 120 on the cover body 100. The arrangement of the multiple second flow-uniform channels 213 and the multiple second drainage channels 214 on the fourth region 202 of the flow-uniform component 200 is similar to the arrangement of the multiple first flow-uniform channels 211 and the multiple first drainage channels 212 on the third region 201 of the flow-uniform component 200, and will not be repeated here.

[0024] In the present application, the cover body 100, the flow uniforming component 200 and the base plate component 300 are stacked in sequence, and the heat conductive components 322 are arranged densely in the first area 321 of the base plate component 300 corresponding to the high heat flux density area of ​​the chip, so that the surface area of ​​the heat conductive components 322 in contact with the liquid in the first area 321 is larger, and the heat conductive components 322 are arranged sparsely in the second area 323 of the base plate component 300 corresponding to the low heat flux density area of ​​the chip, so that the surface area of ​​the heat conductive components 322 in contact with the liquid in the second area 323 is relatively small, which can achieve local high heat control of the chip while maintaining good temperature uniformity, thereby improving the heat dissipation effect of the non-uniform heat generating chip.

[0025] Furthermore, the third area 201 of the flow-uniform component 200 corresponds to the first area 321 of the bottom plate component 300, the fourth area 202 of the flow-uniform component 200 corresponds to the second area 323 of the bottom plate component 300, the plurality of first flow-uniform channels 211 on the third area 201 of the flow-uniform component 200 are connected to the liquid inlet 110 on the cover body 100, a plurality of first liquid outlet holes 221 connecting the first flow-uniform channel 211 and the first area 321 are arranged at a third interval on the first flow-uniform channel 211, and the plurality of first liquid discharge channels 212 on the third area 201 of the flow-uniform component 200 are connected to the first area 3 21 and multiple second uniform flow channels 213 on the fourth area 202 of the uniform flow component 200, multiple second liquid outlet holes 223 connecting the second uniform flow channel 213 and the second area 323 are arranged at a fourth interval on the second uniform flow channel 213, and multiple second drainage channels 214 on the fourth area 202 of the uniform flow component 200 connect the second area 323 and the liquid outlet 120 on the cover body 100, which can achieve heat dissipation of the high heat flux density area of ​​the chip first, and then heat dissipation of the low heat flux density area of ​​the chip, so as to achieve more uniform heat dissipation and further improve the heat dissipation effect of the non-uniform heat generation chip.

[0026] When the heat dissipation device disclosed in the present application is used to dissipate heat for the chip disposed below the base plate assembly 300, as shown in FIG. Figure 6 As shown, after the liquid flows into the multiple first uniform flow channels 211 arranged in the third area 201 of the uniform flow component 200 through the liquid inlet 110 on the cover body 100 for uniform flow, it is vertically impacted on the first area 321 of the heat dissipation chamber with the heat conductive member 322 through the first liquid outlet hole 221 arranged on the first uniform flow channel 211 to realize distributed jet flow, and the heat conductive member 322 is used to contact with the liquid for heat conduction to realize heat dissipation of the high heat flux density area of ​​the chip (i.e., the fifth area 401), and then the liquid in the first area 321 of the heat dissipation chamber flows into the multiple first discharge channels 212 arranged in the third area 201 of the uniform flow component 200. The multiple second uniform flow channels 213 of the fourth area 202 of the flow component 200 are uniformly flowed, and after the uniform flow, the second liquid outlet holes 223 arranged on the second uniform flow channels 213 vertically impact the second area 323 of the heat dissipation chamber with the heat conductive member 322 to realize distributed jetting, and the heat conductive member 322 is used to contact with the liquid for heat conduction to realize the heat dissipation of the low heat flux density area of ​​the chip (i.e., the sixth area 402). After the heat dissipation of the chip is completed, the liquid in the second area 323 of the heat dissipation chamber flows out from the liquid outlet 120 on the cover body 100 through the multiple second drainage channels 214 arranged in the fourth area 202 of the uniform flow component 200.

[0027] The present application adopts the design of the liquid outlet hole, which can increase the flow rate of the liquid flowing downward, thereby increasing disturbance and enhancing heat exchange. The heat dissipation chamber can provide a mixed flow space, extend the jet path, and enhance the heat dissipation effect. In addition, the liquid enters the heat dissipation chamber through the uniform flow channel and the liquid outlet hole of the uniform flow component 200, and is quickly reflected and discharged through the drainage channel after hitting the heat conductive member 322. This liquid flow mode can maintain a lower overall pressure drop at a higher flow rate.

[0028] The embodiment of the present application provides a heat dissipation device, by arranging densely the heat-conducting parts 322 in the first area 321 of the heat dissipation chamber of the base plate component 300, and arranging sparsely the heat-conducting parts 322 in the second area 323 of the heat dissipation chamber of the bottom component, when the chip is in the installed state, the high heat flux density area of ​​the chip corresponds to the first area 321, and the low heat flux density area of ​​the chip corresponds to the second area 323, and the heat dissipation chamber is covered with a uniform flow component 200, the third area 201 of the uniform flow component 200 corresponds to the first area 321 of the heat dissipation chamber, the fourth area 202 of the uniform flow component 200 corresponds to the second area 323 of the heat dissipation chamber, the multiple first uniform flow channels 211 on the third area 201 of the uniform flow component 200 are connected to the liquid inlet 110 on the cover body 100, and the first uniform flow channels 211 are connected with the liquid inlet 110 on the cover body 100. A plurality of first liquid outlet holes 221 are arranged at three intervals, the first liquid outlet holes 221 are connected to the first uniform flow channel 211 and the first area 321, a plurality of first liquid discharge channels 212 on the third area 201 of the uniform flow component 200 are connected to the first area 321 and a plurality of second uniform flow channels 213 on the fourth area 202 of the uniform flow component 200, a plurality of second liquid outlet holes 223 are arranged at the fourth interval on the second uniform flow channel 213, the second liquid outlet holes 223 are connected to the second uniform flow channel 213 and the second area 323, a plurality of second liquid discharge channels 214 on the fourth area 202 of the uniform flow component 200 are connected to the second area 323 and the liquid outlet 120 on the cover 100, so that the high heat flux density area of ​​the chip can be dissipated first, and then the low heat flux density area of ​​the chip can be dissipated, so as to improve the heat dissipation effect of the non-uniform heat generation chip. In addition, by dissipating the heat of the chip through the heat dissipation device provided in the present application, the thermal stress caused by the local temperature difference of the chip can be eliminated, and the service life and reliability of the chip can be ensured.

[0029] In this application, the heat conductor can be a micro-needle tooth. Using the micro-needle tooth as the heat conductor 322 can effectively enhance the overall heat exchange effect, avoid the occurrence of local hot spots, and achieve better temperature control for high heat flux density areas. It should be noted that the micro-needle tooth can be a rectangular columnar structure, which is not specifically limited in this application.

[0030] In one implementation, when the heat conductive member 322 is a rectangular columnar structure, the spacing length between the heat conductive members 322 may be equal to the width of the bottom surface of the rectangular columnar structure, that is, the bottom surface width of the heat conductive member 322 disposed in the first region 321 is smaller than the bottom surface width of the heat conductive member 322 disposed in the second region 323. When the heat conductive member 322 is a square columnar structure, the spacing length between the heat conductive members 322 may be equal to the side length of the bottom surface square of the square columnar structure, that is, the bottom surface square of the heat conductive member 322 disposed in the first region 321 is smaller than the bottom surface square of the heat conductive member 322 disposed in the second region 323, for example. Figure 5 As shown, the side length d of the bottom square of the heat conducting member 322 disposed in the first area 321 is pin It can be 10-100um, the first interval w pin The side length d of the bottom square of the heat conducting member 322 disposed in the second area 323 may be 10-100 um. pin It can be 100-200um, the second interval w pin In addition, the height of the heat conductive member 322 arranged in the first area 321 and the height of the heat conductive member 322 arranged in the second area 323 can be set according to actual heat dissipation requirements. For example, the height of the heat conductive member 322 arranged in the first area 321 is set to be greater than the height of the heat conductive member 322 arranged in the second area 323.

[0031] In the embodiment of the present application, since the first area 321 of the heat dissipation chamber is densely arranged with heat conductive members 322, and the second area 323 of the heat dissipation chamber is sparsely arranged with heat conductive members 322, the third area 201 of the flow equalizer component 200 corresponds to the first area 321 of the heat dissipation chamber, and the fourth area 202 of the flow equalizer component 200 corresponds to the second area 323 of the heat dissipation chamber. By setting the size of the first liquid outlet hole 221 of the third area 201 of the flow equalizer component 200 to be smaller than the size of the second liquid outlet hole 223 of the fourth area 202 of the flow equalizer component 200, and the third interval between the first liquid outlet holes 221 is smaller than the fourth interval between the second liquid outlet holes 223, that is, the first liquid outlet holes 221 of the third area 201 are densely distributed, and the second liquid outlet holes 223 of the fourth area 202 are sparsely distributed, the liquid outlet holes on the flow equalizer component 200 can cooperate with the heat conductive members 322 arranged in the heat dissipation chamber, thereby further improving the heat dissipation effect on the chip.

[0032] In one implementation, the flow-uniform component 200 may include a liquid separator 210 and a jet plate 220, the third region 201 of the liquid separator 210 includes the plurality of first flow-uniform channels 211 and the plurality of first liquid discharge channels 212, the fourth region 202 of the liquid separator 210 includes the plurality of second flow-uniform channels 213 and the plurality of second liquid discharge channels 214, the third region 201 of the jet plate 220 includes the plurality of first liquid outlet holes 221 and the plurality of first liquid discharge frames 222, the fourth region 202 of the jet plate 220 includes the plurality of first liquid outlet holes 221 and the plurality of first liquid discharge frames 222, The device includes the plurality of second liquid outlet holes 223 and the plurality of second liquid drainage frames 224, wherein the first liquid outlet hole 221 corresponds to the first uniform flow channel 211, the second liquid outlet hole 223 corresponds to the second uniform flow channel 213, the first liquid drainage frame 222 corresponds to the first liquid drainage channel 212, the first liquid drainage frame 222 connects the first liquid drainage channel 212 and the first area 321, the second liquid drainage frame 224 corresponds to the second liquid drainage channel 214, and the second liquid drainage frame 224 connects the second liquid drainage channel 214 and the second area 323.

[0033] In the present application, the uniform flow assembly 200 may be composed of a liquid separation plate 210 and a jet plate 220. The flow direction of the liquid on the liquid separation plate 210 is as follows: Figure 3 As shown, the third area 201 of the liquid separation plate 210 includes a plurality of first uniform flow channels 211 and a plurality of first drainage channels 212, and the fourth area 202 of the liquid separation plate 210 includes a plurality of second uniform flow channels 213 and a plurality of second drainage channels 214. The arrangement of the plurality of first uniform flow channels 211, the plurality of first drainage channels 212, the plurality of second uniform flow channels 213 and the plurality of second drainage channels 214 here is consistent with that described above, and will not be repeated in this application.

[0034] Exemplarily, the thickness of the liquid separation plate 210 can be 1-1.5 mm, the multiple first uniform flow channels 211 can be a rake-shaped structure, the multiple first drainage channels 212 can be a rake-shaped structure, the multiple second uniform flow channels 213 can be a rake-shaped structure, the multiple second drainage channels 214 can also be a rake-shaped structure, the width of the uniform flow channel can be 1-1.5 mm, and the width of the drainage channel can be 1-1.5 mm.

[0035] The structure of the jet plate 220 is as follows: Figure 7As shown, the third region 201 of the jet plate 220 includes a plurality of first liquid outlet holes 221 and a plurality of first liquid discharge frames 222, and the fourth region 202 of the jet plate 220 includes a plurality of second liquid outlet holes 223 and a plurality of second liquid discharge frames 224. The arrangement of the first liquid outlet holes 221 corresponds to the first uniform flow channel 211 of the liquid separation plate 210, the arrangement of the first liquid discharge frames 222 corresponds to the first liquid discharge channel 212 of the liquid separation plate 210, the arrangement of the second liquid outlet holes 223 corresponds to the second uniform flow channel 213 of the liquid separation plate 210, and the arrangement of the second liquid discharge frames 224 corresponds to the second liquid discharge channel 214 of the liquid separation plate 210. Exemplarily, the thickness of the jet plate 220 may be 200-300um.

[0036] In the embodiment of the present application, the base plate assembly 300 may include a frame plate 310 and a base plate 320, the frame plate 310 is provided with the heat dissipation chamber, the first area 321 of the base plate 320 arranges a plurality of heat conductive members 322 at the first interval, and the second area 323 of the base plate 320 arranges a plurality of heat conductive members 322 at the second interval.

[0037] For example, the thickness of the bottom plate 320 may be 600-800 um, the thickness of the frame plate 310 may be 200-300 um, and the height of the corresponding heat dissipation chamber may be 200-300 um.

[0038] In one implementation, the base plate 320 may be made of silicon material. Since the chip mounted below the base plate 320 is a silicon-based chip, the base plate 320 is made of silicon material, and when the chip is welded to the heat sink, the problem of interface reliability risk caused by inconsistent thermal expansion coefficients of materials can be avoided.

[0039] Optionally, the base plate 320 may be formed by etching the chip.

[0040] In the embodiment of the present application, the area of ​​the arrangement region of the heat conducting member 322 on the base plate assembly 300 may be larger than the area of ​​the chip, thereby better achieving heat dissipation for the chip.

[0041] In one implementation, the first liquid drainage channel 212 and the second liquid drainage channel 214 may be strip-shaped liquid drainage frames, which can increase the outflow speed of liquid from the first area 321 or the second area 323 of the heat dissipation chamber.

[0042] In an embodiment of the present application, the heat sink may further include a metal layer, which is disposed between the base plate assembly 300 and the chip. The metal layer may be formed by sequentially plating titanium, platinum, and gold on the surface of the base plate assembly 300 close to the chip or on the surface of the chip using vapor deposition or magnetron sputtering technology. After the metallization treatment is completed, gold-tin solder is attached to the welding surface of the base plate assembly 300 or the chip using evaporation technology, and then the heat sink and the chip are placed in an atmosphere furnace using a fixture for heating and bonding to achieve assembly of the heat sink and the chip.

[0043] When the base plate assembly 300 is made of silicon material, the titanium in the metal layer can increase adhesion, the platinum in the metal layer can act as a barrier to prevent titanium from leaking downward, and the gold can improve solderability. When the base plate assembly 300 is made of non-silicon material, the metal layer can separate the base plate assembly 300 from the chip to avoid the interface reliability risk caused by inconsistent thermal expansion coefficients of the materials.

[0044] In addition, the heat sink disclosed in the present application can be packaged as a whole after being assembled with the chip, that is, the heat sink can be directly welded on the chip silicon wafer through the patch process, and then the heat sink and the chip can be packaged as a whole to reduce the interface thermal resistance from the heat sink to the chip and improve the heat dissipation effect on the chip.

[0045] The heat dissipation device disclosed in the present application can be used to dissipate heat for high-density heterogeneous chips, SSP chips, etc.

[0046] It should be noted that the liquid mentioned above may be water, a dielectric medium or a refrigerant, etc., that is, the heat dissipation device disclosed in the present application may use water, a dielectric medium or a refrigerant as a working medium.

[0047] The present application also discloses a method for manufacturing a heat dissipation device. Figure 8 As shown, the manufacturing method includes:

[0048] S820 , bonding the liquid separation plate 210 , the jet plate 220 , the frame plate 310 and the bottom plate 320 in sequence to form a first body.

[0049] S840, connecting the cover body 100 to the first body.

[0050] For example, epoxy resin or UV glue may be used to bond the cover 100 and the first body.

[0051] It should be noted that the separator plate 210, jet plate 220, frame plate 310, bottom plate 320 and cover 100 here are the separator plate 210, jet plate 220, frame plate 310, bottom plate 320 and cover 100 described in the heat dissipation device above.

[0052] Through the manufacturing method disclosed in the present application, considering the bonding size requirements, the liquid separator plate 210, the jet plate 220, the frame plate 310 and the bottom plate 320 are first bonded in sequence to form a first main body, and then the cover body 100 is connected to the first main body. This can solve the processing difficulties of heat dissipation devices with extremely small space dimensions and improve the manufacturing efficiency of the heat dissipation devices.

[0053] In the embodiment of the present application, in order to facilitate the bonding of the liquid separation plate 210, the jet plate 220, the frame plate 310 and the bottom plate 320, the bottom plate 320 and the jet plate 220 can be made of silicon material, and the frame plate 310 and the liquid separation plate 210 can be made of glass, that is, a layer of silicon, a layer of glass, a layer of silicon, and a layer of glass. In addition, the material of the frame plate 310 can also be polydimethylsiloxane (PDMS), and the cover body 100 can be made of glass.

[0054] In the present application, the base plate 320, the frame plate 310, the jet plate 220, the separator plate 210 and the cover body 100 are processed separately, the base plate 320 is processed by a deep silicon etching process, the frame plate 310, the separator plate 210 and the cover body 100 are processed by a laser cutting process, and the jet plate 220 is processed by an etching process.

[0055] The bottom plate 320 is processed by deep silicon etching process as shown in the flowchart. Fig. 9 As shown, the following steps are included: a) designing a photolithography mask according to the required thermal conductive part morphology; b) spin coating photoresist; c) exposing, and changing the exposure time according to the required thermal conductive part height; d) clearing the photoresist to complete the etching process.

[0056] The above embodiments of the present application focus on describing the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0057] The above is only an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A heat dissipation device, characterized in that: include: Cover body, flow distribution assembly and bottom plate assembly, wherein: The base plate assembly includes a heat dissipation chamber, a first area of ​​the heat dissipation chamber is arranged with a plurality of heat conductive members at a first interval, and a second area of ​​the heat dissipation chamber is arranged with a plurality of heat conductive members at a second interval, wherein the first interval is smaller than the second interval; The flow-uniform component at least covers the heat dissipation chamber, the third region of the flow-uniform component includes a plurality of first flow-uniform channels and a plurality of first drainage channels, the first flow-uniform channels and the first drainage channels are arranged alternately, the first flow-uniform channel is provided with a plurality of first liquid outlet holes at a third interval, the first liquid outlet holes connect the first flow-uniform channel and the first region, the fourth region of the flow-uniform component includes a plurality of second flow-uniform channels and a plurality of second drainage channels, the second flow-uniform channels and the second drainage channels are arranged alternately, the second flow-uniform channel is provided with a plurality of second liquid outlet holes at a fourth interval, the second liquid outlet holes connect the second flow-uniform channel and the second region, and the first drainage channel connects the first region and the second flow-uniform channel; The cover body covers the flow-uniform component, and the cover body is provided with a liquid inlet and a liquid outlet, the liquid inlet is connected to the first flow-uniform channel, and the second liquid discharge channel is connected to the second area and the liquid outlet; When the chip is in an installed state, the surface of the base plate component away from the uniform flow component is in contact with the chip, the fifth area of ​​the chip corresponds to the first area, and the sixth area of ​​the chip corresponds to the second area, wherein the temperature of the fifth area is higher than the temperature of the sixth area.

2. The heat dissipation device according to claim 1, characterized in that: The size of the first liquid outlet hole is smaller than that of the second liquid outlet hole, and the third interval is smaller than the fourth interval.

3. The heat dissipation device according to claim 1 or 2, characterized in that: The uniform flow component includes a separator plate and a jet plate, the third area of ​​the separator plate includes the multiple first uniform flow channels and the multiple first drainage channels, the fourth area of ​​the separator plate includes the multiple second uniform flow channels and the multiple second drainage channels, the third area of ​​the jet plate includes the multiple first liquid outlet holes and the multiple first drainage frames, the fourth area of ​​the jet plate includes the multiple second liquid outlet holes and the multiple second drainage frames, the first liquid outlet hole corresponds to the first uniform flow channel, the second liquid outlet hole corresponds to the second uniform flow channel, the first drainage frame corresponds to the first drainage channel, the first drainage frame connects the first drainage channel and the first area, the second drainage frame corresponds to the second drainage channel, and the second drainage frame connects the second drainage channel and the second area.

4. The heat dissipation device according to claim 1, characterized in that: The base plate assembly includes a frame plate and a base plate, the frame plate is provided with the heat dissipation chamber, a plurality of heat conducting members are arranged at the first interval in the first area of ​​the base plate, and a plurality of heat conducting members are arranged at the second interval in the second area of ​​the base plate.

5. The heat dissipation device according to claim 4, characterized in that: The bottom plate is made of silicon material.

6. The heat dissipation device according to claim 5, characterized in that: The bottom plate is formed by etching the chip.

7. The heat dissipation device according to claim 1, characterized in that: The area of ​​the arrangement region of the heat conducting member on the base plate assembly is larger than the area of ​​the chip.

8. The heat dissipation device according to claim 1, characterized in that: The first liquid discharge channel and the second liquid discharge channel are strip-shaped liquid discharge frames.

9. The heat dissipation device according to claim 1, characterized in that: The invention also comprises a metal layer, wherein the metal layer is arranged between the base plate component and the chip.

10. A method for manufacturing a heat dissipation device, characterized in that: include: Bonding the liquid separation plate, the jet plate, the frame plate and the bottom plate in sequence to form a first body; The cover body is connected to the first body.

11. The manufacturing method according to claim 10, characterized in that: The bottom plate and the jet plate are made of silicon material, and the frame plate and the liquid separation plate are made of glass.

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