Socket and inspection socket

Abstract

The invention relates to a socket and a socket for inspection. The socket includes: a base portion including a first base portion and a second base portion which are assembled so as to overlap each other in a vertical direction, and in which a through hole is provided so as to penetrate the first base portion and the second base portion in the vertical direction, the first base portion and the second base portion each having conductivity; and a contact pin inserted through the through-hole, the base portion holding the contact pin in the through-hole of the first base portion by means of an insulating member, and the base portion holding the contact pin in the through-hole of the first base portion by means of the insulating member. A boundary portion between the through hole of the first base portion and the through hole of the second base portion has a first step having a diameter smaller than that of the first base portion side on the second base portion side, and downward movement of the insulating member is restricted by the first step. The inspection socket for inspecting the electrical characteristics of the first electrical component is provided with the socket.

Description

Technical Field

[0001] The invention relates to a socket and a socket for inspection. Background Art

[0002] IC sockets are known as sockets for electrically connecting electrical components such as IC packages encapsulating integrated circuits (ICs) to external electrical components (such as wiring boards). IC sockets are used to inspect electrical characteristics of IC packages during factory inspections.

[0003] The IC socket has contact pins for electrical connection between the IC package and the wiring substrate on the base, the IC package is placed on the upper surface of the base, and the wiring substrate is mounted on the lower surface of the base. The contact pins are provided to penetrate the base, and the upper ends thereof are electrically connected to the terminals of the IC package, and the lower ends thereof are electrically connected to the terminals of the wiring substrate (for example, see Patent Document 1).

[0004] The IC socket includes a contact pin having a coaxial structure. In such an IC socket, a through hole is provided in a metal base for ground connection, and a contact pin for signal transmission is inserted into the through hole via an insulating member (for example, see Patent Document 1). Thus, a coaxial line is formed between the contact pin and the inner wall surface of the through hole in the metal base.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: U.S. Patent No. 8758066 Summary of the invention

[0008] Problem that the invention aims to solve

[0009] However, in the above-mentioned conventional IC socket, when the contact pin is subjected to a pressing force or other external force in the vertical direction, a load may be applied from the contact pin to the insulating component, causing the insulating component to be displaced. In such a case, the holding of the contact pin by the base by the insulating component may become unstable.

[0010] An object of the present invention is to provide a socket and a test socket capable of stabilizing the holding of a contact pin in a through hole of a base.

[0011] Solutions to the problem

[0012] A socket according to one embodiment of the present invention comprises:

[0013] A base including a first base and a second base assembled so as to overlap each other in a vertical direction, and a through hole is provided so as to penetrate the first base and the second base in the vertical direction, and both the first base and the second base have conductivity; and

[0014] The contact pin is inserted into the through hole and, when in use, the upper end is connected to the terminal of the first electrical component and the lower end is connected to the terminal of the second electrical component, thereby electrically connecting the first electrical component and the second electrical component.

[0015] The base holds the contact pin in the through hole of the first base by means of an insulating component, and a first step having a smaller diameter on the second base side than on the first base side is provided at a boundary between the through hole of the first base and the through hole of the second base, so that the downward movement of the insulating component is restricted by the first step.

[0016] A test socket according to one embodiment of the present invention is used for testing electrical characteristics of a first electrical component.

[0017] It is provided with the above-mentioned socket.

[0018] Effects of the Invention

[0019] According to the present invention, displacement and / or falling off of an insulating member for holding a contact pin in a through hole of a base can be prevented. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a figure which shows the socket which concerns on embodiment of this invention, and is a perspective view which shows the upper surface side of a socket.

[0021] Figure 2 yes Figure 1 A cross-sectional view of the base of the socket is shown.

[0022] Description of Reference Numerals

[0023] 10 IC socket

[0024] 20 Frame

[0025] 21 Accommodation

[0026] 22 Guide

[0027] 30 Upper base

[0028] 31, 32 through holes

[0029] 32a distal part

[0030] 32a1 Small diameter part

[0031] 32a2 large diameter part

[0032] 32b proximal part

[0033] 35 Upper surface

[0034] 40 lower base

[0035] 41, 42 through holes

[0036] 45 Lower surface

[0037] 50, 60 contact pins

[0038] 51, 61 upper plunger

[0039] 52, 62 upper tube

[0040] 53, 63 lower tube

[0041] 54, 64 lower plunger

[0042] 81 Insulation sleeve

[0043] 81a cylindrical main body

[0044] 81b Annular protrusion

[0045] B Base

[0046] S1 First step

[0047] S2 The second step DETAILED DESCRIPTION

[0048] Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

[0049] In this embodiment, as an example of a socket, an inspection socket used in an inspection device for inspecting the electrical characteristics of an electrical component is exemplified. In the inspection device, various tests are performed on the electrical component to be inspected. For example, whether the electrical component operates properly is investigated in an environment that is the same as the actual use environment of the electrical component or in an environment that is more burdensome than the actual environment.

[0050] In addition, the socket of this embodiment is an IC socket that uses the IC package as the inspection object, but the electrical component that is the inspection object of the socket may be an electrical component different from the IC package. IC is an electronic circuit, for example, including transistors, resistors, capacitors, and inductors that are interconnected on a silicon substrate.

[0051] Figure 1 1 is a diagram showing an IC socket 10 according to the present embodiment, and is a perspective view showing the upper surface side of the IC socket 10 . Figure 2 yes Figure 1A cross-sectional view of a base portion B of the IC socket 10 is shown.

[0052] (IC socket)

[0053] The IC socket 10 includes a base B and a frame 20. In the present embodiment, the thickness direction of the base B is referred to as an up-down direction, and hereinafter, "up" and "down" refer to up and down in the up-down direction.

[0054] The base B is a flat plate-shaped member having thickness in the vertical direction. In the present embodiment, the base B is rectangular in a plan view, but this shape is only an example. The frame 20 is a member that is arranged on the upper surface 35 of the base B in a manner surrounding the outer periphery and is fixed to the base B. When the IC socket 10 is used, the inner side of the frame 20 functions as a receiving portion 21 for receiving an IC package (not shown).

[0055] When in use, an IC package is placed on the upper side of the upper surface 35 of the base B. The IC package is an example of a first electrical component. In the present embodiment, as the IC package, for example, a BGA (Ball Grid Array) type, an LGA (Land Grid Array) type, or the like IC package can be applied.

[0056] When in use, a wiring board (not shown) is mounted below the lower surface 45 of the base B. The wiring board is an example of a second electrical component. In the present embodiment, the wiring board is a wiring board used in an inspection device for performing the above-mentioned various tests.

[0057] (Frame)

[0058] The frame 20 is a frame body that is opened in the vertical direction at the center and surrounds the opening, and the frame 20 constitutes the outer periphery of the housing 21. In the present embodiment, as an example, the shape of the opening is rectangular, but the shape of the opening can be appropriately changed according to the shape of the IC package to be housed.

[0059] A guide portion 22 for guiding the IC package to the correct position of the housing portion 21 is provided on the inner peripheral side of the frame portion 20, that is, on the inner wall of the housing portion 21. Since the guide portion 22 for guiding the IC package to the correct position of the housing portion 21 can be applied to a known technique, a detailed description thereof is omitted here.

[0060] The guide portion 22 guides the IC package to a correct position in the housing portion 21. The IC package housed in the housing portion 21 is pressed downward by a pressing member (not shown) or the like. By this pressing, the terminals such as solder balls of the IC package come into contact with the ends of upper plungers 51, 61 of contact pins 50, 60 described later arranged on the base B.

[0061] The wiring board is mounted on the lower surface of the base B (lower surface 45 of the lower base 40 ) so that the terminals of the wiring board abut against the lower plungers 54 , 64 of the contact pins 50 , 60 arranged on the base B.

[0062] Therefore, when IC socket 10 is used, IC socket 10 electrically connects the terminals of the IC package accommodated in accommodation portion 21 and the terminals of the wiring board mounted on the lower surface of base B by accommodating the IC package in accommodation portion 21 and pressing it downward.

[0063] (Base)

[0064] The base B has an upper base 30 on the IC package side and a lower base 40 on the wiring substrate side. The upper base 30 and the lower base 40 are planar members having a predetermined thickness. In the thickness direction of the base B, the upper base 30 is arranged on the side where the IC package is accommodated, that is, the upper side, and the lower base 40 is arranged on the side where the wiring substrate is mounted, that is, the lower side.

[0065] The upper base 30 disposed on the upper side constitutes the bottom of the accommodating portion 21 , and the upper surface 35 of the upper base 30 serves as the bottom surface of the accommodating portion 21 .

[0066] That is, in the present embodiment, the base B is a two-layered structure in which the upper base 30 (an example of the first base) and the lower base 40 (an example of the second base) are stacked in the vertical direction. However, as a modified example, other planar members having a predetermined thickness similar to the upper base 30 and the lower base 40 may be further stacked as a part of the base B on the upper side of the upper base 30 and / or the lower side of the lower base 40.

[0067] The upper base 30 has through holes 31 and 32 extending in the vertical direction. The upper side of the contact pin 50 is inserted into the through hole 31, and the end of the upper plunger 51 is arranged so as to be exposed above the upper surface 35. The contact pin 50 may be, for example, a contact pin for grounding (hereinafter referred to as a grounding pin).

[0068] The upper side of the contact pin 60 is inserted into the through hole 32 via an insulating sleeve 81 described later, and is configured so that the end of the upper plunger 61 is exposed to a position higher than the upper surface 35. The insulating sleeve 81 is configured in the through hole 32. For this purpose, the through hole 32 has a portion formed to have a larger diameter than the through hole 31, and the details will be described later. The contact pin 60 can be, for example, a contact pin for signal transmission (hereinafter referred to as a signal pin) or a contact pin for power supply. In the following description, the signal pin is used as an example, and the contact pin 60 is referred to as the signal pin 60.

[0069] In addition, Figure 2 In the figure, one ground pin 50 and its through hole 31, one signal pin 60 and its through hole 32 are shown, but they are arranged corresponding to the number and arrangement of the terminals of the IC package.

[0070] The upper base 30 is formed of a conductive material, typically a metal (e.g., aluminum). The ground pin 50 is inserted into the through hole 31 and is arranged so that the upper tube 52 described later contacts the inner wall surface of the through hole 31. Since the metal constituting the upper base 30 is exposed on the inner wall surface of the through hole 31, the ground pin 50 is electrically connected to the upper base 30, and the ground potential of the upper base 30 is maintained.

[0071] The metal constituting the upper base 30 is also exposed on the inner wall surface of the through hole 32, but the signal pin 60 is inserted into the through hole 32 via the insulating sleeve 81. With this structure, the upper tube 62 described later does not contact the inner wall surface of the through hole 32, thereby preventing the short circuit between the signal pin 60 and the upper base 30. In addition, with this structure, a coaxial line is formed between the upper tube 62 described later and the inner wall surface of the through hole 32. Through this coaxial line, a signal path with impedance matching can be provided to transmit high-frequency electrical signals, and the data transmission speed in the IC socket 10 can be increased.

[0072] Similar to the upper base 30, the lower base 40 is also formed of a conductive material, typically a metal (e.g., aluminum). Also, similar to the upper base 30, the lower base 40 has through holes 41 and 42 that penetrate in the up-down direction. The through hole 41 is paired with the through hole 31 of the upper base 30 to form a through hole that penetrates the base B. Similarly, the through hole 42 is also paired with the through hole 32 of the upper base 30 to form a through hole that penetrates the base B.

[0073] The through holes 41 and 42 are arranged corresponding to the number and arrangement of the through holes 31 and 32 of the upper base 30, that is, the number and arrangement of the terminals of the IC package. In addition, the ground pins 50 are arranged in the through holes 31 and 41, and the signal pins 60 are arranged in the through holes 32 and 42.

[0074] The lower side of the ground pin 50 is inserted into the through hole 41 , and is arranged so that the end of the lower plunger 54 is exposed below the lower surface 45 .

[0075] The lower side of the signal pin 60 is inserted into the through hole 42 , and is arranged so that the end of the lower plunger 64 is exposed below the lower surface 45 .

[0076] The ground pin 50 is inserted into the through hole 41 and is arranged so that a lower tube 53 described later is in contact with the inner wall surface of the through hole 41 .

[0077] (About the shape of through hole)

[0078] The through holes 32 and 42 through which the signal pins 60 are inserted have a larger inner diameter than the through holes 31 and 41 through which the ground pins 50 are inserted, over the entire length in the vertical direction. The signal pins 60 have a smaller diameter than the through holes 32 and 42 over the entire length in the vertical direction. Therefore, when using a signal pin 60 having the same diameter as the ground pin 50, by interposing the insulating member 81 between the signal pin 60 and the inner wall of the through hole 32, the signal pin 60 can be held in a manner that does not contact the inner wall of the through hole 32 and 42.

[0079] In the present embodiment, the through hole 32 is not structured to have a uniform inner diameter, but is structured such that the inner diameter changes in a stepwise manner (three steps in the present embodiment) in the up-and-down direction.

[0080] Specifically, the through hole 32 has a structure in which the diameter of the distal portion 32a is reduced compared to the diameter of the proximal portion 32b. The distal portion 32a is located on the distal side (i.e., the upper side) farther from the boundary of the through holes 32 and 42, and the proximal portion 32b is located on the proximal side (i.e., the lower side) closer to the boundary. The proximal portion 32b has a larger diameter than the distal portion 32a, and the proximal portion 32b also has a larger diameter than the through hole 42 of the lower base 40. Therefore, a step (hereinafter referred to as the "first step S1") is formed at the boundary of the through holes 32 and 42. In addition, the diameter of the distal portion 32a is reduced relative to the proximal portion 32b, and thus a step (hereinafter referred to as the "second step S2") is also formed between the distal portion 32a and the proximal portion 32b.

[0081] The distal portion 32a has a smaller diameter at the end portion on the upper surface 35 side. That is, the distal portion 32a has a small diameter portion 32a1 with a smaller inner diameter at the upper end portion, and a large diameter portion 32a2 with a larger inner diameter below the small diameter portion 32a1. In this embodiment, the inner diameter of the large diameter portion 32a is the same as the inner diameter of the through hole 42 of the lower base 40.

[0082] (Contact pin)

[0083] The terminals of the IC package are electrically connected to the terminals of the wiring board via the ground pins 50 and the signal pins 60 respectively arranged in the through holes 31 , 41 and the through holes 32 , 42 of the base B (the upper base 30 and the lower base 40 ).

[0084] The ground pin 50 electrically connects the ground terminal of the IC package to the ground terminal of the wiring board. The ground pin 50 includes an upper plunger 51, an upper tube 52, a lower tube 53, a lower plunger 54, a spring (not shown), and the like.

[0085] The upper tube 52 is a cylindrical member extending in the up-down direction along the through hole 31. The lower end of the upper plunger 51 is inserted into the inner side of the upper end of the upper tube 52 and fixed.

[0086] The upper end of the upper plunger 51 is formed according to the shape of the terminal of the IC package. For example, in the case where the terminal is a solder ball, Figure 2 As shown, the upper end portion is formed into a crown (crown) shape, and the solder ball contacts the inner side of the crown-shaped portion.

[0087] The lower tube 53 is a cylindrical member extending in the up-down direction along the through hole 41, and is connected to the lower end of the upper tube 52. The lower tube 53 has a larger diameter than the upper tube 52, and accommodates a spring that urges the lower plunger 54 downward. The upper end of the lower plunger 54 is inserted into the inner side of the lower end of the lower tube 53 and is held in a slidable manner.

[0088] The lower end of the lower plunger 54 is formed according to the shape of the terminal of the wiring substrate. For example, when the terminal is a pad, Figure 2 As shown, the lower end portion is formed into a hemispherical shape, and the pad is in contact with the front end portion of the hemispherical shape.

[0089] In the ground pin 50, the upper plunger 51, the upper barrel 52, the lower barrel 53 and the lower plunger 54 are made of conductive metal, and the terminals of the IC package and the terminals of the wiring substrate are electrically connected. For example, the upper barrel 52 and the lower barrel 53 are made of a metal base material, and a gold film is formed on their surfaces. The film is preferably a metal that is inactive to oxygen, and further, a metal with a low resistance value. As an example, the film is gold, which is a precious metal, but it can also be other equivalent metals.

[0090] Therefore, in the ground pin 50, the lower tube 53 contacts the inner wall surface of the through hole 41. The lower tube 53 contacts and is electrically connected to the inner wall surface of the through hole 41, so that the ground potential of the lower base 40 can be maintained.

[0091] The signal pin 60 electrically connects a signal terminal for signal transmission different from the ground terminal in the IC package and a signal terminal for signal transmission different from the ground terminal in the wiring substrate. The signal pin 60 also includes an upper plunger 61, an upper tube 62, a lower tube 63, a lower plunger 64, a spring (not shown), etc., similarly to the ground pin 50.

[0092] In this embodiment, the signal pin 60 has the same structure as the ground pin 50. Therefore, detailed description of the signal pin 60 is omitted, but the signal pin 60 is arranged in the through hole 32 with an insulating sleeve 81 made of an insulating material arranged on the outer periphery.

[0093] in addition, Figure 2 The ground pin 50 and the signal pin 60 shown are examples, and their shapes, sizes, etc. can be appropriately changed according to the shape, size, etc. of the terminal of the IC package, for example.

[0094] (Regarding the shape of the insulating sleeve and the relationship between the insulating sleeve and the through hole)

[0095] like Figure 2 As shown in FIG. 1 , an insulating sleeve 81 (an example of an insulating member) is disposed on the outer periphery of the upper tube 62. As a result, the signal pin 60 does not contact the through holes 32 and 42. In addition, the insulating sleeve 81 disposed in the through hole 32 holds the signal pin 60 inserted into the inner through hole thereof. As a result, the base B can hold the signal pin 60 by means of the insulating sleeve 81 in a manner that the signal pin 60 does not fall off from the through holes 32 and 42.

[0096] In the present embodiment, the insulating sleeve 81 is a cylindrical body extending in the vertical direction and capable of surrounding most of the outer circumference of the upper tube 62. Unlike the existing structure described in Patent Document 1, in which two annular insulating components that do not extend in the vertical direction are arranged at two upper and lower positions, the insulating sleeve 81 surrounds most of the signal pin 60 in the vertical direction as a single body (as a single component), and thus can firmly hold the signal pin 60. Therefore, it is possible to suppress the relative displacement between the insulating sleeve 81 and the signal pin 60 when a pressing force or external force acts on the signal pin 60.

[0097] In addition, the insulating sleeve 81 can be easily installed and removed from the through hole 32 in a state where the base B is disassembled, that is, in a state where the upper base 30 and the lower base 40 are separated. In the present embodiment, the insulating sleeve 81 used for one signal pin 60 is a single component, which is easy to assemble to the base B, so the signal pin 60 and / or the insulating sleeve 81 can be easily replaced. As a result, the maintainability of the IC socket 10 can be improved.

[0098] The insulating sleeve 81 has a cylindrical body portion 81a extending in the vertical direction, and an annular protrusion 81b (an example of a protrusion) having a larger diameter than the cylindrical body portion 81a (ie, protruding outward) at the lower end portion of the cylindrical body portion 81a.

[0099] As described above, the annular protrusion 81b is in a state of being arranged at the proximal portion 32b of the through hole 32. Therefore, the outer diameter of the annular protrusion 81b is larger than the inner diameter of the through hole 42 of the lower base 40. Therefore, the lower surface of the outer edge of the annular protrusion 81b abuts against the first step S1 located at the boundary of the through holes 32 and 42. Thus, the base B can support the annular protrusion 81b from the lower side through the first step S1. By this support structure, the downward movement of the insulating sleeve 81 is restricted.

[0100] In addition, the outer diameter of the annular protrusion 81b is larger than the inner diameter of the large diameter portion 32a2 in the distal portion 32a of the through hole 32. Therefore, the upper surface of the outer edge of the annular protrusion 81b abuts against the second step S2 located at the boundary of the distal portion 32a and the proximal portion 32b. Thus, the base B supports the annular protrusion 81b from the upper side via the second step S2. By this support structure, the upward movement of the insulating sleeve 81 is restricted.

[0101] (Summarize)

[0102] As described above, in this embodiment, the IC socket 10 includes at least a base B and a signal pin 60. The base B includes an upper base 30 and a lower base 40. The upper base 30 and the lower base 40 are both conductive and assembled in a manner overlapping each other in the vertical direction. The upper base 30 and the lower base 40 are provided with through holes 32 and 42 that penetrate the upper base 30 and the lower base 40 in the vertical direction. The signal pin 60 is inserted into the through holes 32 and 42, and when used, the upper end is connected to the terminal of the IC package and the lower end is connected to the terminal of the wiring substrate, thereby electrically connecting the IC package to the wiring substrate. The base B holds the signal pin 60 in the through hole 32 of the upper base 30 by means of an insulating sleeve 81. The base B has a first step S1 at the boundary between the through hole 32 of the upper base 30 and the through hole 42 of the lower base 40, the diameter of which is smaller on the lower base 40 side than on the upper base 30 side, and the first step S1 is used to limit the downward movement of the insulating sleeve 81. According to this structure, even if a load is applied from the signal pin 60 to the insulating sleeve 81 when a pressing force or other external force in the up-down direction acts on the signal pin 60, the downward displacement of the insulating sleeve 81 can be suppressed. Therefore, the holding of the signal pin 60 in the through holes 32 and 42 of the base B can be stabilized.

[0103] In addition, the base B has a second step S2 in the through hole 32 of the upper base 30, the distal side being the side farthest from the boundary between the through hole 32 of the upper base 30 and the through hole 42 of the lower base 40, and the proximal side being the side near the boundary. The base B limits the upward movement of the insulating sleeve 81 by the second step S2. According to this structure, even when a load is applied from the signal pin 60 to the insulating sleeve 81 when a pressing force or other external force in the up-down direction acts on the signal pin 60, the upward displacement of the insulating sleeve 81 can be suppressed. Therefore, the holding of the signal pin 60 in the through holes 32 and 42 of the base B can be further stabilized.

[0104] In addition, the base B supports the insulating sleeve 81 from the bottom through the first step S1, and supports the insulating sleeve 81 from the top through the second step S2. According to this structure, the base B can hold the insulating sleeve 81. Therefore, even when a load is applied to the insulating sleeve 81 from the signal pin 60 due to a pressing force or an external force, the displacement of the insulating sleeve 81 can be reliably suppressed.

[0105] In addition, the insulating sleeve 81 is a cylindrical body that surrounds the outer periphery of the signal pin 60 and extends in the vertical direction. The cylindrical body has an annular protrusion 81b, which is a part of the cylindrical body in the vertical direction that protrudes outward and abuts against the first step S1 and / or the second step S2. According to this structure, the insulating sleeve 81 surrounds most of the signal pin 60 in the vertical direction as a single body (as a single component), so that the signal pin 60 can be held. As a result, it is possible to suppress the relative displacement of the insulating sleeve 81 and the signal pin 60 when a pressing force or external force acts on the signal pin 60. In addition, by firmly holding the insulating sleeve 81 by the base B and holding the signal pin 60 by the insulating sleeve 81, it is possible to prevent the position of the signal pin 60 from being shifted or falling off.

[0106] In addition, the insulating sleeve 81 has an annular protrusion 81b at the lower end. In the through hole 32, a small diameter portion 32a1 having a smaller diameter than the second step S2 is provided at a position located above the second step S2 on the far side of the upper base 30. That is, the base B supports the insulating sleeve 81 at two locations separated in the vertical direction, so that the upright posture of the signal pin 60 in the vertical direction can be stably maintained.

[0107] Although the embodiments of the present invention have been specifically described above, the present invention is not limited to the above-described specific embodiments. Various modifications and changes can be made to the specific examples described in the above-described embodiments within the scope of the gist of the present invention described in the claims.

[0108] Industrial Applicability

[0109] The socket and the inspection socket of the present invention are suitable for use as IC sockets for accommodating electrical components such as IC packages on a wiring substrate, for example. In particular, since the data transmission speed can be increased in the IC package and the wiring substrate, it is particularly suitable for transmitting high-frequency electrical signals.

Claims

1. A socket, characterized in that: have: A base including a first base and a second base assembled so as to overlap each other in a vertical direction, and a through hole is provided so as to penetrate the first base and the second base in the vertical direction, and both the first base and the second base have conductivity; and The contact pin is inserted into the through hole and, when in use, the upper end is connected to the terminal of the first electrical component and the lower end is connected to the terminal of the second electrical component, thereby electrically connecting the first electrical component and the second electrical component. The base holds the contact pin in the through hole of the first base by means of an insulating component, and a first step having a smaller diameter on the second base side than on the first base side is provided at a boundary between the through hole of the first base and the through hole of the second base, so that the downward movement of the insulating component is restricted by the first step.

2. The socket according to claim 1, wherein: The base has a second step having a diameter smaller on a distal side farther from the boundary than on a proximal side closer to the boundary in the through hole of the first base, and the second step restricts upward movement of the insulating member.

3. The socket according to claim 2, wherein: The base supports the insulating member from the bottom via the first step, supports the insulating member from the top via the second step, and supports the insulating member from the outside via the inner wall of the through hole between the first step and the second step.

4. The socket according to claim 2, wherein: The insulating component is a cylindrical body extending in the vertical direction surrounding the outer circumference of the contact pin, and the cylindrical body has a protrusion. The protrusion is a protrusion that protrudes outward from a portion of the cylindrical body in the vertical direction and abuts against the first step and / or the second step.

5. The socket according to claim 4, wherein: The insulating member has the protrusion at the lower end portion, The through hole has a small diameter portion having a smaller diameter than the second step at a position above the second step on the distal side of the first base, and the base supports the insulating member from the outside via an inner wall of the small diameter portion.

6. The socket according to claim 1, wherein: The contact pin is a signal transmission pin or a power supply pin having a smaller diameter than the through hole over the entire length in the vertical direction and inserted into the through hole without contacting the inner wall of the through hole.

7. An inspection socket for inspecting the electrical characteristics of a first electrical component, characterized in that: A socket according to claim 1 is provided.

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