Production process of modeling light source

Abstract

The invention relates to the technical field of modeling light source production, and discloses a modeling light source production process which comprises the following steps: designing a modeling circuit, and designing fixing positions of a plurality of light-emitting chips on a light-transmitting light source substrate; the shape of the circuit and the fixing position of the light-emitting chip are machined on the light source substrate; carving the light source substrate along the line, and removing redundant materials to form the line of the light source substrate; fixing the light-emitting chip on the light source substrate; spraying a light guide layer on the light source substrate, and then baking the light source substrate; splitting the light source substrate into a plurality of unit light sources; and connecting a lead and a resistor on each unit light source, and testing and packaging. The produced light source plate can directly provide the needed three-dimensional light-emitting effect, the light source substrate is a light-transmitting PCB, has certain toughness, is not prone to being broken, and facilitates later transportation and use.

Description

Technical Field

[0001] The present invention relates to the technical field of production of modeling light sources, and in particular to a production process of modeling light sources. Background Art

[0002] At present, the conventional light sources on the market are mainly point light sources. Due to their inherent design characteristics, this type of light source can only achieve flat or local lighting effects, and cannot emit light in all directions and in three dimensions. Therefore, it can only meet the basic lighting needs of people in daily life, such as basic lighting in rooms and corridor lighting, but for occasions that require more delicate and three-dimensional light and shadow effects, such as art exhibitions, stage performances or high-end interior design, point light sources are unable to provide the required three-dimensional lighting effects directly.

[0003] On the other hand, ceramic substrate technology occupies a certain position in the manufacturing of electronic products, but its high cost has become a major bottleneck limiting its widespread application. The high cost of ceramic materials themselves, coupled with the extremely high requirements for precision and complexity in the processing process, makes the cost of the final product high. In addition, the production process of brushing silver paste circuits on the surface of ceramic substrates is also demanding. It not only requires high-precision printing technology, but also needs to ensure the conductivity and stability of the silver paste circuit, which undoubtedly increases the difficulty and cost of production. Summary of the invention

[0004] The purpose of the present invention is to provide a production process for a modeling light source, wherein the light source board produced by the process can directly provide the required three-dimensional luminous effect, the light source substrate is a light-transmitting PCB board, and has a certain toughness, is not easy to break, and is convenient for later transportation and use.

[0005] In order to achieve the above object, the present invention provides a production process of a modeling light source, comprising the following steps:

[0006] Modeling circuit design, designing the fixed positions of multiple light-emitting chips on the light-transmitting light source substrate;

[0007] Processing the shape of the circuit and the fixing position of the light emitting chip on the light source substrate;

[0008] Carving along the line on the light source substrate to remove excess material to form the line of the light source substrate;

[0009] Fixing the light emitting chip on the light source substrate;

[0010] Spraying a light guide layer on the light source substrate, and then baking the light source substrate;

[0011] Splitting the light source substrate into a plurality of unit light sources;

[0012] Connect leads and resistors to each unit light source, and perform testing and packaging.

[0013] Compared with the prior art, the production process of a modeling light source in an embodiment of the present invention has the following beneficial effects: the product produced by the production process of a modeling light source in the present invention is a three-dimensional light source, which can directly provide the required three-dimensional luminous effect; the light source substrate is a transparent PCB board, and has a certain toughness, is not easy to break, and is convenient for later transportation and use; the present application can freely design the shape and circuit during the design process, which is conducive to improving the richness of the product; other electronic components can also be added when designing the circuit to improve the integration and functionality of the product.

[0014] The production process of the modeling light source of the embodiment of the present invention includes the following steps in processing the shape of the circuit and the fixed position of the light-emitting chip on the light source substrate: exposing and developing on the copper-clad light source substrate, and then etching out the required circuit shape and the pad position of the light source chip.

[0015] The production process of the modeling light source of the embodiment of the present invention includes the following steps in engraving along the line on the light source substrate: removing redundant materials from a plurality of light source substrates simultaneously by means of mold stamping.

[0016] The production process of the modeling light source of the embodiment of the present invention includes the following steps in fixing the light-emitting chip on the light source substrate: applying solder paste to the fixed position of the light-emitting chip on the light source substrate to fix the chip, and then fixing the chip by high-temperature welding.

[0017] The production process of the modeling light source of the embodiment of the present invention, in spraying the light guide layer on the light source substrate, comprises the following steps: spraying the light guide layer containing the silicone mixture on both side end surfaces of the light source substrate.

[0018] The production process of the modeling light source of the embodiment of the present invention, when processing the light-emitting chip of the monochromatic light source, the light-guiding layer includes the first silica gel, the second silica gel and the 620 nanometer powder phosphor;

[0019] When processing the light-emitting chip of the multi-color light source, the light-guiding layer includes the first silica gel, the second silica gel and diffusion powder.

[0020] In the production process of the modeling light source of the embodiment of the present invention, when processing the light-emitting chip of the monochromatic light source, the ratio of the first silica gel, the second silica gel and the 620 nanometer powder phosphor is 4:1:0.35.

[0021] In the production process of the modeling light source of the embodiment of the present invention, when processing the light-emitting chip of the multi-color light source, the ratio of the first silica gel, the second silica gel and the diffusion powder is 4:1:0.01.

[0022] In the production process of the modeling light source of the embodiment of the present invention, the light guide layer containing the silica gel mixture is formed by centrifugal stirring and degassing.

[0023] The production process of the modeling light source of the embodiment of the present invention comprises the following steps before splitting the light source substrate into a plurality of unit light sources: dispersing the light source substrate into a plurality of separate unit light sources by means of mold stamping.

[0024] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a flowchart of an embodiment of the present invention. DETAILED DESCRIPTION

[0026] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0027] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0028] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0029] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0030] like Figure 1 As shown, a production process of a modeling light source in a preferred embodiment of the present invention comprises the following steps:

[0031] S1: Modeling circuit design, designing the fixed positions of multiple light-emitting chips on the light-transmitting light source substrate;

[0032] S2: Processing the shape of the circuit and the fixed position of the light emitting chip on the light source substrate;

[0033] S3: Carving along the line on the light source substrate to remove excess material to form the line of the light source substrate;

[0034] S4: Fixing the light emitting chip on the light source substrate;

[0035] S5: spraying a light guide layer on the light source substrate, and then baking the light source substrate;

[0036] S6: splitting the light source substrate into a plurality of unit light sources;

[0037] S7: Connect leads and resistors to each unit light source, and perform testing and packaging.

[0038] The product produced by the production process of the modeling light source of the present invention is a three-dimensional light source, which can directly provide the required three-dimensional lighting effect; the light source substrate is a light-transmitting PCB board, and has a certain toughness, is not easy to break, and is convenient for subsequent transportation and use; the application can freely design the shape and circuit during the design process, which is conducive to improving the richness of the product; other electronic components can also be added when designing the circuit to improve the integration and functionality of the product.

[0039] In some embodiments of the present invention, in S1: modeling circuit design, multiple fixed positions of light-emitting chips are designed on a transparent light source substrate, and the placement positions of the light-emitting chips and electronic components are arranged according to the required shape; then the best panel is designed according to the equipment stroke to facilitate mass production. Specifically, the placement positions of the light-emitting chips can be arranged according to the required length shape (1) according to the heart-shaped shape; (2) according to the length shape, the positions of the red chip, green chip, blue chip, white light CSP chip, and integrated circuit chip are arranged in a staggered manner; or (3) two color chips are arranged in an alternating manner according to the length shape.

[0040] In some embodiments of the present invention, S2: processing the shape of the circuit and the fixed position of the light-emitting chip on the light source substrate includes the following steps: exposing and developing the copper-clad light source substrate, and then etching the required circuit shape and the pad position of the light source chip to prepare for subsequent welding and molding.

[0041] In some embodiments of the present invention, engraving along the lines on the light source substrate includes the following steps: removing excess material from multiple light source substrates simultaneously by die stamping, thereby saving a lot of production costs and improving production efficiency.

[0042] In some embodiments of the present invention, fixing the light-emitting chip on the light source substrate includes the following steps: applying solder paste on the fixed position of the light-emitting chip on the light source substrate to fix the chip, and then fixing the chip by high-temperature welding, thereby ensuring that the light-emitting chip is firmly fixed.

[0043] In some embodiments of the present invention, spraying a light guide layer on a light source substrate includes the following steps: spraying a light guide layer containing a silicone mixture on both side end surfaces of the light source substrate. The provision of the light guide layer ensures the light transmittance of the light source substrate and prevents light interference.

[0044] In some embodiments of the present invention, when processing a light-emitting chip of a monochromatic light source, the light-guiding layer includes a first silica gel, a second silica gel and a 620 nanometer powder phosphor, which is conducive to ensuring the purity of the light of the monochromatic light source;

[0045] When processing a light-emitting chip of a multi-color light source, the light-guiding layer includes a first silica gel, a second silica gel and a diffusion powder, which is conducive to the fusion of colors of multiple light sources.

[0046] In some embodiments of the present invention, when processing a light-emitting chip of a monochromatic light source, the ratio of the first silica gel, the second silica gel and the 620 nanometer powder phosphor is 4:1:0.35. The monochromatic light source light-guiding layer with this material ratio has excellent light-guiding performance and good light transmittance when emitting light.

[0047] In some embodiments of the present invention, when processing the light-emitting chip of a multi-color light source, the ratio of the first silicone rubber, the second silicone rubber and the diffusion powder is 4:1:0.01. The multi-color light source light-guiding layer with this material ratio has excellent light-guiding performance and good light transmittance when emitting light.

[0048] In some embodiments of the present invention, the light-guiding layer containing the silica gel mixture is formed by centrifugal stirring and degassing.

[0049] In some embodiments of the present invention, splitting the light source substrate into multiple unit light sources includes the following steps: dispersing the light source substrate into multiple separate unit light sources by die stamping to facilitate subsequent welding of electronic components and resistors.

[0050] The following are various embodiments of the present application:

[0051] Example 1

[0052] S11: Modeling circuit design, designing the fixed positions of multiple light-emitting chips on the light-transmitting light source substrate, and arranging the placement positions of the light-emitting chips and electronic components according to the shape of the bar light source;

[0053] S12: exposing and developing on the copper-clad light source substrate, and then etching out the required circuit shape and the pad position of the light source chip;

[0054] S13: removing excess material from the plurality of light source substrates simultaneously by die stamping, and removing the excess material to form circuits of the light source substrates;

[0055] S14: applying solder paste to a fixed position of the light emitting chip on the light source substrate to fix the chip, and then fixing the chip by high temperature welding;

[0056] S15: spraying a light guide layer containing a silicone mixture on both side end surfaces of the light source substrate, which can be adjusted to different colors as needed, and baking at high temperature after spraying to form;

[0057] S16: Dispersing the light source substrate into a plurality of separate unit light sources by die stamping;

[0058] S17: Connect leads and resistors to each unit light source, and perform testing and packaging.

[0059] This product is a monochrome integrated light source module. When arranging the circuit, the light-emitting chips are arranged in different directions to form a rectifier bridge to make it emit light, and there is a resistor at the front end of the rectifier circuit to limit the current. Customers can directly assemble the shell and use it without a driving power supply.

[0060] Example 2

[0061] S21: Modeling circuit design, designing the fixed positions of multiple light-emitting chips on the light-transmitting light source substrate, and arranging the placement of the light-emitting chips and electronic components according to the heart-shaped shape;

[0062] S22: exposing and developing on the copper-clad light source substrate, and then etching out the required circuit shape and the pad position of the light source chip;

[0063] S23: removing excess material from the plurality of light source substrates simultaneously by die stamping, and removing the excess material to form circuits of the light source substrates;

[0064] S24: applying solder paste to a fixed position of the light emitting chip on the light source substrate to fix the chip, and then fixing the chip by high temperature welding;

[0065] S25: spraying a light guide layer containing a silica gel mixture along both side end surfaces of the light source substrate, wherein the ratio of the first silica gel, the second silica gel and the 620 nanometer powder phosphor in the light guide layer is 4:1:0.35, and baking at high temperature after spraying is completed;

[0066] S26: Dispersing the light source substrate into a plurality of separate unit light sources by die stamping;

[0067] S27: Connect leads and resistors to each unit light source, and perform testing and packaging.

[0068] This light source is one of the monochrome modeling light source solutions. The heart-shaped light source can be designed into various shapes and fonts to facilitate various scenes.

[0069] Example 3

[0070] S31: Modeling circuit design, designing the fixed positions of multiple light-emitting chips on the transparent light source substrate, and arranging the positions of red chips, green chips, blue chips, white light CSP chips, and integrated circuit chips according to the length and shape;

[0071] S32: exposing and developing on the copper-clad light source substrate, and then etching out the required circuit shape and the pad position of the light source chip;

[0072] S33: removing excess material from the plurality of light source substrates simultaneously by die stamping, and removing the excess material to form circuits of the light source substrates;

[0073] S34: applying solder paste to a fixed position of the light emitting chip on the light source substrate to fix the chip, and then fixing the chip by high temperature welding;

[0074] S35: spraying a light guide layer containing a silicone mixture along both side end surfaces of the light source substrate, wherein the ratio of the first silicone, the second silicone and the diffusion powder in the light guide layer is 4:1:0.01, and baking at high temperature after spraying is completed;

[0075] S36: Dispersing the light source substrate into a plurality of separate unit light sources by die stamping;

[0076] S37: Connect leads and resistors to each unit light source, and perform testing and packaging.

[0077] This light source combines an integrated circuit chip and four color chips; through two wires, it can control multi-color constant light, flashing, mixed light and other multi-functional light sources; and the front end can be welded with resistors to facilitate current control and assembly.

[0078] Example 4

[0079] S31: Modeling circuit design, designing the fixed positions of multiple light-emitting chips on the light-transmitting light source substrate, and staggeredly arranging the positions of two color chips and integrated circuit chips according to the length and shape;

[0080] S32: exposing and developing on the copper-clad light source substrate, and then etching out the required circuit shape and the pad position of the light source chip;

[0081] S33: removing excess material from the plurality of light source substrates simultaneously by die stamping, and removing the excess material to form circuits of the light source substrates;

[0082] S34: applying solder paste to a fixed position of the light emitting chip on the light source substrate to fix the chip, and then fixing the chip by high temperature welding;

[0083] S35: spraying a light guide layer containing a silicone mixture along both side end surfaces of the light source substrate, wherein the ratio of the first silicone, the second silicone and the diffusion powder in the light guide layer is 4:1:0.01, and baking at high temperature after spraying is completed;

[0084] S36: Dispersing the light source substrate into a plurality of separate unit light sources by die stamping;

[0085] S37: Connect leads and resistors to each unit light source, and perform testing and packaging.

[0086] This light source combines two color chips. When working, one color is lit when the power is turned on in the forward direction, and another color is lit when the power is turned on in the reverse direction. The two instantaneous lighting can be mixed into a third color through an external controller, that is, 2 wires can produce three colors; and the front end can be welded for easy control of current and assembly.

[0087] In summary, the embodiments of the present invention provide a production process for a shaped light source, and the resulting product is a three-dimensional light source that can directly provide the desired three-dimensional luminous effect; the light source substrate is a light-transmitting PCB board, and has a certain toughness, is not easy to break, and is convenient for later transportation and use; the present application can freely design the shape and circuit during the design process, which is conducive to improving the richness of the product; other electronic components can also be added when designing the circuit to improve the integration and functionality of the product.

[0088] The above are only preferred embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A production process for a modeling light source, characterized in that: The following steps are involved: Modeling circuit design, designing the fixed positions of multiple light-emitting chips on the light-transmitting light source substrate; Processing the shape of the circuit and the fixing position of the light emitting chip on the light source substrate; Carving along the line on the light source substrate to remove excess material to form the line of the light source substrate; Fixing the light emitting chip on the light source substrate; Spraying a light guide layer on the light source substrate, and then baking the light source substrate; Splitting the light source substrate into a plurality of unit light sources; Connect leads and resistors to each unit light source, and perform testing and packaging.

2. The production process of the modeling light source according to claim 1, characterized in that: Processing the shape of the circuit and the fixed position of the light emitting chip on the light source substrate includes the following steps: exposing and developing the copper-clad light source substrate, and then etching out the required circuit shape and the pad position of the light source chip.

3. The production process of the modeling light source according to claim 1, characterized in that: The engraving along the line on the light source substrate includes the following steps: removing redundant materials from a plurality of light source substrates simultaneously by die stamping.

4. The production process of the modeling light source according to claim 1, characterized in that: Fixing the light emitting chip on the light source substrate includes the following steps: applying solder paste to the fixed position of the light emitting chip on the light source substrate to fix the chip, and then fixing the chip by high temperature welding.

5. The production process of the modeling light source according to claim 1, characterized in that: The step of spraying the light guide layer on the light source substrate comprises the following steps: spraying the light guide layer containing a silica gel mixture on both side end surfaces of the light source substrate.

6. The production process of the modeling light source according to claim 5, characterized in that: When processing a light-emitting chip of a monochromatic light source, the light-guiding layer includes a first silica gel, a second silica gel and a 620 nanometer powder phosphor; When processing the light-emitting chip of the multi-color light source, the light-guiding layer includes the first silica gel, the second silica gel and diffusion powder.

7. The production process of the modeling light source according to claim 6, characterized in that: When processing a light-emitting chip of a monochromatic light source, the ratio of the first silica gel, the second silica gel and the 620 nanometer powder phosphor is 4:1:0.

35.

8. The production process of the modeling light source according to claim 6, characterized in that: When processing the light-emitting chip of a multi-color light source, the ratio of the first silica gel, the second silica gel and the diffusion powder is 4:1:0.

01.

9. The production process of the modeling light source according to claim 5, characterized in that: The light-guiding layer containing the silica gel mixture is formed by centrifugal stirring and degassing.

10. The production process of the modeling light source according to claim 1, characterized in that: The step of splitting the light source substrate into a plurality of unit light sources comprises the following steps: dispersing the light source substrate into a plurality of separate unit light sources by means of mold stamping.

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