Probe device

Abstract

The probe device includes: a housing having a first surface and a second surface; a probe which is supported by the housing and has a first contact part exposed on the first surface and a second contact part exposed on the second surface, at least one of the first contact part and the second contact part being a conductive ceramic material; and an elastic portion disposed inside the housing so as to abut against the probe and the housing. The posture of the probe varies inside the housing such that the position of a contact region of the second contact portion in contact with the electrode pad varies in accordance with the displacement of the first contact portion. The elastic portion elastically deforms in accordance with a change in the posture of the probe inside the housing, and urges the probe in a direction in which the displacement of the first contact portion is eliminated.

Description

Technical Field

[0001] The present invention relates to a probe device used for inspecting electrical characteristics of a device. Background Art

[0002] In the inspection of the electrical characteristics of a device such as a semiconductor integrated circuit mounted in a package, a probe device is used to electrically connect the device and the inspection device. The probe device electrically connects the electrode terminal of the device to the electrode pad configured on a substrate such as a printed circuit board (PCB). The electrode pad is electrically connected to the inspection device via a wiring pattern formed on the substrate.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-35660 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] In the probe device, the electrode terminal and the electrode pad are electrically connected by a contact that contacts the electrode terminal and the electrode pad. The contact uses a metal as a conductive material. However, since the contact contacts the electrode terminal and the electrode pad, the material of the electrode terminal and the electrode pad adheres to the surface of the contact, and the contact property of the contact with the electrode terminal and the electrode pad (hereinafter referred to as "contact property") decreases.

[0008] In order to restore the contact performance of the contact, it is necessary to perform a cleaning operation to remove the metal attached to the surface of the contact. In the cleaning operation, for example, a brush or a cleaning sheet is used to remove the metal attached to the surface of the contact. However, the mechanical cleaning operation using a brush or a cleaning sheet may cause the contact to wear and reduce the contact performance.

[0009] An object of the present invention is to provide a probe device capable of suppressing a decrease in contact with an electrode terminal and an electrode pad.

[0010] Solutions for solving problems

[0011] The gist of a probe device of one technical solution of the present invention is that the probe device comprises: a housing having a first surface and a second surface; a probe having a first contact portion exposed on the first surface and a second contact portion exposed on the second surface, at least one of the first contact portion and the second contact portion being a conductive ceramic material; and an elastic portion disposed inside the housing in contact with the probe and the housing. The posture of the probe changes inside the housing in such a way that the position of the contact area of ​​the second contact portion in contact with the electrode pad changes correspondingly to the displacement of the first contact portion. The elastic portion elastically deforms in accordance with the change in the posture of the probe inside the housing, and applies force to the probe in a direction to eliminate the displacement of the first contact portion.

[0012] Effects of the Invention

[0013] According to the present invention, it is possible to provide a probe device capable of suppressing a decrease in contact with an electrode terminal and an electrode pad. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram showing the structure of the probe device according to the first embodiment.

[0015] Figure 2 It is a schematic diagram showing a change in the posture of the probe of the probe device according to the first embodiment.

[0016] Figure 3 It is a table showing the hardness and volume resistivity of a material.

[0017] Figure 4 It is a schematic diagram showing the structure of the probe device according to the second embodiment.

[0018] Figure 5 This is a schematic diagram for explaining the method for manufacturing the probe device according to the second embodiment.

[0019] Figure 6 It is a schematic diagram showing the structure of the probe device according to the third embodiment.

[0020] Figure 7 This is a schematic diagram for explaining the method for manufacturing the probe device according to the third embodiment.

[0021] Figure 8 It is a schematic diagram showing an example of arrangement of probes of a probe device according to a comparative example. DETAILED DESCRIPTION

[0022] Next, the embodiments of the present invention are described with reference to the accompanying drawings. In the description of the following drawings, the same or similar reference numerals are marked for the same or similar parts. However, it should be noted that the drawings are schematic, and the ratio of the thickness of each part is different from the actual. In addition, the drawings also naturally include parts with different dimensional relationships and proportions. The embodiments shown below illustrate the devices and methods for concretizing the technical ideas of the present invention. The embodiments of the invention do not specify the material, shape, structure, configuration, etc. of the structural components as the following contents.

[0023] (First embodiment)

[0024] Figure 1 The probe device 1 of the first embodiment shown is used to inspect the electrical characteristics of a device 100 as an inspection object. The device 100 is an inspection object in which a semiconductor integrated circuit or the like is mounted in a package. The probe device 1 electrically connects an electrode terminal 101 of the device 100 and an electrode pad 201 of a substrate 200 . Figure 1 The case where the electrode terminal 101 is a lead electrode of a package is shown as an example. The electrode pad 201 is electrically connected to an inspection device via a wiring pattern (not shown) formed on the substrate 200 or the like.

[0025] The probe device 1 includes a housing 10 having a first surface 11 and a second surface 12 opposite to the first surface 11, a probe 20 supported by the housing 10 and having a first contact portion 21 and a second contact portion 22, and an elastic portion 30 arranged inside the housing 10. The probe 20 functions as a contact that electrically connects the electrode terminal 101 and the electrode pad 201. Hereinafter, when the first contact portion 21 and the second contact portion 22 are not limited, they are also referred to as "contact portions". At least the first contact portion 21 of the probe 20 that contacts the electrode terminal 101 and the second contact portion 22 that contacts the electrode pad 201 are conductive ceramic materials. The portion of the probe 20 that is not a conductive ceramic material uses a conductive material such as a metal material. For example, the probe 20 may also be a structure in which the material of the portion between the first contact portion 21 and the second contact portion 22 of the conductive ceramic material uses a metal material such as a beryllium copper (Be-Cu) material or a palladium (Pd) alloy material. Alternatively, not only the contact portion but the entire probe 20 may be made of a conductive ceramic material. Hereinafter, the case where the entire probe 20 is made of a conductive ceramic material will be described as an example. The elastic portion 30 is disposed inside the housing 10 so as to abut against the housing 10 and the probe 20 .

[0026] In order to make the description of the operation of the probe device 1 easier to understand, Figure 1 The X direction, Y direction, and Z direction are defined as shown. Figure 1In the figure, the X direction is the left-right direction of the paper, the Y direction is the depth direction of the paper, and the Z direction is the up-down direction of the paper. In addition, in the Z direction, the direction in which the device 100 is located when viewed from the probe device 1 is set as the upper direction, and the direction in which the probe device 1 is located when viewed from the device 100 is set as the lower direction.

[0027] In addition, for the probe 20 of the probe device 1, Figure 1 Only one probe 20 is shown in the figure, but the probe device 1 may also have a plurality of probes 20. For example, the probe device 1 may also be a structure in which a plurality of probes 20 are arranged along the Y direction. The thickness of the probe 20 in the Y direction (hereinafter also referred to as "thickness") is, for example, about 0.1 mm to 0.2 mm. In addition, the thickness of the probe is not limited to 0.1 mm to 0.2 mm, and can be arbitrarily set according to the size and spacing of the electrode terminal 101, the magnitude of the current flowing in the probe 20 when the device 100 is inspected, etc. The probe 20 may also be formed, for example, by punching a plate of a conductive ceramic material into a predetermined shape using a wire discharge method or a laser processing method. Therefore, compared with forming the probe 20 by processing a metal material, the processing accuracy of the thickness of the probe 20 can be improved. That is, in the probe 20 of the conductive ceramic material, it is not easy to produce processing deviations in the thickness of the probe 20. On the other hand, since the metal material is softer than the conductive ceramic material, the thickness of the probe 20 of the metal material is prone to processing deviations.

[0028] exist Figure 1 , the probe device 1 is arranged in the lower direction of the device 100 when viewed from the Z direction. The first contact portion 21 of the probe 20 is exposed on the first surface 11 of the housing 10, and the second contact portion 22 of the probe 20 is exposed on the second surface 12 of the housing 10. The probe 20 is arranged in the housing 10 in such a manner that the first contact portion 21 contacts the electrode terminal 101 of the device 100 when the interval between the probe device 1 and the device 100 is narrowed along the Z direction. Furthermore, the probe device 1 is arranged in the housing 10 in such a manner that the contact region 220 of the second contact portion 22 contacts the electrode pad 201 of the substrate 200. As described later, when inspecting the device 100, the position of the contact region 220 of the second contact portion 22 that contacts the electrode pad 201 changes due to the change in the position of the first contact portion 21 in the Z direction.

[0029] When viewed from the Y direction, the probe 20 has a curved shape with a recessed portion facing upward. One end of the probe 20 located farther from the outer portion of the probe 20 opposite to the recessed portion (hereinafter referred to as the "curved portion") is the first contact portion 21. The other end of the probe 20 closer to the recessed portion is the second contact portion 22. A part of the arc-shaped area of ​​the outer edge of the curved portion is the contact area 220. When the XY plane defined by the X direction and the Y direction is used as the projection plane, the projection line connecting the first contact portion 21 and the second contact portion 22 (hereinafter referred to as the "extension direction" of the probe 20) extends along the X direction. In other words, when viewed from the Z direction, the probe 20 extends along the X direction.

[0030] The elastic portion 30 is cylindrical in shape and its axial direction extends in the Y direction. That is, the axial direction of the elastic portion 30 is perpendicular to the direction in which the first contact portion 21 of the probe 20 is displaced and perpendicular to the direction in which the probe 20 extends. The elastic portion 30 abuts against the inner side of the recess of the probe 20. In other words, the elastic portion 30 is sandwiched between the surface of the recess of the probe 20 and the inner wall of the housing 10.

[0031] When inspecting the device 100, if Figure 2 As shown, the electrode terminal 101 of the device 100 and the electrode pad 201 of the substrate 200 are electrically connected by using the conductive probe 20. That is, when inspecting the device 100, the device 100 is relatively moved along the Z direction relative to the probe device 1, and the first contact portion 21 of the probe 20 is brought into contact with the electrode terminal 101 of the device 100. At this time, due to the thrust applied to the first contact portion 21 between the first contact portion 21 and the electrode terminal 101, the probe 20 changes its posture inside the housing 10 in a state where the second contact portion 22 is in contact with the surface of the electrode pad 201.

[0032] Specifically, the posture of the probe 20 changes inside the housing 10 while the second contact portion 22 is kept in contact with the electrode pad 201, in response to the displacement of the first contact portion 21 in the Z direction caused by the push applied to the first contact portion 21. As the posture of the probe 20 changes, the position of the contact area 220 of the second contact portion 22 in contact with the electrode pad 201 changes. Figure 2 In FIG. 1 , the posture of the probe 20 and the shape of the elastic portion 30 are shown by solid lines in a state where the first contact portion 21 is in contact with the electrode terminal 101 (hereinafter also referred to as a “contact state”). Figure 2 The dotted lines in the figure show the posture of the probe 20 and the shape of the elastic portion 30 in a state where the first contact portion 21 is not in contact with the electrode terminal 101 (hereinafter also referred to as a "non-contact state"). In the contact state when inspecting the device 100, the posture of the probe 20 changes so that the position of the contact region 220 is closer to the first contact portion 21 than in the non-contact state.

[0033] The probe 20 needs conductivity for electrically connecting the electrode terminal 101 and the electrode pad 201 and mechanical strength to prevent the shape from changing between the contact state and the non-contact state. The probe 20 made of a conductive ceramic material has both conductivity and mechanical strength.

[0034] In the contact state, the elastic part 30 is sandwiched and compressed by the probe 20 and the housing 10 in accordance with the change in the posture of the probe 20 inside the housing 10. That is, in the contact state, the elastic part 30 is elastically deformed. The elastically deformed elastic part 30 applies force to the probe 20 in a direction to restore the posture of the probe 20 to the non-contact state. In other words, the elastic part 30 applies force to the probe 20 in a manner that pushes the first contact part 21 against the electrode terminal 101.

[0035] During the inspection of the device 100, the elastic force of the elastic portion 30 maintains the first contact portion 21 in contact with the electrode terminal 101 and the second contact portion 22 in contact with the electrode pad 201. Thus, when inspecting the device 100, the probe 20 can ensure electrical connection between the electrode terminal 101 of the device 100 and the electrode pad 201 of the substrate 200.

[0036] In the probe device 1, a part of the arc-shaped region of the outer edge of the curved portion of the probe 20 contacts the electrode pad 201 along a line extending in the Y direction as the contact region 220. Figure 2 As shown in the figure, the position of the contact area 220 in the contact state is closer to the first contact portion 21 than the position of the contact area 220 in the non-contact state. The reason for this is that the position change of the contact area 220 between the contact state and the non-contact state is that the position of the contact area 220 changes along the outer edge of the curved portion in accordance with the change in the posture of the probe 20. Since the contact area 220 is included in the arc-shaped area of ​​the curved portion, the position of the contact area 220 in contact with the electrode pad 201 changes smoothly according to the change in the posture of the probe 20. Therefore, even if the posture of the probe 20 changes, damage to the second contact portion 22 and the electrode pad 201 can be suppressed.

[0037] As described above, when inspecting the device 100, the posture of the probe 20 changes, causing the elastic portion 30 sandwiched between the probe 20 and the housing 10 to be elastically deformed. In addition, the elastic portion 30 applies force to the probe 20 in such a manner that the first contact portion 21 contacts the electrode terminal 101 of the device 100 with a predetermined push. That is, the elastic portion 30 applies force to the probe 20 in a direction that cancels the displacement of the first contact portion 21 caused by the push force applied to the first contact portion 21 when the first contact portion 21 is pressed against the electrode terminal 101. During the inspection of the device 100, that is, during the contact between the first contact portion 21 and the electrode terminal 101, the elastic portion 30 is in a state of compression deformation.

[0038] After the inspection of the device 100 is completed, the relative position of the device 100 in the Z direction with respect to the probe device 1 is changed in such a way that the interval between the device 100 and the probe device 1 is widened. The electrode terminal 101 of the device 100 and the first contact portion 21 of the probe 20 are separated, so that the thrust applied to the first contact portion 21 disappears. As a result, the shape of the elastic portion 30 is restored to the non-contact state, and the posture of the probe 20 is restored to the non-contact state by the elastic force of the elastic portion 30.

[0039] The probe 20 is supported by the housing 10 in such a manner that the posture of the probe 20 can be changed corresponding to the displacement of the position of the first contact portion 21 in the Z direction. The posture of the probe 20 changes inside the housing 10 in such a manner that the position of the contact area 220 of the second contact portion 22 that contacts the electrode pad 201 changes corresponding to the displacement of the first contact portion 21 in the Z direction. For example, although not shown in the figure, a part of the probe 20 may be protruded, and the protruding part of the probe 20 may be embedded in a support hole provided in the housing 10. Alternatively, a part of the probe 20 may be placed on a support portion of the housing 10 provided in the lower direction of the probe 20.

[0040] As described above, the probe device 1 includes a probe 20 of a conductive ceramic material that contacts the electrode terminal 101 and the electrode pad 201 at the same time, and an elastic portion 30 that applies force to the probe 20 using an elastic force when the probe 20 contacts the electrode terminal 101. The elastic force of the elastic portion 30 is used to control the contact load applied to the probe 20 when the probe 20 contacts the electrode terminal 101. The contact load is increased by increasing the elastic force of the elastic portion 30, and the contact load is reduced by reducing the elastic force of the elastic portion 30. In addition, in the probe device 1, the displacement amount (hereinafter also referred to as "stroke") of the first contact portion 21 caused by contact with the electrode terminal 101 is controlled by the elastic force of the elastic portion 30. That is, the stroke is reduced by increasing the elastic force of the elastic portion 30, and the stroke is increased by reducing the elastic force of the elastic portion 30.

[0041] The material of the elastic part 30 is, for example, an elastomer. In addition, the elastic part 30 may be set to a cylindrical shape with a hollow structure. By setting the elastic part 30 to a cylindrical shape, it is easy to control the size of the contact load and the stroke. In other words, by increasing the thickness of the cylindrical elastic part 30, the contact load can be increased or the stroke can be reduced. On the other hand, by reducing the thickness of the cylindrical elastic part 30, the contact load can be reduced or the stroke can be increased.

[0042] The elastic part 30 may be made of either a conductive material or an insulating material. However, the materials of the housing 10 and the elastic part 30 and the arrangement of the elastic part 30 inside the housing 10 are set so that the probe 20 is electrically insulated from each other.

[0043] Conventionally, metal materials are used for contacts that electrically connect the electrode terminal 101 and the electrode pad 201. The contact is equivalent to the probe 20 of the probe device 1. Due to repeated inspections of the device 100, the metal materials (tin or nickel-palladium (Ni-Pd) etc.) of the electrode terminal 101 and the electrode pad 201 adhere to the surface of the contact. In order to prevent the contact between the contact and the electrode terminal 101 and the electrode pad 201 from being reduced, it is necessary to use a cleaning operation to remove the metal attached to the surface of the contact. However, due to the cleaning operation, the surface of the contact may be worn or damaged, and the contact of the contact may be reduced.

[0044] In contrast, in the probe device 1, the material of the probe 20 uses a conductive ceramic material that is harder and more wear-resistant than a metal material, thereby suppressing a decrease in the contact property of the probe 20. For example, the probe device 1 can suppress the wear of the probe 20 caused by the cleaning operation of removing the metal attached to the surface of the probe 20. Therefore, the probe device 1 can achieve stable contact between the probe 20 and the electrode terminal 101 and the electrode pad 201. Figure 3 The table shows a comparison of the hardness and volume resistivity of representative metal materials of contactors, beryllium copper (Be—Cu) materials and palladium (Pd) alloy materials, and conductive ceramic materials. Figure 3 As shown, the hardness of the conductive ceramic material is higher than that of the metal material, and the volume resistivity thereof is equal to or lower than that of the metal material. Therefore, the conductive ceramic material can be preferably used as the material of the probe 20 .

[0045] The hardness of the probe 20 is preferably set to 1400 HV or more, for example. In addition, the hardness of the probe 20 is preferably set to a predetermined toughness that ensures that no damage such as a notch is caused by applying an external force to the probe 20 during inspection. For example, by setting the hardness of the probe 20 to 1000 HV or more, an effect can be obtained that the hardness is higher than that of metal materials commonly used for probes and is not easily ground during cleaning. Metal materials commonly used for probes, such as Be-Cu (about 380 HV), palladium alloy (360 HV) or rhenium tungsten alloy (900 HV), have a hardness of less than 1000 HV.

[0046] In addition, the volume resistivity of the probe 20 is preferably set to, for example, 10 μΩ·cm or less. For example, by setting the volume resistivity of the probe 20 to 30 μΩ·cm or less, the probe 20 can have a volume resistivity of the same degree as that of a metal material (palladium alloy (32 μΩ·cm)) commonly used for a probe. Therefore, by using a conductive ceramic material for the probe 20, it is possible to obtain an effect such that the wear during cleaning can be suppressed while ensuring the same degree of electrical properties as the metal material, thereby extending the life of the probe 20.

[0047] In addition, the conductive ceramic material used for the probe 20 preferably uses a material having a higher hardness than the electrode terminal 101 and the electrode pad 201. By making the hardness of the probe 20 higher than the hardness of the electrode terminal 101 and the electrode pad 201, it is possible to suppress the loss of the first contact portion 21 and the second contact portion 22 of the probe 20 caused by repeated inspection of the device 100.

[0048] In addition, when the contact is made of metal material, in order to improve the contactability of the contact, metal is sometimes plated on the surface of the metal material of the contact. For example, a contact is used in which gold is plated on the surface of a base material of a metal material such as a Be-Cu material or a palladium alloy material. However, there may be problems caused by using a contact with a metal plated surface for inspection of the device 100. For example, a metal plating layer peeled off from the contact due to contact with the electrode terminal 101 and the electrode pad 201 adheres to the surface of the substrate 200, causing a short circuit between the electrode pads 201. In contrast, the surface of the probe 20 of the probe device 1 is not plated with metal, and the conductive ceramic material contacts the electrode terminal 101 at the first contact portion 21, and the conductive ceramic material contacts the electrode pad 201 at the second contact portion 22. Therefore, it is possible to prevent a short circuit in the substrate 200 caused by the peeling of the metal plating layer from the surface of the probe 20.

[0049] As described above, in the probe device 1 of the first embodiment, the probe 20 of the conductive ceramic material is used, which has a conductivity equal to or higher than that of the metal material and has a higher hardness and a higher wear resistance than the metal material. Since at least the portion of the probe 20 that contacts the electrode terminal 101 and the electrode pad 201 is made of the conductive ceramic material, the wear of the contact portion can be suppressed. Therefore, by using the probe device 1, the decrease in contact with the electrode terminal 101 and the electrode pad 201 can be suppressed, so that the electrical characteristics of the device 100 can be accurately inspected. Not only the case where the probe 20 as a whole is made of the conductive ceramic material, as long as at least the first contact portion 21 and the second contact portion 22 are made of the conductive ceramic material, the decrease in contact with the electrode terminal 101 and the electrode pad 201 can be suppressed.

[0050] (Second embodiment)

[0051] In the probe device 1 of the second embodiment, as Figure 4 As shown, two probes 20 are arranged in parallel along the Y direction via a shield plate 25 made of an insulating material. Figure 4 The structure of the probe device 1 when viewed from the X direction is shown. The probe 20 and the shielding plate 25 are seen through and the elastic portion 30 is indicated by a dotted line. The two probes 20 are arranged in the Y direction with the shielding plate 25 interposed therebetween. Figure 4 The probe device 1 shown is different from the first embodiment. The probe device 1 of the second embodiment is the same as the first embodiment in other configurations. Hereinafter, a group of probes 20 arranged with a shield plate 25 interposed therebetween is also referred to as a "probe pair".

[0052] exist Figure 4 In the probe device 1 shown, the interval in the Y direction between the first contact portions 21 of the two probes 20 constituting the probe pair is determined by the thickness in the Y direction of the shielding plate 25 (hereinafter referred to as "plate thickness"). By using the probe device 1 having the probe pair, the first contact portions 21 of the probes 20 can be independently contacted with two electrode terminals 101 arranged close to each other. The plate thickness of the shielding plate 25 can also be set according to the interval along the Y direction between the electrode terminals 101.

[0053] use Figure 4 The probe device 1 shown can make a Kelvin connection with the device 100 using a probe pair. That is, the probe device 1 having the probe pair can be used as a Kelvin contact measurement device.

[0054] The probe pair can also be, for example, Figure 5As shown, the sheet 20C is manufactured by processing a conductive ceramic material 20A sandwiching an insulating ceramic material 20B from both sides. The sheet 20C is punched into a predetermined shape of the probe 20 by a wire discharge method or a laser processing method. Through the above steps, a probe pair having a shielding plate 25 processed from the insulating ceramic material 20B and a probe 20 processed from the conductive ceramic material 20A can be manufactured. The sheet 20C can also be formed by diffusion bonding of the insulating ceramic material 20B and the conductive ceramic material 20A. In the case where the bonding temperature of the diffusion bonding is a high temperature of more than 800 degrees, it is preferred that the thermal expansion coefficient of the insulating ceramic material 20B and the thermal expansion coefficient of the conductive ceramic material 20A are close to each other so that the sheet 20C does not crack or deform when it is cooled to room temperature after bonding.

[0055] The interval between the probes 20 of the probe pair is determined by the thickness of the shielding plate 25 made of insulating ceramic material. Figure 4 The probe device 1 shown can manufacture the probe device 1 in which the intervals between the probes 20 are set with high accuracy.

[0056] As described above, according to the probe device 1 of the second embodiment, the contact property of the probe 20 can be improved by using a conductive ceramic material with a high hardness as the material of the probe 20, while the interval of the probe 20 can be set with high precision. In other respects, the probe device 1 of the second embodiment is substantially the same as the probe device 1 of the first embodiment, and repeated descriptions are omitted. For example, only the contact portion of the probe 20 can be made of a conductive ceramic material, or the entire probe 20 can be made of a conductive ceramic material.

[0057] (Third embodiment)

[0058] like Figure 6 As shown, the probe device 1 of the third embodiment sandwiches the probe 20 from both sides by the shield plate 25 of the insulating material. In addition, a plurality of probes 20 are arranged in parallel in the Y direction inside the single slit 13 provided in the housing 10 with the shield plates 25 contacting each other. Figure 6 The structure of the probe device 1 when viewed from the X direction is shown, with the probe 20 and the shielding plate 25 being seen through and the elastic portion 30 being indicated by a dotted line. The probe 20 is sandwiched by the shielding plate 25 and a plurality of probes 20 are arranged in the same slit 13 of the housing 10. Figure 6 The probe device 1 shown is different from the first embodiment. The probe device 1 of the third embodiment is the same as the first embodiment in other structures. Hereinafter, the plurality of probes 20 connected to each other via the shield plate 25 are collectively referred to as a "probe group". Figure 6 The probe device 1 shown in the figure shows, by way of example, a case where one probe group is composed of three probes 20. The number of probes 20 constituting the probe group can be set arbitrarily.

[0059] Probe sets can also be used, for example Figure 7 As shown in the figure, the probe 20 is manufactured by processing a laminated material 20D having a structure in which an insulating ceramic material 20B sandwiches a conductive ceramic material 20A from both sides. The laminated material 20D is punched into a predetermined shape of the probe 20 by a wire discharge method or a laser processing method. Through the above process, a probe group having a plurality of probes 20 can be manufactured. By processing the laminated material 20D, a plurality of probes 20 can be manufactured by a single processing step.

[0060] like Figure 8 As shown, in the probe device of the comparative example where the probe 20 is not sandwiched by the insulating shielding plate 25, one probe 20 is arranged in one slit 13 of the housing 10. By arranging one probe 20 in one slit 13, the guide portion 14 between the partitioning slits 13 of the housing 10 prevents short circuits between the probes 20.

[0061] On the other hand, Figure 6 As shown, in the probe device 1 having the probe group, a plurality of probes 20 can be arranged in one slit 13. Therefore, the probe device 1 can be miniaturized. Since the intervals between the probes 20 in the probe group can be set by the thickness of the shielding plate 25, it is easy to manage the accuracy of the intervals between the probes 20 and the accuracy of the size of the entire probe group.

[0062] Furthermore, in the probe group, since the outer side of the probe 20 is covered by the insulating shielding plate 25, the guide portion 14 of the shell 10 disposed on both sides of the slit 13 may also be conductive. In other words, the material of the shell 10 may also be a conductive material. Therefore, the shell 10 may also be set to a predetermined potential. For example, in the process of inspecting a device, in the case where a higher-precision inspection can be performed by setting the shell 10 to a ground potential, the shell 10 may be set to a ground potential using a conductive material. In addition, by selecting a material with a lower original price, either a conductive material or an insulating material, as the material of the shell 10 and the elastic portion 30, the manufacturing cost of the probe device 1 may also be reduced.

[0063] As described above, the probe device 1 of the third embodiment can improve the contact of the probe 20 by using a conductive ceramic material with a higher hardness as the material of the probe 20, while setting the interval of the probe 20 with high precision. In addition, the probe device 1 of the third embodiment increases the material options of the components around the probe 20, which can achieve cost reduction and functional improvement. In other aspects, the probe device 1 of the third embodiment is substantially the same as the first embodiment, and repeated descriptions are omitted. For example, only the contact portion of the probe 20 can be a conductive ceramic material, or the entire probe 20 can be a conductive ceramic material.

[0064] (Other Embodiments)

[0065] As described above, the present invention is described by the embodiments, but it should not be understood that the description and drawings constituting part of the present disclosure limit the content of the present invention. Various alternative embodiments, examples, and operation techniques will be apparent to those skilled in the art from the present disclosure.

[0066] For example, in the above description, the case where the first contact portion 21 and the second contact portion 22 are made of a conductive ceramic material is described, but either one of the first contact portion 21 and the second contact portion 22 may be made of a conductive ceramic material. For example, in the case where either one of the first contact portion 21 and the second contact portion 22 is worn due to cleaning operations, only the contact portion that is worn due to cleaning operations may be made of a conductive ceramic material. That is, the electrical characteristics of the device 100 can be accurately inspected using the probe 20 in which at least either one of the first contact portion 21 and the second contact portion 22 is made of a conductive ceramic material.

[0067] In addition, in the above content, the case where the elastic part 30 is cylindrical is illustrated, but the shape of the elastic part 30 is not limited to the cylindrical shape. For example, the elastic part 30 may be cylindrical without a hollow part, and the outer edge of the elastic part 30 when viewed from the Y direction may not be circular but polygonal. In addition, the case where the electrode terminal 101 of the device 100 is a lead electrode is illustrated, but the electrode terminal 101 may also be a pad electrode or a bump electrode, or an electrode of a shape other than these.

[0068] As described above, the present invention naturally includes various embodiments and the like that are not described here.

[0069] Description of Reference Numerals

[0070] 1. Probe device; 10. Shell; 11. First surface; 12. Second surface; 13. Slit; 14. Guide portion; 20. Probe; 21. First contact portion; 22. Second contact portion; 25. Shielding plate; 30. Elastic portion; 100. Device; 101. Electrode terminal; 200. Substrate; 201. Electrode pad.

Claims

1. A probe device that electrically connects an electrode terminal of a device to be inspected and an electrode pad connected to an inspection device, wherein: The probe device comprises: A housing having a first surface and a second surface opposite to the first surface; a probe supported by the housing and having a first contact portion exposed on the first surface and a second contact portion exposed on the second surface, at least one of the first contact portion and the second contact portion being made of a conductive ceramic material, wherein a posture of the probe changes inside the housing in such a manner that a position of a contact region of the second contact portion that contacts the electrode pad changes in accordance with a displacement of the first contact portion; and An elastic portion is disposed inside the housing so as to abut against the probe and the housing, and elastically deforms in response to a change in the posture of the probe inside the housing to bias the probe in a direction to cancel the displacement of the first contact portion.

2. The probe device according to claim 1, wherein: The probe is entirely made of conductive ceramic material.

3. The probe device according to claim 1, wherein: The probe has a curved shape, and the contact region is included in an arc-shaped region outside the curved shape.

4. The probe device according to claim 1, wherein: The probe has a higher hardness than a probe formed of rhenium-tungsten alloy.

5. The probe device according to any one of claims 1 to 4, wherein: The two probes are arranged in parallel with a shield plate made of an insulating material interposed therebetween.

6. The probe device according to any one of claims 1 to 4, wherein: The probe is sandwiched from both sides by a shielding plate made of insulating material. A plurality of the probes are arranged in parallel in a single slit provided in the housing so as to contact the shielding plates with each other.

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