Controller assembling device and method

Abstract

The invention provides a controller assembling device and a using method thereof, the controller assembling device comprises a positioning tool and a coating device, and the positioning tool comprises a first positioning part; the coating device comprises a coating partition plate, a through hole is formed in the coating partition plate, and the controller assembling device at least has a first state; when the controller assembling device is in the first state, the coating partition plate covers at least part of the positioning tool, and the projection of the through hole on the upper surface of the positioning tool is located in the projection of the first positioning part on the first surface of the positioning tool. The effect of improving the silicone grease coating uniformity is achieved.

Description

Technical Field

[0001] The present application relates to the field of controller assembly, and in particular to a controller assembly device and method. Background Art

[0002] The controller assembly method of the related art is to manually apply thermal conductive dressing (such as thermal conductive silicone grease or heat dissipation paste) to the thermal conductive sheet (such as ceramic sheet), and manually complete the subsequent pasting and assembly of the thermal conductive sheet and the controller or printed circuit board. However, applying thermal conductive dressing to the thermal conductive sheet in this way will cause the thickness and consistency of the thermal conductive dressing to be affected by manual labor, and the process quality of the product is difficult to guarantee. Summary of the invention

[0003] In view of this, the present application provides a controller assembly device and method, which can be used to improve the problem of uneven application of thermal conductive dressings and achieve the effect of improving the uniformity of thermal conductive dressing application.

[0004] To achieve the above objectives, the embodiments of the present invention provide the following technical solutions:

[0005] A controller assembly device includes a positioning tool and a coating device, the positioning tool includes a first positioning portion; the coating device includes a coating partition, the coating partition is provided with a through hole, and the controller assembly device has at least a first state; when the controller assembly device is in the first state, the coating partition covers at least part of the positioning tool, and the projection of the through hole on the upper surface of the positioning tool is located within the projection of the first positioning portion on the first surface of the positioning tool.

[0006] The controller assembly device provided by this embodiment includes a positioning tool and a coating device; the positioning tool also includes a first positioning portion; the coating device also includes a coating partition, and the coating partition is provided with a through hole; the controller assembly device has at least a first state; when applying the thermal conductive compress, the controller assembly device can be switched to the first state, that is, the coating partition cover is set on the positioning tool, and the projection of the through hole on the upper surface of the positioning tool is located within the projection of the first positioning portion on the first surface of the positioning tool, so that the thermal conductive compress can flow to the first positioning portion through the through hole, thereby improving the uniformity of the application of the thermal conductive compress.

[0007] The present application also provides a method for using a controller assembly device, comprising:

[0008] Placing a heat conducting sheet on a first positioning portion of the controller assembly;

[0009] The coating partition cover of the controller assembly device is arranged on the positioning fixture of the control assembly device, so that the projection of the through hole of the coating partition on the upper surface of the positioning fixture is located within the projection of the first positioning portion on the upper surface of the positioning fixture;

[0010] The thermal conductive compress is applied by knife coating on the coated separator.

[0011] By using the method of the controller assembly device provided in this embodiment, the thermal conductive sheet is placed on the first positioning portion, and then the coating partition cover of the controller assembly device is placed on the positioning tool of the controller assembly device. The projection of the through hole of the coating partition on the upper surface of the positioning tool is located within the projection of the first positioning portion on the upper surface of the positioning tool, so that after the thermal conductive compress is scraped onto the coating partition, the thermal conductive compress can flow evenly through the through hole onto the thermal conductive sheet placed on the first positioning portion, thereby improving the uniformity of the coating of the thermal conductive compress. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0013] Figure 1 A schematic diagram of the structure of the controller assembly device provided in this application;

[0014] Figure 2 A schematic diagram of the local structure of the positioning tooling is provided;

[0015] Figure 3 is a cross-sectional view intended to illustrate a lifting assembly;

[0016] Figure 4 A schematic diagram for showing a partial structure of an adsorption component;

[0017] Figure 5 A schematic diagram showing a partial structure of a coated partition;

[0018] Figure 6 Schematic diagram of the injection molded part structure.

[0019] Figure numerals: 1. base; 2. positioning tool; 21. first positioning part; 22. second positioning part; 23. third positioning part; 4. lifting assembly; 41. lifting control part; 42. lifting platform; 421. lower lifting plate; 422. upper lifting plate; 423. sandwich column; 43. adsorption part; 44. loading platform; 5. coating partition; 51. partition frame; 52. removable partition; 521. mesh area; 522. storage area; 6. support plate; 7. heat conductive sheet; 8. injection molded part; 81. positioning pin.

[0020] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0021] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0022] The technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0023] Example 1

[0024] The present invention first discloses a controller assembly device, including a positioning tool 2 and a coating device, wherein the positioning tool 2 includes a first positioning portion 21; the coating device includes a coating partition 5, and the coating partition 5 is provided with a through hole, and the controller assembly device has a first state and a second state; when the controller assembly device is in the first state, the coating partition 5 covers at least part of the positioning tool 2, and the projection of the through hole on the upper surface of the positioning tool 2 is located within the projection of the first positioning portion 21 on the upper surface of the positioning tool 2. When the controller assembly device is in the second state, the coating partition 5 is away from the positioning tool 2.

[0025] The controller assembly device in this embodiment can improve the uniformity of the thermal conductive dressing coating. Specifically, during the use of the controller assembly device, the thermal conductive sheet 7 is first placed in the first positioning portion 21, and the thermal conductive sheet 7 can be a ceramic sheet. Then the controller assembly device is switched to the first state, that is, the coating partition 5 is covered on the positioning fixture 2, and the projection of the through hole on the upper surface of the positioning fixture 2 is located within the projection of the first positioning portion 21 on the upper surface of the positioning fixture 2. Finally, the thermal conductive dressing is printed on the upper surface of the coating partition 5, so that the thermal conductive dressing can flow through the through hole provided in the coating partition 5 to the thermal conductive sheet placed in the first positioning portion 21, thereby improving the uniformity of the thermal conductive dressing coating.

[0026] The positioning tooling 2 is a horizontally arranged rectangular plate structure. The controller assembly device also includes a base 1, a lifting assembly 4 and a support member 6. The support member 6 is arranged between the positioning tooling 2 and the base 1. The positioning tooling 2 is fixedly arranged above the base 1 at least through the support member 6. The support member 6 is a plate-like or columnar structure that can play a supporting and fixing role. Specifically, the support member 6 in this embodiment includes at least a support plate. There are four support plates, which are respectively arranged around the positioning tooling 2. The top of the support plate is fixedly connected to the positioning tooling 2, and the bottom of the support plate is fixedly connected to the top surface of the base 1; the first positioning portion 21 opened on the positioning tooling 2 includes at least a first through hole, and can be used to limit the heat conductive plate 7.

[0027] The lifting assembly 4 includes a lifting control component 41, a lifting platform 42 and an adsorption component 43. The lifting control component 41 is a driving component that can realize linear feed motion, such as a cylinder, a hydraulic cylinder, an electric cylinder, an electric push rod or a screw (rod) nut mechanism driven by a motor. Specifically, the lifting control component 41 can control the lifting platform 42 to approach or move away from the coating partition 5. The lifting control component 41 in this embodiment is a cylinder, the cylinder body of the cylinder is fixedly connected to the top surface of the base 1, the piston rod of the cylinder is fixedly connected to the lifting platform 42, and the lifting platform 42 is arranged parallel to the positioning tool 2. When the controller assembly device is in the first state, at least part of the lifting platform 42 is located in the first through hole. The adsorption component 43 is arranged at one end of the lifting platform 42 close to the coating partition 5, and the adsorption component 43 can move closer to or away from the positioning tool 2 with the lifting platform 42. The adsorption member 43 corresponds to the first positioning portion 21 one by one, and the adsorption member 43 and the first positioning portion 21 are clearance-matched to achieve a sliding connection. In this embodiment, the adsorption member 31 is a negative pressure suction cup.

[0028] The coating partition 5 is a plate-like structure covered on the positioning tooling 2. The coating partition 5 is also provided with a plurality of mesh areas 521, which correspond one-to-one to the plurality of first positioning portions 21 of the positioning tooling 2. A plurality of through holes are opened in the mesh area 521, and the hole depth d of the through hole satisfies 1mm≤d≤1.8mm.

[0029] When applying the thermal conductive compress to the heat conductive sheet 7 through the controller assembly device, the heat conductive sheet 7 is first placed in the first positioning portion 21, and the first positioning portion 21 can limit the displacement of the heat conductive sheet 7 in all directions on the horizontal plane. Then the controller assembly device is switched to the first state, and the lifting control component 41 controls the lifting platform 42 to approach the coating partition 5, so that at least part of the lifting platform 42 and the adsorption component 43 arranged on the side of the lifting platform 42 close to the coating partition 5 are located in the first positioning portion 21. On the one hand, the cooperation of the two can support the heat conductive sheet 7 and prevent the heat conductive sheet 7 from falling from the first positioning portion 21. On the other hand, when the heat conductive sheet 7 is placed in the first positioning portion 21, the adsorption component 43 is started and adsorbs the heat conductive sheet 7, so as to limit the displacement of the heat conductive sheet 7 in the vertical direction. The first positioning portion 21 and the adsorption component 43 can be used in combination to complete the positioning of the heat conductive sheet 7. After the positioning of the heat conducting sheet 7 is completed, the coating partition 5 is turned over so that the coating partition 5 is covered on the positioning fixture 2, and the position of the mesh area 521 corresponds to the position of the first positioning portion 21, so that the mesh area 521 of the coating partition 5 is located above the heat conducting sheet 7, and a heat conducting material, such as silicone grease, is applied to the mesh area 521 of the coating partition 5. The silicone grease can flow through the through holes of the mesh area 521 to the surface of the heat conducting sheet 7 and adhere to the surface of the heat conducting sheet 7. After the silicone grease fills the through holes of the mesh area 521, the excess silicone grease can be temporarily stored in the storage area 522 of the coating partition 5 to be used for the next application of silicone grease. The silicone grease can be accurately attached to the surface of the heat conducting sheet 7 through the coating mesh of the coating partition 5, avoiding the silicone grease from adhering to other surfaces other than the heat conducting sheet 7. On the components, thereby saving silicone grease, on the other hand, the non-hollow part of the mesh area 521 of the coating partition 5 can support the tool used to apply silicone grease, so that the silicone grease thickness of the hollow part of the mesh area 521 maintains a higher uniformity, thereby improving the process quality; in addition, when the coated partition mesh area 521 is separated from the thermal conductive sheet 7, the non-hollow part of the mesh area 521 will cause a mesh-like gap to appear between the silicone grease attached to the thermal conductive sheet 7, and the gap can accommodate the silicone grease diffused by the extrusion when the thermal conductive sheet 7 and the semiconductor device are squeezed against each other for assembly, thereby reducing the gap between the thermal conductive sheet 7, the semiconductor device and the silicone grease, ensuring the heat dissipation capacity while reducing the silicone grease squeezed out from between the semiconductor device and the thermal conductive sheet 7, further saving the amount of silicone grease.

[0030] When the heat conducting sheet 7 coated with silicone grease is used, the heat conducting sheet 7 and the semiconductor device are connected by the injection molded part 8 with positioning function, so as to ensure good fit and heat dissipation performance. Therefore, in this embodiment, the top surface of the positioning tool 2 is fixedly connected with a second positioning part 22 and a third positioning part 23 for positioning the heat conducting sheet 7, so as to ensure good fit and heat dissipation performance. Figure 6Taking the injection molded part 8 shown as an example, the second positioning part 22 and the third positioning part 23 in this embodiment are described in detail. Six second positioning parts 22 are provided, and the six second positioning parts 22 are arranged around the area not covered by the coating partition 5 to limit the injection molded part 8. The third positioning part 23 is used in conjunction with the positioning pin 81 on the surface of the injection molded part 8 to accurately position the injection molded part 8, so that the installation area of ​​the heat conducting sheet 7 of the injection molded part 8 coincides with the first positioning part 21 of the positioning tool 2.

[0031] When installing the injection molded part 8 on the positioning fixture 2, first align the installation area of ​​the heat conducting plate 7 of the injection molded part 8 with the first positioning part 21 of the positioning installation platform, and make the edge of the injection molded part 8 contact the inner wall of the second positioning part 22, then press down the injection molded part 8 until the positioning pin 81 of the injection molded part 8 is inserted into the third positioning part 23, that is, the positioning and installation of the injection molded part 8 is completed. In this process, the second positioning part 22 can guide the injection molded part 8 to achieve preliminary positioning of the injection molded part 8, so that the positioning pin 81 of the injection molded part 8 can be more easily inserted into the third positioning part 23 during the subsequent pressing process, which provides convenience for completing precise positioning and improves installation efficiency. After completing the installation and positioning of the injection molded part 8, start the lifting control component 41 to lift The piston rod of the lifting control part 41 pushes the lifting platform 42 to rise, thereby pushing the suction cup and the heat conductive sheet 7 adsorbed on the suction cup to rise and approach the heat conductive sheet 7 installation area on the bottom surface of the injection molded part 8, and finally make the heat conductive sheet 7 and the injection molded part 8 tightly contact, and complete the pasting of the heat conductive sheet 7 and the injection molded part 8 by applying silicone grease on the surface of the heat conductive sheet 7. After that, the printed circuit board of the controller is installed on the injection molded part 8. During the installation process, the side of the heat conductive sheet 7 with silicone grease attached is brought close to the power components (such as IGBT, SiC, etc.) of the printed circuit board and squeezes the silicone grease, so that the paste-like silicone grease fills the gap between the power components and the heat conductive sheet, thereby ensuring the thermal conductivity of the heat conductive sheet and the silicone grease, and improving the heat dissipation efficiency of the heating elements in the controller.

[0032] The present invention also discloses a method for using a controller assembly device, comprising the following steps:

[0033] Step 1: Place the heat conducting sheet 7 in the first positioning portion 21 of the positioning tool 2 .

[0034] Step 2: Turn over the coating partition 5 so that the coating partition 5 covers the positioning tool 2.

[0035] Step 3: Apply silicone grease so that the silicone grease fills the grid area of ​​the coated partition 5.

[0036] Step 4: Turn over the coating partition 5 again to separate the coating partition 5 from the positioning tool 2.

[0037] Step 5: Install the injection molded part 8 on the top surface of the positioning tooling 2.

[0038] Step 6: Start the lifting control component 41 to lift the lifting platform 42 so that the heat conducting plate 7 is tightly attached to the bottom surface of the injection molded part 8. After keeping it for a period of time, close the lifting control component 41 and close the adsorption component 31 to separate the adsorption component 31 from the heat conducting plate 7.

[0039] Step 7: Install the printed circuit board on the injection molded part, and make the heating element of the printed circuit board contact with the thermal conductive dressing applied to the thermal conductive sheet;

[0040] Step 8: Remove the injection molded part 8 and the heat conducting sheet 7 adhered to the bottom surface of the injection molded part 8 from the positioning tool.

[0041] Example 2

[0042] The difference from Example 1 is that the positioning tool 2 and the support plate 6 are detachably connected by bolts, a threaded hole is provided on the top surface of the support plate 6, and a plurality of threaded holes corresponding to the top surfaces of the four support plates 6 are provided near the edge on the upper surface of the positioning tool 2.

[0043] The coating partition 5 includes a partition frame 51 hinged to the base 1 and a detachable partition 52, and the mesh area 521 and the material storage area 522 are both located on the detachable partition 52; the detachable partition 52 and the partition frame 51 are detachably connected by screws.

[0044] The provision of the removable partition 52 allows the removable partition 52 to be replaced separately when the removable partition 52 has been used for a long time and the thickness of the mesh area has dropped below the thickness required by the coating process, thereby facilitating the maintenance of the controller installation device.

[0045] The lifting platform 42 includes an upper lifting plate 422, a lower lifting plate 421 and a sandwich column 423. The upper lifting plate 422 and the lower lifting plate 421 are both arranged horizontally, the upper lifting plate 422 is located above the lower lifting plate 421, the center of the bottom surface of the lower lifting plate 421 is fixedly connected to the piston rod of the lifting control member 41, and the sandwich column 423 is arranged vertically. The top end of the sandwich column 423 is detachably connected to the bottom surface of the upper lifting plate 422, and the bottom end of the sandwich column 423 is detachably connected to the top surface of the lower lifting plate 421. The specific way in which the sandwich column 423 is detachably connected to the upper lifting plate 422 and the lower lifting plate 421 is that the upper lifting plate 4 A cubic square mortise and tenon is provided on the top surface of 22, a square mortise and tenon is provided on the bottom surface of the lower lifting plate 421, the top and bottom ends of the sandwich column 423 are integrally formed with a cubic square tenon that is plugged into and matched with the square mortise and tenon, a threaded hole is provided on the cross section of the square tenon, and a circular through hole is provided at the center of the bottom surface of the tenon and tenon, the sandwich column 423 is connected to the upper lifting plate 422 or the lower lifting plate 421 by fixing bolts, the fixing bolts pass through the upper lifting plate 422 or the lower lifting plate 421, and are screwed into the threaded holes of the square tenons, thereby completing the detachable connection between the upper lifting plate 422, the lower lifting plate 421 and the sandwich column 423.

[0046] The lifting assembly 4 also includes a loading platform 44, which is a horizontally arranged rectangular plate-shaped structure. The loading platform 44 is arranged on the top surface of the upper lifting plate 422 and is detachably connected to the upper lifting plate 422 by bolts. A plurality of adsorbents 43 are arranged on the top surface of the upper lifting plate 422 and are fixedly connected to the loading platform 44. An air guide channel is provided in the loading platform 44, and the air guide channel connects the adsorbent 43 with an external air path.

[0047] The versatility of the controller installation device can be improved by using the detachably connected positioning tool 2, detachable partition 52 and loading platform 44. When the layout of the thermal conductive sheet 7 to be coated or the injection-molded part 8 changes, the positioning tool 2, detachable partition 52 and loading platform 44 that meet the coating and installation requirements can be replaced, thereby making the controller installation device suitable for new assembly scenarios.

[0048] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the invention disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the following claims.

[0049] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A controller assembly device, characterized in that: The controller assembly device comprises a positioning fixture (2) and a coating device, wherein the positioning fixture (2) comprises a first positioning portion (21); the coating device comprises a coating partition (5), and the coating partition (5) is provided with a through hole, and the controller assembly device has at least a first state; when the controller assembly device is in the first state, the coating partition (5) covers at least a portion of the positioning fixture (2), and the projection of the through hole on the upper surface of the positioning fixture (2) is located within the projection of the first positioning portion (21) on the upper surface of the positioning fixture (2).

2. A controller assembly device according to claim 1, characterized in that: The controller assembly device comprises a lifting component (4), wherein the lifting component (4) comprises a lifting control component (41) and a lifting platform (42), wherein the lifting control component (41) is capable of controlling the lifting platform (42) to move closer to or further away from the coating partition (5); the controller assembly device also has a second state; when the controller assembly device is in the second state, the coating partition (5) is separated from the positioning tool (2).

3. A controller assembly device according to claim 2, characterized in that: The lifting assembly (4) also includes an adsorption member (43), and the adsorption member (43) is located at one end of the lifting platform (42) close to the coating partition (5), and the adsorption member (43) can move closer to or away from the positioning tool (2) along with the lifting platform (42); the first positioning portion (21) also includes a first through hole; when the controller assembly device is in the first state, at least part of the adsorption member (43) is located in the first through hole.

4. A controller assembly device according to claim 3, characterized in that: The coating partition (5) comprises a partition frame (51) and a detachable partition (52), and the through hole is arranged on the detachable partition (52); the controller assembly device also comprises a base (1), the partition frame (51) is connected to the base (1), and the partition frame (51) is connected to the detachable partition (52).

5. A controller assembly device according to claim 1, characterized in that: The coating partition (5) is further provided with a mesh area (521), and the mesh area (521) is provided with a plurality of through holes; the depth d of the through holes satisfies 1 mm ≤ d ≤ 1.8 mm.

6. A controller assembly device according to claim 4, characterized in that: It also includes a support member (6); the positioning tool (2) and the base (1) are connected at least through the support member.

7. A controller assembly device according to claim 1, characterized in that: The positioning tool (2) is provided with a second positioning portion (22) and a third positioning portion (23), and the second positioning portion (22) is arranged on the top wall of the positioning tool (2); and when the controller assembly device is in the first state, the second positioning portion (22) is located in the area of ​​the top wall that is not covered by the coating partition (5), and the inclined side wall of the second positioning portion (22) is inclined in a direction away from the side wall of the positioning tool (2); the positioning pin hole (23) is opened on the top wall of the positioning tool (2).

8. A controller assembly device according to claim 3, characterized in that: The lifting platform (42) comprises an upper lifting plate (422), a lower lifting plate (421) and a sandwich column (423); the upper lifting plate (422) is connected to the lower lifting plate (421) at least through the sandwich column (423); the lower lifting plate (421) is connected to the lifting cylinder (41), and the upper lifting plate (422) is connected to the adsorption member (43).

9. A method for using a controller assembly device, characterized in that: The following steps are involved: Placing a heat conducting sheet (7) on a first positioning portion (21) of the controller assembly device; The coating partition (5) of the controller assembly device is covered on the positioning fixture (2) of the control assembly device, so that the projection of the through hole (521) of the coating partition (5) on the upper surface of the positioning fixture (2) is located within the projection of the first positioning portion (21) on the upper surface of the positioning fixture (2); The heat-conducting compress is scraped and applied to the coating partition (5).

10. The method for using the controller assembly device according to claim 9, characterized in that: The following steps are also included: Separating the coating partition plate (5) from the positioning tool (2); Placing the injection molded part (8) on the top wall of the positioning tool (2); The lifting platform (42) of the controller assembly device is controlled to approach the positioning tool (2) at least through the lifting control component (41) of the controller assembly device, so that the heat conducting sheet (7) is closely attached to the bottom surface of the injection molded part (8) at least through the adsorption component (43) arranged on the lifting platform; After maintaining for a period of time, the lifting platform (42) is controlled to move away from the positioning tool at least by the lifting control component (41); Assembling a printed circuit board on the injection molded part (8), and making the heating element of the printed circuit board contact with at least a portion of the heat-conducting dressing applied to the heat-conducting sheet (7); The printed circuit board, the injection molded part (8) and the heat conducting sheet (7) adhered to the bottom surface of the injection molded part (8) are removed from the positioning tool (2).

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