Automatic glue filling equipment for column type conductive slip ring in thermal vacuum environment

Abstract

The invention provides automatic glue filling equipment for a column type conductive slip ring in a thermal vacuum environment. The automatic glue filling equipment comprises a thermal vacuum chamber, a glue filling tool, a vacuum pump and a heating plate, the glue filling tool comprises a valve push rod, a glue storage tank, a glue storage disc, a motor and a glue pipe. The vacuum pump can effectively discharge gas in the thermal vacuum chamber, the glue solution and the glue filling loop; the heating plate can heat the glue solution, the pouring tool and the conductive slip ring product to be poured, and the fluidity of the glue solution in the pouring process is improved. The glue filling tool is connected with the threaded holes in the heating plate through screws. In the glue filling process, the motor drives the push rod to move upwards, the valve at the bottom of the glue storage tank is opened, and glue flows into the glue storage disc from the through hole in the bottom of the glue storage tank; the glue liquid in the glue storage disc is injected into the conductive slip ring body assembly through the glue pipe under the action of gravity. After glue filling is completed, the motor drives the push rod to move downwards, and the valve at the bottom of the glue storage tank is closed.

Description

Technical Field

[0001] The invention relates to a conductive slip ring glue pouring device, in particular to a column type conductive slip ring automatic glue pouring device under a thermal vacuum environment. Background Art

[0002] During the molding process of the conductive slip ring body assembly, it is necessary to inject glue made of organic chemical materials such as synthetic resin. The cured glue plays the role of insulating and fixing the metal ring piece. Therefore, the quality of the glue injection will greatly affect the insulation performance and electrical strength of the conductive slip ring.

[0003] The glue filling process can usually be divided into three steps: glue mixing, glue injection and curing. At present, there are two main forms of glue filling for conductive slip ring ring components: one is to fill glue by pressurized filling under vacuum; the other is to fill glue by injecting a syringe under atmospheric environment. The glue filling equipment for pressurized filling has the function of applying a certain pressure to the glue and quickly filling the space. The glue flows faster and has a greater impact, which can easily damage the welding points of the slip ring segments. In addition, too much impact filling speed is prone to glue turbulence, destroying the positioning between the slip ring segments. At the same time, too short exhaust time is also prone to cause adverse consequences such as increased soft spots, uneven hardness, and decreased bonding ability after the glue is cured. For the glue filling method of syringe injection, it is difficult to control the filling speed, and it is easy to produce bubbles and local gel, blocking the flow channel, causing defects such as "lack of meat" or "holes" in the ring body component after curing. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide an automatic glue pouring device for column-type conductive slip rings in a thermal vacuum environment in view of the defects involved in the background technology.

[0005] The present invention adopts the following technical solutions to solve the above technical problems:

[0006] A column-type conductive slip ring automatic glue pouring equipment under a thermal vacuum environment comprises a thermal vacuum chamber, a glue pouring tool, a vacuum pump, a heating plate, and a workbench; the workbench is externally connected to the thermal vacuum chamber, and the vacuum pump is connected to the thermal vacuum chamber through a bellows to maintain the vacuum degree in the thermal vacuum chamber; a heating plate is arranged under the table top of the workbench to control the ambient temperature of the thermal vacuum chamber, and the glue pouring tool is connected to the heating plate.

[0007] Furthermore, the workbench is provided with an exhaust hole on its surface; the vacuum pump is connected to the exhaust hole via a bellows; the heating plate is provided with threaded holes of different specifications, and the glue filling tool is connected to the threaded holes of the heating plate via screws.

[0008] Furthermore, the glue pouring tooling includes a valve push rod, a valve, a glue storage tank, a glue storage tray, a motor, and a hose; one end of the valve push rod is connected to the motor, and the other end is connected in series with a valve; a through hole is provided at the bottom of the glue storage tank, and the valve can move up and down in the through hole; a through hole is provided at the bottom of the glue storage tray, one end of the hose is connected to the through hole at the bottom of the glue storage tray, and the other end is connected to the pouring port of the conductive slip ring product to be poured.

[0009] The valve push rod is connected to the motor at one end and reciprocates up and down under the traction of the motor, thereby driving the movement of the valve connected to the other end of the push rod; when the valve push rod moves upward, the valve moves upward and the valve opens; when the valve push rod moves downward, the valve moves downward and the valve closes.

[0010] Furthermore, a through hole is provided at the bottom of the glue storage tank, and when the valve is open, the glue can flow along the through hole to the glue storage tray below. A rubber hose is connected below the through hole at the bottom of the glue storage tray, and the glue in the glue storage tray flows along the through hole to the rubber hose, and then the glue flows from the rubber hose into the conductive slip ring product to be cast.

[0011] In view of this, this paper proposes a device for automatic glue pouring of columnar conductive slip rings in a thermal vacuum environment. The device can be used to automatically pour glue on the conductive slip ring body assembly in a thermal vacuum environment. The device can heat and insulate the glue to maintain a good flow rate during the glue pouring process; at the same time, it can evacuate the glue, and during the pouring process, the glue surface area is expanded and the glue liquid collides with the glue liquid when it drips during the pouring process, ensuring that the glue and the gas in the glue pouring circuit are effectively discharged. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The present invention will be further described below in conjunction with the accompanying drawings.

[0013] Figure 1 The present invention is a cross-sectional view of the structure of a column-type conductive slip ring automatic glue pouring device under a thermal vacuum environment.

[0014] Figure 2 It is a schematic diagram of the glue filling tooling structure in an embodiment of the present invention.

[0015] Figure 3 It is a cross-sectional view of the glue potting tooling structure in an embodiment of the present invention. DETAILED DESCRIPTION

[0016] The technical solution of the present invention is further described in detail below in conjunction with the accompanying drawings:

[0017] The present invention can be implemented in many different forms and should not be considered limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0018] An automatic glue filling device for column-type conductive slip rings in a thermal vacuum environment according to an embodiment of the present invention is as follows Figure 1 As shown, the workbench 5 is externally connected to a thermal vacuum chamber 1, and a vacuum hole is provided on the table top, and a vacuum pump 4 is connected to the vacuum hole through a bellows. A heating plate 3 is arranged on the table top of the workbench 5, and the heating plate 3 is provided with threaded holes of different specifications. The glue filling tool 2 is connected to the threaded holes of the heating plate 3 through screws.

[0019] like Figure 2 , 3 As shown, the glue filling tooling includes a valve push rod, a valve, a glue storage tank, a glue storage tray, a motor, and a rubber hose;

[0020] One end of the valve push rod 2-1 is connected to the motor 2-6, and the other end is connected in series with the valve 2-3;

[0021] The bottom of the glue storage tank 2-2 is provided with a through hole, and the valve 2-3 can move up and down in the through hole;

[0022] A through hole is provided at the bottom of the glue storage tray 2-4, one end of the rubber hose 2-5 is connected to the through hole at the bottom of the glue storage tray 2-4, and the other end is connected to the pouring port of the conductive slip ring product 2-7 to be poured.

[0023] To summarize, the working principle of the present invention is: when in use, place the conductive slip ring assembly to be filled with glue under the glue storage tray and connect it to the pouring port of the glue storage tray through a hose. Put the stirred glue into the glue storage tank, turn on the vacuum pump and the heating plate, and evacuate and heat the thermal vacuum chamber; after the vacuum degree and temperature of the thermal vacuum chamber reach the set value, the motor drives the push rod to move upward, opens the valve at the bottom of the glue storage tank, and the glue flows from the glue storage tank into the glue storage tray; due to gravity, the glue in the glue storage tray drips into the conductive slip ring assembly through the hose. After the glue filling is completed, the motor drives the push rod to move downward to close the valve at the bottom of the glue storage tank.

Claims

1. An automatic glue filling device for column-type conductive slip rings under thermal vacuum environment, characterized in that: Includes thermal vacuum chamber, glue filling tooling, vacuum pump, heating plate, and workbench; The workbench is externally connected to a thermal vacuum chamber, and a vacuum pump is connected to the thermal vacuum chamber through a bellows to maintain the vacuum degree in the thermal vacuum chamber; a heating plate is arranged under the workbench to control the ambient temperature of the thermal vacuum chamber, and a glue pouring tool is connected to the heating plate.

2. According to the automatic glue pouring equipment for column-type conductive slip rings in a thermal vacuum environment in claim 1, it is characterized in that: The table top of the workbench is provided with an air extraction hole.

3. According to claim 2, the automatic glue filling equipment for column-type conductive slip rings in a thermal vacuum environment is characterized in that: The vacuum pump is connected to the air extraction hole through a bellows.

4. According to claim 3, the automatic glue pouring equipment for column-type conductive slip rings in a thermal vacuum environment is characterized in that: The heating plate is provided with threaded holes of different specifications.

5. According to the automatic glue pouring equipment for column-type conductive slip rings in a thermal vacuum environment in claim 1, it is characterized in that: The glue pouring tool is connected to the threaded hole of the heating plate through screws.

6. The automatic glue pouring equipment for column-type conductive slip rings in a thermal vacuum environment according to claim 5, characterized in that: The glue filling tooling includes a valve push rod, a valve, a glue storage tank, a glue storage tray, a motor, and a rubber hose; One end of the valve push rod is connected to the motor, and the other end is connected in series with the valve; A through hole is provided at the bottom of the glue storage tank, and the valve can move up and down in the through hole; A through hole is provided at the bottom of the glue storage tray, one end of the rubber hose is connected to the through hole at the bottom of the glue storage tray, and the other end is connected to the pouring port of the conductive slip ring product to be poured.

7. The automatic glue pouring equipment for column-type conductive slip rings in a thermal vacuum environment according to claim 6, characterized in that: The valve push rod is connected to the motor at one end and reciprocates up and down under the traction of the motor, thereby driving the movement of the valve connected to the other end of the push rod; when the valve push rod moves upward, the valve moves upward and the valve opens; when the valve push rod moves downward, the valve moves downward and the valve closes.

8. The automatic glue pouring equipment for column-type conductive slip rings in a thermal vacuum environment according to claim 7, characterized in that: A through hole is provided at the bottom of the glue storage tank, and when the valve is opened, the glue liquid can flow along the through hole to the glue storage tray below.

9. The automatic glue pouring equipment for column-type conductive slip rings in a thermal vacuum environment according to claim 8, characterized in that: A rubber hose is connected below the through hole at the bottom of the rubber storage tray, and the glue in the rubber storage tray flows along the through hole into the rubber hose, and then the glue flows from the rubber hose into the conductive slip ring product to be cast.

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