Electroplating carrier, equipment and method

Abstract

The invention discloses an electroplating carrier, equipment and a method. The electroplating carrier at least comprises a bearing seat and baffles, the bearing seat is provided with a bearing channel, and the bearing channel is used for placing a part to be electroplated and at least one baffle; wherein the baffle comprises a cover plate and a flow equalizing plate, a plurality of flow guide holes are formed in the flow equalizing plate, and when the to-be-electroplated part and the baffle are both placed in the bearing channel, the cover plate covers the edge part of the corresponding surface of the to-be-electroplated part, and the flow equalizing plate covers the other part of the corresponding surface of the to-be-electroplated part, so that the covered surface of the to-be-electroplated part is communicated with the outside through the flow guide holes. According to the electroplating carrier, the edge part of the to-be-electroplated part can be covered through the baffle of the electroplating carrier, so that power lines of the to-be-electroplated part are uniformly distributed, and the uniformity of the thickness of a plating layer is improved.

Description

Technical Field

[0001] The present application relates to the technical field of electroplating equipment, and in particular to an electroplating carrier, equipment and method. Background Art

[0002] Horizontal electroplating technology is a continuation of the development of vertical electroplating technology, with the same methods and principles. Horizontal electroplating equipment usually uses a pair of rollers to transport the parts to be plated, and in the process of transporting the parts to be plated, a spray mechanism is used to directly spray the plating liquid onto the surface of the parts to be plated for electroplating.

[0003] Since the workpiece to be electroplated has edge effects (i.e., during electroplating, electric lines tend to concentrate on the sharp corners and edges of the workpiece to be electroplated, so that the current density on the sharp corners and edges of the workpiece to be electroplated is relatively large, resulting in the coating thickness at the sharp corners and edges being greater than the average thickness), this transmission method is likely to cause uneven coating thickness on the workpiece to be electroplated in actual use.

[0004] Therefore, it is urgent to design an electroplating carrier, equipment and method to solve the above technical problems. Summary of the invention

[0005] The purpose of the present application is to provide an electroplating carrier, equipment and method, which covers the edge portion of the workpiece to be electroplated through the baffle of the electroplating carrier so that the electric lines of the workpiece to be electroplated are evenly distributed, thereby improving the uniformity of the coating thickness.

[0006] To achieve the above-mentioned purpose, the present application provides an electroplating carrier, which at least includes a supporting seat and a baffle, wherein the supporting seat has a supporting channel, and the supporting channel is used to place the workpiece to be electroplated and at least one of the baffles; wherein the baffle includes a cover plate and a flow equalizing plate, and a plurality of guide holes are provided on the flow equalizing plate. When the workpiece to be electroplated and the baffle are both placed in the supporting channel, the cover plate covers the edge portion of the corresponding surface of the workpiece to be electroplated, and the flow equalizing plate covers the remaining portion of the corresponding surface of the workpiece to be electroplated, so that the covered surface of the workpiece to be electroplated is connected to the outside through the flow guide holes.

[0007] As a further improvement of the above technical solution: a first trough body and a second trough body are provided in the carrying channel, and the orthographic projection area of ​​the first trough body is larger than the orthographic projection area of ​​the second trough body, so that the interior of the carrying channel is stepped; when the baffle and the workpiece to be electroplated are respectively placed in the first trough body and the second trough body, the baffle covers the corresponding surface of the workpiece to be electroplated.

[0008] As a further improvement of the above technical solution: a plurality of support blocks are arranged in the second trough body, and the plurality of support blocks together constitute a accommodating area for placing the workpiece to be electroplated; when the baffles are placed in both the first trough body and the second trough body, and the workpiece to be electroplated is placed in the accommodating area, the two baffles respectively cover the upper and lower surfaces of the workpiece to be electroplated.

[0009] As a further improvement of the above technical solution: an avoidance groove for the support block to pass through is opened on the edge of the baffle placed in the second slot body, and the number and size of the avoidance grooves match those of the support blocks.

[0010] As a further improvement of the above technical solution: there is a preset distance between the accommodating area and the bottom of the first trough body and the second trough body to allow the electroplating solution to flow.

[0011] As a further improvement of the above technical solution: a wiring groove is provided on the bearing seat, and the wiring groove is connected to the second groove body so as to allow the conductive wire connected to the part to be electroplated to pass through.

[0012] As a further improvement of the above technical solution: a water filter hole is provided on the wiring groove.

[0013] To achieve the above-mentioned purpose, the present application further provides an electroplating device on the other hand, using the electroplating carrier as described above, and at least comprising: a plating tank filled with a plating liquid; a transmission mechanism, arranged in the plating tank, configured to drive the electroplating carrier to move; a spray mechanism, arranged in the plating tank, configured to spray the plating liquid onto the plating carrier; a conductive mechanism, movably arranged on the plating tank, electrically connected to the plating carrier, and moving with the plating carrier; a liquid circulation mechanism, connected to the plating tank, configured to drive the plating liquid to circulate and form a liquid loop; wherein the liquid circulation mechanism is connected to the spray mechanism, and the cation concentration of the plating liquid increases after circulation, so that the plating liquid sprayed onto the workpiece to be electroplated has a high concentration of cations, and the plating liquid flows to the workpiece to be electroplated through the plating carrier.

[0014] As a further improvement of the above technical solution: it also includes a power supply, which is used to provide an energy source for the electroplating equipment, and the spray mechanism and the conductive mechanism are electrically connected to the positive and negative electrodes of the power supply respectively.

[0015] As a further improvement of the above technical solution: the spray mechanism at least includes a liquid supply pipeline and a plurality of anode units; wherein the anode unit has a liquid outlet channel, one end of the liquid outlet channel is connected to the liquid supply pipeline, and the other end is arranged toward the transmission mechanism.

[0016] As a further improvement of the above technical solution: the liquid circulation mechanism includes at least a liquid storage tank, a circulation pump and a circulation pipeline, and the electroplating tank, the liquid storage tank and the circulation pump are connected in sequence through multiple circulation pipelines to form a circulating liquid loop.

[0017] As a further improvement of the above technical solution: the transmission mechanism comprises at least a plurality of guide rollers arranged at intervals, the plurality of anode units are arranged along the transmission direction of the transmission mechanism, and the anode unit is located in the interval between two of the guide rollers.

[0018] As a further improvement of the above technical solution: the transmission mechanism also includes a guide roller, and the guide roller is arranged on a guide roller. When the transmission mechanism is in a working state, the electroplating carrier is placed on the guide roller.

[0019] As a further improvement of the above technical solution: the conductive mechanism at least includes a conductive track, a conductive clamp, a conductor and a conductive block; the conductive clamp is used to clamp the conductive wire, and the conductive track is slidably connected to the conductive clamp; the conductor is arranged in the conductive track, and the cathode of the power supply is electrically connected to the conductor; the conductive block is arranged on the conductive clamp and contacts the conductor; when the electroplating carrier drives the conductive clamp to move along the conductive track, the conductive block transmits the electrical energy obtained by contacting the conductor to the workpiece to be electroplated.

[0020] To achieve the above-mentioned purpose, the present application also provides an electroplating method on the other hand, using the electroplating equipment as described above, including: placing the workpiece to be electroplated and the baffle in the carrying channel; placing the electroplating carrier on the transmission mechanism; turning on the electroplating equipment, the electroplating carrier moves along the transmission direction of the transmission mechanism, the spray mechanism obtains the electroplating liquid from the liquid circulation mechanism, and sprays the electroplating liquid onto the electroplating carrier; the electroplating liquid flows to the workpiece to be electroplated through the guide hole of the baffle to complete the electroplating of the workpiece to be electroplated.

[0021] It can be seen that the electroplating carrier provided by the present application, by covering the edge area of ​​the workpiece to be electroplated with the baffle of the electroplating carrier, the electroplating liquid must first flow to the central part of the surface to be electroplated through the guide holes of the flow equalizing plate, and then diffuse to the edge part through the central part, so that the distance that the electric line moves to the edge position of the workpiece to be electroplated is greater than the distance that the electric line moves to the center position of the workpiece to be electroplated. In this way, the distribution of the electric line on the surface to be electroplated can be uniform, thereby reducing the influence of uneven plating caused by the edge effect of the workpiece to be electroplated;

[0022] The present application also provides an electroplating device using an electroplating carrier, which uses the electroplating carrier to avoid direct contact between the workpiece to be electroplated and the transmission mechanism to reduce the possibility of the workpiece to be electroplated being broken, and also adds a partition in the spraying mechanism to further improve the uniformity of the coating thickness. In addition, the electroplating device has a liquid circulation mechanism, which can make the cation content in the electroplating solution sprayed onto the workpiece to be electroplated higher than the cation content in the electroplating solution in the electroplating tank;

[0023] The present application also provides an electroplating method using the electroplating device;

[0024] The electroplating equipment and the electroplating method include all technical solutions of the electroplating carrier, and therefore also have all technical advantages of the electroplating carrier. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 It is a structural schematic diagram of an electroplating carrier in one embodiment provided in the present application;

[0027] Figure 2 yes Figure 1 Cross-sectional view in the middle DD direction;

[0028] Figure 3 yes Figure 2 A partial enlarged view of part A;

[0029] Figure 4 It is a structural schematic diagram of an electroplating carrier in one embodiment provided in the present application;

[0030] Figure 5 is a cross-sectional view of an electroplating carrier in another embodiment provided by the present application;

[0031] Figure 6 yes Figure 6 A partial enlarged view of part B;

[0032] Figure 7 is a cross-sectional view of an electroplating carrier in an embodiment provided by the present application when no part to be electroplated is placed thereon;

[0033] Figure 8 yes Figure 8 A partial enlarged view of part C in the middle;

[0034] Fig. 9 is a cross-sectional view of an electroplating carrier in another embodiment provided by the present application;

[0035] Fig.10 yes Fig.10 A partial enlarged view of part D in the middle;

[0036] Fig.11 It is a structural schematic diagram of a transmission electroplating carrier of an electroplating equipment in the prior art;

[0037] Fig.12 It is a structural schematic diagram of another electroplating equipment transmission electroplating carrier in the prior art;

[0038] Fig.13 It is a structural schematic diagram of a ring block used in an embodiment provided by the present application;

[0039] Fig.14 is a structural schematic diagram of a blocking block used in an embodiment provided by the present application;

[0040] Fig.15 is a schematic structural diagram of an electroplating device in one embodiment provided in the present application;

[0041] Fig.16 is a schematic structural diagram of an electroplating device in one embodiment provided in the present application;

[0042] Fig.17 This is a schematic diagram of the structure of a spray mechanism in one embodiment provided in the present application;

[0043] Fig.18 It is a control logic diagram of an electroplating device in one embodiment provided by the present application;

[0044] Fig.19 It is a structural schematic diagram of a transmission mechanism in an embodiment provided by the present application;

[0045] Fig. 20 It is a structural schematic diagram of a transmission mechanism in another embodiment provided by the present application;

[0046] Fig.21 It is a structural schematic diagram of a transmission mechanism in another embodiment provided by the present application;

[0047] Fig. 22 is a structural schematic diagram of a conductive mechanism in an embodiment provided in the present application;

[0048] Fig.23 It is a flow chart of an electroplating method in one embodiment provided in the present application.

[0049] Reference numerals:

[0050] 10- electroplating carrier; 101- bearing seat; 1011- bearing channel; 10111- first tank body; 10112- second tank body; 10113- third tank body; 102- baffle; 1021- cover plate; 1022- flow equalizing plate; 10221- flow guide hole; 103- baffle A; 104- baffle B; 1041- avoidance groove; 105- support block; 106- support groove; 107- plug-in structure; 108- bearing slideway; 109- annular block; 110- blocking block; 111- wiring groove; 112- water filter hole;

[0051] 20-parts to be plated; 201-conductive wire;

[0052] 30- electroplating tank;

[0053] 40-transmission mechanism; 401-guide roller; 4011-anti-slip sleeve; 402-guide roller; 403-guide plate;

[0054] 50-spraying mechanism; 501-liquid supply pipeline; 5011-main pipeline; 5012-branch pipeline; 502-anode unit; 5021-liquid outlet channel; 5022-anode piece; 50221-anode hole; 5023-anode mounting seat; 5024-partition plate; 50241-hole position;

[0055] 60-conductive mechanism; 601-conductive track; 602-conductive clamp; 603-conductive body; 604-conductive block;

[0056] 70-liquid circulation mechanism; 701-liquid storage tank; 702-circulation pump; 703-circulation pipeline;

[0057] 80-power supply;

[0058] 90-controller; 901-liquid level sensor; 902-flow sensor; 903-solenoid valve; 904-temperature sensor. DETAILED DESCRIPTION

[0059] To make the purpose, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below in conjunction with the accompanying drawings. Terms such as "upper", "above", "lower", "below", "first end", "second end", "one end", "the other end" used in the present application to represent spatial relative positions are used to describe the relationship between a unit or feature as shown in the accompanying drawings relative to another unit or feature for the purpose of convenience of explanation. Terms of spatial relative position may be intended to include different orientations of the device in use or work other than the orientation shown in the figure. For example, if the device in the figure is turned over, the unit described as being "below" or "below" other units or features will be located "above" other units or features. Therefore, the exemplary term "below" can encompass both the above and below orientations. The device can be oriented in other ways (rotated 90 degrees or other orientations), and the spatially related descriptors used herein are interpreted accordingly.

[0060] In addition, the terms "installed", "set", "provided with", "connected", "slidingly connected", "fixed", and "sleeved" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0061] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the embodiments described in this application are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0062] The present application provides an electroplating carrier 10, which is used to carry a target substrate to be electroplated, and can partially cover the substrate using the structure of the electroplating carrier 10 itself, so that its electric lines are evenly distributed, and the purpose of uniform coating thickness is achieved. Among them, the target substrate can be a product that needs to be given some special physical properties or decorative effects, such as PCB boards, solar cells, silicon wafers and chips, etc., and for example, metal grid lines are electroplated on silicon wafers.

[0063] Please refer to Figure 1-Figure 4The electroplating carrier 10 at least includes a bearing seat 101 and a baffle 102. The bearing seat 101 has a bearing channel 1011. The bearing channel 1011 is used to place the workpiece 20 to be electroplated and at least one baffle 102. The baffle 102 includes a cover plate 1021 and a current equalizing plate 1022. The current equalizing plate 1022 is provided with a plurality of guide holes 10221. When the workpiece 20 to be electroplated and the baffle 102 are both placed in the bearing channel 1011, the cover plate 1021 covers the edge portion of the corresponding surface of the workpiece 20 to be electroplated, and the current equalizing plate 1022 covers the rest of the corresponding surface of the workpiece 20 to be electroplated, so that the covered surface of the workpiece 20 to be electroplated is connected to the outside through the guide holes 10221. Specifically, the cover plate 1021 is the edge portion around the baffle 102, and the current equalizing plate 1022 is the remaining portion of the baffle 10. When only one side of the workpiece 20 to be plated needs to be plated, only one baffle 102 can be provided, and it is placed at the corresponding position of the surface to be plated of the workpiece 20 to be plated, so that the plating liquid flows to the surface to be plated through the guide hole 10221. When both sides of the workpiece 20 to be plated need to be plated at the same time, the workpiece 20 to be plated is placed between two baffles 102, so that the two baffles 102 can respectively cover the corresponding two surfaces to be plated of the workpiece 20 to be plated. Alternatively, when only one side of the workpiece 20 to be plated needs to be plated, two baffles 102 can be provided, and the workpiece 20 to be plated is placed between the two baffles 102 regardless of the positive and negative directions, and then the surface of the workpiece 20 to be plated is selected for electroplating. Since the edge of the workpiece 20 to be plated is covered by the cover plate 1021, the plating solution must first flow through the guide holes 10221 to the center of the surface to be plated, and then diffuse from the center to the edge, so that the distance that the electric line moves to the edge of the workpiece 20 to be plated is greater than the distance that the electric line moves to the center of the workpiece 20 to be plated. In this way, the electric line can be evenly distributed on the surface to be plated, thereby reducing the influence of uneven plating caused by the edge effect of the workpiece 20 to be plated.

[0064] In order to allow both the workpiece 20 to be plated and the baffle 102 to be placed in the carrying channel 1011, in this embodiment, a first slot 10111 and a second slot 10112 are provided in the carrying channel 1011. The orthographic projection area of ​​the first slot 10111 is larger than the orthographic projection area of ​​the second slot 10112, so that the interior of the carrying channel 1011 is stepped. When the baffle 102 and the workpiece 20 to be plated are placed in the first slot 10111 and the second slot 10112, respectively, the baffle 102 covers the corresponding surface of the workpiece 20 to be plated. Specifically, if only one side of the workpiece 20 to be plated is to be plated, the workpiece 20 to be plated is first placed in the second slot 10112, with the surface to be plated of the workpiece 20 facing the first slot 10111, and then the baffle 102 is placed in the first slot 10111. When the first trough body 10111 is located above the second trough body 10112, the baffle 102 can cover the upper surface of the part to be electroplated 20; when the second trough body 10112 is located above the first trough body 10111, the baffle 102 can cover the lower surface of the part to be electroplated 20. At this time, the baffle 102 needs to be placed into the first trough body 10111 from the bottom of the supporting seat 101. In order to prevent the baffle 102 from falling, a movable blocking member can be further provided on the supporting seat 101. By adjusting the position of the movable blocking member so that it is located below the supporting seat 101 or the supporting channel 1011, when the movable blocking member is located below the supporting channel 1011, it can be tightly attached to the bottom of the baffle 102 to prevent it from falling.

[0065] It should be noted that the orthographic projection area of ​​the baffle 102 needs to be larger than the orthographic projection area of ​​the second trough 10112. If the orthographic projection area of ​​the baffle 102 is smaller than the orthographic projection area of ​​the second trough 10112, the baffle 102 will fall into the second trough 10112, and there is a possibility that the surface to be plated of the workpiece 20 to be plated cannot be covered; if the orthographic projection area of ​​the baffle 102 is equal to the orthographic projection area of ​​the second trough 10112, then the baffle 102 will fall into the second trough 10112, and there is a possibility that the surface to be plated of the workpiece 20 to be plated cannot be covered; During the transmission process, the baffle 102 may fall from the first tank body 10111 into the second tank body 10112 due to shaking, and the baffle 102 is not easy to be taken out from the second tank body 10112 because the distance between the side wall of the baffle 102 and the inner wall of the second tank body 10112 is too small; at the same time, the orthographic projection area of ​​the baffle 102 needs to be smaller than the orthographic projection area of ​​the first tank body 10111, so that the baffle 102 can be placed in the first tank body 10111. Accordingly, the orthographic projection area of ​​the workpiece 20 to be electroplated needs to be smaller than the orthographic projection area of ​​the second tank body 10112. If the orthographic projection area of ​​the workpiece 20 to be electroplated is equal to the orthographic projection area of ​​the second tank body 10112, the workpiece 20 to be electroplated will be difficult to take out and put because the distance between its side wall and the inner wall of the second tank body 10112 is too small.

[0066] In this structure, if both sides of the workpiece 20 to be plated are plated at the same time, the orthographic projection area of ​​any baffle 102 must be larger than the orthographic projection area of ​​the second tank body 10112 and smaller than the orthographic projection area of ​​the first tank body 10111, and the baffle 102 must be placed in the first tank body 10111, and the orthographic projection area of ​​the other baffle 102 must be smaller than the orthographic projection area of ​​the second tank body 10112 and larger than the orthographic projection area of ​​the workpiece 20 to be plated, and the baffle 102 must be placed in the second tank body 10112. For ease of description, the baffles 102 placed in the first tank body 10111 are collectively referred to as baffles A103 below, and the baffles 102 placed in the second tank body 10112 are collectively referred to as baffles B104 below. In this way, it can be ensured that the orthographic projection areas of the two baffles 102 are both larger than the orthographic projection area of ​​the workpiece 20 to be plated. Specifically, the baffle B104 and the workpiece 20 to be plated are placed in close contact, that is, the upper surface of the baffle B104 is in direct contact with the lower surface of the workpiece 20 to be plated. At this time, the plating liquid cannot flow in large quantities between the workpiece 20 to be plated and the baffle B104, which may easily lead to a deterioration in the plating effect of the workpiece 20 to be plated.

[0067] In order to solve the problem of poor electroplating effect on the lower surface of the workpiece 20 to be electroplated caused by the above structure during double-sided electroplating, in an achievable embodiment, a plurality of support blocks 105 are arranged in the second tank body 10112, and the plurality of support blocks 105 together form a receiving area for placing the workpiece 20 to be electroplated, and when baffles 102 are placed in both the first tank body 10111 and the second tank body 10112, and the workpiece 20 to be electroplated is placed in the receiving area, the two baffles 102 respectively cover the upper and lower surfaces of the workpiece 20 to be electroplated. It should be noted that the receiving area does not refer to the area enclosed by the opposite ends of the plurality of support blocks 105, but refers to the horizontal plane formed by the upper surfaces of the plurality of support blocks 105.

[0068] Further, in one example, referring to Figure 5-6 , Figure 9-10, a support groove 106 can be provided on each support block 105, and multiple support grooves 106 are provided with openings at the central axis position facing the second tank body 10112. In this case, the accommodating area refers to the range formed by the edge connection lines of multiple support grooves 106. Since there is a certain distance between the inner wall of the support groove 106 and the inner wall of the second tank body 10112, the orthographic projection area of ​​the accommodating area must be smaller than the orthographic projection area of ​​the second tank body 10112, so that the baffle 102 is likely to cover the workpiece 20 to be electroplated. Specifically, the orthographic projection area of ​​the accommodating area is positively correlated with the orthographic projection area of ​​the workpiece 20 to be electroplated that can be placed, that is, the larger the orthographic projection area of ​​the accommodating area, the larger the orthographic projection area of ​​the workpiece 20 to be electroplated that can be placed. The central axis lines of the plurality of support grooves 106 will together form the minimum accommodation area. If the orthographic projection area of ​​the workpiece 20 to be plated is smaller than the orthographic projection area of ​​the minimum accommodation area, the workpiece 20 to be plated may be unstable. If the orthographic projection area of ​​the workpiece 20 to be plated is less than or equal to the orthographic projection area of ​​the area enclosed by the opposite ends of the plurality of support blocks 105, the workpiece 20 to be plated may fall into the second trough 10112. Furthermore, the cover plate 1021 of the baffle B104 is provided with avoidance grooves 1041 for the support blocks 105 to pass through, and the number and size of the avoidance grooves 1041 match those of the support blocks 105. Specifically, when the baffle B104 is placed in the second tank body 10112, the inner wall of the avoidance groove 1041 fits with the outer wall of the support block 105, which can guide the movement of the baffle B104. When the baffle B104 is completely placed at the bottom of the second tank body 10112, the workpiece 20 to be electroplated is placed in the accommodating area. At this time, the cover plate 1021 of the baffle B104 and the support groove 106 jointly cover the edge of the workpiece 20 to be electroplated. In order to be placed in the second tank body 10112, the baffle B104 without the avoidance groove 1041 can only choose to reduce its size. However, in this way, the baffle B104 cannot completely cover the edge of the workpiece 20 to be electroplated, that is, the area between the support blocks 105 cannot be covered.

[0069] In another example, each support block 105 is configured as a columnar structure with the same height. In this case, the accommodating area refers to a horizontal plane formed by connecting the upper surfaces of the plurality of columnar structures. The orthographic projection area of ​​the accommodating area may be less than or equal to the orthographic projection area of ​​the second tank body 10112, so that the baffle 102 can cover the workpiece 20 to be plated. However, it should be noted that the orthographic projection area of ​​the workpiece 20 to be plated cannot be less than the orthographic projection area of ​​the accommodating area, otherwise the workpiece 20 to be plated may fall into the second tank body 10112.

[0070] Furthermore, the cover plate 1021 of the baffle B104 is provided with avoidance holes for the support block 105 to pass through, and the number and size of the avoidance holes match those of the support block 105. Specifically, when the baffle B104 is placed in the second tank 10112, the inner wall of the avoidance holes fits the outer wall surface of the columnar structure, which can guide the movement of the baffle B104. When the baffle B104 is completely placed at the bottom of the second tank 10112, the workpiece 20 to be electroplated is placed in the accommodating area. At this time, the cover plate 1021 of the baffle B104 and the columnar structure jointly cover the edge of the workpiece 20 to be electroplated. In order to be placed in the second tank 10112, the baffle B104 without avoidance holes can only choose to reduce its size. However, in this way, the baffle B104 cannot completely cover the edge of the workpiece 20 to be electroplated, that is, the area between the columnar structures cannot be covered.

[0071] In the above embodiment, there is a preset spacing between the accommodating area and the bottom of the first tank body 10111 and the second tank body 10112 to allow the electroplating liquid to flow. Specifically, when only the workpiece 20 to be electroplated is placed in the second tank body 10112, and the baffle A103 is placed in the first tank body 10111, and only one surface of the workpiece 20 to be electroplated is electroplated, the preset spacing needs to be greater than the thickness of the workpiece 20 to be electroplated. It should be noted that, in the case where the electroplating liquid can flow in and flow within the preset spacing, the present application does not limit the specific value of the preset spacing. For example, the thickness of the workpiece 20 to be electroplated can be used as a reference, and the preset spacing can be set to an integer multiple of the thickness of the workpiece 20 to be electroplated. If the thickness of the workpiece 20 to be electroplated is 5 mm, the preset spacing can be set to 10 mm, 15 mm, 20 mm, etc. When the baffle B104 and the workpiece 20 to be plated are placed in the second tank 10112, and the baffle A103 is placed in the first tank 10111, the front and back sides of the workpiece 20 to be plated are plated, and the preset spacing needs to be greater than the total thickness of the baffle B104 and the workpiece 20 to be plated, and the height of the support block 105 is greater than the thickness of the baffle B104. Similar to the above principle, in the case where the electroplating solution can flow in and flow within the preset spacing, the present application does not limit the specific values ​​of the preset spacing and the support block 105 at this time.

[0072] Furthermore, a first electroplating area can be formed between the accommodating area and the bottom of the first tank body 10111, and a second electroplating area can be formed between the accommodating area and the bottom of the second tank body 10112. The side wall of the first electroplating area can adopt an inclined structure, that is, the first electroplating area is a cone section with a large top and a small bottom. In this way, the inclined side wall of the first electroplating area can guide the flow of the electroplating liquid so that the electroplating liquid can flow to the surface to be electroplated of the part 20 to be electroplated. Correspondingly, the side wall of the second electroplating area can also adopt an inclined structure, and the inclination direction is opposite to that of the first electroplating area, that is, the second electroplating area is a cone section with a small top and a large bottom. Specifically, the workpiece 20 to be plated is located below the first plating area, and the plating liquid enters from the top of the first plating area. Since the plating liquid needs to be drained onto the workpiece 20 to flow downward, the first plating area has a structure that is larger at the top and smaller at the bottom. However, the workpiece 20 to be plated is located above the second plating area, and the plating liquid will enter from the bottom of the second plating area. Therefore, in order to drain the plating liquid, the second plating area needs to be set as a conical section with a small top and a large bottom.

[0073] In one possible implementation, reference Figure 7-8 The bearing channel 1011 is also provided with a third slot 10113, and the third slot 10113 can be used to place the baffle 102. The third slot 10113 is located below the second slot 10112, and the third slot 10113 and the first slot 10111 are symmetrically arranged in the vertical direction with the second slot 10112 as the center. In this way, the two baffles 102 can be placed in the first slot 10111 and the third slot 10113, respectively, to cover the upper and lower surfaces of the electroplated part 20. For the convenience of description, the baffles 102 placed in the first slot 10111 are collectively referred to as baffles A103 below, and the baffles 102 placed in the third slot 10113 are collectively referred to as baffles B104 below.

[0074] In order to prevent the baffle B104 from falling under the action of gravity after being placed in the third slot 10113, in this embodiment, Figure 5-6A plug-in slot is also provided on the supporting seat 101, and the plug-in slot is located at the bottom of the second slot body 10112. A plug-in structure 107 matching the plug-in slot is provided on the baffle B104. When the baffle B104 is plugged into the plug-in slot using its plug-in structure 107, the baffle B104 is located below the workpiece 20 to be electroplated and covers the lower surface of the workpiece 20 to be electroplated. Since the part of the workpiece 20 to be electroplated placed on the second slot body 10112 has been covered by the second slot body 10112, the plug-in structure 107 provided on the cover plate 1021 of the baffle B104 does not affect the covering of the edge of the workpiece 20 to be electroplated. If the third trough body 10113 is selected to be smaller or larger than the size of the first trough body 10111, that is, the orthographic projection area of ​​the third trough body 10113 is smaller than or larger than the orthographic projection area of ​​the first trough body 10111, the orthographic projection area of ​​the cover plate 1021 in the baffle B104 can be adjusted according to the orthographic projection area of ​​the edge portion of the workpiece 20 to be electroplated. For example, the orthographic projection area of ​​the third trough body 10113 is smaller than the orthographic projection area of ​​the first trough body 10111, and the edge portion of the workpiece 20 to be electroplated can be covered by the second trough body 10112, then the orthographic projection area of ​​the cover plate 1021 in the baffle B104 needs to be reduced until the connection between the cover plate 1021 and the current equalizing plate 1022 coincides with the outer edge of the second trough body 10112, so that the rest of the workpiece 20 to be electroplated can be completely covered by the current equalizing plate 1022. Specifically, the seat body portion of the support seat 101 forming the second tank body 10112 has a certain thickness to allow the plug-in slot to be opened. When the workpiece 20 to be electroplated is placed in the second tank body 10112, the baffle B104 is located below the second tank body 10112, and the distance between the baffle B104 and the workpiece 20 to be electroplated is the thickness of the second tank body 10112, so that a sufficient amount of electroplating liquid can contact the lower surface of the workpiece 20 to be electroplated. Accordingly, in order to improve the stability of the placement of the baffle A103, the first tank body 10111 and the baffle A103 can also be provided with a matching plug-in structure 107.

[0075] Furthermore, while ensuring that the workpiece 20 to be electroplated can be stably placed in the second tank body 10112, the width of the second tank body 10112, that is, the distance between the outer wall of the second tank body 10112 and the inner wall of the bearing channel 1011, can be reduced. At the same time, the width of the second tank body 10112 needs to be less than or equal to the width of the cover plate 1021 in the baffle B104, so that during the electroplating process, the guide hole 10221 of the current equalizing plate 1022 will not be covered by the second tank body 10112. When the width of the second tank body 10112 is less than the width of the cover plate 1021 in the baffle B104, the plating liquid can flow through the guide hole 10221 to the part of the bottom surface of the workpiece 20 to be electroplated that is not in contact with the second tank body 10112. In other words, the smaller the width of the second tank body 10112, the smaller the processing impact on the edge of the workpiece 20 to be electroplated.

[0076] Furthermore, the plug-in structure 107 can be configured as a protrusion made of partially or entirely elastic material, and when the protrusion is placed in the plug-in slot, it can produce elastic deformation, thereby reducing the gap between it and the plug-in slot, and realizing a stable connection between the plug-in structure 107 and the plug-in slot. In order to facilitate the placement of the plug-in structure 107 in the plug-in slot, a plug-in slope can be set on the surface of the plug-in structure 107 that first contacts the plug-in slot, thereby reducing the plug-in resistance and realizing a quick plug-in between the plug-in structure 107 and the plug-in slot.

[0077] It should be noted that, in the case where the plug-in structure 107 and the plug-in slot can be plugged in, the present application does not limit the shape, size, and positional relationship of the plug-in slot and the plug-in structure 107. For example, the plug-in slot can be set on the baffle B104, and the plug-in structure 107 can be set at the bottom of the second slot body 10112.

[0078] In another practicable manner, referring to Figure 7-10A carrying slide 108 is provided in the third trough body 10113, wherein a preset distance is provided between the carrying slide 108 and the bottom of the second trough body 10112 for the baffle B104 to be placed. When the baffle B104 is placed in the carrying slide 108, the side wall of the baffle B104 contacts the sliding wheel in the carrying slide 108. The baffle B104 is located below the workpiece 20 to be electroplated and covers the lower surface of the workpiece 20 to be electroplated. In this manner, the orthographic projection area of ​​the third trough 10113 needs to be larger than the orthographic projection area of ​​the second trough 10112, so that the bearing slide 108 can be set. If the orthographic projection area of ​​the third trough 10113 is less than or equal to the orthographic projection area of ​​the second trough 10112, then the third trough 10113 will occupy part of the area after the bearing slide 108 is installed, and the orthographic projection area of ​​the baffle B104 that can be placed in the third trough 10113 cannot be larger than the orthographic projection area of ​​the accommodating area, which may cause the baffle B104 to be unable to cover the workpiece 20 to be electroplated. In addition, at least one side of the third trough 10113 is provided with an opening that is connected to the outside, so that the workpiece 20 to be electroplated can be placed in the third trough 10113 through the opening. Specifically, the bearing slide 108 includes two symmetrically arranged slides, and the size of the slide body matches the size of the baffle B104 to ensure that the baffle B104 can be placed in the slide. In order to facilitate the movement of the baffle B104 from the outside to the bearing tank body, the slide groove can also be set along the length of the third tank body 10113. If the third tank body 10113 has only one opening, when the baffle B104 needs to be placed, first place one end of the baffle B104 from the opening of the third tank body 10113 into the slide groove, and move along the slide groove until the end of the baffle B104 abuts against the third tank body 10113. At this time, the baffle B104 can completely cover the lower surface of the workpiece 20 to be electroplated. Since the baffle B104 needs to be placed in the slide groove with a part of its area, the positive projection area of ​​the cover plate 1021 can be appropriately increased so that the cover plate 1021 part of the baffle B104 can still cover the edge part of the workpiece 20 to be electroplated.

[0079] Furthermore, the supporting seat 101 can also provide a protective plate on the opening of the third trough body 10113. The protective plate can be rotatably set or removably set on the supporting seat 101. When the baffle B104 is not placed, the protective plate is rotated or removed so that the baffle B104 can be moved into the third trough body 10113 through the opening. After the baffle B104 is placed in the slide groove and moved into place, the protective plate is rotated or installed so that the opening of the third trough body 10113 can be covered to prevent the baffle B104 from falling due to the impact force of the plating liquid or the moving inertia during the transportation of the electroplating carrier 10.

[0080] Different from the above-mentioned method of plugging the baffle 102 with the bearing seat 101 or directly placing it in the bearing channel 1011, in an practicable method, the baffle 102 and the bearing seat 101 can also be connected by rotation. Specifically, the baffle A103 can be hinged with the first tank 10111. When the workpiece 20 to be plated is selected for single-sided electroplating, the baffle A103 is rotated 90°, or the baffle A103 is directly flipped 180° and placed on the bearing seat 101, which is convenient for the staff to operate with both hands or a robot. The flip angle range of the baffle A103 is 90° to 180°. After the carrying channel 1011 is connected to the outside, the workpiece 20 to be electroplated is placed in the second trough body 10112, and the baffle A103 is rotated again so that it covers the surface to be electroplated of the workpiece 20 to be electroplated; when the workpiece 20 to be electroplated is selected to be electroplated on both sides at the same time, after the carrying channel 1011 is connected to the outside, the baffle B104 is first placed in the second trough body 10112, and then the workpiece 20 to be electroplated is placed in the accommodating area, or only the workpiece 20 to be electroplated is placed in the second trough body 10112, the baffle B104 is inserted or placed in the third trough body 10113, and then the baffle A103 is rotated again to cover the surface to be electroplated of the workpiece 20 to be electroplated. It is also possible to choose a connection mode in which the baffle A103 is hinged to the first tank body 10111, and the baffle B104 is hinged to the third tank body 10113. Since when the baffle B104 is placed in the second tank body 10112, the workpiece 20 to be electroplated needs to be placed on the support block 105, and the support block 105 will occupy part of the space in the first electroplating area. The remaining space cannot allow the baffle B104 to complete the flip, so the baffle B104 cannot be hinged to the inside of the second tank body 10112. Under this structure, a movable connection structure needs to be set at the opposite end of the hinge of the baffle B104 to prevent one end of the baffle B104 from being in an open state under the action of gravity, so that during the movement of the electroplating carrier 10, the baffle B104 repeatedly opens and closes and hits the support seat 101, resulting in damage to the support seat 101 and the baffle B104. Specifically, the movable connection structure can adopt a magnetic structure, a plug-in structure 107, or other structures that can repeatedly connect the free end of the baffle B104 to the third tank body 10113. In addition, since the workpiece 20 to be plated is placed in the second tank body 10112, the rotation of the baffle B104 is not affected by the placement of the workpiece 20 to be plated. The baffle B104 is only needed when the baffle B104 and the third tank body 10113 need to be cleaned and maintained. The replacement and placement method of the workpiece 20 to be plated is the same as that when only the hinge structure of the baffle A103 is set as described above.

[0081] Of course, in other embodiments of the present application, the baffle 102 may also adopt a structure that is fixedly connected to the bearing seat 101. Specifically, both baffles 102 may be selected to be fixedly connected, or baffle A103 may be selected to be fixedly connected. If only one of the two baffles 102 is selected for fixed connection, the workpiece 20 to be electroplated needs to be placed from the other detachably connected baffle 102 (the first trough body 10111 or the third trough body 10113) into the second trough body 10112. When the baffle A103 is fixedly connected to the first trough body 10111, the distance between the bottom of the baffle A103 and the top of the second trough body 10112 is too close, so that the workpiece 20 to be electroplated cannot be placed in the second trough body 10112. For example, the width of the workpiece 20 to be electroplated is a, the thickness is b, the width of the bearing channel 1011 is c, the width of the second trough body 10112 is d, and the distance between the second trough body 10112 and the bearing seat 10113 is d. The width of the connecting part of the channel 1011 is c-2d=e. Since the workpiece 20 to be plated needs to be placed in the second tank 10112, a>e. Therefore, the workpiece 20 to be plated needs to be placed in the second tank 10112 in a vertical state. When the distance between the bottom surface of the baffle A103 and the top surface of the second tank 10112 is less than b, the workpiece 20 to be plated cannot be completely placed in the second tank 10112. If the distance between the first tank 10111 and the second tank 10112 is increased, the thickness of the support seat 101 may be increased, resulting in increased costs. Therefore, when only one baffle 102 is selected for fixed connection, the fixed baffle A103 is mainly used. When both baffles 102 are fixedly connected, it is necessary to open a take-in and put-out port on the side wall of the support seat 101 for the workpiece 20 to be plated to enter and exit. In order to prevent the workpiece 20 to be plated from falling out, the protective plate mentioned above or other structures that block the take-in and put-out port can be set at the take-in and put-out port. Compared with the structure in which the baffle 102 and the supporting seat 101 are detachably connected, the fixed connection structure can improve the stability of the installation of the baffle 102 and avoid the baffle 102 falling during the electroplating process. However, the detachable connection structure is more convenient for the installation and replacement of the electroplated component 20 and the baffle 102.

[0082] In the prior art, reference Fig.11 , the workpiece 20 to be electroplated is electroplated by directly placing it on the transmission mechanism 40. Since the workpiece 20 to be electroplated is immersed in the plating solution, in order to prevent it from being affected by the flow force of the circulating plating solution, a clamping mechanism for clamping the workpiece 20 to be electroplated is provided in the electroplating equipment, that is, a clamping bracket is provided on the plating tank 30, and a clamping slide is provided on the clamping bracket. The clamping slide is equal in length to the transmission mechanism 40, and the clamping slide is slidably connected to the clamping member. The clamping member is placed on the workpiece 20 to be electroplated, and the workpiece 20 to be electroplated is pressed on the transmission mechanism 40 by its own weight, and moves synchronously with the workpiece 20 to be electroplated, so that the workpiece 20 to be electroplated can be in a preset position during the transmission process; or refer to Fig.12, the upper and lower roller assemblies are used to transport the workpiece 20 to be plated, and the workpiece 20 to be plated is located between the upper roller and the lower roller. When the lower roller rotates to transport the workpiece 20 to be plated, the upper roller can provide a thrust in a transport direction for the workpiece 20 to be plated, and at the same time use its own weight to achieve the compaction of the workpiece 20 to be plated. However, in this way, if the compaction member / upper roller is not within the preset weight range, the compaction member / upper roller is too heavy, and the workpiece 20 to be plated will be crushed by the compaction member / upper roller. If the compaction member is too light / the distance between the upper roller and part of the workpiece 20 to be plated is too large, the workpiece 20 to be plated will be fixed by the compaction member at part of the transport process and moved at part of the part due to the excessive flow force of the electroplating liquid, thereby causing the workpiece 20 to be broken and causing cost losses.

[0083] The present application provides an electroplating carrier 10, which can stably place the workpiece 20 to be electroplated through the carrying channel 1011 of the carrying seat 101, and uses the baffle 102 to cover it, so that the workpiece 20 to be electroplated cannot fall from the carrying seat 101. In addition, since the electroplating carrier 10 is used to carry the workpiece 20 to be electroplated, its movement direction is restricted by the structure, compared with the method of using the pressing member to directly contact the surface of the workpiece 20 to be electroplated, the impact on the surface to be electroplated can be reduced.

[0084] In one feasible embodiment, a detachable connection structure is provided between the cover plate 1021 and the current equalizing plate 1022. Specifically, the detachable connection may be achieved by splicing, overlapping or plugging, for example, a lapped lower plate extending in the axial direction of the cover plate 1021 is provided at the bottom of the inner wall thereof (if the cover plate 1021 is annular, the lapped lower plate extends from the bottom of the cover plate 1021 toward the center of the circle to form a connected inner ring and outer ring), and an lapped upper plate extending outward is provided at the top of the outer wall of the current equalizing plate 1022. If the thickness of the current equalizing plate 1022 and the cover plate 1021 are both H, and the thickness of the lapped lower plate and the lapped upper plate are both 1 / 2H, that is, when the lapped upper plate is placed on the lapped lower plate, the upper and lower surfaces of the cover plate 1021 and the current equalizing plate 1022 are flush, and when the baffle 102 is installed. When removing the baffle 102, the cover plate 1021 must be placed in the carrying channel 1011 first, that is, the cover plate 1021 in the baffle A103 is placed in the first slot 10111, and the cover plate 1021 in the baffle B104 is placed in the second slot 10112 or the third slot 10113, and then the equalizing plate 1022 is placed on the cover plate 1021. When disassembling the baffle 102, the equalizing plate 1022 can be taken out through the guide hole 10221 of the equalizing plate 1022, and then the cover plate 1021 can be taken out using the vacant space of the equalizing plate 1022, or the baffle 102 can be directly taken out as a whole through the gap between the carrying channel 1011 and the cover plate 1021.

[0085] In another feasible embodiment, a fixed connection structure can be selected between the cover plate 1021 and the current equalizing plate 1022. The fixed connection can be selected by bonding or integral molding, for example, the outer wall of the current equalizing plate 1022 is bonded to the inner wall of the cover plate 1021. Compared with the detachable connection method, the fixed connection can ensure the connection stability between the cover plate 1021 and the current equalizing plate 1022, avoid the shaking or falling of the current equalizing plate 1022 due to the excessive impact force of the water flow when spraying the plating solution in the overlap mode, and change the structure of the baffle 102 in the plug-in mode, increase the preparation workload and production cost, etc., but the detachable connection is convenient for replacing only the current equalizing plate 1022 when the current equalizing plate 1022 is damaged or the through hole size is not suitable, which can improve the replacement efficiency and reduce the cost of the cover plate 1021 to a certain extent.

[0086] It should be noted that, in the case where the cover plate 1021 can be connected to the current equalizing plate 1022 and serves to cover the workpiece 20 to be plated, the present application does not limit the connection method between the cover plate 1021 and the current equalizing plate 1022. For example, under the condition of covering the workpiece 20 to be plated, the current equalizing plate 1022 can also be replaced with a current equalizing membrane with flow guide holes 10221. When in use, the current equalizing membrane is glued to the cover plate 1021. When replacement is required, it only needs to be torn off, which is convenient to use and reduces costs. Compared with the current equalizing plate 1022, this method is easy to cause it to fall off due to loose bonding or excessive impact of the plating liquid during use.

[0087] In a feasible implementation, the current equalizing plate 1022 and the cover plate 1021 can be made of the same material. Specifically, corrosion-resistant PP material, PVC material or glass fiber cloth can be selected. It should be noted that, under the condition that it can be ensured that the current equalizing plate 1022 and the cover plate 1021 do not react with the plating solution (so that the power line can bypass the cover plate 1021 and enter the bearing channel 1011 through the guide hole 10221), this application does not limit the manufacturing materials of the cover plate 1021 and the current equalizing plate 1022.

[0088] In the above-mentioned achievable implementation, the flow balancing plate 1022 has a plurality of flow guide holes 10221, and the plurality of flow guide holes 10221 are evenly arranged on the flow balancing plate 1022. Furthermore, the flow rate of the plating solution flowing through the flow holes can be adjusted by changing the aperture of the flow holes. Fig.13When the flow guide hole 10221 is opened, its initial aperture can be set to a larger size. Subsequently, an annular block 109 is placed in the flow guide hole 10221. The annular block 109 includes a portion placed in the flow guide hole 10221 and having a hollow cylindrical structure. The outer wall of the hollow cylindrical structure is in direct contact with the inner wall of the flow guide hole 10221. The hollow portion of the inner wall of the hollow cylindrical structure allows the electroplating solution to flow. The annular block 109 is arranged to reduce the aperture of the flow guide hole 10221, so that the amount of liquid flowing into the second tank 10112 through the flow guide hole 10221 can be changed according to the aperture size of the flow hole. The aperture of the flow hole is reduced by controlling the thickness of the hollow cylindrical structure, and the thicker the side wall of the hollow cylindrical structure, the smaller the aperture of the flow hole will be. Furthermore, the annular block 109 also includes a portion in an annular structure placed on the flow equalizing plate 1022, the inner wall of the annular structure is connected to the outer wall of the top surface of the hollow cylindrical structure, and it is necessary to ensure that the ring width of the annular portion plus the width of the cylinder is greater than the aperture of the guide hole 10221 (that is, the orthographic projection area of ​​the upper surface of the annular block 109 is greater than the orthographic projection area of ​​the guide hole 10221) to play a role in supporting the annular block 109.

[0089] In one possible implementation, reference Fig.14 , the baffle 102 is no longer divided into a cover plate 1021 and a flow equalizing plate 1022, but a plurality of flow guide holes 10221 are directly opened on the baffle 102, and the plurality of flow guide holes 10221 are evenly distributed on the baffle 102, and a blocking block 110 can be placed in the flow guide hole 10221. When a blocking block 110 is placed in the flow guide hole 10221 at the edge of the baffle 102, the blocking block 110 can cover the edge of the workpiece 20 to be electroplated. Among them, the material of the blocking block 110 can be selected from a flexible material. Compared with a hard material, the flexible material has softness, can effectively reduce the gap between the flow guide hole 10221 and it, and can reduce the space occupied by the baffle 102. If a hard material is used, the blocking block 110 needs to be added with a blocking top hat structure to prevent it from falling, and this structure will also increase the space occupied by the baffle 102. It should also be noted that the material of the blocking block 110 cannot react with the electroplating solution, so as not to affect the electroplating effect of the component 20 to be electroplated.

[0090] Furthermore, the number and position of the guide holes 10221 of the blocking block 110 can be adjusted according to the size and distribution of the electric lines of the workpiece 20 to be electroplated. For example, when the orthographic projection area of ​​the first workpiece 20 to be electroplated placed in the electroplating carrier 10 is smaller than the orthographic projection area of ​​the second workpiece 20 to be electroplated placed in the electroplating carrier 10, the number of blocked guide holes 10221 located at the edge of the baffle 102 can be increased to meet the need to cover the edge portion of the larger-sized workpiece 20 to be electroplated. In practical applications, the workpiece 20 to be electroplated can be directly electroplated without setting the baffle 102, and the workpiece 20 to be electroplated that has been electroplated can be evenly divided into N electroplating areas, and the thickness of the electroplating layer in each electroplating area can be measured, so as to reversely infer the distribution of the electric lines of the workpiece 20 to be electroplated, so as to adjust the blockage rate of the guide holes 10221 at each position on the baffle 102, balance the distribution of the electric lines of the workpiece 20 to be electroplated, and effectively improve the uniformity of electroplating.

[0091] Furthermore, the aperture of the guide hole 10221 can also be adjusted as needed, and the adjustment method and function are the same as those of the guide hole 10221 of the flow equalizing plate 1022, and will not be described in detail here.

[0092] In one possible implementation, reference Figure 1-4 The support base 101 is also provided with a wiring groove 111, which is connected to the second tank body 10112 for the conductive wire 201 connected to the workpiece 20 to be electroplated to pass through. Specifically, there is at least one conductive wire 201, and it extends along the wiring groove 111 to the second tank body 10112 to connect to the workpiece 20 to be electroplated. Furthermore, the conductive wire 201 can be made of copper foil tape, metal foil tape or other materials with good conductive properties, and the present application does not limit this.

[0093] In an achievable implementation, a water filter hole 112 is provided on the wiring groove 111 to discharge the electroplating liquid remaining in the wiring groove 111, and prevent the electroplating liquid from flowing from the wiring groove 111 to the workpiece 20 to be electroplated, thereby affecting the coating thickness of the workpiece 20 to be electroplated. There is at least one water filter hole 112, and more than one water filter hole 112 may be provided. When there are more than one water filter hole 112, they need to be centrally provided to facilitate the arrangement of the conductive wire 201. For example, multiple water filter holes 112 are centrally provided at the axis of the wiring groove 111, and the conductive connector is located on one side of the wiring groove 111 to prevent the water filter hole 112 and the conductive wire 201 from interfering with each other.

[0094] In one embodiment disclosed in the present application, an electroplating device is also provided. Figure 15-16The electroplating carrier 10 can be used in an electroplating device as shown in the figure. The electroplating device is used to electroplate the workpiece 20 to be electroplated so that a metal film is attached to the entire area or a part of the surface of the workpiece 20 to be electroplated. The electroplating device can be a horizontal electroplating device.

[0095] In this embodiment, the electroplating equipment at least includes an electroplating tank 30, a transmission mechanism 40, a spray mechanism 50, a conductive mechanism 60 and a liquid circulation mechanism 70. Specifically, the electroplating tank 30 is filled with a plating solution, the transmission mechanism 40 is arranged in the electroplating tank 30, and is configured to drive the electroplating carrier 10 to move, the spray mechanism 50 is arranged in the electroplating tank 30, and is configured to spray the plating solution to the electroplating carrier 10, the conductive mechanism 60 is movably arranged on the electroplating tank 30, is electrically connected to the electroplating carrier 10, and moves with the electroplating carrier 10, and the liquid circulation mechanism 70 is connected to the electroplating tank 30, and is configured to drive the plating solution to circulate and form a liquid loop. Among them, the liquid circulation mechanism 70 is connected to the spray mechanism 50, and the cation concentration of the plating solution increases after circulation, so that the plating solution sprayed onto the workpiece 20 to be electroplated has a high concentration of cations, and the plating solution flows to the workpiece 20 to be electroplated through the electroplating carrier 10. At the same time, the transmission mechanism 40 and the spray mechanism 50 are both immersed in the electroplating solution to ensure the normal flow of ions during the electroplating process.

[0096] In practical applications, the electroplating equipment further includes a power supply 80, which is used to provide an energy source for the electroplating equipment. The spray mechanism 50 and the conductive mechanism 60 are electrically connected to the positive and negative electrodes of the power supply 80, respectively.

[0097] In one possible implementation, reference Figure 15-17 The spray mechanism 50 at least includes a liquid supply pipeline 501 and a plurality of anode units 502. The anode unit 502 has a liquid outlet channel 5021, one end of the liquid outlet channel 5021 is connected to the liquid supply pipeline 501, and the other end is disposed toward the transmission mechanism 40, and an anode member 5022 is disposed in the liquid outlet channel 5021. Specifically, the anode unit 502 includes an anode mounting seat 5023 and an anode member 5022, the liquid outlet channel 5021 is arranged along the length of the anode mounting seat 5023, the anode member 5022 can be detached in the liquid outlet channel 5021, and the anode member 5022 is provided with an anode hole 50221 for passing the electroplating solution; the liquid supply pipeline 501 includes a main pipeline 5011 and a plurality of branch pipelines 5012, one end of the plurality of branch pipelines 5012 is connected to the main pipeline 5011, and the other end is respectively connected to the anode mounting seat 5023, so that the electroplating solution introduced through the main pipeline 5011 can flow into the liquid supply pipeline 501, and the flow direction of the electroplating solution is as follows: Fig.17In order to realize the detachable setting of the anode member 5022, the anode mounting seat 5023 can adopt a split structure, that is, the mounting seat 1 and the mounting seat 2 can be plugged in the vertical direction, and can be split at the mounting position of the anode member 5022. In this way, when installing or replacing the anode member 5022, the mounting seat 1 and the mounting seat 2 can be separated first, and after the anode member 5022 is placed on the mounting seat 2, the mounting seat 1 and the mounting seat 2 can be connected.

[0098] Furthermore, the main pipe 5011 and the plurality of anode units 502 are arranged along the length of the transmission mechanism 40. In order to allow the electroplating carrier 10 at any transmission position to be sprayed with the electroplating liquid, the anode unit 502 needs to be arranged in accordance with the length of the transmission mechanism 40. For example, the transmission mechanism 40 is arranged along the length of the electroplating tank 30, the main pipe 5011 is consistent with the length of the transmission mechanism 40 and is arranged in the electroplating tank 30, and the plurality of anode units 502 are arranged on the main pipe 5011 at intervals through the branch pipes 5012. In actual applications, the plurality of anode units 502 are all connected to the same fixed mounting bracket, and the fixed mounting bracket is arranged in the electroplating tank 30 to improve the installation stability of the anode unit 502. If the anode unit 502 is connected to the main pipe 5011 only through the branch pipe 5012, the connection is easily unstable under the impact of the liquid for a long time, and even shaking, damage, and component separation may occur in the non-fixed connection part.

[0099] Furthermore, the number of main conduits 5011 is at least one. If the workpiece 20 to be plated is subjected to single-sided electroplating, the main conduit 5011 can be arranged at a position corresponding to the surface to be plated. If the workpiece 20 to be plated is subjected to double-sided electroplating, two main conduits 5011 need to be arranged, and they correspond to the two surfaces to be plated respectively. When it is necessary to increase the amount of plating liquid flowing to the surface of the workpiece 20 to be plated, multiple main conduits 5011 can be arranged at a position corresponding to each surface to be plated, or multiple rows of anode units 502 can be arranged on each main conduit 5011, and the multiple rows of anode units 502 are arranged in an interlaced manner. By increasing the density of the anode units 502, it is avoided that the amount of plating liquid flowing into the electroplating carrier 10 cannot reach the set standard.

[0100] Since the anode member 5022 needs to be electrically connected to the positive electrode of the power source 80, in order to facilitate the anode member 5022 to be energized with the power source 80, in an achievable embodiment, an anode lead-out member connected to the anode member 5022 may also be provided. Specifically, one end of the anode lead-out member is connected to the anode member 5022, and the other end extends to be connected to the positive electrode of the power source 80.

[0101] In an achievable embodiment, a partition 5024 is provided on the anode mounting seat 5023. In practical applications, the partition 5024 has the same structure as the baffle 102 in the electroplating carrier 10, that is, the partition 5024 has a hole 50241 for allowing the electroplating solution to flow, and the hole 50241 is provided in the central area of ​​the partition 5024, so that when the electroplating solution flows onto the partition 5024, it cannot flow out through the edge area of ​​the partition 5024. Due to the edge effect of the anode member 5022 itself, the structure can cover the edge part of the anode member 5022. When the electroplating solution flows to the workpiece 20 to be electroplated through the anode member 5022, the edge effect of the anode member 5022 can be weakened first through the partition 5024, and then the edge effect of the workpiece 20 to be electroplated can be weakened through the baffle 102. In this way, the electric lines distributed on the workpiece 20 to be electroplated can be made uniform, so as to achieve the purpose of uniform coating thickness of the workpiece 20 to be electroplated.

[0102] It should be noted that since the plating liquid flows through the branch pipe 5012, the liquid outlet channel 5021, the anode component 5022 and the partition 5024 in sequence, in order to ensure that the plating liquid can flow continuously and stably, the liquid outlet pipe, the anode hole 50221 of the anode component 5022 and the hole position 50241 of the partition 5024 need to be aligned. Preferably, the orthographic projection of the liquid outlet pipe toward the transmission mechanism 40 and located on the workpiece 20 to be electroplated is called the first projection, the orthographic projection of the anode hole 50221 toward the transmission mechanism 40 and located on the workpiece 20 to be electroplated is called the second projection, and the orthographic projection of the hole position 50241 of the partition 5024 toward the transmission mechanism 40 and located on the workpiece 20 to be electroplated is called the third projection. The first projection, the second projection and the third projection completely overlap, the area of ​​the third projection is larger than the area of ​​the first projection, and the area of ​​the first projection is larger than the area of ​​the second projection, so that the plating liquid can flow into the anode hole 50221 and the hole position 50241 of the partition 5024 in sequence through the liquid outlet pipe. Since the positions of the first projection, the second projection and the third projection do not correspond, a large amount of the plating liquid remains on the anode part 5022 or the partition 5024, the circulation speed slows down, and the plating liquid cannot be sprayed onto the workpiece 20 to be electroplated in time.

[0103] Among them, the amount of liquid sprayed onto the workpiece 20 to be plated by the plating liquid can be achieved by changing the diameter of the liquid outlet pipe, the anode hole 50221, the hole position 50241 and the aperture of the guide hole 10221. If the amount of liquid sprayed onto the workpiece 20 to be plated per minute is to be increased, it is necessary to adjust the pipe diameter and the aperture at the same time. If only some of the sizes are adjusted, it is easy to cause the liquid to still not be able to circulate in large quantities. For example, when only the aperture of the anode hole 50221 and the hole position 50241 of the partition 5024 is increased, the amount of liquid flowing from the liquid outlet pipe to the anode part 5022 remains unchanged, and the amount of liquid flowing out through the anode hole 50221 and the hole position 50241 of the partition 5024 increases. After the plating liquid is sprayed onto the electroplating carrier 10, the amount of liquid flowing onto the workpiece 20 to be plated is limited by the aperture of the guide hole 10221. When the aperture of the guide hole 10221 does not change, the amount of liquid flowing onto the workpiece 20 to be plated remains unchanged.

[0104] However, when the flow rate of the plating liquid flowing into the main pipeline 5011 remains unchanged, changing the diameter of the liquid outlet pipeline, the diameter of the anode hole 50221, the hole position 50241 and the guide hole 10221 will change the flow rate of the liquid. When the above-mentioned diameter or diameter is smaller, the flow rate of the plating liquid flowing out is faster. If the flow rate is too fast, the plating liquid flowing toward the workpiece 20 to be plated will form a jet, and the impact force generated may cause the workpiece 20 to shake frequently or directly damage its surface; when the above-mentioned diameter or diameter is larger, the flow rate of the plating liquid flowing out is slower. If the flow rate is too slow, the plating liquid flowing out through the anode unit 502 may not flow to the electroplating carrier 10 and directly enter the liquid loop.

[0105] Therefore, in actual use, the diameter of the liquid outlet pipe, the diameter of the anode hole 50221, the hole position 50241 and the guide hole 10221, and the liquid flow rate or pressure flowing into the main pipe 5011 within a certain period of time can be preset. Compared with the existing electroplating equipment, the method of using the electroplating carrier 10 to carry the workpiece 20 to be electroplated can use the baffle 102 or the structure of the carrying channel 1011 to gather the fragments when the workpiece 20 to be electroplated is too strong due to the impact of the electroplating liquid spraying, and wait for the operation and maintenance personnel to handle it, so as to avoid the situation that the fragments generated when the workpiece 20 to be electroplated is directly transported and processed will directly fall into the electroplating tank 30, blocking and damaging the electroplating equipment.

[0106] In one possible implementation, reference Figure 15-16 , Fig.18, the liquid circulation mechanism 70 at least includes a liquid reservoir 701, a circulation pump 702 and a circulation pipe 703. The plating tank 30, the liquid reservoir 701 and the circulation pump 702 are connected in sequence through a plurality of circulation pipes 703, and a circulating liquid loop is formed. Specifically, the plating solution in the plating tank 30 flows to the liquid reservoir 701 through the circulation pipe 703 under the suction of the circulation pump 702. Since the cation concentration of the plating solution in the plating tank 30 is lower than that of the original solution after long-term use, it is drained into the liquid reservoir 701 to mix with the original solution and precipitate, so that the cation concentration of the plating solution that returns to the plating tank 30 through the liquid reservoir 701 again will increase. For example, the cation concentration of the plating solution flowing out of the plating tank 30 is M1. After the plating solution is placed in the liquid reservoir 701 and mixed with the original solution, the cation concentration of the plating solution flowing into the plating tank 30 is M2, and M2>M1. In order to ensure that the cation concentration in the plating solution that re-flows into the plating tank 30 changes, the operation and maintenance personnel need to regularly replenish the plating solution stock solution into the liquid storage tank 701. If the plating solution sprayed onto the surface of the workpiece 20 to be plated is not mixed with the stock solution, but the plating solution initially filled in the plating tank 30 is repeatedly used, after a certain period of time, the ions reaching the surface of the workpiece 20 to be plated may gradually decrease, so that a plating layer of sufficient thickness cannot be formed on the surface of the workpiece 20 to be plated.

[0107] In an achievable implementation, a liquid level sensor 901 is provided in each of the electroplating tank 30 and the liquid reservoir 701, for monitoring the real-time amount of electroplating liquid in the electroplating tank 30 and the liquid reservoir 701. Specifically, the electroplating equipment has a controller 90, and there is a communication line (wired or wireless communication line) between the liquid level sensor 901 and the controller 90, and the controller 90 can receive the signal sent by the liquid level sensor 901, and then obtain the real-time hydraulic pressure in the electroplating tank 30 and the liquid reservoir 701. Among them, the liquid level sensor 901 arranged in the electroplating tank 30 is the first liquid level sensor 901, and the liquid level sensor 901 arranged in the liquid storage tank 701 is the second liquid level sensor 901. Before the electroplating equipment is used, the standard threshold range of the first liquid level sensor 901 and the second liquid level sensor 901 can be set respectively. When the liquid level in the electroplating tank 30 and / or the liquid storage tank 701 is not within the set standard threshold range, the liquid level sensor 901 can be fed back to the controller 90 via the above-mentioned communication line, and then the controller 90 issues a reminder in the form of sound, light and electricity. For example, the standard threshold range of the first liquid level sensor 901 is F1, and the standard threshold range of the second liquid level sensor 901 is F2. When the amount of plating liquid F3 in the plating tank 30 is less than F1, it indicates that the amount of plating liquid in the plating tank 30 is too little, and the circulation pump 702 may not be started. At this time, the cation content in the plating liquid in the plating tank 30 may be too low. The amount of plating liquid F4 in the liquid storage tank 701 at this time can be obtained. If F4 is less than F2, the reason why the amount of plating liquid in the surface plating tank 30 is too low is that the amount of plating liquid in the liquid loop is insufficient, and the liquid storage tank 701 needs to be replenished with the original plating liquid in time. If F4 is greater than F2, it indicates that the plating liquid in the liquid storage tank 701 has not flowed into the plating tank 30, and the operation and maintenance personnel can promptly detect whether there is a problem with components such as the circulation pump 702 or the circulation pipe 703.

[0108] Furthermore, a flow sensor 902 may be provided on the circulation pipeline 703 to monitor the flow rate of the plating solution flowing into the plating tank 30 in real time. Specifically, the flow sensor 902 is connected to the controller 90 by electrical signals, and the controller 90 may receive the signal sent by the flow sensor 902 to obtain the real-time flow rate in the circulation pipeline. The flow sensor 902 and the standard threshold range of the flow rate may be pre-set before the electroplating equipment is used. When the flow rate exceeds the set standard threshold range, a large amount of plating solution will flow into the main pipeline 5011 in a short time, resulting in the plating solution being too fast when spraying, which may easily damage the part 20 to be plated.

[0109] Furthermore, if there are more than one main pipeline 5011 in the electroplating tank 30, a plurality of circulating pipelines 703 connected thereto may be provided correspondingly, and each circulating pipeline 703 connected thereto may be provided with a solenoid valve 903 to control the flow direction of the electroplating solution. The controller 90 is electrically connected to the solenoid valve 903, and the controller 90 may also control the opening and closing of the solenoid valve 903. When only one-side electroplating is performed on the workpiece 20 to be electroplated, the controller 90 may control the corresponding solenoid valve 903 to be opened, and the solenoid valve 903 on the other circulating pipeline to be closed. When double-side electroplating is performed on the workpiece 20 to be electroplated, the controller 90 may control both solenoid valves 903 to be opened. For example, two main pipelines 5011 are arranged in the electroplating tank 30, the main pipeline 5011A is located above the transmission mechanism 40, and the main pipeline 5011B is located below the transmission mechanism 40. The circulating pipeline 703 connected to the main pipeline 5011A is the circulating pipeline 703A, and the circulating pipeline 703 connected to the main pipeline 5011B is the circulating pipeline 703B. The solenoid valve 903 arranged on the circulating pipeline 703A is the solenoid valve 903A, and the solenoid valve 903 arranged on the circulating pipeline 703B is the solenoid valve 903B. If the surface to be plated of the workpiece 20 to be plated faces upward, the controller 90 controls the solenoid valve 903A to open and the solenoid valve 903B to close, so that the plating liquid flowing out of the liquid storage tank 701 flows to the main pipeline 5011A through the circulating pipeline 703A, so that the plating liquid is sprayed out of the anode unit 502 located above the transmission mechanism 40 to the upper surface of the workpiece 20 to be plated (i.e., the surface to be plated).

[0110] In one possible implementation, reference Figure 15-16 , Fig.21 , the transmission mechanism 40 at least includes a plurality of guide rollers 401 arranged at intervals. Specifically, the guide rollers 401 are driven to rotate by a driving device, so that the electroplating carrier 10 placed thereon can move along its transmission direction. Among them, the driving device can adopt a driving motor and a transmission belt, and the transmission belt is used to drive and connect the plurality of guide rollers 401, and the driving motor is connected to the end of any guide roller 401 and drives it to rotate, so as to realize the operation of the transmission mechanism 40. It should be noted that, in the case where the electroplating carrier 10 can be transported and the electroplating liquid can be sprayed to the workpiece 20 to be electroplated, the present application does not limit the structure of the transmission mechanism 40. For example, if only one-sided electroplating is performed on the workpiece 20 to be electroplated, the transmission mechanism 40 can also adopt a conveyor belt structure. If double-sided electroplating is performed on the workpiece 20 to be electroplated, the transmission mechanism 40 can also adopt a hanging conveying structure. In addition, if the structure of the transmission mechanism 40 is changed so that the direction of the surface to be electroplated of the workpiece 20 to be electroplated changes, the direction of the anode unit 502 needs to be adjusted.

[0111] In actual application, multiple anode units 502 are arranged along the transmission direction of the transmission mechanism 40, and the anode units 502 are located in the interval between the two guide rollers 401. During the transportation of the electroplating carrier 10, since the bottom of the electroplating carrier 10 needs to contact the guide roller 401, the electroplating carrier 10 is pushed to move in its rotation direction by the rotation force of the guide roller 401. Therefore, in order to make the electroplating solution flowing out through the hole 50241 of the partition 5024 flow to the electroplating carrier 10, the anode units 502 need to be arranged toward the above-mentioned interval. In this way, in order to make a sufficient amount of electroplating solution flow to the electroplating carrier 10, when there are multiple rows of anode units 502, they can be arranged in parallel, that is, multiple anode units 502 are arranged corresponding to each interval.

[0112] Further, the interval between two adjacent guide rollers 401 can be adjusted according to the orthographic projection area of ​​the electroplating carrier 10. Specifically, if the interval is larger than the orthographic projection area of ​​the electroplating carrier 10, the electroplating carrier 10 will fall during transportation. However, if the interval is smaller than the orthographic projection area of ​​the electroplating carrier 10, if the interval is too large, it is easy to cause the sprayed part of the electroplating carrier 10 to tilt to one side under the impact of the electroplating liquid and fall to the bottom of the electroplating tank 30. If the interval is too small, it is easy to cause the anode unit 502 to fail to accurately spray the electroplating liquid onto the electroplating carrier 10. Therefore, in order to ensure that the electroplating carrier 10 can be transported normally and that the electroplating liquid sprayed onto the workpiece 20 to be electroplated is sufficient, the above-mentioned interval needs to be adjusted before operating the transmission mechanism 40 and after replacing the electroplating carrier 10.

[0113] In one possible implementation, reference Fig.19 , multiple transmission mechanisms 40 can be arranged in the electroplating tank 30. In order to ensure that the electroplating time of the workpieces 20 to be electroplated on different transmission mechanisms 40 is the same, the multiple transmission mechanisms 40 must have the same length and be arranged side by side. In addition, each transmission mechanism 40 must be provided with at least two main pipes 5011 and a conductive mechanism 60 so that the workpieces 20 to be electroplated on each transmission mechanism 40 can be effectively electroplated.

[0114] In one possible implementation, reference Fig. 20 , Fig.21 , an anti-skid cover 4011 is sleeved on the guide roller 401. Specifically, the anti-skid cover 4011 can be made of a soft material with a certain surface roughness, and by sleeved on the guide roller 401, the bottom of the electroplating carrier 10 can increase the friction when it contacts the guide roller 401, so that the electroplating carrier 10 will not slip or deviate when moving.

[0115] Different from the above-mentioned method of sleeve-mounting the anti-slip sleeve 4011 on the guide roller 401, in an achievable embodiment, referring to Fig.21The transmission mechanism 40 also includes a guide roller 402, at least one guide roller 402 is arranged on the guide roller 401, and when the transmission mechanism 40 is in working state, the electroplating carrier 10 is placed on the guide roller 402. Wherein, when the guide roller 402 adopts different models, its surface can present different structures, such as a concave-convex structure or a rubber structure, and the guide rollers 402 with different structures can be tested for friction before use to adapt to different electroplating situations. In addition, since the orthographic projection area of ​​the contact part between the guide roller 402 and the electroplating carrier 10 is smaller than the orthographic projection area of ​​the contact part between the guide roller 401 and the electroplating carrier 10, the part of the bottom of the electroplating carrier 10 covered is reduced, and the area where the electroplating liquid sprayed by the anode unit 502 can contact the electroplating carrier 10 is increased, so that the loss of the amount of electroplating liquid flowing to the workpiece 20 to be electroplated is reduced. Preferably, there are two guide rollers 402, which are respectively located at both ends of the guide roller 401. Compared with the method of only setting one guide roller 402 in the middle of the guide roller 401, setting two guide rollers 402 can improve the transmission stability of the electroplating carrier 10 by increasing the contact area with the electroplating carrier 10.

[0116] In order to prevent the electroplating carrier 10 from being displaced due to slipping or the impact of the electroplating liquid during movement, or even falling to the bottom of the electroplating tank 30, in a feasible embodiment, guide plates 403 can be provided at both ends of the guide roller 401, and the guide plates 403 are located on the opposite side of the two guide rollers 402. In this way, the guide plates 403 can be used to limit the two sides of the electroplating carrier 10 to ensure that the moving direction of the electroplating carrier 10 will not deviate. Furthermore, the two ends of the guide plate 403 extend away from the part of its central axis. Since the guide plate 403 is provided on the guide roller 401, in order to prevent the electroplating carrier 10 from shaking when being sprayed with the electroplating liquid, the end of the guide plate 403 needs to extend to the interval between two adjacent guide rollers 401. Furthermore, the guide plate 403 is provided on the guide roller 401 in a detachable manner. There is a certain distance between the two guide plates 403, and a carrier placement area is formed. The orthographic projection area of ​​the carrier placement area should be larger than the orthographic projection area of ​​the electroplating carrier 10. Since the electroplating carrier 10 will be replaced due to the change of the orthographic projection area of ​​the electroplated part 20, the distance between the two guide plates 403 should be adjusted so that the orthographic projection area of ​​the carrier placement area is still larger than the orthographic projection area of ​​the replaced electroplating carrier 10. Accordingly, the guide roller 402 can also be detachably disposed on the guide roller 401 to adjust the distance between the two guide rollers 402 to adapt to the size of the electroplating carrier 10. If the guide roller 402 is fixedly set on the guide roller 401, the distance between the guide roller 402 and the end of the guide roller 401 is fixed, and the guide plate 403 can only adjust its position within the fixed distance. When the distance between the two guide rollers 402 is greater than the electroplating carrier 10, the orthographic projection area of ​​the carrier placement area must be much larger than the orthographic projection area of ​​the electroplating carrier 10. At this time, the guide plate 403 cannot play a good limiting role on the electroplating carrier 10, and the electroplating carrier 10 will still shake in the carrier placement area.

[0117] In the prior art, when the electroplating equipment transmits the workpiece 20 to be electroplated, the workpiece 20 to be electroplated is directly placed on the transmission mechanism 40, or a carrier plate is added and the workpiece 20 to be electroplated is placed on the carrier plate. In the above-mentioned methods, the workpiece 20 to be electroplated will be offset in the transmission position due to reasons such as excessive impact of the electroplating liquid spray. If the position of the workpiece 20 to be electroplated does not match the preset position when the anode unit 502 is sprayed, the sprayed electroplating liquid can only partially reach the surface to be electroplated. If the external force affecting the movement of the workpiece 20 to be electroplated is too strong, it may also cause the workpiece 20 to fall to the bottom of the electroplating tank 30. The method of adding a guide roller 402 to the guide roller 401, adding a guide plate 403 to the guide roller 401, or adding a guide roller 402 and a guide plate 403 to the guide roller 401 at the same time can effectively prevent the movement of the electroplating carrier 10 during the transmission process. Among them, adding a guide roller 402 separately can improve the friction between the electroplating carrier 10 and the transmission mechanism 40, adding a guide plate 403 separately can limit the moving direction of the electroplating carrier 10, and adding a guide roller 402 and a guide plate 403 at the same time can further improve the transmission stability of the electroplating carrier 10 compared to the above-mentioned separate adding method.

[0118] In one possible implementation, reference Figure 15-16 , Fig. 22, the conductive mechanism 60 at least includes a conductive track 601, a conductive clamp 602, a conductor 603 and a conductive block 604. Among them, the conductive clamp 602 is used to clamp the conductive wire 201, the conductive track 601 is slidably connected to the conductive clamp 602, the conductor 603 is arranged in the conductive track 601, the cathode of the power supply 80 is electrically connected to the conductor 603, and the conductive block 604 is arranged on the conductive clamp 602 and contacts the conductor 603. When the electroplating carrier 10 drives the conductive clamp 602 to move along the conductive track 601, the conductive block 604 transmits the electrical energy obtained by contacting the conductor 603 to the workpiece 20 to be electroplated. Specifically, a conductive support frame is provided on the electroplating tank 30, the conductive track 601 is provided on the conductive support frame, and the length of the conductive track 601 is equal to that of the transmission mechanism 40, so that the conductive clamp 602 slidably connected to the conductive track 601 can move synchronously with the electroplating carrier 10. In this embodiment, the conductive track 601 is a hollow rectangle, the conductor 603 is arranged in the hollow part, and a sliding opening for the conductive clamp 602 to slide and connect is opened along the length of the bottom. One end of the conductive clamp 602 is a clamping part, and the other end is connected to the conductive block 604. The conductive block 604 and the clamping part are connected by a conductive connecting part. The positive projection area of ​​the sliding opening is smaller than the positive projection area of ​​the conductive block 604, and larger than the positive projection area of ​​the conductive connecting part, so that the conductive block 604 can be placed in the conductive track 601 and cannot fall from the sliding opening during the movement. The clamping part is composed of a fixed clamping side and a movable clamping side connected to each other. When one end of the conductive wire 201 is fixedly connected to the workpiece 20 to be electroplated, the other end is placed in the fixed clamping side, so that the movable clamping side moves close to the fixed clamping side until the conductive wire 201 is clamped. At this time, the negative electrode of the power supply 80 transmits current to the workpiece 20 to be electroplated through the conductor 603, the conductive block 604, the conductive connecting part and the conductive clamp 602.

[0119] In one possible implementation, reference Fig.18 , a temperature sensor 904 may be provided in the electroplating tank 30, and the controller 90 is electrically connected to the temperature sensor 904 to obtain the real-time temperature in the electroplating tank 30. Since the electroplating solution needs to work at a set temperature, it is necessary to ensure that the electroplating tank 30 is within the set temperature range for a long time. For example, bright nickel plating requires the electroplating solution temperature to be maintained at 50°C, chromium plating requires the electroplating solution temperature to be 50°C to 60°C, and acid bright copper plating or bright silver plating requires the electroplating solution temperature to be within 30°C. By providing the temperature sensor 904, the temperature in the electroplating tank 30 can be obtained in real time, and the temperature control equipment in the electroplating tank 30 can be adjusted to meet the temperature requirements of the electroplating process.

[0120] An embodiment disclosed in the present application also provides an electroplating method, please refer to Fig.23 The method uses the above-mentioned electroplating equipment, comprising:

[0121] The workpiece 20 to be plated and the baffle 102 are both placed in the carrying channel 1011. When only one side of the workpiece 20 to be plated needs to be plated, the baffle 102 is placed in the first tank 10111 or the third tank 10113 corresponding to the surface to be plated of the workpiece 20 to be plated. When both sides of the workpiece 20 to be plated need to be plated at the same time, the workpiece 20 to be plated is located between the two baffles 102. Specifically, the electroplating carrier 10 of the corresponding size can be replaced according to the orthographic projection area of ​​the workpiece 20 to be plated, so as to ensure that the workpiece 20 to be plated can be stably placed in the carrying seat 101, and the cover plate 1021 can cover the edge of the surface to be plated of the workpiece 20 to be plated.

[0122] The electroplating carrier 10 is placed on the guide roller 402. If a guide plate 403 is provided on the guide roller 401, the guide plate 403 needs to be installed on both sides of the electroplating carrier 10. The transmission stability of the electroplating carrier 10 is improved by the guide roller 402 and the spraying area of ​​the workpiece 20 to be electroplated is increased. The guide plate 403 can be used to limit the moving direction of the electroplating carrier 10.

[0123] The conductive wire 201 is adjusted to pass through the wiring groove 111 and is clamped by the conductive clamp 602. The conductive wire 201 is clamped by the conductive clamp 602 to continuously and stably transmit current to the workpiece 20 to be plated.

[0124] The electroplating equipment is turned on, and the electroplating carrier 10 moves along the transmission direction of the transmission mechanism 40. The spray mechanism 50 obtains the electroplating solution from the liquid circulation mechanism 70 and sprays the electroplating solution onto the electroplating carrier 10. The electroplating solution flows to the workpiece 20 to be electroplated through the guide hole 10221 of the baffle 102 to complete the electroplating of the workpiece 20 to be electroplated. When the electroplating solution flows to the workpiece 20 to be electroplated through the anode unit 502, the edge effect of the anode unit 5022 can be weakened first through the partition 5024, and then the edge effect of the workpiece 20 to be electroplated can be weakened through the baffle 102. In this way, the electric lines distributed on the workpiece 20 to be electroplated can be uniform, so as to achieve the purpose of uniform coating thickness of the workpiece 20 to be electroplated.

[0125] It can be seen that the electroplating carrier 10 provided by the present application covers the edge of the workpiece 20 to be electroplated with the baffle 102 of the electroplating carrier 10, so that the electroplating solution first flows to the central part of the surface 20 to be electroplated through the guide hole 10221 of the flow equalizing plate 1022, and then diffuses to the edge through the central part, so that the distance that the electric line moves to the edge of the workpiece 20 to be electroplated is greater than the distance that the electric line moves to the central part of the workpiece 20 to be electroplated. In this way, the electric line can be evenly distributed on the surface 20 to be electroplated, thereby reducing the influence of uneven plating caused by the edge effect of the workpiece 20 to be electroplated;

[0126] The present application also provides an electroplating device using an electroplating carrier 10, which uses the electroplating carrier 10 to avoid direct contact between the workpiece 20 to be electroplated and the transmission mechanism 40, so as to reduce the possibility of the workpiece 20 to be electroplated being broken. At the same time, a partition 5024 is added to the spray mechanism 50 to further improve the uniformity of the coating thickness. In addition, the electroplating device has a liquid circulation mechanism 70, which can make the cation content in the electroplating solution sprayed onto the workpiece 20 to be electroplated higher than the cation content in the electroplating solution in the electroplating tank 30;

[0127] The present application also provides an electroplating method using the electroplating device;

[0128] The electroplating equipment and the electroplating method include all technical solutions of the electroplating carrier 10 , and therefore also have all technical advantages of the electroplating carrier 10 .

[0129] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. An electroplating carrier, characterized in that: At least comprises a bearing seat and a baffle, wherein the bearing seat has a bearing channel, and the bearing channel is used to place the workpiece to be electroplated and at least one of the baffles; Wherein, the baffle includes a cover plate and a flow equalizing plate, and a plurality of guide holes are opened on the flow equalizing plate. When the workpiece to be electroplated and the baffle are both placed in the carrying channel, the cover plate covers the edge portion of the corresponding surface of the workpiece to be electroplated, and the flow equalizing plate covers the remaining portion of the corresponding surface of the workpiece to be electroplated, so that the covered surface of the workpiece to be electroplated is connected to the outside through the guide holes.

2. The electroplating carrier according to claim 1, characterized in that: A first slot body and a second slot body are provided in the carrying channel, and the orthographic projection area of ​​the first slot body is larger than the orthographic projection area of ​​the second slot body, so that the interior of the carrying channel is in a stepped shape; When the baffle and the workpiece to be electroplated are placed in the first tank body and the second tank body respectively, the baffle covers the corresponding surface of the workpiece to be electroplated.

3. The electroplating carrier according to claim 2, characterized in that: A plurality of support blocks are arranged in the second tank body, and the plurality of support blocks together form a receiving area for placing the parts to be electroplated; When the baffles are placed in both the first trough body and the second trough body, and the workpiece to be electroplated is placed in the accommodating area, the two baffles respectively cover the upper and lower surfaces of the workpiece to be electroplated.

4. The electroplating carrier according to claim 3, characterized in that: The edge of the baffle plate placed in the second tank body is provided with an avoidance groove for the support block to pass through, and the number and size of the avoidance grooves match those of the support blocks.

5. The electroplating carrier according to claim 4, characterized in that: There is a preset distance between the containing area and the bottom of the first trough body and the second trough body to allow the plating solution to flow.

6. The electroplating carrier according to any one of claims 2 to 5, characterized in that: The bearing seat is provided with a wiring groove, which is communicated with the second groove body so as to allow the conductive wire connected to the piece to be electroplated to pass through.

7. The electroplating carrier according to claim 6, characterized in that: The wiring groove is provided with a water filtering hole.

8. An electroplating device, using the electroplating carrier according to any one of claims 1 to 7, characterized in that: At least: an electroplating tank filled with an electroplating solution; A transmission mechanism, disposed in the electroplating tank and configured to drive the electroplating carrier to move; A spray mechanism, disposed in the electroplating tank, configured to spray the electroplating liquid onto the electroplating carrier; A conductive mechanism, movably disposed on the electroplating tank, electrically connected to the electroplating carrier, and moving with the electroplating carrier; A liquid circulation mechanism, connected to the electroplating tank, configured to drive the electroplating liquid to circulate to form a liquid loop; Wherein, the liquid circulation mechanism is connected to the spray mechanism, and the cation concentration of the plating solution increases after circulation, so that the plating solution sprayed onto the plating carrier has a high concentration of cations, and the plating solution flows to the workpiece to be electroplated through the plating carrier.

9. The electroplating equipment according to claim 8, characterized in that: It also includes a power supply, which is used to provide an energy source for the electroplating equipment. The spray mechanism and the conductive mechanism are electrically connected to the positive and negative poles of the power supply respectively.

10. The electroplating equipment according to claim 9, characterized in that: The spray mechanism at least includes a liquid supply pipeline and a plurality of anode units; Wherein, the anode unit has a liquid outlet channel, one end of which is connected to the liquid supply pipeline, and the other end is arranged toward the transmission mechanism.

11. The electroplating equipment according to claim 10, characterized in that: The liquid circulation mechanism at least includes a liquid storage tank, a circulation pump and a circulation pipeline. The electroplating tank, the liquid storage tank and the circulation pump are connected in sequence through a plurality of circulation pipelines to form a circulating liquid loop.

12. The electroplating equipment according to claim 11, characterized in that: The transmission mechanism at least comprises a plurality of guide rollers arranged at intervals, and the plurality of anode units are arranged along the transmission direction of the transmission mechanism, and the anode unit is located in the interval between two of the guide rollers.

13. The electroplating equipment according to claim 12, characterized in that: The transmission mechanism also includes a guide roller, which is arranged on a guide roller. When the transmission mechanism is in a working state, the electroplating carrier is placed on the guide roller.

14. The electroplating equipment according to claim 13, characterized in that: The conductive mechanism at least includes a conductive track, a conductor and a conductive block; The conductive clamp is used to clamp the conductive wire, and the conductive track is slidably connected to the conductive clamp; The conductor is arranged in the conductive track, and the power supply cathode is electrically connected to the conductor; The conductive block is disposed on the conductive clamping jaw and is in contact with the conductor; When the electroplating carrier drives the conductive clamp to move along the conductive track, the conductive block transmits the electrical energy obtained by contacting the conductive body to the workpiece to be electroplated.

15. An electroplating method, using the electroplating device according to any one of claims 8 to 14, characterized in that: include: Placing the workpiece to be electroplated and the baffle in the carrying channel; placing the electroplating carrier onto the transmission mechanism; The electroplating equipment is turned on, the electroplating carrier moves along the transmission direction of the transmission mechanism, the spraying mechanism obtains the electroplating liquid from the liquid circulation mechanism, and sprays the electroplating liquid onto the electroplating carrier; The electroplating solution flows onto the workpiece to be electroplated through the guide holes of the baffle plate to complete the electroplating of the workpiece to be electroplated.

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