Heating structure for electric heating floor

Abstract

The invention discloses a heating structure for an electric heating floor. The heating structure comprises a first base material layer, an electric heating film, an electrode and a second base material layer which are sequentially stacked from bottom to top, the adhesion agent is arranged on the first substrate layer and the second substrate layer, the electrodes are arranged at two ends of a first surface of the electrothermal film, the first substrate layer is adhered to a second surface of the electrothermal film, and the second substrate layer is adhered to the first surface of the electrothermal film and the electrodes; adhering and fixing the layers through a pressing process; the electrode is connected with an external power supply and enables the electrothermal film to emit heat after being electrified; the electric heating device is characterized in that the adhesion agent generates adhesion force in the direction of penetrating through the electrode and / or the electric heating film, so that the electric heating film is in close contact with the electrode.

Description

Technical Field

[0001] The present invention relates to an electric floor heating system, and more particularly to a heating structure buried in a building floor. Background Art

[0002] like Figure 1 , a cross-sectional schematic diagram of a typical heating structure 1 of an electric heating floor, from bottom to top, a first substrate layer 2 (polyester film Polyethylene Terephthalate PET, polycarbonate film PolycarbonatePC or polypropylene film polypropylene PP, etc.), an electric heating film 3 (PTC, Positive Temperature Coefficient, heating materials such as carbon fiber cloth, silver paste electric heating film or indium tin oxide electric heating film, etc.), an electrode 4 (copper foil, etc.), and a second substrate layer 5 (polyester film Polyethylene Terephthalate PET, polycarbonate film PolycarbonatePC or polypropylene film polypropylene PP, etc.) are arranged in sequence. The layers are bonded by adhesive 6 and fixed by pressing. The electrode 4 is connected to an external power source, and the electric heating film 3 is heated when powered on.

[0003] The arrangement order is roughly as follows: the adhesive 6 is arranged on the upper surface of the first substrate layer 2 and the lower surface of the second substrate layer 5, the electrode 4 is arranged on the first surface of the electric heating film 3, the first substrate layer 2 is bonded to the second surface of the electric heating film 3 with the adhesive 6, and the second substrate layer 5 is bonded to the first surface of the electric heating film 3 and the electrode 4 with the adhesive 6. The electric heating film 3 and the electrode 4 have different thermal expansion rates and cold contraction rates, so that a microgap appears between the electric heating film 3 and the electrode 4, and the two are not in sufficient close contact, so it is easy to cause a short circuit state similar to poor circuit contact, and even sparks, which is a safety concern. Summary of the invention

[0004] The object of the present invention is to provide a heating structure for an electric heating floor to solve the above-mentioned problem.

[0005] The technical features of the present invention are as follows: a heating structure for an electric heating floor is provided, the heating structure comprising a first substrate layer, an electric heating film, an electrode and a second substrate layer stacked in sequence from bottom to top; an adhesive is arranged on the first substrate layer and the second substrate layer, the electrodes are arranged at both ends of a first surface of the electric heating film, the first substrate layer is adhered to a second surface of the electric heating film, and the second substrate layer is adhered to the first surface of the electric heating film and the electrode; each layer is adhered and fixed through a pressing process; the electrode is connected to an external power source, and the electric heating film is heated after power is turned on; wherein: the adhesive generates an adhesive force in the direction of penetrating the electrode and / or the electric heating film, so that the electric heating film is in close contact with the electrode.

[0006] Effects of the present invention:

[0007] As described in the prior art, due to the different thermal expansion rates and cold contraction rates of the electric heating film and the electrode, there is an external force that separates them, resulting in a micro gap, which leads to problems similar to poor circuit contact. However, through the present invention, the joint generates a bonding force in the direction of penetrating one or both of the electrode and the electric heating film, and the bonding force can resist the external force that separates the electric heating film from the electrode, and can normally maintain the close contact between the electric heating film and the electrode, reduce or avoid the micro gap between them, reduce or avoid the poor contact and short circuit state between the two, and improve the safety of the heating structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 A schematic cross-sectional view of a heating structure in the prior art.

[0009] Figure 2 A three-dimensional exploded schematic diagram of a heating structure according to a first embodiment of the present invention.

[0010] Figure 3 A partially enlarged cross-sectional exploded schematic diagram of a heating structure according to a first embodiment of the present invention.

[0011] Figure 4 A partially enlarged cross-sectional assembly schematic diagram of a heating structure according to a first embodiment of the present invention.

[0012] Figure 5 A partially enlarged cross-sectional exploded schematic diagram of the heating structure of the second embodiment of the present invention.

[0013] Figure 6 A partially enlarged cross-sectional assembly schematic diagram of the heating structure of the second embodiment of the present invention.

[0014] Figure 7 A partially enlarged cross-sectional exploded schematic diagram of the heating structure of the third embodiment of the present invention.

[0015] Figure 8 A partially enlarged cross-sectional assembly schematic diagram of the heating structure of the third embodiment of the present invention.

[0016] Fig. 9 A schematic three-dimensional exploded diagram of the heating structure of the fourth embodiment of the present invention.

[0017] Fig.10 A partially enlarged cross-sectional assembly schematic diagram of the heating structure of the fourth embodiment of the present invention.

[0018] Explanation of the reference numerals: 10 - heating structure; 11 - first substrate layer; 12 - second substrate layer; 20 - electric heating film; 21 - first surface; 22 - second surface; 23 - hole; 24 - hole; 30 - electrode; 31 - hole; 41 - first adhesive; 42 - second adhesive; 43 - joining part. DETAILED DESCRIPTION

[0019] In order to facilitate the description of the central idea of ​​the present invention as described in the above invention content column, it is now expressed in a specific embodiment. Various objects in the embodiments are depicted according to the proportions, sizes, deformations or displacements suitable for description, rather than being drawn according to the proportions of actual components, which should be explained in advance. Directional terms such as upper and lower are used in the following description, which are expressed according to the direction of the view and cannot be interpreted as limiting the present invention.

[0020] like Figures 2 to 4 The heating structure 10 of the present invention comprises a first substrate layer 11, an electric heating film 20, an electrode 30 and a second substrate layer 12 stacked in sequence from bottom to top. The layers are bonded by adhesive and fixed by pressing. The electrode 30 is connected to an external power source, and the electric heating film 20 is heated when powered.

[0021] The arrangement method is generally to arrange the first adhesive 41 on the upper surface of the first substrate layer 11, arrange the second adhesive 42 on the lower surface of the second substrate layer 12, arrange the electrodes 30 at both ends of the first surface 21 of the electric heating film 20, adhere the first substrate layer 11 to the second surface 22 of the electric heating film 20 with the first adhesive 41, and adhere the second substrate layer 12 to the first surface 21 of the electric heating film 20 and the electrodes 30 with the second adhesive 42. After pressing and fixing, the adjacent films and layers are adhered and fixed to each other.

[0022] The materials of the first substrate layer 11 and the second substrate layer 12 include but are not limited to polyester plastic (PET).

[0023] The electrode 30 includes but is not limited to copper foil, aluminum foil, silver foil, and carbon conductive film. The width W of the electrode 30 is greater than 5 mm.

[0024] The electric heating film 20 includes but is not limited to a fiber cloth that can conduct electricity and generate heat.

[0025] The first adhesive 41 and the second adhesive 42 include but are not limited to thermoplastic resin.

[0026] like Figures 2 to 4 , Embodiment 1:

[0027] The electrode 30 is provided with a plurality of holes 31 , and the holes 31 are circular or elongated.

[0028] During the process of pressing and fixing the heating structure 10, the second adhesive 42 melts and flows into the hole 31 of the electrode 30, and adheres to the local surface of the electric heating film 20 corresponding to the hole 31. After the second adhesive 42 is cured, a joint 43 is formed in the hole 31. The joint 43 makes the second substrate layer 12 and the electric heating film 20 and the inner wall of the hole 31 form a bonding relationship; in other words, the joint 43 makes the second substrate layer 12 and the electric heating film 20 generate a bonding force in the direction of penetrating the electrode 30. The bonding force also forms a relative tension parallel to the axis of the hole 31 for the second substrate layer 12 and the electric heating film 20, and the relative tension makes the electric heating film 20 closely contact the lower surface of the electrode 30, and the second substrate layer 12 closely contact the upper surface of the electrode 30.

[0029] As described in the prior art, due to the different thermal expansion rates and cold contraction rates of the electric heating film 20 and the electrode 30, there is an external force between the two that separates them, resulting in a micro gap and a problem similar to poor circuit contact. However, through the above-mentioned present invention, the bonding force can resist the external force that separates the electric heating film 20 from the electrode 30, and can normally maintain the close contact between the electric heating film 20 and the electrode 30, reduce or avoid the micro gap between them, reduce or avoid the poor contact short circuit state between the two, and improve the safety of the use of the heating structure 10.

[0030] like Figure 5 and Figure 6 , Embodiment 2:

[0031] A plurality of holes 23 are arranged through the electrode 30 and the electric heating film 20 , and the holes 23 are circular or long.

[0032] During the process of pressing and fixing the heating structure 10, the second adhesive 42 melts and flows into the hole 31 of the electrode 30. The first adhesive 41 melts and flows into the hole 23 of the electric heating film 20. The first adhesive 41 and the second adhesive 42 are cross-linked and solidified with each other in the plurality of holes 23, 31 to form a joint 43. The joint 43 enables the first substrate layer 11 and the second substrate layer 12 to generate bonding force in the direction of penetrating the electric heating film 20 and the electrode 30. The bonding force enables the first substrate layer 11 and the second substrate layer 12 to form relative pressure on the electrode 30 and the electric heating film 20, so that the electrode 30 and the electric heating film 20 are in close contact, thereby resisting the external force that separates the electric heating film 20 from the electrode 30, reducing or avoiding the micro gap between the two, reducing or avoiding the short circuit state of poor contact between the two, and improving the safety of the heating structure 10.

[0033] like Figure 7 and Figure 8 , Embodiment 3:

[0034] The electrothermal film 20 is provided with a plurality of holes 23 at locations corresponding to the electrodes 30 . The holes 23 are circular or elongated.

[0035] During the process of pressing and fixing the heating structure 10, the first adhesive 41 melts and flows into the hole 23 of the electric heating film 20, and adheres to the local surface of the electrode 30 corresponding to the hole 23. After the first adhesive 41 is cured, a joint 43 is formed in the hole 23. The joint 43 causes the first substrate layer 11 and the electrode 30 to generate a bonding force in the direction of penetrating the electric heating film 20. The bonding force also forms a pulling force parallel to the axis of the hole 23 for the first substrate layer 11 and the electrode 30, so that the electrode 30 is in close contact with the electric heating film 20. The bonding force can resist the above-mentioned external force that separates the electric heating film 20 from the electrode 30, and can normally maintain the close contact between the electric heating film 20 and the electrode 30, reduce or avoid the micro gap between them, reduce or avoid the short circuit state of poor contact between the two, and improve the safety of the heating structure 10.

[0036] like Fig. 9 and Fig.10 , Embodiment 4:

[0037] A plurality of holes 24 are arranged on the electrothermal film 20 at a portion where the electrode 30 is not disposed (ie, a portion of the electrothermal film 20 other than the electrode 30 ) penetrating the first surface 21 and the second surface 22 .

[0038] During the hot pressing process of the heating structure 10, the first adhesive 41 and the second adhesive 42 melt and flow into the hole 24, and crosslink and solidify to form the joint 43. The joint 43 enables the first substrate layer 11 and the second substrate layer 12 to generate bonding force in the direction of penetrating the electric heating film 20.

Claims

1. A heating structure for an electric heating floor, the heating structure comprising a first substrate layer, an electric heating film, an electrode and a second substrate layer stacked in sequence from bottom to top; a first adhesive is arranged on an upper surface of the first substrate layer, a second adhesive is arranged on a lower surface of the second substrate layer, the electrodes are arranged at both ends of a first surface of the electric heating film, the first substrate layer is adhered to a second surface of the electric heating film with the first adhesive, and the second substrate layer is adhered to the first surface of the electric heating film and the electrode with the second adhesive; the heating structure is adhered and fixed by a hot pressing process; the electrode is connected to an external power source, and the electric heating film is heated when powered on; the characteristics are: The electrode and the electric heating film are provided with a plurality of holes correspondingly therethrough; During the hot pressing process, the second adhesive melts and flows into the hole of the electrode; the first adhesive melts and flows into the hole of the electric heating film; the first adhesive and the second adhesive are cross-linked and solidified with each other in the hole of the electrode and the hole of the electric heating film to form a joint; the joint enables the first substrate layer and the second substrate layer to generate a bonding force in the direction of penetrating the electric heating film and the electrode, so that the electrode and the electric heating film are in close contact.

2. A heating structure for an electric heating floor, the heating structure comprising a first substrate layer, an electric heating film, an electrode and a second substrate layer stacked in sequence from bottom to top; a first adhesive is arranged on an upper surface of the first substrate layer, a second adhesive is arranged on a lower surface of the second substrate layer, the electrodes are arranged at both ends of a first surface of the electric heating film, the first substrate layer is adhered to a second surface of the electric heating film with the first adhesive, and the second substrate layer is adhered to the first surface of the electric heating film and the electrode with the second adhesive; the bonding is fixed by a hot pressing process; the electrode is connected to an external power source, and the electric heating film is heated when powered on; the characteristics are: The electric heating film is provided with a plurality of holes at the position corresponding to the electrode; During the hot pressing process, the first adhesive melts and flows into the hole of the electric heating film, and adheres to the local surface of the electrode corresponding to the hole; after the first adhesive is cured, a joint is formed in the hole; the joint enables the first substrate layer and the electrode to generate a bonding force in the direction of penetrating the electric heating film, so that the electrode is in close contact with the electric heating film.

3. A heating structure for an electric heating floor, the heating structure comprising a first substrate layer, an electric heating film, an electrode and a second substrate layer stacked in sequence from bottom to top; a first adhesive is arranged on an upper surface of the first substrate layer, a second adhesive is arranged on a lower surface of the second substrate layer, the electrodes are arranged at both ends of a first surface of the electric heating film, the first substrate layer is adhered to a second surface of the electric heating film with the first adhesive, and the second substrate layer is adhered to the first surface of the electric heating film and the electrode with the second adhesive; the bonding is fixed by a hot pressing process; the electrode is connected to an external power source, and the electric heating film is heated when powered on; the characteristics are: The electric heating film is provided with a plurality of holes at a position other than the electrode, penetrating through the first surface and the second surface; During the hot pressing process, the first adhesive and the second adhesive melt and flow into the hole, and are cross-linked and solidified to form a joint; the joint enables the first substrate layer and the second substrate layer to generate a bonding force in a direction of penetrating the electric heating film.

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