Imprint photomask manufacturing method

Abstract

The invention discloses a method for manufacturing an imprinting photomask. The method comprises the following steps of: providing a base material; a plurality of photomask alignment marks which are arranged at intervals are formed on the base material; and an imprint layer is formed on the inner sides of the plurality of photomask alignment marks of the base material. The surface, far away from the base material, of the imprinting layer is provided with a first pattern and a second pattern, the first pattern is provided with a first inner edge and a first outer edge which are located on the two opposite sides respectively, and the second pattern is provided with a second inner edge and a second outer edge which are located on the two opposite sides respectively. The first inner edge and the second inner edge are spaced by a long plate combining gap not larger than 50 micrometers, and the first inner edge and the second inner edge are irregular and complementary in shape. Therefore, according to the manufacturing method of the imprint photomask, the required pattern can be combined by the long plate combination gap, so that the manufacturing difficulty of the imprint photomask is effectively reduced.

Description

Technical Field

[0001] The invention relates to a manufacturing method, and in particular to an imprint mask manufacturing method. Background Art

[0002] The embossed pattern of the embossed mask manufactured by the existing embossed mask manufacturing method often needs to be composed of multiple sub-patterns; however, when the existing embossed mask is used to emboss an optical film, the gaps between the multiple sub-patterns are often transferred to the pattern embossed on the optical film, thereby generating gaps or defects visible to the naked eye, thereby affecting its subsequent application. Therefore, the inventors believe that the above defects can be improved, and have devoted themselves to research and proposed a reasonable design and effective improvement of the above defects in conjunction with the application of scientific principles. Summary of the invention

[0003] An embodiment of the present invention provides an imprint mask manufacturing method, which can effectively improve the defects that may occur in the existing imprint mask manufacturing method.

[0004] The embodiment of the present invention discloses a method for manufacturing an imprint mask, which includes: a pre-step: providing a substrate having a penetration block, an alignment block in an annular shape and surrounding the penetration block, and a non-penetrating block in an annular shape and surrounding the alignment block; wherein the substrate only allows a curing light provided by the penetration block to pass through, and the alignment block allows the alignment light to pass through, and the wavelength of the curing light is different from the wavelength of the alignment light; a mark forming step: forming a plurality of mask alignment marks spaced apart from each other in the alignment block of the substrate; and a pattern forming step: forming an imprint layer in the penetration block, and the imprint layer allows the curing light to pass through and has on a surface away from the substrate: a first pattern having a first inner edge and a first outer edge located on opposite sides respectively; and a second pattern having a second inner edge and a second outer edge located on opposite sides respectively; wherein the first inner edge and the second inner edge are spaced apart from each other by a long platemaking gap not greater than 50 microns, and the first inner edge and the second inner edge are both irregular and complementary in shape.

[0005] Optionally, in the preceding step, the curing light is an ultraviolet ray, and the alignment light is an infrared ray.

[0006] Optionally, the alignment block is in a square ring shape; in the mark forming step, a plurality of mask alignment marks are respectively formed at a plurality of corners of the alignment block.

[0007] Optionally, in the pattern forming step, the first outer edge and the second outer edge are respectively located on opposite sides of the embossing layer, and both the first outer edge and the second outer edge are irregular and complementary in shape.

[0008] Optionally, in the pattern forming step, the first pattern has a first upper side edge and a first lower side edge respectively located on two opposite sides, both of which are irregular and have shapes complementary to each other; the second pattern has a second upper side edge and a second lower side edge respectively located on two opposite sides, both of which are irregular and have shapes complementary to each other.

[0009] Optionally, one end of the first upper side edge and one end of the first lower side edge are respectively connected to the two ends of the first inner edge, and the other end of the first upper side edge and the other end of the first lower side edge are respectively connected to the two ends of the first outer edge; one end of the second upper side edge and one end of the second lower side edge are respectively connected to the two ends of the second inner edge, and the other end of the second upper side edge and the other end of the second lower side edge are respectively connected to the two ends of the second outer edge.

[0010] Optionally, in the pattern forming step, the first pattern and the second pattern each include a plurality of irregularly arranged reflective embossed portions, and the reflective embossed portions have the same appearance.

[0011] Optionally, in the pattern forming step, in any one of the first pattern and the second pattern, each reflective embossed portion has a plurality of reflective embossed areas arranged in a matrix, the reflective embossed portions reflect along the same direction, and the reflective directions of the plurality of reflective embossed portions are irregularly arranged.

[0012] Optionally, in the pattern forming step, two ends of the first outer edge and two ends of the second outer edge are respectively adjacent to a plurality of mask alignment marks.

[0013] Optionally, in the pattern forming step, the embossing layer is formed by irradiating a photoresist layer with an exposure ultraviolet ray through a mask or interference, and the preset exposure wavelength of the exposure ultraviolet ray falls outside the preset photocuring band of the curing light, and the elongated platemaking gap is no greater than 30 microns.

[0014] In summary, the method for manufacturing an imprint mask disclosed in the embodiment of the present invention can combine the elongated plate-forming gaps to form a desired pattern, thereby effectively reducing the manufacturing difficulty of the imprint mask and can be used for transfer printing to form a unit film layer in which the plate-forming gaps cannot be observed with the naked eye.

[0015] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, these descriptions and drawings are only used to illustrate the present invention and are not intended to limit the protection scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional schematic diagram of the preparation steps of the method for manufacturing a plate-type optical film (or the method for manufacturing an imprinting mask) according to the first embodiment of the present invention.

[0017] Figure 2 for Figure 1 An enlarged schematic diagram of region II.

[0018] Figure 3 It is a three-dimensional schematic diagram of a plate-forming imprinting device according to the first embodiment of the present invention.

[0019] Figures 4 to 6 It is a schematic plan view of the embossing and curing step of the method for manufacturing a group-type optical film according to the first embodiment of the present invention.

[0020] Figure 7 It is a partial top view schematic diagram of the modular optical film according to the first embodiment of the present invention.

[0021] Figure 8 for Figure 7 Schematic enlargement of region VIII.

[0022] Fig. 9 It is a three-dimensional schematic diagram of the preparation steps of the method for manufacturing a plate-type optical film (or the method for manufacturing an imprinting mask) according to the second embodiment of the present invention.

[0023] Fig.10 It is a partial top view schematic diagram of the modular optical film according to the second embodiment of the present invention. DETAILED DESCRIPTION

[0024] The following is an explanation of the implementation of the "imprint mask manufacturing method" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, it should be noted in advance that the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual sizes. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0025] It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component or one signal from another signal. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.

[0026] [Example 1]

[0027] See also Figures 1 to 8This embodiment discloses a method for manufacturing a modular optical film, which includes a preparation step S100 and an imprinting and curing step S300. To facilitate understanding of this embodiment, the preparation step S100 and the imprinting and curing step S300 will be described below.

[0028] The preparation step S100: Figure 1 and Figure 2 As shown, an imprint mask 1 is provided. The preparation step S100 in this embodiment can also be regarded as an imprint mask manufacturing method, which includes a pre-step, a mark forming step, and a pattern forming step.

[0029] The pre-processing step is to provide a substrate 11, which is described as a flat plate in this embodiment, but the present invention is not limited thereto. The substrate 11 has a penetration block 111, an alignment block 112 in an annular shape surrounding the penetration block 111, and a non-penetration block 113 in an annular shape surrounding the alignment block 112.

[0030] Specifically, the substrate 11 only allows the curing light L (eg, Figure 5 That is, the curing light L cannot pass through the alignment block 112 and the non-penetrating block 113. Furthermore, the alignment block 112 is in a square ring shape in this embodiment and can provide a alignment light IR (such as: Figure 4 The infrared light shown in the figure passes through, the alignment light IR preferably cannot pass through the non-penetrating block 113, and the wavelength of the curing light L is different from the wavelength of the alignment light IR.

[0031] The mark forming step: forming a plurality of mask alignment marks 12 spaced apart from each other in the alignment block 112 of the substrate 11, and the plurality of mask alignment marks 12 are described in this embodiment as being formed at a plurality of corners of the alignment block 112. Each of the mask alignment marks 12 may be in a cross shape to facilitate alignment in two directions perpendicular to each other, but the present invention is not limited thereto.

[0032] The pattern forming step: forming an imprint layer 13 in the penetration block 111, and the imprint layer 13 can allow the curing light L to pass through and has a unit pattern 130 on the surface away from the substrate 11. In this embodiment, the imprint layer 13 is formed by irradiating a photoresist layer with an exposure ultraviolet UV through a mask M or interference, and the preset exposure wavelength of the exposure ultraviolet UV falls within the curing light L (e.g.: Figure 5). For example, the preset exposure wavelength may be 190 nm to 250 nm, and the preset photocuring wavelength differs from the preset exposure wavelength by at least 100 nm (e.g., the preset photocuring wavelength is 350 nm to 410 nm).

[0033] In more detail, the outline of the unit pattern 130 is generally square (e.g., rectangular or square), but the edge of the unit pattern 130 is irregular. The unit pattern 130 has a first outer edge 131 and a second outer edge 132 located on opposite sides, and an upper side edge 133 and a lower side edge 134 located on other opposite sides. Furthermore, both ends of the first outer edge 131 and both ends of the second outer edge 132 are respectively adjacent to the plurality of mask alignment marks 12. That is, the imprint mask 1 is formed with a plurality of mask alignment marks 12 on the outer side of the imprint layer 13.

[0034] The first outer edge 131 and the second outer edge 132 are located at opposite outer sides of the embossed layer 13 along a first direction D1, and the first outer edge 131 and the second outer edge 132 are both irregular and complementary in shape. Furthermore, the upper edge 133 and the lower edge 134 are located at opposite outer sides of the embossed layer 13 along a second direction D2 perpendicular to the first direction D1, and the upper edge 133 and the lower edge 134 are both irregular and complementary in shape, but not limited thereto. For example, in other embodiments not shown in the present invention, the unit pattern 130 may also adopt the upper edge 133 and the lower edge 134 of regular shape according to the requirements.

[0035] It should be noted that the unit pattern 130 in this embodiment includes a plurality of irregularly arranged reflective embossed portions 135, which have the same appearance. Each of the reflective embossed portions 135 has a plurality of reflective embossed areas 1351 arranged in a matrix, which can reflect light in the same direction, and the reflective directions of the plurality of reflective embossed portions 135 are irregularly arranged. That is, when the plurality of reflective embossed portions 135 are irradiated by visible light, they can reflect and form a variety of colors.

[0036] Furthermore, each of the reflective embossed portions 135 is circular, and the multiple reflective embossed portions 135 of the unit pattern 130 are overlapped with each other, so that the first outer edge 131, the second outer edge 132, the upper edge 133, and the lower edge 134 are each composed of arc edges of multiple reflective embossed portions 135.

[0037] The above is a description of the technical content of the preparation step S100 (or the imprint mask manufacturing method) in this embodiment; that is, this embodiment is equivalent to disclosing an imprint mask 1 in the above description, which has an irregular structure different from the previous ones. The technical content of the imprint curing step S300 is then introduced.

[0038] The imprint curing step S300: Figures 3 to 6 As shown, a plurality of adhesive layers 3a spaced apart from each other and having uniform thickness are formed on a carrier 2, and the plurality of adhesive layers 3a are sequentially embossed and cured by the embossing layer 13 of the embossing mask 1, thereby forming a plurality of unit film layers 3. In this embodiment, the plurality of adhesive layers 3a are illustrated as a plurality of light-cured adhesive layers formed by coating or spraying, which can be cured by irradiation of the curing light L; the plurality of unit film layers 3 are spaced apart from each other and formed on the carrier 2 and together form a set of format optical films 200.

[0039] In more detail, the carrier 2 is described as a flat sheet structure in this embodiment, and the carrier 2 has a plurality of carrier alignment marks 21 arranged at intervals, but the present invention is not limited thereto. In the imprint curing step S300, each of the adhesive layers 3a is substantially formed within the area surrounded by the four carrier alignment marks 21 (that is, any one of the unit film layers 3 is disposed within the area surrounded by the four carrier alignment marks 21), and the plurality of carrier alignment marks 21 are not shielded by the plurality of adhesive layers 3a.

[0040] Specifically, in the imprint curing step S300, the imprint mask 1 is aligned with at least two of the carrier alignment marks 21 located next to any one of the adhesive layers 3a along a height direction H perpendicular to the first direction D1 and the second direction D2 using a plurality of the mask alignment marks 12, and then the imprint layer 13 is subjected to the imprint curing operation along the height direction H, thereby enabling the plurality of the unit film layers 3 to be precisely formed at default positions while maintaining default intervals and having substantially the same appearance.

[0041] In addition, if Figure 1 , Figure 7 ,and Figure 8As shown, the following will introduce the assembled optical film 200 formed after the assembly optical film manufacturing method of this embodiment is implemented; that is, this embodiment is equivalent to disclosing a assembled optical film 200 in the following description, which has an irregular structure different from the previous one. Among them, the multiple unit film layers 3 of the assembled optical film 200 are described as being arranged in a matrix, but the present invention is not limited to this. For example, in other embodiments not shown in the present invention, the multiple unit film layers 3 can also be arranged in a row along the first direction D1.

[0042] In this embodiment, each of the unit film layers 3 includes a first outer edge 31 and a second outer edge 32 located on opposite sides, which are respectively embossed by the first outer edge 131 and the second outer edge 132 of the unit pattern 130, so that the first outer edge 31 and the second outer edge 32 are both irregular and complementary in shape. Furthermore, each of the unit film layers 3 also has an upper side edge 33 and a lower side edge 34 located on other opposite sides, which are respectively embossed by the upper side edge 133 and the lower side edge 134 of the unit pattern 130, so that the upper side edge 33 and the lower side edge 34 are both irregular and complementary in shape.

[0043] Furthermore, each of the unit film layers 3 includes a plurality of irregularly arranged reflective portions 35, which are formed by the unit pattern 130 of the embossed layer 13 and have the same appearance. That is, in each of the unit film layers 3 of this embodiment, each of the reflective portions 35 has a plurality of reflective areas 351 arranged in a matrix, which reflect light in the same direction, and the reflective directions of the plurality of reflective portions 35 are irregularly arranged. That is, when the plurality of reflective portions 35 are irradiated by visible light, they can reflect to form a variety of colors.

[0044] Furthermore, each of the reflective portions 35 is circular in the present embodiment, and the multiple reflective portions 35 of each of the unit film layers 3 are overlapped with each other, so that the first outer edge 31, the second outer edge 32, the upper side edge 33 and the lower side edge 34 of each of the unit film layers 3 are each composed of the arc edges of the multiple reflective portions 35.

[0045] From another perspective, among the two unit film layers 3 adjacent to each other along the first direction D1, the first outer edge 31 of one of the unit film layers 3 is adjacent to the second outer edge 32 of the other unit film layer 3 (and have irregular shapes complementary to each other) and are separated by a first gap G1 of no more than 50 microns. Furthermore, among the two unit film layers 3 adjacent to each other along the second direction D2, the upper side edge 33 of one of the unit film layers 3 is adjacent to the lower side edge 34 of the other unit film layer 3 along the second direction D2 (and have irregular shapes complementary to each other) and are separated by a second gap G2 of no more than 50 microns.

[0046] That is, the plurality of carrier alignment marks 21 are exposed in the plurality of first gaps G1 and the plurality of second gaps G2 between the plurality of unit film layers 3. In this embodiment, the plurality of first gaps G1 and the plurality of second gaps G2 are interconnected and generally present a chessboard shape, and any one of the first gaps G1 and the second gaps G2 is preferably not greater than 30 microns, but is not limited thereto.

[0047] In addition, if Figure 1 , Figures 3 to 6 As shown, this embodiment also discloses a group plate type imprinting device 100, and the group plate type optical film manufacturing method can be implemented by the group plate type imprinting device 100, but the present invention is not limited thereto. That is to say, the group plate type optical film manufacturing method can also be implemented by other devices. In addition, the group plate type imprinting device 100 in this embodiment is used to manufacture and form the group plate type optical film 200 as described above, so the specific structure of the group plate type optical film 200 will not be repeated in the following description.

[0048] The plate-forming imprinting device 100 in this embodiment comprises a workbench 4, a displacement mechanism 5 disposed on the workbench, a coating mechanism 6 disposed corresponding to the workbench 4, the imprinting mask 1 connected to the displacement mechanism 5 and a camera mechanism 7, and a curing light source 8 connected to the displacement mechanism 5 and disposed corresponding to the imprinting mask 1. In this embodiment, the specific structure of the imprinting mask 1 is as described in the content of the plate-forming optical film manufacturing method described above, so it will not be repeated in the following description.

[0049] It should be noted that the group plate type imprinting device 100 is described in this embodiment by combining the above-mentioned multiple components, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the camera mechanism 7 and / or the curing light source 8 may also be omitted or replaced by other components.

[0050] The workbench 4 is used for placing the carrier 2 , and the specific structure of the carrier 2 is roughly the same as that described in the above-mentioned method for manufacturing the assembly type optical film, so it will not be repeated in the following description.

[0051] The displacement mechanism 5 can move relative to the workbench 4 along the mutually orthogonal height direction H, the first direction D1 and the second direction D2. Furthermore, the coating mechanism 6 is installed on the displacement mechanism 5 in this embodiment, and can be driven by the displacement mechanism 5 to sequentially form a plurality of adhesive layers 3a spaced from each other and having uniform thickness on the carrier 2, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the operation of the coating mechanism 6 can also be independent of the displacement mechanism 5.

[0052] It should be noted that the coating mechanism 6 accurately forms the multiple glue layers 3a by coating or spraying in a manner different from dispensing, so that each glue layer 3a has a uniform thickness and is formed within the area surrounded by the four carrier alignment marks 21 and does not cover any of the carrier alignment marks 21.

[0053] In addition, the imprint mask 1, the imaging mechanism 7 and the curing light source 8 can be synchronously moved by the displacement mechanism 5. The imprint mask 1 can also be relatively moved along the height direction H relative to the imaging mechanism 7 and the curing light source 8, but the present invention is not limited thereto.

[0054] Thus, the group type imprinting device 100 can use the camera mechanism 7 to make the multiple mask alignment marks 12 of the imprinting mask 1 align with at least two carrier alignment marks 21 located next to any one of the adhesive layers 3a along the height direction H, and then drive the imprinting mask 1 to be imprinted along the height direction H through the displacement mechanism 5, so that the multiple adhesive layers 3a are imprinted in sequence and each forms a unit film layer 3. The curing light source 8 can be used to emit the curing light L toward the substrate 11 of the imprinted mask 1 to pass through the penetration block 111 and the imprinting layer 13, thereby curing the unit film layer 3.

[0055] As described above, the method for manufacturing the composite optical film or the composite imprinting device 100 in this embodiment can manufacture the composite optical film 200 through the structure of the imprinting mask 1 (e.g., the first outer edge 131 and the second outer edge 132 having an irregular shape and complementary shapes) and other components or steps matched therewith, so that the first gap G1 is formed by the first outer edge 31 and the second outer edge 32 having an irregular shape and complementary shapes with a specific size (e.g., not greater than 50 microns) between any two adjacent unit film layers 3 of the composite optical film 200, thereby making it impossible for a user to observe the first gap G1 with the naked eye. On the other hand, if the gap is defined by two regular edges, the size of the gap needs to be at least less than 5 microns to make it difficult for the naked eye to directly observe it.

[0056] That is to say, Figure 1 , Figure 7 and Figure 8 As shown, the structure of the assembled optical film 200 provided in this embodiment is different from that in the past, which is more convenient for production and manufacturing and can effectively improve its application range. In other words, the imprint mask 1 or the manufacturing method thereof provided in this embodiment can form the assembled optical film 200 in which the first gap G1 (and the second gap G2) cannot be observed by naked eyes with a relatively low manufacturing difficulty.

[0057] [Example 2]

[0058] See also Fig. 9 and Fig.10 As shown, it is the second embodiment of the present invention. Since this embodiment is similar to the above-mentioned first embodiment, the similarities between the two embodiments are not repeated here, and the difference between this embodiment and the above-mentioned first embodiment is mainly that the unit pattern 130 of the imprint mask 1 in this embodiment (e.g., in the pattern forming step) is formed with a first pattern 130-1 and a second pattern 130-2 arranged at intervals from each other, so that each of the unit film layers 3 is also correspondingly formed with two sub-blocks 30 arranged at intervals.

[0059] In more detail, the first pattern 130-1 has the first outer edge 131 and a first inner edge 136 located at opposite sides (along the first direction D1), and the second pattern 130-2 has the second outer edge 132 and a second inner edge 137 located at opposite sides (along the first direction D1). The first inner edge 136 and the second inner edge 137 are both irregular and complementary in shape, and the first inner edge 136 and the second inner edge 136 are adjacent to each other and separated by an elongated plate-setting gap S13 of not more than 50 microns along the first direction D1. The elongated plate-setting gap S13 is preferably not more than 30 microns and its long axis direction is not parallel to (e.g., substantially perpendicular to) the first direction D1.

[0060] The first pattern 130-1 has a first upper edge 133-1 and a first lower edge 134-1 located on two opposite sides, both of which are irregular and complementary in shape. One end of the first upper edge 133-1 and one end of the first lower edge 134-1 are connected to two ends of the first inner edge 136, respectively, and the other end of the first upper edge 133-1 and the other end of the first lower edge 134-1 are connected to two ends of the first outer edge 131, respectively.

[0061] The second pattern 130-2 has a second upper edge 133-2 and a second lower edge 134-2 located on the other opposite sides, both of which are irregular and complementary in shape. One end of the second upper edge 133-2 and one end of the second lower edge 134-2 are connected to the two ends of the second inner edge 137, respectively, and the other end of the second upper edge 133-2 and the other end of the second lower edge 134-2 are connected to the two ends of the second outer edge 132, respectively.

[0062] That is, in this embodiment, the upper edge 133 is divided into the first upper edge 133-1 and the second upper edge 133-2 by the long typesetting slit S13, and the lower edge 134 is divided into the first upper edge 133-1 and the second upper edge 133-2 by the long typesetting slit S13. In addition, in other embodiments not shown in the present invention, the unit pattern 130 can also be divided into more than three patterns according to needs.

[0063] Furthermore, in this embodiment, the first pattern 130-1 and the second pattern 130-2 each include a plurality of reflective embossed portions 135 that are irregularly arranged and have the same appearance, each of which has a plurality of reflective embossed areas (not shown in the figure) that are arranged in a matrix and reflect in the same direction, and the reflecting directions of the plurality of reflective embossed portions 135 are irregularly arranged.

[0064] The above is a description of the differences between the embossing layer 13 of this embodiment and that of the first embodiment. The differences between the assembly type optical film 200 embossed by the embossing layer 13 of this embodiment (through the embossing curing step S300 ) and that of the first embodiment will be described below.

[0065] Specifically, each of the unit film layers 3 has a first inner edge 36 and a second inner edge 37 disposed adjacent to each other, the first outer edge 31 and the second outer edge 32 located at opposite sides (along the first direction D1), and an upper side edge 33 and a lower side edge 34 located at other opposite sides (along the second direction D2). The first inner edge 36 and the second inner edge 37 are both irregular and complementary in shape, the first outer edge 31 and the second outer edge 32 are both irregular and complementary in shape, and the upper side edge 33 and the lower side edge 34 are both irregular and complementary in shape.

[0066] In each of the unit film layers 3, the first inner edge 36 and the second inner edge 37 are respectively formed by embossing the first inner edge 136 and the second inner edge 137 of the unit pattern 130, and are separated from each other by a set of plate gaps S3 not greater than 50 microns. The set of plate gaps S3 is preferably not greater than 30 microns and its long axis direction is not parallel to (e.g., substantially perpendicular to) the first direction D1.

[0067] That is, the upper side edge 33 and the lower side edge 34 are each divided into two separate sections by the panel gap S3 in this embodiment, and are respectively located in two sub-blocks 30, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the unit film layer 3 can also be divided into more than three sub-blocks 30 according to needs.

[0068] In addition, the specific structure of each unit film layer 3 (such as the reflective portion 35 or the multiple reflective areas contained therein), and the first gap G1 or the second gap G2 formed by any two adjacent unit film layers 3 along the first direction D1 or the second direction D2 are the same as those in the first embodiment, and are not described in detail here. It should be noted that any of the panel gaps S3 is connected to two of the second gaps G2.

[0069] As described above, the plate-type optical film manufacturing method or the plate-type imprinting device 100 in this embodiment can manufacture the plate-type optical film 200 through the structure of the imprinting mask 1 (such as: the first inner edge 136 and the second inner edge 137 having irregular shapes and complementary shapes) and other matching components or steps, thereby making any of the unit film layers 3 of the plate-type optical film 200 form the plate-type gap S3 that cannot be observed by the user with the naked eye, thereby facilitating the production of the imprinting mask 1.

[0070] In other words, the plate-forming optical film 200 provided in this embodiment has a different structure from the conventional one, which is more conducive to the production and manufacturing of the embossed mask 1, and further facilitates its promotion and mass production. Furthermore, the embossed mask 1 or its manufacturing method provided in this embodiment can combine the unit pattern 130 with the long plate-forming slit S13, thereby effectively reducing the manufacturing difficulty of the embossed mask 1, and can be used to form the unit film layer 3 in which the plate-forming slit S3 cannot be observed with the naked eye.

[0071] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention's specification and drawings are included in the patent scope of the present invention.

Claims

1. A method for manufacturing an imprint mask, characterized in that: The method for manufacturing an imprint mask comprises: A pre-step: providing a substrate, the substrate having a penetrating block, an annular aligning block surrounding the penetrating block, and an annular non-penetrating block surrounding the aligning block; wherein the substrate only allows a curing light provided by the penetrating block to pass through, and the aligning block allows the aligning light to pass through, and the wavelength of the curing light is different from the wavelength of the aligning light; a mark forming step: forming a plurality of mask alignment marks spaced apart from each other in the alignment area of ​​the substrate; and a pattern forming step: forming an imprint layer on the penetration block, and the imprint layer can allow the curing light to pass through and has: a first pattern on a surface away from the substrate, with a first inner edge and a first outer edge located on opposite sides respectively; and A second pattern has a second inner edge and a second outer edge located on opposite sides respectively; wherein the first inner edge and the second inner edge are separated from each other by an elongated platemaking gap not greater than 50 microns, and the first inner edge and the second inner edge are both irregular and complementary in shape.

2. The method for manufacturing an imprint mask according to claim 1, wherein: In the preceding step, the curing light is an ultraviolet ray, and the alignment light is an infrared ray.

3. The method for manufacturing an imprint mask according to claim 1, wherein: The alignment block is in a square ring shape; in the mark forming step, a plurality of mask alignment marks are respectively formed at a plurality of corners of the alignment block.

4. The method for manufacturing an imprint mask according to claim 1, wherein: In the pattern forming step, the first outer edge and the second outer edge are respectively located on opposite sides of the embossing layer, and the first outer edge and the second outer edge are both irregular and complementary in shape.

5. The method for manufacturing an imprint mask according to claim 4, wherein: In the pattern forming step, the first pattern has a first upper side edge and a first lower side edge respectively located on two opposite sides, the first upper side edge and the first lower side edge are both irregular and complementary in shape; the second pattern has a second upper side edge and a second lower side edge respectively located on two opposite sides, the second upper side edge and the second lower side edge are both irregular and complementary in shape.

6. The method for manufacturing an imprint mask according to claim 5, wherein: One end of the first upper side edge and one end of the first lower side edge are respectively connected to the two ends of the first inner edge, and the other end of the first upper side edge and the other end of the first lower side edge are respectively connected to the two ends of the first outer edge; one end of the second upper side edge and one end of the second lower side edge are respectively connected to the two ends of the second inner edge, and the other end of the second upper side edge and the other end of the second lower side edge are respectively connected to the two ends of the second outer edge.

7. The method for manufacturing an imprint mask according to claim 1, wherein: In the pattern forming step, each of the first pattern and the second pattern includes a plurality of irregularly arranged reflective embossed portions, and the plurality of reflective embossed portions have the same appearance.

8. The method for manufacturing an imprint mask according to claim 7, wherein: In the pattern forming step, in any one of the first pattern and the second pattern, each of the reflective embossed portions has a plurality of reflective embossed areas arranged in a matrix, the plurality of reflective embossed portions reflect along the same direction, and the reflective directions of the plurality of reflective embossed portions are irregularly configured.

9. The method for manufacturing an imprint mask according to claim 1, wherein: In the pattern forming step, two ends of the first outer edge and two ends of the second outer edge are respectively adjacent to a plurality of the mask alignment marks.

10. The method for manufacturing an imprint mask according to claim 1, wherein: In the pattern forming step, the embossing layer is formed by irradiating a photoresist layer with an exposure ultraviolet ray through a mask or interference, and the preset exposure wavelength of the exposure ultraviolet ray falls outside the preset light curing band of the curing light, and the elongated platemaking gap is no larger than 30 microns.

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