Uniform temperature and pressure field reconstruction system of deep in-situ environment simulation cabin and control method of uniform temperature and pressure field reconstruction system

Abstract

The invention discloses a deep in-situ environment simulation cabin uniform temperature and pressure field reconstruction system and a control method thereof.The system comprises a heating and heat preservation belt, a temperature sensor and a control system, the heating and heat preservation belt is connected to the outer wall of a deep in-situ environment simulation cabin, the temperature sensor is installed on the heating and heat preservation belt, and the control system is connected with the control system; the deep in-situ environment simulation cabin is also internally provided with the temperature sensor, the temperature sensor and the heating and heat preservation belt are respectively connected with the control system, and the deep in-situ environment simulation cabin is internally provided with a temperature medium. By implementing the system, the problems existing in the prior art can be solved, efficient and uniform deep in-situ environment temperature field reconstruction is achieved, multi-point temperature control capable of being remotely operated is provided, the uniformity and stability of a reconstructed temperature field are ensured, and the system is suitable for an ultrahigh-pressure high-temperature environment.

Description

Technical Field

[0001] The present invention relates to the technical field of temperature control systems, and in particular to a uniform temperature and pressure field reconstruction system for a deep in-situ environment simulation chamber and a control method thereof. Background Art

[0002] The deep earth environment is characterized by ultra-high pressure and high temperature. For example, the temperature and pressure environment at 3,000 meters underground can reach 100°C and 100MPa or more. However, existing rock mechanics research is mainly based on "ordinary rock samples" in shallow environments, or experiments are conducted under distorted conditions of the occurrence environment. The data obtained are significantly different from the actual conditions of the deep environment.

[0003] The cores taken from deep need to reconstruct the in-situ temperature and pressure environment in the ground laboratory. After a series of treatments, they are sealed and stored in a separate fidelity loading test chamber for further experimental testing. In order to maintain the temperature and pressure environment of the separate fidelity loading test chamber during the transfer and loading experiments, Chinese patent CN117075652B mentions a temperature and pressure decoupling control method based on a water medium isodensity curve diagram. Based on the decoupling concept of this patent, a method is proposed to maintain the stability of the temperature and pressure field in the closed chamber by keeping the temperature field unchanged. Therefore, the reconstruction of a uniform temperature field becomes a key issue.

[0004] Existing heating methods such as electromagnetic heating and microwave radiation heating are prone to introduce electromagnetic waves from non-original environments and have restrictions on the shape of the heated object. Methods such as heat transfer oil and high-temperature hot air have long heating times and large equipment volumes, making them inconvenient to disassemble and transport. Although electric heating has the advantages of low cost, flexible installation, and high heating efficiency, traditional electric heating methods have uneven temperature distribution due to uneven current distribution or unreasonable layout of heating elements. Current temperature measurement and control instruments for electric heating have low measurement and control accuracy and can only detect single-point temperature, making them unsuitable for ultra-high pressure and high temperature environments.

[0005] Therefore, it is necessary to design a new system to solve the problems existing in the existing technology and realize efficient and uniform reconstruction of the deep in-situ environmental temperature field, and provide multi-point temperature control that can be remotely operated to ensure the uniformity and stability of the reconstructed temperature and pressure field, which is suitable for ultra-high pressure and high temperature environments. Summary of the invention

[0006] The purpose of the present invention is to overcome the defects of the prior art and provide a uniform temperature and pressure field reconstruction system for a deep in-situ environmental simulation chamber and a control method thereof.

[0007] To solve the above technical problems, the objective of the present invention is achieved through the following technical solutions: providing a uniform temperature and pressure field reconstruction system for a deep in-situ environmental simulation chamber, comprising: a heating and insulation belt, a temperature sensor and a control system, wherein the heating and insulation belt is connected to the outer wall of the deep in-situ environmental simulation chamber, the temperature sensor is installed on the heating and insulation belt, the temperature sensor is also installed in the deep in-situ environmental simulation chamber, the temperature sensor and the heating and insulation belt are respectively connected to the control system, and a temperature medium is provided in the deep in-situ environmental simulation chamber.

[0008] A further technical solution is as follows: thermal conductive silicone grease is coated between the heating and insulation belt and the outer wall of the deep in-situ environment simulation chamber.

[0009] Its further technical solution is: the heating and insulation belt includes an insulation belt body, insulation cotton, steel bars and an electric heating plate, the insulation belt body is filled with the insulation cotton, the steel bars are located in the insulation belt body, and the electric heating plate is located on one side of the insulation belt body close to the deep in-situ environment simulation chamber.

[0010] Its further technical solution is: the control system includes an industrial computer, a control module, a temperature measurement module, a solid-state relay, and a communication module, the communication module is respectively connected to the industrial computer, the control module and the temperature measurement module, and the solid-state relay is connected to the electric heating plate;

[0011] The temperature measurement module is used to measure the resistance value of the temperature sensor, calculate the temperature value, send the temperature value to the industrial computer, and receive the temperature target value set by the industrial computer;

[0012] The industrial computer is used to receive the temperature values ​​of each temperature measuring point sent by the temperature measuring module, draw a temperature change curve, calculate and send the duty cycle for controlling the periodic conduction of the solid-state relay, and set the temperature control parameters;

[0013] The control module is used to receive the duty cycle calculated by the industrial computer and convert the duty cycle into a control signal of the solid-state relay, so as to control the working state of the solid-state relay through the control signal, and further control the working state of the electric heating plate.

[0014] A further technical solution is: the control system also includes a display module, and the display module is connected to the temperature measurement module.

[0015] Its further technical solution is: the control system also includes a circuit breaker, a contactor, a knob switch, an emergency stop switch, a switching power supply module and an indicator light; the circuit breaker is connected to the contactor and the knob switch respectively; the emergency stop switch is connected to the contactor and the knob switch respectively; the contactor is connected to the indicator light, the switching power supply module and the solid-state relay respectively; the auxiliary power supply module is connected to the communication module.

[0016] Its further technical solution is: the temperature measurement module includes an auxiliary power supply module, a first communication module, an AD conversion module, a temperature measurement single-chip computer module and a channel selection module, the auxiliary power supply module is respectively connected to the channel selection module and the AD conversion module; the channel selection module is connected to the AD conversion module; the AD conversion module is connected to the temperature measurement single-chip computer, the temperature measurement single-chip computer is connected to the first communication module, and the first communication module is connected to the communication module.

[0017] Its further technical solution is: the control module includes a control microcontroller, a second communication module and a plug-in terminal, the second communication module and the plug-in terminal are respectively connected to the control microcontroller; the second communication module is connected to the communication module, and the plug-in terminal is connected to the solid-state relay.

[0018] Its further technical solution is: the communication module includes a first communication conversion module and a second communication conversion module, the first communication conversion module is used to convert the XH2.54 electrical interface used for 485 communication of the temperature measurement module and the control module into an RJ45 electrical interface; the second communication conversion module is used to convert the two 485 differential signals transmitted by the RJ45 electrical interface of the temperature measurement module and the control module into one USB differential signal, and connect to the industrial computer through the USB interface.

[0019] In addition, in order to overcome the defects of the prior art, the present invention also provides a control method performed by the above-mentioned deep in-situ environment simulation chamber uniform temperature and pressure field reconstruction system, comprising:

[0020] Set the target temperature of the temperature medium and the upper limit temperature of the heating and insulation belt;

[0021] Start the electric heating plate to gradually increase the temperature of the heating and insulation belt. When the actual temperature of the temperature medium does not reach 5% of the target temperature, keep the heating and insulation temperature at the set upper limit temperature;

[0022] When the actual temperature of the temperature medium reaches 5% of the target temperature, the heating and insulation belt starts to cool down until the temperature of the heating and insulation belt approaches the temperature of the temperature medium;

[0023] In the process of keeping the temperature of the temperature medium constant, the heating and insulation belt dynamically adjusts the output power according to the duty cycle, and the heating and insulation belt compensates the lost heat to the deep in-situ environment simulation chamber, so that the temperature of the temperature medium remains constant.

[0024] Compared with the prior art, the present invention has the following beneficial effects: the present invention installs a heating and insulation belt on the outer wall of the deep in-situ environment simulation cabin, and sets temperature sensors on the heating and insulation belt and multiple positions in the cabin to monitor temperature changes in real time to ensure the uniformity of the heating process. The temperature sensor is connected to the control system and can automatically adjust the power output of the heating and insulation belt according to the temperature data to accurately control the temperature in the cabin. A multi-point temperature control system is designed to ensure uniform temperature distribution at different positions, thereby constructing a stable temperature field. The design of the heating and insulation belt ensures high heating efficiency and uniform temperature distribution, and adapts to the requirements of deep high-pressure environments. The multi-point control module improves the operability and safety of the system, enabling it to achieve efficient and stable temperature control under extremely high temperature and high pressure conditions.

[0025] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0027] Figure 1 A schematic cross-sectional view of a structural diagram of a uniform temperature and pressure field reconstruction system for a deep in-situ environmental simulation chamber provided by an embodiment of the present invention;

[0028] Figure 2 A schematic diagram of the cross-sectional structure of a heating and heat-insulating belt provided in an embodiment of the present invention;

[0029] Figure 3 A schematic block diagram of the structure of a control system provided by an embodiment of the present invention;

[0030] Figure 4 A schematic block diagram of the structure of a temperature measurement module provided in an embodiment of the present invention;

[0031] Figure 5 A specific circuit schematic diagram of the temperature measurement module provided by an embodiment of the present invention;

[0032] Figure 6 A schematic block diagram of the structure of a control module provided in an embodiment of the present invention;

[0033] Figure 7A specific circuit schematic diagram of a control module provided by an embodiment of the present invention;

[0034] Figure 8 A specific circuit schematic diagram of the second communication conversion module provided in an embodiment of the present invention;

[0035] Fig. 9 A schematic diagram of the temperature control principle provided by an embodiment of the present invention;

[0036] Fig.10 A schematic flow chart of a control method for a uniform temperature and pressure field reconstruction system for a deep in-situ environmental simulation chamber provided by an embodiment of the present invention;

[0037] Description of the symbols in the figure:

[0038] 10. Heating and insulation belt; 11. Insulation cotton; 12. Steel bar; 13. Electric heating plate; 20. Temperature sensor; 30. Deep in-situ environment simulation chamber; 40. Temperature medium; 50. Industrial computer; 60. Circuit breaker; 70. Contactor; 80. Knob switch; 90. Emergency stop switch; 100. Indicator light; 110. Solid-state relay; 120. Switching power supply module; 130. Control module; 131. Control single-chip microcomputer; 132. Second communication module; 133. Plug-in terminal block; 140. Temperature measurement module; 141. Auxiliary power supply module; 142. First communication module; 143. AD conversion module; 144. Temperature measurement single-chip microcomputer module; 145. Channel selection module; 150. Display module; 160. Communication module. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0041] It should also be understood that the terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in the specification of the present invention and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0042] It should be further understood that the term "and / or" used in the present description and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0043] Existing heating methods such as electromagnetic heating and microwave radiation heating are prone to introduce non-in-situ environmental electromagnetic waves and have restrictions on the shape of the heating object; the heat transfer oil and high-temperature hot air methods take a long time to heat up and the equipment is bulky, making it inconvenient to disassemble and transport; although traditional electric heating methods have the advantages of low cost, flexible installation and efficient heating, due to uneven current distribution or unreasonable layout of heating elements, the temperature distribution is uneven and the measurement and control accuracy is low, which cannot meet the needs of ultra-high pressure and high temperature environments.

[0044] To this end, an embodiment of the present invention provides a uniform temperature field reconstruction system for a deep in-situ environmental simulation chamber 30 and a control method thereof, which solves the problems existing in the prior art and realizes efficient and uniform reconstruction of the deep in-situ environmental temperature field, and provides multi-point temperature control that can be remotely operated to ensure the uniformity and stability of the reconstructed temperature and pressure field, and is suitable for ultra-high pressure and high temperature environments.

[0045] Specifically, the embodiment of the present invention adopts a heating and heat preservation belt 10 composed of an electric heating plate 13, a heat preservation cotton 11, and a steel bar 12, and ensures good contact with the cabin wall through thermal conductive silicone grease, effectively improving the heat transfer efficiency and ensuring the uniformity of the temperature field. A plurality of temperature sensors 20 are arranged in the system, and the real-time monitoring and dynamic adjustment of each temperature measuring point are realized through the control system to ensure that the temperature is evenly distributed in the entire cabin. Through the joint use of the industrial computer 50 and the control module 130, dynamic power adjustment based on the duty cycle is realized to improve the temperature control accuracy of the system. The communication module 160 is used for data transmission, and the user can remotely monitor and adjust the temperature value through the industrial computer 50 to ensure the convenience and flexibility of operation. The system is equipped with safety components such as a circuit breaker 60, a contactor 70, and an emergency stop switch 90, which can cut off the power supply in time when a fault or abnormality occurs to ensure the safety of equipment and personnel. The temperature sensor used to detect the temperature medium is designed to be resistant to high temperature and high pressure, and can work stably in extreme environments to meet the harsh conditions of deep in-situ simulation. According to the target temperature and the upper limit temperature of the heating and insulation belt 10, the system can adjust the heating power in real time and automatically adjust the temperature of the heating belt when the temperature medium 40 is stable. The temperature sensor 20 and the temperature measurement module 140 provide real-time feedback of the temperature changes in the cabin. The control system continuously optimizes the heating strategy based on this data to ensure the stability and uniformity of the temperature field. The system ensures the uniformity, safety and operability of the deep in-situ environmental temperature field, and is particularly suitable for ultra-high pressure and high temperature environmental simulation.

[0046] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0047] In one embodiment, see Figure 1 and Figure 2 The above-mentioned uniform temperature field reconstruction system of a deep in-situ environmental simulation chamber 30 includes: a heating and insulation belt 10, a temperature sensor 20 and a control system. The heating and insulation belt 10 is connected to the outer wall of the deep in-situ environmental simulation chamber 30. The temperature sensor 20 is installed on the heating and insulation belt 10. The temperature sensor 20 is also installed in the deep in-situ environmental simulation chamber 30. The temperature sensor 20 and the heating and insulation belt 10 are respectively connected to the control system. A temperature medium 40 is provided in the deep in-situ environmental simulation chamber 30.

[0048] In this embodiment, the heating and insulation belt 10 is connected to the outer wall of the deep in-situ environmental simulation chamber 30; the temperature sensor 20 is installed on the heating and insulation belt 10 and in the deep in-situ environmental simulation chamber 30, and is used to detect the temperature of multiple points of the heating and insulation belt 10 and the temperature of the temperature medium 40; the control system is connected to the temperature sensor 20 and the heating and insulation belt 10, and is used to automatically adjust the output power of the heating and insulation belt 10 according to the feedback signal of the temperature sensor 20 to maintain the temperature of the temperature medium 40 constant; the temperature medium 40 is arranged in the cavity of the deep in-situ environmental simulation chamber 30, and is used to simulate the temperature conditions of the deep in-situ environment.

[0049] In this embodiment, the above-mentioned heating and heat-insulating belt 10 is but not limited to a silicone resistance wire heating and heat-insulating belt 10 .

[0050] When in use, the silicone resistance wire heating and insulation belt 10 is fixed to the outer wall of the deep in-situ environment simulation chamber 30 by using a stainless steel detachable cable tie, and thermal conductive silicone grease is applied between the heating and insulation belt 10 and the outer wall of the simulation chamber to enhance the heat conduction effect. The interior of the simulation chamber cavity is filled with a temperature medium 40, and multiple temperature sensors 20 are used to monitor the temperature of different positions of the heating and insulation belt 10 and the temperature of the temperature medium 40 respectively.

[0051] The system uses a fidelity core as an experimental object. The fidelity core is obtained through deep in-situ fidelity coring technology. After displacement and processing, it is used for experiments in the deep in-situ environmental simulation chamber 30. The fidelity core has a diameter of 50 mm and a length of 100 mm. According to the size of the fidelity core, a cavity of the deep in-situ environmental simulation chamber 30 is designed, which has a diameter of 80 mm and a depth of 224 mm, to ensure that the temperature of each point of the temperature medium 40 in the space is nearly equal and evenly distributed.

[0052] During the heating stage, the system ensures that the silicone resistance wire heating insulation belt 10 is within a safe temperature range and uses maximum power to heat the temperature medium 40 in the cavity of the deep in-situ environment simulation chamber 30 as quickly as possible to reach a preset target temperature.

[0053] In the heat preservation stage, when the temperature of the temperature medium 40 approaches the target temperature and the difference with the target temperature does not exceed 3%, the system automatically enters the heat preservation stage. In this stage, the temperature control system automatically adjusts the output power of the power supply to the silicone resistance wire heating insulation belt 10 to keep the temperature of the temperature medium 40 constant and ensure that the temperature in the simulation cabin is uniform and stable.

[0054] In one embodiment, thermal conductive silicone grease is applied between the heating and insulation belt 10 and the outer wall of the deep in-situ environment simulation chamber 30 to improve the heat conduction efficiency and ensure that the heat of the heating and insulation belt 10 is effectively transferred to the deep in-situ environment simulation chamber 30 .

[0055] In one embodiment, see Figure 2 The above-mentioned heating and insulation belt 10 includes an insulation belt body, insulation cotton 11, a steel bar 12 and an electric heating plate 13. The insulation belt body is filled with insulation cotton 11, the steel bar 12 is located in the insulation belt body, and the electric heating plate 13 is located on one side of the insulation belt body close to the deep in-situ environment simulation chamber 30.

[0056] The shape, size and quantity of the heating and insulation belt 10 are designed according to the appearance and actual needs of the deep in-situ environmental simulation chamber 30, and its rated power is determined according to the maximum temperature requirement of the uniform temperature field in the simulation chamber.

[0057] In this embodiment, the heat preservation belt body serves as the main structure of the heating and heat preservation belt 10;

[0058] The insulation cotton 11 is filled in the insulation belt body as a passive insulation part, which reduces the loss of heat to the external normal temperature environment and protects the heating insulation belt 10 from damage during transportation and use; the insulation cotton 11 is made of flame retardant material, which is mainly used to reduce the loss of heat and prevent the heat from being dissipated to the external normal temperature environment. It also plays a protective role to prevent the silicone electric heating plate 13 from being damaged due to scratching, collision, extrusion, etc. during the movement and transfer of the simulation cabin.

[0059] The steel bars 12 are located inside the insulation belt body, ensuring that the heating insulation belt 10 is in close contact with the outer wall of the deep in-situ environment simulation chamber 30 when tightened with the stainless steel detachable tie; the number, size and distribution spacing of the steel bars 12 are designed according to the shape of the silicone resistance wire heating insulation belt 10.

[0060] The electric heating plate 13 is located on one side of the insulation belt body close to the deep in-situ environment simulation chamber 30, and serves as an active insulation part for quickly heating the deep in-situ environment simulation chamber 30 during the heating stage and compensating for heat loss during the insulation stage.

[0061] The selection of the temperature medium 40 requires that it does not introduce additional non-in-situ environmental factors and has the characteristics of being easy to obtain, environmentally friendly and safe. For this reason, the present invention selects water as the temperature medium 40 in the simulation cabin. Water is common in deep in-situ environments and can effectively transfer heat, meeting the requirements for building a uniform temperature field.

[0062] In summary, the system of this embodiment enables the deep in-situ environmental simulation chamber 30 to achieve precise temperature control and maintain temperature uniformity and stability during the experiment, thereby providing a reliable simulation environment for deep geological research, core experiments, etc.

[0063] In one embodiment, see Figure 3 The control system includes an industrial computer 50, a control module 130, a temperature measurement module 140, a solid-state relay 110, and a communication module 160. The communication module 160 is connected to the industrial computer 50, the control module 130, and the temperature measurement module 140, respectively, and the solid-state relay 110 is connected to the electric heating plate 13;

[0064] The temperature measurement module 140 is used to measure the resistance value of the temperature sensor 20, calculate the temperature value, send the temperature value to the industrial computer 50, and receive the temperature target value set by the industrial computer 50;

[0065] The industrial computer 50 is used to receive the temperature values ​​of each temperature measurement point sent by the temperature measurement module 140, draw a temperature change curve, calculate and send the duty cycle of the periodic conduction of the solid-state relay 110, and set the temperature control parameters;

[0066] The control module 130 is used to receive the duty cycle calculated by the industrial computer 50 and convert the duty cycle into a control signal of the solid-state relay 110 to control the working state of the solid-state relay 110 through the control signal, thereby controlling the working state of the electric heating plate 13.

[0067] In one embodiment, see Figure 3 The above control system also includes a display module 150 , and the display module 150 is connected to the temperature measurement module 140 .

[0068] In one embodiment, see Figure 3The above-mentioned control system also includes a circuit breaker 60, a contactor 70, a knob switch 80, an emergency stop switch 90, a switching power supply module 120 and an indicator light 100; the circuit breaker 60 is connected to the contactor 70 and the knob switch 80 respectively; the emergency stop switch 90 is connected to the contactor 70 and the knob switch 80 respectively; the contactor 70 is connected to the indicator light 100, the switching power supply module 120 and the solid-state relay 110 respectively; the auxiliary power supply module 141 is connected to the communication module 160.

[0069] Specifically, the circuit breaker 60 automatically cuts off the circuit to protect the equipment when a serious overload or short circuit occurs.

[0070] Contactor 70: controlled by the knob switch 80 to complete the start and stop operations of the electrical equipment.

[0071] Knob switch 80: controls the on and off of contactor 70 when the emergency stop switch 90 is normally closed.

[0072] Emergency stop switch 90: In an emergency, quickly control the contactor 70 to disconnect to ensure the safety of the equipment.

[0073] Indicator light 100: indicates the working status of the system, lights up when the contactor 70 is turned on, and turns off otherwise.

[0074] The solid-state relay 110 is controlled by the control module 130 to adjust the output power of the power supply to the silicone resistance wire heating insulation belt 10 .

[0075] The switching power supply module 120 converts the 220V AC voltage into a 5V DC voltage to supply power to each module in the system.

[0076] Display module 150: displays the target temperature set on the industrial computer 50 and the actual temperature measured.

[0077] In one embodiment, see Figure 4 The above-mentioned temperature measurement module 140 includes an auxiliary power supply module 141, a first communication module 160142, an AD conversion module 143, a temperature measurement microcontroller module 144 and a channel selection module 145. The auxiliary power supply module 141 is respectively connected to the channel selection module 145 and the AD conversion module 143; the channel selection module 145 is connected to the AD conversion module 143; the AD conversion module 143 is connected to the temperature measurement microcontroller, the temperature measurement microcontroller is connected to the first communication module 160142, and the first communication module 160142 is connected to the communication module 160.

[0078] The temperature measurement module 140 can detect multiple temperature points, and the temperature measurement error is within ±0.03°C. The auxiliary power supply module 141 provides a stable 5V DC power supply. The first communication module 160142 realizes 485 communication with the industrial computer 50. The AD conversion module 143 converts the resistance value of the temperature sensor 20 into a digital signal. The temperature measurement microcontroller module 144 processes the data after AD conversion and controls the first communication module 160142 to send data. The channel selection module 145 is used to select different channels of the temperature sensor 20.

[0079] In one embodiment, see Figure 5 The auxiliary power supply module 141 includes a voltage regulator U3 of model but not limited to TPS78233, a voltage reference chip U6 of model REF3030, and the IN pin, EN pin and one end of the grounding capacitor C2 of the voltage regulator U3 are connected to the +5V voltage. The GND pin of the voltage regulator U3 is connected to the digital ground and the analog ground respectively, and the OUT pin of the voltage regulator U3 is connected to the grounding capacitors C3, C4 and one end of the inductor L1. The other end of the inductor L1 is connected to the Vin pin of the voltage reference chip U6 and the grounding capacitor C13, the GND pin of the voltage reference chip U6 is grounded, and the Vout pin of the voltage reference chip U6 is connected to the grounding capacitor C14.

[0080] The AD conversion module 143 includes an AD conversion chip U4 of model number but not limited to AD7124, the IOVDD pin of the AD conversion chip U4 and the grounding capacitor C12 are connected to a +5V voltage, the DGND pin of the AD conversion chip U4 is connected to a digital ground, the AVSS pin of the AD conversion chip U4 is connected to an analog ground, the REGCAPD pin of the AD conversion chip U4 is connected to a grounding capacitor C11, the REFOUT pin of the AD conversion chip U4 is connected to a grounding capacitor C19, and the REGCAPA pin of the AD conversion chip U4 is connected to a grounding capacitor C15. The AVDD pin of the AD conversion chip U4 is connected to a grounding capacitor C17, the positive electrode of the filter capacitor C18, and one end of the inductor L2, and the other end of the inductor L2 is connected to the OUT pin of the voltage regulator U3.

[0081] The channel selection module 145 includes a single-ended 8-channel multi-way switch chip U2 of model number but not limited to CD4051, and aviation plugs P1, P2, P3, P4, P5, P6, P7, and P8 of model number GX12-4. The pin connections of each aviation plug are as follows:

[0082] Pin 1 of the aviation plug P1 is connected to the resistor R13, the other end of the resistor R13 is respectively connected to the grounding capacitor C29, one end of the capacitor C20 and the AIN1 pin of the AD conversion chip U4, the other end of the capacitor C20 is connected to the AIN0 pin of the AD conversion chip U4, and is connected to the grounding capacitor C28 and one end of the resistor R9, and the other end of the resistor R9 is connected to pin 4 of the aviation plug P1.

[0083] Pin 1 of the aviation plug P2 is connected to the resistor R14, the other end of the resistor R14 is respectively connected to the grounding capacitor C31, one end of the capacitor C21 and the AIN3 pin of the AD conversion chip U4, the other end of the capacitor C21 is connected to the AIN2 pin of the AD conversion chip U4, and is connected to the grounding capacitor C30 and one end of the resistor R10, and the other end of the resistor R10 is connected to pin 4 of the aviation plug P2.

[0084] Pin 1 of the aviation plug P3 is connected to the resistor R15, the other end of the resistor R15 is respectively connected to the grounding capacitor C33, one end of the capacitor C22 and the AIN5 pin of the AD conversion chip U4, the other end of the capacitor C22 is connected to the AIN4 pin of the AD conversion chip U4, and is connected to the grounding capacitor C32 and one end of the resistor R11, and the other end of the resistor R11 is connected to pin 4 of the aviation plug P3.

[0085] Pin 1 of the aviation plug P4 is connected to the resistor R16, the other end of the resistor R16 is respectively connected to the grounding capacitor C35, one end of the capacitor C23 and the AIN7 pin of the AD conversion chip U4, the other end of the capacitor C23 is connected to the AIN6 pin of the AD conversion chip U4, and is connected to the grounding capacitor C34 and one end of the resistor R12, and the other end of the resistor R12 is connected to pin 4 of the aviation plug P4.

[0086] Pin 1 of the aviation plug P5 is connected to the resistor R21, the other end of the resistor R21 is respectively connected to the grounding capacitor C45, one end of the capacitor C36 and the AIN9 pin of the AD conversion chip U4, the other end of the capacitor C36 is connected to the AIN8 pin of the AD conversion chip U4, and is connected to the grounding capacitor C44 and one end of the resistor R17, and the other end of the resistor R17 is connected to pin 4 of the aviation plug P5.

[0087] Pin 1 of the aviation plug P6 is connected to the resistor R22, the other end of the resistor R22 is respectively connected to the grounding capacitor C47, one end of the capacitor C37 and the AIN11 pin of the AD conversion chip U4, the other end of the capacitor C37 is connected to the AIN10 pin of the AD conversion chip U4, and is connected to the grounding capacitor C46 and one end of the resistor R18, and the other end of the resistor R18 is connected to pin 4 of the aviation plug P6.

[0088] Pin 1 of the aviation plug P7 is connected to the resistor R23, the other end of the resistor R23 is respectively connected to the grounding capacitor C49, one end of the capacitor C38 and the AIN13 pin of the AD conversion chip U4, the other end of the capacitor C38 is connected to the AIN12 pin of the AD conversion chip U4, and is connected to the grounding capacitor C48 and one end of the resistor R19, and the other end of the resistor R19 is connected to pin 4 of the aviation plug P7.

[0089] Pin 1 of the aviation plug P8 is connected to the resistor R24, the other end of the resistor R24 ​​is respectively connected to the grounding capacitor C51, one end of the capacitor C39 and the AIN15 pin of the AD conversion chip U4, the other end of the capacitor C39 is connected to the AIN14 pin of the AD conversion chip U4, and is connected to the grounding capacitor C50 and one end of the resistor R20, and the other end of the resistor R20 is connected to pin 4 of the aviation plug P8.

[0090] The VDD pin of the single-ended 8-channel multiplexer chip U2 and the grounding capacitor C5 are connected to a +5V voltage, the INH, VEE, and VSS pins of the single-ended 8-channel multiplexer chip U2 are connected to the analog ground, the COM pin of the single-ended 8-channel multiplexer chip U2 is connected to one end of the resistor R3 and one end of the resistor R2, the other end of the resistor R3 is connected to the REFIN1- pin of the AD conversion chip U4, the other end of the resistor R2 is connected to one end of the resistor R1, the other end of the resistor R1 is connected to the grounding capacitor C7, the REFIN1+ pin of the AD conversion chip U4, and one end of the capacitor C1, and the other end of the capacitor C1 is connected to the grounding capacitor C6. The IN / OUT0 pin of the single-ended 8-channel multiplexer chip U2 is connected to the 3rd pin of the aviation plug P1 and the grounding capacitor C24. The IN / OUT1 pin of the single-ended 8-channel multiplexer chip U2 is connected to the 3rd pin of the aviation plug P2 and the grounding capacitor C25. The IN / OUT2 pin of the single-ended 8-channel multiplexer chip U2 is connected to the 3rd pin of the aviation plug P3 and the grounding capacitor C26. The IN / OUT3 pin of the single-ended 8-channel multiplexer chip U2 is connected to the 3rd pin of the aviation plug P4 and the grounding capacitor C27. The IN / OUT4 pin of the single-ended 8-channel multiplexer chip U2 is connected to the 3rd pin of the aviation plug P5 and the grounding capacitor C40, the IN / OUT5 pin of the single-ended 8-channel multiplexer chip U2 is connected to the 3rd pin of the aviation plug P6 and the grounding capacitor C41, the IN / OUT6 pin of the single-ended 8-channel multiplexer chip U2 is connected to the 3rd pin of the aviation plug P7 and the grounding capacitor C42, and the IN / OUT7 pin of the single-ended 8-channel multiplexer chip U2 is connected to the 3rd pin of the aviation plug P8 and the grounding capacitor C43.

[0091] The first communication module 160142 includes a communication interface chip U5 of model but not limited to MAX485 and an electrical interface J1 of model XH2.54. The VCC pin of the communication interface chip U5 and one end of the grounding capacitor C16 are connected to the +5V voltage, the GND pin of the communication interface chip U5 is grounded, the B pin of the communication interface chip U5 and the 4th pin of the electrical interface J1 are connected to one end of the terminal resistor R8, and the other end of the terminal resistor R8 is connected to the A pin of the communication interface chip U5 and the 3rd pin of the electrical interface J1.

[0092] The temperature measurement microcontroller module 144 includes a microcontroller U1 of model number but not limited to STC32G12K128. The Vcc pin of U1 is connected to one end of the grounding capacitors C9 and C10 to a +5V voltage. The P2.2 pin of U1 is connected to one end of the resistor R4, and the other end of R4 is connected to the CS pin of the AD conversion chip U4; the P2.3 pin is connected to one end of the resistor R6, and the other end of R6 is connected to the DIN pin of the AD conversion chip U4; the P2.4 pin is connected to one end of the resistor R7, and the other end of R7 is connected to the DOUT pin of the AD conversion chip U4; the P2.5 pin is connected to one end of the resistor R5, and the other end of R5 is connected to the SCLK pin of the AD conversion chip U4. The P0.2 pin of U1 is connected to the A pin of the single-ended 8-channel multiplexer chip U2, the P0.3 pin is connected to the B pin of U2, and the P0.4 pin is connected to the C pin of U2; the P1.3 pin is connected to the RE and DE pins of the communication interface chip U5; the P1.6 pin is connected to the R0 pin of U5; and the P1.7 pin is connected to the DI pin of U5.

[0093] The TPS78233 voltage regulator and REF3030 voltage reference chip are used to provide precise voltage stability, ensure the stable operation of each module, and improve the reliability of the system. By separating the analog ground from the digital ground, the interference of digital noise on the analog signal is reduced, and the accuracy and signal quality of the AD conversion module 143 are improved. The CD4051 single-ended 8-channel multi-way switch chip is used to support the selection and switching of multiple signal channels, which improves the flexibility and channel scalability of the system. The low-noise design and precise reference voltage of the AD7124 AD conversion chip provide high-precision analog-to-digital conversion, which is suitable for high-precision measurement applications. The MAX485 communication interface chip and XH2.54 electrical interface are used to provide a stable RS-485 communication connection to ensure the reliability and anti-interference ability of the system data transmission. The temperature measurement microcontroller STC32G12K128 is used as the control core. Through precise pin configuration, it completes signal acquisition, processing and control, and provides flexible software programming capabilities. The system design includes multiple filter capacitors and inductors, which can effectively filter out power supply noise and ensure the stability and low noise performance of the power supply. The aviation plug and precise circuit design simplify the connection between modules, facilitate subsequent maintenance and module expansion, and improve the operability and maintainability of the system.

[0094] In one embodiment, see Figure 6 The above-mentioned control module 130 includes a control microcontroller 131, a second communication module 132 and a plug-in terminal 133. The second communication module 132 and the plug-in terminal 133 are respectively connected to the control microcontroller 131; the second communication module 132 is connected to the communication module 160, and the plug-in terminal 133 is connected to the solid-state relay 110.

[0095] Specifically, see Figure 7 The control module 130 can realize the temperature control of the multi-channel silicone resistance wire heating insulation belt 10. The control microcontroller 131 is a microcontroller U1 of STC8F2K64S2, but not limited to, the second communication module 132160 includes a communication interface chip U2 of MAX485, and the interface includes a 4-pin interface J1 of XH2.54, and 2-pin interfaces JP1, JP2, JP3, JP4, JP5, JP6, JP7, JP8. The specific connections are as follows:

[0096] Connection of the communication interface chip U2: The VCC pin of the communication interface chip U2 is connected to the +5V voltage; the GND pin of the communication interface chip U2 is grounded; the B pin of the communication interface chip U2 is connected to the 4th pin of the 4-pin interface J1; the A pin of the communication interface chip U2 is connected to the 3rd pin of the 4-pin interface J1.

[0097] Connection of single-chip computer U1: VCC pin of single-chip computer U1 is connected to +5V voltage through grounding capacitors C1 and C2; GND pin of single-chip computer U1 is grounded; P1.0 pin of single-chip computer U1 is connected to R0 pin of communication interface chip U2; P1.1 pin of single-chip computer U1 is connected to DI pin of communication interface chip U2; P1.2 pin of single-chip computer U1 is connected to DE pin of communication interface chip U2; P1.3 pin of single-chip computer U1 is connected to RE pin of communication interface chip U2; P2.0, P2.1, P2.3, P2.4, P2.5, P2.6, P2.7 and P2.8 pins of single-chip computer U1 are respectively connected to pin 1 of 2-pin interfaces JP1, JP2, JP3, JP4, JP5, JP6, JP7 and JP8; Pin 2 of all 2-pin interfaces JP1, JP2, JP3, JP4, JP5, JP6, JP7 and JP8 are grounded.

[0098] Through these connections, signal communication and control relationships are established between the single-chip microcomputer U1 and the communication interface chip U2, and are connected and expanded with other modules through the JP1 to JP8 interfaces.

[0099] In one embodiment, the above-mentioned communication module 160 includes a first communication conversion module and a second communication conversion module. The first communication conversion module is used to convert the XH2.54 electrical interface used for 485 communication of the temperature measurement module 140 and the control module 130 into an RJ45 electrical interface; the second communication conversion module is used to convert the two 485 differential signals transmitted by the RJ45 electrical interface of the temperature measurement module 140 and the control module 130 into one USB differential signal, and connect to the industrial computer 50 through the USB interface.

[0100] In one embodiment, see Figure 8 , the second communication conversion module includes:

[0101] Adapter chip: Use CH342 adapter chip to realize USB conversion into two asynchronous serial ports.

[0102] Interface chip: Use MAX485 interface chip to convert serial port signal into 485 differential signal.

[0103] Electrical interface: Use RJ45 electrical interface as the interface for two-way 485 signal transmission.

[0104] USB interface: Use Type-C electrical interface to connect to industrial computer 50.

[0105] Specifically, the CH342 chip is used to realize the USB conversion into two asynchronous serial ports, that is, converting the USB differential signal into a serial port signal; and the MAX485 chip converts the serial port signal into a 485 differential signal; the RJ45 interface serves as the electrical interface for the two 485 signals. The main components of the RJ45 to 485 to USB module include the conversion chip CH342 (model U1), the interface chip MAX485 (model U2, U3), the RJ45 electrical interface (model RJ1) and the USB electrical interface (model type-c-12, model USB1). The specific circuit connection relationship is as follows:

[0106] Adapter chip U1 (CH342): VIO pin is connected to +5V voltage through grounding capacitor C2; GND pin is grounded; V3 pin is connected to grounding capacitor C6; VBUS pin, VDD5 pin and grounding capacitor C1 are connected to +5V voltage; DTR1 pin is connected to ground through resistor R1, one end of resistor R1 is connected to DTR1, and the other end is grounded; DSR1 pin is connected to ground through resistor R2, one end of resistor R2 is connected to DSR1, and the other end is grounded; DTR0 pin is connected to ground through resistor R3, one end of resistor R3 is connected to DTR0, and the other end is grounded.

[0107] Interface chip U2 (MAX485): VCC pin is connected to +5V voltage through grounding capacitor C4; GND pin is grounded; RO (receive output) pin is connected to RXD1 pin of adapter chip U1; DI (data input) pin is connected to TXD1 pin of adapter chip U1; RE (receive enable) pin and DE (drive enable) pin are connected to DTR1 pin of adapter chip U1.

[0108] Interface chip U3 (MAX485): VCC pin is connected to +5V voltage through grounding capacitor C5; GND pin is grounded; RO pin is connected to RXD0 pin of adapter chip U1; DI pin is connected to TXD0 pin of adapter chip U1; RE pin and DE pin are connected to DTR0 pin of adapter chip U1.

[0109] RJ45 electrical interface RJ1: Pin 1 of the RJ45 interface is connected to pin A of interface chip U2; pin 2 of the RJ45 interface is connected to pin B of interface chip U2; pin 3 of the RJ45 interface is connected to pin A of interface chip U3; pin 6 of the RJ45 interface is connected to pin B of interface chip U3.

[0110] USB electrical interface USB1: The VBUS pin of the USB interface is connected to a +5V voltage through a grounding capacitor C1, a cathode of a voltage zener diode D1, and one end of a resistor R4; the anode of the voltage zener diode D1 is grounded; the other end of the resistor R4 is connected to the anode of a light-emitting diode D2, and the cathode of D2 is grounded; the GND pin of the USB interface is grounded.

[0111] The above circuit converts the USB signal into a serial port signal, then converts it into a 485 differential signal through the MAX485 chip, and transmits the 485 signal through the RJ45 interface, thereby realizing the conversion and connection between the USB and 485 interfaces.

[0112] In one embodiment, the above-mentioned communication module 160 may also be other wireless communication modules 160, such as Bluetooth, WiFi, ZigBee, LoRa, etc.

[0113] The wired communication method is used in this embodiment because it uses physical media for data transmission, provides a stable data transmission channel, and is not easily interfered by the outside world. In complex industrial sites, wired communication data transmission has higher reliability.

[0114] The temperature control of the uniform temperature field reconstruction system of the deep in-situ environment simulation chamber 30 can be controlled within an error of ±0.5°C. Fig. 9 As shown, the specific control principle is as follows:

[0115] The actual temperature T of the measuring temperature medium 40 media and the set target temperature T target , calculate the temperature error E media =T target -T media .

[0116] The outer loop PID controller is based on the temperature error E media Calculate the expected temperature T of the silicone resistance wire heating insulation belt 10 heater_desired .

[0117] The desired temperature T heater_desired The upper limit temperature T of the silicone resistance wire heating insulation belt is set to 10 max Within.

[0118] Measure the actual temperature T of the silicone resistance wire heating insulation belt 10 heater , calculate the temperature error E heater =T heater_desired -T heaterEheater .

[0119] The inner loop PID controller is based on the temperature error E heater Calculate the duty cycle of the power supply used to regulate the output power of the silicone resistance wire heating insulation belt 10.

[0120] According to the above control principle, the whole control method can be obtained as follows:

[0121] Set temperature parameter: Set the target temperature T of the temperature medium 40 target . Set the upper limit temperature T of the silicone resistance wire heating insulation belt 10 max , is to ensure the safety of the heating and insulation belt.

[0122] Heating to the upper limit temperature: starting the silicone resistance wire to heat the thermal insulation belt 10 to gradually increase its temperature.

[0123] The temperature medium 40 reaches the target temperature: continue to monitor the actual temperature T of the temperature medium 40 media .

[0124] When the actual temperature T of the temperature medium 40 media Close to target temperature T target When the temperature of the silicone resistance wire heating insulation belt 10 starts to decrease, the temperature thereof approaches the temperature T of the temperature medium 40. media .

[0125] Compensation for lost heat: While the temperature of the temperature medium 40 is kept constant, the silicone resistance wire heating insulation belt 10 dynamically adjusts the output power according to the duty cycle D calculated by the inner loop PID controller.

[0126] By dynamically adjusting the output power, the silicone resistance wire heating insulation belt 10 replenishes the heat lost due to heat loss to the deep in-situ environment simulation chamber 30, ensuring that the temperature of the temperature medium 40 is maintained at the target temperature T target .

[0127] The heating method of the system of this embodiment avoids heating methods such as electromagnetic heating, microwave radiation heating, infrared radiation and laser heating that may affect or damage the internal components of the deep core. The design of the silicone resistance wire heating and insulation belt 10 can be customized according to the appearance of the deep in-situ environmental simulation cabin 30, and the shape, size and quantity can be flexibly adjusted. At the same time, the insulation belt is easy to disassemble and has strong applicability. Temperature and pressure sensors are installed at multiple monitoring points, and the data acquisition system is combined with computer technology to achieve accurate monitoring of temperature and pressure. The system provides stable temperature control while ensuring the safe operation of the silicone resistance wire heating and insulation belt 10. After verification, the temperature measurement error in the range of 0 to 150°C is ±0.03°C, and the temperature control error is ±0.2°C, which ensures the temperature control accuracy of the deep in-situ environmental simulation cabin 30. A remote control system is also designed, and the communication stability and reliability under long-distance conditions are ensured through the independently developed electrical interface conversion communication module 160, thereby ensuring the life safety of staff in high temperature and high pressure experimental environments.

[0128] The above-mentioned system for reconstructing a uniform temperature field of a deep in-situ environment simulation chamber 30 is provided by installing a heating and insulation belt 10 on the outer wall of the deep in-situ environment simulation chamber 30, and setting temperature sensors 20 at multiple locations of the heating and insulation belt 10 and the chamber to monitor temperature changes in real time to ensure the uniformity of the heating process. The temperature sensor 20 is connected to the control system and can automatically adjust the power output of the heating and insulation belt 10 according to the temperature data to accurately control the temperature in the chamber. A multi-point temperature control system is designed to ensure uniform temperature distribution at different locations, thereby constructing a stable temperature field. The design of the heating and insulation belt 10 ensures high heating efficiency and uniform temperature distribution, and meets the requirements of deep high-pressure environments. The multi-point control module 130 improves the operability and safety of the system, enabling it to achieve efficient and stable temperature control under extremely high temperature and high pressure conditions.

[0129] In one embodiment, see Fig.10 , also provides a control method executed by the above-mentioned uniform temperature field reconstruction system of the deep in-situ environmental simulation chamber 30, including steps S110 to S130.

[0130] S110, setting the target temperature of the temperature medium 40 and the upper limit temperature of the heating and heat preservation belt 10;

[0131] S120, start the electric heating plate 13 to gradually increase the temperature of the heating and heat preservation belt 10, and when the actual temperature of the temperature medium 40 does not reach 5% of the target temperature, keep the temperature of the heating and heat preservation belt 10 at the set upper limit temperature;

[0132] S130 , when the actual temperature of the temperature medium 40 reaches 5% of the target temperature, the heating and heat-insulating belt 10 starts to cool down until the temperature of the heating and heat-insulating belt 10 approaches the temperature of the temperature medium 40 .

[0133] Specifically, when the actual temperature of the temperature medium 40 reaches 5% of the target temperature, the heating belt is cooled; if the heat preservation heating belt 10 reaches the set upper limit temperature, and the actual temperature of the temperature medium 40 has not reached 5% of the target temperature, the heat preservation heating belt 10 is maintained at the set upper limit temperature;

[0134] S140. While the temperature of the temperature medium 40 is kept constant, the heating and insulation belt 10 dynamically adjusts the output power according to the duty cycle, and the heating and insulation belt 10 compensates the lost heat to the deep in-situ environment simulation chamber 30, so that the temperature of the temperature medium 40 is kept constant.

[0135] The premise for executing the above control method is that the initial temperature of the temperature medium 40 must be lower than the set target temperature.

[0136] It should be noted that technical personnel in the relevant field can clearly understand that the specific implementation process of the control method performed by the uniform temperature field reconstruction system of the above-mentioned deep in-situ environmental simulation chamber 30 can refer to the corresponding description in the aforementioned system embodiment, and for the convenience and conciseness of the description, it will not be repeated here.

[0137] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A uniform temperature and pressure field reconstruction system for a deep in-situ environment simulation chamber, characterized in that: include: A heating and insulation belt, a temperature sensor and a control system, wherein the heating and insulation belt is connected to the outer wall of a deep in-situ environmental simulation chamber, the temperature sensor is installed on the heating and insulation belt, and the temperature sensor is also installed in the deep in-situ environmental simulation chamber. The temperature sensor and the heating and insulation belt are respectively connected to the control system, and a temperature medium is provided in the deep in-situ environmental simulation chamber.

2. A deep in-situ environment simulation chamber uniform temperature and pressure field reconstruction system according to claim 1, characterized in that: Thermal conductive silicone grease is coated between the heating and insulation belt and the outer wall of the deep in-situ environment simulation chamber.

3. A deep in-situ environment simulation chamber uniform temperature and pressure field reconstruction system according to claim 2, characterized in that: The heating and insulation belt includes an insulation belt body, insulation cotton, steel bars and an electric heating plate. The insulation belt body is filled with the insulation cotton, the steel bars are located in the insulation belt body, and the electric heating plate is located on one side of the insulation belt body close to the deep in-situ environment simulation chamber.

4. A deep in-situ environment simulation chamber uniform temperature and pressure field reconstruction system according to claim 3, characterized in that: The control system includes an industrial computer, a control module, a temperature measurement module, a solid-state relay, and a communication module, wherein the communication module is respectively connected to the industrial computer, the control module, and the temperature measurement module, and the solid-state relay is connected to the electric heating plate; The temperature measurement module is used to measure the resistance value of the temperature sensor, calculate the temperature value, send the temperature value to the industrial computer, and receive the temperature target value set by the industrial computer; The industrial computer is used to receive the temperature values ​​of each temperature measuring point sent by the temperature measuring module, draw a temperature change curve, calculate and send the duty cycle for controlling the periodic conduction of the solid-state relay, and set the temperature control parameters; The control module is used to receive the duty cycle calculated by the industrial computer and convert the duty cycle into a control signal of the solid-state relay, so as to control the working state of the solid-state relay through the control signal, and further control the working state of the electric heating plate.

5. A deep in-situ environment simulation chamber uniform temperature and pressure field reconstruction system according to claim 4, characterized in that: The control system also includes a display module, and the display module is connected to the temperature measurement module.

6. A deep in-situ environment simulation chamber uniform temperature and pressure field reconstruction system according to claim 5, characterized in that: The control system also includes a circuit breaker, a contactor, a knob switch, an emergency stop switch, a switching power supply module and an indicator light; the circuit breaker is connected to the contactor and the knob switch respectively; the emergency stop switch is connected to the contactor and the knob switch respectively; the contactor is connected to the indicator light, the switching power supply module and the solid-state relay respectively; the auxiliary power supply module is connected to the communication module.

7. A deep in-situ environment simulation chamber uniform temperature and pressure field reconstruction system according to claim 6, characterized in that: The temperature measurement module includes an auxiliary power supply module, a first communication module, an AD conversion module, a temperature measurement single-chip computer module and a channel selection module. The auxiliary power supply module is connected to the channel selection module and the AD conversion module respectively; the channel selection module is connected to the AD conversion module; the AD conversion module is connected to the temperature measurement single-chip computer, the temperature measurement single-chip computer is connected to the first communication module, and the first communication module is connected to the communication module.

8. A deep in-situ environment simulation chamber uniform temperature and pressure field reconstruction system according to claim 7, characterized in that: The control module includes a control single chip microcomputer, a second communication module and a plug-in terminal. The second communication module and the plug-in terminal are respectively connected to the control single chip microcomputer; the second communication module is connected to the communication module, and the plug-in terminal is connected to the solid-state relay.

9. A deep in-situ environment simulation chamber uniform temperature and pressure field reconstruction system according to claim 8, characterized in that: The communication module includes a first communication conversion module and a second communication conversion module. The first communication conversion module is used to convert the XH2.54 electrical interface used for 485 communication of the temperature measurement module and the control module into an RJ45 electrical interface; the second communication conversion module is used to convert the two 485 differential signals transmitted by the RJ45 electrical interface of the temperature measurement module and the control module into one USB differential signal, and connect to the industrial computer through the USB interface.

10. A control method performed by the uniform temperature and pressure field reconstruction system of the deep in-situ environment simulation chamber according to any one of claims 1 to 9, characterized in that: include: Set the target temperature of the temperature medium and the upper limit temperature of the heating and insulation belt; Start the electric heating plate to gradually increase the temperature of the heating and insulation belt. When the actual temperature of the temperature medium does not reach 5% of the target temperature, keep the heating and insulation temperature at the set upper limit temperature; When the actual temperature of the temperature medium reaches 5% of the target temperature, the heating and insulation belt starts to cool down until the temperature of the heating and insulation belt approaches the temperature of the temperature medium; In the process of keeping the temperature of the temperature medium constant, the heating and insulation belt dynamically adjusts the output power according to the duty cycle, and the heating and insulation belt compensates the lost heat to the deep in-situ environment simulation chamber, so that the temperature of the temperature medium remains constant.

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