Serial port converter

Abstract

The invention relates to the technical field of data conversion equipment, and discloses a serial port converter which comprises a shell internally provided with a conversion mainboard, the shell is of a hollow structure, and openings are formed in the two ends of the shell to expose a data interface of the conversion mainboard; a buffer assembly for supporting the conversion mainboard is arranged at the inner bottom of the shell; a heat conduction assembly attached to the conversion mainboard is arranged on the inner top of the shell, and an air cooling assembly opposite to the heat conduction assembly is arranged on the top of the shell. The heat conduction assembly is in attached contact with the conversion mainboard to absorb heat released by the conversion mainboard, the heat conduction assembly has a larger surface area to facilitate heat exchange, the temperature sensor senses the working temperature of the conversion mainboard in the shell, and if the temperature reaches a preset value, the air cooling assembly and the water cooling assembly are controlled to be started; therefore, the working temperature of the conversion mainboard is not too high to trigger a safety program to cause frequency reduction, namely, prolonging of data response time caused by frequency reduction is avoided.

Description

Technical Field

[0001] This invention relates to the field of data conversion equipment technology, specifically a serial port converter. Background Technology

[0002] A serial port converter is a device used to convert a serial communication interface to other communication interfaces. It typically contains a conversion motherboard. This motherboard integrates electronic components for processing and converting signals. During high-speed data transmission, the motherboard generates heat. Because the electronic components on the motherboard are small, if the heat cannot be dissipated quickly enough, it can easily burn out.

[0003] To ensure the safety and lifespan of the conversion motherboard, a safety program is usually set up. If the operating temperature of the conversion motherboard reaches the preset value, the safety program will be triggered to reduce the frequency of the conversion motherboard and reduce the heat generated by the conversion motherboard. However, the frequency reduction of the conversion motherboard will cause the data response time to be extended, that is, the data processing efficiency of the conversion motherboard will decrease.

[0004] Therefore, we propose a serial port converter to solve the problems mentioned above. Summary of the Invention

[0005] (a) Technical problems to be solved

[0006] In view of the shortcomings of the prior art mentioned above, the purpose of this invention is to provide a serial port converter to solve the problems mentioned above.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, the present invention provides the following technical solution:

[0009] A serial port converter includes a housing with a conversion motherboard inside, the housing having a hollow structure and openings at both ends to expose the data interface of the conversion motherboard;

[0010] The inner bottom of the housing is provided with a buffer assembly to support the conversion motherboard;

[0011] The inner top of the housing is provided with a heat-conducting component that is in contact with the conversion motherboard, and the top of the housing is provided with an air-cooling component relative to the heat-conducting component.

[0012] The bottom of the housing is provided with a water-cooling component relative to the heat-conducting component;

[0013] A temperature sensor is installed inside the housing, and the feedback signal of the temperature sensor is output to the control switches of the air-cooling component and the water-cooling component, respectively.

[0014] Further, the heat conduction component includes a heat sink and a heat conduction plate. The heat sink has multiple roots and is connected to the inner top of the housing at intervals. The spaced openings of the heat sink face the opening of the housing. The heat conduction plate is adhesively connected between the heat sink and the conversion main board.

[0015] Further, the upper end of the heat sink penetrates through the housing and is distributed at intervals on the top surface of the housing. Both sides of the end of the heat sink extend outwards.

[0016] Further, the air cooling component includes a housing and a fan. The housing is covered on the top of the housing and covers the heat sink. The end face of the housing is provided with a mounting plate facing the openings formed at intervals of the heat sink. The fan is mounted on the mounting plate.

[0017] Further, the buffer component includes a backing plate and a buffer block. The backing plate is located at the bottom layer of the housing and the conversion main board is mounted on the top surface of the backing plate. The buffer block is connected between the top end corners of the backing plate and the inner bottom of the housing.

[0018] Further, the water cooling component includes a water cooling pipe, a water tank and a micro water pump. The water cooling pipe is in a continuous S shape and is interspersed between the heat sinks on the top surface of the housing. The water tank is located at the inner bottom of the housing. Both ends of the water cooling pipe extend into the interior of the water tank. The micro water pump is located inside the water tank and is communicated with the end of the water cooling pipe.

[0019] Further, the cross-sectional shape of the groove formed by the heat sinks at intervals is a "convex" shape profile, and a limiting slider is slidably fitted inside the groove. The limiting slider is limited and engaged with the groove, and the top end of the heat conduction plate is connected to the limiting slider.

[0020] Further, a guiding groove is formed on the bottom surface of the limiting slider. A connecting heat conduction column is connected to the center of the top surface of the heat conduction plate. The connecting heat conduction column is located inside the guiding groove and is slidably fitted with each other. A spring is connected between the top surface of the connecting heat conduction column and the inner top of the guiding groove.

[0021] Further, two temperature sensors are provided and are respectively located on the upper and lower surfaces inside the housing. The feedback signal of one of the temperature sensors is output to the control switch of the air cooling component, and the feedback signal of the other temperature sensor is output to the control switch of the water cooling component.

[0022] (III) Beneficial effects

[0023] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0024] The casing protects the conversion motherboard from external impacts, while the buffer component further protects it and reduces potential vibrations. During high-speed data conversion or transmission, the conversion motherboard generates heat. The heat-conducting component, in close contact with the motherboard, absorbs this heat. Its larger surface area facilitates heat exchange. A temperature sensor detects the operating temperature of the motherboard inside the casing. If the temperature reaches a preset value, it activates both the air-cooling and water-cooling components. Both accelerate the cooling of the heat-conducting component. The heat-conducting component effectively transfers heat from the motherboard for extended periods, preventing overheating that could trigger a safety mechanism and cause frequency throttling, thus avoiding prolonged data response time due to frequency reduction. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the external structure of the serial port converter of the present invention;

[0026] Figure 2 This is a schematic diagram of the thermal conductive component structure of the serial port converter of the present invention;

[0027] Figure 3 This is a schematic diagram of the water-cooling pipe structure of the serial port converter of the present invention;

[0028] Figure 4 This is a schematic diagram of the buffer component structure of the serial port converter of the present invention;

[0029] Figure 5 This is a schematic diagram of the water-cooling component structure of the serial port converter of the present invention;

[0030] Figure 6 This is a schematic diagram of the heat sink structure of the serial port converter of the present invention;

[0031] Figure 7 This is a cross-sectional view of the limiting slider structure of the serial port converter of the present invention.

[0032] In the diagram: 1. Housing; 2. Cover; 3. Mounting plate; 4. Fan; 5. Heat sink; 6. Fan; 7. Heat conduction plate; 8. Temperature sensor; 9. Pad; 10. Buffer block; 11. Water tank; 12. Miniature water pump; 13. Limiting slider; 14. Heat conduction column; 15. Guide groove; 16. Spring. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] Please see Figure 1-7 As shown in the figure, the present invention provides a serial port converter, which includes a housing 1 with a conversion main board arranged inside. The housing 1 is of a hollow structure, and openings for exposing the data interfaces of the interface conversion main board are provided at both ends; a buffer component for supporting the conversion main board is arranged at the inner bottom of the housing 1; a heat conduction component is arranged at the inner top of the housing 1 and is in contact with the conversion main board, and an air-cooling component is arranged at the top of the housing 1 relative to the heat conduction component; a water-cooling component is arranged at the bottom of the housing 1 relative to the heat conduction component; a temperature sensor 8 is arranged inside the housing 1. There are two temperature sensors 8, which are respectively located on the upper and lower surfaces inside the housing 1. The feedback signal of one temperature sensor 8 is output to the control switch of the air-cooling component, and the feedback signals of the other temperature sensor 8 output to the control switches of the water-cooling component are respectively output to the control switches of the air-cooling component and the water-cooling component.

[0035] Specifically, as Figure 2 、 Figure 6 and Figure 7 shown, the heat conduction component includes heat sinks 5 and heat conduction plates 7. There are multiple heat sinks 5, which are arranged at intervals and connected to the inner top of the housing 1. The spaced openings of the heat sinks 5 face the openings of the housing 1. The heat conduction plate 7 is in contact and connected between the heat sinks 5 and the conversion main board. The upper ends of the heat sinks 5 penetrate through the housing 1 and are distributed at intervals on the top surface of the housing 1. The ends of the heat sinks 5 extend outward on both sides, and their structure is trapezoidal. The groove cross-section formed between two adjacent heat sinks 5 has a "convex" shape contour, and a limiting slider 13 is slidably arranged inside the groove in a fitting manner. The limiting slider 13 is in limiting engagement with the groove. A guiding groove 15 is provided on the bottom surface of the limiting slider 13. A connecting heat conduction column 14 is axially connected to the top surface of the heat conduction plate 7. The connecting heat conduction column 14 is located inside the guiding groove 15 and is in sliding contact with each other. A spring 16 is connected between the top surface of the connecting heat conduction column 14 and the inner top of the guiding groove 15. The heat conduction plate 7, the limiting slider 13 and the heat conduction column 均由散热硅胶等或其他导热材料制成,在弹簧16的作用下导热板7可根据转换主板的凹凸不平紧贴在其上的元件上,以增强热量传导效率。

[0036] As Figure 1 shown, the air-cooling component includes a cover shell 2 and a fan 4. The cover shell 2 is covered on the top of the housing 1 and covers the heat sinks 5. An air duct 3 is provided on the end face of the cover shell 2, which faces the openings formed at intervals of the heat sinks 5. The fan 4 is installed in the air duct 3. When the fan 4 rotates, it accelerates the air circulation around the heat conduction component, thereby improving the heat exchange efficiency of the heat conduction component.

[0037] As Figure 3 and Figure 5 It should be noted that there is an error in the original Chinese text of ID=10 where "均由散热硅胶等或其他导热材料制成" is not in English. The corrected English translation for this part is "are all made of heat dissipation silica gel or other heat conductive materials".As shown, the water cooling assembly includes a water cooling pipe 6, a water tank 11, and a micro water pump 12. The water cooling pipe 6 is in a continuous S-shape and is inserted between the heat sinks 5 on the top surface of the housing 1. The water tank 11 is located at the bottom inner part of the housing 1. Both ends of the water cooling pipe 6 extend into the interior of the water tank 11. The micro water pump 12 is located inside the water tank 11 and is connected to the end of the water cooling pipe 6. After the micro water pump 12 is started, it draws the water tank 11 into the water cooling pipe 6 and exchanges heat with the housing 1 to cool it down.

[0038] like Figure 4 and Figure 5 As shown, the buffer assembly includes a pad 9 and a buffer block 10. The pad 9 is located at the bottom of the protective shell 2 and the main body 1 of the plate is installed on the top surface of the pad 9. The buffer block 10 is connected between the top corner of the pad 9 and the inner bottom of the protective shell 2, and it can be made of flexible silicone or sponge.

[0039] The housing 1 protects the conversion motherboard from external impacts. The buffer component further protects the conversion motherboard and reduces the vibration it may suffer. The conversion motherboard generates heat during high-speed data conversion or transmission. The heat-conducting component is in close contact with the conversion motherboard to absorb the released heat. The heat-conducting component has a larger surface area, which is conducive to heat exchange. The temperature sensor 8 senses the operating temperature of the conversion motherboard inside the housing 1. If the temperature reaches the preset value, it controls the air-cooling component to start. The air-cooling component accelerates the air circulation around the heat-conducting component, thereby improving the heat exchange efficiency of the heat-conducting component. It can also start the water-cooling component. The water circulation of the water-cooling component further expands the heat transfer range and improves the heat exchange efficiency. Both the air-cooling component and the water-cooling component accelerate the cooling of the heat-conducting component. The heat-conducting component can transfer the heat of the conversion motherboard during operation for a long time, so that the operating temperature of the conversion motherboard will not overheat and trigger the safety program to cause frequency reduction, that is, avoid the data response time extension caused by frequency reduction.

[0040] For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances; for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this invention should be included within the protection scope of this invention.

Claims

1. A serial port converter, characterized in that: It comprises a housing (1) in which a conversion mainboard is arranged, the housing (1) being a hollow structure with openings at both ends for exposing a data interface of the conversion mainboard; The inner bottom of the housing (1) is provided with a buffer component for supporting the conversion mainboard; The inner top of the shell (1) is provided with a heat-conducting component that fits the conversion mainboard, and the top of the shell (1) is provided with an air-cooling component relative to the heat-conducting component; The bottom of the housing (1) is provided with a water cooling component opposite to the heat conducting component; A temperature sensor (8) is arranged inside the housing (1), and feedback signals of the temperature sensor (8) are output to control switches of the air cooling component and the water cooling component respectively.

2. A serial port converter according to claim 1, characterized in that: The heat conduction component comprises a heat sink (5) and a heat conduction plate (7); the heat sink (5) comprises a plurality of heat sinks (5) which are arranged at intervals and connected to the inner top of the shell (1); the interval openings of the heat sink (5) face the opening of the shell (1); and the heat conduction plate (7) is fitted and connected between the heat sink (5) and the conversion mainboard.

3. A serial port converter according to claim 2, characterized in that: The upper ends of the heat sinks (5) penetrate the shell (1) and are distributed at intervals on the top surface of the shell (1), and the ends of the heat sinks (5) extend outwards on both sides.

4. A serial port converter according to claim 3, characterized in that: The air cooling component comprises a cover (2) and a fan (4); the cover (2) is arranged on the top of the housing (1) and covers the heat sink (5); the end surface of the cover (2) is provided with a mounting plate (3) with an opening formed at a distance from the heat sink (5); and the fan (4) is mounted on the mounting plate (3).

5. A serial port converter according to claim 1, characterized in that: The buffer assembly comprises a pad (9) and a buffer block (10); the pad (9) is located at the bottom layer of the shell (1) and the conversion main board is mounted on the top surface of the pad (9); the buffer block (10) is connected between the top surface end corner of the pad (9) and the inner bottom of the shell (1).

6. A serial port converter according to claim 3, characterized in that: The water cooling assembly comprises a water cooling pipe (6), a water tank (11) and a micro water pump (12); the water cooling pipe (6) is in a continuous S-shape and is inserted between the heat sinks (5) on the top surface of the shell (1); the water tank (11) is located at the inner bottom of the shell (1); both ends of the water cooling pipe (6) extend into the interior of the water tank (11); and the micro water pump (12) is located inside the water tank (11) and is connected to the end of the water cooling pipe (6).

7. A serial port converter according to claim 3, characterized in that: The cross-sectional profile of the groove formed by the intervals between the heat sinks (5) is a "convex"-shaped profile, and a limit slider (13) is provided inside the groove for sliding fit, the limit slider (13) is limitedly engaged with the groove, and the top end of the heat conducting plate (7) is connected to the limit slider (13).

8. A serial port converter according to claim 7, characterized in that: The bottom surface of the limit slide block (13) is provided with a guide groove (15); the top surface of the heat conducting plate (7) is axially connected with a connecting heat conducting column (14); the connecting heat conducting column (14) is located inside the guide groove (15) and is slidably fitted with each other; a spring (16) is connected between the top surface of the connecting heat conducting column (14) and the inner top of the guide groove (15).

9. A serial port converter according to claim 1, characterized in that: Two temperature sensors (8) are provided and are respectively located on the upper and lower surfaces inside the shell (1), wherein a feedback signal of one of the temperature sensors (8) is output to a control switch of an air cooling component, and a feedback signal of the other temperature sensor (8) is output to a control switch of a water cooling component.

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