Method and system for automatically checking gold plating data network through CAM

Abstract

According to the method and system for automatically checking the gold plating data network through the CAM, overlapping and touching of multiple layers of networks are automatically and accurately recognized and processed through the coordinate clicking function and the graph overlapping comparison function, the checking accuracy is improved, and errors and defects are reduced. Compared with manual inspection, automation is achieved, and the inspection time is greatly shortened. The system comprises a check execution unit, a record display unit, a graph check modification unit and an error linking unit, the process is simplified, detailed records are provided, error positions are visually displayed, instant modification is supported, problems are rapidly positioned through error linking, rework is reduced, and user experience is improved. On the whole, the system integrates a plurality of functional units, realizes automation and intelligentization of the inspection process, reduces manual intervention, ensures inspection accuracy and consistency, and provides an efficient and reliable solution for network inspection of gold plating data.

Description

Technical Field

[0001] The present invention relates to the field of circuit board data optimization, and in particular to a method and system for CAM automatic inspection of electrometallic data network. Background Art

[0002] In the electronics manufacturing industry, the production process of printed circuit boards (PCBs) cannot be separated from the processing of CAM (computer-aided manufacturing) data.

[0003] China Publication No. CN106529070B discloses a method and system for automatically processing CAM data of a circuit board, which realizes a series of processes such as preprocessing, uploading, automatic processing, packaging output, and importing and displaying workspace of CAM data; this method automatically completes the processing of CAM data according to the configuration file through the server, and provides the packaging output of the processing log and the processing results, which greatly improves the efficiency and accuracy of circuit board production. However, when processing the electroplating data network, the above method may not be able to comprehensively and accurately check the complex relationship between the electroplating layer network and the solder mask window layer network and the circuit layer network, which may lead to errors and defects in production.

[0004] In addition, the existing circuit board CAM data automatic processing system also has certain limitations in terms of user interface and interactivity. For example, when users need to check and handle errors, they may need to manually find and locate the error location, which not only increases the workload and time cost, but also may reduce the accuracy and efficiency of processing.

[0005] Therefore, in order to overcome the shortcomings of the prior art, the present invention proposes a new CAM automated inspection method and system for electrical and metal material networks, which aims to more comprehensively and accurately inspect and process the complex relationships in electrical and metal material networks, and provide a more intuitive and convenient user interface and interactive experience. Summary of the invention

[0006] The present invention overcomes the deficiencies of the above-mentioned technologies and provides a method and system for CAM automatic inspection of electrical material networks.

[0007] To achieve the above object, the present invention adopts the following technical solutions:

[0008] A first aspect of an embodiment of the present invention discloses a method for CAM automatic inspection of an electrical material network, comprising the following steps:

[0009] S1. Design the circuit pattern of the substrate according to customer needs. The circuit pattern is divided into the solder mask window layer network, the electroplating gold layer network and the circuit layer network;

[0010] S2, pulling a lead from the circuit pattern of the substrate to a preset copper pattern at the edge of the board to achieve electrical conduction;

[0011] S3. After conducting, select any coordinate point in the circuit diagram of the substrate, and use the "Select the same network object by coordinate point" function to select and determine the large copper object graphic in the circuit layer network that contains the coordinate point and belongs to the same network.

[0012] S4. Use the "Graphic Overlap Comparison Command Touch" function to identify and select the gold layer object graphics where the solder mask window layer network touches the gold layer network;

[0013] S5, again using the "graphic overlap comparison command touch" function, overlap and compare the large copper object graphic of the circuit layer network selected in step S3 with the electroplating gold layer object graphic selected in step S4;

[0014] S6. Use the inverse selection function to filter out the graphic objects in the circuit layer network that are not touched by the object graphics in the electroplating layer network;

[0015] S7. Determine the number of untouched graphic objects selected. If the number is greater than 0, an error message is displayed, and the graphic objects are selected to the error reporting layer. If the number is 0, a message indicating that the check has passed is displayed.

[0016] Preferably, in step S3, "selecting any coordinate point in the circuit pattern of the substrate after conduction, and using the "coordinate point select same network object" function to select and determine the large copper object pattern of the circuit layer network of the same network to which the coordinate point belongs" includes:

[0017] S31, after conducting, after selecting any coordinate point in the circuit pattern of the substrate, use the "coordinate point select same network object" function to select and determine the circuit layer network of the same network to which the coordinate point belongs;

[0018] S32, selecting all object graphics of the line layer network of the same network to which the coordinate point belongs;

[0019] S33, determine whether the number of selected object graphics is greater than or equal to the preset value M. If the number of selected object graphics is less than the preset value M, repeat step S31; if the number of selected object graphics is greater than or equal to the preset value M, determine that the selected object is a large copper object graphic, and proceed to the next step.

[0020] Preferably, the preset value M is 150.

[0021] Preferably, in step S7, "determining the number of untouched graphic objects selected, and prompting an error if the number selected is greater than 0;" includes:

[0022] S71, determining the number of untouched graphic objects selected, if the number is greater than 0, picking out the selected graphic objects to the error reporting layer; and displaying the number of errors and the address of the link error reporting layer in a prompt window;

[0023] S72, click the linked error layer address to jump to the error position, and modify the error line graphic position;

[0024] S73, re-execute steps S2-S7 until there are no errors.

[0025] Preferably, the implementation method of the function of "selecting the same network object by coordinate point" in step S3 is:

[0026] The lower left corner of the circuit pattern of the substrate is used as the scanning starting point, and the lower right corner is used as the scanning end point. The scanning is performed according to the linear relationship y=kx+b, where the slope k changes cyclically with a preset step size to traverse and select all object graphics of the circuit layer network belonging to the same network at any given coordinate point.

[0027] Preferably, the preset step value is the increment of the slope k, and the increment of the slope k is set to 0.1.

[0028] A second aspect of an embodiment of the present invention discloses a CAM system for automatically checking an electrical and metal material network, comprising:

[0029] The method for automatically checking the electrical and metal material network by using the CAM described in the first aspect comprises:

[0030] The inspection execution unit 1 is used to execute the corresponding inspection operation according to the function button selected by the user;

[0031] Inspection record display unit 2, used to provide the user with the inspection record;

[0032] Graphics viewing and modification unit 3, used to visually view the location of graphic errors and modify them;

[0033] The error link unit 4 is used to automatically jump to the corresponding error position in the graphic viewing and modifying unit 3.

[0034] Preferably, the inspection record display unit 2 comprises: an inspection item display subunit 21, an inspection result display subunit 22, and an inspection time display subunit 23, wherein the inspection result display subunit 22 comprises a parameter for displaying the number of errors and a link address corresponding to the error.

[0035] Preferably, the graphic checking and modifying unit 3 comprises: an all-layer subunit 31 for checking and modifying the circuit graphics of the entire substrate, and an error reporting layer subunit 32 for checking and modifying the circuit graphics of the error reporting layer.

[0036] Compared with the prior art, the embodiments of the present invention have the following beneficial effects:

[0037] 1. In the first embodiment of the present invention, through the "coordinate point selection of the same network object" function and the "graphic overlap comparison command touch" function, the overlap and touch relationship between the solder mask window layer network, the electroplating layer network and the circuit layer network can be automatically and accurately identified and processed, which greatly improves the accuracy of the inspection and reduces errors and defects in the production process such as missing wires and broken wires. Moreover, compared with the traditional manual inspection method, the present invention realizes automated inspection and greatly shortens the inspection time. In addition, through the error prompt and link function, users can quickly locate and modify errors, which improves work efficiency and user satisfaction.

[0038] 2. Embodiment 2 of the present invention As described above, through the inspection execution unit, the user can select the corresponding function button to perform the inspection operation according to the needs, which greatly simplifies the inspection process and improves work efficiency. Through the setting of the inspection record display unit and its various subunits, a detailed inspection record is provided, including inspection items, inspection results and inspection time, so that the user can have a more comprehensive understanding of the inspection situation. Through the graphic viewing and modification unit, the user is allowed to intuitively view the error position of the graphic and make modifications directly, which helps to quickly locate and correct errors and reduce rework time. Through the error link unit, it can automatically jump to the corresponding error position in the graphic viewing and modification unit 3. This function simplifies the error handling process and improves the user experience. In summary, the entire system realizes the automation and intelligence of the inspection process by integrating multiple functional units, reduces manual intervention, and improves the accuracy and consistency of the inspection. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0040] Figure 1 It is a logical flow diagram of a method for CAM automatic inspection of electrical and metal material network disclosed in the first embodiment of the present invention;

[0041] Figure 2 It is a schematic block diagram of the structure disclosed in the second embodiment of the present invention. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] It should be noted that the terms "first", "second", "third", "fourth", etc. in the specification and claims of the present invention are used to distinguish different objects rather than to describe a specific order. The terms "including" and "having" in the embodiments of the present invention and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device including a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0044] The embodiment of the present invention discloses a method for CAM automatic inspection of electrical and metal material network, which can simplify the construction process of recognition and improve recognition efficiency, and is also conducive to accurate tuning of the recognition method in the later stage.

[0045] Embodiment 1

[0046] See also Figure 1 , Figure 1 A method for CAM automatic inspection of electrical and metal material network disclosed in the first embodiment of the present invention comprises the following steps:

[0047] S1. Design the circuit pattern of the substrate according to customer needs. The circuit pattern is divided into the solder mask window layer network, the electroplating gold layer network and the circuit layer network;

[0048] S2, pulling a lead from the circuit pattern of the substrate to a preset copper pattern at the edge of the board to achieve electrical conduction;

[0049] S3. After conducting, select any coordinate point in the circuit diagram of the substrate, and use the "Select the same network object by coordinate point" function to select and determine the large copper object graphic in the circuit layer network that contains the coordinate point and belongs to the same network.

[0050] S4. Use the "Graphic Overlap Comparison Command Touch" function to identify and select the gold layer object graphics where the solder mask window layer network touches the gold layer network;

[0051] S5, again using the "graphic overlap comparison command touch" function, overlap and compare the large copper object graphic of the circuit layer network selected in step S3 with the electroplating gold layer object graphic selected in step S4;

[0052] S6. Use the inverse selection function to filter out the graphic objects in the circuit layer network that are not touched by the object graphics in the electroplating layer network;

[0053] S7. Determine the number of untouched graphic objects selected, and if the number is greater than 0, prompt an error; if the number is 0, prompt a check passed.

[0054] As described above, the present invention can automatically and accurately identify and process the overlapping and touching relationships between the solder mask window layer network, the electroplating layer network and the circuit layer network through the "coordinate point selection of the same network object" function and the "graphic overlap comparison command touch" function, which greatly improves the accuracy of the inspection and reduces errors and defects in the production process such as missing wires and broken wires. Moreover, compared with the traditional manual inspection method, the present invention realizes automated inspection and greatly shortens the inspection time. In addition, through the error prompt and link function, users can quickly locate and modify errors, which improves work efficiency and user satisfaction.

[0055] As a preferred implementation, in step S3, "selecting any coordinate point in the circuit pattern of the substrate after conduction, and using the "coordinate point selects the same network object" function to select and determine the large copper object graphic of the circuit layer network of the same network to which the coordinate point belongs" includes:

[0056] S31, after conducting, after selecting any coordinate point in the circuit pattern of the substrate, use the "coordinate point select same network object" function to select and determine the circuit layer network of the same network to which the coordinate point belongs;

[0057] S32, selecting all object graphics of the line layer network of the same network to which the coordinate point belongs;

[0058] S33, determine whether the number of selected object graphics is greater than or equal to the preset value M. If the number of selected object graphics is less than the preset value M, repeat step S31; if the number of selected object graphics is greater than or equal to the preset value M, it is determined that the selected object graphics are large copper objects, and proceed to the next step. In specific implementation, the large copper object graphics refer to copper parts that occupy a large area or significant size in the circuit board PCB design.

[0059] As described above, through the "coordinate point selection of the same network object" function, the circuit layer network of the same network can be automatically and accurately selected and determined, avoiding the error of manual selection. By determining whether the number of object graphics is greater than or equal to the preset value M, it can be ensured that the selected object is a large copper object graphic, thereby improving the accuracy of recognition. In addition, when the number of selected object graphics does not meet the preset value, step S31 can be automatically repeated until a large copper object graphic that meets the conditions is found, thereby improving the overall processing efficiency. Moreover, the method of the present invention can be applied to different types of substrate circuit graphics. It only needs to adjust the preset value M according to the specific situation, and has strong adaptability and flexibility.

[0060] As a preferred implementation, the preset value M is 150. Thus, the preset value M is set to 150, which is obtained based on the experience or industry standards of most data graphics. In the network inspection of electric and gold data, by setting 150 as a reasonable threshold, it can be ensured that the inspection process can accurately reflect the actual situation and meet the needs of customers.

[0061] As a preferred implementation, in step S7, "determining the number of untouched graphic objects selected, and prompting an error if the number is greater than 0;" includes:

[0062] S71, determining the number of untouched graphic objects selected, if the number is greater than 0, picking out the selected graphic objects to the error reporting layer; and displaying the number of errors and the address of the link error reporting layer in a prompt window;

[0063] S72, click the linked error layer address to jump to the error position, and modify the error line graphic position;

[0064] S73, re-execute steps S2-S7 until there are no errors.

[0065] As mentioned above, this case can fully check that all graphic objects are processed correctly by automatically detecting untouched or non-overlapping graphic objects, thereby reducing the possibility of human error. Specifically, through the settings of S71 and step S72, the user can directly jump to the error location through the link to make modifications without manual search or scrolling, which greatly saves time and energy; and the clear prompt window and link function make the error detection and correction process more intuitive and easy to understand, improving the user experience. In addition, by directly picking out untouched graphic objects and placing them in the error reporting layer, inspectors can quickly locate potential problem areas without having to check them one by one in complex line graphics, greatly shortening the time for error identification and improving overall inspection efficiency.

[0066] As a preferred implementation, the function of "selecting the same network object by coordinate point" described in step S3 is: taking the lower left corner of the circuit graphic of the substrate as the scanning starting point, and the lower right corner point as the scanning end point, scanning is performed according to the linear relationship of y=kx+b, wherein the slope k changes cyclically with a preset step value, thereby traversing and selecting all object graphics of the circuit layer network belonging to the same network of any given coordinate point.

[0067] As described above, this case sets the scanning starting point and scanning end point, with the lower left corner of the circuit pattern of the substrate as the starting point and the lower right corner as the end point, to ensure effective coverage of the entire specified area, that is, the entire substrate strip. By scanning according to the linear relationship of y=kx+b, and combining the slope k with a preset step value for cyclic change, it is possible to traverse the entire scanning area, so as to accurately select all object graphics of the circuit layer network belonging to the same network at any given coordinate point, thereby greatly improving efficiency. The cyclic change of the slope k enables the method of this case to flexibly adapt to circuit patterns of different sizes, ensuring that all relevant graphic objects are selected without omission. The setting of the preset step value also provides control over the scanning accuracy, and the user can adjust the step value according to actual needs to achieve the best scanning effect. In addition, by combining linear scanning and slope change, this function can accurately locate any given coordinate point and accurately select all object graphics of the circuit layer network belonging to the same network as the point, thereby ensuring the quality and reliability of the product.

[0068] The preset step value is the increment of the slope k, and the increment of the slope k is set to 0.1. In specific implementation, the lower left corner of the strip of the circuit pattern of the substrate is used as the starting point, the lower right corner point is used as the scanning end point, and the linear relationship of y=kx+b is installed. K obtains the coordinates in a 0.1 manner, thereby selecting the same network object at any coordinate point. In this way, the increment of the slope k is set to 0.1, so that the slope k will change in a smaller step, which helps to traverse the scanning area more carefully, thereby more accurately selecting the object graphics belonging to the same network as the given coordinate point, and can improve the accuracy of the scanning.

[0069] As a preferred embodiment, the graphics of all objects in the solder mask window layer network and all objects in the electroplating layer network in step S4 are data graphics of the original data provided to the customer. In this way, during the use and maintenance of the circuit board, some of the objects may need to be replaced or repaired. Using the original data graphics provided by the customer for design and manufacturing can ensure that these objects can be accurately identified and located during subsequent maintenance. This helps to reduce maintenance costs and time and improve the reliability and service life of the circuit board.

[0070] Embodiment 2

[0071] like Figure 2 As shown, a system for CAM automatic inspection of electrical and metal material networks, using the method for CAM automatic inspection of electrical and metal material networks described in embodiment 1, comprises:

[0072] The inspection execution unit 1 is used to execute the corresponding inspection operation according to the function button selected by the user;

[0073] Inspection record display unit 2, used to provide the user with the inspection record;

[0074] Graphics viewing and modification unit 3, used to visually view the location of graphic errors and modify them;

[0075] The error link unit 4 is used to automatically jump to the corresponding error position in the graphic viewing and modifying unit 3.

[0076] As a preferred embodiment, the inspection record display unit 2 includes: an inspection item display subunit 21, an inspection result display subunit 22, and an inspection time display subunit 23. The inspection result display subunit 22 includes a parameter for displaying the number of errors and a link address corresponding to the error.

[0077] As described above, through the inspection execution unit 1, the user can select the corresponding function button to perform the inspection operation according to the needs, which greatly simplifies the inspection process and improves work efficiency. Through the setting of the inspection record display unit 2 and its various subunits, a detailed inspection record is provided, including inspection items, inspection results and inspection time, so that the user can have a more comprehensive understanding of the inspection situation. Through the graphic viewing and modification unit 3, the user is allowed to intuitively view the error position of the graphic and make modifications directly, which helps to quickly locate and correct errors and reduce rework time. Through the error link unit 4, it can automatically jump to the corresponding error position in the graphic viewing and modification unit 3. This function simplifies the error handling process and improves the user experience. In summary, the entire system realizes the automation and intelligence of the inspection process by integrating multiple functional units, reduces manual intervention, and improves the accuracy and consistency of the inspection.

[0078] As a preferred embodiment, the graphic viewing and modification unit 3 includes: an all-layer subunit 31 for viewing and modifying the circuit graphics of the entire substrate, and an error reporting layer subunit 32 for viewing and modifying the circuit graphics of the error reporting layer. In this way, the setting of all-layer subunits 21 allows the user to comprehensively view and modify the circuit graphics of the substrate. Whether it is the solder mask window layer, the electroplating layer or the circuit layer, it can be operated under the same interface without frequently switching different layers, thereby improving work efficiency. Through the setting of the error reporting layer subunit 22, the error graphic objects are clearly isolated and displayed, and only the graphics of the error reporting layer can be viewed and modified, so that the user can quickly locate and solve the error, avoid getting lost in complex multi-layer circuit graphics, reduce the difficulty of operation, and further improve work efficiency.

[0079] The above is a detailed introduction to a method and system for CAM automated inspection of electrical and metal material networks disclosed in an embodiment of the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A method for CAM automated inspection of electrical material network, characterized in that The following steps are involved: S1. Design the circuit pattern of the substrate according to customer needs. The circuit pattern is divided into the solder mask window layer network, the electroplating gold layer network and the circuit layer network; S2, pulling a lead from the circuit pattern of the substrate to a preset copper pattern at the edge of the board to achieve electrical conduction; S3. After conducting, select any coordinate point in the circuit diagram of the substrate, and use the "select the same network object by coordinate point" function to select and determine the large copper object graphic in the circuit layer network that contains the coordinate point and belongs to the same network; S4. Use the "Graphic Overlap Comparison Command Touch" function to identify and select the gold layer object graphics where the solder mask opening layer network touches the gold layer network; S5. Use the "Graphic Overlap Comparison Command touch" function again to overlap and compare the large copper object graphic of the circuit layer network selected in step S3 with the electroplating gold layer object graphic selected in step S4; S6. Use the inverse selection function to filter out the graphic objects in the circuit layer network that are not touched by the object graphics in the electroplating layer network; S7. Determine the number of untouched graphic objects selected. If the number is greater than 0, an error message is displayed, and the graphic objects are selected to the error reporting layer. If the number is 0, a message indicating that the check has passed is displayed.

2. The method for CAM automated inspection of electrical material network according to claim 1, characterized in that: In step S3, "select any coordinate point in the circuit pattern of the substrate after conduction, and use the "select the same network object at the coordinate point" function to select and determine the large copper object pattern of the circuit layer network of the same network to which the coordinate point belongs" includes: S31. After selecting any coordinate point in the circuit pattern of the substrate after conduction, use the "select the same network object by coordinate point" function to select and determine the circuit layer network of the same network to which the coordinate point belongs; S32, selecting all object graphics of the line layer network of the same network to which the coordinate point belongs; S33, determine whether the number of selected object graphics is greater than or equal to the preset value M. If the number of selected object graphics is less than the preset value M, repeat step S31; if the number of selected object graphics is greater than or equal to the preset value M, determine that the selected object is a large copper object graphic, and proceed to the next step.

3. The method for CAM automated inspection of electrical material network according to claim 1, characterized in that: The preset value M is 150.

4. The method for CAM automated inspection of electrical material network according to claim 1, characterized in that: In step S7, the number of untouched graphic objects selected is determined, and if the number is greater than 0, an error message is displayed; "include: S71, determining the number of untouched graphic objects selected, if the number is greater than 0, picking out the selected graphic objects to the error reporting layer; and displaying the number of errors and the address of the link error reporting layer in a prompt window; S72, click the linked error layer address to jump to the error position, and modify the error line graphic position; S73, re-execute steps S2-S7 until there are no errors.

5. The method for CAM automated inspection of electrical material network according to claim 1, characterized in that: The implementation method of the "coordinate point selection of the same network object" function in step S3 is: The lower left corner of the circuit pattern of the substrate is used as the scanning starting point, and the lower right corner is used as the scanning end point. The scanning is performed according to the linear relationship y=kx+b, where the slope k changes cyclically with a preset step size to traverse and select all object graphics of the circuit layer network belonging to the same network at any given coordinate point.

6. The method for CAM automated inspection of electrical material network according to claim 5, characterized in that: The preset step value is the increment of the slope k, and the increment of the slope k is set to 0.

1.

7. A CAM system for automatically checking electrical and metal material networks, characterized in that: A method for automatically checking an electrical material network using the CAM described in any one of claims 1 to 6, comprising: The inspection execution unit (1) is used to execute a corresponding inspection operation according to the function button selected by the user; An inspection record display unit (2) is used to provide the user with the inspection record; A graphics viewing and modification unit (3) is used to visually view the location of graphics errors and modify the errors; The error link unit (4) is used to automatically jump to the corresponding error position in the graphic viewing and modification unit (3).

8. The CAM automated inspection system for electrical and metal material networks according to claim 7, characterized in that: The inspection record display unit (2) comprises: an inspection item display subunit (21), an inspection result display subunit (22), and an inspection time display subunit (23); the inspection result display subunit (22) comprises a parameter for displaying the number of errors and a link address corresponding to the error.

9. The CAM automated inspection system for electrical and metal material networks according to claim 7, characterized in that: The graphic checking and modifying unit (3) comprises: an all-layer subunit (31) for checking and modifying the circuit graphics of the entire substrate, and an error reporting layer subunit (32) for checking and modifying the circuit graphics of the error reporting layer.

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