Plasma generator for semiconductor processing

Abstract

The invention relates to the technical field of plasma treatment, and particularly discloses a plasma generator for semiconductor processing, which comprises a support frame, and further comprises a treatment assembly arranged on a sliding seat and a spray head device and used for adjusting the movement track of the spray head device relative to workpiece surface treatment; and the overturning assemblies are arranged on the two sides of the sliding base, and the overturning assemblies are used for overturning the workpieces. Through the processing assembly, the workpiece can be clamped and fixed, the stability of the workpiece during processing is guaranteed, the moving track of the spray head device relative to the workpiece surface processing can be adjusted according to semiconductor workpieces in different rectangular or circular shapes, plasmas sprayed by the spray head device act on the workpiece surface, and the loss and waste of the plasmas are reduced; and the workpiece can be conveniently overturned through the overturning assembly, the workpiece does not need to be manually overturned, and the workpiece processing efficiency can be improved.

Description

Technical Field

[0001] The invention relates to the technical field of plasma processing, in particular to a plasma generator for semiconductor processing. Background Art

[0002] The plasma generator commonly used in semiconductor processing is a device that can generate plasma, which plays an important role in semiconductor processing. In semiconductor processing, plasma generators are widely used in surface treatment processes such as etching, cleaning, polymerization, and thin film preparation. Through the treatment of the plasma surface treatment machine, it acts on the surface of the product, which can make the surface treatment effect of the product better and more firm, improve the process quality, and enhance product reliability.

[0003] When a semiconductor workpiece is processed by a plasma surface treatment machine, the movement trajectory of the plasma nozzle of the plasma surface treatment machine relative to the workpiece surface usually cannot be adjusted according to the different shapes of the workpiece. The plasma nozzle may move out of the workpiece surface range, so that the plasma is not acted on the product surface, which will cause a lot of plasma loss and waste. For this reason, we propose a plasma generator for semiconductor processing. Summary of the invention

[0004] The object of the present invention is to provide a plasma generator for semiconductor processing, so as to solve the problem raised in the above background technology that when processing the surface of a semiconductor workpiece, the plasma nozzle may move out of the workpiece surface range, so that the plasma is not acted on the product surface, thereby causing a large amount of plasma loss and waste.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: A plasma generator for semiconductor processing, comprising: a support frame, a body is arranged on the support frame, a guide rail is fixedly arranged on the body, a slide seat is slidably arranged on the guide rail, a nozzle device is arranged on the upper side of the body, a plasma generator is arranged on the support frame, and an air pipe is connected between the plasma generator and the nozzle device.

[0006] It also includes: a processing component, which is arranged on the slide and the nozzle device, and is used to adjust the movement trajectory of the nozzle device relative to the workpiece surface during processing;

[0007] The turning assembly is arranged on both sides of the slide and is used to turn the workpiece.

[0008] Among them, the processing component includes a placing table arranged on the upper side of the slide, a ring-shaped part is movably arranged on the outer side of the placing table, a first clamp is fixedly provided on the side of the ring-shaped part close to the nozzle device, an installation cavity is provided on the side of the ring-shaped part away from the nozzle device, and a cover plate is detachably fixed on the upper side of the installation cavity of the ring-shaped part.

[0009] Among them, a gear is rotatably arranged in the installation cavity of the annular part, and racks are meshingly connected on both sides of the gear. A first connecting rod is fixed on the upper side of the rack on one side, and a second connecting rod is fixed on the upper side of the rack on the other side. The first connecting rod and the second connecting rod are both movable and pass through the cover plate. A second clamp is fixed at one end of the first connecting rod and the second connecting rod, and a telescopic end of the first electric push rod is fixed at one end of the rack on one side.

[0010] Among them, a second electric push rod is fixed on the upper side of the cover plate, a third clamp is fixed on the telescopic end of the second electric push rod, a mounting block fixed to the cover plate is provided on one side of the third clamp, and a distance sensor is provided on the side of the mounting block close to the third clamp.

[0011] Among them, the two second clamps are slidably provided with a sliding shell on an inner side close to the first clamp, the second clamp is provided with a sliding cavity located at the sliding shell, a sliding block is slidably provided on the inner side of the sliding shell, a first spring is fixed between the sliding block and the sliding shell, and a pressure sensor is installed on the inner side of the sliding cavity of the second clamp.

[0012] Among them, a sensing module is fixedly provided on one side of the nozzle device, a connecting block is fixedly provided on the upper side of the second clamp on the left side, a first marking part is fixedly provided on the connecting block, first electromagnetic blocks are fixedly provided at equal intervals on the upper side of the second clamp on the right side, and second electromagnetic blocks are fixedly provided at equal intervals on the upper side of the second clamp on the left side, and multiple first electromagnetic blocks and second electromagnetic blocks are arranged at intervals.

[0013] Among them, mounting parts are fixed on the left and right sides of the nozzle device, a third electromagnetic block is slidably arranged on the lower side of the mounting part, a second spring fixed to the mounting part is symmetrically arranged on the upper side of the third electromagnetic block, and a first switch is installed on the mounting part located on the upper side of the third electromagnetic block.

[0014] Among them, a second marking member is fixed on the first clamp, a first motor is fixed on the inner side of the slide, the output shaft of the first motor is fixed to the placement table, a mounting shell is arranged on one side of the ring, a support rod fixed to the slide is arranged on the lower side of the mounting shell, a wedge block is slidably arranged on the inner side of the mounting shell, a third spring is symmetrically fixed between the wedge block and the mounting shell, a second switch is installed on the inner side of the mounting shell, and a pressure block is fixed on the side of the ring close to the wedge block.

[0015] Among them, the flipping assembly includes four support blocks fixed to the sliding seat, the four support blocks are respectively located on both sides of the sliding seat and are symmetrically arranged, connecting parts are slidably arranged on the lower sides of the four support blocks, third electric push rods are fixed on the upper sides of the two connecting parts on the right, telescopic rods are fixed on the upper sides of the two connecting parts on the left, and support plates are fixed on the telescopic ends of the third electric push rods and the telescopic rods on both sides.

[0016] Among them, a second motor is fixedly provided in the middle of one support plate, the output shaft of the second motor movably passes through the support plate and is fixedly provided with a transmission shaft, a support shaft is rotatably provided in the middle of the other support plate, one end of the transmission shaft and the support shaft are fixedly provided with plug-in blocks, the middle of the front and rear sides of the annular member are provided with slots matching the plug-in blocks, a fixed block is fixedly provided on one side of the sliding seat, and fourth electric push rods are fixedly provided on both sides of the fixed block, and the telescopic ends of the two fourth electric push rods are respectively fixedly provided with the connecting pieces on the front and rear sides.

[0017] The present invention has at least the following beneficial effects:

[0018] The present invention can clamp and fix the workpiece through the processing component to ensure the stability of the workpiece during processing, and can adjust the movement trajectory of the nozzle device relative to the workpiece surface during processing according to the semiconductor workpiece of different shapes such as rectangle or circle to adapt to the shape of the workpiece, so that the plasma ejected by the nozzle device acts on the workpiece surface, reducing the loss and waste of plasma and achieving the effect of saving resources; after the surface treatment of one side of the workpiece is completed, if the other surface of the workpiece needs to be processed, the workpiece can be conveniently flipped through the flipping component, without the need for manual flipping of the workpiece, and the processing efficiency of the workpiece can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the front-view stereoscopic structure of the present invention;

[0020] Figure 2 It is a schematic diagram of the overall structure of the processing component and the flip component of the present invention;

[0021] Figure 3 It is a schematic diagram of the structure of the explosion of the ring member and the cover plate of the present invention;

[0022] Figure 4 It is a schematic structural diagram of a cross-section of the second clamping member of the present invention located at the sliding shell;

[0023] Figure 5 It is a structural schematic diagram of the connection of the mounting parts of the present invention;

[0024] Figure 6 It is a schematic structural diagram of the lower side cross-section of the mounting member of the present invention;

[0025] Figure 7 It is a schematic diagram of the structure of the placement table and the slide seat explosion of the present invention;

[0026] Figure 8 It is a schematic structural diagram of a cross-section of the installation shell of the present invention;

[0027] Fig. 9 It is a schematic structural diagram of the flip assembly of the present invention.

[0028] In the figure: 11, support frame; 12, machine body; 13, guide rail; 14, slide seat; 15, nozzle device; 16, plasma generator; 17, air pipe; 2, processing assembly; 21, placement table; 22, ring member; 23, first clamp; 24, gear; 25, rack; 26, first connecting rod; 27, second connecting rod; 28, first electric push rod; 29, second clamp; 210, first electromagnetic block; 211, second electromagnetic block; 212, cover plate; 213, support rod; 214, second electric push rod; 215, third clamp; 216, mounting block; 217, distance sensor; 218, sliding shell; 219, slider; 220, pressure sensor; 221 , first spring; 222, mounting piece; 223, sensing module; 224, connecting block; 225, first marking piece; 226, second marking piece; 227, third electromagnetic block; 228, first switch; 229, second spring; 230, first motor; 231, pressure block; 232, mounting shell; 233, wedge block; 234, second switch; 235, third spring; 3, flip assembly; 31, support block; 32, connecting piece; 33, third electric push rod; 34, telescopic rod; 35, support plate; 36, second motor; 37, transmission shaft; 38, plug block; 39, slot; 310, fixing block; 311, fourth electric push rod; 312, support shaft. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] Embodiment 1

[0031] See also Figures 1 to 9 The present invention provides a technical solution: a plasma generator for semiconductor processing, comprising: a support frame 11, a body 12 is arranged on the support frame 11, a guide rail 13 is fixedly arranged on the body 12, a slide seat 14 is slidably arranged on the guide rail 13, a nozzle device 15 is arranged on the upper side of the body 12, a plasma generator 16 is arranged on the support frame 11, and an air pipe 17 is connected between the plasma generator 16 and the nozzle device 15,

[0032] It also includes: a processing component 2, which is arranged on the slide 14 and the nozzle device 15, and the processing component 2 is used to adjust the movement trajectory of the nozzle device 15 relative to the workpiece surface during processing;

[0033] The turning assembly 3 is arranged on both sides of the slide 14 and is used to turn the workpiece.

[0034] When the plasma surface treatment body 12 treats the semiconductor workpiece, the position between the workpiece and the nozzle device 15 is adjusted by sliding the slide 14 in the front-to-back direction of the guide rail 13 and the nozzle device 15 in the up-down and left-to-right direction, and the plasma generated by the plasma generator 16 passes through the air pipe 17 and is sprayed onto the surface of the workpiece by the nozzle device 15 to treat the surface of the workpiece; the workpiece can be clamped and fixed by the treatment component 2 to ensure the stability of the workpiece during treatment, and the movement trajectory of the nozzle device 15 relative to the workpiece surface during treatment can be adjusted according to the semiconductor workpiece of different shapes such as rectangle or circle to adapt to the shape of the workpiece, so that the plasma sprayed by the nozzle device 15 acts on the surface of the workpiece, reducing the loss and waste of plasma and achieving the effect of saving resources; after the surface treatment of one side of the workpiece is completed, if the other surface of the workpiece needs to be treated, the workpiece can be conveniently turned over by the turning component 3, without the need for manual turning over of the workpiece, which can improve the processing efficiency of the workpiece.

[0035] Embodiment 2

[0036] The processing assembly 2 includes a placement table 21 arranged on the upper side of the slide 14, a ring member 22 is movably arranged on the outer side of the placement table 21, a first clamp 23 is fixedly arranged on the side of the ring member 22 close to the nozzle device 15, a part of the first clamp 23 is located on the placement table 21, and a mounting cavity is arranged on the side of the ring member 22 away from the nozzle device 15, and a cover plate 212 is detachably fixedly arranged on the upper side of the mounting cavity of the ring member 22, and by removing the cover plate 212, it is convenient to perform operations such as inspection and maintenance on the components in the mounting cavity of the ring member 22;

[0037] A gear 24 is rotatably arranged in the mounting cavity of the ring member 22, and racks 25 are meshed and connected on both sides of the gear 24. A first connecting rod 26 is fixedly arranged on the upper side of the rack 25 on one side, and a second connecting rod 27 is fixedly arranged on the upper side of the rack 25 on the other side. The first connecting rod 26 and the second connecting rod 27 are both movable through the cover plate 212. A second clamp 29 is fixedly arranged at one end of the first connecting rod 26 and the second connecting rod 27. The second clamp 29 can slide left and right along the first clamp 23. A first electric push rod 26 is fixedly arranged at one end of the rack 25 on one side. The telescopic end of the rod 28 and the fixed end of the first electric push rod 28 are fixed to the ring member 22; when in use, the workpiece is placed on the placement table 21, and one end of the workpiece can be pressed against one side of the first clamp 23. By controlling the extension of the telescopic end of the first electric push rod 28, the rack 25 on one side is driven to move, and the gear 24 is rotated, so that the rack 25 on the other side moves relatively, so that the first connecting rod 26 and the second connecting rod 27 on both sides are used to make the second clamps 29 on both sides clamp the left and right sides of the workpiece in the center.

[0038] A second electric push rod 214 is fixedly provided on the upper side of the cover plate 212. The second electric push rod 214 and the first electric push rod 28 can adopt multi-stage electric push rods according to actual needs. A third clamp 215 is fixedly provided at the telescopic end of the second electric push rod 214. A mounting block 216 fixed to the cover plate 212 is provided on one side of the third clamp 215. A distance sensor 217 is provided on the side of the mounting block 216 close to the third clamp 215. After the workpiece is placed on the placement table 21, the third clamp 215 is driven to move by controlling the extension of the telescopic end of the second electric push rod 214. The front and rear sides of the workpiece can be clamped by the third clamp 215 and the first clamp 23, so that the workpiece can be kept stable when being processed, thereby ensuring the processing effect.

[0039] The two second clamps 29 are both slidably provided with a sliding shell 218 on one inner side close to the first clamp 23. The second clamp 29 is provided with a sliding cavity at the sliding shell 218. The sliding shell 218 is slidably provided in the sliding cavity of the second clamp 29. A slider 219 is slidably provided inside the sliding shell 218. A first spring 221 is fixed between the slider 219 and the sliding shell 218. A pressure sensor 220 is installed inside the sliding cavity of the second clamp 29. After the four sides of the workpiece are clamped by the second clamps 29, the first clamp 23 and the third clamp 215 on both sides, if the workpiece is shaped If the shape of the workpiece is rectangular, then after clamping, the workpiece will press the sliding shell 218 to move toward the inner side of the sliding cavity of the second clamp 29, so that the first spring 221 is compressed, and a thrust is exerted on the slider 219, so that the slider 219 exerts a force on the pressure sensor 220. The pressure sensor 220 detects the change in force and transmits the signal to the controller, which indicates that the shape of the workpiece to be processed is rectangular. If the shape of the workpiece is circular, the side of the workpiece will not press against the sliding shell 218, and the pressure sensor 220 will not detect the change in pressure, which indicates that the shape of the workpiece to be processed is circular.

[0040] A sensing module 223 is fixedly provided on one side of the nozzle device 15, and the sensing module 223 is located at the diagonal left rear side of the plasma nozzle on the lower side of the nozzle device 15. A connecting block 224 is fixedly provided on the upper side of the left second clamp 29, and a first marking member 225 is fixedly provided on the connecting block 224. First electromagnetic blocks 210 are fixedly provided on the upper side of the right second clamp 29 at equal intervals, and second electromagnetic blocks 211 are fixedly provided on the upper side of the left second clamp 29 at equal intervals. A plurality of first electromagnetic blocks 210 and second electromagnetic blocks 211 are arranged at intervals. The left and right sides of the nozzle device 15 are fixed with mounting parts 222, and a third electromagnetic block 227 is slidably arranged on the lower side of the mounting part 222, and the lower side of the mounting part 222 is through-arranged, and a second spring 229 fixed with the mounting part 222 is symmetrically arranged on the upper side of the third electromagnetic block 227, and the mounting part 222 is located on the upper side of the third electromagnetic block 227. A first switch 228 is installed, and after power is turned on, the first electromagnetic block 210 and the second electromagnetic block 211 will repel the third electromagnetic block 227;

[0041] If the shape of the workpiece to be processed is a rectangle, the controller will control the movement of the nozzle device 15 in the left and right directions and the movement of the slide 14 in the front and back directions. When the sensing module 223 senses the first marking member 225, the plasma nozzle on the lower side of the nozzle device 15 is located at the left rear position of the workpiece, which is the starting position for processing, and the first electromagnetic block 210, the second electromagnetic block 211 and the third electromagnetic block 227 are controlled to be energized to generate magnetism. By controlling the up and down movement of the nozzle device 15, the distance from the surface of the workpiece is adjusted. Subsequently, the controller controls the nozzle device 15 to move to the right and sprays plasma to process the surface of the workpiece. When the nozzle on the lower side of the nozzle device 15 moves to the rightmost side of the workpiece, the right side mounting member 222 corresponds to the first first electromagnetic block 210 on the rear side of the second clamp 29 on the right side, so that the third electromagnetic block 227 on the lower side of the right side mounting member 222 is repelled, so that the third electromagnetic block 227 on the right side moves up, the second spring 229 is compressed, and presses the first switch 228, and the control The slide 14 is controlled to move a certain distance to the rear side so that the next position of the workpiece moves to the lower side of the nozzle device 15, and the nozzle device 15 is controlled to move to the left side to process the surface of the next position of the workpiece. When the nozzle of the nozzle device 15 moves to the leftmost side of the workpiece, the left mounting member 222 corresponds to the rear first second electromagnetic block 211 on the left second clamp 29, so that the left third electromagnetic block 227 moves up to press the first switch 228, so that the slide 14 moves a certain distance to the rear side. The nozzle device 15 is controlled to move to the right to process the surface of the next position of the workpiece. After the nozzle device 15 moves to the rightmost side of the workpiece, the third electromagnetic block 227 on the right side corresponds to the second first electromagnetic block 210 on the rear side, so that the third electromagnetic block 227 moves up to press the first switch 228, and then the slide 14 moves backward, and the nozzle device 15 moves to the left, and so on and so forth, so that the plasma nozzle on the lower side of the nozzle device 15 moves in an "S"-shaped matrix relative to the surface of the workpiece to process the surface of the workpiece;

[0042] Initially, the distance between the third clamp 215 and the first clamp 23 is fixed. After the third clamp 215 moves and clamps the front and rear sides of the workpiece with the first clamp 23, the distance moved by the third clamp 215 can be detected by the distance sensor 217, so that the length dimension of the workpiece in the front and rear direction can be analyzed. When the nozzle device 15 sprays plasma to process the surface of the workpiece, when the total distance moved to the rear side by the slide 14 reaches the length dimension in the front and rear direction of the workpiece, it means that the surface of the workpiece has been completely processed, and the controller will control and stop the processing of the workpiece surface.

[0043] A second marking member 226 is fixedly disposed on the first clamp 23, a first motor 230 is fixedly disposed inside the slide 14, an output shaft of the first motor 230 is fixedly disposed on the placement table 21, a mounting shell 232 is disposed on one side of the ring member 22, a support rod 213 fixedly disposed on the lower side of the mounting shell 232 and fixedly disposed on the slide 14, a wedge block 233 is slidably disposed inside the mounting shell 232, a third spring 235 is symmetrically fixedly disposed between the wedge block 233 and the mounting shell 232, a second switch 234 is mounted on the inside of the mounting shell 232, and a pressing block 231 is fixedly disposed on one side of the ring member 22 close to the wedge block 233;

[0044] If the shape of the workpiece to be processed is circular, after the workpiece is clamped, the rear side of the circular workpiece will be against the middle of the first clamp 23, and through the movement of the slide 14 and the nozzle device 15, when the sensing module 223 senses the second marking member 226, the plasma nozzle of the nozzle device 15 will face downward to the middle rear side of the circular workpiece, which is the starting position for processing. During processing, the position of the nozzle device 15 will not move, and the placement table 21 is driven to rotate by controlling the output shaft of the first motor 230, and the annular member 22 can also be driven to rotate, so as to keep the clamping of the workpiece stable during processing, thereby driving the workpiece on the placement table 21 to rotate, so as to pass through the nozzle device The plasma ejected from the device 15 processes the surface of the workpiece. When rotating one circle, the pressing block 231 presses the wedge block 233 to slide toward the inner side of the mounting shell 232, the third spring 235 is compressed, and the wedge block 233 presses the second switch 234, and the slide 14 is controlled to move a certain distance to the rear side, so as to perform circumferential processing on the next position of the workpiece, and this process is repeated; similarly, the diameter size of the circular workpiece can be analyzed through the distance sensor 217. When the total distance moved to the rear side by the slide 14 reaches half of the diameter size of the circular workpiece, it means that the surface of the workpiece has been completely processed, and the controller will control and stop processing the surface of the workpiece;

[0045] Therefore, the processing component 2 can be used to adjust the movement trajectory of the nozzle device 15 relative to the workpiece surface during processing according to the semiconductor workpiece of different shapes such as rectangle or circle, so that the plasma ejected by the nozzle device 15 acts on the workpiece surface, reduces the loss and waste of plasma, and achieves a saving effect; and when the workpiece is rectangular, the moving distance when the second clamp 29 clamps the left and right sides of the workpiece can also be analyzed to obtain the length dimension of the workpiece in the left and right directions, and then the surface area of ​​the workpiece can be obtained. If the workpiece is circular, the surface area of ​​the circular workpiece can also be obtained by analyzing the diameter dimension of the circular workpiece. Therefore, according to the surface area of ​​the workpiece to be processed, the total amount of plasma ejected during processing can be controlled. After the total amount of plasma ejected is reached, it indicates that the surface processing of the workpiece has been completed, which can further facilitate the processing of the workpiece surface and achieve a saving effect.

[0046] Embodiment 3

[0047] The flip assembly 3 includes four support blocks 31 fixed to the slide 14, the four support blocks 31 are respectively located on both sides of the slide 14 and are symmetrically arranged, and connecting members 32 are slidably arranged on the lower sides of the four support blocks 31, the support blocks 31 can support and guide the connecting members 32, and during the forward and backward movement of the slide 14, the support blocks 31 and the connecting members 32 will not touch the guide rail 13, the upper sides of the two right connecting members 32 are fixed with third electric push rods 33, and the upper sides of the two left connecting members 32 are fixed with telescopic rods 34, and the telescopic ends of the third electric push rods 33 and the telescopic rods 34 on both sides are fixed with support plates 35, the telescopic rods 34 can assist in supporting and guiding the up and down movement of the support plates 35, and the third electric push rods 33 and the telescopic rods 34 can be set to multiple levels according to actual needs to ensure the height of the support plates 35 when they rise.

[0048] A second motor 36 is fixedly arranged in the middle of the support plate 35 on one side, and the output shaft of the second motor 36 movably passes through the support plate 35 and is fixedly arranged with a transmission shaft 37. A support shaft 312 is rotatably arranged in the middle of the support plate 35 on the other side, and one end of the transmission shaft 37 and the support shaft 312 are fixedly arranged with an insert block 38. The middle of the front and rear sides of the ring member 22 are provided with a slot 39 adapted to the insert block 38. A fixed block 310 is fixedly arranged on one side of the slide seat 14, and fourth electric push rods 311 are fixedly arranged on both sides of the fixed block 310. The telescopic ends of the two fourth electric push rods 311 are respectively fixedly arranged with the connecting members 32 on the front and rear sides.

[0049] When the other surface of the workpiece needs to be processed, the connecting members 32 on both sides are driven to move closer to each other by controlling the telescopic ends of the fourth electric push rods 311 on both sides, so that the plug blocks 38 on both sides are inserted into the slots 39 on both sides of the annular member 22, and the telescopic ends of the third electric push rods 33 are controlled to drive the support plate 35 to move upward, thereby driving the annular member 22 and the workpiece clamped by the first clamp 23, the second clamps 29 on both sides and the third clamp 215 to move upward, and the output shaft of the second motor 36 drives the transmission shaft 37 and the plug block 38 to rotate, so that the annular member 22 and the clamped workpiece are turned 180 degrees around the axis, and the annular member 22 and the clamped workpiece are turned 180 degrees around the axis through the third electric push rod 33. The first clamp 23 and the second clamp 29 on both sides and the third clamp 215 release the clamping of the workpiece, so that the workpiece is flipped over and placed on the placement table 21, and the third electric push rod 33 drives the support plate 35 and the annular member 22 to move upward, and the second motor 36 is used to flip the annular member 22 in the opposite direction and reset it, and then the annular member 22 is moved down and reset, and then the fourth electric push rods 311 on both sides are controlled to drive the connecting members 32 on both sides to move away from each other, so that the flipping assembly 3 will not hinder the first motor 230 from driving the placement table 21 and the annular member 22 to rotate, and then the other surface of the workpiece can be processed by the processing assembly 2.

[0050] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0051] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A plasma generator for semiconductor processing, comprising: A support frame (11), a body (12) is arranged on the support frame (11), a guide rail (13) is fixedly arranged on the body (12), a slide seat (14) is slidably arranged on the guide rail (13), a nozzle device (15) is arranged on the upper side of the body (12), a plasma generator (16) is arranged on the support frame (11), and an air pipe (17) is connected between the plasma generator (16) and the nozzle device (15), The invention is characterized in that it also comprises: a processing component (2), wherein the processing component (2) is arranged on the slide seat (14) and the nozzle device (15), and the processing component (2) is used to adjust the movement trajectory of the nozzle device (15) relative to the workpiece surface during processing; A turning assembly (3), wherein the turning assembly (3) is arranged on both sides of the slide seat (14), and the turning assembly (3) is used to turn the workpiece.

2. The plasma generator for semiconductor processing according to claim 1, characterized in that: The processing assembly (2) comprises a placement platform (21) arranged on the upper side of the slide (14), an annular member (22) is movably arranged on the outer side of the placement platform (21), a first clamp (23) is fixedly arranged on the side of the annular member (22) close to the nozzle device (15), an installation cavity is arranged on the side of the annular member (22) away from the nozzle device (15), and a cover plate (212) is detachably fixedly arranged on the upper side of the installation cavity of the annular member (22).

3. The plasma generator for semiconductor processing according to claim 2, characterized in that: A gear (24) is rotatably arranged in the mounting cavity of the annular member (22), and racks (25) are meshingly connected on both sides of the gear (24). A first connecting rod (26) is fixedly arranged on the upper side of the rack (25) on one side, and a second connecting rod (27) is fixedly arranged on the upper side of the rack (25) on the other side. The first connecting rod (26) and the second connecting rod (27) are both movable and penetrate the cover plate (212), and a second clamp (29) is fixedly arranged on one end of the first connecting rod (26) and the second connecting rod (27). A telescopic end of a first electric push rod (28) is fixedly arranged on one end of the rack (25) on one side.

4. The plasma generator for semiconductor processing according to claim 2, characterized in that: A second electric push rod (214) is fixedly provided on the upper side of the cover plate (212); a third clamp (215) is fixedly provided at the telescopic end of the second electric push rod (214); a mounting block (216) fixedly provided with the cover plate (212) is provided on one side of the third clamp (215); and a distance sensor (217) is provided on the side of the mounting block (216) close to the third clamp (215).

5. The semiconductor processing plasma generator according to claim 3, characterized in that: A sliding shell (218) is slidably provided on an inner side of each of the two second clamps (29) close to the first clamp (23); a sliding cavity is provided on the sliding shell (218) of the second clamp (29); a slider (219) is slidably provided on the inner side of the sliding shell (218); a first spring (221) is fixedly provided between the slider (219) and the sliding shell (218); and a pressure sensor (220) is installed on the inner side of the sliding cavity of the second clamp (29).

6. The semiconductor processing plasma generator according to claim 3, characterized in that: A sensing module (223) is fixedly arranged on one side of the nozzle device (15); a connecting block (224) is fixedly arranged on the upper side of the second clamp (29) on the left side; a first marking member (225) is fixedly arranged on the connecting block (224); first electromagnetic blocks (210) are fixedly arranged on the upper side of the second clamp (29) on the right side at equal intervals; second electromagnetic blocks (211) are fixedly arranged on the upper side of the second clamp (29) on the left side at equal intervals; and a plurality of the first electromagnetic blocks (210) and the second electromagnetic blocks (211) are arranged at intervals.

7. The plasma generator for semiconductor processing according to claim 6, characterized in that: The left and right sides of the nozzle device (15) are fixedly provided with mounting parts (222); a third electromagnetic block (227) is slidably provided on the lower side of the mounting part (222); a second spring (229) fixed to the mounting part (222) is symmetrically provided on the upper side of the third electromagnetic block (227); and a first switch (228) is installed on the upper side of the mounting part (222) located on the third electromagnetic block (227).

8. The plasma generator for semiconductor processing according to claim 2, characterized in that: A second marking member (226) is fixedly provided on the first clamp (23), a first motor (230) is fixedly provided on the inner side of the slide seat (14), an output shaft of the first motor (230) is fixedly provided on the placement table (21), a mounting shell (232) is provided on one side of the annular member (22), a support rod (213) fixedly provided on the lower side of the mounting shell (232) and fixedly provided on the slide seat (14), a wedge block (233) is slidably provided on the inner side of the mounting shell (232), a third spring (235) is symmetrically fixedly provided between the wedge block (233) and the mounting shell (232), a second switch (234) is installed on the inner side of the mounting shell (232), and a pressure block (231) is fixedly provided on the side of the annular member (22) close to the wedge block (233).

9. The semiconductor processing plasma generator according to claim 2, characterized in that: The flip assembly (3) comprises four support blocks (31) fixed to the slide seat (14), the four support blocks (31) are respectively located on both sides of the slide seat (14) and are symmetrically arranged, the lower sides of the four support blocks (31) are all slidably provided with connecting members (32), the upper sides of the two right connecting members (32) are both fixed with third electric push rods (33), the upper sides of the two left connecting members (32) are both fixed with telescopic rods (34), and the telescopic ends of the third electric push rods (33) and the telescopic rods (34) on both sides are both fixed with support plates (35).

10. The plasma generator for semiconductor processing according to claim 9, characterized in that: A second motor (36) is fixedly arranged in the middle of the support plate (35) on one side, and an output shaft of the second motor (36) movably passes through the support plate (35) and is fixedly arranged with a transmission shaft (37); a support shaft (312) is rotatably arranged in the middle of the support plate (35) on the other side, and an insertion block (38) is fixedly arranged at one end of the transmission shaft (37) and the support shaft (312); a slot (39) matching the insertion block (38) is opened in the middle of the front and rear sides of the annular member (22); a fixing block (310) is fixedly arranged on one side of the slide seat (14), and fourth electric push rods (311) are fixedly arranged on both sides of the fixing block (310); and the telescopic ends of the two fourth electric push rods (311) are respectively fixedly arranged with the connecting members (32) on the front and rear sides.

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