Heat dissipation structure and active phased array antenna

Abstract

The invention discloses a heat dissipation structure and an active phased array antenna, the heat dissipation structure comprises a water cooling structure and a phase change plate, the water cooling structure comprises a water cooling plate and a support body, and the water cooling plate is internally provided with a flow channel through which a cooling liquid flows. One end of the supporting body is connected to the water cooling plate, and the supporting body and the water cooling plate are integrally formed. And the phase change plate is filled with a phase change material, is detachably connected to the supporting body, and is arranged opposite to the water cooling plate relative to the supporting body. The water cooling plate and the phase change plate are arranged at the same time to form a combined heat dissipation structure, multi-channel heat dissipation is achieved, the heat dissipation efficiency is higher, the water cooling plate and the supporting body form an integrally-formed water cooling structure, the heat dissipation effect is effectively improved while the structural strength is guaranteed, more space is reserved for arrangement and design of flow channels, and the heat dissipation efficiency is improved. The antenna is suitable for a miniaturized high-integration-level active phased-array antenna.

Description

Technical Field

[0001] The present invention relates to the technical field of active phased array antennas, and in particular to a heat dissipation structure for an active phased array antenna and an active phased array antenna comprising the heat dissipation structure. Background Art

[0002] Phased array radar, or phase-controlled electronically scanned array radar, is a radar array composed of a large number of identical radiating units, which can obtain accurate and predictable radiation patterns and beam pointing. According to the type of phased array antenna used, phased array radar can be specifically divided into active phased array radar and passive phased array radar.

[0003] An active phased array radar is a phased array radar that uses an active phased array antenna. Each antenna element of the active phased array antenna has an independent T / R (Transmit / Receive) component, and uses a microwave integration method to integrate components such as phase shifters, filters, attenuators, power amplifiers, and low-noise amplifiers into the same chip. Compared with passive phased array antennas, it achieves miniaturization and lightweight of the equipment.

[0004] However, it is precisely because of the miniaturization of the active phased array antenna structure and the high integration of electronic components that a higher heat flux density will be generated during operation, posing greater challenges to the heat dissipation structure design of the active phased array antenna.

[0005] At present, active phased array antennas with high heat flux density mainly use single-channel forced liquid cooling as the preferred heat dissipation method, which has poor heat dissipation effect and has great limitations in the layout design of the flow channel, and cannot meet the ever-increasing heat dissipation needs in the field of active phased array antenna technology. Summary of the invention

[0006] The object of the present invention is to provide a heat dissipation structure for an active phased array antenna and an active phased array antenna including the heat dissipation structure, so as to improve the heat dissipation effect and meet the ever-increasing heat dissipation requirements in the field of active phased array antenna technology.

[0007] In order to achieve the above objectives, the first aspect of the present invention provides a heat dissipation structure for an active phased array antenna, comprising:

[0008] A water cooling structure, comprising:

[0009] A water-cooling plate, wherein a flow channel for a coolant to flow therethrough is provided inside the water-cooling plate; and

[0010] A support body, one end of which is connected to the water-cooling plate, and the support body is configured to be integrally formed with the water-cooling plate; and

[0011] A phase change plate, wherein the interior of the phase change plate is filled with a phase change material, the phase change plate is detachably connected to the support body, and is arranged opposite to the water cooling plate with respect to the support body.

[0012] Optionally, a portion of the water cooling plate not provided with the flow channel is evenly provided with a plurality of connector through holes, and

[0013] The distance between the inner wall of the connector through hole and the side wall of the flow channel is not less than 1.5 mm.

[0014] Optionally, a first opening and a second opening are provided on the side wall of the support body, and the first opening and the second opening are respectively connected to two ends of the flow channel.

[0015] Optionally, the first opening and the second opening are located on the same side wall of the support body.

[0016] Optionally, the heat dissipation structure further includes a cover plate, which is detachably connected to the support body and is used to seal the first opening and the second opening.

[0017] Optionally, the flow channel includes a first flow section of a main flow channel, a first branch flow channel, a second flow section of the main flow channel, a second branch flow channel and a third flow section of the main flow channel, which are sequentially arranged along the outer edge of the water-cooled plate.

[0018] The first flow section of the main channel and the third flow section of the main channel are arranged on the same side of the water-cooled plate and are connected to the first opening and the second opening respectively; the second flow section of the main channel is arranged on the opposite side of the first flow section of the main channel and the third flow section of the main channel;

[0019] The first branch channel and the second branch channel are respectively arranged on the adjacent two sides of the second flow segment of the main channel; the first branch channel connects the first flow segment of the main channel with the second flow segment of the main channel; the second branch channel connects the third flow segment of the main channel with the second flow segment of the main channel.

[0020] Optionally, at least part of the cross-section of the first branch flow channel and the second branch flow channel along the height direction of the heat dissipation structure is configured to be sawtooth-shaped.

[0021] Optionally, the flow channel further includes:

[0022] at least one third branch flow channel, the third branch flow channel being arranged in parallel with the first branch flow channel, one end of the third branch flow channel being connected to the first flow section of the main flow channel, and the other end of the third branch flow channel being connected to the second flow section of the main flow channel; and

[0023] at least one fourth branch flow channel, the fourth branch flow channel is arranged in parallel with the second branch flow channel, one end of the fourth branch flow channel is connected to the third flow section of the main flow channel, and the other end is connected to the second flow section of the main flow channel,

[0024] The third branch flow channel and the fourth branch flow channel are arranged between the first branch flow channel and the second branch flow channel.

[0025] Optionally, at least part of the cross-section of the third branch flow channel and the fourth branch flow channel along the height direction of the heat dissipation structure is configured to be corrugated.

[0026] A second aspect of the present invention provides an active phased array antenna, comprising:

[0027] The heat dissipation structure according to any one of the first aspects above; and

[0028] A heat source is arranged inside the support body, and two ends of the heat source are respectively in contact with the inner end surfaces of the water cooling plate and the phase change plate.

[0029] Compared with the prior art, the present invention has at least the following technical effects:

[0030] By simultaneously arranging a water-cooled plate with a cold channel and a phase change plate filled with a phase change material, a combined heat dissipation structure is formed, and heat is dissipated from two end surfaces to a heat source with a high heat flux density, thereby realizing multi-channel heat dissipation, having a better heat dissipation effect, and having a higher heat dissipation efficiency.

[0031] By constructing the water cooling plate and the support body into an integrally formed water cooling structure, the thermal resistance between the water cooling plate and the support body is fully reduced, while the structural strength of the water cooling plate and the support body is increased, thereby improving the overall structural reliability of the heat dissipation structure.

[0032] By constructing the water-cooling plate and the support body as an integrated water-cooling structure, the assembly relationship of the heat dissipation structure is simplified. The water-cooling plate and the support body no longer need to be connected and fixed by other components, leaving more space for the arrangement and design of the flow channel. It is suitable for miniaturized heat sources and is convenient for further improving the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings required for the description. Obviously, the drawings described below are an embodiment of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work:

[0034] Figure 1 It is an exploded schematic diagram of a heat dissipation structure according to a specific embodiment of the present invention;

[0035] Figure 2is a three-dimensional schematic diagram of a water cooling structure according to a specific embodiment of the present invention;

[0036] Figure 3 for Figure 2 Schematic diagram of the internal structure of the water cooling structure;

[0037] Figure 4 is a three-dimensional schematic diagram of a phase change plate according to a specific embodiment of the present invention;

[0038] Figure 5 It is a three-dimensional schematic diagram of a heat dissipation structure according to a specific embodiment of the present invention.

[0039] Description of reference numerals:

[0040] 100: Heat dissipation structure

[0041] 10: Water cooling structure

[0042] 20: Water cooling plate

[0043] 21: Connector through hole

[0044] 22: Mounting hole

[0045] 30: Support body

[0046] 31: First Opening

[0047] 32: Second opening

[0048] 33: Cover

[0049] 34: Cover plate through hole

[0050] 35: Support body through hole

[0051] 40: Phase change board

[0052] 41: Phase change board first through hole

[0053] 42: Phase change plate second through hole

[0054] 50: Runner

[0055] 51: Main channel first flow section

[0056] 52: Second flow section of the main channel

[0057] 53: The third flow section of the main channel

[0058] 54: First branch

[0059] 55: Second branch

[0060] 56: The third branch

[0061] 57: The fourth branch DETAILED DESCRIPTION

[0062] The following is a further detailed description of a heat dissipation structure and an active phased array antenna proposed in the present invention in combination with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. In order to make the purposes, features and advantages of the present invention more obvious and easy to understand, please refer to the accompanying drawings. It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no technical substantive significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the effects that can be produced by the present invention and the purposes that can be achieved, should still fall within the scope of the technical content disclosed by the present invention.

[0063] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0064] In the description of the present invention, it should be understood that the terms "center", "height", "thickness", "up", "down", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0065] In the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0066] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0067] The present invention provides an active phased array antenna, including a heat dissipation structure 100 and a heat source. As those skilled in the art can understand, the heat source includes but is not limited to various components of the active phased array antenna and elements required to be heat-dissipated contained in each component. The above-mentioned various components are, for example, the T / R (Transmit / Receive) component, antenna unit and array surface component, power supply component, etc. of the active phased array antenna.

[0068] like Figures 1 to 3 As shown, specifically, the heat dissipation structure 100 includes a water-cooling structure 10 and a phase change plate 40, the water-cooling structure 10 includes a water-cooling plate 20 and a support body 30, and a flow channel 50 for the coolant to flow through is arranged inside the water-cooling plate 20. One end of the support body 30 is connected to the water-cooling plate 20, and the support body 30 is configured to be integrally formed with the water-cooling plate 20. The phase change plate 40 is filled with a phase change material, and the phase change plate 40 is detachably connected to the support body 30, and is arranged relative to the water-cooling plate 20 with respect to the support body 30.

[0069] First, the present invention respectively arranges the water cooling plate 20 and the phase change plate 40 at both ends of the heat dissipation structure 100 to form a combined heat dissipation structure 100, and dissipates heat from the two end faces to the heat source with high heat flux density, thereby realizing multi-channel heat dissipation, better heat dissipation effect and higher heat dissipation efficiency.

[0070] Furthermore, the present invention fully reduces the thermal resistance between the water-cooling plate 20 and the support body 30 by constructing the water-cooling structure 10 as an integral body, while ensuring the structural strength of the water-cooling structure 10 and improving the overall structural reliability of the heat dissipation structure 100. In addition, since the water-cooling plate 20 and the support body 30 are integrally formed, they do not need to be connected and fixed by other components, the assembly relationship is simpler, and the cost is saved, and more space is left for the arrangement and design of the flow channel 50, which is convenient for further improving the heat dissipation effect.

[0071] like Figure 2 and Figure 3 As shown, the portion of the water-cooled plate 20 where the flow channel 50 is not provided is evenly provided with a plurality of connector through holes 21, and the connector through holes 21 are used to realize the electrical connection between the heat source and the outside world. The present invention optimizes the position of the connector through holes 21, and combines the water-cooled plate 20 and the support body 30 to be integrally formed, thereby leaving more space for the arrangement of the flow channel 50. The specific arrangement and design of the flow channel 50 will be further described below. Some mounting holes 22 are also provided on the water-cooled plate 20 to facilitate the installation and positioning of the water-cooled plate 20. The distance between the inner wall of the connector through hole 21 and the side wall of the flow channel 50 is not less than 1.5 mm, so as to further ensure the strength and reliability of the overall structure of the water-cooled plate 20.

[0072] like Figure 2 and Figure 3 As shown, since the water cooling plate 20 and the support body 30 are integrally formed, a first opening 31 and a second opening 32 can be set on the side wall of the support body 30, and the first opening 31 and the second opening 32 are respectively connected to the two ends of the flow channel 50 to serve as a water inlet and a water outlet, so that the coolant can flow inside the flow channel 50 to achieve the effect of heat dissipation and cooling.

[0073] Preferably, the first opening 31 and the second opening 32 can be located on the same side wall of the support body 30. By arranging the water inlet and the water outlet of the flow channel 50 on the same side wall, it is beneficial to increase the overall length of the flow channel 50 and improve the heat dissipation effect. In addition, since the water inlet and the water outlet connecting the flow channel 50 need to ensure that the side wall has a certain thickness, arranging the water inlet and the water outlet on the same side wall is beneficial to simplifying the structure and reducing costs.

[0074] Furthermore, if Figure 1 and Figure 2As shown, the heat dissipation structure 100 also includes a cover plate 33. The cover plate 33 is provided with a cover plate through hole 34, and the side wall of the support body 30 is provided with a support body through hole 35 corresponding to the cover plate through hole 34 at the periphery of the first opening 31 and the second opening 32, so that the cover plate 33 can be detachably connected to the support body 30 by means of threaded connection or the like, thereby sealing the first opening 31 and the second opening 32. By providing the cover plate 33, the first opening 31 and the second opening 32 can be sealed when the flow channel 50 is not in use, thereby avoiding blockage and facilitating maintenance. The side wall provided with the first opening 31 and the second opening 32 needs to have a wall thickness of at least 1.5 mm, so as to facilitate the optimization design of the cross-sectional dimensions of the water inlet and the water outlet and the position design of the support body through hole 35.

[0075] Specifically, if Figure 3 As shown, the flow channel 50 includes a first flow segment 51 of the main flow channel, a first branch flow channel 54, a second flow segment 52 of the main flow channel, a second branch flow channel 55 and a third flow segment 53 of the main flow channel, which are sequentially arranged along the outer edge of the water-cooled plate 20. The first flow segment 51 of the main flow channel and the third flow segment 53 of the main flow channel are arranged on the same side of the water-cooled plate 20, and are connected to the first opening 31 and the second opening 32 respectively. The second flow segment 52 of the main flow channel is arranged on the opposite sides of the first flow segment 51 of the main flow channel and the third flow segment 53 of the main flow channel. The first branch flow channel 54 and the second branch flow channel 55 are respectively arranged on the adjacent two sides of the second flow segment 52 of the main flow channel. The first branch flow channel 54 connects the first flow segment 51 of the main flow channel with the second flow segment 52 of the main flow channel, and the second branch flow channel 55 connects the third flow segment 53 of the main flow channel with the second flow segment 52 of the main flow channel.

[0076] The first flow section 51 of the main channel, the first branch channel 54, the second flow section 52 of the main channel, the second branch channel 55 and the third flow section 53 of the main channel are connected in series to form a complete passage, which can initially achieve a water cooling effect.

[0077] Further, the flow channel 50 further includes at least one third branch flow channel 56 and at least one fourth branch flow channel 57. The third branch flow channel 56 is arranged in parallel with the first branch flow channel 54. One end of the third branch flow channel 56 is connected to the first flow segment 51 of the main flow channel, and the other end is connected to the second flow segment 52 of the main flow channel. The fourth branch flow channel 57 is arranged in parallel with the second branch flow channel 55. One end of the fourth branch flow channel 57 is connected to the third flow segment 53 of the main flow channel, and the other end is connected to the second flow segment 52 of the main flow channel. The third branch flow channel 56 and the fourth branch flow channel 57 are arranged between the first branch flow channel 54 and the second branch flow channel 55.

[0078] like Figure 3 As shown, the third branch channel 56 forms a parallel passage with the first branch channel 54, and the fourth branch channel 57 forms another parallel passage with the second branch channel 55. Taking into account the limitation of spatial layout, the present invention designs a series channel located around the water-cooled plate 20 in the main channel 50 of the water-cooled plate 20. At the same time, in order to increase the heat dissipation area, combined with the position of the connector through hole 21, two branch channels 50 that penetrate the cold plate are arranged in the middle position of the water-cooled plate 20 to form a parallel channel. The present invention adopts a mixed design form of series channels and parallel channels, so that the channel 50 can cover the entire heat dissipation surface while ensuring the electrical performance of the product, ensuring the uniform temperature control of the heat dissipation surface and improving the heat dissipation effect.

[0079] Furthermore, if Figure 3 As shown, the first branch flow channel 54 and the second branch flow channel 55 are at least partially constructed in a sawtooth shape, that is, the cross-section of the first branch flow channel 54 and the second branch flow channel 55 along the direction perpendicular to the water-cooled plate 20 is at least partially constructed in a sawtooth shape. The third branch flow channel 56 and the fourth branch flow channel 57 are at least partially constructed in a corrugated shape, that is, the cross-section of the third branch flow channel 56 and the fourth branch flow channel 57 along the direction perpendicular to the water-cooled plate 20 is at least partially constructed in a corrugated shape. According to the specific location of the flow channel 50 and the spatial structure layout, the present invention adopts a corrugated flow channel around the connector through hole 21 in the dense area of ​​the connector through hole 21, and designs a sawtooth flow channel or a straight flow channel on the periphery of the water-cooled plate 20, so as to maximize the heat dissipation area and heat dissipation efficiency while ensuring the structural strength.

[0080] In specific use, such as Figure 3 As shown, the coolant can, for example, flow into the first opening 31 along the first flow segment 51 of the main channel and respectively enter the third branch channel 56 and the first branch channel 54 (including a part of the first flow segment 51 of the main channel and the second flow segment 52 of the main channel), and then merge into the second flow segment 52 of the main channel. In the second half, it enters the fourth branch channel 57 and the second branch channel 55 (including a part of the third flow segment 53 of the main channel and the second flow segment 52 of the main channel), and finally merges into the third flow segment 53 of the main channel and is discharged through the second opening 32.

[0081] It is understandable that the present invention does not limit the flow direction of the coolant, that is, the coolant can also flow in through the second opening 32 and then flow out through the first opening 31. In an embodiment not shown in the figure, the first opening 31 and the second opening 32 can be arranged on different side walls of the support body 30, for example, they can be arranged on two adjacent side walls or two opposite side walls, that is, at least one of the first opening 31 and the second opening 32 can be arranged on the side wall where the first branch channel 54 or the second branch channel 55 is located, and the present invention does not limit this.

[0082] like Figure 4 and Figure 5 As shown, the phase change plate 40 is provided with a first through hole 41 and a second through hole 42 of the phase change plate, and the positions corresponding to the first through hole 41 and the second through hole 42 of the phase change plate on the support body 30 can be provided with screw holes, respectively, so that the phase change plate 40 can be detachably mounted to the support body 30 by screws. Since different side walls of the support body 30 can have different thicknesses, the first through hole 41 and the second through hole 42 of the phase change plate can have different structures and sizes, thereby further ensuring the reliability of the overall structure.

[0083] In specific use, the heat source can be arranged inside the support body 30, and then the phase change plate 40 can be connected to the support body 30 by screws, so that the two ends of the heat source are respectively in contact with the inner end surfaces of the water cooling plate 20 and the phase change plate 40. By making the water cooling plate 20 and the heat source, and the heat source and the mounting surface of the phase change plate 40 in a compressed state, the thermal resistance between the heat source and the heat dissipation structure 100 can be reduced, and the structural reliability and heat dissipation efficiency can be ensured.

[0084] As can be understood by those skilled in the art, the phase change plate 40 is filled with a large area of ​​phase change material. Since the temperature of the phase change material remains unchanged during the process of absorbing and releasing heat, but the material state changes, it is necessary to use a non-phase change material as the shell of the phase change plate 40 to improve the stability of the overall structure of the phase change plate 40. The heat absorption performance of the phase change material filled in the phase change plate 40 is better than the material used for the shell of the phase change plate 40, and reaches a heat absorption peak within a specific temperature range to fully meet the heat dissipation requirements of electronic components and improve heat dissipation efficiency.

[0085] The present invention realizes multi-channel heat dissipation and higher heat dissipation efficiency by simultaneously arranging the water-cooling plate 20 and the phase change plate 40 to form a combined heat dissipation structure 10, and the water-cooling plate 20 and the support body 30 are constructed as the water-cooling structure 10 to effectively improve the heat dissipation effect while ensuring the structural strength, leaving more space for arranging and designing the flow channel 50, which is suitable for miniaturized and highly integrated active phased array antennas, and has significant progress compared with the prior art.

[0086] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. A heat dissipation structure for an active phased array antenna, characterized in that: include: A water cooling structure, comprising: A water-cooling plate, wherein a flow channel for a coolant to flow therethrough is provided inside the water-cooling plate; and A support body, one end of which is connected to the water-cooling plate, and the support body is configured to be integrally formed with the water-cooling plate; and A phase change plate, wherein the interior of the phase change plate is filled with a phase change material, the phase change plate is detachably connected to the support body, and is arranged opposite to the water cooling plate with respect to the support body.

2. The heat dissipation structure according to claim 1, characterized in that: A portion of the water cooling plate where the flow channel is not provided is evenly provided with a plurality of connector through holes, and a distance between an inner wall of the connector through hole and a side wall of the flow channel is not less than 1.5 mm.

3. The heat dissipation structure according to claim 1, characterized in that: The side wall of the support body is provided with a first opening and a second opening, and the first opening and the second opening are respectively communicated with two ends of the flow channel.

4. The heat dissipation structure according to claim 3, characterized in that: The first opening and the second opening are located on the same side wall of the support body.

5. The heat dissipation structure according to claim 4, characterized in that: The heat dissipation structure further includes a cover plate, which is detachably connected to the support body and is used to seal the first opening and the second opening.

6. The heat dissipation structure according to claim 4, characterized in that: The flow channel comprises a first flow section of the main flow channel, a first branch flow channel, a second flow section of the main flow channel, a second branch flow channel and a third flow section of the main flow channel which are sequentially arranged along the outer edge of the water-cooling plate; The first flow section of the main channel and the third flow section of the main channel are arranged on the same side of the water-cooled plate and are connected to the first opening and the second opening respectively; the second flow section of the main channel is arranged on the opposite side of the first flow section of the main channel and the third flow section of the main channel; The first branch channel and the second branch channel are respectively arranged on the adjacent two sides of the second flow segment of the main channel; the first branch channel connects the first flow segment of the main channel with the second flow segment of the main channel; the second branch channel connects the third flow segment of the main channel with the second flow segment of the main channel.

7. The heat dissipation structure according to claim 6, characterized in that: The first branch flow channel and the second branch flow channel are at least partially configured in a zigzag shape.

8. The heat dissipation structure according to claim 6, characterized in that: The flow channel also includes: at least one third branch flow channel, the third branch flow channel being arranged in parallel with the first branch flow channel, one end of the third branch flow channel being connected to the first flow section of the main flow channel, and the other end of the third branch flow channel being connected to the second flow section of the main flow channel; and at least one fourth branch flow channel, the fourth branch flow channel is arranged in parallel with the second branch flow channel, one end of the fourth branch flow channel is connected to the third flow section of the main flow channel, and the other end is connected to the second flow section of the main flow channel, The third branch flow channel and the fourth branch flow channel are arranged between the first branch flow channel and the second branch flow channel.

9. The heat dissipation structure according to claim 8, characterized in that: The third branch flow channel and the fourth branch flow channel are at least partially configured in a corrugated shape.

10. An active phased array antenna, characterized in that: include: The heat dissipation structure according to any one of claims 1 to 9; and A heat source is arranged inside the support body, and two ends of the heat source are respectively in contact with the inner end surfaces of the water cooling plate and the phase change plate.

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