Processing method and manufacturing method of inter-board connector
By cutting the surface of the welding portion of the inter-board connector, a gap is formed to compensate for the expansion of the soldering agent, the problem of tin beads generated during the reflow soldering process is solved, ensuring the safety and performance of the vehicle.
Patent Information
- Application Number
- CN202411537266.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-30
- Publication Date
- 2025-02-28
AI Technical Summary
The existing inter-board connectors are prone to producing tin beads during the reflow soldering process, resulting in short-circuit function failure or intermittent failure, which in turn causes the vehicle to lose control and threaten driving safety.
By adjusting the cutting and processing parameters of the welding part, the surface of the welding part is cut to form a gap to compensate for the volume expansion of the welding agent and avoid the generation of tin beads.
It effectively avoids the generation of tin beads and ensures the performance of the vehicle and driving safety.
Smart Images
Figure 00000000_0000_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of connectors, and in particular to a processing method and a manufacturing method of an inter-board connector. Background Art
[0002] Nowadays, in the same domain controller of a vehicle, a BTB (board to board connector, also called an inter-board connector) connector is usually used to connect two or more PCBs (Printed Circuit Boards).
[0003] In the related art, when the BTB connector undergoes SMT (Surface Mounted Technology) reflow soldering, the contact surface between the BTB connector body and the PCB solder paste is easily affected by factors such as soldering temperature, time, solder paste quality, printing thickness, steel mesh and mounting pressure. The tin beads generated during reflow soldering are movable, so that the tin beads on the BTB connector will be displaced during assembly, testing and subsequent applications, and it is difficult to predict the position of the tin beads after movement. When the tin beads move to the Fine-pitch spacing of the pad or between the package pins of the chip, the short-circuit function of the IC (Integrated Circuit) or BGA (Ball Grid Array) will fail or intermittently fail, causing the vehicle to lose control and making it difficult to ensure the safety of the driver. Summary of the invention
[0004] In view of this, an embodiment of the present application provides a processing method and a manufacturing method for an inter-board connector to solve or alleviate the problem in the related art that short-circuit function failure or intermittent failure causes the vehicle to lose control and makes it difficult to ensure the safety of the driver.
[0005] According to a first aspect of an embodiment of the present application, a processing method for a board-to-board connector is provided, wherein the connection surface between the board-to-board connector and the circuit board comprises a docking portion and a welding portion, wherein the welding portion is used to be welded to a pad area of the circuit board after the docking portion is docked with the circuit board; the processing method comprises: regulating cutting processing parameters of the welding portion, wherein the cutting processing parameters are determined according to at least one of phase change parameters of the welding agent applied to the pad area, manufacturing process parameters of the printing mold, and mechanical parameters of the circuit board; and cutting the surface of the welding portion using the cutting processing parameters so that a gap is formed between the welding agent before the reflow soldering stage and the surface after the cutting, and the gap is used to compensate for the volume expansion of the welding agent during the reflow soldering stage.
[0006] In some embodiments of the present application, the surface of the welding part is cut using cutting processing parameters, including: using cutting processing parameters to cut a portion of the surface of the welding part into a recessed area, so that the installation surface of the pin in the docking part is closer to the circuit board than the bottom surface of the recessed area.
[0007] In some embodiments of the present application, a recessed area is cut on a portion of the surface of the weld part using cutting processing parameters, including: cutting a recessed area on a portion of the surface of the weld part according to a caliber parameter and a depth parameter of the recessed area, wherein the caliber parameter is inversely correlated with the depth parameter.
[0008] In some embodiments of the present application, the processing method further includes: before the reflow soldering stage, applying solder to a portion of the soldering area of the circuit board corresponding to the recessed area.
[0009] In some embodiments of the present application, the surface of the welding part is cut using cutting processing parameters, including: using the cutting processing parameters to cut the surface of the welding part so that the cut surface is aligned with the installation surface of the pin of the docking part.
[0010] In some embodiments of the present application, the surface of the welding part is cut using cutting processing parameters so that the cut surface is aligned with the installation surface of the pin of the docking part, including: cutting the surface of the welding part according to the caliber parameters and depth parameters of the welding part.
[0011] In some embodiments of the present application, regulating the cutting processing parameters of the welding part includes: fine-tuning the cutting processing parameters of the welding part at least according to the phase change parameters of the welding agent coated on the welding pad area, so that the welding agent contacts the surface after cutting using the cutting processing parameters during the reflow soldering stage.
[0012] In some embodiments of the present application, the processing method further includes: before the reflow soldering stage, applying a soldering agent to the soldering area of the circuit board so that a gap is formed between the soldering agent and the cut surface.
[0013] In some embodiments of the present application, the processing method further includes: in the reflow soldering stage, placing the butted board-to-board connector and the circuit board under a liquefaction temperature condition of the solder.
[0014] According to a second aspect of an embodiment of the present application, a method for manufacturing a board-to-board connector is provided, wherein the connection surface between the board-to-board connector and the circuit board includes a docking portion and a welding portion, wherein the welding portion is used to be welded to a pad area of the circuit board after the docking portion is docked with the circuit board; the manufacturing method includes: determining a contact surface corresponding to a surface of a board-to-board connector mold and the welding portion of the board-to-board connector; adjusting the thickness of the contact surface to a target thickness based on a thickness optimization parameter to obtain an adjusted board-to-board connector mold; and injecting an injection molding agent into the adjusted board-to-board connector mold to obtain a board-to-board connector, wherein the injection molding agent is used to manufacture the board-to-board connector.
[0015] According to the processing method and manufacturing method of the inter-board connector provided in the embodiment of the present application, the surface of the welding part is cut by cutting processing parameters, so that a gap is formed between the welding agent before the reflow soldering stage and the surface after the cutting. During the reflow soldering stage, the volume expansion of the welding agent can be compensated by the gap, which can avoid the appearance of more solder beads due to the tension after the welding agent melts, thereby ensuring the performance of the vehicle and protecting the safety of the driver. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.
[0017] Figure 1 It is a schematic flow chart of a method for processing a board-to-board connector according to an embodiment of the present application;
[0018] Figure 2 A schematic diagram of a partial structure of an inter-board connector according to an embodiment of the present application;
[0019] Figure 3 A schematic diagram of a connection structure between an inter-board connector and a circuit board according to an embodiment of the present application;
[0020] Figure 4 A schematic diagram of a structure for determining cutting process parameters according to an embodiment of the present application;
[0021] Figure 5 A schematic diagram of a partial structure of a cut inter-board connector according to an embodiment of the present application;
[0022] Figure 6 It is a partial structural schematic diagram of a cut inter-board connector according to another embodiment of the present application;
[0023] Figure 7The present invention provides a method for manufacturing an inter-board connector according to an embodiment of the present application. DETAILED DESCRIPTION
[0024] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the embodiments of the present application should fall within the scope of protection of the embodiments of the present application.
[0025] The specific implementation of the embodiments of the present application is further explained below in combination with the embodiments of the present application and the accompanying drawings.
[0026] Specifically, reflow soldering relies on hot air flow to act on solder joints, so that the gel-like flux reacts physically under a certain high-temperature air flow to achieve the purpose of soldering. During the soldering process, the solder paste absorbs heat and changes from solid to liquid, and then changes from liquid to solid again after cooling. The specific welding principle is: when the PCB enters the preheating zone, the solvent and gas in the solder paste evaporate, and at the same time, the flux in the solder paste wets the pads, component ends and pins, and the solder paste softens, collapses, covers the pads, component ends and pins and isolates them from oxygen; when the PCB enters the heat absorption zone, the PCB and components are fully preheated to prevent the PCB from suddenly entering the high-temperature welding zone and damaging the PCB and components; when the PCB enters the reflow soldering zone, the temperature rises rapidly to melt the solder paste, and the liquid solder wets, diffuses, flows or reflows the pads, component ends and pins of the PCB to form solder joints; when the PCB enters the cooling zone, the solder joints solidify, and the reflow soldering process is completed.
[0027] Because in the related art, the butt joint and welding parts of the board-to-board connector (i.e., BTB connector) are in close contact with the circuit board (i.e., PCB board), there is mutual compression, and there is no space to absorb the increased volume of the solder paste from solid to liquid. Therefore, additional tension will be generated, causing solder beads to form after the solder paste is solidified / welded. The solder beads on the BTB connector will be displaced during assembly, testing, and subsequent applications, and it is difficult to predict the position of the solder beads after movement. When the solder beads move to the Fine-pitch spacing of the pad or between the package pins of the chip, the short-circuit function of the IC or BGA will fail or intermittently fail, causing the vehicle to lose control, making it difficult to ensure the safety of the driver.
[0028] Moreover, as time goes by, tin whiskers will grow on the tin beads, which are more likely to cause short circuits, causing the cockpit domain controller to fail, resulting in a sudden black screen and intermittent failure of the intelligent driving during driving, resulting in vehicle safety accidents, and in severe cases, the vehicle will be destroyed and people will die.
[0029] Based on this, in order to reduce the external force interference of the docking part and the welding part of the BTB connector on the solder paste on the PCB board and eliminate the generation of tin beads, the present application cuts the welding part of the BTB connector to form additional space in the welding part to absorb the increased volume of the solder paste when it changes from solid to liquid, thereby avoiding the generation of tin beads after the solder paste is solidified / welded.
[0030] Figure 1 The figure is a flow chart of a method for processing an inter-board connector according to an embodiment of the present application. Figure 2 It is a partial structural schematic diagram of an inter-board connector according to an embodiment of the present application. Figure 3 The figure is a schematic diagram of the connection structure between the inter-board connector and the circuit board according to one embodiment of the present application.
[0031] Among them, Figure 2 As shown, the connecting surface between the board connector and the circuit board includes a docking portion and a welding portion. The welding portion is used to be welded to the pad area of the circuit board after the docking portion and the circuit board are docked. There are several docking pins in the docking portion and several welding pins in the welding portion. When solder paste is printed on the circuit board, the docking pins of the docking portion and the welding pins of the welding portion will be inserted into the through holes at the corresponding positions of the circuit board, so that the docking pins and the welding pins are wrapped by the solder paste, so that the board connector and the circuit board are connected to each other. Figure 3 As shown, the inter-board connector is located below the circuit board, multiple docking pins of the inter-board connector are inserted into through holes at corresponding positions of the circuit board, and multiple welding pins are inserted into through holes in the pad area of the circuit board, so that the inter-board connector and the circuit board are interconnected.
[0032] like Figure 1 As shown, the processing method includes:
[0033] S11: regulating cutting processing parameters of the soldering portion, wherein the cutting processing parameters are determined according to at least one of phase change parameters of the solder applied to the pad area, manufacturing process parameters of the printing mold, and mechanical parameters of the circuit board.
[0034] The pad area refers to the area in the circuit board. During the reflow soldering process, the steel mesh will cover the solder layer, and then the solder will be accurately applied to the pad area of the PCB through the holes on the steel mesh, so as to achieve accurate soldering in the subsequent component mounting process. The solder can be solder paste or other solder.
[0035] The phase change parameters of soldering agent at least include the ratio of Flux (flux, a chemical substance that can help and promote the soldering process in the soldering process, and has a protective effect and prevents oxidation reaction) and tin powder in different solder pastes, the size of solder balls and the finished product characteristics of solder paste. The quality of solder is one of the important factors affecting the generation of tin beads. The metal content in the solder, the degree of oxidation of the metal powder, and the size of the metal powder can all affect the generation of tin beads. In addition, the quality of the solder is also critical. For example, if the metal content in the solder is too low, it will lead to excessive flux components. Excessive flux is not easy to volatilize during the preheating stage, causing tin beads.
[0036] The manufacturing process parameters of the printing mold include at least the opening size and thickness of the steel mesh. If the opening of the steel mesh is larger than the actual size, or the steel mesh is too thick, the solder paste may be printed on the solder mask layer, resulting in solder beads. The mechanical parameters of the circuit board include at least the warpage of the PCB board. The PCB board is usually made of glass fiber and some other composite materials. Most PCB boards are laminated only once and are very simple. The warpage of the PCB board refers to the change in the shape of the PCB.
[0037] Since the phase change parameters of the solder in the pad area, the manufacturing process parameters of the printing mold and the mechanical parameters of the circuit board have an impact on the tin beads generated during the reflow process, the cutting processing parameters of the soldering part can be adjusted based on the above parameters.
[0038] In addition, the placement pressure of the placement machine and the setting of the reflow temperature curve also affect the tin beads generated during the reflow process. If the placement pressure is too high, the solder paste will be squeezed into the solder resist layer, resulting in the formation of tin beads. If the temperature curve is incorrect, the moisture and solvent inside the solder paste have not completely evaporated, and they begin to boil when they reach the reflow zone, causing the solder paste to splash out and form tin beads.
[0039] In some embodiments, regulating the cutting processing parameters of the welding part includes: fine-tuning the cutting processing parameters of the welding part at least according to the phase change parameters of the welding agent applied to the pad area, so that the welding agent contacts the surface cut using the cutting processing parameters during the reflow soldering stage.
[0040] That is to say, when different types of solder are used for soldering, the cutting processing parameters of the soldering part can be fine-tuned according to the phase change parameters of the solder so that the solder contacts the surface cut using the cutting processing parameters during the reflow soldering stage.
[0041] S12: Cutting the surface of the soldering part using cutting process parameters so that a gap is formed between the solder before the reflow soldering stage and the surface after the cutting, and the gap is used to compensate for the volume expansion of the solder during the reflow soldering stage.
[0042] In some embodiments, the processing method of the board-to-board connector further includes: before the reflow soldering stage, applying a soldering agent to the soldering area of the circuit board so that a gap is formed between the soldering agent and the cut surface.
[0043] Furthermore, in some embodiments, the processing method of the inter-board connector further includes: in the reflow soldering stage, placing the butted inter-board connector and the circuit board under the liquefaction temperature condition of the solder.
[0044] Among them, the liquefaction temperature condition is adjusted according to the type of solder and the reflow temperature curve in the reflow process. The reflow temperature curve can be divided into four temperature zones: preheating zone (temperature between 20°C and 150°C), endothermic zone (temperature between 150°C and 190°C), reflow zone (temperature between 190°C and 210°C) and cooling zone (temperature between 210°C and 50°C).
[0045] In the preheating zone, the temperature rises slowly so that some solvents and water vapor in the solder paste can evaporate in time and activate the flux. The electronic parts (especially IC parts) are heated slowly to prepare for the high temperature later. Since the activation temperature of most fluxes is about 150°C, another purpose of uniform heating in the preheating zone is to make the solvent in the solder paste evaporate appropriately and activate the flux.
[0046] In the heat absorption zone, the solder paste is on the eve of melting, the volatiles in the solder paste will be further removed, the flux starts to work, and effectively removes the oxides on the soldering surface. If the temperature in this area rises too quickly, the rosin (flux) in the solder paste will expand and volatilize rapidly. Under normal circumstances, the rosin should slowly escape from the gaps between the solder pastes. When the rosin evaporates too quickly, quality problems such as pores, tin explosion, and solder beads will occur.
[0047] In the reflow zone (the area with the highest temperature in the entire reflow zone, also commonly called liquid holding time), the tin or nickel in the solder and the copper on the pad form intermetallic compounds due to diffusion;
[0048] In the cooling zone, the solder paste cools and solidifies the solder joints, which will be prepared for the subsequent PCB assembly process. Therefore, in the reflow soldering stage, the docking board connector and the circuit board are placed under the liquefaction temperature of the solder, so that the solder melts and connects the board connector and the circuit board to each other.
[0049] Further, continue to refer to Figure 2 , Figure 2This is a schematic diagram of a structure where the surface of the soldering part is not cut. Before the reflow soldering stage, after the solder is applied to the soldering area of the circuit board, no gap is formed between the solder and the cut surface. Therefore, in the reflow soldering stage, after the butted board-to-board connector and the circuit board are placed under the liquefaction temperature condition of the solder, due to the mutual compression between the soldering part of the board-to-board connector and the circuit board, there is no space to absorb the increased volume of the solder paste from solid to liquid, resulting in tension generated after the solder melts, causing solder beads to form after the solder solidifies / soldering.
[0050] To this end, the surface of the welding part is cut using cutting processing parameters so that a gap is formed between the solder before the reflow soldering stage and the surface after the cutting. The gap is used to compensate for the volume expansion of the solder during the reflow soldering stage. In this way, the tension after the solder melts can be avoided, which leads to the appearance of more tin beads, thereby ensuring the performance of the vehicle and the safety of the driver.
[0051] It should be noted that spaces with different size parameters may be cut out on the surface of the soldering portion, so that a gap is formed between the solder before the reflow soldering stage and the surface after the cutting.
[0052] In some embodiments, the surface of the welding part is cut using cutting processing parameters, including: using cutting processing parameters to cut a portion of the surface of the welding part into a recessed area, so that the installation surface of the pin in the docking part is closer to the circuit board than the bottom surface of the recessed area.
[0053] Further, in some embodiments, a recessed area is cut on a portion of the surface of the weld part using cutting processing parameters, including: cutting a recessed area on a portion of the surface of the weld part according to a caliber parameter and a depth parameter of the recessed area, wherein the caliber parameter is inversely correlated with the depth parameter.
[0054] For example, Figure 4 FIG. 1 is a schematic diagram of a structure for determining cutting process parameters according to an embodiment of the present application. Figure 4As shown, the depth parameter of the recessed area of the welding part is determined according to the thickness of the steel mesh in the manufacturing process parameters of the printing mold, the phase change parameters of the solder when the steel mesh is withdrawn, and the warpage of the circuit board. For example, the thickness of the steel mesh is 0.15mm~0.18mm, the solder paste is pulled up 0.1mm when the steel mesh is withdrawn, and the warpage of the PCB board is 0.1mm~0.15mm. The depth parameter in the cutting process parameter is calculated to be 0.33mm, and the caliber parameter in the cutting process parameter is determined to be 1.5mm based on the depth parameter. It can be understood that when the depth parameter is greater than 0.33mm, it can be determined that the caliber parameter corresponding to the depth parameter can be adjusted to a value less than 1.5mm, that is, the caliber parameter is inversely correlated with the depth parameter. It should be noted that the caliber parameter and the depth parameter can be adjusted according to actual conditions, and the specific values are not limited in this application.
[0055] Figure 5 FIG. 1 is a schematic diagram of a partial structure of a cut inter-board connector according to an embodiment of the present application. Figure 5 As shown, according to the predetermined caliber parameter, a portion of the surface of the welding part is cut to a caliber of about 1.5 mm in length, and according to the predetermined depth parameter, a portion of the surface of the welding part is cut to a depth of about 0.33 mm in height, so as to form a Figure 5 The recessed area shown makes the mounting surface of the pins in the mating portion closer to the circuit board than the bottom surface of the recessed area.
[0056] In some embodiments, the method for processing the board-to-board connector further includes: before the reflow soldering stage, applying solder to a portion of the soldering region of the circuit board corresponding to the recessed area.
[0057] Therefore, before the reflow soldering stage, the flux is applied to the portion of the soldering area of the circuit board corresponding to the recessed area, and in the reflow soldering stage, the docked inter-board connector and the circuit board are placed under the liquefaction temperature condition of the flux. Since there is a recessed area between the soldering portion of the inter-board connector and the circuit board, the increased volume of the flux changing from solid to liquid can be absorbed, thereby avoiding the appearance of tin beads and ensuring the performance of the vehicle and the safety of the driver.
[0058] In some embodiments, cutting the surface of the welding part using the cutting process parameters includes: cutting the surface of the welding part using the cutting process parameters so that the cut surface is aligned with the installation surface of the pin of the docking part. Figure 4That is to say, the cutting processing parameters of the welding part are determined according to the thickness of the steel mesh in the manufacturing process parameters of the printing mold, the phase change parameters of the solder when the steel mesh is withdrawn, and the warping of the circuit board. For example, the thickness of the steel mesh is 0.15mm~0.18mm, the solder paste is pulled up 0.1mm when the steel mesh is withdrawn, and the warping of the PCB board is 0.1mm~0.15mm. The depth parameter in the cutting processing parameters is calculated to be 0.33mm.
[0059] Further, in some embodiments, the surface of the welding part is cut using cutting processing parameters so that the cut surface is aligned with the installation surface of the pin of the docking part, including: cutting the surface of the welding part according to the caliber parameters and depth parameters of the welding part.
[0060] Figure 6 FIG. 1 is a schematic diagram of a partial structure of a cut-off board-to-board connector according to another embodiment of the present application. Figure 6 As shown, according to the diameter parameter of the welded part 5.8mm, the complete surface of the welded part is cut to a diameter of about 5.8mm (this length value is usually the length of the upper surface of the welded part), and according to the depth parameter 0.33mm, the complete surface of the welded part is cut to a depth of about 0.33mm, forming a Figure 6 The straight line area shown makes the surface after cutting aligned with the installation surface of the pin of the docking part. Among them, the caliber parameter and the depth parameter can be adjusted according to the actual situation, and the specific values are not limited in this application.
[0061] In this way, before the reflow soldering stage, the flux is applied to the portion of the soldering area of the circuit board that corresponds to the straight area, and in the reflow soldering stage, the docked inter-board connector and the circuit board are placed under the liquefaction temperature condition of the flux. Since there is a straight area of a certain height between the soldering portion of the inter-board connector and the circuit board, the increased volume of the solder that changes from solid to liquid can be absorbed, thereby avoiding the appearance of tin beads and ensuring the performance of the vehicle and the safety of the driver.
[0062] It should be noted that the present application uses 3D printing technology to produce 100 sets of inter-board connectors with recessed areas cut out and inter-board connectors with straight areas cut out for verification, and the following results are obtained: Figure 6 The board connector with the straight line area cut out as shown, and Figure 5 As shown, the inter-board connector with the recessed area cut out has a significantly improved defective rate compared to the original defective rate of the inter-board connector in the recessed area and the inter-board connector in the straight area, thereby saving the design cost of the vehicle.
[0063] In some embodiments, the contact surface of the board-to-board connector mold corresponds to the upper surface of the welding part of the board-to-board connector; wherein the connection surface between the board-to-board connector and the circuit board includes a docking part and a welding part, and the welding part is used to be welded to the pad area of the circuit board after the docking part is docked with the circuit board.
[0064] Figure 7 A method for manufacturing a board-to-board connector according to an embodiment of the present application is as follows: Figure 7 As shown, the manufacturing method includes:
[0065] S71: Determine the contact surface of the board-to-board connector mold corresponding to the surface of the welding portion of the board-to-board connector. The board-to-board connector mold is used to manufacture board-to-board connectors in batches, and the surface of the welding portion of the board-to-board connector refers to Figure 5 and Figure 6 The bottom surface of the weld after the mid-cut.
[0066] By performing concave cutting and straight cutting on the board-to-board connector in the above embodiment, a gap is formed between the solder before the reflow soldering stage and the surface after cutting. The gap is used to compensate for the volume expansion of the solder during the reflow soldering stage, thereby verifying that the surface where the soldering part of the board-to-board connector is located after cutting can be completely separated from the solder, reducing the external force interference of the board-to-board connector body on the soldering of the solder, and eliminating the generation of tin beads.
[0067] Therefore, in order to facilitate the promotion of the cut inter-board connector structure in practical applications, the present application also proposes a method for manufacturing an inter-board connector. By optimizing the inter-board connector mold, it is possible to mass-produce inter-board connectors that can eliminate tin beads during the reflow soldering process.
[0068] S72: Adjusting the thickness of the contact surface to a target thickness based on the thickness optimization parameter to obtain an adjusted board-to-board connector mold.
[0069] The thickness optimization parameters are parameters corresponding to the cutting processing parameters. For example, when a recessed area is cut out on part of the surface of the welding part using the cutting processing parameters, the caliber parameter of the welding part of the board-to-board connector is 1.5 mm, and the depth parameter is 0.33 mm. For the board-to-board connector mold for manufacturing the board-to-board connector with the recessed area, the thickness of the contact surface (the length of the contact surface is 1.5 mm) corresponding to the bottom surface of the welding part in the mold can be adjusted to the target thickness, which is the original thickness + 0.33 mm, to obtain the adjusted board-to-board connector mold.
[0070] S73: injecting an injection molding agent into the adjusted inter-board connector mold to obtain an inter-board connector, wherein the injection molding agent is used to manufacture the inter-board connector.
[0071] Furthermore, an injection molding agent is injected into the adjusted inter-board connector mold to obtain an inter-board connector by injection molding. The welding portion of the inter-board connector also has a recessed area (the recessed area corresponds to the recessed area obtained by cutting), and the mounting surface of the pins in the docking portion of the inter-board connector is closer to the circuit board than the bottom surface of the recessed area. In this way, by optimizing the inter-board connector mold, inter-board connectors that can eliminate tin beads in the reflow soldering process can be mass-produced.
[0072] Similarly, using the cutting processing parameters, when a straight line area is cut out on part of the surface of the welding part, the caliber parameter of the welding part of the board-to-board connector is 5.8mm, and the depth parameter is 0.33mm. For the board-to-board connector mold for manufacturing the board-to-board connector with a straight line area, the thickness of the contact surface corresponding to the bottom surface of the welding part in the mold (the length of the contact surface is 5.8mm) can be adjusted to the target thickness, which is the original thickness + 0.33mm, to obtain the adjusted board-to-board connector mold.
[0073] Furthermore, the plasticizer is injected into the adjusted inter-board connector mold to obtain an inter-board connector by injection molding. The welding portion of the inter-board connector also has a straight area (the straight area corresponds to the straight area obtained by cutting), and the surface of the welding portion is aligned with the installation surface of the pin of the docking portion. In this way, by optimizing the inter-board connector mold, inter-board connectors that can eliminate tin beads in the reflow process can be mass-produced.
[0074] It should be noted that, in this application, by optimizing the inter-board connector mold, 100 sets, 500 sets and 800 sets of inter-board connector molds with a contact surface length of 5.8 mm and a thickness of the original thickness + 0.33 mm were produced in sequence, and the inter-board connectors with straight line areas were verified. It was determined that the defective rate of the inter-board connector was significantly improved compared with the original defective rate, thereby saving the design cost of the vehicle.
[0075] In summary, the present application cuts the surface of the welding part through cutting processing parameters, so that a gap is formed between the welding agent before the reflow soldering stage and the surface after the cutting. During the reflow soldering stage, the volume expansion of the welding agent can be compensated by the gap, which can avoid the tension after the welding agent melts, resulting in a large number of tin beads, thereby ensuring the performance of the vehicle and protecting the safety of the driver.
[0076] In addition, the present application optimizes the inter-board connector mold for manufacturing the inter-board connector. The welding part of the inter-board connector mass-produced by the mold has a certain space, so that a gap is formed between the soldering agent before the reflow soldering stage and the surface after cutting. During the reflow soldering stage, the volume expansion of the solder can be compensated by the gap, which can avoid the appearance of more solder beads due to the tension after the solder melts, thereby ensuring the performance of the vehicle and protecting the safety of the driver.
[0077] It should be pointed out that, according to the needs of implementation, the various components / steps described in the embodiments of the present application can be split into more components / steps, or two or more components / steps or partial operations of components / steps can be combined into new components / steps to achieve the purpose of the embodiments of the present application.
[0078] Those of ordinary skill in the art will appreciate that the units and method steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the embodiments of the present application.
[0079] The above implementation methods are only used to illustrate the embodiments of the present application, and are not intended to limit the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application, and the scope of patent protection of the embodiments of the present application should be defined by the claims. The systems, devices or modules described in the above embodiments can be implemented by computer chips or entities, or by products with certain functions.
Claims
1. A method for processing a board-to-board connector, characterized in that: The connecting surface between the board-to-board connector and the circuit board includes a docking portion and a welding portion, wherein the welding portion is used to be welded to a pad area of the circuit board after the docking portion is docked with the circuit board; The processing method comprises: Regulating a cutting process parameter of the soldering portion, wherein the cutting process parameter is determined according to at least one of a phase change parameter of the solder applied to the solder pad area, a manufacturing process parameter of the printing mold, and a mechanical parameter of the circuit board; The surface of the soldering part is cut using the cutting process parameters, so that a gap is formed between the solder before the reflow soldering stage and the surface after the cutting, and the gap is used to compensate for the volume expansion of the solder during the reflow soldering stage.
2. The processing method according to claim 1, characterized in that: Cutting the surface of the welding portion using the cutting processing parameters includes: By using the cutting processing parameters, a recessed area is cut at a part of the surface of the soldering portion, so that the mounting surface of the pins in the docking portion is closer to the circuit board than the bottom surface of the recessed area.
3. The processing method according to claim 2, characterized in that: Using the cutting processing parameters, cutting a portion of the surface of the welding portion into a recessed area comprises: The recessed area is cut into a portion of the surface of the welding portion according to a diameter parameter and a depth parameter of the recessed area, wherein the diameter parameter is inversely correlated with the depth parameter.
4. The processing method according to claim 3, characterized in that: The method further comprises: Before the reflow soldering stage, the solder is applied to a portion of the soldering area of the circuit board corresponding to the recessed area.
5. The processing method according to claim 1, characterized in that: Cutting the surface of the welding portion using the cutting processing parameters includes: The surface of the welding portion is cut using the cutting processing parameters so that the cut surface is aligned with the mounting surface of the pin of the docking portion.
6. The processing method according to claim 5, characterized in that: Using the cutting processing parameters, cutting the surface of the welding portion so that the cut surface is aligned with the mounting surface of the pin of the docking portion, comprising: The surface of the welding part is cut according to the diameter parameter and the depth parameter of the welding part.
7. The processing method according to claim 1, characterized in that: Regulating the cutting processing parameters of the welding portion includes: The cutting process parameters of the soldering portion are fine-tuned at least according to the phase change parameters of the solder applied to the pad area, so that the solder contacts the surface cut by the cutting process parameters during the reflow soldering stage.
8. The processing method according to claim 1, characterized in that: The method further comprises: Before the reflow soldering stage, the soldering agent is applied to the soldering area of the circuit board so that the gap is formed between the soldering agent and the cut surface.
9. The processing method according to claim 8, characterized in that: The method further comprises: In the reflow soldering stage, the butted board-to-board connector and the circuit board are placed under the liquefaction temperature condition of the solder.
10. A method for manufacturing a board-to-board connector, characterized in that: The connecting surface between the board-to-board connector and the circuit board includes a docking portion and a welding portion, wherein the welding portion is used to be welded to a pad area of the circuit board after the docking portion is docked with the circuit board; The manufacturing method comprises: Determine a contact surface of the board-to-board connector mold corresponding to a surface of a welding portion of the board-to-board connector; Adjusting the thickness of the contact surface to a target thickness based on the thickness optimization parameter to obtain an adjusted board-to-board connector mold; Injecting an injection molding agent into the adjusted inter-board connector mold to obtain the inter-board connector, wherein the injection molding agent is used to manufacture the inter-board connector.