Formed crystal bar pasting method and bar pasting machine system

Abstract

The invention provides a 1t; 111gt, 111gt; the invention discloses a crystal bar pasting method and a bar pasting machine system and belongs to the field of semiconductors. The result; 111gt, 111gt; the crystal bar pasting method comprises the following steps: providing 1t; 111gt, 111gt; and forming a crystal bar. The crystal bar is further provided with a Notch groove, the Notch groove faces upwards, the bar sticking machine system obtains the deviation value and the initial rotation angle of the crystal bar crystal orientation, and the Y-axis initial orientation angle of the crystal bar is set. And in the bar sticking machine system, the Y-axis orientation angle is continuously reset until the real-time rotation angle of the crystal bar crystal orientation is within the target rotation angle range. And rotating the crystal bar based on the rotation angle of the crystal bar around the own circumferential direction. And setting a slope in the resin strip based on the target orientation angle so as to correct the target orientation angle to 0 degree. By obtaining the target orientation angle of the crystal bar and obtaining the inclination height of the crystal bar in the length direction, when the crystal bar is sawn, the probability that the crystal bar is located at the optimal rotation angle can be improved, the elasticity modulus of materials on the two sides of the sawn crystal bar is symmetrical, and the problem that a silicon wafer warps is solved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a <111> A crystal rod pasting method and a rod pasting machine system. Background Art

[0002] When the saw wire cuts the silicon wafer, the cutting direction of the cutting wire is parallel to the surface of the silicon wafer being cut and opposite to the feeding direction of the silicon rod. Before the silicon rod is glued, it can be rotated so that the cutting wire is cut along a certain crystal plane and crystal direction, thereby determining the cutting direction of the cutting wire. The semicircular groove formed during the wire cutting process can be divided into many small planes parallel to the cutting line. Due to the anisotropy of single-crystal silicon materials, these discrete small planes parallel to the cutting line represent different crystal planes, with different elastic modulus, hardness and fracture toughness values, and will show different properties during sawing. Therefore, the choice of the cutting direction of the cutting wire will affect the geometric parameters such as WARP of the silicon wafer.

[0003] Existing <111> When the crystal rod is cut, the random distribution of the crystal orientation of the incoming material and the random distribution of the angles of the crystal rod cause the elastic modulus of the material on both sides of the saw to be different when the crystal rod is sawed, which causes the silicon wafer to warp.

[0004] It should be noted that the information disclosed in the background technology section of the invention is only intended to deepen the understanding of the general background technology of the invention, and should not be regarded as an admission or suggestion in any form that the information constitutes prior art already known to those skilled in the art. Summary of the invention

[0005] The object of the present invention is to provide a <111> A method for pasting a crystal rod and a pasting machine system to solve the problem <111> When the crystal rod is cut, the random distribution of the crystal orientation of the incoming material causes the elastic modulus of the material on both sides of the saw to be different, resulting in the problem of warping of the silicon wafer.

[0006] In order to solve the above technical problems, the present invention provides a <111> A method for pasting a crystal rod, comprising:

[0007] Provide a <111> A crystal rod having a first end face and a second end face arranged opposite to each other, the first end face is defined as a reference face, and a vertical crystal direction of the crystal rod is defined as a Y-axis crystal direction;

[0008] The crystal ingot also has a Notch groove, and the Notch groove is facing upward, and the stick gluing machine system obtains the deviation value between the actual value of the crystal orientation of the crystal ingot and the standard angle and the initial rotation angle of the crystal orientation of the crystal ingot, and sets the initial orientation angle of the Y axis of the crystal ingot;

[0009] In the stick bonding machine system, the Y-axis orientation angle is continuously reset until the real-time rotation angle of the crystal rod crystal direction is within the target rotation angle range, so as to correct the Y-axis crystal direction and obtain the rotation angle of the crystal rod around its own circumferential direction. The Y-axis orientation angle of the crystal rod when it is within the target rotation angle range is defined as the target orientation angle, wherein the target rotation angle is the angle of the best sawing direction of the crystal rod during sawing;

[0010] Based on the angle at which the crystal rod rotates around its own circumferential direction, the crystal rod is rotated;

[0011] Based on the target orientation angle, the height of the ingot along its length direction is adjusted to correct the target orientation angle to 0°;

[0012] The crystal rod is glued and fixed based on the tilt height of the crystal rod.

[0013] Preferably, the crystal rod further has a Notch groove, and the Notch groove is facing upward, and the stick bonding machine system obtains the deviation value between the actual value of the crystal orientation of the crystal rod and the standard angle and the initial rotation angle of the crystal orientation of the crystal rod, and sets the initial orientation angle of the Y axis of the crystal rod, including:

[0014] The crystal rod is placed in a rod bonding machine, which includes an X-Ray orientator. The X-Ray orientator is used to obtain the deviation between the actual value of the crystal rod crystal orientation and the standard angle and the initial rotation angle of the crystal rod crystal orientation, and the Y-axis initial orientation angle of the crystal rod is set in the rod bonding machine system.

[0015] Preferably, the initial orientation angle of the Y-axis is set to 0°.

[0016] Preferably, the angle of the crystal rod rotating clockwise along the reference plane is defined as positive, the angle of the crystal rod rotating counterclockwise along the reference plane is defined as negative, and the angle of the Notch groove of the crystal rod rotating on the rod bonding machine is -90° to 90°.

[0017] Preferably, in the stick bonding machine system, the Y-axis orientation angle is continuously reset until the real-time rotation angle of the crystal rod crystal direction is within the target rotation angle range, so as to correct the Y-axis crystal direction, and obtain the angle of rotation of the crystal rod around its own circumferential direction, and define the Y-axis orientation angle of the crystal rod when it is within the target rotation angle range as the target orientation angle, wherein the target rotation angle is the angle of the best sawing direction of the crystal rod during sawing, including:

[0018] Reset the Y-axis orientation angle and set the orientation angle to a positive value. If the real-time rotation angle of the crystal rod is close to the target angle, continue to increase the orientation angle until the real-time rotation angle of the crystal rod is within the target angle range. If the real-time rotation angle of the crystal rod deviates from the target angle, set the orientation angle to a negative value and continue to decrease the orientation angle until the real-time rotation angle of the crystal rod is within the target angle range.

[0019] Preferably, the target rotation angle range includes 0°±5°, 60°±5°, and -60°±5°.

[0020] Preferably, adjusting the height of the crystal rod along its length direction based on the target orientation angle to correct the target orientation angle to 0° comprises:

[0021] If the target orientation angle is a positive value, the first end surface of the crystal rod is higher than the second end surface;

[0022] If the target orientation angle is a negative value, the first end surface of the crystal rod is lower than the second end surface.

[0023] Preferably, the adjusting the height of the crystal rod along its length direction based on the target orientation angle to correct the target orientation angle to 0° further includes:

[0024] Based on the target orientation angle, a resin strip is manufactured, and a slope is provided in the resin strip to correct the target orientation angle to 0°, wherein the height of the slope is equal to the height of the ingot tilted along its length direction;

[0025] The height of the resin strip located at the first end surface is set to H1, and the height of the resin strip located at the second end surface is set to H2;

[0026] If the target orientation angle is greater than 0°, H1 is greater than H2;

[0027] If the target orientation angle is less than 0°, H1 is less than H2.

[0028] Preferably, the height of the slope is:

[0029] H=L*tan(θ), where L is the length of the crystal rod and θ is the absolute value of the target orientation angle.

[0030] Preferably, the stick gluing machine further comprises a workpiece, and after the crystal stick is fixed to the sloped side of the resin strip, the other side of the resin strip is fixed to the workpiece.

[0031] The present invention also provides a stick gluing machine system, comprising:

[0032] Measuring equipment, used to obtain the deviation between the actual value of the crystal orientation of the crystal rod and the standard angle and the initial rotation angle of the crystal orientation of the crystal rod, and to set the initial orientation angle of the Y axis of the crystal rod;

[0033] A crystal orientation algorithm module is used to continuously reset the Y-axis orientation angle until the real-time rotation angle of the crystal rod crystal orientation is within the target rotation angle range, so as to correct the Y-axis crystal orientation and obtain the rotation angle of the crystal rod around its own circumferential direction, and define the Y-axis orientation angle of the crystal rod when it is within the target rotation angle range as the target orientation angle, wherein the target rotation angle is the angle of the best sawing direction of the crystal rod during sawing; based on the rotation angle of the crystal rod around its own circumferential direction, the crystal rod is rotated; based on the target orientation angle, the height of the crystal rod tilted along its length direction is adjusted to correct the target orientation angle to 0°;

[0034] The pasting device is used to paste and fix the crystal rod based on the tilt height of the crystal rod.

[0035] Compared with the prior art, the present invention <111> The crystal rod pasting method has the following advantages:

[0036] The present invention provides a <111> A crystal rod, the crystal rod has a first end face and a second end face that are relatively arranged, and the first end face is defined as a reference surface; the crystal rod also has a Notch groove, and the Notch groove is facing upward, and the stick gluing machine system obtains the deviation value between the actual value of the crystal direction and the standard angle and the initial rotation angle of the crystal rod crystal direction, and sets the initial Y-axis orientation angle of the crystal rod; in the stick gluing machine system, the Y-axis orientation angle is continuously reset until the real-time rotation angle of the crystal rod crystal direction is within the target rotation angle range to correct the Y-axis crystal direction, and the angle of rotation of the crystal rod around its own circumferential direction is obtained, and the Y-axis orientation angle of the crystal rod when it is in the target rotation angle range is defined as the target orientation angle, wherein the target rotation angle is the angle of the best sawing direction of the crystal rod when sawing. Based on the angle of rotation of the crystal rod around its own circumferential direction, the crystal rod is rotated; based on the target orientation angle, the height of the crystal rod tilted along its length direction is adjusted to correct the target orientation angle to 0°; based on the height of the crystal rod tilt, the crystal rod is glued and fixed. In this way, the angle of the crystal rod can be rotated from a random distribution to a specified angle, thereby increasing the probability that the crystal rod is located at the optimal angle when sawing. The elastic modulus of the materials on both sides of the sawed crystal rod is symmetrical, avoiding the problem of warping of the silicon wafer.

[0037] The stick sticking machine system provided by the present invention and the stick sticking machine system provided by the present invention <111> The method for sticking the type crystal rod belongs to the same inventive concept. Therefore, the stick sticking machine system provided by the present invention can avoid the problem of warping of silicon wafers when the crystal rod is sawed. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 The saw wire is from different directions <110> A schematic diagram of the structure of cutting a type crystal rod;

[0039] Figure 2 yes Figure 1 In <110> Elastic modulus distribution diagram of the crystal rod after cutting;

[0040] Figure 3 The saw wire is from different directions <111> A schematic diagram of the structure of cutting a type crystal rod;

[0041] Figure 4 for Figure 3 In <111> Elastic modulus distribution diagram of the crystal rod after cutting;

[0042] Figure 5 yes <111> Structural diagram of the best cutting direction when sawing a crystal rod;

[0043] Figure 6 yes <111> Schematic diagram of the structure of sawing direction-angle vs elastic modulus of the crystal rod;

[0044] Figure 7 yes <111> The probability distribution diagram of the angle distribution of the crystal rod randomly falling into the optimal angle;

[0045] Figure 8 In one embodiment of the present invention <111> Flow chart of the method for pasting the molded crystal rod;

[0046] Fig. 9 is a schematic structural diagram of a resin strip in one embodiment of the present invention;

[0047] Fig.10 is a schematic structural diagram of a resin strip in another embodiment of the present invention;

[0048] Fig.11 is a schematic diagram of a structure in which a crystal rod is pasted and fixed in one embodiment of the present invention;

[0049] Fig.12 is a schematic structural diagram of a crystal rod in a cutting state in one embodiment of the present invention;

[0050] In the figure,

[0051] 100-workpiece; 200-resin strip;

[0052] 300-crystal rod; 310-gap;

[0053] 320-first end face; 400-saw wire. DETAILED DESCRIPTION

[0054] In order to make the purpose, advantages and features of the present invention more clear, the present invention is described below in conjunction with the accompanying drawings and specific embodiments. <111> The method for pasting a type crystal rod and the stick pasting machine system are further described in detail. It should be noted that the drawings are all in a very simplified form and are not in precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. It should be understood that the drawings in the specification do not necessarily show the specific structure of the present invention in proportion, and the illustrative features used to illustrate certain principles of the present invention in the drawings in the specification will also adopt a slightly simplified drawing method. The specific design features of the present invention disclosed herein include, for example, specific dimensions, directions, positions and shapes, which will be determined in part by the specific application and use environment. And, in the embodiments described below, the same figure mark is sometimes used in common between different figures to represent the same part or a part with the same function, and its repeated description is omitted. In this specification, similar numbers and letters are used to represent similar items, so once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0055] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0056] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0057] Ginseng Figures 1 to 6 As shown, Figure 1 For saw wire from different directions <110> Schematic diagram of the structure for cutting the type crystal rod. Figure 2 for Figure 1 In <110> Elastic modulus distribution of the crystal rod after cutting. Figure 3 For saw wire from different directions <111> Schematic diagram of the structure for cutting the type crystal rod. Figure 4 for Figure 3In <111> Elastic modulus distribution of the crystal rod after cutting. Figure 2 It can be seen that for <110> For a type crystal ingot, the saw wire can obtain symmetric distribution of elastic modulus of the materials on both sides of the crystal ingot from any cutting direction. Figure 3 and Figure 4 It can be seen that for <111> For the crystal rod, the elastic modulus distribution of the materials on both sides of the sawing is symmetrical only when the saw wire cutting direction is 0°, 60°, 120°, 180°, 240°, and 300°.

[0058] Ginseng Figures 5 to 7 As shown, Figure 5 for <111> Structural schematic diagram of the best cutting direction when sawing a type crystal rod. Figure 6 for <111> Schematic diagram of the structure of sawing direction of the type crystal rod-angle vs elastic modulus, where Figure (6a) is the elastic modulus distribution diagram when the angle is 0° or 60°; Figure (6b) is the elastic modulus distribution diagram when the angle is 20°; Figure (6c) is the elastic modulus distribution diagram when the elastic modulus is 40°. Figure 7 for <111> The probability distribution of the angle distribution of the type crystal rod randomly falling into the optimal angle. Figure 6 It can be seen that when the rotation angle is 0° or 60°, the elastic modulus is symmetrically distributed. Figure 7 It can be seen that when the crystal rod angles are randomly distributed, the probability of falling into the optimal angle is only 15%.

[0059] Ginseng Figures 8 to 12 One of the revealed <111> A specific implementation method of the method for pasting a type crystal rod. <111> The method for pasting a molded crystal rod includes the following steps S1 to S6.

[0060] Step S1: Provide a <111> The crystal rod 300 has a first end surface 320 and a second end surface (not shown) arranged opposite to each other. The first end surface 320 is defined as a reference surface, and the vertical crystal direction of the crystal rod 300 is defined as a Y-axis crystal direction.

[0061] Specifically, refer to Figure 8 and Fig.11 As shown, provide a <111> The crystal rod 300 has a first end surface 320 and a second end surface which are arranged opposite to each other. The first end surface 320 is defined as a reference surface. For the convenience of description, the vertical crystal direction of the crystal rod 300 is defined as a Y-axis crystal direction.

[0062] The crystal rod 300 has a first end surface 320 and a second end surface. The first end surface 320 and the second end surface each have a notch 310 , which is used as a physical reference point to indicate the crystal orientation or other properties of the crystal rod 300 .

[0063] Step S2: the crystal ingot 300 also has a Notch groove, the Notch groove is facing upward, and the stick bonding machine system obtains the deviation value between the actual value of the crystal ingot crystal orientation and the standard angle and the initial rotation angle of the crystal ingot crystal orientation, and sets the initial orientation angle of the Y axis of the crystal ingot 300.

[0064] Specifically, continue to Figure 8 , Fig. 9 and Fig.11 As shown, the Notch groove is a surface formed by a notch 310 set on the surface of the crystal rod 300. The notch 310 is used as a physical reference point and can indicate the crystal orientation or other properties of the crystal rod 300.

[0065] Place the crystal rod 300 in a stick bonding machine. The stick bonding machine has a workpiece 100, a resin strip 200, a turntable (not shown in the figure), a roller (not shown in the figure), an angle measuring mechanism (not shown in the figure), a fixing mechanism (not shown in the figure), a bonding device (not shown in the figure), etc. The workpiece 100 is fixed on the turntable, and the turntable can drive the workpiece 100 to rotate in a horizontal plane. The resin strip 200 is fixed to the workpiece 100 by bonding and is used to bond the crystal rod 300. The fixing mechanism extends from the length direction of the crystal rod 300 (i.e., Fig. 9 The crystal rod 300 is fixed at both ends of the crystal rod 300 (in the direction of the arrow X in the middle), and the fixing mechanism includes two suction cups, which are adsorbed on the two ends of the crystal rod 300, and can rotate together with the crystal rod 300, and can act as a position sensor. The roller and the angle measuring mechanism are both located on the outside of the crystal rod 300, and the extension direction of the roller is arranged parallel to the crystal rod 300, and is used to support the crystal rod 300 so that it can rotate axially with the help of the roller. The turntable can drive the workpiece 100 to rotate. The pasting equipment is used to paste and fix the crystal rod 300 to the workpiece 100 and the resin strip 200 respectively. In this step, the crystal rod 300 is fixed to the sticking machine by the fixing mechanism, but is not fixed to the workpiece 100 by the resin strip 200, that is, the crystal rod 300 has not yet been glued.

[0066] The crystal ingot 300 is rotated by a stick sticking machine, with the Notch facing upwards, as the initial position of the crystal ingot 300. Then, the deviation between the actual value of the crystal orientation of the crystal ingot 300 and the standard angle is obtained by an angle measuring mechanism such as an X-Ray orientation instrument. <111> The standard angle of the crystal orientation of the crystal rod is 14°14′. The deviation value is the difference between the actual value of the measured crystal orientation and the standard angle. The measurement data is transmitted to the stick gluing machine system. Finally, the Y-axis initial orientation angle of the crystal rod 300 is set. In this embodiment, the Y-axis initial orientation angle is generally set to 0°. Of course, in some other embodiments, the initial orientation angle can also be set to other values.

[0067] Step S3: In the stick bonding machine system, the Y-axis orientation angle is continuously reset until the real-time rotation angle of the crystal rod 300 is within the target rotation angle range to correct the Y-axis crystal orientation and obtain the rotation angle of the crystal rod 300 around its own circumferential direction. The Y-axis orientation angle of the crystal rod 300 when it is within the target rotation angle range is defined as the target orientation angle, wherein the target rotation angle is the angle of the optimal sawing direction of the crystal rod 300 during sawing.

[0068] Specifically, refer to Figure 8 and Fig.11 As shown, the sawing is suitable for truncation or slicing, and can be single-line truncation or multi-line slicing. The best sawing direction during sawing is the best feed direction for diamond wire or mortar wire cutting. In the stick gluing machine system, the Y-axis orientation angle is continuously reset until the real-time rotation angle of the crystal rod is within the target rotation angle range, and the angle of rotation of the crystal rod 300 around its own circumferential direction is obtained, including:

[0069] Reset the Y-axis orientation angle, and set the Y-axis orientation angle to a positive value. If the real-time rotation angle of the crystal rod crystal direction is close to the target rotation angle, the Y-axis orientation angle is continued to increase until the real-time rotation angle of the crystal rod crystal direction is within the target rotation angle range. If the real-time rotation angle of the crystal rod crystal direction deviates from the target rotation angle, the Y-axis orientation angle is set to a negative value, and the Y-axis orientation angle is continued to be reduced until the real-time rotation angle of the crystal rod crystal direction is within the target rotation angle. In the above step S2, in the stick sticking machine system of the stick sticking machine, the initial orientation angle has been set to 0 °. Next, in the stick sticking machine system of the stick sticking machine, the Y-axis orientation angle can be set to a positive value, such as the orientation angle can be set to 0.2 °. And the real-time rotation angle of the crystal rod 300 is measured by an orientation meter to determine whether the real-time rotation angle of the crystal rod crystal direction is close to the target rotation angle or deviates from the target rotation angle. If the real-time rotation angle of the crystal rod crystal direction is close to the target rotation angle, the stick sticking machine system of the stick sticking machine is continuously set and increased until the real-time rotation angle of the crystal rod crystal direction is within the target rotation angle. If the real-time rotation angle of the crystal ingot deviates from the target rotation angle, the Y-axis orientation angle can be set to a negative value, for example, -0.2°, and the Y-axis orientation angle can be continuously reduced in the stick gluing machine system until the real-time rotation angle of the crystal ingot is within the target rotation angle. Fig.11 As shown, when the real-time rotation angle of the crystal rod is α, the real-time rotation angle of the crystal rod 300 is within the target rotation angle range. When the real-time rotation angle of the crystal rod is within the target rotation angle range, the Y-axis orientation angle set at this time is the target orientation angle.

[0070] The angle of rotation of the crystal rod 300 in the clockwise direction along the reference plane is defined as positive, and the angle of rotation of the crystal rod 300 in the counterclockwise direction along the reference plane is defined as negative. Since the Notch groove of the crystal rod 300 rotates at an angle of -90° to 90° on the stick bonding machine. Therefore, the optimal rotation angles of the crystal rod crystal orientation are 0°, 60° and -60°. When the target rotation angle is within the set tolerance range near the optimal rotation angle, the probability of warping of the crystal rod 300 can be reduced. In this embodiment, the tolerance range is preferably set to ±5°. Then, the target rotation angle range includes 0°±5°, 60°±5°, and -60°±5°.

[0071] The following is an example in which the target rotation angle is 0°, the tolerance range is ±5°, that is, the target rotation angle range is 0°±5°, and the initial orientation angle of the Y-axis is 0°.

[0072] The simulation results on the stick glue machine system are shown in Table 1, which is a table showing the change of the Y-axis rotation angle with the reset Y-axis orientation angle.

[0073] Table 1 shows the change of Y-axis rotation angle with the reset Y orientation angle

[0074]

[0075] It should be noted that the Y-axis rotation angle is the real-time rotation angle of the crystal rod. The Y orientation angle is the orientation angle described above. Test 1, Test 2, Test 3, Test 4 and Test 5 of this example are the data obtained by measuring the same crystal rod during the crystal rod adjustment process.

[0076] As can be seen from Table 1, when the Notch groove is facing upwards, when the Y-axis crystal direction of the crystal rod 300 is -0.355, that is, the deviation value of the actual value of the crystal direction and the standard angle is -0.355. The Y-axis rotation angle is 23.764, and the initial orientation angle is set to 0°. Reset the Y-axis orientation angle, for example, the orientation angle can be set to 0.2. The Y-axis rotation angle is 34.479, and the Y-axis rotation angle deviates from the target rotation angle, then the Y-axis orientation angle needs to be reset. For example, it can be set to -0.2, then the Y-axis rotation angle decreases and approaches the target rotation angle. Repeat the setting of the orientation angle until the Y-axis rotation angle of the crystal rod 300 is within the range of 0°±5°, that is, 4.816, and the target orientation angle is obtained. In the embodiment shown in Table 1, the target orientation deviation angle is -0.3. At the same time, the angle at which the crystal rod 300 rotates around its own circumferential direction at this time is obtained.

[0077] Step S4: rotating the crystal rod 300 based on the rotation angle of the crystal rod 300 around its own circumferential direction.

[0078] Through the cooperation between the turntable and the rollers, the crystal direction of the crystal ingot 300 is rotated to a target rotation angle range based on the rotation angle of the crystal ingot 300 around its own circumferential direction. The target rotation angle is the angle of the best sawing direction of the crystal ingot 300 during sawing.

[0079] Step S5: Based on the target orientation angle, the height of the crystal rod 300 along its length direction is adjusted to correct the target orientation angle to 0°.

[0080] Specifically, refer to Figures 8 to 12 As shown, the target rotation angle range is 0°±5° as an example. Based on the target orientation angle, the crystal rod 300 is adjusted along its length direction (ie, Figure 1 The height of the inclination of the crystal rod 300 (the direction in which the X-axis is located) to correct the Y-axis re-inspection value to 0° includes: if the target orientation angle is a positive value, the first end face 320 of the crystal rod is higher than the second end face; if the target orientation angle is a negative value, the first end face 320 of the crystal rod 300 is lower than the second end face.

[0081] As one embodiment, based on the target orientation angle, adjusting the height of the crystal rod 300 tilted along its length direction to correct the target orientation angle to 0° includes: based on the target orientation angle, making a resin strip 200, and setting a slope (not shown in the figure) in the resin strip 200 to correct the target orientation angle to 0°, wherein the height of the slope is equal to the height of the crystal rod 300 tilted along its length direction. That is, the crystal rod 300 is fixed to the side of the resin strip 200 having the slope, and the other side of the resin strip 200 is fixed to the workpiece 100. The deviation value between the actual value of the crystal orientation and the standard angle can be measured by an X-Ray orientation meter to obtain the Y-axis re-inspection value to verify whether the Y-axis re-inspection value is 0°. That is, by correcting the target orientation angle to 0°, the Y-axis re-inspection value is corrected to 0°.

[0082] The height of the slope is: H = L*tan(θ), where L is the length of the crystal rod 300 and θ is the absolute value of the target orientation angle. When the target rotation angle is 0°, the Y-axis re-inspection value is corrected to 0° by setting a slope on the resin strip and adjusting the height of the crystal rod 300.

[0083] The height of the resin strip 200 located at the first end surface 320 is denoted as H1 , and the height of the resin strip 200 located at the second end surface is denoted as H2 .

[0084] like Fig. 9 As shown, if the target orientation angle θ is greater than 0°, H1 is greater than H2;

[0085] like Fig.10 As shown, if the target orientation angle θ is less than 0°, H1 is less than H2.

[0086] As another embodiment thereof, based on the target orientation angle, adjusting the height of the crystal rod 300 tilted along its length direction to correct the target orientation angle to 0° also includes: the rod bonding machine also includes a slicer, and in the dovetail groove of the slicer clamping the workpiece 100, by inserting a feeler gauge at the head or tail part, the height of the crystal rod 300 tilted along its length direction is adjusted to correct the target orientation angle to 0°.

[0087] In this embodiment, the resin strip 200 is a conventional resin strip 200 without a slope. In the dovetail groove of the slicer clamping the workpiece 100, inserting a feeler gauge at the head or tail position can also play a role in correcting the target orientation angle.

[0088] If the target orientation angle θ is greater than 0°, then H1 is greater than H2. Place the feeler gauge at the head of the dovetail groove and correct the target orientation angle to 0°.

[0089] If the target orientation angle θ is less than 0°, then H1 is less than H2. Place the feeler gauge at the tail of the dovetail groove and correct the target orientation angle to 0°.

[0090] Step S6: Based on the tilt height of the crystal ingot 300 , the crystal ingot 300 is glued and fixed.

[0091] Specifically, refer to Figures 8 to 12 As shown, based on the height of the inclination of the crystal rod 300, the crystal rod 300 is pasted, including: the stick-sticking machine has a pasting device, and the crystal rod 300 and the sloped side of the resin strip 200 are pasted and fixed by the pasting device. The manufactured resin strip 200 is pasted and fixed to the workpiece 100 on the pasting machine. Finally, the resin strip 200 is pasted and fixed to the crystal rod 300, that is, the pasting of the crystal rod 300 is completed. In actual cutting, the workpiece 100, the resin strip 200 and the crystal rod 300 are rotated 180°, and the saw wire 400 of the stick-sticking machine is cut in the specified direction (that is, Fig.12 The crystal rod 300 is cut in the direction of the arrow d in the middle.

[0092] In this embodiment, the deviation value between the actual value of the crystal orientation and the standard angle and the initial rotation angle of the crystal orientation of the crystal rod are first obtained, and the initial orientation angle of the crystal rod 300 on the Y axis at the initial rotation angle is set. Then, in the stick bonding machine system, the Y axis orientation angle is continuously reset until the real-time rotation angle of the crystal orientation of the crystal rod is within the target rotation angle range to correct the Y axis crystal orientation, and the angle of rotation of the crystal rod 300 around its own circumferential direction is obtained, and the Y axis orientation angle of the crystal rod 300 when it is within the target rotation angle range is defined as the target orientation angle, wherein the target rotation angle is the angle at which the best sawing direction of the crystal rod 300 is located during sawing. The crystal rod 300 is rotated based on the angle at which the crystal rod 300 rotates around its own circumferential direction. Based on the target orientation angle, a slope is set in the resin strip 200 to correct the target orientation angle to 0°. The crystal rod 300 is fixed to the sloped side of the resin strip 200, so that the probability of the crystal rod 300 being located at the best corner during sawing is increased, and the elastic modulus of the materials on both sides of the sawed crystal rod 300 is symmetrical, avoiding the problem of warping of the silicon wafer.

[0093] This embodiment also discloses a stick gluing machine system, including a measuring device, for obtaining the deviation value between the actual value of the crystal direction of the crystal rod and the standard angle and the initial rotation angle of the crystal direction of the crystal rod, and setting the initial orientation angle of the Y axis of the crystal rod 300. A crystal direction algorithm module, for continuously resetting the Y axis orientation angle until the real-time rotation angle of the crystal direction of the crystal rod is within the target rotation angle range, so as to correct the Y axis crystal direction, and obtain the angle of rotation of the crystal rod 300 around its own circumferential direction, and define the Y axis orientation angle of the crystal rod 300 when it is within the target rotation angle range as the target orientation angle, wherein the target rotation angle is the angle of the best sawing direction of the crystal rod 300 during sawing; based on the angle of rotation of the crystal rod 300 around its own circumferential direction, the crystal rod 300 is rotated; based on the target orientation angle, the height of the crystal rod 300 tilted along its length direction is adjusted to correct the target orientation angle to 0°. A gluing device, for gluing and fixing the crystal rod 300 based on the tilted height of the crystal rod 300.

[0094] The stick gluing machine system provided in this embodiment is different from the stick gluing machine system provided in this embodiment <111> The method for sticking the crystal rods of this embodiment belongs to the same inventive concept. Therefore, the stick sticking machine system provided in this embodiment can prevent the problem of warping of the silicon wafer when the crystal rod 300 is sawed.

[0095] In summary, the above embodiments are <111> The different configurations of the crystal rod pasting method and the stick pasting machine system are described in detail. Of course, the above description is only a description of the preferred embodiment of the present invention, and is not any limitation to the scope of the present invention. The present invention includes but is not limited to the configurations listed in the above implementation. Those skilled in the art can draw inferences based on the contents of the above embodiments. Any changes and modifications made by ordinary technicians in the field of the present invention based on the above disclosure are within the scope of protection of the claims.

Claims

1. A <111> A method for pasting a type crystal rod, characterized in that: include: Provide a <111> A crystal rod having a first end face and a second end face arranged opposite to each other, the first end face is defined as a reference face, and a vertical crystal direction of the crystal rod is defined as a Y-axis crystal direction; The stick gluing machine system obtains the deviation value between the actual value of the crystal orientation of the crystal ingot and the standard angle and the initial rotation angle of the crystal orientation of the crystal ingot, and sets the initial orientation angle of the Y axis of the crystal ingot; In the stick bonding machine system, the Y-axis orientation angle is continuously reset until the real-time rotation angle of the crystal rod crystal direction is within the target rotation angle range, so as to correct the Y-axis crystal direction and obtain the rotation angle of the crystal rod around its own circumferential direction. The Y-axis orientation angle of the crystal rod when it is within the target rotation angle range is defined as the target orientation angle, wherein the target rotation angle is the angle of the best sawing direction of the crystal rod during sawing; Based on the angle at which the crystal rod rotates around its own circumferential direction, the crystal rod is rotated; Based on the target orientation angle, the height of the ingot along its length direction is adjusted to correct the target orientation angle to 0°; The crystal rod is glued and fixed based on the tilt height of the crystal rod.

2. according to claim 1 <111> A method for pasting a type crystal rod, characterized in that: The crystal rod also has a Notch groove, and the Notch groove is facing upward. The stick gluing machine system obtains the deviation value between the actual value of the crystal orientation of the crystal rod and the standard angle and the initial rotation angle of the crystal orientation of the crystal rod, and sets the initial orientation angle of the Y axis of the crystal rod, including: The crystal rod is placed in a rod bonding machine, which includes an X-Ray orientator. The X-Ray orientator is used to obtain the deviation between the actual value of the crystal rod crystal orientation and the standard angle and the initial rotation angle of the crystal rod crystal orientation, and the Y-axis initial orientation angle of the crystal rod is set in the rod bonding machine system.

3. According to claim 2 <111> A method for pasting a type crystal rod, characterized in that: The initial orientation angle of the Y axis is set to 0°.

4. according to claim 1 <111> A method for pasting a type crystal rod, characterized in that: The angle of the crystal rod rotating clockwise along the reference plane is defined as positive, and the angle of the crystal rod rotating counterclockwise along the reference plane is defined as negative. The angle of the Notch groove of the crystal rod rotating on the rod bonding machine is -90° to 90°.

5. According to claim 4 <111> A method for pasting a type crystal rod, characterized in that: In the stick bonding machine system, the Y-axis orientation angle is continuously reset until the real-time rotation angle of the crystal rod crystal direction is within the target rotation angle range to correct the Y-axis crystal direction, and obtain the angle of rotation of the crystal rod around its own circumferential direction, and define the Y-axis orientation angle of the crystal rod when it is within the target rotation angle range as the target orientation angle, wherein the target rotation angle is the angle of the best sawing direction of the crystal rod during sawing, including: Reset the Y-axis orientation angle and set the orientation angle to a positive value. If the real-time rotation angle of the crystal rod is close to the target angle, continue to increase the orientation angle until the real-time rotation angle of the crystal rod is within the target angle range. If the real-time rotation angle of the crystal rod deviates from the target angle, set the orientation angle to a negative value and continue to decrease the orientation angle until the real-time rotation angle of the crystal rod is within the target angle range.

6. According to claim 5 <111> A method for pasting a type crystal rod, characterized in that: The target rotation angle range includes 0°±5°, 60°±5°, and -60°±5°.

7. According to claim 1 <111> A method for pasting a type crystal rod, characterized in that: The step of adjusting the height of the crystal rod along its length direction based on the target orientation angle to correct the target orientation angle to 0° includes: If the target orientation angle is a positive value, the first end surface of the crystal rod is higher than the second end surface; If the target orientation angle is a negative value, the first end surface of the crystal rod is lower than the second end surface.

8. According to claim 1 <111> A method for pasting a type crystal rod, characterized in that: The step of adjusting the height of the crystal rod along its length direction based on the target orientation angle to correct the target orientation angle to 0° further includes: Based on the target orientation angle, a resin strip is manufactured, and a slope is set in the resin strip to correct the target orientation angle to 0°, wherein the height of the slope is equal to the height of the ingot tilted along its length direction; The height of the resin strip located at the first end surface is set to H1, and the height of the resin strip located at the second end surface is set to H2; If the target orientation angle is greater than 0°, H1 is greater than H2; If the target orientation angle is less than 0°, H1 is less than H2.

9. The method according to claim 8 <111> A method for pasting a type crystal rod, characterized in that: The height of the slope is: H=L*tan(θ), where L is the length of the crystal rod and θ is the absolute value of the target orientation angle.

10. The method according to claim 9 <111> A method for pasting a type crystal rod, characterized in that: The stick gluing machine also includes a workpiece. After the crystal stick is fixed to the sloped side of the resin strip, the other side of the resin strip is fixed to the workpiece.

11. A stick gluing machine system, characterized in that: include: Measuring equipment, used to obtain the deviation between the actual value of the crystal orientation of the crystal rod and the standard angle and the initial rotation angle of the crystal orientation of the crystal rod, and to set the initial orientation angle of the Y axis of the crystal rod; The crystal orientation algorithm module is used to continuously reset the Y-axis orientation angle until the real-time rotation angle of the crystal rod crystal orientation is within the target rotation angle range, so as to correct the Y-axis crystal orientation and obtain the rotation angle of the crystal rod around its own circumferential direction. The Y-axis orientation angle of the crystal rod when it is within the target rotation angle range is defined as the target orientation angle, wherein the target rotation angle is the angle of the best sawing direction of the crystal rod during sawing; the crystal rod is rotated based on the rotation angle of the crystal rod around its own circumferential direction; based on the target orientation angle, the height of the crystal rod tilted along its length direction is adjusted to correct the target orientation angle to 0°; The pasting device is used to paste and fix the crystal rod based on the tilt height of the crystal rod.

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