Fan module and electronic device

Abstract

The invention discloses a fan module and an electronic device. The fan module comprises a shell and a fan blade assembly. The shell comprises a first cover plate, a side plate and a second cover plate. The side plate is arranged on the first cover plate. The second cover plate is arranged on the side, away from the first cover plate, of the side plate, so that the first cover plate, the side plate and the second cover plate jointly form a first air outlet and a second air outlet. The first air outlet and the second air outlet are located in the two different sides of the first cover plate respectively. The second cover plate is provided with an air inlet communicated with the first air outlet and the second air outlet. The fan blade assembly is rotatably arranged on the first cover plate. The first cover plate is provided with a first notch. The first notch is recessed inwards from a reference surface where the second air outlet is located, and is connected to the side plate.

Description

Technical Field

[0001] The present invention relates to an air cooling unit and an electronic device comprising the same, and in particular to a fan module and an electronic device comprising the same. Background Art

[0002] Compared to traditional desktop computers, laptops have the advantage of being thin and light and easy to carry, making them a widely used electronic device. Generally speaking, in order to effectively dissipate the heat generated by the heat source, most manufacturers will install fans inside the laptop. In this way, the fan can introduce cold air from the outside to cool the heat source and the laptop components such as the shell.

[0003] However, in recent years, in pursuit of portability, laptop computers have gradually become thinner and lighter, which has reduced the internal space of the laptop computer. Therefore, the fan in the laptop computer often does not have enough space to effectively cool the housing. As a result, when the user operates the keyboard module on the housing, the user will come into contact with the hot housing and feel uncomfortable. Summary of the invention

[0004] The object of the present invention is to provide a fan module and an electronic device to prevent a user from feeling uncomfortable due to contact with a high-temperature cover when operating a keyboard module.

[0005] A fan module disclosed in one embodiment of the present invention includes a housing and a blade assembly. The housing includes a first cover plate, a side plate and a second cover plate. The side plate is arranged on the first cover plate. The second cover plate is arranged on a side of the side plate away from the first cover plate, so that the first cover plate, the side plate and the second cover plate together form a first air outlet and a second air outlet. The first air outlet and the second air outlet are respectively located on different sides of the first cover plate. The second cover plate has an air inlet connected to the first air outlet and the second air outlet. The blade assembly is rotatably arranged on the first cover plate. The first cover plate has a first notch. The first notch is recessed inward from a reference plane where the second air outlet is located, and is connected to the side plate.

[0006] The electronic device disclosed in another embodiment of the present invention comprises a base, a cover, a mainboard, a heat source, a keyboard module and a fan module. The cover is arranged on one side of the base and forms a storage space together with the base. The mainboard is arranged in the storage space. The heat source is arranged on the mainboard. The keyboard module and the cover are located on the same side of the mainboard. The fan module comprises a housing and a fan blade assembly. The housing comprises a first cover plate, a side plate and a second cover plate. The side plate is arranged on the first cover plate. The second cover plate is arranged on a side of the side plate away from the first cover plate, so that the first cover plate, the side plate and the second cover plate jointly form a first air outlet and a second air outlet. The first air outlet and the second air outlet are respectively located on different sides of the first cover plate. The second cover plate has an air inlet connected to the first air outlet and the second air outlet. The fan blade assembly is rotatably arranged on the first cover plate. The first cover plate has a first notch. The first notch is recessed inward from a reference surface where the second air outlet is located, and is connected to the side plate.

[0007] According to the fan module and electronic device disclosed in the above embodiments, the first notch is recessed inward from the reference plane where the second air outlet is located, and is connected to the side plate. Therefore, the heat dissipation airflow guided by the fan blade assembly will flow from the second air outlet through the first notch to between the cover body and the main board. In this way, the air volume flowing between the cover body and the main board can be increased, and the heat accumulated between the cover body and the main board can be effectively dissipated. In this way, the cover body can be effectively cooled, and the user is prevented from feeling uncomfortable due to contact with the high-temperature cover body when operating the keyboard module. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 FIG. 4 is a schematic side cross-sectional view of an electronic device according to an embodiment of the present invention.

[0009] Figure 2 for Figure 1 A three-dimensional diagram of the electronic device in which the base and the cover are omitted.

[0010] Figure 3 for Figure 1 A three-dimensional diagram of a fan module of an electronic device in FIG.

[0011] Figure 4 for Figure 1 A partially enlarged top view of the electronic device omitting the base and cover.

[0012] Figure 5 for Figure 1 A partial enlarged view of the electronic device in FIG.

[0013] The reference numerals are as follows:

[0014] 10: Electronic devices

[0015] 100: Base

[0016] 150: Accommodation space

[0017] 200: Cover

[0018] 300: Motherboard

[0019] 301: Top surface

[0020] 302: Bottom surface

[0021] 400: Heat source

[0022] 500:Keyboard module

[0023] 600: Fan module

[0024] 610: Shell

[0025] 611: First cover plate

[0026] 6110,6111: Side edge

[0027] 612: Side panel

[0028] 6120: Side edge

[0029] 6121: Side notch

[0030] 613: Second cover

[0031] 614: First air outlet

[0032] 615: Second air outlet

[0033] 616: Air inlet

[0034] 617: The First Gap

[0035] 618: Second Gap

[0036] 620: Fan blade assembly

[0037] 650: First heat sink fin group

[0038] 660: Second heat sink fin group

[0039] 700,800: air guide

[0040] F: Cooling airflow

[0041] W: Width

[0042] P: Reference plane DETAILED DESCRIPTION

[0043] The detailed features and advantages of the embodiments of the present invention are described in detail in the following embodiments, and the contents are sufficient to enable those skilled in the art to understand the technical contents of the embodiments of the present invention and implement them accordingly. According to the contents disclosed in this specification, the claims and the drawings, those skilled in the art can easily understand the relevant purposes and advantages of the present invention. The following embodiments further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention in any viewpoint.

[0044] See also Figure 1 and Figure 2 , Figure 1 FIG. 4 is a schematic side cross-sectional view of an electronic device according to an embodiment of the present invention. Figure 2 for Figure 1 In the present embodiment, the electronic device 10 is, for example, a main body of a notebook computer, and includes a base 100, a cover 200, a main board 300, two heat sources 400, a keyboard module 500, two fan modules 600, two first heat dissipation fin groups 650, two second heat dissipation fin groups 660, two air guides 700 and two air guides 800.

[0045] The base 100 is, for example, commonly known as a “D piece”. The cover 200 is, for example, commonly known as a “C piece”. The cover 200 is disposed on one side of the base 100 and forms a receiving space 150 together with the base 100 .

[0046] The motherboard 300 is disposed in the accommodation space 150. In this embodiment, the motherboard 300 has a top surface 301 and a bottom surface 302 facing each other. The top surface 301 faces the cover 200. The two heat sources 400 are, for example, a central processing unit (CPU) or a graphics processing unit (GPU). The two heat sources 400 are electrically connected to the motherboard 300 and are disposed on the bottom surface 302. The keyboard module 500 is electrically connected to the motherboard 300. The keyboard module 500 and the cover 200 are located on the same side of the motherboard 300.

[0047] The corresponding fan module 600, the first heat sink fin group 650, the second heat sink fin group 660, the air guide 700 and the air guide 800 constitute a heat sink assembly (not numbered). The two heat sink assemblies in this embodiment are respectively used to dissipate the heat generated by the two heat sources 400 to the outside of the electronic device 10. Since the structures of the two heat sink assemblies are similar, only one heat sink assembly is used as an example for description below.

[0048] See also Figure 2 Figure 3 , Figure 3 for Figure 1610 is a three-dimensional diagram of a fan module of an electronic device in FIG. The fan module 600 includes a housing 610 and a fan blade assembly 620. The housing 610 includes a first cover plate 611, a side plate 612 and a second cover plate 613. The side plate 612 is disposed on the first cover plate 611. The second cover plate 613 is disposed on a side of the side plate 612 away from the first cover plate 611, so that the first cover plate 611, the side plate 612 and the second cover plate 613 together form a first air outlet 614 and a second air outlet 615. The first air outlet 614 and the second air outlet 615 are respectively located on different sides of the first cover plate 611. The first cover plate 611 has a first notch 617. The first notch 617 is recessed inward from a reference plane P where the second air outlet 615 is located, and is connected to the side plate 612. The second cover plate 613 has an air inlet 616 connected to the first air outlet 614 and the second air outlet 615. The fan blade assembly 620 is rotatably disposed on the first cover plate 611 .

[0049] In this embodiment, a side edge 6111 defining the first notch 617 in the first cover plate 611 is in an arc shape to facilitate the manufacture of the first cover plate 611. However, the present invention is not limited to the shape of the side edge 6111. In other embodiments, the side edge may also be in a right angle shape.

[0050] In addition, in this embodiment, the first cover plate 611 further has a second notch 618. The second notch 618 is recessed inward from the reference plane P. Different sides of the first notch 617 are respectively connected to the side plate 612 and the second notch 618. The width W of the second notch 618 is, for example, 37 mm.

[0051] In addition, in this embodiment, the side plate 612 has a side edge 6120. The side edge 6120 is connected to the first notch 617. A side notch 6121 is formed between the side edge 6120 and the reference plane P. In this embodiment, the second air outlet 615, the first notch 617, the second notch 618 and the side notch 6121 together form a large air outlet.

[0052] The first heat dissipation fin set 650 and the second heat dissipation fin set 660 are disposed on the main board 300. The first heat dissipation fin set 650 and the second heat dissipation fin set 660 are disposed adjacent to the first air outlet 614 and the second air outlet 615 respectively.

[0053] The air guide 700 is disposed on a side of the first cover plate 611 away from the second cover plate 613 , and covers at least a portion of the second notch 618 .

[0054] The air guide 800 is disposed on the bottom surface 302 of the mainboard 300 and is located between the heat source 400 and the fan module 600 .

[0055] See also Figures 3 to 5 , Figure 4 for Figure 1 A partially enlarged top view of the electronic device omitting the base and cover. Figure 5 for Figure 1 A partial enlarged view of the electronic device in FIG.

[0056] like Figure 4 As shown, the fan blade assembly 620 is used to guide a heat dissipation airflow F to the first heat dissipation fin group 650 and the second heat dissipation fin group 660 through the first air outlet 614 and the second air outlet 615 respectively. Through the second notch 618, the air volume of the heat dissipation airflow F flowing to the second heat dissipation fin group 660 will increase, thereby allowing the heat generated by the heat source 400 to be more effectively transferred to the second heat dissipation fin group 660. In addition, by shielding at least a portion of the second notch 618 with the air guide 700, the heat dissipation airflow F will flow more concentratedly to the second heat dissipation fin group 660, thereby allowing the heat generated by the heat source 400 to be more effectively transferred to the second heat dissipation fin group 660. It should be noted that in other embodiments where the heat source has a lower heat generation, the first plate body may not need to have the second notch 618, and the electronic device may not need to include the air guide 700.

[0057] In addition, if Figure 3 and Figure 4 As shown, in this embodiment, a side edge 6110 of the first cover plate 610 defining the second air outlet 615, for example, contacts the second heat dissipation fin set 660. Therefore, the heat dissipation airflow F flowing to the second heat dissipation fin set 660 can be prevented from further flowing to the pivotal member (not shown), thereby preventing the lubricating oil on the pivotal member from being dried by the heat dissipation airflow F.

[0058] like Figure 5 As shown, the air guide 800 is used to guide the heat dissipation airflow F flowing out of the first notch 617 and the side notch 6121 to between the top surface 301 of the motherboard 300 and the cover 200. In other words, the air guide 800 allows the heat dissipation airflow F to flow more concentratedly to the top surface 301 of the motherboard 300 and the cover 200. However, in other embodiments where the heat generation of the heat source is lower, the electronic device may not need to include the air guide 800.

[0059] In addition, if Figure 5 As shown, in this embodiment, the first cover plate 611 is closer to the cover body 200 than the second cover plate 613. Therefore, the heat dissipation airflow F can more easily flow from the second air outlet 615 of the first cover plate 611 to the top surface 301 of the motherboard 300 and the cover body 200. However, in other embodiments where the heat generation of the heat source is lower, the first cover plate can also be farther away from the cover body than the second cover plate.

[0060] According to the fan module and electronic device disclosed in the above embodiments, the first notch is recessed inward from the reference plane where the second air outlet is located, and is connected to the side plate. Therefore, the heat dissipation airflow guided by the fan blade assembly will flow from the second air outlet through the first notch to between the cover body and the main board. In this way, the air volume flowing between the cover body and the main board can be increased, and the heat accumulated between the cover body and the main board can be effectively dissipated. In this way, the cover body can be effectively cooled, and the user is prevented from feeling uncomfortable due to contact with the high-temperature cover body when operating the keyboard module.

[0061] In addition, according to experimental data, through the design of the first notch 617, the second notch 618, the side notch 6121 and the air guide 800, the temperature at the hottest point in the cover 200 is reduced by about 7 degrees Celsius.

[0062] Although the present invention is disclosed as above with the aforementioned embodiments, it is not intended to limit the present invention. Those skilled in the art may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the patent protection scope of the present invention shall be determined by the claims attached to this specification.

Claims

1. A fan module, comprising: A housing, comprising a first cover plate, a side plate and a second cover plate, wherein the side plate is disposed on the first cover plate, and the second cover plate is disposed on a side of the side plate away from the first cover plate, so that the first cover plate, the side plate and the second cover plate together form a first air outlet and a second air outlet, wherein the first air outlet and the second air outlet are respectively located on different sides of the first cover plate, and the second cover plate has an air inlet connected to the first air outlet and the second air outlet; and A fan blade assembly is rotatably disposed on the first cover plate; in, The first cover plate has a first notch, which is recessed inward from a reference surface where the second air outlet is located and is connected to the side plate. 2 . The fan module as claimed in claim 1 , wherein the side plate has a side edge, the side edge is connected to the first notch, and a side notch is formed between the side edge and the reference plane. 3 . The fan module as claimed in claim 1 , wherein a side edge of the first cover plate defining the first notch is in an arc shape.

4. The fan module as claimed in claim 1, wherein the first cover plate further has a second notch, the second notch is recessed inward from the reference surface, and two different sides of the first notch are respectively connected to the side plate and the second notch.

5. An electronic device comprising: a base; A cover body is disposed on one side of the base and forms a containing space together with the base; A mainboard is disposed in the accommodating space; A heat source is disposed on the mainboard; a keyboard module, the keyboard module and the cover are located on the same side of the motherboard; and A fan module, comprising: A housing, comprising a first cover plate, a side plate and a second cover plate, wherein the side plate is disposed on the first cover plate, and the second cover plate is disposed on a side of the side plate away from the first cover plate, so that the first cover plate, the side plate and the second cover plate together form a first air outlet and a second air outlet, wherein the first air outlet and the second air outlet are respectively located on different sides of the first cover plate, and the second cover plate has an air inlet connected to the first air outlet and the second air outlet; and A fan blade assembly is rotatably disposed on the first cover plate; in, The first cover plate has a first notch, which is recessed inward from a reference surface where the second air outlet is located and is connected to the side plate.

6. The electronic device as described in claim 5 further includes a first heat dissipation fin group and a second heat dissipation fin group arranged on the main board, the first cover plate also has a second notch, the second notch is recessed inward from the reference surface, different sides of the first notch are respectively connected to the side plate and the second notch, the first heat dissipation fin group and the second heat dissipation fin group are respectively adjacent to the first air outlet and the second air outlet, and the fan blade assembly is used to guide a heat dissipation airflow to the first heat dissipation fin group and the second heat dissipation fin group through the first air outlet and the second air outlet respectively. 7 . The electronic device as claimed in claim 6 , further comprising an air guide member, the air guide member being disposed on a side of the first cover plate away from the second cover plate and covering at least a portion of the second notch. 8 . The electronic device as claimed in claim 6 , wherein a side edge of the first cover defining the second air outlet contacts the second heat dissipation fin set.

9. The electronic device as described in claim 5 further comprises an air guide member, the mainboard has a top surface and a bottom surface facing away from each other, the top surface faces the cover body, the heat source is arranged on the bottom surface of the mainboard, the air guide member is arranged on the bottom surface of the mainboard and is between the heat source and the fan module, and the air guide member is used to guide a heat dissipation airflow flowing out of the second air outlet to between the top surface of the mainboard and the cover body. 10 . The electronic device as claimed in claim 5 , wherein the first cover is closer to the cover body than the second cover.

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