Circuit board assembly and preparation method

Abstract

The invention provides a circuit board assembly and a preparation method, and relates to the technical field of electronics. A circuit board assembly is applied to network equipment and comprises a mainboard, an accommodating cavity is formed in the edge of the mainboard, and a first bonding pad is formed in the position close to the accommodating cavity; a second bonding pad, a third bonding pad and a connecting line for connecting the second bonding pad and the third bonding pad are formed on the carrier plate; the indicating lamp is electrically connected with the second bonding pad; wherein the support plate at least partially covers the accommodating cavity, the indicating lamp and the second bonding pad are accommodated in the accommodating cavity, the first bonding pad is electrically connected with the third bonding pad, and the first bonding pad is connected with an indicating lamp control module arranged on the mainboard. Through the circuit board assembly, the high density of the interfaces arranged on the network equipment can be improved.

Description

Technical Field

[0001] The present invention relates to the field of electronic technology, and more particularly to a circuit board assembly and a preparation method thereof. Background Art

[0002] With the development of communication technology, the traffic carried by network equipment has gradually increased. The density of network interfaces deployed in a network device and the optical module interfaces required for plugging in optical modules has also gradually increased. In some scenarios, the interface needs to be configured with an indicator light to display the working status of the interface.

[0003] In order to achieve higher bandwidth, the deployment density of interfaces is further improved, and the deployment space reserved for indicator lights and peripheral circuits on the circuit board of network equipment is further compressed. Therefore, how to more effectively utilize the space on the circuit board in the network equipment so that each interface can display the working status is an urgent problem to be solved by technical personnel in this field. Summary of the invention

[0004] In order to overcome the problems existing in the related art, this specification provides a circuit board assembly and a preparation method.

[0005] According to a first aspect of an embodiment of this specification, a circuit board assembly is provided, which is applied to a network device, including:

[0006] A mainboard, wherein a receiving cavity is provided at an edge of the mainboard, and a first solder pad is formed at a position close to the receiving cavity;

[0007] A carrier board, on which a second pad, a third pad, and a connection line connecting the second pad and the third pad are formed;

[0008] an indicator light, electrically connected to the second pad;

[0009] Among them, the carrier board at least partially covers the accommodating cavity, the indicator light and the second solder pad are accommodated in the accommodating cavity, the first solder pad is electrically connected to the third solder pad, and the first solder pad is connected to the indicator light control module set on the mainboard.

[0010] Optionally, the circuit board assembly further includes:

[0011] The indicator light peripheral device is arranged on the carrier board and accommodated in the accommodation cavity. The indicator light peripheral device is connected in series to the connecting line on the carrier board.

[0012] Optionally, a shielding portion is provided on a side of the accommodating cavity away from the carrier board, and the shielding portion is formed by the main board.

[0013] Optionally, the first pad and the third pad are L-shaped.

[0014] Optionally, two of the second pads and two of the third pads form a pad group, or three of the second pads and three of the third pads form a pad group;

[0015] Each pad group corresponds to an indicator light;

[0016] At least two pad groups are arranged on one carrier board.

[0017] Optionally, at least two accommodating cavities are formed on the main board, two adjacent accommodating cavities are respectively formed on different surfaces of the main board, and the two adjacent accommodating cavities are staggered.

[0018] Optionally, also include:

[0019] The interface housing is arranged at the edge of the main board, and the main board and the interface housing clamp the carrier board.

[0020] Optionally, the carrier plate partially covers the accommodating cavity;

[0021] The circuit board assembly further includes:

[0022] A light guide column, the light guide column is fixed to the bottom of one side of the interface housing facing the main board and is accommodated in the accommodation cavity;

[0023] The tail of the light guide column is close to the indicator light, and the head of the light guide column extends to the edge of the mainboard.

[0024] According to a second aspect of an embodiment of this specification, a method for preparing a circuit board assembly is provided, comprising:

[0025] preparing a main board, wherein a first solder pad is formed on the main board;

[0026] A receiving cavity is provided at the edge of the mainboard, wherein the first solder pad is located at the edge of the mainboard close to the receiving cavity;

[0027] preparing a carrier board, wherein an indicator light is electrically connected between a second pad and a third pad formed on the carrier board;

[0028] The first soldering pad and the third soldering pad are welded so that the indicator light arranged on the carrier board is accommodated in the accommodation cavity.

[0029] Optionally, after welding the first welding pad and the third welding pad, the method further includes:

[0030] An interface shell is welded on the main board, wherein a light guide column is fixed to the bottom of one side of the interface shell facing the main board, the interface shell covers the main board and the carrier board, and the light guide column is accommodated in the accommodating cavity.

[0031] The technical solutions provided by the embodiments of this specification may have the following beneficial effects:

[0032] In the embodiments of the present specification, in a network device, a receiving cavity is opened on a main board, and a carrier board provided with an indicator light is electrically connected to the main board, so that the indicator light on the carrier board is accommodated in the receiving cavity, thereby avoiding the situation where the indicator light is provided on the main board and occupies a large height dimension. The interface housing provided in the network device can be provided in a high-density manner, thereby improving the utilization efficiency of the space on the circuit board in the network device.

[0033] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the specification and, together with the description, serve to explain the principles of the specification.

[0035] Figure 1 It is a structural schematic diagram of a circuit board assembly involved in this application;

[0036] Figure 2 It is a corresponding connection diagram of a main board and a carrier board in a circuit board assembly involved in the present application;

[0037] Figure 3 It is a structural schematic diagram of a carrier board in a circuit board assembly involved in an embodiment of the present application, wherein an indicator light peripheral device is arranged on the carrier board;

[0038] Figure 4 is a structural schematic diagram of a carrier board in a circuit board assembly involved in an embodiment of the present application, wherein the third pad is L-shaped;

[0039] Figure 5 It is a structural schematic diagram of a carrier board in a circuit board assembly involved in an embodiment of the present application, wherein a plurality of pad groups are arranged on the carrier board, and each pad includes two second pads and two third pads;

[0040] Figure 6 It is a structural schematic diagram of a carrier board in a circuit board assembly involved in an embodiment of the present application, wherein a plurality of pad groups are arranged on the carrier board, and each pad includes three second pads and three third pads;

[0041] Figure 7It is a structural schematic diagram of a circuit board assembly involved in an embodiment of the present application;

[0042] Figure 8 It is a structural schematic diagram of a circuit board assembly involved in an embodiment of the present application, wherein a light guide column is provided on the interface housing;

[0043] Fig. 9 is a side view of a circuit board assembly involved in an embodiment of the present application, wherein a light guide column is provided on the interface housing;

[0044] Fig.10 It is a flow chart of a method for preparing a circuit board assembly involved in the present application. DETAILED DESCRIPTION

[0045] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this specification. Instead, they are merely examples of devices and methods consistent with some aspects of this specification as detailed in the appended claims.

[0046] The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit this specification. The singular forms "a", "the" and "the" used in this specification and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0047] It should be understood that although the terms first, second, third, etc. may be used in this specification to describe various information, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this specification, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0048] The present application relates to a circuit board assembly 100, such as Figure 1 , 2 As shown, it is applied to network equipment, including:

[0049] A mainboard 1, an accommodating cavity 10 is provided at the edge of the mainboard 1, and a first solder pad 11 is formed near the accommodating cavity 10. The accommodating cavity 10 can communicate with the upper surface and the lower surface of the mainboard 1, or can be a groove formed by a depth control technology, and can be set according to actual needs. Other devices can also be set on the mainboard 1, such as a processor, a connector, a controller for controlling an indicator light, etc.;

[0050] A carrier board 2, on which a second pad 20, a third pad 21 and a connection line 22 connecting the second pad 20 and the third pad 21 are formed, wherein the number of the first pad 11, the second pad 20 and the third pad 21 is set according to actual needs;

[0051] The indicator light 3 is electrically connected to the second pad 20. The indicator light 3 can be electrically connected to the second pad 20 by bonding, plugging or welding. The indicator light 3 can be a single-color light-emitting diode, a two-color light-emitting diode, etc. The indicator light 3 has at least two pins, each of which is connected to a different second pad 20. The indicator light 3 can form a loop by being electrically connected to at least two second pads 20, and can be lit up by the control of the controller to show the working status of the corresponding device. For example, the single-color light-emitting diode has two pins, and the two-color light-emitting diode has three pins;

[0052] Among them, the carrier board 2 at least partially covers the accommodating cavity 10, the indicator light 3 and the second solder pad 20 are accommodated in the accommodating cavity 10, the first solder pad 11 is electrically connected to the third solder pad 21, and the first solder pad 11 is connected to the indicator light control module (not shown) provided on the main board 1, and the indicator light control module may include the above-mentioned controller and indicator light peripheral devices such as a resistor provided between the controller and the indicator light 3.

[0053] In the network device, a receiving cavity 10 is formed on the edge of the mainboard 1 by grooving or cutting, and an indicator light 3 is arranged on one side surface of the carrier board 2. Figure 2 The figure shows the surfaces of the main board 1 and the carrier board 2 where the welding is performed, wherein the dotted lines indicate the corresponding welding positions. When welding the main board 1 and the carrier board 2, the surface of the carrier board 2 where the indicator light 3 is provided is pressed toward the surface of the main board 1 where the accommodating cavity 10 is provided, and the third soldering pad 21 and the first soldering pad 11 are welded together, so that the indicator light 3 on the carrier board 2 can be extended into the accommodating cavity 10, reducing the space occupied by the indicator light 3 on the main board 1, so that the interface housing can be more closely attached to the main board 1, and a high-density setting of the interface is achieved.

[0054] Depending on the needs, the interface shell can be used to plug in the connector of the network cable, or it can be used to plug in the optical module. Of course, the interface shell can also accommodate other devices that are electrically connected to the network connector and optical module, such as terminals or gold fingers, etc., which can be set according to actual needs without any restrictions.

[0055] In order to further save the space occupied by the peripheral components of the indicator lights on the mainboard 1 and the circuit space inside the mainboard 1, the circuit board assembly 100, such as Figure 3 As shown, it also includes:

[0056] The indicator light peripheral device 4 is disposed on the carrier board 2 and accommodated in the accommodation cavity 10 . The indicator light peripheral device 4 is connected in series to the connecting line 22 on the carrier board 2 .

[0057] The indicator light peripheral device 4 may include a resistor, etc. When the indicator light peripheral device 4 is set on the carrier board 2, a controller can be set on the main board 1 to connect the controller and the first pad 11. There is no need to set structures such as ground vias around devices such as welding resistors, thereby saving the space on the main board 1 required for setting the indicator light peripheral device 4, and further improving the high density of the circuit board components.

[0058] Optional, such as Figure 1 As shown, a shielding portion 12 is provided on a side of the accommodating cavity 10 away from the carrier board 2 , and the shielding portion 12 is formed by the main board 1 .

[0059] Since the indicator light 3 has a certain scattering when emitting light, if the size of the accommodating cavity 10 is too large, the indicator light 3 may not be clearly displayed on the front panel side of the network device, thereby affecting the staff's judgment on the working status of the interface.

[0060] In order to improve the light emission effect of the indicator light 3, the accommodating cavity 10 can be formed on one side surface of the mainboard 1, and does not penetrate the mainboard 1. For example, a groove can be formed on the edge of the mainboard 1 by a process such as controlled depth milling, so that the accommodating cavity 10 has a bottom wall 10A. In this way, the light emission of the indicator light 3 can be wrapped by the carrier board 2 and the bottom wall 10A of the accommodating cavity 10, so as to better propagate to the front panel side of the network device, thereby improving the display effect of the indicator light on the front panel side of the network device.

[0061] Since the carrier board 2 and the main board 1 are separately provided, the fixation between the two is mainly achieved by welding between the first solder pad 11 and the third solder pad 21 , which may cause problems such as false connection or separation due to vibration of the network device.

[0062] To avoid this problem, optional Figure 4 As shown, the first pad 11 and the third pad 21 are L-shaped.

[0063] The first pad 11 and the third pad 21 are arranged in an L shape. On one side of the carrier 2, the second pad 20 can be formed in the middle, and the L-shaped third pad 21 corresponds to the second pad 20 from both sides.

[0064] When the first pad 11 and the third pad 21 are welded, the L-shaped arrangement can enlarge the welding area compared with other forms, so that the welding between the first pad 11 and the third pad 21 is more firm.

[0065] Optional, such as Figure 5 , 6 As shown, two of the second pads 20 and two of the third pads 21 form a pad group 5, or three of the second pads 20 and three of the third pads 21 form a pad group 5;

[0066] Each pad group 5 is provided with an indicator light 3;

[0067] At least two pad groups 5 are arranged on one carrier board 2 .

[0068] When a single-color light-emitting diode is used as the indicator light 3, Figure 5 As shown, the positive electrode and the negative electrode need to be connected to a second pad 20 respectively, so two corresponding third pads 21 also need to be provided, and these pads form a pad group 5.

[0069] When the two-color light emitting diode is used as the indicator light 3, Figure 6 As shown, one negative electrode and two positive electrodes need to be connected to one second pad 20 respectively, so three corresponding third pads 21 also need to be provided, and these pads form a pad group 5 .

[0070] On a carrier board 2, a plurality of pad groups 5 can be respectively arranged, and each pad group 5 is electrically connected to an indicator light 3. In this way, a accommodating cavity 10 for accommodating a plurality of indicator lights 3 can be prepared on the main board 1 at one time, and the carrier board 2 having a plurality of pad groups 5 and indicator lights 3 can be welded to the main board 1, thereby achieving the effect of installing a plurality of indicator lights 3 at one time, thereby improving the preparation efficiency of the circuit board assembly in which the main board and the carrier board are separately arranged.

[0071] Optional, such as Figure 7 As shown, at least two accommodating cavities 10 are formed on the main board 1 , and two adjacent accommodating cavities 10 are respectively formed on different surfaces of the main board 1 , and the two adjacent accommodating cavities 10 are staggered.

[0072] In the network device, a large number of interfaces are arranged on the front panel, and as the interfaces become more dense, the interfaces will be respectively provided on the upper surface 1A and the lower surface 1B of the mainboard 1 .

[0073] Furthermore, two adjacent accommodating cavities 10 need to be staggered to avoid damage to the mainboard 1 when the two accommodating cavities 10 are processed at the same position of the upper surface 1A and the lower surface 1B.

[0074] Optionally, the circuit board assembly 100, such as Figure 7 As shown, it also includes:

[0075] The interface housing 6 is disposed on the edge of the mainboard 1 , and the mainboard 1 and the interface housing 6 clamp the carrier board 2 .

[0076] Under the condition that the clearance is met, the interface housing 6 , the carrier board 2 and the main board 1 are stacked and arranged, and the distance between the interface housing 6 and the main board 1 can meet the arrangement of the carrier board 2 .

[0077] In order to further improve the display effect of indicator light 3 on the front panel of the network device, Figure 8 , 9 As shown, the carrier plate 2 partially covers the accommodating cavity 10;

[0078] The circuit board assembly 100 further includes:

[0079] A light guide column 7, the light guide column 7 is fixed to the bottom of one side of the interface housing 6 facing the main board 1, and is accommodated in the accommodation cavity 10;

[0080] The tail of the light guide column 7 is close to the indicator light 3 , and the head of the light guide column 7 extends to the edge of the main board 1 .

[0081] By setting the light guide column 7, the light output of the indicator light 3 can be guided to the front panel, and the head of the light guide column 7 can be extended to the edge of the mainboard 1 or protruded outside the front panel of the network device by controlling the length of the light guide column 7, so as to further enhance the display effect of the working status of the interface.

[0082] from Fig. 9 It can be seen that the size of the accommodating cavity 10 is larger than that of the carrier board 2 in the length direction, so that the front of the accommodating cavity 10 can be exposed toward the interface housing 6, and the light guide column 7 fixed at the lower part of the interface housing 6 can extend into the accommodating cavity 10 and be close to the indicator light 3 to realize the light output of the indicator light 3. Fig. 9 In the figure, the arrows can show the pattern of the light output from the indicator light 3 along the light guide column 7.

[0083] Correspondingly, the present application also provides a method for preparing a circuit board assembly, such as Fig.10 As shown, the circuit board assembly used to prepare the above-mentioned circuit board assembly includes:

[0084] S100. Prepare the mainboard.

[0085] Wherein, a first solder pad is formed on the main board.

[0086] S101, opening a receiving cavity at the edge of the mainboard.

[0087] The first solder pad is located at an edge of the mainboard close to the accommodating cavity. Specifically, the accommodating cavity can be prepared by controlled depth milling.

[0088] S102, preparing a carrier plate.

[0089] Wherein, the indicator light is electrically connected between the second pad and the third pad formed on the carrier.

[0090] S103 , welding the first soldering pad and the third soldering pad so that the indicator light disposed on the carrier board is accommodated in the accommodation cavity.

[0091] Optionally, after step S103, welding the first pad and the third pad, the method further includes:

[0092] S04. Welding an interface housing onto the mainboard.

[0093] A light guide column is fixed to the bottom of one side of the interface housing facing the main board, the interface housing covers the main board and the carrier board, and the light guide column is accommodated in the accommodating cavity.

[0094] The technical solutions provided by the embodiments of this specification may have the following beneficial effects:

[0095] In the embodiments of the present specification, in a network device, a receiving cavity is opened on a main board, and a carrier board provided with an indicator light is electrically connected to the main board, so that the indicator light on the carrier board is accommodated in the receiving cavity, thereby avoiding the situation where the indicator light is provided on the main board and occupies a large height dimension. The interface housing provided in the network device can be provided in a high-density manner, thereby improving the utilization efficiency of the space on the circuit board in the network device.

[0096] The above is a description of a specific embodiment of the specification. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the embodiments and still achieve the desired results. In addition, the processes depicted in the drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0097] Those skilled in the art will readily appreciate other embodiments of the specification after considering the specification and practicing the invention claimed herein. The specification is intended to cover any variations, uses or adaptations of the specification that follow the general principles of the specification and include common knowledge or customary techniques in the art that are not claimed in the specification. The specification and examples are to be considered exemplary only, and the true scope and spirit of the specification are indicated by the following claims.

[0098] It should be understood that the present description is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present description is limited only by the appended claims.

[0099] The above description is only a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of this specification should be included in the scope of protection of this specification.

Claims

1. A circuit board assembly, characterized in that: Applied to network equipment, including: A mainboard, wherein a receiving cavity is provided at an edge of the mainboard, and a first solder pad is formed at a position close to the receiving cavity; A carrier board, on which a second pad, a third pad, and a connection line connecting the second pad and the third pad are formed; an indicator light, electrically connected to the second pad; Among them, the carrier board at least partially covers the accommodating cavity, the indicator light and the second solder pad are accommodated in the accommodating cavity, the first solder pad is electrically connected to the third solder pad, and the first solder pad is connected to the indicator light control module set on the mainboard.

2. The circuit board assembly according to claim 1, characterized in that: Also includes: The indicator light peripheral device is arranged on the carrier board and accommodated in the accommodation cavity. The indicator light peripheral device is connected in series to the connecting line on the carrier board.

3. The circuit board assembly according to claim 1, characterized in that: A shielding portion is disposed on a side of the accommodating cavity away from the carrier board, and the shielding portion is formed by the main board.

4. The circuit board assembly according to claim 1, characterized in that: The first pad and the third pad are L-shaped.

5. The circuit board assembly according to claim 1, characterized in that: Two of the second pads and two of the third pads form a pad group, or three of the second pads and three of the third pads form a pad group; Each pad group corresponds to an indicator light; At least two pad groups are arranged on one carrier board.

6. The circuit board assembly according to claim 1, characterized in that: At least two accommodating cavities are formed on the main board, and two adjacent accommodating cavities are respectively formed on different surfaces of the main board, and the two adjacent accommodating cavities are staggered.

7. The circuit board assembly according to any one of claims 1 to 6, characterized in that: Also includes: The interface housing is arranged at the edge of the main board, and the main board and the interface housing clamp the carrier board.

8. The circuit board assembly according to claim 7, characterized in that: The carrier plate partially covers the accommodating cavity; The circuit board assembly further includes: A light guide column, the light guide column is fixed to the bottom of one side of the interface housing facing the main board and is accommodated in the accommodation cavity; The tail of the light guide column is close to the indicator light, and the head of the light guide column extends to the edge of the mainboard.

9. A method for preparing a circuit board assembly, characterized in that: include: preparing a main board, wherein a first solder pad is formed on the main board; A receiving cavity is provided at the edge of the mainboard, wherein the first solder pad is located at the edge of the mainboard close to the receiving cavity; preparing a carrier board, wherein an indicator light is electrically connected between a second pad and a third pad formed on the carrier board; The first soldering pad and the third soldering pad are welded so that the indicator light arranged on the carrier board is accommodated in the accommodation cavity.

10. The method according to claim 9, characterized in that After welding the first pad and the third pad, the method further includes: An interface shell is welded on the main board, wherein a light guide column is fixed to the bottom of one side of the interface shell facing the main board, the interface shell covers the main board and the carrier board, and the light guide column is accommodated in the accommodating cavity.

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