Vacuum chamber and film forming apparatus

Abstract

A vacuum chamber is characterized by being provided with a chamber capable of decompressing the inside, a reinforcing member (125) provided along the wall surface of the chamber, an attachment member (127) for attaching the reinforcing member (125) to the wall surface, and a dust scattering prevention member (129) provided at the boundary between the reinforcing member (125) and the chamber.

Description

Technical Field

[0001] The invention relates to a vacuum chamber and a film forming device. Background Art

[0002] Among film forming apparatuses, there are known apparatuses having a plurality of chambers configured to reduce the pressure inside. For example, an apparatus for manufacturing electronic devices such as an organic EL display apparatus has a heating chamber for pre-processing a substrate, a film forming chamber for forming a film on the substrate, and the like.

[0003] Since the interior of the above-mentioned chamber is switched between a vacuum state and an atmospheric pressure state for use, the chamber is repeatedly deformed due to the pressure difference between the vacuum state and the atmospheric pressure state. Therefore, in order to improve the strength of the chamber, reinforcing components such as ribs are sometimes provided on the wall surface of the chamber. In Patent Document 1, in order to improve the strength of a chamber that can switch the interior between a vacuum state and an atmospheric pressure state, a structure is disclosed in which a reinforcing component is mounted on the outer wall surface of the chamber by bolts.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: International Publication No. 2009 / 078351 Summary of the invention

[0007] Problems to be solved by the invention

[0008] However, even if the chamber is provided with a reinforcing component, it is very difficult to completely suppress the deformation of the chamber when the film forming device is in operation, and the chamber and the reinforcing component will deform a lot. At this time, the reinforcing component and the chamber rub against each other and grind the two components, which sometimes produces fine-grained grinding powder. If the grinding powder is scattered by the wind, the grinding powder may enter the chamber and adhere to the substrate in the chamber, causing manufacturing defects.

[0009] Therefore, an object of the present invention is to prevent scattering of grinding powder in a vacuum chamber configured to be able to reduce the pressure inside and in which a reinforcing member is provided on a wall surface of the chamber.

[0010] Means for solving problems

[0011] The vacuum chamber of the present invention is characterized by comprising:

[0012] a chamber capable of depressurizing the interior of the chamber;

[0013] A reinforcing component, wherein the reinforcing component is arranged along a wall surface of the chamber;

[0014] A mounting member for mounting the reinforcing member on the wall surface; and

[0015] A dust scattering prevention member is provided at a boundary portion between the reinforcing member and the chamber.

[0016] Effects of the Invention

[0017] According to the present invention, in a vacuum chamber configured to be able to reduce the pressure inside and in which a reinforcing member is provided on the wall surface of the chamber, it is possible to prevent scattering of grinding powder. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram showing a part of the film forming apparatus of the embodiment.

[0019] Figure 2 is a schematic diagram of a heating chamber of an embodiment.

[0020] Figure 3 It is a schematic cross-sectional view showing the mounting structure of the reinforcing member of the comparative example and the embodiment.

[0021] Figure 4 It is a schematic cross-sectional view showing a mounting structure of a reinforcement member according to a modified example.

[0022] Figure 5 This is a schematic structural diagram of a film forming chamber according to an embodiment.

[0023] Figure 6 It is an explanatory diagram of the organic EL display device of the embodiment. DETAILED DESCRIPTION

[0024] Hereinafter, with reference to the accompanying drawings, the mode for implementing the present invention will be described in detail based on the embodiments. However, the size, material, shape, relative arrangement, etc. of the components described in the embodiments should be appropriately changed according to the structure and various conditions of the device to which the present invention is applied. That is, the scope of the present invention is not limited to the following embodiments.

[0025] The present invention relates to a vacuum chamber configured to be able to reduce the pressure inside, and a film-forming device equipped with the vacuum chamber. The present invention can be applied, for example, to a device for depositing various materials on the surface of a substrate to form a film. As the material of the substrate, any material such as glass, a film of a polymer material, a silicon wafer, a metal, etc. can be selected. The substrate can also be, for example, a substrate on which a film of polyimide or the like is deposited on a glass substrate. In addition, as the evaporation material, any material such as an organic material, a metallic material (metal, metal oxide, etc.) can also be selected. Specifically, the technology of the present invention can be applied to manufacturing devices for organic electronic devices (for example, organic light-emitting elements, thin-film solar cells), optical components, etc. In the following, the case where the present invention is applied to a manufacturing device for electronic devices is explained as an example, but the present invention is not limited to this and can be applied to various vacuum chambers and film-forming devices.

[0026] (Example)

[0027] <Structure of film forming apparatus>

[0028] Figure 1 1 is a schematic diagram schematically showing a part of the structure of a film forming apparatus 1 according to an embodiment of the present invention. The film forming apparatus 1 includes: a storage chamber 11 for storing a substrate 3 to be subjected to film forming processing, a heating chamber (feeding chamber) 12 for heating the substrate 3, and a film forming chamber 13 for forming a film on a processed surface of the substrate 3. The heating chamber 12 and the film forming chamber 13 are vacuum chambers configured to be able to reduce the pressure inside.

[0029] The substrate 3 is held on the substrate carrier 5 with the processed surface of the substrate 3 facing the vertical direction, and is transported integrally with the substrate carrier 5 from the storage chamber 11 to the heating chamber 12 and from the heating chamber 12 to the film forming chamber 13 by a transport member such as a transport robot.

[0030] In the storage chamber 11, a plurality of unprocessed substrates 3 are stored in a state of being held on a substrate carrier 5. The substrate carrier 5 is a mask-integrated carrier that holds the substrate 3 in a state where the processed surface of the substrate 3 is exposed. The substrate carrier 5 may be a structure capable of holding a plurality of substrates 3 or a structure capable of holding only one substrate 3.

[0031] The heating chamber 12 is provided with a heating member such as a heater, and a heating treatment is performed before the film forming process for the purpose of improving the adhesion of the thin film to the substrate 3. In addition, the heating chamber 12 is provided with an exhaust mechanism, which is configured to be able to adjust the pressure in the chamber. Since the interior of the receiving chamber 11 is in an atmospheric pressure state, when the substrate 3 is transported from the receiving chamber 11 to the heating chamber 12, the interior of the heating chamber 12 becomes an atmospheric pressure state corresponding to the receiving chamber 11.

[0032] In the film forming chamber (evaporation device) 13, the evaporation material stored in the evaporation source is heated by the heater to evaporate and is evaporated onto the substrate. The substrate 3 transported from the heating chamber 12 to the film forming chamber 13 is sent out from the film forming chamber 13 after the film forming process is performed. Since the film forming process is performed in a vacuum state inside the film forming chamber 13, when the substrate 3 is transported from the heating chamber 12 to the film forming chamber 13, the interiors of the two chambers are in a vacuum state in advance. It should be noted that in order to be able to form a thin film using different materials, a film forming device generally has a structure with multiple film forming chambers.

[0033] As described above, when the film forming apparatus 1 is in operation, the storage chamber 11 is basically in an atmospheric pressure state, and the film forming chamber 13 is in a vacuum state. On the other hand, the heating chamber 12 is in an atmospheric pressure state when the substrate 3 is sent from the storage chamber 11, and is in a vacuum state when the substrate 3 is sent to the film forming chamber 13. In this way, since the heating chamber 12 frequently repeats the atmospheric pressure state and the vacuum state, the load caused by the change of the internal pressure state acts on the heating chamber 12 more frequently than other chambers.

[0034] In this embodiment, refer to Figure 1 , the structure of the manufacturing device of the electronic device is described, but the structure to which the present invention is applied is not limited thereto, and may also be a structure having other types of devices or chambers and having changed porosity and configuration of these devices or chambers. For example, the manufacturing device of the electronic device may be a group type instead of an inline type. In addition, the film forming chamber of the present invention is configured to form a thin film (material film) of a desired pattern by vacuum evaporation, but may also be configured to perform film forming processing by a sputtering device or a CVD (Chemical Vapor Deposition) device.

[0035] <Structure of the heating chamber>

[0036] Reference Figure 2 (a) and (b) describe the detailed structure of the heating chamber 12 of this embodiment. Figure 2 (a) is a schematic diagram showing the appearance of the heating chamber 12 of the present embodiment, and shows a state where the upper cover 123 is closed. Figure 2 (b) is a schematic diagram showing the appearance of the heating chamber 12 of the present embodiment, and shows a state where the upper cover 123 is opened.

[0037] The heating chamber 12 includes a main body (chamber body) 121, an upper cover 123 that can be opened and closed relative to the main body 121, and a rib member 125 provided along the upper surface of the upper cover 123. That is, the heating chamber 12 is a structure in which the rib member 125 is provided as a reinforcing member in a chamber formed by the main body 121 and the upper cover 123. In addition, a gate valve 31 for connecting the heating chamber 12 to other chambers is provided between the heating chamber 12 and the storage chamber 11 and between the heating chamber 12 and the film forming chamber 13. In addition, the heating chamber 12 is supported from below by a base 33.

[0038] The gate valve 31 is composed of a disk (valve core) and a valve body (valve body). The gate valve 31 is arranged around the communication port 121a of the main body 121, and opens and closes the passage for the substrate 3 to pass through by the movement of the disk. In the state where the passage is open, the substrate 3 is sent in and out of the interior of the main body 121 through the communication port (entrance and exit) 121a of the heating chamber 12 by the conveying member. The heating chamber 12 is configured so that when the passage is closed, the pressure in the chamber can be adjusted by an exhaust mechanism (not shown) to switch between a vacuum state and an atmospheric pressure state.

[0039] The main body 121 has an opening 121b on the upper side, and the operator can reach in through the opening 121b to perform maintenance on the inside of the heating chamber 12 as needed. In addition, the upper cover 123 is provided to be openable and closable relative to the main body 121, and the opening 121b is blocked by the upper cover 123 during the heating process of the substrate 3. When the upper cover 123 is closed, the O-ring provided in a manner surrounding the opening 121b is flattened, thereby maintaining the airtightness of the heating chamber 12. In this embodiment, the upper cover 123 is formed of a relatively lightweight aluminum alloy in consideration of operability during opening and closing.

[0040] As described above, since the heating chamber 12 repeatedly switches between the atmospheric pressure state and the vacuum state, the upper cover 123 is deformed due to the change in the internal pressure state. Therefore, in the heating chamber 12, a rib member 125 is provided as a reinforcing member for improving the strength of the upper cover 123. The rib member 125 is provided along the mounting surface 123a corresponding to the upper surface of the upper cover 123 when the upper cover 123 is closed, and is located outside the heating chamber 12. When viewed from a direction perpendicular to the mounting surface 123a of the upper cover 123, the rib member 125 extends from one end of the upper cover 123 to the other end in a manner that two longitudinal ribs and two transverse ribs are respectively crossed.

[0041] Considering the strength, the rib member 125 of the present embodiment is formed of stainless steel such as SUS. In this way, when the upper cover portion 123 and the rib member 125 are formed of different materials, it is difficult to connect the two members by welding. Therefore, in the present embodiment, a plurality of bolts 127 are provided as mounting members for mounting the rib member 125 on the upper cover portion 123. The bolts 127 are inserted through the rib member 125 and the upper cover portion 123 to mount the rib member 125 on the upper cover portion 123. It should be noted that the mounting member for mounting the rib member 125 on the upper cover portion 123 is not limited to the above-mentioned threaded member, and various mounting members can be used.

[0042] The upper cover 123 is opened and closed relative to the main body 121 by rotating around a rotation axis extending parallel to the mounting surface 123a. In the present embodiment, the upper cover 123 is opened and closed by a cylinder 35 having a main body 35a and a movable part 35b. The cylinder 35 is a cylinder mechanism that is extended and retracted by the movable part 35b moving straight relative to the main body 35a to change the stroke, and the movable part 35b moves straight in a substantially vertical direction.

[0043] The rib member 125 has an extension portion 125a extending in a direction orthogonal to the rotation axis of the upper cover 123 on the outer side relative to the upper cover 123 when viewed from a direction perpendicular to the mounting surface 123a. The extension portion 125a is connected to the movable portion 35b, and the upper cover 123 and the rib member 125 rotate integrally by the movement of the movable portion 35b of the cylinder 35. By adopting such a structure, the reinforcing member also functions as a component of the opening and closing mechanism of the upper cover 123. In addition, in order to assume the role of the opening and closing mechanism of the upper cover 123, the rib member 125 is formed of a material with a higher strength than the upper cover 123 so that the extension portion 125a does not deform. It should be noted that in order to improve the safety of the operator, it can also be configured to further provide a stopper such as a pillar to prevent the upper cover 123 from being accidentally closed.

[0044] <Rib member mounting structure>

[0045] Reference Figure 3 (a) and (b) describe in detail the mounting structure of the rib member 125 with respect to the upper cover portion 123 . Figure 3 (a) is a schematic cross-sectional view showing a mounting structure of a rib member 125 according to a comparative example, Figure 3 (b) is a schematic cross-sectional view showing the mounting structure of the rib member 125 according to the present embodiment.

[0046] As described above, the heating chamber 12 repeatedly changes its internal pressure state, so the entire chamber including the upper cover 123 repeatedly deforms. Figure 3As in the comparative example shown in (a), in a structure in which the rib member 125 is in direct contact with the upper cover 123, when the chamber is deformed, the rib member 125 and the upper cover 123 are in sliding contact, and the two members are ground, thereby sometimes generating fine-grained grinding powder 51. When the upper cover 123 is opened and closed, if the grinding powder 51 enters the interior of the heating chamber 12, the grinding powder 51 may adhere to the substrate and cause manufacturing defects. Therefore, in order to prevent the generation and scattering of the grinding powder 51, the inventors of the present application have conceived of providing a dust scattering prevention member at the boundary between the rib member 125 and the upper cover 123.

[0047] like Figure 3 As shown in (b), in this embodiment, grease 129 is applied as a lubricant between the upper cover 123 and the rib member 125. By interposing the grease 129 between the upper cover 123 and the rib member 125, the friction coefficient between the upper cover 123 and the rib member 125 is reduced, and the generation of grinding powder 51 when the two members are in sliding contact can be suppressed. In addition, even if grinding powder 51 is generated, since the grinding powder 51 is brought into the grease 129, it is also possible to prevent the grinding powder 51 from scattering outside.

[0048] As described above, according to this embodiment, even when reinforcing members such as ribs are provided on the wall surface of the chamber, the generation of grinding powder can be suppressed and scattering can be prevented. Furthermore, the generation of problems such as substrate manufacturing defects and device contamination caused by grinding powder can be suppressed.

[0049] (Variation)

[0050] Next, refer to Figure 4 (a) and (b) illustrate modified examples of the present invention. Figure 4 (a) is a schematic cross-sectional view showing the mounting structure of the rib member 125 of Modification 1. Modification 1 is a structure in which a belt member 131 is further added as a dust scattering prevention member relative to the above-mentioned embodiment. The belt member 131 is provided in a manner that covers the entire boundary portion between the rib member 125 and the upper cover portion 123. By adopting such a structure, it is possible to prevent the grinding powder 51 from flying out of the grease 129 and the grease 129 itself from scattering. That is, the dust scattering prevention member is not limited to one type, and a plurality of types may be combined and provided in the vacuum chamber.

[0051] Figure 4(b) is a schematic cross-sectional view showing the mounting structure of the rib member 125 of Modification 2. Modification 2 is a structure in which a liquid seal 133 is provided as a dust scattering prevention member instead of the grease 129 relative to the above-mentioned embodiment. The liquid seal 133 is a silicone sealant provided in a manner that covers the entire boundary portion between the rib member 125 and the upper cover portion 123. In Modification 2, since there is no lubricant or the like between the rib member 125 and the upper cover portion 123, the generation of the grinding powder 51 cannot be suppressed. However, since the entire boundary portion is covered by the liquid seal 133, the grinding powder 51 does not scatter outward, but is sealed between the liquid seal 133, the rib member 125, and the upper cover portion 123. Furthermore, according to Modification 2, the scattering of the grinding powder 51 can be prevented without the lubricant being interposed between the rib member 125 and the upper cover portion 123.

[0052] It should be noted that the structure of the present invention is not limited to the above structure, and various changes can be made within the scope of not losing the sameness as the invention embodied in the above embodiment. For example, the vacuum chamber may be a structure in which only the belt member 131 is provided without the grease 129, or a structure in which the liquid seal 133 is provided on the basis of the grease 129.

[0053] In addition, the above-mentioned embodiment is configured to provide a reinforcing member on the surface of the upper cover of the chamber, but the present invention can also be applied to a structure in which a reinforcing member is provided on the outer wall surface or the inner wall surface of the main body of the chamber. In addition, in the above-mentioned embodiment, an example of applying the present invention to a heating chamber is described, but the present invention can also be applied to other vacuum chambers constituting a film forming device. For example, a film forming chamber also repeatedly operates and stops the film forming device, so that the internal pressure state changes. Therefore, by applying the present invention to the film forming chamber, it is possible to prevent the scattering of grinding powder.

[0054] <Film Forming Room>

[0055] Reference Figure 5 , the film forming process in the film forming chamber 13 is described in more detail. An evaporation source 7 as a film forming source is provided in the film forming chamber 13. They are supported in a state of being positioned in the film forming chamber 13 so that the processed surface of the substrate 3 held on the substrate carrier 5 faces downward. Thus, film formation is performed on the substrate 3 held on the substrate carrier 5.

[0056] In this embodiment, film formation (evaporation) is performed by vacuum evaporation. Specifically, the film-forming material evaporates or sublimates from the evaporation source 7, and the film-forming material is evaporated onto the substrate 3 to form a thin film on the substrate 3. As the evaporation source 7 is a well-known technology, its detailed description is omitted. For example, the evaporation source 7 can be composed of a container such as a crucible for accommodating the film-forming material and a heating device for heating the container. It should be noted that the film-forming source is not limited to the evaporation source 7, and the film-forming source can also be a sputtering cathode for forming a film by sputtering.

[0057] <Method for manufacturing electronic device>

[0058] Next, an example of a method for manufacturing an electronic device using the film-forming apparatus of this embodiment will be described. Hereinafter, as an example of an electronic device, the structure of an organic EL display device will be described, and a method for manufacturing the organic EL display device will be described.

[0059] First, the manufactured organic EL display device will be described. Figure 6 (a) is an overall view of the organic EL display device 700. Figure 6 (b) shows the cross-sectional structure of a pixel.

[0060] like Figure 6 As shown in (a), in the display area 701 of the organic EL display device 700, a plurality of pixels 702 having a plurality of light-emitting elements are arranged in a matrix. Each light-emitting element has a structure having an organic layer sandwiched by a pair of electrodes, and the details will be described later. It should be noted that the pixel mentioned here refers to the smallest unit that can display the desired color in the display area 701. In the case of the organic EL display device of this embodiment, the pixel 702 is formed by a combination of a first light-emitting element 702R, a second light-emitting element 702G, and a third light-emitting element 702B that show different light emission from each other. The pixel 702 is mostly composed of a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but it can also be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, as long as it is at least one color, and there is no special limitation.

[0061] Figure 6 (b) Yes Figure 6(a) is a partial cross-sectional schematic diagram at the BB line. The pixel 702 is composed of a plurality of light-emitting elements, each of which has a first electrode (anode) 704, a hole transport layer 705, any one of the light-emitting layers 706R, 706G, and 706B, an electron transport layer 707, and a second electrode (cathode) 708 on a substrate 703. Among them, the hole transport layer 705, the light-emitting layers 706R, 706G, 706B, and the electron transport layer 707 are equivalent to organic layers. In addition, in this embodiment, the light-emitting layer 706R is an organic EL layer that emits red light, the light-emitting layer 706G is an organic EL layer that emits green light, and the light-emitting layer 706B is an organic EL layer that emits blue light. The light-emitting layers 706R, 706G, and 706B are formed into patterns corresponding to light-emitting elements (sometimes also referred to as organic EL elements) that emit red light, green light, and blue light, respectively.

[0062] In addition, the first electrode 704 is formed separately for each light-emitting element. The hole transport layer 705, the electron transport layer 707, and the second electrode 708 can be formed in common for a plurality of light-emitting elements 702R, 702G, and 702B, or can be formed for each light-emitting element. It should be noted that in order to prevent the first electrode 704 and the second electrode 708 from short-circuiting due to foreign matter, an insulating layer 709 is provided between the first electrode 704. In addition, since the organic EL layer is degraded by moisture and oxygen, a protective layer 710 is provided to protect the organic EL element from moisture and oxygen corrosion.

[0063] exist Figure 6 In (b), the hole transport layer 705 and the electron transport layer 707 are shown as a single layer, but they may be formed of multiple layers including a hole blocking layer and an electron blocking layer depending on the structure of the organic EL display element. In addition, a hole injection layer having an energy band structure that allows holes to be smoothly injected from the first electrode 704 to the hole transport layer 705 may be formed between the first electrode 704 and the hole transport layer 705. Similarly, an electron injection layer may be formed between the second electrode 708 and the electron transport layer 707.

[0064] Next, an example of a method for manufacturing an organic EL display device will be described in detail.

[0065] First, a substrate (mother glass) 703 on which a circuit (not shown) for driving the organic EL display device and a first electrode 704 are formed is prepared.

[0066] An acrylic resin is formed by spin coating on the substrate 703 having the first electrode 704 formed thereon, and the acrylic resin is patterned by photolithography to form an opening in the portion having the first electrode 704 formed thereon to form an insulating layer 709. The opening corresponds to a light emitting region where the light emitting element actually emits light.

[0067] The substrate 703 patterned with the insulating layer 709 is placed on a substrate carrier provided with an adhesive member. The substrate 703 is held by the adhesive member. The substrate 703 is sent to the first organic material film forming device, and after being turned over, a hole transport layer 705 is formed as a common layer on the first electrode 704 in the display area. The hole transport layer 705 is formed by vacuum evaporation. In fact, the hole transport layer 705 is formed to a larger size than the display area 701, so a high-definition mask is not required.

[0068] Next, the substrate 703 formed with the hole transport layer 705 is introduced into a second organic material film forming apparatus. The substrate and the mask are aligned, the substrate is placed on the mask, and a red light emitting layer 706R is formed on the portion of the substrate 703 where the element emitting red light is arranged.

[0069] Similar to the film formation of the light-emitting layer 706R, the light-emitting layer 706G emitting green light is formed by the third organic material film-forming device, and the light-emitting layer 706B emitting blue light is further formed by the fourth organic material film-forming device. After the film formation of the light-emitting layers 706R, 706G, and 706B is completed, the electron transport layer 707 is formed on the entire display area 701 by the fifth film-forming device. The electron transport layer 707 is formed as a common layer on the light-emitting layers 706R, 706G, and 706B of the three colors.

[0070] The substrate on which the electron transport layer 707 has been formed is moved in a metallic vapor deposition material film forming apparatus to form a second electrode 708 .

[0071] After that, the device is moved to a plasma CVD device to form a protective layer 710, completing the film forming process on the substrate 703. After flipping, the substrate 703 is separated from the substrate carrier by peeling the adhesive member from the substrate 703. After that, the organic EL display device 700 is completed after cutting.

[0072] If the substrate 703 having the insulating layer 709 patterned thereon is exposed to an atmosphere containing moisture and oxygen from the time when it is introduced into the film forming apparatus until the film forming of the protective layer 710 is completed, the light-emitting layer composed of the organic EL material may be degraded by moisture and oxygen. Therefore, in this embodiment, the substrate is introduced and removed between the film forming apparatuses in a vacuum atmosphere or an inert gas atmosphere.

[0073] Description of Reference Numerals

[0074] 12 Heating chamber (vacuum chamber), 125 Rib member (reinforcement member), 127 Bolt (mounting member), 129 Grease (dust dispersion prevention member)

Claims

1. A vacuum chamber, characterized in that: The vacuum chamber comprises: a chamber capable of depressurizing the interior of the chamber; A reinforcing component, wherein the reinforcing component is arranged along a wall surface of the chamber; a mounting member, the mounting member mounting the reinforcing member on the wall surface; as well as A dust scattering prevention member is provided at a boundary portion between the reinforcing member and the chamber.

2. The vacuum chamber according to claim 1, wherein: The reinforcing member is a rib member extending along the wall surface.

3. The vacuum chamber according to claim 2, wherein: The attachment member is a screw member inserted through the rib member and the interior of the wall surface.

4. The vacuum chamber according to claim 1, wherein: The dust scattering prevention member is a lubricant interposed between the reinforcing member and the cavity.

5. The vacuum chamber according to claim 4, wherein: The lubricant is grease.

6. The vacuum chamber according to claim 1, wherein: The dust scattering prevention member is a liquid gasket covering a boundary portion between the reinforcing member and the chamber.

7. The vacuum chamber according to claim 1, wherein: The dust scattering prevention member is a belt member covering a boundary portion between the reinforcing member and the chamber.

8. The vacuum chamber according to claim 1, wherein: The chamber includes a cover portion that blocks an opening of the chamber body and is configured to be openable and closable relative to the chamber body. The wall surface is a surface of the cover portion.

9. The vacuum chamber according to claim 8, wherein: The vacuum chamber further comprises a cylinder mechanism connected to the cover. The cover portion is rotated relative to the chamber body to be opened and closed by a change in the stroke of the cylinder mechanism.

10. The vacuum chamber according to claim 9, wherein: The reinforcing member has an extension portion extending outward from the chamber when viewed from a direction perpendicular to the wall surface on which the reinforcing member is mounted, The cylinder mechanism is connected to the cover portion via the extended portion of the reinforcement member.

11. A vacuum chamber, characterized in that: The vacuum chamber comprises: a chamber capable of depressurizing the interior of the chamber; A reinforcing component, wherein the reinforcing component is arranged along a wall surface of the chamber; A mounting member for mounting the reinforcing member on the wall surface; and A lubricant is applied to a contact portion between the reinforcing member and the cavity.

12. The vacuum chamber according to claim 11, wherein: The vacuum chamber includes a belt member covering a contact portion between the reinforcing member and the chamber.

13. A film forming device, comprising: a receiving chamber, wherein the receiving chamber receives the substrate; a heating chamber for heating the substrate introduced from the receiving chamber; and a film forming chamber, wherein the film forming chamber performs a film forming process on the substrate fed from the heating chamber, The film forming device is characterized in that The heating chamber is the vacuum chamber according to any one of claims 1 to 12.

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