Copper cylinder multi-surface welding process

Abstract

The invention belongs to the technical field of welding, and particularly relates to a copper column multi-face welding process which comprises a welding piece, the welding piece is provided with at least two opposite or adjacent tin soldering faces, a copper column is welded to any tin soldering face, and the specific welding process comprises the following steps that S100, the copper columns are placed on the tin soldering faces, and the copper columns are welded to the tin soldering faces; a to-be-welded seam is formed between the contact surfaces of the copper column and the tin soldering surface; the method aims at determining the welding sequence of all to-be-welded joints on a welding part in advance, then sorting solder wires according to the melting points from high to low, then filling the first to-be-welded joint with the solder wire with the highest melting point, then filling the second to-be-welded joint with the solder wire with the second highest melting point, and so on. In this way, it can be ensured that when the solder wire in the subsequent to-be-welded seam is heated, the solder wire in the previous to-be-welded seam cannot be molten again, and therefore the performance of the welded seam before and after welding can be effectively controlled by selecting ordered welding and adopting the solder wires with different melting points, and the welding quality is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of welding, and in particular relates to a copper column multi-surface welding process. Background Art

[0002] Copper pillars play a vital role in the field of modern electrical connections, especially as key components of laminated busbars. There are currently two common ways to connect and fix them to the laminated busbars, namely riveting and welding. Riveting can meet basic connection requirements in some specific application scenarios. However, compared with riveting, welding achieves a more stable connection, which can provide a more reliable and solid bond between the copper pillar and the laminated busbar, thereby better ensuring that the entire electrical connection system maintains stable performance in a complex operating environment.

[0003] In the prior art, the soldering operation of copper pillars usually faces the need for double-sided or multi-sided soldering. This is because in many actual electrical connection structures, the copper pillars need to be firmly connected to the laminated busbars or other related components from multiple sides to achieve all-round electrical conduction and mechanical fixation. However, in the double-sided or multi-sided soldering process, after completing the soldering process on one side, it is necessary to reverse the workpiece to heat and solder the other side. At this time, the tin in the weld of the previously soldered surface often melts. This is because when the other side is subsequently heated and soldered, the heat will be transferred to the previously soldered part, causing the temperature of the part to rise, so that the tin in the weld reaches the melting point and melts again, thereby causing the connection strength of the weld to decrease, and the originally firm welding part may become loose, thereby affecting the stability and reliability of the entire electrical connection. At the same time, the melted tin liquid will flow downward under the action of gravity, and the downward flowing tin liquid will destroy the originally smooth and smooth appearance of the weld, causing the welding part to be uneven or even empty. Summary of the invention

[0004] In view of this, the present invention provides a copper column multi-sided welding process, the purpose of which is to use solder wires with different melting points on the same welding part to perform orderly welding on double or multiple sides, in order to avoid the melting of tin in the welded weld due to repeated heating of the welding part.

[0005] The technical solution adopted by the present invention is as follows:

[0006] A copper column multi-faceted welding process comprises a welding piece (1), wherein the welding piece (1) is provided with at least two opposite or adjacent soldering surfaces, and a copper column (2) is welded on any of the soldering surfaces. The specific welding process comprises the following steps:

[0007] S100: placing a copper pillar (2) on the soldering surface, so that a weld is formed between the contact surface of the copper pillar (2) and the soldering surface;

[0008] S200: Divide all soldering surfaces of the weldment (1) into welding areas, and divide each welding area into N welds to be welded, where N is a positive integer and N≥2;

[0009] S300, obtaining the spacing between the seams to be welded, and determining whether the spacing between adjacent seams to be welded is within the range of influence of the welding temperature;

[0010] If the spacing is within the range affected by the welding temperature, the corresponding seam to be welded is marked as a risk area, and the seam to be welded in the risk area executes S400;

[0011] If the spacing is outside the range affected by the welding temperature, the corresponding seam to be welded is marked as a regular area, and the seam to be welded in the regular area executes S500;

[0012] S400: configuring a number of solder wires with different melting points; determining the number K of seams to be welded in the risk area, matching the K seams to be welded with solder wires; marking the K seams to be welded in order from high to low according to the welding melting points; making the melting point temperature of the Kth solder wire to be welded greater than the melting point temperature of the K-1th solder wire to be welded; completing the welding in the risk area;

[0013] S500: confirm the number M of seams to be welded in the conventional area, configure the same solder wire corresponding to the M seams to be welded (3) for welding, mark the M seams to be welded in sequence according to welding requirements, and complete the welding of the conventional area.

[0014] The specific concept is to predetermine the welding sequence between the various seams to be welded on the welded part, and then sort the solder wires according to the melting point from high to low, and then fill the solder wire with the highest melting point into the first seam to be welded, and then fill the solder wire with the second highest melting point into the second seam to be welded, and so on. In this way, it can be ensured that when the solder wire in the subsequent seam to be welded is heated, the solder wire in the previous seam to be welded will not melt again, so that by selecting orderly welding and using solder wires with different melting points, the performance of the previous and next welding seams can be effectively controlled and the welding quality can be improved.

[0015] Further, in the S500, when the M seams to be welded are marked in sequence according to the welding requirements, the welding sequence of the seams to be welded in the conventional area is determined by the sequence marking;

[0016] The welds to be welded in the conventional area are sorted by area so that the area of ​​the Mth weld is greater than or equal to the area of ​​the M-1th weld.

[0017] As a preferred technical solution, when the areas of the seams to be welded are different, the seams with smaller areas are arranged in the front welding order, and the seams with larger areas are arranged in the back welding order. In this way, the input amount of high-melting-point solder wire can be relatively reduced, and the time required for heating the high-melting-point solder wire can be shortened. The larger the area of ​​the seam to be welded, the lower the melting point of the solder wire filled in the seam. In this way, when welding the seams with larger areas in the subsequent welding, the required heating time will also be shortened accordingly.

[0018] Furthermore, when there are seams to be welded in the conventional area with the same area, the same seams to be welded are marked as a competitive sequence, and the distance parameters between the seams to be welded in the marked competitive sequence and the ends of the welded parts are obtained; the seams to be welded in the marked competitive sequence are prioritized from small to large according to the distance parameters.

[0019] As a preferred technical solution, the smaller the distance parameter is, the higher the welding priority of the corresponding seam to be welded; conversely, the larger the distance parameter is, the lower the welding priority of the corresponding seam to be welded, so that the welding operation can be gradually promoted from the position relative to the edge to the center, reducing the errors and time waste that may be caused by frequent adjustments to the welding position.

[0020] Furthermore, in the S500, the material of the solder wire is a tin-lead alloy, wherein the proportion of tin is 20%-63% and the proportion of lead is 37%-80%.

[0021] Furthermore, in step S400, the melting point temperature difference between the solder wires selected for any two adjacent seams to be welded is greater than 25 degrees Celsius, and the melting point temperature range of all solder wires is between 183 degrees Celsius and 279 degrees Celsius.

[0022] Furthermore, in S100, before placing the copper pillar, the step further includes cleaning the soldering surface of the soldering part.

[0023] Furthermore, in S400, a laser welding device is used to heat the solder wire, and the laser welding device includes a HLD6772WS-TL laser tin wire welding machine.

[0024] Furthermore, in S400, the welding area needs to be covered with an inert gas during welding, and the inert gas includes argon.

[0025] Furthermore, in S400, the time from the start of heating to the complete melting of the solder wires in different welds is recorded.

[0026] Furthermore, the wire diameter of the solder wire is between 0.3 mm and 0.5 mm.

[0027] In summary, due to the adoption of the above technical solution, the present invention has at least the following beneficial effects:

[0028] 1. By predetermining the welding sequence between the various seams to be welded on the welded part, it is helpful to achieve an efficient and orderly welding process. At the same time, solder wires with different melting points can prevent all solder wires from melting at the same time when heated to a specific temperature. Specifically, when using solder wires with different melting points, first sort the solder wires from high to low in terms of melting point, then fill the solder wire with the highest melting point into the first seam to be welded, and then fill the solder wire with the second highest melting point into the second seam to be welded, and so on. This ensures that when the solder wire in the subsequent seam to be welded is heated, the solder wire in the previous seam to be welded will not melt again. Therefore, by selecting orderly welding and using solder wires with different melting points, the performance of the previous and subsequent welding seams can be effectively controlled to improve the welding quality.

[0029] 2. Sort the welding sequence of each weld according to the size of the area, and put the weld with a smaller area in the front welding position to reduce the input of high-melting-point solder wire, thereby shortening the time required to heat the high-melting-point solder wire. The larger the area of ​​the weld, the lower the melting point of the solder wire filled in the weld. In this way, the heating time required for the subsequent welding of the weld with a larger area will be shortened accordingly, thereby further optimizing the welding sequence and improving the welding efficiency of the overall product. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The present invention will now be described by way of example with reference to the accompanying drawings, in which:

[0031] Figure 1 It is a structural schematic diagram of multi-sided welding of a copper column provided by the present invention.

[0032] Reference numerals in the figure: welding part-1; copper column-2; seam to be welded-3. DETAILED DESCRIPTION

[0033] The following is a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] In the prior art, the soldering of copper pillars usually involves double-sided or multi-sided soldering. Once one side is soldered and the weld needs to be turned over to solder the other side, the tin in the previous weld may re-melt. Due to the influence of gravity, the liquid tin will flow downward, which will not only reduce the soldering quality, but also may damage the appearance of the weld.

[0035] Example

[0036] Therefore, in order to solve the problem of the potential impact of repeated heating on the welded weld during the existing double-sided or multi-sided welding process, and to ensure that the weld remains stable under continuous heating conditions and avoids the occurrence of melting, the present invention discloses a copper column multi-sided welding process, see Figure 1 , comprising a welding part 1, wherein the welding part 1 is provided with at least two opposite or adjacent soldering surfaces, and a copper column 2 is soldered on any soldering surface. The specific welding process comprises the following steps:

[0037] S100, placing a copper pillar 2 on the soldering surface to form a soldering seam 3 between the contact surface of the copper pillar 2 and the soldering surface.

[0038] It should be noted that the welding piece 1 is preferably a rectangular copper bar, and the diameter of the surface to be welded of the copper column 2 is less than or equal to the width of the soldering surface of the welding piece 1 to ensure that the copper column 2 can be stably placed on the soldering surface during welding.

[0039] S200, dividing all soldering surfaces of the weldment 1 into welding areas, and dividing each welding area into N weld seams 3 to be welded, where N is a positive integer and N≥2.

[0040] S300, obtaining the spacing between the seams to be welded, and determining whether the spacing between adjacent seams to be welded is within the range of influence of the welding temperature;

[0041] If the spacing is within the range affected by the welding temperature, the corresponding seam to be welded is marked as a risk area, and the seam to be welded in the risk area executes S400;

[0042] If the spacing is outside the range affected by the welding temperature, the corresponding seam to be welded is marked as a regular area, and S500 is executed for the seam to be welded in the regular area.

[0043] S400: configuring a number of solder wires with different melting points; determining the number K of seams to be welded in the risk area, matching the K seams to be welded with solder wires; marking the K seams to be welded in order from high to low according to the welding melting points; making the melting point temperature of the Kth solder wire to be welded greater than the melting point temperature of the K-1th solder wire to be welded; completing the welding in the risk area;

[0044] S500: confirm the number M of seams to be welded in the conventional area, configure the M seams to be welded with the same solder wire for welding, mark the M seams to be welded in sequence according to welding requirements, and complete welding in the conventional area.

[0045] It is worth mentioning that the wire diameter of the solder wire is between 0.3mm and 0.5mm to ensure the melting speed and welding quality of the solder wire during the welding process.

[0046] S400, according to the welding sequence, the solder wires in the corresponding weld seams 3 are heated in sequence to complete the welding of the copper column 2 and the welded part 1 to obtain a finished product.

[0047] It should be noted that the heating equipment for the solder wire can be a combination of an electric soldering iron and a laser.

[0048] In combination with the above S100 to S400, by predetermining the welding sequence between the various seams to be welded 3 on the welded part 1, it is helpful to achieve efficient and orderly welding process. At the same time, solder wires with different melting points can avoid all solder wires from melting at the same time when heated to a specific temperature. Specifically, when using solder wires with different melting points, first sort the solder wires from high to low according to the melting point, then fill the solder wire with the highest melting point into the first seam to be welded, and then fill the solder wire with the second highest melting point into the second seam to be welded, and so on. In this way, it can be ensured that when the solder wire in the subsequent seam to be welded 3 is heated, the solder wire in the previous seam to be welded 3 will not melt again, so that by selecting orderly welding and using solder wires with different melting points, the performance of the previous and next welding seams can be effectively controlled to improve the welding quality.

[0049] In a preferred embodiment, in S500, when M seams to be welded are marked in sequence according to welding requirements, the welding order of the seams to be welded in the conventional area is determined by the sequence marking, wherein the seams to be welded in the conventional area are welded in order according to their areas, so that the area of ​​the Mth seam to be welded is greater than or equal to the area of ​​the M-1th seam to be welded. This sorting rule helps to improve the overall welding efficiency of the workpiece.

[0050] The seam to be welded 3 is formed by the contact surface between the copper pillar 2 and the soldering surface, so the area of ​​the seam to be welded 3 is the size of the contact surface between the copper pillar 2 and the soldering surface. In S500, if the areas of the seams to be welded 3 in the safety area are different, the corresponding solder wire is filled into each seam to be welded 3 according to the size of the area. Specifically, the smaller the area of ​​the seam to be welded 3, the higher the melting point of the solder wire filled therein. Conversely, the larger the area of ​​the seam to be welded 3, the lower the melting point of the solder wire filled therein. Since the welding order of the seam to be welded 3 with a smaller area is earlier than that of the seam to be welded 3 with a larger area, and the melting point of the solder wire in the seam to be welded 3 with an earlier welding order is higher, and the higher the melting point of the solder wire, the longer the heating time is. If the seam to be welded 3 with a larger area is matched with a solder wire with a high melting point, more solder wire needs to be filled and a longer heating time is consumed during the welding process to ensure that the solder wire is fully melted and fills the weld, which may reduce the welding efficiency.

[0051] Therefore, by placing the weld seam 3 with a smaller area in the front welding sequence, the input amount of high melting point solder wire can be relatively reduced, thereby shortening the time required to heat the high melting point solder wire, and the larger the area of ​​the weld seam 3, the lower the melting point of the solder wire filled, so that when welding the weld seam 3 with a larger area in the subsequent welding, the required heating time will be shortened accordingly. Because the low melting point solder wire can complete the state transition more quickly when reaching the melting point for welding fusion, it effectively improves the speed of the entire welding process and further improves the overall welding efficiency of the workpiece.

[0052] Furthermore, in S500, when there are seams to be welded in the conventional area with the same area, the same seams to be welded are marked as a competitive sequence, and the distance parameters between the seams to be welded in the marked competitive sequence and the ends of the welded parts are obtained; and the seams to be welded in the marked competitive sequence are prioritized from small to large according to the distance parameters.

[0053] In a specific implementation, this sorting method can further optimize the planning of the welding process. When faced with a situation where multiple weld seams 3 have the same area, the weld seams closer to the end of the weldment 1 are processed first, so that the welding operation can be gradually advanced from the relative edge position to the center, so that in the actual welding process, the operator can operate more conveniently, reducing the errors and time waste that may be caused by frequent adjustments to the welding position.

[0054] In addition, the melting point temperature difference between any two solder wires with adjacent melting point rankings is greater than 25 degrees Celsius, and the melting point temperature range of all solder wires is between 183 degrees Celsius and 279 degrees Celsius.

[0055] Preferably, in the S500, the material of the solder wire is a tin-lead alloy, wherein the proportion of tin is 20%-63% and the proportion of lead is 37%-80%. This ratio of tin-lead alloy can ensure that the solder has good fluidity and wettability while maintaining sufficient mechanical strength. During the welding process, the tin-lead alloy welding wire can melt quickly and evenly cover the surface of the weld to form a stable and reliable solder joint. In addition, the alloy has a low melting point, which helps to reduce the thermal impact on the workpiece during welding, thereby protecting sensitive components from damage.

[0056] On the other hand, in the step S400, a laser welding device is used to heat the solder wire, and the laser welding device used includes a HLD6772WS-TL laser tin wire welding machine. Laser welding has the characteristics of high precision and high efficiency, which not only helps to significantly increase the welding speed, but also, by virtue of the focusing characteristics of the laser beam, can carry out fine welding for tiny welds, which is of great significance for improving welding quality and production efficiency. In addition, the heat generated during the laser welding process is relatively concentrated, and the corresponding heat-affected zone is relatively small, which helps to reduce the deformation and thermal damage of the weldment, thereby effectively ensuring the structural stability and reliability of the copper column after the welding is completed. At the same time, the smoke and spatter generated during the laser welding process are relatively small, which is conducive to maintaining a clean working environment and also reduces the subsequent cleaning work required.

[0057] Furthermore, in S100, before placing the copper pillar 2, the soldering surface of the weldment 1 is cleaned to remove oil stains, oxide layer and impurities on the soldering surface to ensure that the copper pillar 2 and the soldering surface can be in good contact to form a weld 3.

[0058] In this embodiment, in S400, the welding area needs to be covered with an inert gas during welding, and the inert gas includes argon gas to prevent the welding area from reacting with oxygen in the air, thereby avoiding oxidation of the welding part. This inert gas protection measure can significantly improve the quality of the weld, ensure the stability of the welding process and the strength of the weld after welding.

[0059] Furthermore, in S400, the time from the start of heating to the complete melting of the solder wire in different weld seams 3 is recorded, and the melting time of the solder wire in each weld seam 3 is stored separately. When welding multiple products of the same standard, if the overall welding time exceeds the predetermined range, the products and specific welding links of the weld seams with possible problems can be quickly located by analyzing and comparing these separately stored melting time data.

[0060] For example, assuming that the scheduled welding time for a single product is T minutes, when the overall welding time of a batch of multiple products exceeds this predetermined range (i.e., the completion time is greater than T multiplied by the number of products), first check the melting time records corresponding to each weld 3 of each product. If it is found that the melting time of a weld 3 of a product (such as the second weld of product A) is significantly longer than the melting time of the welds at the same position of other normal products, this indicates that there may be an abnormality in the welding process of the weld.

[0061] For example, at the weld seam 3, the laser power setting of the laser welding equipment deviates and fails to provide enough heat to melt the solder wire within the normal time; or the inert gas flow is unstable, which affects the protection effect of the welding area and causes interference in the melting process of the solder wire; or there are differences in the quality of the solder wire itself, such as uneven wire diameter and other factors that affect the melting speed. By analyzing these abnormal melting time data, it is helpful to assist users to find the root cause of the problem, and then take targeted measures in time to adjust and repair it, so as to avoid similar problems in subsequent products, thereby effectively reducing the extra time spent on welding fault troubleshooting and repair, and greatly improving the welding efficiency of the overall product.

[0062] Moreover, by statistically analyzing the melting time distribution of different batches of products and different welds under various welding conditions, the preset values ​​of welding process parameters can be further optimized. For example, according to previous data, for welds of a certain size and layout, under a specific combination of laser power and inert gas flow, the melting time of the solder wire is always in a relatively stable and short range. Then, in subsequent welding production, this combination of parameters can be used as the standard setting for this type of weld, so that each weld can be welded under more ideal conditions, further shortening the overall welding time and improving the welding efficiency of the overall product.

[0063] In addition, detailed records of melting time also help to arrange the connection of welding processes in the production process. When the approximate melting time of each weld is known, the welding sequence switching time between different welds in the same product can be planned more accurately, reducing unnecessary waiting time, allowing welding equipment and operators to continue to work efficiently, which also significantly improves the welding efficiency of the overall product.

[0064] In summary, the copper pillar multi-sided welding process avoids the problem of repeated heating affecting the welded welds during double-sided or multi-sided soldering, while also improving the production efficiency of the welded products.

[0065] For example, see Figure 1 The welding part 1 is arranged in an "L"-shaped structure with four soldering surfaces. The processing personnel place four copper pillars 2 on the four soldering surfaces respectively, and then sort them according to the area sizes of the seams to be welded 3 formed by the four copper pillars 2 and the soldering surfaces to determine the first seam to be welded, the second seam to be welded, the third seam to be welded and the fourth seam to be welded, and then fill the solder wire into the first seam to be welded, the second seam to be welded, the third seam to be welded and the fourth seam to be welded in order from high to low melting point temperatures.

[0066] Among them, the tin-lead ratio of the solder wire filled in the first weld is: tin accounts for 20%, lead accounts for 80%, and the melting point is 279 degrees Celsius.

[0067] The tin-lead ratio of the solder wire filled into the second weld is: 35% tin, 65% lead, and the melting point is 248 degrees Celsius.

[0068] The tin-lead ratio of the solder wire filled into the third weld is: 50% tin, 50% lead, and the melting point is 215 degrees Celsius.

[0069] The tin-lead ratio of the solder wire filled into the fourth weld is: 63% tin, 37% lead, and the melting point is 183 degrees Celsius.

[0070] Finally, the solder wires in the first seam to be welded, the second seam to be welded, the third seam to be welded and the fourth seam to be welded are heated in turn to complete the welding.

[0071] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0072] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A copper column multi-sided welding process, characterized in that: The welding part comprises at least two opposite or adjacent soldering surfaces, and a copper column is soldered on any soldering surface. The following steps are involved: S100: placing a copper pillar on the soldering surface to form a weld between the copper pillar and the contact surface of the soldering surface; S200: Divide all soldering surfaces of the weldment into welding areas, and divide each welding area into N welds to be welded, where N is a positive integer and N≥2; S300, obtaining the spacing between the seams to be welded, and determining whether the spacing between adjacent seams to be welded is within the range of influence of the welding temperature; If the spacing is within the range affected by the welding temperature, the corresponding seam to be welded is marked as a risk area, and the seam to be welded in the risk area executes S400; If the spacing is outside the range affected by the welding temperature, the corresponding seam to be welded is marked as a regular area, and the seam to be welded in the regular area executes S500; S400: configuring a number of solder wires with different melting points; determining the number K of seams to be welded in the risk area, matching the K seams to be welded with solder wires; marking the K seams to be welded in order from high to low according to the welding melting points; making the melting point temperature of the Kth solder wire to be welded greater than the melting point temperature of the K-1th solder wire to be welded; completing the welding in the risk area; S500: confirm the number M of seams to be welded in the conventional area, configure the M seams to be welded with the same solder wire for welding, mark the M seams to be welded in sequence according to welding requirements, and complete welding in the conventional area.

2. The copper column multi-surface welding process according to claim 1, characterized in that: In the step S500, when the M seams to be welded are marked in sequence according to the welding requirements, the welding sequence of the seams to be welded in the conventional area is determined by the sequence markings; The welds to be welded in the conventional area are sorted by area so that the area of ​​the Mth weld is greater than or equal to the area of ​​the M-1th weld.

3. The copper column multi-surface welding process according to claim 2, characterized in that: When there are welds with the same area in the conventional area, the same welds are marked as a competition sequence, and the distance parameters between the welds marked in the competition sequence and the ends of the welded parts are obtained; the welds marked in the competition sequence are prioritized from small to large according to the distance parameters.

4. The copper column multi-surface welding process according to claim 1, characterized in that: In the S500, the material of the solder wire is a tin-lead alloy, wherein the proportion of tin is 20%-63% and the proportion of lead is 37%-80%.

5. The copper column multi-surface welding process according to claim 1, characterized in that: In step S400, the melting point temperature difference between the selected solder wires for any two adjacent seams to be welded is greater than 25 degrees Celsius, and the melting point temperature range of all solder wires is between 183 degrees Celsius and 279 degrees Celsius.

6. The copper column multi-surface welding process according to claim 1, characterized in that: In the above S100, before placing the copper pillar, the soldering surface of the soldering part is cleaned.

7. The copper column multi-surface welding process according to claim 1, characterized in that: In S400, a laser welding device is used to heat the solder wire, and the laser welding device includes a HLD6772WS-TL laser solder wire welding machine.

8. The copper column multi-surface welding process according to claim 7, characterized in that: In the above S400, the welding area needs to be covered with an inert gas during welding, and the inert gas includes argon.

9. The copper column multi-surface welding process according to claim 7, characterized in that: In the S400, the time from the start of heating to the complete melting of the solder wires in different welds is recorded.

10. The copper column multi-surface welding process according to claim 1, characterized in that: The wire diameter of the solder wire is between 0.3 mm and 0.5 mm.

Images