Soldering tin nozzle structure for wave soldering and soldering system

Abstract

The invention relates to the technical field of wave soldering equipment components, in particular to a soldering nozzle structure for wave soldering and a soldering system.The soldering nozzle structure comprises a first side plate, a second side plate and two sets of end plates arranged in parallel, the first side plate and the second side plate are vertically arranged, and the first side plate and the second side plate are fixedly connected between the two sets of end plates; an adjusting plate is rotationally connected between the two groups of end plates; after the tin liquid moves to a certain position on the flow guide plate, the tin liquid can fall down and fall into the corresponding material collecting box, when the amount of the tin liquid in the material collecting box reaches a certain amount, the material collecting box moves downwards to drive the driving structure to work, and the driving structure drives the first filter plate and the second filter plate to move when working; when the first filter plate and the second filter plate move, the first filter plate and the second filter plate are cleaned through the cleaning structure, so that the tin liquid filtering effect of the first filter plate and the second filter plate is guaranteed, meanwhile, the tin liquid outlet amount during follow-up welding spot welding is guaranteed, and the working efficiency and the use convenience are improved.

Description

Technical Field

[0001] The invention relates to the technical field of wave soldering equipment components, and in particular to a solder nozzle structure and a soldering system for wave soldering. Background Art

[0002] The welding of circuit boards often requires the use of wave soldering furnaces. Wave soldering is a process in which molten liquid tin solder is pumped to form a solder wave of a specific shape on the surface of the solder tank. The circuit board with components inserted is placed on a conveyor chain and passes through the solder wave at a specific angle and a certain immersion depth to achieve solder joint welding.

[0003] The existing wave soldering nozzle is prone to clogging of the filter plate due to oxides after long-term use, and needs to be disassembled and cleaned from time to time, which reduces work efficiency. At the same time, the welding quality can only be ensured after the filter plate is cleaned. Therefore, a solder nozzle structure for wave soldering is proposed to facilitate the cleaning of the filter plate in the solder nozzle and improve work efficiency. Summary of the invention

[0004] In view of the problems in the prior art, the present invention provides a solder nozzle structure and a soldering system for wave soldering, which facilitates the cleaning of a filter plate in the solder nozzle and improves work efficiency.

[0005] The technical solution adopted by the present invention to solve its technical problems is a solder nozzle structure for wave soldering, comprising a vertically arranged first side plate, a second side plate and two groups of parallelly arranged end plates, the first side plate and the second side plate are fixedly connected between the two groups of end plates, an adjustment plate is rotatably connected between the two groups of end plates, the tops of the first side plate and the second side plate are fixedly connected with horizontally arranged guide plates, a mobile filtering structure for filtering solder is provided between the first side plate and the second side plate, a gathering structure is provided on the side away from the first side plate and the second side plate, a driving structure is provided below the gathering structure, the driving structure is used to drive the mobile filtering structure to move, and a cleaning structure is provided on the side away from the first side plate and the second side plate, the cleaning structure is used to clean the mobile filtering structure.

[0006] As a further optimization scheme of the present invention, the movable filtering structure includes a first slot penetrating the first side plate and the second side plate, a horizontally arranged first filter plate is slidably connected in the first slot, first grooves are provided on the lower surfaces at both ends of the first filter plate, a horizontally arranged first tooth structure is provided in the first groove, and the first tooth structure is meshed with the driving structure for transmission.

[0007] As a further optimization scheme of the present invention, the mobile filtering structure also includes a second slot penetrating the first side plate and the second side plate, the second slot is located below the first slot, a horizontally arranged second filter plate is slidably connected in the second slot, second grooves are provided on the upper surfaces of both ends of the second filter plate, a horizontally arranged second tooth structure is provided in the second groove, and the second tooth structure is meshed with the driving structure for transmission.

[0008] As a further optimization scheme of the present invention, the material collection structure includes a material collection box with an opening upward, and the two groups of material collection boxes are respectively vertically slidably connected to the first side plate and the second side plate on one side away from the first side plate, and one side of the first side plate and the second side plate are fixedly connected to a horizontally arranged support plate, and the support plate is located below the material collection box, and both ends of the bottom of the material collection box are fixedly connected to vertically arranged racks, and positioning holes corresponding to the racks are provided above the support plates, and the lower end of the rack passes through the positioning holes, and a reset spring is fixedly connected between the support plate and the bottom of the material collection box, and the rack is located in the middle of the reset spring, and the rack is meshed with the driving structure for transmission;

[0009] The inner bottom of the collection box is provided with a plurality of liquid outlet holes, a sealing plug is provided in the liquid outlet hole, a positioning groove is provided at the bottom of the sealing plug, and a plurality of push rods corresponding to the sealing plugs are fixedly connected to the upper surface of the support plate, the push rods are conically arranged, and the upper ends of the push rods correspond to the positioning grooves.

[0010] As a further optimization scheme of the present invention, the driving structure includes two groups of first gears, the first gears are meshed with the rack for transmission, one side of the first gear is fixedly connected with a rotating shaft, the first side plate and the second side plate are connected with two groups of connecting rods on the side away from each other, one end of the rotating shaft is rotatably connected to the connecting rod, and the other end of the rotating shaft is fixedly connected with a second gear, and the second gear is meshed with the first tooth structure and the second tooth structure for transmission.

[0011] As a further optimization scheme of the present invention, the cleaning structure includes a first cleaning plate arranged on one side of the first groove and a second cleaning plate arranged on one side of the second groove, the first side plate and the second side plate are connected to the first cleaning plate and the second cleaning plate through support rods, the upper end of the first cleaning plate is in sliding contact with the lower surface of the first filter plate, and the upper end of the second cleaning plate is in sliding contact with the lower surface of the second filter plate.

[0012] As a further optimization scheme of the present invention, a locking structure is provided on one side of the first side plate and the second side plate close to the material collection box, and the locking structure includes a plurality of groups of first pin grooves and a plurality of groups of second pin grooves, the first pin groove is located above the second pin groove, a first pin rod is slidably connected in the first pin groove, a first ball is installed at one end of the first pin rod close to the material collection box, a first extrusion spring is fixedly connected between the first pin rod and the inner wall of the first pin groove, a second pin rod is slidably connected in the second pin groove, a second ball is installed at one end of the second pin rod close to the material collection box, and a second extrusion spring is fixedly connected between the second pin rod and the inner wall of the second pin groove;

[0013] A plurality of locking grooves are arranged on one side of the material collecting box close to the locking structure. The first ball is located in the locking groove in the initial state, and the second ball is located in the locking groove after the material collecting box moves downward.

[0014] As a further optimization solution of the present invention, the mesh aperture of the first filter plate is smaller than the mesh aperture of the second filter plate.

[0015] A soldering system comprises the above-mentioned solder nozzle structure for wave soldering.

[0016] Beneficial effects of the present invention:

[0017] (1) The present invention discloses a solder nozzle structure for wave soldering. After the tin liquid moves to a certain position on the guide plate, the tin liquid will fall and land in the corresponding collecting box. When the amount of tin liquid in the collecting box reaches a certain amount, the collecting box moves downward to drive the driving structure to work. When the driving structure works, it drives the first filter plate and the second filter plate to move. When the first filter plate and the second filter plate move, the cleaning structure cleans the first filter plate and the second filter plate, thereby ensuring the filtering effect of the first filter plate and the second filter plate on the tin liquid, and at the same time ensuring the amount of tin liquid discharged during subsequent solder joint welding, thereby improving work efficiency and convenience of use. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0019] Figure 1 is an axonometric view of the present invention;

[0020] Figure 2 is a side view of the present invention;

[0021] Figure 3 It is a schematic diagram of the cross-sectional structure of the present invention;

[0022] Figure 4 for Figure 3 A schematic diagram of the enlarged structure of region A;

[0023] Figure 5It is a schematic diagram of the driving structure of the present invention;

[0024] Figure 6 for Figure 5 Schematic diagram of the enlarged structure of region B;

[0025] Figure 7 It is a schematic cross-sectional view of the cleaning structure of the present invention;

[0026] Figure 8 for Figure 7 Schematic diagram of the enlarged structure of the C region;

[0027] Fig. 9 for Figure 7 Schematic diagram of the enlarged structure of the D region;

[0028] In the figure: 1. first side plate; 2. second side plate; 3. end plate; 4. adjustment plate; 5. guide plate; 6. first slot; 7. first filter plate; 8. first tooth structure; 9. second slot; 10. second filter plate; 11. second tooth structure; 12. collection box; 13. support plate; 14. rack; 15. positioning hole; 16. reset spring; 17. liquid outlet; 18. sealing plug; 19. positioning slot; 20. ejector rod; 21. first gear; 22. rotating shaft; 23. connecting rod; 24. second gear; 25. first cleaning plate; 26. second cleaning plate; 27. support rod; 28. first pin groove; 29. ​​first pin rod; 30. first ball; 31. first extrusion spring; 32. second pin groove; 33. second pin rod; 34. second ball; 35. second extrusion spring; 36. locking slot. DETAILED DESCRIPTION

[0029] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0030] In order to facilitate the cleaning of the filter plate in the solder nozzle and improve the work efficiency, as an embodiment of the present invention, Figure 1 , Figure 2 , Figure 3As shown, a solder nozzle structure for wave soldering described in the present invention comprises a vertically arranged first side plate 1, a second side plate 2 and two groups of parallelly arranged end plates 3, the first side plate 1 and the second side plate 2 are fixedly connected between the two groups of end plates 3, an adjustment plate 4 is rotatably connected between the two groups of end plates 3, the tops of the first side plate 1 and the second side plate 2 are fixedly connected with a horizontally arranged guide plate 5, a mobile filtering structure for filtering solder is provided between the first side plate 1 and the second side plate 2, a gathering structure is provided on the side away from the first side plate 1 and the second side plate 2, a driving structure is provided below the gathering structure, the driving structure is used to drive the mobile filtering structure to move, and a cleaning structure is provided on the side away from the first side plate 1 and the second side plate 2, the cleaning structure is used to clean the mobile filtering structure.

[0031] When in use, when soldering of components is required, the electric pump is used to transport the tin liquid to the first side plate 1 and the second side plate 2, and the mobile filtering structure is used to filter the oxide impurities contained in the tin liquid. When the tin liquid reaches a certain amount, the tin liquid will overflow from the upper part of the first side plate 1 and the second side plate 2, and the guide plate 5 is used to form a solder wave peak, and the solder wave peak is used to perform soldering of components;

[0032] After the tin liquid moves to a certain position on the guide plate 5, the tin liquid will fall and fall into the corresponding aggregate structure. When the amount of tin liquid in the aggregate structure reaches a certain amount, the aggregate structure moves downward to drive the driving structure to work. When the driving structure works, it drives the mobile filter structure to move. When the mobile filter structure moves, it relies on the cleaning structure to clean the mobile filter structure, so as to ensure the filtering effect of the mobile filter structure on the tin liquid.

[0033] After the aggregate structure moves down to a certain position, the tin liquid in the aggregate structure will be discharged and fall into the tin liquid pool. After the tin liquid in the aggregate structure is discharged, the aggregate structure resets and moves upward to drive the driving structure to work again. When the driving structure works, it drives the mobile filtering structure to reset and move. This makes it easier to clean the mobile filtering structure during the solder joint welding of components to avoid blockage of the mobile filtering structure, thereby ensuring the amount of tin liquid discharged during subsequent solder joint welding and improving work efficiency and ease of use.

[0034] In order to facilitate the cleaning of the first filter plate 7, exemplary, as Figure 1 , Figure 3 , Figure 4 , Figure 7As shown, the present invention also includes that the movable filtering structure includes a first slot 6 penetrating the first side plate 1 and the second side plate 2, a first horizontally arranged first filter plate 7 is slidably connected in the first slot 6, and first grooves are provided on the lower surfaces of both ends of the first filter plate 7, a first horizontally arranged first tooth structure 8 is provided in the first groove, and the first tooth structure 8 is meshed with the driving structure for transmission.

[0035] When in use, when soldering of components is required, the tin liquid is transported to the first side plate 1 and the second side plate 2 by an electric pump, and the oxide impurities contained in the tin liquid are filtered by the first filter plate 7. After the filtering is completed, the tin liquid passes through the guide plate 5 to form a solder wave peak, and the components are soldered by this.

[0036] When the amount of tin liquid in the aggregate structure reaches a certain amount, the aggregate structure moves downward and drives the driving structure to work. When the driving structure works, it meshes with the first tooth structure 8 to drive, thereby driving the first filter plate 7 to move. When the first filter plate 7 moves, the lower surface of the first filter plate 7 is cleaned by the cleaning structure, so as to facilitate the cleaning of the first filter plate 7.

[0037] After the tin liquid in the aggregate structure is discharged, the aggregate structure resets and moves upward while driving the driving structure to work, and the first filter plate 7 is driven to reset and move by the meshing transmission between the driving structure and the first tooth structure 8. When the first filter plate 7 resets and moves, the lower surface of the first filter plate 7 is cleaned by the cleaning structure, so as to further improve the cleaning effect of the first filter plate 7 and ensure the tin liquid output of the first filter plate 7 during subsequent solder joint welding.

[0038] When the first filter plate 7 moves, impurities falling on the upper surface of the first filter plate 7 can be cleaned through the first slot 6 .

[0039] In order to facilitate cleaning of the second filter plate 10, for example, Figure 1 , Figure 3 , Figure 4 , Figure 7 As shown, the present invention also includes that the mobile filtering structure also includes a second slot 9 penetrating the first side plate 1 and the second side plate 2, the second slot 9 is located below the first slot 6, a horizontally arranged second filter plate 10 is slidably connected in the second slot 9, and second grooves are provided on the upper surfaces of both ends of the second filter plate 10, a horizontally arranged second tooth structure 11 is provided in the second groove, and the second tooth structure 11 is meshed with the driving structure for transmission.

[0040] When in use, when soldering of components is required, the tin liquid is transported to the first side plate 1 and the second side plate 2 by an electric pump, and the oxide impurities contained in the tin liquid are first filtered by the second filter plate 10. After the filtering by the second filter plate 10 is completed, the tin liquid is filtered twice by the first filter plate 7, so as to improve the filtering effect of the mobile filtering structure, and further ensure the stability and welding effect of the soldering of components by the tin liquid;

[0041] When the amount of tin liquid in the aggregate structure reaches a certain amount, the aggregate structure moves downward and drives the driving structure to work. When the driving structure works, it meshes with the first tooth structure 8 and the second tooth structure 11 to drive the first filter plate 7 and the second filter plate 10 to move. When the second filter plate 10 moves, the cleaning structure cleans the lower surface of the second filter plate 10, so as to facilitate the cleaning of the second filter plate 10.

[0042] After the tin liquid in the aggregate structure is discharged, the aggregate structure is reset and moved upward, and at the same time, the driving structure is driven to work, and the second filter plate 10 is driven to reset and move by the meshing transmission between the driving structure and the second tooth structure 11. When the second filter plate 10 is reset and moved, the lower surface of the second filter plate 10 is cleaned by the cleaning structure, so as to further improve the cleaning effect of the second filter plate 10, and at the same time ensure the tin liquid discharge amount of the second filter plate 10 during the subsequent solder joint welding;

[0043] When the second filter plate 10 moves, impurities falling on the upper surface of the second filter plate 10 can be cleaned through the second slots 9 .

[0044] For example, Figure 1 , Figure 2 , Figure 4 , Figure 5 , Figure 6 As shown, the present invention also includes that the aggregate structure includes an aggregate box 12 with an opening upward, and the two groups of aggregate boxes 12 are respectively vertically slidably connected to the first side plate 1 and the side away from the second side plate 2, and the first side plate 1 and the second side plate 2 are fixedly connected to a horizontally arranged support plate 13 on one side, and the support plate 13 is located below the aggregate box 12, and the two ends of the bottom of the aggregate box 12 are fixedly connected with a vertically arranged rack 14, and a positioning hole 15 corresponding to the rack 14 is provided above the support plate 13, and the lower end of the rack 14 passes through the positioning hole 15, and a reset spring 16 is fixedly connected between the support plate 13 and the bottom of the aggregate box 12, and the rack 14 is located in the middle of the reset spring 16, and the rack 14 is meshed with the driving structure for transmission;

[0045] The inner bottom of the collecting box 12 is provided with a plurality of liquid outlet holes 17, and a sealing plug 18 is provided in the liquid outlet hole 17. A positioning groove 19 is provided at the bottom of the sealing plug 18. The upper surface of the support plate 13 is fixedly connected with a plurality of push rods 20 corresponding to the sealing plugs 18. The push rods 20 are conically arranged, and the upper ends of the push rods 20 correspond to the positioning groove 19.

[0046] When in use, after the tin liquid moves to a certain position on the guide plate 5, the tin liquid will fall and fall into the corresponding collecting box 12. When the amount of tin liquid in the collecting box 12 reaches a certain amount, the collecting box 12 moves down and drives the rack 14 to move down synchronously. When the rack 14 moves down, it meshes with the driving structure to drive the first filter plate 7 and the second filter plate 10 to move, so as to facilitate the cleaning of the first filter plate 7 and the second filter plate 10.

[0047] When the collection box 12 moves downward, the reset spring 16 is squeezed. At the same time, after the collection box 12 moves downward to a certain position, the bottom of the collection box 12 contacts the support plate 13, and at the same time, the positioning groove 19 of the sealing plug 18 is squeezed by the push rod 20 to drive the sealing plug 18 to move upward. At this time, the tin liquid in the collection box 12 will be discharged through the liquid outlet 17. After the tin liquid in the collection box 12 is discharged, the collection box 12 is reset and moved upward to the initial state by relying on the action of the reset spring 16, so as to facilitate the subsequent cleaning of the mobile filtering structure.

[0048] In order to facilitate the movement of the first filter plate 7 and the second filter plate 10, for example, Figure 2 , Figure 5 , Figure 6 As shown, the present invention also includes that the driving structure includes two groups of first gears 21, the first gears 21 are meshed with the rack 14 for transmission, one side of the first gear 21 is fixedly connected with a rotating shaft 22, the first side plate 1 and the second side plate 2 are connected with two groups of connecting rods 23 on the side away from each other, one end of the rotating shaft 22 is rotatably connected to the connecting rod 23, and the other end of the rotating shaft 22 is fixedly connected with a second gear 24, and the second gear 24 is meshed with the first tooth structure 8 and the second tooth structure 11 for transmission.

[0049] During use, when the amount of tin liquid in the collecting box 12 reaches a certain amount, the collecting box 12 moves down and drives the rack 14 to move down synchronously. When the rack 14 moves down, it meshes with the first gear 21 for transmission. When the first gear 21 rotates, it drives the second gear 24 to rotate by relying on the rotating shaft 22. When the second gear 24 rotates, it meshes with the first tooth structure 8 and the second tooth structure 11 for transmission, and drives the first filter plate 7 and the second filter plate 10 to move. The first filter plate 7 and the second filter plate 10 are cleaned by relying on the cleaning structure, so as to ensure the stability of subsequent solder joint welding of components;

[0050] When the tin liquid in the collecting box 12 is discharged, the collecting box 12 and the rack 14 are reset and moved upward by relying on the action of the reset spring 16. When the rack 14 is reset and moved upward, it meshes with the first gear 21 again, and thereby drives the first filter plate 7 and the second filter plate 10 to reset and move and return to the initial state.

[0051] For example, Figure 7 , Figure 8 , Fig. 9 As shown, the present invention also includes that the cleaning structure includes a first cleaning plate 25 arranged on one side of the first slot 6 and a second cleaning plate 26 arranged on one side of the second slot 9, the first side plate 1 and the second side plate 2 are connected to the first cleaning plate 25 and the second cleaning plate 26 through a support rod 27, the upper end of the first cleaning plate 25 is in sliding contact with the lower surface of the first filter plate 7, and the upper end of the second cleaning plate 26 is in sliding contact with the lower surface of the second filter plate 10.

[0052] When in use, when the second gear 24 rotates, it meshes with the first tooth structure 8 and the second tooth structure 11 and drives the first filter plate 7 and the second filter plate 10 to move. The lower surface of the first filter plate 7 is cleaned by two groups of first cleaning plates 25, and the lower surface of the second filter plate 10 is cleaned by two groups of second cleaning plates 26. The support rod 27 can improve the stability of the first cleaning plate 25 and the second cleaning plate 26.

[0053] In order to ensure the stability of the aggregate box 12, for example, Figure 1 , Figure 7 , Figure 8 As shown, the present invention also includes that the first side plate 1 and the second side plate 2 are both provided with a locking structure on one side close to the collecting box 12, and the locking structure includes a plurality of groups of first pin grooves 28 and a plurality of groups of second pin grooves 32, the first pin groove 28 is located above the second pin groove 32, a first pin rod 29 is slidably connected in the first pin groove 28, a first ball 30 is installed at one end of the first pin rod 29 close to the collecting box 12, a first extrusion spring 31 is fixedly connected between the first pin rod 29 and the inner wall of the first pin groove 28, a second pin rod 33 is slidably connected in the second pin groove 32, a second ball 34 is installed at one end of the second pin rod 33 close to the collecting box 12, and a second extrusion spring 35 is fixedly connected between the second pin rod 33 and the inner wall of the second pin groove 32;

[0054] The collecting box 12 is provided with a plurality of locking grooves 36 on one side close to the locking structure. The first balls 30 are initially located in the locking grooves 36 . After the collecting box 12 moves downward, the second balls 34 are located in the locking grooves 36 .

[0055] When in use, when the amount of tin liquid in the collection box 12 reaches a certain amount, the first ball 30 is disengaged from the locking groove 36. At the same time, as the collection box 12 moves down to a certain position, the collection box 12 is squeezed and contacted with the second ball 34, and the second pin 33 and the second squeezing spring 35 are squeezed. As the collection box 12 continues to move down, the second ball 34 corresponds to the locking groove 36 of the collection box 12. At this time, the second squeezing spring 35 and the second pin 33 drive the second ball 34 to move into the locking groove 36, so as to ensure the stability of the collection box 12 and facilitate the discharge of the tin liquid in the collection box 12.

[0056] After the tin liquid is discharged, the reset spring 16 drives the collection box 12 to reset and move upward, and at the same time the second ball 34 disengages from the locking groove 36. When the collection box 12 resets to the initial state, the first ball 30 is located in the locking groove 36 again, thereby ensuring the stability of the collection box 12, so as to facilitate the subsequent collection of the tin liquid.

[0057] Exemplarily, the present invention also includes that the mesh aperture of the first filter plate 7 is smaller than the mesh aperture of the second filter plate 10 .

[0058] When in use, the tin liquid is filtered once by the second filter plate 10. After the first filtration is completed, the tin liquid passes through the first filter plate 7, and the first filter plate 7 is used to filter the tin liquid for a second time, so as to ensure the amount of tin liquid discharged during the subsequent soldering of components and the welding effect.

[0059] A soldering system comprises the above-mentioned solder nozzle structure for wave soldering.

[0060] When the present invention is used, when it is necessary to perform solder joint welding on components, the tin liquid is transported to the first side plate 1 and the second side plate 2 by an electric pump, and the oxide impurities contained in the tin liquid are first filtered by the second filter plate 10. After the second filter plate 10 completes the filtering, the tin liquid is filtered twice by the first filter plate 7, so as to improve the filtering effect of the mobile filtering structure, and further ensure the stability and welding effect of the solder joint welding of the components by the tin liquid;

[0061] When the tin liquid reaches a certain amount, the tin liquid will overflow from the upper part of the first side plate 1 and the second side plate 2, and at the same time, the guide plate 5 is used to form a solder wave crest, and the solder crest is used to realize soldering of the components;

[0062] After the tin liquid moves to a certain position on the guide plate 5, the tin liquid will fall and fall into the corresponding collection box 12. When the amount of tin liquid in the collection box 12 reaches a certain amount, the first ball 30 disengages from the locking groove 36, and the collection box 12 moves downward and drives the rack 14 to move downward synchronously. When the rack 14 moves downward, it meshes with the first gear 21 for transmission. When the first gear 21 rotates, it drives the second gear 24 to rotate by relying on the rotating shaft 22. When the second gear 24 rotates, it meshes with the first tooth structure 8 and the second tooth structure 11 for transmission, and drives the first filter plate 7 and the second filter plate 10 to move. The lower surface of the first filter plate 7 is cleaned by relying on two groups of first cleaning plates 25, and the lower surface of the second filter plate 10 is cleaned by relying on two groups of second cleaning plates 26, so as to ensure the stability of subsequent solder joint welding of components.

[0063] As the components move, the electric pump will work intermittently to form a solder wave peak to cooperate with the welding work of the components. After each group of components is welded, the electric pump can stop working. At this time, when the tin liquid in the collection box 12 is discharged, the collection box 12 and the rack 14 are driven to reset and move upward by relying on the action of the reset spring 16. When the rack 14 resets and moves upward, it meshes with the first gear 21 again, and thereby drives the first filter plate 7 and the second filter plate 10 to reset and move and return to the initial state. At the same time, the second ball 34 disengages from the locking groove 36. When the collection box 12 is reset to the initial state, the first ball 30 is again located in the locking groove 36, so as to ensure the stability of the collection box 12, so as to facilitate the subsequent collection of tin liquid.

[0064] Descriptions such as "specific example" or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, those skilled in the art may combine and combine different embodiments or examples and features of different embodiments or examples described in this specification without contradiction.

[0065] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of the present invention is defined by the attached claims and their equivalents.

Claims

1. A solder nozzle structure for wave soldering, comprising a first side plate (1) and a second side plate (2) arranged vertically, and two groups of end plates (3) arranged in parallel, wherein the first side plate (1) and the second side plate (2) are fixedly connected between the two groups of end plates (3), an adjusting plate (4) is rotatably connected between the two groups of end plates (3), and the tops of the first side plate (1) and the second side plate (2) are fixedly connected with a horizontally arranged guide plate (5), characterized in that: A mobile filtering structure for filtering solder is provided between the first side plate (1) and the second side plate (2); a collection structure is provided on the side away from the first side plate (1) and the second side plate (2); a driving structure is provided below the collection structure, and the driving structure is used to drive the mobile filtering structure to move; a cleaning structure is provided on the side away from the first side plate (1) and the second side plate (2), and the cleaning structure is used to clean the mobile filtering structure.

2. A solder nozzle structure for wave soldering according to claim 1, characterized in that: The movable filtering structure comprises a first slot (6) penetrating the first side plate (1) and the second side plate (2); a first filter plate (7) arranged horizontally is slidably connected in the first slot (6); first grooves are arranged on the lower surfaces of both ends of the first filter plate (7); a first tooth structure (8) arranged horizontally is arranged in the first groove; and the first tooth structure (8) is meshed with the driving structure for transmission.

3. A solder nozzle structure for wave soldering according to claim 2, characterized in that: The mobile filtering structure also includes a second slot (9) penetrating the first side plate (1) and the second side plate (2), the second slot (9) being located below the first slot (6), a second filter plate (10) being slidably connected in the second slot (9), second grooves being provided on both ends of the upper surface of the second filter plate (10), a second tooth structure (11) being provided in the second groove, and the second tooth structure (11) being meshed with the driving structure for transmission.

4. A solder nozzle structure for wave soldering according to claim 3, characterized in that: The material collecting structure comprises a material collecting box (12) with an opening facing upward, and two groups of the material collecting boxes (12) are respectively connected to the first side plate (1) and the second side plate (2) in a vertical sliding manner, and one side of the first side plate (1) and the second side plate (2) is fixedly connected to a horizontally arranged support plate (13), and the support plate (13) is located below the material collecting box (12). Both ends of the bottom of the material collecting box (12) are fixedly connected to a vertically arranged rack (14), and a positioning hole (15) corresponding to the rack (14) is provided above the support plate (13), and the lower end of the rack (14) passes through the positioning hole (15). A reset spring (16) is fixedly connected between the support plate (13) and the bottom of the material collecting box (12), and the rack (14) is located in the middle of the reset spring (16). The rack (14) is meshed with the driving structure for transmission; The inner bottom of the collecting box (12) is provided with a plurality of groups of liquid outlet holes (17), a sealing plug (18) is provided in the liquid outlet hole (17), a positioning groove (19) is provided at the bottom of the sealing plug (18), and the upper surface of the support plate (13) is fixedly connected with a plurality of groups of push rods (20) corresponding to the sealing plugs (18), the push rods (20) are conically arranged, and the upper ends of the push rods (20) correspond to the positioning grooves (19).

5. A solder nozzle structure for wave soldering according to claim 4, characterized in that: The driving structures each comprise two groups of first gears (21), the first gears (21) meshing with the rack (14) for transmission, one side of the first gear (21) being fixedly connected with a rotating shaft (22), the first side plate (1) and the second side plate (2) being connected with two groups of connecting rods (23) on a side away from each other, one end of the rotating shaft (22) being rotatably connected with the connecting rod (23), the other end of the rotating shaft (22) being fixedly connected with a second gear (24), the second gear (24) being meshing with the first tooth structure (8) and the second tooth structure (11) for transmission.

6. A solder nozzle structure for wave soldering according to claim 5, characterized in that: The cleaning structure comprises a first cleaning plate (25) arranged on one side of the first slot (6) and a second cleaning plate (26) arranged on one side of the second slot (9); the first side plate (1) and the second side plate (2) are connected to the first cleaning plate (25) and the second cleaning plate (26) via a support rod (27); the upper end of the first cleaning plate (25) is in sliding contact with the lower surface of the first filter plate (7); and the upper end of the second cleaning plate (26) is in sliding contact with the lower surface of the second filter plate (10).

7. A solder nozzle structure for wave soldering according to claim 6, characterized in that: The first side plate (1) and the second side plate (2) are both provided with a locking structure on one side close to the material collecting box (12), and the locking structure comprises a plurality of groups of first pin grooves (28) and a plurality of groups of second pin grooves (32), the first pin groove (28) is located above the second pin groove (32), a first pin rod (29) is slidably connected in the first pin groove (28), a first ball (30) is installed at one end of the first pin rod (29) close to the material collecting box (12), a first extrusion spring (31) is fixedly connected between the first pin rod (29) and the inner wall of the first pin groove (28), a second pin rod (33) is slidably connected in the second pin groove (32), a second ball (34) is installed at one end of the second pin rod (33) close to the material collecting box (12), and a second extrusion spring (35) is fixedly connected between the second pin rod (33) and the inner wall of the second pin groove (32); A plurality of locking grooves (36) are provided on one side of the material collection box (12) close to the locking structure. The first ball (30) is located in the locking groove (36) in the initial state. After the material collection box (12) moves downward, the second ball (34) is located in the locking groove (36).

8. A solder nozzle structure for wave soldering according to claim 7, characterized in that: The mesh aperture of the first filter plate (7) is smaller than the mesh aperture of the second filter plate (10).

9. A welding system, characterized in that: The soldering system comprises the solder nozzle structure for wave soldering as claimed in claim 1.

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