Wafer automatic detection equipment for semiconductor processing

Abstract

The invention discloses wafer automatic detection equipment for semiconductor processing, and relates to the field of wafer laser detection, the wafer automatic detection equipment comprises a base and a top plate fixedly mounted at the upper end of the base, a driving motor is fixedly mounted at the upper end of the right side of the top plate, a threaded rod is fixedly mounted at the output end of the driving motor, and a wafer detection plate is placed at the upper end of the base. A movable block is installed on the surface of the threaded rod in a threaded mode, and a limiting groove is formed in the upper end of the top plate. The wafer automatic detection equipment for semiconductor processing is provided with an assembly capable of carrying out multi-position adjustment laser detection, when a wafer detection plate needs to be detected, the wafer detection plate is placed on the base, and a movable block moves left and right to drive an electric telescopic rod at the rear end to be limited by a sliding piece, so that the wafer detection plate is automatically detected. The movable angle rod moves back and forth to drive the laser detector fixedly installed on the right side of the movable angle rod, movement of the laser detector can scan and monitor the size of the wafer through the laser detector, multi-position convenient adjustment can be achieved, and use by workers is facilitated.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer detection equipment, and in particular to automatic wafer detection equipment for semiconductor processing. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Various circuit component structures can be processed and manufactured on this high-purity silicon wafer to make it an integrated circuit (IC) product with specific electrical functions.

[0003] Wafer inspection is a critical step in the semiconductor manufacturing process. Accurate measurement of wafer size is a key step in quality control. Slight deviations in size may affect the quality and performance of the final product. Detecting wafer size through laser is a high-precision and non-contact measurement method.

[0004] In the prior art, a Y-axis detection system is formed by a ring conveyor belt, which can realize automatic laser detection of the wafer product size, meet the requirements of fast measurement speed, high measurement accuracy, and multiple measurements. However, during use, if dust accumulates on the surface of the wafer being detected, the dust can easily cause deviations in the laser detection data, resulting in inaccurate detection results. At the same time, if the wafer being detected is placed at an angle, it is also easy to cause deviations in the detection results. Summary of the invention

[0005] The purpose of the present invention is to provide an automatic wafer inspection device for semiconductor processing, so as to solve the problem mentioned in the above background technology that dust can easily cause deviations in laser detection data, resulting in inaccurate detection results. At the same time, if the wafer being inspected is placed at an angle, it is also easy to cause deviations in the detection results.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solution: a wafer automatic detection device for semiconductor processing, comprising a base and a top plate fixedly mounted on the upper end of the base, a drive motor is fixedly mounted on the upper right end of the top plate, and a threaded rod is fixedly mounted on the output end of the drive motor, and a wafer detection plate is placed on the upper end of the base; A movable block is threadedly installed on the surface of the threaded rod, and a limiting groove is provided at the upper end of the top plate, and the movable block is connected to the limiting groove in a sliding manner, and a positioning detection mechanism is provided at the rear of the movable block, and the positioning detection mechanism is provided with a horizontal plate, and the horizontal plate is fixedly installed below the rear end of the top plate, and a groove is provided inside the horizontal plate, and a sliding member is slidably installed inside the horizontal plate; A friction wheel is rotatably mounted inside the base, a disc is fixedly mounted outside the friction wheel, a moving rod is fixedly mounted outside the disc, and an automatic air blowing and impurity removal mechanism is arranged on the surface of the moving rod; A positioning plate is fixedly installed at the rear end of the base, a pressure spring is fixedly installed at the upper end of the positioning plate, and an anti-tilting mechanism is arranged at the upper end of the pressure spring.

[0007] Furthermore, the movable block is in an "L" shape, a groove is provided at the rear of the movable block, and the movable block is limited inside the limiting groove.

[0008] Furthermore, an electric telescopic rod is fixedly installed on the front end of the sliding member, and a movable angle rod is fixedly installed on the front end of the electric telescopic rod, and the middle end of the movable angle rod is slidably connected to the rear end of the movable block, and a laser detector is fixedly installed on the right side of the movable angle rod, and the output end of the laser detector is aimed downward.

[0009] Furthermore, a fixing plate is fixedly installed on the upper end of the base, and a reset spring is fixedly installed on the inner side of the fixing plate, and a clamp is fixedly installed on the inner side of the reset spring, and the front end of the clamp is inclined, the clamp is arranged on the outer side of the wafer detection plate, and a first damping rod is arranged between the clamp and the fixing plate.

[0010] Furthermore, the automatic air blowing and impurity removal mechanism is provided with a push rod, and the shape of the push rod is "T"-shaped, and the upper end of the push rod is nested in the surface of the moving rod, and the lower end of the push rod is fixedly installed with a pressure plate.

[0011] Furthermore, a fixed bin is fixedly installed at the lower end of the base, and an elastic airbag is fixedly installed inside the fixed bin, and the material of the elastic airbag is elastically set, and a telescopic bellows is installed through the inside of the elastic airbag, and an air jet is installed through the upper end of the telescopic bellows, and the lower end of the air jet is fixedly installed on the upper end of the clamp, and the output end of the air jet is aligned with the surface of the wafer inspection plate.

[0012] Furthermore, the pressing plate is attached to the inner wall of the fixed bin, and the pressing plate and the elastic airbag form a pressed structure, and a one-way air inlet is installed through the lower end of the elastic airbag, and a one-way valve is arranged inside the one-way air inlet.

[0013] Furthermore, the anti-tilt mechanism is provided with a lifting plate, and the lower end of the lifting plate is fixedly mounted on the upper end of the pressure spring, and a second damping rod is provided between the lifting plate and the positioning plate.

[0014] Furthermore, a bidirectional screw is rotatably mounted on the upper end of the lifting plate, and a rotating handle is fixedly mounted on the right side of the bidirectional screw. The threads on the left and right ends of the bidirectional screw are opposite, and a support is threadedly mounted on the surface of the bidirectional screw.

[0015] Furthermore, the front end of the supporting member is located below the wafer inspection plate, a slide groove is provided at the upper end of the lifting plate, a slider is fixedly installed at the lower end of the supporting member, and the slider and the slide groove are connected in a sliding manner.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. A component capable of performing multi-position adjustable laser detection is provided. When the wafer detection plate needs to be inspected, it is placed on the base and started by the drive motor on the outer side of the upper top plate. The start of the drive motor drives the threaded rod fixedly installed at its output end to rotate. When the threaded rod rotates, it drives the movable block threadedly connected on its surface to move left and right along the limit groove. The left and right movement of the movable block drives the electric telescopic rod at the rear end to move left and right along the inside of the horizontal plate under the limit of the sliding part. The electric telescopic rod can also drive the moving angle rod forward and backward. The moving angle rod moves forward and backward to drive the laser detector fixedly installed on its right side. The movement of the laser detector can scan and monitor the size of the wafer by itself. It can be conveniently adjusted in multiple positions, which is convenient for the staff to use; Furthermore, a clamping plate capable of clamping and positioning is provided. Before the wafer needs to be inspected, it is pushed between the left and right clamping plates along the inclined position of the front end of the clamping plate. At this time, the elastic force of the reset spring on the inner side of the fixed plate is applied to the clamping plate, and the clamping plate moves inward to clamp and fix the wafer inspection plate, which is convenient for subsequent inspection. At the same time, when the wafer inspection plate is inspected, if the device shakes, it can also be buffered by the reset spring and the clamping plate. If the reset spring vibrates back and forth, the pressure is relieved through the clamping plate and the first damping rod to avoid continuous reciprocating vibration of the reset spring, so that the clamping plate drives the wafer inspection plate to maintain a centered mounting state relative to the base in a short period of time, which is beneficial for the laser detector to scan and inspect the wafer inspection plate in a static state.

[0017] 2. When inspecting the wafer, the wafer inspection plate is pushed in, and the bottom of the wafer inspection plate contacts the friction wheel, and the friction wheel is driven to rotate by the friction force. When the friction wheel rotates, the disc on its outer side is driven to rotate. When the disc rotates, the moving rod on its surface is driven, and the moving rod drives the nested push rod to move. When the bottom pressure plate is limited by the fixed bin, the push rod can move up and down. The elastic airbag is squeezed by the pressure plate moving up and down inside the fixed bin. The elastic airbag is squeezed and the air inside is transported to the air jet through the telescopic bellows. The air jet is aimed at the surface of the wafer inspection plate for blowing. Therefore, as the wafer inspection plate is pulled, air can be blown to remove impurities, which can ensure that there are no impurities on the wafer surface and effectively avoid the influence of impurities on the inspection accuracy. Furthermore, the elastic airbag is elastically set. When the pressure plate stops squeezing the elastic airbag, the elastic airbag expands due to its own elastic force. The expanded elastic airbag inhales air through a one-way air inlet set at the lower end. A one-way valve is set inside the one-way air inlet. The setting of the one-way valve makes the one-way air inlet only able to take in air but not let out air. Therefore, it can be used reciprocatingly, which improves the practicability of the device.

[0018] 3. A pressure spring and a second damping rod are arranged between the positioning plate and the lifting plate, so that the supporting part threadedly connected to the surface of the bidirectional screw can support the wafer detection plate. At the same time, the position of the supporting part can be adjusted by the rotating handle on the outside of the bidirectional screw. The supporting part can slide along the slide groove under the action of the slider, and can be adjusted to a suitable position for supporting different wafer detection plates, so as to facilitate the adjustment of the wafer detection plates to the same plane and avoid inaccurate detection data after the wafer detection plates are tilted. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the present invention; Figure 2 This is a schematic diagram of the top plate of the present invention when viewed from above; Figure 3 For the present invention Figure 2 The enlarged structural diagram at A in the middle; Figure 4 It is a schematic diagram of the three-dimensional structure of the movable block of the present invention; Figure 5 This is a schematic diagram of the three-dimensional structure of the base of the present invention from top view; Figure 6 It is a schematic diagram of the three-dimensional structure of the present invention in side section; Figure 7 It is a schematic diagram of the cross-sectional three-dimensional structure of the friction wheel of the present invention; Figure 8 This is a schematic diagram of the cross-sectional three-dimensional structure of the fixed warehouse of the present invention; Fig. 9 It is a rear-view stereoscopic structural schematic diagram of the present invention; Fig.10 It is a schematic diagram of the rear cross-sectional three-dimensional structure of the backing member of the present invention.

[0020] In the figure: 1. base; 2. top plate; 3. wafer detection plate; 4. drive motor; 5. threaded rod; 6. movable block; 7. limit groove; 8. cross plate; 9. sliding member; 10. electric telescopic rod; 11. movable angle rod; 12. laser detector; 13. fixed plate; 14. reset spring; 15. clamping plate; 16. first damping rod; 17. friction wheel; 18. disc; 19. moving rod; 20. push rod; 21. pressure plate; 22. fixed bin; 23. elastic air bag; 24. telescopic bellows; 25. jet nozzle; 26. one-way air inlet; 27. positioning plate; 28. pressure spring; 29. ​​lifting plate; 30. second damping rod; 31. two-way screw rod; 32. supporting member; 33. slider; 34. slide groove. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Embodiment 1

[0022] like Figure 1-Figure 6 The technical solution shown, in order to solve the problem of inconvenient adjustment when detecting the wafer size, discloses: a base 1 and a top plate 2 fixedly installed on the upper end of the base 1, and a driving motor 4 is fixedly installed on the upper right end of the top plate 2, and a threaded rod 5 is fixedly installed on the output end of the driving motor 4, a wafer detection plate 3 is placed on the upper end of the base 1, a movable block 6 is threadedly installed on the surface of the threaded rod 5, and a limiting groove 7 is provided at the upper end of the top plate 2, and the movable block 6 is connected to the limiting groove 7 in a sliding manner, and a positioning detection mechanism is provided at the rear of the movable block 6, and the positioning detection mechanism is provided with a cross plate 8, and the cross plate 8 is fixedly installed below the rear end of the top plate 2, and a groove is provided inside the cross plate 8, and a sliding member 9 is slidably installed inside the cross plate 8, and the shape of the movable block 6 is " The movable block 6 is L-shaped, and a groove is provided at the rear of the movable block 6, and the movable block 6 is limited inside the limiting groove 7. An electric telescopic rod 10 is fixedly installed at the front end of the sliding member 9, and a movable angle rod 11 is fixedly installed at the front end of the electric telescopic rod 10, and the middle end of the movable angle rod 11 is slidably connected with the rear end of the movable block 6, and a laser detector 12 is fixedly installed on the right side of the movable angle rod 11, and the output end of the laser detector 12 is aligned downward, a fixed plate 13 is fixedly installed at the upper end of the base 1, and a return spring 14 is fixedly installed on the inner side of the fixed plate 13, and a clamping plate 15 is fixedly installed on the inner side of the return spring 14, and the front end of the clamping plate 15 is inclined, and the clamping plate 15 is arranged on the outer side of the wafer detection plate 3, and a first damping rod 16 is arranged between the clamping plate 15 and the fixed plate 13; In the embodiment, a component capable of performing multi-position adjustable laser detection is provided. When the wafer detection plate 3 needs to be detected, it is placed on the base 1 and started by the driving motor 4 on the outer side of the upper top plate 2. The start of the driving motor 4 drives the threaded rod 5 fixedly installed on its output end to rotate. When the threaded rod 5 rotates, it drives the movable block 6 threadedly connected to it on its surface to move. The movable block 6 slides left and right along the limiting groove 7. The left and right movement of the movable block 6 drives the electric telescopic rod 10 at the rear end to move left and right along the inside of the cross plate 8 under the limitation of the sliding member 9. The electric telescopic rod 10 can also drive the moving angle rod 11 forward and backward through its own start-up. The moving angle rod 11 moves forward and backward inside the groove at the rear end of the moving block 6. The moving angle rod 11 moves forward and backward, driving the laser detector 12 fixedly installed on its right side. The movement of the laser detector 12 can scan and monitor the size of the wafer by itself, and can be conveniently adjusted in multiple positions, which is convenient for workers. The clamping plate 15 is provided for clamping and positioning. Before the wafer needs to be inspected, the wafer inspection plate 3 is pushed between the left and right clamping plates 15 along the inclined position of the front end of the clamping plate 15. At this time, the elastic force of the reset spring 14 on the inner side of the fixing plate 13 is applied to the clamping plate 15, and the clamping plate 15 moves inward to clamp and fix the wafer inspection plate 3, which is convenient for subsequent inspection. At the same time, when the wafer inspection plate 3 is inspected, if the device shakes, it can also be buffered by the reset spring 14 and the clamping plate 15. The reset spring 14 buffers it through its own elastic force. At the same time, if the reset spring 14 vibrates back and forth, the first damping rod 16 between the clamping plate 15 and the fixing plate 13 is used to release the pressure to avoid the reset spring 14 from vibrating back and forth continuously, so that the clamping plate 15 drives the wafer inspection plate 3 to maintain a centered erection state relative to the base 1 in a short time, which is beneficial for the laser detector 12 to scan and inspect the wafer inspection plate 3 in a static state. Embodiment 2

[0023] like Figure 5 , Figure 6 , Figure 7 and Figure 8The technical solution shown in the figure, in order to solve the problem that if there are many impurities on the surface of the wafer during laser detection, the detection effect is inaccurate, discloses: a friction wheel 17 is rotatably installed inside the base 1, and a disk 18 is fixedly installed on the outside of the friction wheel 17, and a moving rod 19 is fixedly installed on the outside of the disk 18, and an automatic air blowing and impurity removal mechanism is provided on the surface of the moving rod 19, and the automatic air blowing and impurity removal mechanism is provided with a push rod 20, and the shape of the push rod 20 is "T", and the upper end of the push rod 20 is nested in the surface of the moving rod 19, and the lower end of the push rod 20 is fixedly installed with a pressing plate 21, and the lower end of the base 1 is fixedly installed with a fixed The fixed bin 22 is provided with an elastic airbag 23 fixedly installed inside the fixed bin 22, and the material of the elastic airbag 23 is elastically set, and a telescopic bellows 24 is installed through the inside of the elastic airbag 23, and an air jet 25 is installed through the upper end of the telescopic bellows 24, and the lower end of the air jet 25 is fixedly installed on the upper end of the clamping plate 15, and the output end of the air jet 25 is aligned with the surface of the wafer detection plate 3, the pressing plate 21 is attached to the inner wall of the fixed bin 22, and the pressing plate 21 and the elastic airbag 23 form a pressing structure, and a one-way air inlet 26 is installed through the lower end of the elastic airbag 23, and a one-way valve is arranged inside the one-way air inlet 26; In the embodiment, when the wafer detection plate 3 is being inspected, the bottom of the wafer detection plate 3 contacts the friction wheel 17 by pushing the wafer detection plate 3 in, and the friction wheel 17 is driven to rotate by the friction force. When the friction wheel 17 rotates, the disc 18 on its outer side is driven to rotate. When the disc 18 rotates, the moving rod 19 on its surface is driven. Under the rotation of the disc 18, the moving rod 19 can drive the nested push rod 20 to move through the groove at the upper end of the push rod 20. When the bottom pressure plate 21 is limited by the fixed bin 22, the push rod 20 can move up and down along the outer opening of the fixed bin 22. The elastic airbag 23 is squeezed by the pressure plate 21 moving up and down inside the fixed bin 22, and the elastic airbag 23 is squeezed to release the air inside. The air is delivered to the air jet 25 through the telescopic bellows 24, and the air jet 25 blows toward the surface of the wafer detection plate 3. Therefore, as the wafer detection plate 3 is pulled and drawn, air can be blown to remove impurities, which can ensure that the wafer surface is free of impurities and effectively prevent the impurities from affecting the detection accuracy. The elastic airbag 23 is elastically arranged. When the pressure plate 21 rises and stops squeezing the elastic airbag 23, the elastic airbag 23 expands and resets by its own elastic force. The expanded elastic airbag 23 uses the negative pressure principle to inhale air through the one-way air inlet 26 arranged at the lower end. A one-way valve is arranged inside the one-way air inlet 26. The one-way valve is arranged so that the one-way air inlet 26 can only take in air but cannot discharge air. Therefore, it can be used in a reciprocating cycle, which improves the practicality of the device. Embodiment 3

[0024] As shown Figure 5 , Figure 6 , Fig. 9 and Fig.10 The technical solution shown, in order to solve the problem that if the wafer is tilted during detection, the detection effect may be easily deviated, discloses: a positioning plate 27 is fixedly installed at the rear end of the base 1, and a pressure spring 28 is fixedly installed at the upper end of the positioning plate 27, and an anti-tilting mechanism is arranged at the upper end of the pressure spring 28, and the anti-tilting mechanism is provided with a lifting plate 29, and the lower end of the lifting plate 29 is fixedly installed on the upper end of the pressure spring 28, and a second damping rod 30 is arranged between the lifting plate 29 and the positioning plate 27, a bidirectional screw rod 31 is rotatably installed at the upper end of the lifting plate 29, and a rotating handle is fixedly installed on the right side of the bidirectional screw rod 31, and the left and right ends of the bidirectional screw rod 31 have opposite threads, and a lining member 32 is threadedly installed on the surface of the bidirectional screw rod 31, and the front end of the lining member 32 is located below the wafer detection plate 3, and a slide groove 34 is provided at the upper end of the lifting plate 29, and a slider 33 is fixedly installed at the lower end of the lining member 32, and the slider 33 is connected to the slide groove 34 in a sliding connection; In the embodiment, a pressure spring 28 and a second damping rod 30 are provided between the positioning plate 27 and the lifting plate 29, so that the supporting member 32 threadedly connected to the surface of the bidirectional screw rod 31 can support the wafer detection plate 3. At the same time, the position of the supporting member 32 can be adjusted by the rotating handle on the outside of the bidirectional screw rod 31. The supporting member 32 can slide along the slide groove 34 under the action of the slider 33, so as to achieve the limiting effect. The appropriate position can be adjusted according to different wafer detection plates 3 for supporting, which is convenient for adjusting the wafer detection plate 3 to be in the same plane with the base 1, thereby avoiding inaccurate detection data after the wafer detection plate 3 is tilted.

[0025] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer automatic inspection device for semiconductor processing, comprising a base (1) and a top plate (2) fixedly mounted on the upper end of the base (1), wherein a drive motor (4) is fixedly mounted on the upper right end of the top plate (2), and a threaded rod (5) is fixedly mounted on the output end of the drive motor (4), and a wafer inspection plate (3) is placed on the upper end of the base (1); Features: A movable block (6) is threadedly mounted on the surface of the threaded rod (5), and a limiting groove (7) is provided at the upper end of the top plate (2), and the movable block (6) is connected to the limiting groove (7) in a sliding manner, and a positioning detection mechanism is provided at the rear of the movable block (6), and the positioning detection mechanism is provided with a horizontal plate (8), and the horizontal plate (8) is fixedly mounted below the rear end of the top plate (2), and a groove is provided inside the horizontal plate (8), and a sliding member (9) is slidably mounted inside the horizontal plate (8); A friction wheel (17) is rotatably mounted inside the base (1), a disc (18) is fixedly mounted on the outside of the friction wheel (17), a moving rod (19) is fixedly mounted on the outside of the disc (18), and an automatic air blowing and impurity removal mechanism is provided on the surface of the moving rod (19); A positioning plate (27) is fixedly mounted on the rear end of the base (1), a pressure spring (28) is fixedly mounted on the upper end of the positioning plate (27), and an anti-tilting mechanism is provided on the upper end of the pressure spring (28).

2. The automatic wafer inspection equipment for semiconductor processing according to claim 1, characterized in that: The movable block (6) is in an "L" shape, a groove is provided at the rear of the movable block (6), and the movable block (6) is limited in position within the limiting groove (7).

3. The automatic wafer inspection equipment for semiconductor processing according to claim 2, characterized in that: An electric telescopic rod (10) is fixedly mounted on the front end of the sliding member (9), and a movable angle rod (11) is fixedly mounted on the front end of the electric telescopic rod (10), and the middle end of the movable angle rod (11) is slidably connected to the rear end of the movable block (6), and a laser detector (12) is fixedly mounted on the right side of the movable angle rod (11), with the output end of the laser detector (12) directed downward.

4. The automatic wafer inspection equipment for semiconductor processing according to claim 3, characterized in that: A fixing plate (13) is fixedly mounted on the upper end of the base (1), a return spring (14) is fixedly mounted on the inner side of the fixing plate (13), a clamping plate (15) is fixedly mounted on the inner side of the return spring (14), and the front end of the clamping plate (15) is inclined. The clamping plate (15) is arranged on the outer side of the wafer detection plate (3), and a first damping rod (16) is arranged between the clamping plate (15) and the fixing plate (13).

5. The automatic wafer inspection equipment for semiconductor processing according to claim 1, characterized in that: The automatic air blowing and impurity removal mechanism is provided with a push rod (20), and the push rod (20) is in a "T" shape, and the upper end of the push rod (20) is nested in the surface of the moving rod (19), and the lower end of the push rod (20) is fixedly mounted with a pressing plate (21).

6. The automatic wafer inspection equipment for semiconductor processing according to claim 5, characterized in that: A fixed bin (22) is fixedly mounted on the lower end of the base (1), and an elastic airbag (23) is fixedly mounted inside the fixed bin (22), and the material of the elastic airbag (23) is elastically set, and a telescopic bellows (24) is installed through the inside of the elastic airbag (23), and an air jet (25) is installed through the upper end of the telescopic bellows (24), and the lower end of the air jet (25) is fixedly mounted on the upper end of the clamping plate (15), and the output end of the air jet (25) is aligned with the surface of the wafer detection plate (3).

7. The automatic wafer inspection equipment for semiconductor processing according to claim 6, characterized in that: The pressing plate (21) is fitted to the inner wall of the fixed bin (22), and the pressing plate (21) and the elastic airbag (23) form a pressed structure, and a one-way air inlet (26) is installed through the lower end of the elastic airbag (23), and a one-way valve is arranged inside the one-way air inlet (26).

8. The automatic wafer inspection equipment for semiconductor processing according to claim 1, characterized in that: The anti-tilt mechanism is provided with a lifting plate (29), and the lower end of the lifting plate (29) is fixedly mounted on the upper end of the pressure spring (28), and a second damping rod (30) is provided between the lifting plate (29) and the positioning plate (27).

9. The automatic wafer inspection equipment for semiconductor processing according to claim 8, characterized in that: A bidirectional screw rod (31) is rotatably mounted on the upper end of the lifting plate (29), and a rotating handle is fixedly mounted on the right side of the bidirectional screw rod (31). The left and right ends of the bidirectional screw rod (31) have opposite threads, and a support member (32) is threadedly mounted on the surface of the bidirectional screw rod (31).

10. The automatic wafer inspection equipment for semiconductor processing according to claim 9, characterized in that: The front end of the supporting member (32) is located below the wafer inspection plate (3), and a slide groove (34) is provided at the upper end of the lifting plate (29), and a slider (33) is fixedly mounted at the lower end of the supporting member (32), and the slider (33) and the slide groove (34) are connected in a sliding manner.

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