Server system and heat dissipation module

Abstract

The invention provides a server system and a heat dissipation module, and the server system comprises a cabinet, a plurality of servers and a heat dissipation module. The servers are arranged in the cabinet. The heat dissipation module comprises a pump assembly, a main manifold assembly, a plurality of heat exchange assemblies and a sub-manifold assembly. The pumping assembly is arranged in the cabinet. The main manifold assembly comprises a first main pipeline and a second main pipeline, the first main pipeline is connected to the main liquid outlet of the pumping assembly and the liquid inlets of the servers, and the second main pipeline is connected to the liquid outlets of the servers and the main liquid inlet of the pumping assembly. The heat exchange assemblies are detachably arranged in the cabinet. The sub-manifold assembly comprises a first sub-pipeline and a second sub-pipeline, the first sub-pipeline is connected with the sub-liquid outlets of the pumping assembly and the liquid inlets of the heat exchange assemblies, and the second sub-pipeline is connected with the liquid outlets of the heat exchange assemblies and the sub-liquid inlets of the pumping assembly. Manpower can be saved, safety specifications are met, the space utilization rate of the machine room is increased, and energy waste is reduced.

Description

Technical Field

[0001] The invention relates to a server system and a heat dissipation module. Background Art

[0002] Currently, multiple servers in server cabinets mostly use liquid cooling modules for heat dissipation. There are generally three configuration methods for this liquid cooling module, namely, the liquid cooling module is configured in an additional independent cabinet, the liquid cooling module is configured on the rear door of the server cabinet, and the liquid cooling module is configured in the server cabinet.

[0003] In the case where the liquid cooling module is configured in an additional independent cabinet, since the liquid cooling module and the servers are located in two different cabinets, the pipelines connecting the liquid cooling module and the servers cannot be pre-assembled before the two cabinets are placed in the predetermined positions in the computer room, otherwise the two cabinets will be difficult to transport. In addition, since the two cabinets must be used in groups, when the remaining space in the computer room can only accommodate one cabinet, the two cabinets that must be used in groups are difficult to be placed at the same time, resulting in idle space in the computer room that cannot be effectively utilized.

[0004] For example, if the liquid cooling module is installed at the rear door of the server cabinet, the rear door and the liquid cooling module will not only increase the overall space occupied, but also cause maintenance personnel to be in a high temperature environment behind the cabinet during maintenance, which does not meet safety regulations.

[0005] For example, when a liquid cooling module is configured in a server cabinet, since the pump, radiator and fan are integrated in the same shell and installed in the cabinet through the shell, the size of the radiator is limited by the space in the shell, resulting in insufficient heat dissipation capacity of the radiator, which in turn affects the number of servers that can be accommodated in the server cabinet. Summary of the invention

[0006] The present invention provides a server system and a heat dissipation module, which can avoid the problems derived from the configurations of the above three liquid cooling heat dissipation modules.

[0007] A server system disclosed in one embodiment of the present invention comprises a cabinet, a plurality of servers and a heat dissipation module. The servers are arranged in the cabinet and each has a liquid inlet and a liquid outlet. The heat dissipation module comprises a pump component, a main manifold component, a plurality of heat exchange components and a sub-manifold component. The pump component is arranged in the cabinet and has a main liquid inlet, a sub-liquid inlet, a main liquid outlet and a sub-liquid outlet. The main manifold component comprises a first main line and a second main line, the first main line is connected to the main liquid outlet of the pump component and the liquid inlets of the servers, and the second main line is connected to the liquid outlets of the servers and the main liquid inlet of the pump component. The heat exchange components are detachably arranged in the cabinet and each has a liquid inlet and a liquid outlet. The sub-manifold assembly includes a first sub-pipeline and a second sub-pipeline, wherein the first sub-pipeline connects the sub-liquid outlet of the pump assembly and the liquid inlets of the heat exchange assemblies, and the second sub-pipeline connects the liquid outlets of the heat exchange assemblies and the sub-liquid inlet of the pump assembly.

[0008] Another embodiment of the present invention discloses a heat dissipation module, comprising a pump component, a plurality of heat exchange components and a sub-manifold component. The pump component has a sub-liquid inlet and a sub-liquid outlet. Each of the heat exchange components has a liquid inlet and a liquid outlet. The sub-manifold component comprises a first sub-pipeline and a second sub-pipeline. The first sub-pipeline connects the sub-liquid outlet of the pump component and the liquid inlets of the heat exchange components, and the second sub-pipeline connects the liquid outlets of the heat exchange components and the sub-liquid inlet of the pump component.

[0009] A server system disclosed in another embodiment of the present invention includes a cabinet, a plurality of servers and a heat dissipation module. The cabinet has a storage space and an inner bottom surface, and the inner bottom surface is located at the bottom of the storage space. The servers are arranged in the storage space. The heat dissipation module includes a pump component and a plurality of heat exchange components. The pump component is arranged in the storage space and connected to the server. The heat exchange components are detachably arranged in the storage space and connected to the pump component. The heights of the servers, the pump component and the heat exchange components relative to the inner bottom surface are different from each other.

[0010] According to the server system and heat dissipation module disclosed in the above embodiments, by accommodating these servers and these heat exchange components in a cabinet and connecting to a pump component, the pipes between these servers, these heat exchange components and the pump component can be pre-connected when the server system is transported to a preset position in the computer room. In this way, after the server system is placed at the preset position in the computer room, it is not necessary to arrange personnel to go to the computer room to connect the pipes, thereby saving manpower. In addition, these heat exchange components and pump components are configured to be accommodated in the same cabinet as these servers, so it is convenient to configure the server system in the odd-numbered space in the computer room, thereby improving the space utilization rate of the computer room.

[0011] Furthermore, these heat exchange components and pump components are arranged inside the cabinet, rather than behind the cabinet, so that the space occupied by the overall server system will not be increased, and personnel are not required to perform maintenance operations in the higher ambient temperature area behind the cabinet.

[0012] On the other hand, the heat exchange components are modular and detachable, so the number of heat exchange components can be flexibly adjusted according to the cooling requirements of the servers in the cabinet, thereby avoiding the situation where the cooling capacity provided by these heat exchange components cannot meet the cooling requirements of these servers, or is excessively higher than the cooling requirements of these servers, causing energy waste.

[0013] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide a further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional schematic diagram of a server system disclosed according to an embodiment of the present invention.

[0015] Figure 2 for Figure 1 A three-dimensional schematic diagram of a server system from another perspective.

[0016] Figure 3 for Figure 1 A partially enlarged front view of a server system.

[0017] Figure 4 for Figure 1 A schematic diagram of the server system.

[0018] Figure 5 for Figure 1 Schematic diagram of the pump assembly.

[0019] Figure 6 for Figure 1 A three-dimensional schematic diagram of a heat exchange component.

[0020] Figure 7 for Figure 1 A three-dimensional schematic diagram of a heat exchange component from another perspective.

[0021] Description of the accompanying symbols:

[0022] 1: Server system;

[0023] 10: Cabinet;

[0024] 11: Accommodation space;

[0025] 12: inner bottom surface;

[0026] 20: server;

[0027] 21: Liquid inlet;

[0028] 22: Liquid outlet;

[0029] 23,24: connector;

[0030] 30: heat dissipation module;

[0031] 31: pump assembly;

[0032] 311: housing;

[0033] 3111: main liquid outlet;

[0034] 3112: main liquid inlet;

[0035] 3113: liquid outlet;

[0036] 3114: liquid inlet;

[0037] 312: pump unit;

[0038] 313,314: main connector;

[0039] 315,316: sub-joint;

[0040] 317: controller;

[0041] 32: heat exchange component;

[0042] 321: housing;

[0043] 322: heat exchanger;

[0044] 3221: bottom plate;

[0045] 3221a: liquid inlet;

[0046] 3221b: liquid outlet;

[0047] 3222: top plate;

[0048] 3223: connecting plate;

[0049] 3224: fin structure;

[0050] 323,324: connector;

[0051] 325: fan;

[0052] 33: Main manifold assembly;

[0053] 331: first main road;

[0054] 3311: first main component;

[0055] 3312: first main connector;

[0056] 332: second main road;

[0057] 3321: second main component;

[0058] 3322: second main connector;

[0059] 34: Sub-manifold assembly;

[0060] 341: first sub-pipeline;

[0061] 3411: first sub-tube;

[0062] 3412: first sub-joint;

[0063] 342: second sub-pipeline;

[0064] 3421: second sub-tube;

[0065] 3422: second sub-joint;

[0066] 35: pressure sensor;

[0067] 40: slide rail assembly;

[0068] 41: slide rail;

[0069] 411: first rail member;

[0070] 412: second rail member;

[0071] 413: third rail member;

[0072] W: width;

[0073] H:Height. DETAILED DESCRIPTION

[0074] See also Figures 1 to 4 . Figure 1 It is a three-dimensional schematic diagram of a server system disclosed according to an embodiment of the present invention. Figure 2 for Figure 1 A three-dimensional schematic diagram of a server system from another perspective. Figure 3 for Figure 1 A partially enlarged front view of a server system. Figure 4 for Figure 1 In order to clearly describe the connection relationship between the components of the server system, Figure 4 It is drawn only in a schematic manner. Figure 4 The positions of components in the illustration do not represent actual positions.

[0075] In this embodiment, the server system 1 includes a cabinet 10, a plurality of servers 20 and a heat dissipation module 30. In addition, the server system 1 further includes a plurality of rail assemblies 40. The heat dissipation module 30 includes a pump assembly 31, a plurality of heat exchange assemblies 32, a main manifold assembly 33 and a sub-manifold assembly 34.

[0076] The cabinet 10 has a receiving space 11 and an inner bottom surface 12, and the inner bottom surface 12 of the cabinet 10 is located at the bottom of the receiving space 11. The servers 20, the pump assembly 31, and the heat exchange assemblies 32 are located in the receiving space 11, and the heights relative to the inner bottom surface 12 are different from each other. For example, the heat exchange assemblies 32 are located between the servers 20 and the pump assembly 31, and the pump assembly 31 is closer to the inner bottom surface 12 than the heat exchange assemblies 32 and the servers 20. In other words, the heat exchange assemblies 32 are located above the pump assembly 31, and the servers 20 are located above the heat exchange assemblies 32. It should be noted that the relative positions of the pump assembly 31, the heat exchange assemblies 32, and the servers 20 are not used to limit the present invention, but can be adjusted according to needs.

[0077] Next, see Figure 4 and Figure 5 . Figure 5 for Figure 1 Schematic diagram of the pump assembly.

[0078] In this embodiment, the servers 20 are, for example but not limited to, 1U servers 20. Each of the servers 20 has a liquid inlet 21, a liquid outlet 22, and two connectors 23, 24. The two connectors 23, 24 are respectively disposed at the liquid inlet 21 and the liquid outlet 22.

[0079] The pump assembly 31 includes a housing 311, two pump units 312, two main connectors 313, 314, two sub connectors 315, 316 and a controller 317. The housing 311 has a main liquid outlet 3111, a main liquid inlet 3112, a sub liquid outlet 3113 and a sub liquid inlet 3114. The two pump units 312 are detachably disposed in the housing 311, and the two pump units 312 are connected in parallel to the main liquid outlet 3111, the main liquid inlet 3112, the sub liquid outlet 3113 and the sub liquid inlet 3114 through pipelines (not shown). The two main connectors 313, 314 are respectively disposed at the main liquid outlet 3111 and the main liquid inlet 3112, and the two sub connectors 315, 316 are respectively disposed at the sub liquid outlet 3113 and the sub liquid inlet 3114. The controller 317 is, for example, electrically connected to the two pumping units 312 .

[0080] like Figure 5As shown, the main liquid outlet 3111, the main liquid inlet 3112, the sub-liquid outlet 3113 and the sub-liquid inlet 3114 are located on the same side of the housing 311, but the present invention is not limited thereto. The positions of the main liquid outlet, the main liquid inlet, the sub-liquid outlet and the sub-liquid inlet can be adjusted as required. For example, the main liquid outlet and the main liquid inlet can be located on one side of the housing, while the sub-liquid outlet and the sub-liquid inlet can be located on the other side of the housing.

[0081] In this embodiment, one of the pump units 312 of the pump assembly 31 is, for example, a main pump unit 312 responsible for driving the coolant to flow, and the other pump unit 312 is, for example, a spare pump unit 312. When the controller 317 detects that the main pump unit 312 fails, the controller 317 activates the spare pump unit 312 to drive the coolant to flow.

[0082] It should be noted that the number of pump units 312 is not intended to limit the present invention, but can be increased or decreased according to actual needs.

[0083] The main manifold assembly 33 includes a first main line 331 and a second main line 332. The first main line 331 includes a first main part 3311 and a plurality of first main joints 3312, which are disposed on the first main part 3311. The first main joints 3312 of the first main line 331 are respectively connected to the joints 23 of the servers 20 and the main joints 313 of the pump assembly 31, so that the main liquid outlet 3111 of the pump assembly 31 is connected to the liquid inlet 21 of the servers 20 through the first main line 331. The second main line 332 includes a second main part 3321 and a plurality of second main joints 3322, which are disposed on the second main part 3321. The second main connectors 3322 of the second main line 332 are respectively connected to the connectors 24 of the servers 20 and the main connector 314 of the pump assembly 31 , so that the main liquid inlet 3112 of the pump assembly 31 is connected to the liquid outlet 22 of the servers 20 through the second main line 332 .

[0084] In this embodiment, the two main connectors 313, 314 of the pump assembly 31, the first main connectors 3312 of the first main line 331, the connectors 23, 24 of the server 20 and the second main connectors 3322 of the second main line 332 are, for example, tool-free quick-release connectors, which can improve assembly efficiency.

[0085] It should be noted that the first main pipe component 3311 of the first main pipe 331 is not limited to being connected to the liquid inlet 21 of the servers 20 and the main liquid outlet 3111 of the pump assembly 31 via a joint, and the second main pipe component 3321 of the second main pipe 332 is not limited to being connected to the liquid outlet 22 of the servers 20 and the main liquid inlet 3112 of the pump assembly 31 via a joint. In other embodiments, the first main pipe component of the first main pipe can be directly connected to the liquid inlet of the servers and the main liquid outlet of the pump assembly, and the second main pipe component of the second main pipe can be directly connected to the liquid outlet of the servers and the main liquid inlet of the pump assembly. In other words, the joint can be omitted for each server, the main joint can be omitted for the pump assembly, the first main pipe can be omitted for the first main pipe, and the second main pipe can be omitted for the second main pipe.

[0086] Next, see Figure 4 , Figure 6 , Figure 7 . Figure 6 for Figure 1 A three-dimensional schematic diagram of a heat exchange component. Figure 7 for Figure 1 A three-dimensional schematic diagram of a heat exchange component from another perspective.

[0087] In the present embodiment, each heat exchange component 32 is detachably disposed in the accommodation space 11 of the cabinet 10, for example, through a slide rail component 40. For example, the slide rail component 40 includes two slide rails 41. The two slide rails 41 are, for example but not limited to, three-section slide rails, and each slide rail 41 includes a first rail member 411, a second rail member 412, and a third rail member 413. The two first rail members 411 of the two slide rails 41 are respectively fixed to opposite sides of the cabinet 10. The second rail members 412 of the two slide rails 41 are respectively fixed to opposite sides of the heat exchange component 32, and the two second rail members 412 of the two slide rails 41 are respectively slidably disposed on the two first rail members 411 through two third rail members 413, so that the heat exchange component 32 can be detachably disposed in the accommodation space 11 of the cabinet 10.

[0088] However, each heat exchange component 32 is not limited to being detachably disposed in the accommodation space 11 of the cabinet 10 through the slide rail component 40. In other embodiments, the server system may not have a slide rail component, but instead include a plurality of support members. These support members may be L-shaped brackets, and these support members are disposed on opposite sides of the cabinet and form a plurality of assembly slides to guide the assembly or extraction of these heat exchange components. After these heat exchange components slide into these assembly slides, these heat exchange components can be fixed to these support members by screws, mechanism buckles that can be operated by hand, or hand-screwed screws to be positioned.

[0089] These heat exchange components 32 have the same structure, so only one of them is described in detail below. The heat exchange component 32 includes a shell 321, a heat exchanger 322, two joints 323, 324 and multiple fans 325. The heat exchanger 322 is located in the shell 321. The heat exchanger 322 is, for example, a water-cooled row, which includes, for example, a bottom plate 3221, a top plate 3222, multiple connecting plates 3223 and multiple fin structures 3224. The bottom plate 3221 is connected to the top plate 3222 through these connecting plates 3223 and is thermally coupled to each other, and the bottom plate 3221, the top plate 3222 and the connecting plate 3223 are all provided with a flow channel structure (not shown), and these fin structures 3224 are located between any two adjacent connecting plates 3223 and are thermally coupled to the connecting plates 3223. The width W of the heat exchanger 322 is about 530 mm, and the height H is about 4U, where 4U can be 4RU (rack unit) or 4OU (open rack unit). The bottom plate 3221 has a liquid inlet 3221a and a liquid outlet 3221b, and the liquid inlet 3221a and the liquid outlet 3221b are located on one side of the heat exchanger 322. Two joints 323 and 324 are respectively disposed at the liquid inlet 3221a and the liquid outlet 3221b. The fans 325 are located in the housing 321 and are located on the other side of the heat exchanger 322 relative to the liquid inlet 3221a and the liquid outlet 3221b.

[0090] It should be noted that the size of the heat exchanger 322 is not intended to limit the present invention, but the size of the heat exchanger can be adjusted according to actual needs. For example, the width of the heat exchanger can be adjusted accordingly according to the actual width of the cabinet, and the height of the heat exchanger can be less than 4U or greater than 4U. If a heat exchanger with a smaller height can provide the required heat dissipation capacity, using a heat exchanger with a smaller height can reduce the space it occupies in the cabinet, which is conducive to the expansion of the number of servers in the cabinet.

[0091] It should be noted that the structure of the heat exchanger 322 is merely an example and is not intended to limit the present invention. Instead, a heat exchanger with other structures may be selected according to needs.

[0092] The sub-manifold assembly 34 includes a first sub-pipeline 341 and a second sub-pipeline 342. The first sub-pipeline 341 includes a first sub-pipeline 3411 and a plurality of first sub-joints 3412, which are disposed on the first sub-pipeline 3411. The first sub-joints 3412 of the first sub-pipeline 341 are respectively assembled to the joints 323 of the heat exchangers 322 and the sub-joints 315 of the pump assembly 31, so that the sub-liquid outlet 3113 of the pump assembly 31 is connected to the liquid inlet 3221a of the heat exchangers 322 through the first sub-pipeline 341. The second sub-pipeline 342 includes a second sub-pipeline 3421 and a plurality of second sub-joints 3422, which are disposed on the second sub-pipeline 3421. The second sub-connectors 3422 of the second sub-pipeline 342 are respectively connected to the connectors 324 of the heat exchangers 322 and the sub-connectors 316 of the pump assembly 31 , so that the sub-liquid inlet 3114 of the pump assembly 31 is connected to the liquid outlet 3221 b of the heat exchangers 322 through the second sub-pipeline 342 .

[0093] In this embodiment, the two sub-connectors 315, 316 of the pump assembly 31, the first sub-connectors 3412 of the first sub-pipeline 341, the connectors 323, 324 of the heat exchanger 322 and the second sub-connectors 3422 of the second sub-pipeline 342 are, for example, tool-free quick-release connectors, which can improve assembly efficiency.

[0094] It should be noted that the first sub-pipe 3411 of the first sub-pipeline 341 is not limited to being connected to the liquid inlet 3221a of the heat exchangers 322 and the sub-liquid outlet 3113 of the pump assembly 31 via a joint, and the second sub-pipe 3421 of the second sub-pipeline 342 is not limited to being connected to the liquid outlet 3221b of the heat exchangers 322 and the sub-liquid inlet 3114 of the pump assembly 31 via a joint. In other embodiments, the first sub-pipeline of the first sub-pipeline can be directly connected to the liquid inlet of the heat exchangers and the sub-liquid outlet of the pump assembly, and the second sub-pipeline of the second sub-pipeline can be directly connected to the liquid outlet of the heat exchangers and the sub-liquid inlet of the pump assembly. In other words, the joint can be omitted for each heat exchanger, the sub-joint can be omitted for the pump assembly, the first sub-joint can be omitted for the first sub-pipeline, and the second sub-joint can be omitted for the second main pipeline.

[0095] Next, the operation process of the server system 1 will be described below. Figure 4As shown, when the main pump unit 312 in the pump assembly 31 is in operation, the coolant is driven to flow out of the pump assembly 31, and then flows into the server 20 through the first main line 331 to absorb the heat generated by the server 20. Then, the coolant that absorbs the heat generated by the server 20 flows out of the server 20, and then flows back to the pump assembly 31 through the second main line 332. Then, the main pump unit 312 in the pump assembly 31 drives the coolant to flow out of the pump assembly 31 again, and then flows into the heat exchangers 322 through the first sub-line 341 to transfer the heat absorbed by the coolant to the heat exchangers 322, so as to cool the coolant. At this time, under the operation of the fan 325, the heat absorbed by the heat exchanger 322 is dissipated by forced convection. Then, the cooled coolant flows out of the heat exchangers 322, and then flows back to the pump assembly 31 through the second sub-line 342. In this way, the main pump unit 312 continuously drives the cooling liquid to repeat the above-mentioned flow cycle, so that the server 20 can operate at an appropriate temperature.

[0096] In this embodiment, since the servers 20 and the heat exchange components 32 are housed in the cabinet 10 and connected to the pump component 31, the pipes between the servers 20, the heat exchange components 32 and the pump component 31 can be pre-connected when the server system 1 is transported to the preset position in the computer room. In this way, after the server system 1 is placed at the preset position in the computer room, it is not necessary to arrange personnel to go to the computer room to connect the pipes, thereby saving manpower. In addition, the heat exchange components 32 and the pump component 31 are arranged in the same cabinet 10 as the servers 20, so it is convenient to configure the server system 1 in the odd-shaped space in the computer room, thereby improving the space utilization rate of the computer room.

[0097] Furthermore, the heat exchange components 32 and the pump components 31 are disposed inside the cabinet 10 rather than behind the cabinet 10 , so that the space occupied by the entire server system 1 is not increased, and personnel are not required to perform maintenance operations in the higher ambient temperature area behind the cabinet 10 .

[0098] On the other hand, the heat exchange components 32 are modular and removable, so the number of heat exchange components 32 can be flexibly adjusted according to the heat dissipation requirements of the servers 20 in the cabinet 10. For example, assuming that the servers 20 currently configured in the cabinet 10 require a heat dissipation requirement of 40KW, and each of the heat exchange components 32 provides a heat dissipation capacity of 10KW, the user can configure four heat exchange components 32 in the cabinet 10 to meet the heat dissipation requirements of the servers 20. Similarly, if the servers 20 require a heat dissipation requirement of 30KW, and each of the heat exchange components 32 provides a heat dissipation capacity of 10KW, the user can configure three heat exchange components 32 in the cabinet 10 to meet the heat dissipation requirements of the servers 20. In this way, the heat exchange components 32 are modular and removable, which can avoid the heat dissipation capacity provided by the heat exchange components 32 failing to meet the heat dissipation requirements of the servers 20, or being excessively higher than the heat dissipation requirements of the servers 20, thereby causing energy waste.

[0099] In this embodiment, the pump assembly 31 is connected in parallel to the heat exchangers 322 of the heat exchange assemblies 32, but the present invention is not limited thereto. In other embodiments, the pump assembly may be connected in series to the heat exchangers of the heat exchange assemblies.

[0100] In this embodiment, if Figure 4 As shown, the heat dissipation module 30 may also include two pressure sensors 35, which are electrically connected to the controller 317 and are respectively arranged at the sub-liquid outlet 3113 and the sub-liquid inlet 3114 of the pump component 31 to sense the coolant pressure at the said locations. In this way, when the number of heat exchange components 32 is increased or decreased, the controller 317 can, for example, automatically control the pump unit 312 to adjust the flow rate of the coolant according to the difference in pressure sensed by the two pressure sensors 35, so that the coolant can flow at a preset pressure difference. It should be noted that the pressure sensor 35 is an optional component and can be selected or omitted according to needs.

[0101] In this embodiment, the controller 317 can also be electrically connected to the fans 325 of the heat exchange components 32 to adjust the rotation speed of the fans 325 according to demand, thereby adjusting the heat dissipation capacity of each heat exchange component 32. In addition, the number of fans 325 of each heat exchange component 32 is a plurality of configurations, so that when one of the fans 325 fails, other fans 325 are still running to maintain the heat dissipation capacity of each heat exchange component 32. It should be noted that the number of fans 325 can be increased or decreased according to demand.

[0102] According to the server system and heat dissipation module disclosed in the above embodiments, by accommodating these servers and these heat exchange components in a cabinet and connecting to a pump component, the pipes between these servers, these heat exchange components and the pump component can be pre-connected when the server system is transported to a preset position in the computer room. In this way, after the server system is placed at the preset position in the computer room, it is not necessary to arrange personnel to go to the computer room to connect the pipes, thereby saving manpower. In addition, these heat exchange components and pump components are configured to be accommodated in the same cabinet as these servers, so it is convenient to configure the server system in the odd-numbered space in the computer room, thereby improving the space utilization rate of the computer room.

[0103] Furthermore, these heat exchange components and pump components are arranged inside the cabinet, rather than behind the cabinet, so that the space occupied by the overall server system will not be increased, and personnel are not required to perform maintenance operations in the higher ambient temperature area behind the cabinet.

[0104] On the other hand, the heat exchange components are modular and detachable, so the number of heat exchange components can be flexibly adjusted according to the cooling requirements of the servers in the cabinet, thereby avoiding the situation where the cooling capacity provided by these heat exchange components cannot meet the cooling requirements of these servers, or is excessively higher than the cooling requirements of these servers, causing energy waste.

Claims

1. A server system, characterized in that: Include: A cabinet; A plurality of servers are disposed in the cabinet and each server has a liquid inlet and a liquid outlet; and A heat dissipation module, comprising: A pump assembly is disposed in the cabinet and has a main liquid inlet, a sub-liquid inlet, a main liquid outlet and a sub-liquid outlet; a main manifold assembly, comprising a first main line and a second main line, wherein the first main line is connected to the main liquid outlet of the pump assembly and the liquid inlets of the plurality of servers, and the second main line is connected to the liquid outlets of the plurality of servers and the main liquid inlet of the pump assembly; A plurality of heat exchange components are detachably disposed in the cabinet and each has a liquid inlet and a liquid outlet; and A sub-manifold assembly includes a first sub-pipeline and a second sub-pipeline, wherein the first sub-pipeline is connected to the sub-liquid outlet of the pump assembly and the liquid inlets of the multiple heat exchange assemblies, and the second sub-pipeline is connected to the liquid outlets of the multiple heat exchange assemblies and the sub-liquid inlet of the pump assembly.

2. The server system according to claim 1, wherein: The cabinet has a containing space and an inner bottom surface, wherein the inner bottom surface is located at the bottom of the containing space, and the servers, the pump assembly and the heat exchange assemblies are located in the containing space and have different heights relative to the inner bottom surface.

3. The server system according to claim 2, characterized in that: The plurality of heat exchange components are located between the plurality of servers and the pump component.

4. The server system according to claim 3, characterized in that: The pump component is closer to the inner bottom surface than the plurality of heat exchange components and the plurality of servers.

5. The server system according to claim 1, wherein: The heat dissipation module further includes two pressure sensors, and the two pressure sensors are respectively arranged at the sub-liquid outlet and the sub-liquid inlet of the pump component.

6. The server system according to claim 1, wherein: Each of the heat exchange components comprises a shell, a heat exchanger and a plurality of fans; in each of the heat exchange components, the heat exchanger and the plurality of fans are located inside the shell, the liquid inlet and the liquid outlet of the heat exchange component are located on one side of the heat exchanger, and the plurality of fans are located on the other side of the heat exchanger relative to the liquid inlet and the liquid outlet.

7. The server system according to claim 6, characterized in that: The heat exchanger is a water cooling row, and the height of the heat exchanger is 4U.

8. The server system according to claim 1, wherein: It further comprises a plurality of slide rail components, and the plurality of heat exchange components are detachably disposed in the cabinet through the plurality of slide rail components.

9. The server system according to claim 1, wherein: The pump assembly includes a housing and at least two pump units. The at least two pump units are detachably disposed in the housing.

10. A heat dissipation module, characterized in that: Include: A pump assembly having a liquid inlet and a liquid outlet; A plurality of heat exchange components, each having a liquid inlet and a liquid outlet; and A sub-manifold assembly includes a first sub-pipeline and a second sub-pipeline, wherein the first sub-pipeline is connected to the sub-liquid outlet of the pump assembly and the liquid inlets of the multiple heat exchange assemblies, and the second sub-pipeline is connected to the liquid outlets of the multiple heat exchange assemblies and the sub-liquid inlet of the pump assembly.

11. The heat dissipation module according to claim 10, characterized in that: Each of the heat exchange components comprises a shell, a heat exchanger and a plurality of fans; in each of the heat exchange components, the heat exchanger and the plurality of fans are located inside the shell, the liquid inlet and the liquid outlet are located on one side of the heat exchanger, and the plurality of fans are located on the other side of the heat exchanger relative to the liquid inlet and the liquid outlet.

12. The heat dissipation module according to claim 11, characterized in that: The heat exchanger is a water-cooled row.

13. The heat dissipation module according to claim 11, characterized in that: The heat exchanger has a height of 4U.

14. The heat dissipation module according to claim 10, characterized in that: It further comprises two pressure sensors, which are respectively disposed at the sub-liquid outlet and the sub-liquid inlet of the pump component.

15. The heat dissipation module according to claim 10, characterized in that: The pump assembly includes a housing and at least two pump units. The at least two pump units are detachably disposed in the housing.

16. A server system, characterized in that: Include: A cabinet having a containing space and an inner bottom surface, wherein the inner bottom surface is located at the bottom of the containing space; A plurality of servers are arranged in the accommodation space; and A heat dissipation module, comprising: A pump assembly is disposed in the accommodating space and is connected to the plurality of servers; as well as A plurality of heat exchange components are detachably disposed in the accommodating space and are connected to the pump component; The heights of the servers, the pump assembly, and the heat exchange assemblies relative to the inner bottom surface are different from each other.

17. The server system according to claim 16, wherein: The plurality of heat exchange components are located between the plurality of servers and the pump component.

18. The server system according to claim 17, wherein: The pump component is closer to the inner bottom surface than the plurality of heat exchange components and the plurality of servers.

19. The server system according to claim 16, wherein: Each of the heat exchange components comprises a shell, a heat exchanger and a plurality of fans; in each of the heat exchange components, the heat exchanger and the plurality of fans are located inside the shell, the heat exchanger has a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet of the heat exchanger are located on one side of the heat exchanger, and the plurality of fans are located on the other side of the heat exchanger relative to the liquid inlet and the liquid outlet.

20. The server system according to claim 19, wherein: The heat exchanger is a water cooling row, and the height of the heat exchanger is 4U.

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