Computer operation stability test system

Abstract

The invention relates to a computer operation stability test system applied to the field of electronic digital data processing, which comprises a computer body, and adopts the cooperation of a limit heat dissipation acquisition unit, a heat dissipation power regulation and control unit and a gap adjustment assembly, and the heat dissipation power can be regulated and controlled through the synergistic effect of the gap adjustment assembly and a radiator. According to the method, heat dissipation in the running process of the CPU is tested, data are collected, collaborative data of heat dissipation gaps of a radiator and heat dissipation power regulation and control of a heat dissipation system under different running load states of the CPU are obtained through testing, then heat dissipation modes suitable for different running loads of the CPU are obtained through testing, and an accurate testing result is formed. And in the subsequent actual application process of the computer body, applicable heat dissipation regulation and control can be carried out according to the operation load change of the CPU, and the operation stability and safety of the computer body in the actual application process are effectively guaranteed.

Description

Technical Field

[0001] The present invention relates to a test system, in particular to a computer operation stability test system applied to the field of electronic digital data processing. Background Art

[0002] Computer operation stability is the characteristic of a system being able to run continuously under a specific environment and load without serious failures, crashes or abnormal behaviors. The factors affecting computer operation stability mainly include hardware factors, software factors, network factors and configuration operations. In the architecture of hardware factors and software factors, CPU and memory are the cornerstones of system performance.

[0003] Running stability tests not only helps us find potential hardware problems, but also helps IT professionals perform regular checks and maintenance on the system. This type of testing can verify the reliability of the system over a long period of time, which is especially important for servers, workstations, and high-performance computing environments. It ensures that the system can maintain high efficiency during peak hours and avoid data loss and service interruptions caused by system crashes.

[0004] In the actual operating environment, the temperature control of the CPU and the efficiency of the cooling system are also crucial to maintaining the stable operation of the computer. Unfortunately, the fin structure of the heat sink directly used for CPU cooling in the existing cooling system is fixed and cannot be adaptively adjusted according to the different cooling requirements of the CPU, resulting in the cooling efficiency not reaching the optimal state. Therefore, how to test the effect of the cooling system working with it under different CPU operating performance requirements to ensure the stability of the computer in actual operation has become one of the key issues that need to be solved in the current technological development. Summary of the invention

[0005] In view of the above-mentioned prior art, the technical problem to be solved by the present invention is how to test the effect of the cooling system and its coordinated work under different CPU operating performance requirements to ensure the stability of the computer in actual operation.

[0006] In order to solve the above problems, the present invention provides a computer operation stability testing system, comprising a computer body, a mainboard is fixedly installed in the computer body, a CPU processor is fixedly installed on the left side of the mainboard, a radiator matched with the CPU processor is fixedly installed on the left side of the mainboard, and a plurality of gap adjustment components are arranged on the radiator; The CPU processor is equipped with a test control processing unit, the input end of which is connected to a chassis temperature acquisition unit, an operation status acquisition unit, a heat dissipation power acquisition unit, a limit heat dissipation acquisition unit and a test instruction receiving unit, and the output end of the test control processing unit is connected to a CPU load control unit, a heat dissipation power control unit and a test result transmission unit; The input end of the chassis temperature acquisition unit is connected to the temperature sensor signal arranged in the computer body, the input end of the operation status acquisition unit is connected to the CPU processor signal, the input end of the heat dissipation power acquisition unit is connected to the heat dissipation system signal, the input end of the extreme heat dissipation acquisition unit is connected to the gap adjustment component signal, and the input end of the test instruction receiving unit is connected to the data input port signal arranged on the computer body; The output end of the CPU load control unit is connected to the data input port signal of the CPU processor, the input end of the heat dissipation power control unit is connected to the heat dissipation system signal set in the computer body, and the output end of the test result transmission unit is connected to the data output port signal set on the computer body.

[0007] In the above-mentioned computer operation stability test system, through the synergistic effect of the gap adjustment component and the radiator, the test obtains the coordinated data of the radiator heat dissipation gap and the heat dissipation power of the heat dissipation system under different operating load conditions of the CPU processor, and then the heat dissipation method suitable for the CPU processor under different operating loads can be effectively obtained through the test, forming accurate test results, and effectively promoting the heat dissipation efficiency and heat dissipation effect in the subsequent computer body application process.

[0008] As a supplement to the present application, the radiator includes a heat conducting sheet fixedly mounted on the mainboard and located on the left side of the CPU processor, and the heat conducting sheet and the CPU processor are in contact, a heat conducting pipe group is fixedly connected to the left end of the heat conducting sheet, and a plurality of radiator fins are slidably connected to the heat conducting pipe group; The gap adjustment component includes an isolation ring fixedly connected between two adjacent radiator fins, and the isolation ring is slidably sleeved on the outer end of the heat conduction pipe group, and a heat dissipation isolation cavity is opened in the isolation ring; The inner walls on both sides of the heat dissipation isolation cavity are fixedly connected with limit trigger rods, and the limit trigger rods at corresponding positions on the left and right sides are used in coordination, and the input end of the limit heat dissipation collection unit is connected to the limit trigger rod signal.

[0009] As a supplement to the present application, an isolation drive bar is fixedly connected between the inner walls on the left and right sides of the heat dissipation isolation cavity. The isolation drive bar is made of a composite of multiple memory metal wires, and the deformation direction of the isolation drive bar is left and right.

[0010] As a further improvement of the present application, a discrete spring mounted on the outside of the limit trigger rod is fixedly connected between the left and right inner walls of the heat dissipation isolation cavity, and the discrete spring remains in an extended state when not subject to external force, and maintains the maximum gap between two adjacent radiator fins through the cooperation of the isolation ring and the isolation drive strip.

[0011] As a further improvement of the present application, a positioning plate is fixedly connected to the left end of the heat pipe group, and the radiator fin located on the leftmost side of the heat pipe group is fixedly connected to the positioning plate.

[0012] As a further improvement of the present application, the right end of the heat pipe group is fixedly connected to a limiting plate, and the left end of the limiting plate is embedded with an abutting conductive plate. The input end of the test and control processing unit is also connected to a heat dissipation position acquisition unit, and the input end of the heat dissipation position acquisition unit is connected to the abutting conductive plate signal.

[0013] As another improvement of the present application, the right end of the heat pipe group is fixedly connected to a limiting plate, the left end of the limiting plate is fixedly connected to a magnetic isolation push sleeve that is slidably mounted on the outer end of the heat pipe group, the left end of the magnetic isolation push sleeve is fixedly connected to a magnetic isolation push plate that is slidably mounted on the outer end of the heat pipe group, and the magnetic isolation push plate is fixedly connected to the radiator fin located on the far right.

[0014] As another improvement supplement of the present application, an electromagnetic control cavity is opened in the magnetic isolation push sleeve, and the inner wall of the electromagnetic control cavity is coated with a magnetic isolation coating, and the left and right inner walls of the electromagnetic control cavity are fixedly connected with electromagnetic verification rings, and the output end of the test control processing unit is also connected to the heat dissipation control verification unit, and the output end of the heat dissipation control verification unit is connected to the electromagnetic verification ring signal.

[0015] In summary, through the cooperation of the extreme heat dissipation acquisition unit, the heat dissipation power control unit and the gap adjustment component, on the one hand, various tests on the computing performance of the CPU processor can be effectively realized to ensure the stability of the CPU processor during the operation of the computer body; on the other hand, through the synergy of the gap adjustment component and the radiator, the heat dissipation during the operation of the CPU processor can be tested and data collected, as well as the coordinated data of the heat dissipation gap of the radiator and the heat dissipation power control of the heat dissipation system under different operating loads of the CPU processor can be obtained through testing, and then the heat dissipation method suitable for the CPU processor under different operating loads can be obtained through testing to form accurate test results, and in the subsequent actual application of the computer body, according to the changes in the computing load of the CPU processor, applicable heat dissipation regulation can be performed, effectively promoting the heat dissipation effect of the heat dissipation system on the CPU processor in the actual application process, avoiding the accumulation of heat on the CPU processor, reducing the thermal damage of the CPU processor during operation, and effectively ensuring the operation stability and safety of the computer body during the actual application process. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Axonometric diagram of the computer body of the first to third embodiments of the present application; Figure 2 This is a control logic diagram of a computer operation stability test system according to the first to third embodiments of the present application; Figure 3 This is an axonometric diagram of the heat sink of the first to third embodiments of the present application being arranged on the mainboard; Figure 4It is an axonometric cross-sectional view of the CPU processor at normal temperature of the first and second embodiments of the present application; Figure 5 This is a front cross-sectional view of the CPU processor and the gap adjustment assembly at normal temperature according to the first and second embodiments of the present application; Figure 6 For the first and second embodiments of this application Figure 5 The enlarged cross-sectional view of the part at A in the middle; Figure 7 It is an axonometric cross-sectional view of the CPU processor when overheating in the first and second embodiments of the present application; Figure 8 This is a front cross-sectional view of the CPU processor overheating and the gap adjustment component in the first and second embodiments of the present application; Fig. 9 For the first and second embodiments of this application Figure 8 The enlarged cross-sectional view of the part at B in the middle; Fig.10 This is a diagram of the internal heat dissipation state of the computer body according to the first to third embodiments of the present application; Fig.11 This is a front view of the magnetic push sleeve of the CPU processor at normal temperature according to the third embodiment of the present application; Fig.12 This is the main view of the magnetic isolation push sleeve when the verification action is generated in the third embodiment of the present application.

[0017] Description of the numbers in the figure: 1 computer body, 11 motherboard, 2 CPU processor, 3 cooling system, 4 gap adjustment component, 41 isolation ring, 42 heat isolation cavity, 43 isolation drive bar, 44 limit trigger rod, 45 discrete spring, 5 radiator, 51 heat conductive sheet, 52 heat conductive pipe group, 53 radiator fin, 6 positioning sheet, 7 limit sheet, 71 magnetic isolation push sleeve, 72 magnetic isolation push plate. DETAILED DESCRIPTION

[0018] The following is a detailed description of three implementation methods of the present application in conjunction with the accompanying drawings.

[0019] The first implementation method: Figure 1 - Fig.10 The computer operation stability test system is shown, which includes a computer body 1, a mainboard 11 is fixedly installed in the computer body 1, a CPU processor 2 is fixedly installed on the left side of the mainboard 11, a heat sink 5 matched with the CPU processor 2 is fixedly installed on the left side of the mainboard 11, and a plurality of gap adjustment components 4 are arranged on the heat sink 5; The CPU processor 2 is equipped with a test control processing unit, the input end of which is connected to a chassis temperature acquisition unit, an operation status acquisition unit, a heat dissipation power acquisition unit, a limit heat dissipation acquisition unit and a test instruction receiving unit, and the output end of the test control processing unit is connected to a CPU load control unit, a heat dissipation power control unit and a test result transmission unit; The input end of the chassis temperature acquisition unit is connected to the temperature sensor signal arranged in the computer body 1, the input end of the operation status acquisition unit is connected to the CPU processor 2, the input end of the heat dissipation power acquisition unit is connected to the heat dissipation system 3, the input end of the extreme heat dissipation acquisition unit is connected to the gap adjustment component 4, and the input end of the test instruction receiving unit is connected to the data input port arranged on the computer body 1; The output end of the CPU load control unit is connected to the data input port signal of the CPU processor 2, the input end of the heat dissipation power control unit is connected to the heat dissipation system 3 set in the computer body 1, and the output end of the test result transmission unit is connected to the data output port signal set on the computer body 1. Through the cooperation of the extreme heat dissipation acquisition unit, the heat dissipation power control unit and the gap adjustment component 4, on the one hand, various tests on the computing performance of the CPU processor 2 can be effectively implemented to ensure the stability of the CPU processor 2 during the operation of the computer body 1. On the other hand, through the synergistic effect of the gap adjustment component 4 and the radiator 5, the heat dissipation of the CPU processor 2 during operation can be tested and data collected. And the test obtains the coordinated data of the heat dissipation gap of the radiator 5 and the heat dissipation power regulation of the heat dissipation system 3 under different operating load conditions of the CPU processor 2, and then obtains the heat dissipation method suitable for the CPU processor 2 under different operating loads through the test, to form an accurate test result, and can perform applicable heat dissipation regulation according to the change of the computing load of the CPU processor 2 during the subsequent actual application of the computer body 1, effectively promote the heat dissipation effect of the heat dissipation system 3 on the CPU processor 2 during the actual application process, avoid the accumulation of heat on the CPU processor 2, reduce the thermal damage of the CPU processor 2 during operation, and effectively ensure the operation stability and safety of the computer body 1 during the actual application process.

[0020] It should be noted that the heat dissipation system 3 is a prior art, and the heat dissipation system 3 is composed of a plurality of heat dissipation fans. Those skilled in the art can select a suitable number of heat dissipation fans and install them at suitable positions of the computer body 1 according to the actual needs of the computer body 1. Generally, the heat dissipation direction in the computer body 1 follows a heat dissipation and ventilation method of front-to-back and bottom-in-top-out. Therefore, the heat dissipation fan can be set at the front end, rear end, upper end and lower end of the computer body 1, and a heat dissipation fan is also set at the front end or rear end of the radiator 5, which can promote the heat dissipation effect of the radiator 5. The specific installation situation and installation data are set according to the actual situation of the computer body 1 and will not be elaborated here.

[0021] Figure 4 - Fig. 9 The heat sink 5 is shown to include a heat conducting sheet 51 fixedly mounted on the mainboard 11 and located on the left side of the CPU processor 2, and the heat conducting sheet 51 is in contact with the CPU processor 2. A thermal grease layer may be coated between the CPU processor 2 and the heat conducting sheet 51 to promote heat conduction, so that the temperature on the CPU processor 2 can be effectively transferred to the heat sink 5. A heat conducting pipe group 52 is fixedly connected to the left end of the heat conducting sheet 51, and a plurality of heat sink fins 53 are slidably connected to the heat conducting pipe group 52. The gap adjustment assembly 4 includes an isolation ring 41 fixedly connected between two adjacent radiator fins 53, and the isolation ring 41 is slidably sleeved on the outer end of the heat pipe group 52, and a heat dissipation isolation cavity 42 is opened in the isolation ring 41; The inner walls on both sides of the heat dissipation isolation cavity 42 are fixedly connected with limit trigger rods 44, and the limit trigger rods 44 at corresponding positions on the left and right sides are used in coordination. The input end of the limit heat dissipation acquisition unit is connected to the limit trigger rod 44 signal. Through the coordination of the limit trigger rod 44 and the limit heat dissipation acquisition unit, the overheating state of the CPU processor 2 can be effectively monitored, and the physical image data of the CPU processor 2 in the test process can be fed back to the test control processing unit in time, so as to effectively realize the test control processing unit to collect data on both the computing power and computing performance of the CPU processor 2, improve the judgment accuracy of the computing performance of the CPU processor 2, and facilitate the subsequent improvement and protection of the computer body 1. In addition, through the thermal contraction effect of the gap adjustment component 4, when an overheating trigger is generated, the gap adjustment component 4 can be used to drive the reduction of the heat dissipation gap between the radiator fins 53, thereby promoting the heat conduction efficiency and improving the heat dissipation system 3 to the CPU The heat dissipation effect of the processor 2 can effectively feedback the synergistic effect of the CPU processor 2 and the heat dissipation system 3 to the test and control processing unit, further increase the comparability of the test data, realize all-round testing of the computer body 1, and effectively reflect the operating status of the computer body 1 in the actual application process, so as to promote the subsequent upgrade of the computer body 1 and the role of operation protection. In addition, through the cooperation of the discrete spring 45 and the limit trigger rod 44, the minimum contraction value of the isolation ring 41 can be effectively limited, thereby avoiding the excessive temperature deformation of the isolation drive bar 43, which makes the gap between the two adjacent radiator fins 53 too small, thereby causing the air flow rate to be too low, resulting in a negative feedback of the heat dissipation efficiency, thereby ensuring the effectiveness of heat dissipation while assisting the system test to obtain the optimal heat dissipation gap that meets the different computing requirements of the CPU processor 2, so as to promote the synergistic effect between the CPU processor 2 and the radiator 5 in the subsequent actual application process.

[0022] Figure 4 - Fig. 9It is shown that an isolation drive strip 43 is fixedly connected between the inner walls on the left and right sides of the heat dissipation isolation cavity 42. The isolation drive strip 43 is made of a composite of multi-segment memory metal wires and can produce corresponding thermal contraction effects in different temperature ranges. The deformation direction of the isolation drive strip 43 is the left and right direction. The setting of the isolation drive strip 43 can achieve the effect of thermal contraction deformation of the isolation ring 41 under the heat conduction effect of the radiator 5 when the CPU processor 2 is overheated, and can promptly produce a recovery deformation effect after the subsequent heat dissipation effect of the heat dissipation system 3 is effective, which can trigger and cut off the two-way data transmission of deformation, facilitate the effectiveness test of the synergistic effect of the CPU processor 2 and the heat dissipation system 3, fit the full data test collection of the actual operation of the computer body 1, and improve the reliability of the test results.

[0023] Figure 4 - Fig. 9 It is shown that a discrete spring 45 is fixedly connected between the left and right inner walls of the heat dissipation isolation cavity 42 and is mounted on the outside of the limit trigger rod 44. The discrete spring 45 remains in an extended state when not subjected to external force, and the cooperation between the isolation ring 41 and the isolation drive bar 43 drives the two adjacent heat sink fins 53 to maintain the maximum gap. The setting of the discrete spring 45 can effectively assist the isolation drive bar 43 in driving the isolation ring 41 to produce a restoring deformation effect, thereby improving the feedback rate after the heat dissipation effectiveness, being able to timely feedback the heat dissipation effectiveness data, and improving the accuracy of the test results, so as to facilitate the subsequent update and upgrade, and ensure the subsequent computer body 1 The operation stability during actual application is improved, the overheating damage of the CPU processor 2 is reduced, and the isolation elongation effect can be maintained through the cooperation of the discrete spring 45 and the isolation drive bar 43, so that the two adjacent radiator fins 53 have a maximum heat dissipation gap in the initial state, and then when temperature-sensitive deformation occurs or when no temperature-sensitive deformation occurs, the heat dissipation efficiency data can be effectively fed back and recorded, and the effect of testing the heat dissipation gap is effectively achieved, thereby realizing the applicability synergy of the heat dissipation system for the CPU processor 2 with different operating requirements, and promoting the stability of the computer body 1 in subsequent actual applications.

[0024] Figure 3 - Fig.10 It is shown that a positioning piece 6 is fixedly connected to the left end of the heat pipe group 52, and the radiator fin 53 located on the leftmost side of the heat pipe group 52 is fixedly connected to the positioning piece 6. The setting of the positioning piece 6 can effectively ensure that the direction of the gap change of the radiator fin 53 is limited during the process of the gap adjustment component 4 adjusting the gap of the radiator fin 53, so that the radiator fin 53 can effectively cooperate with the heat dissipation system 3 to ensure the heat dissipation effect of the heat dissipation system 3, and can also effectively avoid damage to other electrical components on the mainboard 11 when the gap of the radiator fin 53 changes, thereby ensuring the safety of the computer body 1.

[0025] Figure 1 - Fig.10 It is shown that when the operation stability test of the computer body 1 is performed, the technician sends a test instruction to the test instruction receiving unit through the data input port set on the computer body 1, the test control processing unit receives the unit test start instruction through the test instruction receiving unit, and then sends the calculation control data to the CPU load control unit, and transmits different calculation amounts to the CPU processor 2 through the data input port set on the CPU processor 2, and then the CPU processor 2 processes the received calculation amount, the operation status acquisition unit collects the status of the CPU processor 2 processing different calculation amount data, and then transmits it to the test control processing unit, so that the test control processing unit can effectively judge the operation speed of the CPU processor 2 and the effectiveness of the calculation processing. At the same time, the temperature sensor located in the computer body 1 transmits the temperature data in the computer body 1 to the chassis temperature acquisition unit, and the test control processing unit can effectively obtain the operation environment data of the CPU processor 2.

[0026] When the amount of computing of the CPU processor 2 is normal, its heat dissipation is not large. Therefore, at this time, the temperature transferred from the heat conductive sheet 51 and the heat conductive pipe group 52 to the heat sink fins 53 can effectively promote the heat dissipation of the CPU processor 2 by means of natural heat dissipation, and cannot reach the thermal deformation temperature of the isolation drive bar 43. Therefore, at this time, the isolation ring 41 remains in an elongated state under the elastic action of the discrete spring 45, limiting the gap between two adjacent heat sink fins 53 to maintain a maximum value. Then, as the amount of computing of the CPU processor 2 continues to increase, the excessive computing load will cause the CPU processor 2 to produce an appearance of temperature rise. The heat conductive sheet 51 and the heat conductive pipe group 52 can conduct the heat generated by the CPU processor 2 to the heat sink fins 53, which cannot be effectively dissipated by means of natural heat dissipation, causing the heat to accumulate on the heat sink fins 53 and be transferred to the isolation drive bar 43 through the isolation ring 41. After the temperature reaches the thermal deformation temperature of the isolation drive bar 43, the isolation drive bar 43 produces thermal contraction deformation, and drives the isolation ring 41 and The discrete springs 45 produce synchronous contraction, continuously reducing the gap between the two adjacent radiator fins 53, and due to the fixed limit of the positioning plate 6, the radiator fins 53 all produce the movement of moving toward the left side to contract the gap, which not only promotes the efficiency of heat conduction, avoids the accumulation of heat on the CPU processor 2, and protects the operating safety of the CPU processor 2, but also effectively ensures the positional relationship between the radiator fins 53 and the heat dissipation system 3, and ensures the effect of subsequent heat dissipation synergy. After the isolation drive bar 43 is fully contracted, the extreme trigger rods 44 on the left and right sides are abutted to trigger the extreme heat dissipation acquisition unit. The test control processing unit obtains the state of heat generation of the CPU processor 2 at the computing amount by calculating the trigger data transmitted by the heat dissipation acquisition unit, and in this process, the test control processing unit can obtain the real-time data of temperature changes in the computer body 1 through the chassis temperature acquisition unit, which can effectively assist the test control processing unit in judging the temperature change data of the CPU processor 2 in the process of processing different computing amount data.

[0027] Then the test control processing unit sends a control instruction to the heat dissipation power control unit, so that the heat dissipation control unit sends a control instruction to the heat dissipation system 3, and adjusts the heat dissipation power of the heat dissipation system 3 in stages. As the heat dissipation system 3 promotes the heat dissipation effect, the temperature inside the computer body 1 will continue to decrease. While the test control processing unit obtains the heat dissipation effect of the heat dissipation system 3 on the inside of the computer body 1 under different powers according to the chassis acquisition unit, as the heat dissipation efficiency continues to increase, the temperature on the radiator fins 53 gradually decreases, thereby causing the temperature of the isolation drive bar 43 to gradually recover, resulting in a recovery deformation, and then the isolation drive bar 43 recovers the deformation and Under the elastic recovery action of the discrete spring 45, the isolation ring 41 is driven to stretch, so that the gap between the two adjacent radiator fins 53 continues to increase. After the isolation ring 41 is stretched and deformed, the left and right extreme trigger rods 44 are separated. The test and control processing unit can obtain the disconnection data transmitted by the extreme heat dissipation acquisition unit at this time, and then based on the heat dissipation power of the heat dissipation system 3 at this time transmitted by the heat dissipation power acquisition unit, the test and control processing unit can effectively judge the collaborative data between the heat dissipation system 3 and the CPU processor 2 based on the acquired data, and judge the actual heat dissipation effect of the heat dissipation system 3 during the operation of the CPU processor 2.

[0028] Furthermore, after the test control processing unit receives the disconnection data transmitted by the extreme heat dissipation acquisition unit, the heat dissipation power of the heat dissipation system 3 at this time is maintained through the heat dissipation power control unit, and then the calculation control is re-issued to the data input port of the CPU processor 2 through the CPU load control unit, and then the data feedback is fed back through the isolation drive bar 43 and the extreme heat dissipation acquisition unit, so as to judge the effectiveness of the heat dissipation effect of the heat dissipation system 3 when the heat dissipation system 3 is kept in a high power operation state and the CPU processor 2 is in a large amount of calculation and generates the image of temperature rise; when the chassis temperature acquisition unit transmits to the test control processing unit that the temperature inside the computer body 1 has an increasing trend, but the test control processing unit does not receive the trigger data sent by the extreme heat dissipation acquisition unit, it is judged that the heat dissipation power of the heat dissipation system 3 at this time is in the effective maximum value range; then, the test control processing unit re-uses the heat dissipation power of the heat dissipation system 3 through the heat dissipation power control unit to continuously reduce the heat dissipation power of the heat dissipation system 3, and after obtaining the upward trend of the chassis temperature and the extreme heat dissipation acquisition unit is triggered, the effective minimum value of the heat dissipation power of the heat dissipation system 3 is obtained through the data transmitted by the heat dissipation power acquisition unit; When the chassis temperature acquisition unit transmits to the test control processing unit that the temperature inside the computer body 1 has an increasing trend, and at the same time the test control processing unit receives the trigger data sent by the extreme heat dissipation acquisition unit, the test control processing unit determines that the heat dissipation power of the heat dissipation system 3 is the minimum value at this time, and continues to increase the heat dissipation power of the heat dissipation system 3 through the heat dissipation power control unit, and repeats the calculation and control, so as to test and obtain the maximum value of the effective power of the heat dissipation effect of the heat dissipation system 3 when the CPU processor 2 is in a large amount of calculation and generates an image of temperature rise; after the heat dissipation power control unit controls the heat dissipation system 3 to the maximum power, when it still receives the trigger data transmitted by the extreme heat dissipation acquisition unit, it is determined that the heat dissipation system 3 at this time cannot be effectively adapted to the CPU processor 2, and the test control processing unit no longer issues a control instruction to the heat dissipation power control unit; Finally, the test control processing unit analyzes and processes the test data of the computer body 1 according to the running data of the CPU processor 2, the initial temperature data in the computer body 1, and the heat dissipation coordination data between the heat dissipation system 3 and the CPU processor 2, and transmits the computing demand data of the CPU processor 2, the adaptability data of the heat dissipation system 3, and the heat dissipation power effective range data of the heat dissipation system 3 to the test result transmission unit, so that the test result transmission unit feeds back the test data of the computer body 1 to the technician through the data output port of the computer body 1, which can effectively assist the test personnel to obtain the coordinated effect of the CPU processor 2 and the heat dissipation system 3 during the actual operation of the computer body 1, so as to ensure the computer body 1 is running smoothly. The operation stability and safety of the computer body 1 in the subsequent application process can be improved, and then in the subsequent application process of the computer body 1, a suitable heat dissipation system 3 can be effectively selected, and a suitable heat dissipation power can be set, while ensuring the operation stability of the computer body 1, reducing the energy loss during the operation of the computer body 1. In the computer body 1 with intelligent regulation, the floating heat dissipation regulation function of the heat dissipation system 3 can be set, and the heat dissipation system 3 can be regulated to function under effective power according to the computing load state of the CPU processor 2, thereby ensuring the effectiveness of heat dissipation, maintaining the stability of the operating temperature of the CPU processor 2, avoiding overheating of the CPU processor 2, and reducing damage to the CPU processor 2.

[0029] Furthermore, in the subsequent actual application process of the computer body 1, according to the CPU processor 2 with different application requirements, when the CPU processor 2 runs at the maximum load according to the test data, the heat dissipation system 3 can meet the low energy consumption requirement while meeting the effective gap between the two adjacent radiator fins 53 with the best heat dissipation efficiency for the heat accumulation generated by the maximum load. Then, according to the gap data, the radiator 5 with the heat dissipation gap is manufactured to ensure that the heat dissipation requirements under different load requirements are effectively met during the actual application of the CPU processor 2, and the operation safety and stability of the CPU processor 2 are guaranteed. By analogy, according to the maximum operating load of the CPU processor 2 with different computing burdens, while the heat dissipation system 3 meets the low energy consumption requirement, the radiator 5 with different heat dissipation gap specifications can be matched to ensure the effectiveness of the computer body 1 in the actual application process. On the one hand, the multi-specification of the computer body 1 is realized, and on the other hand, the efficient synergy of the heat dissipation system 3 and the CPU processor 2 is realized. By testing the data of the gap between the two adjacent radiator fins 53 on the radiator 5 and cooperating with the effective application of the cooling fan, the subsequent multi-specification production and application of the radiator 5 is realized to meet different heat dissipation synergy requirements, meet different market requirements, and promote the economic benefits of the application of the heat dissipation system in the computer body 1.

[0030] Second implementation method: Figure 1 - Fig.10 A computer operation stability test system is shown as a further improvement of the first embodiment, which promotes its functionality and optional specifications to meet different market needs. The right end of the heat pipe group 52 is fixedly connected to a limit plate 7, and the left end of the limit plate 7 is embedded with an abutting conductive plate. The input end of the test and control processing unit is also connected to a heat dissipation position acquisition unit, and the input end of the heat dissipation position acquisition unit is connected to the abutting conductive plate signal. The setting of the limit plate 7 and the abutting conductive plate can effectively provide data feedback on the gap reset state of the radiator fin 53, and realize the effect monitoring of the coordinated work of the CPU processor 2, the heat dissipation system 3 and the heat sink 5, thereby effectively ensuring the effect of the heat dissipation system 3 on the CPU processor 2, and can effectively obtain specific coordinated data, which is convenient for subsequent parameter setting in the actual application process of the computer body 1, so as to ensure the operation stability and safety of the computer body 1, and can also effectively promote the automation and intelligence of the operation guarantee process of the computer body 1, promote the functionality of the computer body 1, and improve the economic benefits of the computer body 1.

[0031] Figure 1 - Fig.10It is shown that when the computer body 1 starts to test and run, since the temperature in the computer body 1 has not reached the temperature of thermal deformation of the isolation drive strip 43, the radiator fin 53 is kept in the maximum gap state through the isolation ring 41. At this time, the radiator fin 53 located on the far right abuts against the limit plate 7, which can squeeze the abutting conductive plate on the limit plate 7, so that the heat dissipation position acquisition unit can effectively transmit the validity of the initial state of the radiator fin 53 to the test control processing unit, and subsequently as the amount of calculation in the CPU processor 2 continues to increase, causing the temperature of the radiator fin 53 to change, or the heat dissipation system 3 takes effect, promoting the isolation drive strip 43 to recover the deformation, causing the test control processing unit to control the isolation drive strip 43. The data between the untriggered and the non-conductive abutting conductive piece can be received and judged, and the effectiveness of the effect on the isolation drive strip 43 during the temperature change on the CPU processor 2 can be effectively judged according to the transmission of the next-level trigger data, and the effectiveness of the heat dissipation data regulation when the subsequent heat dissipation system 3 and the CPU processor 2 work together can be effectively judged, so as to ensure the effectiveness and reference of the subsequent test results. It can also judge the heating rate of the CPU processor 2 and the heat dissipation efficiency of the heat dissipation system 3 according to the triggering and disconnecting data of the heat dissipation position acquisition unit and the triggering and disconnecting data of the extreme heat dissipation acquisition unit, so as to facilitate the test of the heat dissipation effectiveness and timeliness of the heat dissipation of the heat dissipation system 3, and further ensure the accuracy and effectiveness of the test results.

[0032] The third implementation method: Figure 1 - Figure 3 and Fig.10 - Fig.12 A computer operation stability test system is shown, which is a further improvement of the first embodiment and a replacement for the second embodiment, and its functionality and specification options are promoted to meet different market needs. The right end of the heat pipe group 52 is fixedly connected to a limit plate 7, and the left end of the limit plate 7 is fixedly connected to a magnetic isolation push sleeve 71 that is slidably mounted on the outer end of the heat pipe group 52. The left end of the magnetic isolation push sleeve 71 is fixedly connected to a magnetic isolation push plate 72 that is slidably mounted on the outer end of the heat pipe group 52, and the magnetic isolation push plate 72 is fixedly connected to the radiator fin 53 located on the far right. The extension and contraction of the magnetic isolation push sleeve 71 can drive the radiator fin 53 to generate a gap through the magnetic isolation push plate 72. By regulating the gaps between multiple radiator fins 53, the conductivity of the radiator fin 53 to the heat on the CPU processor 2 can be effectively changed, and then cooperate with the heat dissipation system 3 to achieve rapid heat dissipation, thereby effectively ensuring the safety of the operation of the CPU processor 2 and promoting the synergy between the CPU processor 2 and the heat dissipation system 3.

[0033] Figure 2 , Fig.11 and Fig.12It is shown that an electromagnetic control cavity is opened in the magnetic isolation push sleeve 71, and the inner wall of the electromagnetic control cavity is coated with a magnetic isolation coating, and the left and right inner walls of the electromagnetic control cavity are fixedly connected with electromagnetic verification rings, and the output end of the test control processing unit is also connected to a heat dissipation control verification unit, and the output end of the heat dissipation control verification unit is connected to the electromagnetic verification ring signal. The setting of the heat dissipation control verification unit and the limit plate 7 can effectively verify the test results and verify the applicability of the gap data of the radiator fin 53, thereby achieving further precise processing of the test results, and can obtain the appropriate gap data of the radiator fin 53 while obtaining the effective heat dissipation power range, so as to achieve the maximum effect of thermal conduction and heat dissipation of the radiator fin 53, and effectively ensure the subsequent operation stability and safety of the computer body 1 in actual application.

[0034] Figure 1 - Figure 3 and Fig.10 - Fig.12 It is shown that during the test process, the heat dissipation regulation and verification unit did not receive the control instruction transmitted by the test regulation and processing unit, so the electromagnetic verification ring was kept in a constant power-off state. Therefore, the magnetic isolation push sleeve 71 at this time would not produce a large resistance to the deformation of the isolation ring 41, the isolation drive strip 43 and the discrete spring 45, so that the isolation ring 41, the isolation drive strip 43 and the discrete spring 45 can effectively produce corresponding deformation effects and transmit corresponding trigger data. When the test regulation and processing unit evaluates the power range of the heat dissipation effectiveness of the heat dissipation system 3, the test regulation and processing unit will issue a regulation instruction to the heat dissipation regulation and verification unit, and by inputting different current masses into the electromagnetic verification ring, the electromagnetic verification rings on the left and right sides will produce electromagnetic repulsion effects of different sizes, which will continuously drive the radiator fins 53 on the right side to produce continuous gap contraction and movement. Under the elastic force of the discrete spring 45 in the isolation ring 41, the two adjacent heat dissipation rings will be The gap between the fins 53 of the radiator is uniformly changed, and then the test control processing unit is under different gap states of the radiator fins 53. Through the functions of the CPU load control unit and the heat dissipation power control unit, the coordinated data between the CPU processor 2 and the heat dissipation system 3, as well as the effective power range of the heat dissipation of the heat dissipation system 3 are further verified and optimized, and then transmitted to the data output port of the computer body 1 through the test result transmission unit, and fed back to the technicians, so that the technicians can effectively optimize and control the computer body 1 according to the gap setting of the radiator fins 53, the effective power range of the heat dissipation of the heat dissipation system 3, and the operating status data of the CPU processor 2 obtained by the test, further ensuring the accuracy and effectiveness of the test results, and also promoting the coordinated effectiveness of the CPU processor 2, the heat dissipation system 3 and the radiator 5 in the subsequent actual application of the computer body 1, and promoting the development and application of the computer body 1.

[0035] In view of current practical needs, the above-mentioned implementation mode adopted in this application is not limited to the scope of protection. Various changes made within the knowledge scope of technical personnel in this field without departing from the concept of this application still fall within the scope of protection of the present invention.

Claims

1. A computer operation stability testing system, characterized in that: The computer comprises a computer body (1), a mainboard (11) being fixedly mounted inside the computer body (1), a CPU processor (2) being fixedly mounted on the left side of the mainboard (11), a heat sink (5) matching the CPU processor (2) being fixedly mounted on the left side of the mainboard (11), and a plurality of gap adjustment components (4) being arranged on the heat sink (5); The CPU processor (2) is equipped with a test control processing unit, the input end of the test control processing unit is connected to a chassis temperature acquisition unit, an operation status acquisition unit, a heat dissipation power acquisition unit, a limit heat dissipation acquisition unit and a test instruction receiving unit, and the output end of the test control processing unit is connected to a CPU load control unit, a heat dissipation power control unit and a test result transmission unit; The input end of the chassis temperature acquisition unit is connected to a temperature sensor signal disposed in the computer body (1), the input end of the operation status acquisition unit is connected to a CPU processor (2), the input end of the heat dissipation power acquisition unit is connected to a heat dissipation system (3), the input end of the extreme heat dissipation acquisition unit is connected to a gap adjustment component (4), and the input end of the test instruction receiving unit is connected to a data input port provided on the computer body (1); The output end of the CPU load control unit is signal-connected to a data input port of the CPU processor (2), the input end of the heat dissipation power control unit is signal-connected to a heat dissipation system (3) disposed in the computer body (1), and the output end of the test result transmission unit is signal-connected to a data output port disposed on the computer body (1).

2. A computer operation stability testing system according to claim 1, characterized in that: The heat sink (5) comprises a heat conducting sheet (51) fixedly mounted on the mainboard (11) and located on the left side of the CPU processor (2); a heat conducting pipe group (52) is fixedly connected to the left end of the heat conducting sheet (51); and a plurality of heat sink fins (53) are slidably connected to the heat conducting pipe group (52); The gap adjustment assembly (4) comprises an isolation ring (41) fixedly connected between two adjacent radiator fins (53), and the isolation ring (41) is slidably sleeved on the outer end of the heat conduction pipe group (52), and a heat dissipation isolation cavity (42) is provided in the isolation ring (41); The inner walls on the left and right sides of the heat dissipation isolation cavity (42) are both fixedly connected with limit trigger rods (44), and the limit trigger rods (44) at corresponding positions on the left and right sides are used in coordination, and the input end of the limit heat dissipation collection unit is signal-connected to the limit trigger rods (44).

3. A computer operation stability testing system according to claim 2, characterized in that: An isolation drive strip (43) is fixedly connected between the inner walls on the left and right sides of the heat dissipation isolation cavity (42); the isolation drive strip (43) is made of a composite of multiple memory metal wires, and the deformation direction of the isolation drive strip (43) is the left-right direction.

4. A computer operation stability testing system according to claim 2, characterized in that: A discrete spring (45) mounted on the outside of the limit trigger rod (44) is also fixedly connected between the left and right inner walls of the heat dissipation isolation cavity (42), and the discrete spring (45) remains in an extended state when not acted upon by an external force, and drives the two adjacent heat sink fins (53) to maintain a maximum gap through the cooperation of the isolation ring (41) and the isolation drive bar (43).

5. A computer operation stability testing system according to claim 2, characterized in that: A positioning piece (6) is fixedly connected to the left end of the heat conduction pipe group (52), and the radiator fin (53) located on the leftmost side of the heat conduction pipe group (52) is fixedly connected to the positioning piece (6).

6. A computer operation stability testing system according to claim 2, characterized in that: The right end of the heat conduction pipe group (52) is fixedly connected to a limit plate (7), and the left end of the limit plate (7) is embedded with an abutment conductive plate. The input end of the test control processing unit is also connected to a heat dissipation position acquisition unit, and the input end of the heat dissipation position acquisition unit is connected to the abutment conductive plate signal.

7. A computer operation stability testing system according to claim 2, characterized in that: The right end of the heat conduction tube group (52) is fixedly connected to a limit plate (7), the left end of the limit plate (7) is fixedly connected to a magnetic isolation push sleeve (71) that is slidably sleeved on the outer end of the heat conduction tube group (52), the left end of the magnetic isolation push sleeve (71) is fixedly connected to a magnetic isolation push plate (72) that is slidably sleeved on the outer end of the heat conduction tube group (52), and the magnetic isolation push plate (72) is fixedly connected to the radiator fin (53) located at the rightmost side.

8. A computer operation stability testing system according to claim 7, characterized in that: An electromagnetic control cavity is provided in the magnetic isolation push sleeve (71), and the inner wall of the electromagnetic control cavity is coated with a magnetic isolation coating. The left and right inner walls of the electromagnetic control cavity are fixedly connected to electromagnetic verification rings. The output end of the test control processing unit is also connected to a heat dissipation control verification unit. The output end of the heat dissipation control verification unit is connected to the electromagnetic verification ring signal.

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