Heat conduction device and heat conduction method of integrated electronic equipment based on VNX case architecture

Abstract

The invention relates to the field of integrated electronic equipment, and provides a heat conduction device and a heat conduction method for integrated electronic equipment based on a VNX case framework in order to solve the problems that the product performance and normal function use are affected due to the fact that heat cannot be conducted out when existing integrated electronic equipment works. A plurality of circuit mounting cavities are parallelly arranged in a single-machine module shell from left to right, external circuit modules are mounted in the circuit mounting cavities, an upper cover plate is mounted at the upper end of the single-machine module shell, and the upper cover plate is matched with the circuit mounting cavities to seal the external circuit modules in the single-machine module shell; heat conduction indium sheets with different thicknesses are arranged between the upper cover plate and the external circuit modules in the circuit mounting cavities; the upper end of the upper cover plate is provided with a first heat-conducting joint, the heat sink is provided with a second heat-conducting joint, and a heat-conducting cable is connected between the first heat-conducting joint and the second heat-conducting joint; meanwhile, the invention further provides a heat conduction method of the heat conduction device of the integrated electronic equipment based on the VNX case architecture.

Description

Technical Field

[0001] The present invention relates to the field of integrated electronic equipment, and in particular to a heat conduction device and a heat conduction method of integrated electronic equipment based on a VNX chassis architecture. Background Art

[0002] VNX (Virtualized Network eXtension) is a network virtualization architecture that achieves more efficient resource management and network traffic control by virtualizing physical resources. This architecture is widely used in cloud computing, data centers, and network management of large enterprises.

[0003] Integrated electronic equipment refers to equipment that integrates multiple electronic devices or functions into one, usually with multiple functions or multiple electronic devices. These devices are usually used in specific application scenarios, such as aerospace, modern defense equipment, etc.

[0004] The VNX chassis architecture is used in integrated electronic equipment. It integrates multiple single machines such as inertial measurement devices, satellite receivers, main control computers, secondary power supplies, etc. in the integrated electronic equipment to achieve functional integration. Multiple single machines use 400-core or 200-core standard GVNX electrical connectors as interfaces to plug into the motherboard inside the VNX chassis. That is, the motherboard is a BUS circuit board, and the BUS circuit board contains multiple parallel arranged GVNX electrical connectors. This structural combination can meet the design requirements of low cost, high integration and miniaturization of integrated electronic equipment.

[0005] However, when multiple stand-alone modules are stacked in the enclosed space inside the VNX chassis, the heat generated by each stand-alone module during normal operation is large. If it cannot be removed in time, the product temperature will rise rapidly, causing the product to be in a high temperature environment for a long time, which will have a serious negative impact on the product's performance and functions. How to remove the heat from the product during operation and reduce the temperature of the product during operation is a difficult problem in the design of integrated electronic equipment for the VNX chassis architecture. Summary of the invention

[0006] The purpose of the present invention is to solve the problem that heat cannot be discharged from the existing VNX chassis architecture integrated electronic equipment, resulting in high temperature of the product when it is working, affecting the normal use of product performance and functions, and proposes a heat conduction device and heat conduction method based on the VNX chassis architecture integrated electronic equipment.

[0007] To achieve the above objectives, the technical solution proposed by the present invention is:

[0008] A heat conduction device for integrated electronic equipment based on a VNX chassis architecture, which is special in that it includes a single module housing, a heat conduction cable and a heat sink;

[0009] A plurality of circuit installation cavities are arranged in parallel from left to right in the single-machine module housing, and the external circuit module is installed in the circuit installation cavity. A socket connected to the plurality of circuit installation cavities in a one-to-one correspondence is arranged at the lower end of the single-machine module housing, and an upper cover plate is installed at the upper end thereof. The upper cover plate cooperates with the plurality of circuit installation cavities to seal the external circuit module in the single-machine module housing;

[0010] A heat-conducting indium sheet of different thickness is arranged between the upper cover plate and the external circuit modules in each circuit installation cavity, so as to compensate for the height of the corresponding external circuit module in each circuit installation cavity and conduct the heat generated by the corresponding external circuit module to the upper cover plate;

[0011] A first heat-conducting joint is arranged at the upper end of the upper cover plate, a second heat-conducting joint is arranged on the heat sink, and the heat-conducting cable is connected between the first heat-conducting joint and the second heat-conducting joint to transfer the heat in the single-unit module housing to the heat sink.

[0012] Furthermore, the inner and outer surfaces of the single-unit module housing, the upper cover plate and the heat-conducting cable are all made of metal materials, and graphene is filled between the inner and outer surfaces.

[0013] Furthermore, the metal material of the inner surface and outer surface of the single-unit module housing, the upper cover plate and the heat-conducting cable is aluminum.

[0014] Furthermore, the thickness of the thermally conductive indium sheet is 0.5 mm-1.5 mm.

[0015] Furthermore, the compressibility of the thermally conductive indium sheet is not less than 0.3 mm.

[0016] Furthermore, the upper cover plate is embedded in the upper end of the single-machine module housing.

[0017] At the same time, the present invention also proposes a heat conduction method of the heat conduction device of the above-mentioned VNX chassis architecture integrated electronic device, which is special in that it includes the following steps:

[0018] Step 1: Process a single-unit module housing and open a plurality of circuit installation cavities of the same height therein;

[0019] Step 2: Install the external circuit modules in the circuit installation cavity, and measure the height difference between each external circuit module and the circuit installation cavity;

[0020] Step 3: According to the different height differences between the external circuit modules and the circuit installation cavity in step 2, thermally conductive indium sheets of different thicknesses are pasted on the top of the corresponding external circuit modules, so that the heights of the external circuit modules are consistent after pasting;

[0021] Step 4: Install the upper cover on the thermal conductive indium sheet and fix it with screws;

[0022] Step 5. Connect the first thermally conductive joint on the upper end of the upper cover and the second thermally conductive joint on the heat sink through a thermal cable. When the integrated electronic device is working, the heat generated by each external circuit module is conducted to the heat sink through the upper cover and the thermal cable, thereby completing the rapid cooling of the integrated electronic device of the VNX chassis architecture.

[0023] Beneficial effects of the present invention:

[0024] [1] The heat conduction device of the integrated electronic device based on the VNX chassis architecture of the present invention has a simple structure and is easy to process. It can effectively conduct heat generated by the external circuit module and reduce the temperature of the product during operation.

[0025] [2] The present invention arranges heat-conducting indium sheets of different thicknesses between the upper cover plate and the external circuit modules in each circuit installation cavity, so that the heights of the external circuit modules are consistent. There are no gaps or protrusions between the upper cover plate, the external circuit module and the stand-alone module housing, and effective close contact is formed, thereby ensuring effective heat conduction and effectively improving the cooling effect and cooling speed of the device.

[0026] [3] The present invention utilizes a heat conducting cable to transfer the heat in the housing of the stand-alone module to a heat sink with a lower temperature, which can effectively and quickly reduce the heat in the housing of the stand-alone module and ensure the normal operation of the product.

[0027] [4] The present invention fills graphene between the inner and outer surfaces of the single-unit module housing, the upper cover plate and the heat-conducting cable, and utilizes the high thermal conductivity of the graphene material to achieve rapid heat conduction and achieve the purpose of rapid heat conduction and uniform temperature.

[0028] [5] The heat conduction method of the integrated electronic device based on the VNX chassis architecture of the present invention has a simple operation process and is easy to implement. The heat on the single-machine module shell can be effectively conducted to the upper cover plate through the thermal indium sheet. The upper cover plate and the thermal cable are connected through the first thermal joint. The heat is then conducted to the thermal cable. The thermal cable is connected to a heat sink with a lower temperature through the second thermal joint. The heat is then conducted to the heat sink, thereby realizing the rapid heat extraction and achieving the effect of rapid cooling. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a structural schematic diagram of a heat conduction device of an integrated electronic device based on a VNX chassis architecture of the present invention;

[0030] Figure 2 Schematic diagram of the material structure of the inner and outer surfaces of the stand-alone module housing in an embodiment of the present invention;

[0031] Reference numerals:

[0032] 1- single-machine module housing, 2- thermally conductive indium sheet, 3- upper cover plate, 4- thermally conductive cable, 5- heat sink, 6- circuit installation cavity, 7- first thermally conductive joint, 8- second thermally conductive joint, 9- inner surface, 10- outer surface, 11- graphene, 12- socket. DETAILED DESCRIPTION

[0033] like Figure 1 As shown, a heat conduction device for integrated electronic equipment based on a VNX chassis architecture includes a single-machine module housing 1, a heat-conducting indium sheet 2, an upper cover plate 3, a heat-conducting cable 4 and a heat sink 5;

[0034] A plurality of circuit installation cavities 6 are arranged in parallel from left to right in the stand-alone module housing 1, and the external circuit module is installed in the circuit installation cavity 6. The lower end of the stand-alone module housing 1 is provided with a socket 12 connected to the plurality of circuit installation cavities 6 in a one-to-one correspondence. The upper cover plate 3 is embeddedly installed at the upper end of the stand-alone module housing 1. The upper cover plate 3 and the plurality of circuit installation cavities 6 cooperate with each other to seal the external circuit module in the stand-alone module housing 1. The heat generated by the external circuit module is conducted to the stand-alone module housing 1 through direct contact. A heat-conducting indium sheet 2 of different thicknesses is arranged between the upper cover plate 3 and the external circuit modules in each circuit installation cavity 6. The thickness of the heat-conducting indium sheet 2 is 0.5mm-1.5mm, and its compressible amount is not less than 0.3mm. It can effectively ensure the effective and rapid conduction of heat. The thermal conductive indium sheets 2 of different thicknesses are used to compensate for the height of the external circuit modules in each circuit installation cavity 6, so that the height of each external circuit module is consistent, and the heat generated by the corresponding external circuit module is conducted to the upper cover plate 3. The heat on the stand-alone module shell 1 is conducted to the upper cover plate 3 through the thermal conductive indium sheets 2; thermal conductive indium sheets 2 of different thicknesses are arranged between the upper cover plate 3 and the external circuit modules in each circuit installation cavity 6, so that the height of each external circuit module is consistent, there is no gap or protrusion between the upper cover plate 3, the external circuit module and the stand-alone module shell 1, and effective close contact is formed, thereby ensuring the effective conduction of heat and effectively improving the cooling effect and cooling speed of the device.

[0035] A first heat conducting joint 7 is provided at the upper end of the upper cover plate 3, a second heat conducting joint 8 is provided on the heat sink 5, a heat conducting cable 4 is connected between the first heat conducting joint 7 and the second heat conducting joint 8, and the upper cover plate 3 conducts the heat on the single-unit module housing 1 to the heat sink 5 with a lower temperature through the heat conducting cable 4, thereby achieving the purpose of rapid heat conduction.

[0036] like Figure 2As shown, the inner surface 9 and the outer surface 10 of the single-machine module housing 1, the upper cover plate 3 and the heat-conducting cable 4 are all made of aluminum plates, and the two aluminum plates of the inner surface 9 and the outer surface 10 are filled with graphene 11. The three can quickly and evenly conduct heat by utilizing the high thermal conductivity of the graphene 11 material to achieve a rapid cooling effect.

[0037] This embodiment also proposes a heat conduction method for integrated electronic equipment based on a VNX chassis architecture, comprising the following steps:

[0038] Step 1: Processing a stand-alone module housing 1 and opening a plurality of circuit installation cavities 6 of the same height therein;

[0039] Step 2: Install the external circuit modules in the circuit installation cavity 6, and measure the height difference between each external circuit module and the circuit installation cavity 6;

[0040] Step 3: According to the different height differences between the external circuit modules and the circuit installation cavity 6 in step 2, thermally conductive indium sheets 2 of different thicknesses are pasted on the top of the corresponding external circuit modules, so that the heights of the external circuit modules are consistent after pasting;

[0041] Step 4: Install the upper cover plate 3 on the thermal conductive indium sheet 2 and fix it with screws;

[0042] Step five: connect the first thermally conductive joint 7 on the upper end of the upper cover plate 3 and the second thermally conductive joint 8 on the heat sink 5 through the thermally conductive rope 4, so that when the integrated electronic device is working, the heat generated by each external circuit module is conducted to the heat sink 5 through the upper cover plate 3 and the thermally conductive rope 4, thereby completing the rapid cooling of the integrated electronic device of the VNX chassis architecture.

[0043] This method can effectively transfer the heat on the single-machine module shell to the upper cover plate through the thermally conductive indium sheet. The upper cover plate and the thermally conductive cable are connected through a first thermally conductive joint. The heat is then transferred to the thermally conductive cable. The thermally conductive cable is connected to a heat sink with a lower temperature through a second thermally conductive joint. The heat is then transferred to the heat sink, thereby realizing rapid heat extraction and achieving a rapid cooling effect. The method can also be promoted and applied to other occasions where heat conduction is required in confined spaces, and has certain guiding significance for engineering practice.

Claims

1. A heat conduction device for integrated electronic equipment based on a VNX chassis architecture, characterized in that: It comprises a single-machine module housing (1), a heat conducting cable (4) and a heat sink (5); A plurality of circuit installation cavities (6) are arranged in parallel from left to right in the single-machine module housing (1), and the external circuit module is installed in the circuit installation cavity (6). A socket (12) connected to the plurality of circuit installation cavities (6) in a one-to-one correspondence is arranged at the lower end of the single-machine module housing (1), and an upper cover plate (3) is installed at the upper end thereof. The upper cover plate (3) and the plurality of circuit installation cavities (6) cooperate with each other to seal the external circuit module in the single-machine module housing (1); A heat-conducting indium sheet (2) of different thicknesses is arranged between the upper cover plate (3) and the external circuit modules in each circuit installation cavity (6), so as to compensate for the height of the corresponding external circuit module in each circuit installation cavity (6) and conduct the heat generated by the corresponding external circuit module to the upper cover plate (3); A first heat-conducting joint (7) is provided at the upper end of the upper cover plate (3), a second heat-conducting joint (8) is provided on the heat sink (5), and the heat-conducting cable (4) is connected between the first heat-conducting joint (7) and the second heat-conducting joint (8) to conduct heat in the single-unit module housing (1) to the heat sink (5).

2. According to claim 1, a heat conduction device for integrated electronic equipment based on a VNX chassis architecture, characterized in that: The inner surface (9) and outer surface (10) of the single-unit module housing (1), the upper cover plate (3) and the heat-conducting cable (4) are all made of metal materials, and graphene (11) is filled between the inner surface (9) and the outer surface (10).

3. According to claim 2, a heat conduction device for integrated electronic equipment based on a VNX chassis architecture, characterized in that: The metal material of the inner surface (9) and the outer surface (10) of the single-unit module housing (1), the upper cover plate (3) and the heat conducting cable (4) is aluminum.

4. According to claim 3, a heat conduction device for integrated electronic equipment based on a VNX chassis architecture, characterized in that: The thickness of the thermally conductive indium sheet (2) is 0.5 mm to 1.5 mm.

5. A heat conduction device for integrated electronic equipment based on VNX chassis architecture according to claim 4, characterized in that: The compressibility of the thermally conductive indium sheet (2) is not less than 0.3 mm.

6. The heat conduction device of the integrated electronic device based on the VNX chassis architecture according to claim 5, characterized in that: The upper cover plate (3) is embeddedly mounted on the upper end of the single-machine module housing (1).

7. A heat conduction method for a heat conduction device of an integrated electronic device based on a VNX chassis architecture according to any one of claims 1 to 6, characterized in that: The following steps are involved: Step 1: Processing a single-unit module housing (1) and opening a plurality of circuit installation cavities (6) of the same height therein; Step 2: installing the external circuit modules in the circuit installation cavity (6), and measuring the height difference between each external circuit module and the circuit installation cavity (6); Step 3: According to the different height differences between the external circuit modules and the circuit installation cavity (6) in step 2, thermal conductive indium sheets (2) of different thicknesses are pasted on the top of the corresponding external circuit modules, so that the heights of the external circuit modules are consistent after pasting; Step 4: Install the upper cover plate (3) on the thermal conductive indium sheet (2) and fix it with screws; Step 5: Connect the first thermally conductive joint (7) on the upper end of the upper cover (3) and the second thermally conductive joint (8) on the heat sink (5) through a thermally conductive cable (4), so that when the integrated electronic device is working, the heat generated by each external circuit module is conducted to the heat sink (5) through the upper cover (3) and the thermally conductive cable (4), thereby completing the rapid cooling of the VNX chassis architecture integrated electronic device.

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