Plating apparatus and plating method

Abstract

The present invention suppresses or prevents transfer of the shape, movement, etc. of each member disposed between a substrate and an anode to a plating film. A plating device is provided with: a plating tank for holding a plating solution; a substrate holder that holds the substrate such that the surface to be plated faces downward; an anode disposed facing the substrate; a separator disposed between the substrate and the anode; and a diaphragm support part for pressing the upper surface of the diaphragm, the diaphragm support part having a plurality of openings of a first shape and a plurality of openings of a second shape disposed outside the plurality of openings of the first shape, the center of a circumscribed circle including the plurality of openings of the first shape being eccentric from the center of rotation of the substrate holder.

Description

Technical Field

[0001] The present invention relates to a plating device and a plating method. Background Art

[0002] As a plating device capable of performing a plating treatment on a substrate, a so-called face-down type or cup type plating device is known, as described in International Publication No. 2003 / 079684 (Patent Document 1). Such a plating device comprises: a plating tank storing a plating liquid and having an anode disposed therein; and a substrate holder (also called a plating head) disposed above the anode and holding the substrate as a cathode.

[0003] For such a face-down plating device, in terms of structure, since the anode is arranged at the bottom of the plating tank, it is necessary to remove all the parts on the upper part of the anode during maintenance operations such as anode replacement. In this series of operations, there are problems such as poor workability, time consumption, and deterioration of the operating rate of the plating device. In order to solve this problem, in the International Publication No. 2003 / 079684 (Patent Document 1), the following structure is adopted, that is, a pull-out unit that can be pulled out from the plating tank is provided, and the anode is arranged in the pull-out unit.

[0004] Patent Document 1: International Publication No. 2003 / 079684

[0005] However, in addition to the anode, a membrane (diaphragm) is sometimes provided in the plating tank, which is arranged above the anode and divides the anode chamber on the anode side and the cathode chamber on the substrate side. The diaphragm seals the plating solutions of the anode chamber and the cathode chamber from each other, and allows the metal ions in the plating solution to pass from the anode chamber to the cathode chamber, while preventing the additives in the plating solution from passing from the cathode chamber to the anode chamber. Such a diaphragm is a consumable part that needs to be replaced regularly, but because it is arranged below the components on the substrate holder side such as the resistor and the paddle, and is installed in the plating tank via a closed structure to divide the chambers from each other and seal them from each other, there is a problem of troublesome removal and installation during replacement. In addition, since the diaphragm and the anode are separated, there is a concern that the height dimension of the integrated unit will become larger.

[0006] In addition, from the perspective of improving the quality of the plated film formed on the substrate, it is necessary to suppress or prevent the shape and movement of each component disposed between the substrate and the anode from being transferred to the plated film. In addition, from the perspective of improving the quality of the plated film, it is also necessary to pay attention to reducing the residual bubbles in the cathode chamber. Summary of the invention

[0007] The present invention aims to solve at least part of the above-mentioned problems. One of the objects of the present invention is to facilitate the maintenance of a diaphragm and the like arranged in a face-down plating device. In addition, one of the objects of the present invention is to facilitate the installation of a diaphragm in a plating tank in a face-down plating device. In addition, one of the objects of the present invention is to easily and reliably seal each chamber in a plating tank by a diaphragm in a face-down plating device. One of the objects of the present invention is to suppress or prevent the transfer of the shape, movement, etc. of each component arranged between a substrate and an anode to a plating film. One of the objects of the present invention is to reduce the residual bubbles in a cathode chamber.

[0008] According to one aspect of the present invention, a plating device is provided, which comprises: a plating tank for holding a plating liquid; a substrate holder for holding a substrate with a plated surface facing downward; an anode arranged opposite to the substrate; a diaphragm arranged between the substrate and the anode; and a diaphragm support portion for pressing an upper surface of the diaphragm, the diaphragm support portion having a plurality of openings of a first shape and a plurality of openings of a second shape arranged outside the plurality of openings of the first shape, the center of a circumscribed circle including the plurality of openings of the first shape being eccentric from a rotation center of the substrate holder.

[0009] In addition, according to one aspect of the present invention, a plating device is provided, which comprises: a plating tank for holding a plating liquid; a substrate holder for holding a substrate; an anode arranged opposite to the substrate; a diaphragm arranged between the substrate and the anode; and a diaphragm support portion for pressing the diaphragm, the diaphragm support portion having a surface and a back surface, and having a plurality of beams for defining a plurality of openings passing through the surface and the back surface, and at least a portion of the beams are chamfered on the back surface side in contact with the diaphragm.

[0010] According to one aspect of the present invention, there is provided a plating method, which is a plating method for plating a substrate with a plated surface facing downward, wherein a plating tank is prepared, the plating tank comprising: an anode opposite to the substrate; a diaphragm arranged between the substrate and the anode; and a diaphragm support portion pressing the upper surface of the diaphragm, the diaphragm support portion having a plurality of openings of a first shape and a plurality of openings of a second shape arranged outside the plurality of openings of the first shape, and the substrate is plated while being rotated in a state where the rotation center of the substrate is eccentric from the center of a circumscribed circle of the plurality of openings of the first shape including the diaphragm support portion.

[0011] In addition, according to one aspect of the present invention, a plating method is provided, which is a plating method for plating a substrate, wherein a plating tank is prepared, the plating tank having: an anode, opposite to the above-mentioned substrate; a diaphragm, arranged between the above-mentioned substrate and the above-mentioned anode; and a diaphragm support portion, pressing the above-mentioned diaphragm, the diaphragm support portion having a plurality of beams with predetermined plurality of openings, at least a portion of the above-mentioned beams being chamfered on a side in contact with the above-mentioned diaphragm, and the above-mentioned substrate is plated using the above-mentioned plating tank. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a perspective view showing the overall structure of a plating apparatus according to one embodiment.

[0013] Figure 2 It is a plan view showing the overall structure of a plating apparatus according to one embodiment.

[0014] Figure 3 This is a perspective view of the plating module viewed from the front and bottom.

[0015] Figure 4 It is a perspective view of a longitudinal section of a plating module.

[0016] Figure 5 is a perspective view of a cross section of a plating module.

[0017] Fig. 6A It is an enlarged perspective view showing a part of the anode holder assembly.

[0018] Figure 6B It is an explanatory diagram for explaining the mounting structure of the separator and the anode.

[0019] Figure 7 It is a perspective view of a longitudinal section of a plating module at the cathode liquid inlet.

[0020] Figure 8 is a top view of the anode holder assembly.

[0021] Fig. 9 is a perspective view of the anode holder assembly as viewed from above.

[0022] Fig.10 This is a perspective view of the anode holder assembly as viewed from below.

[0023] Fig.11 This is a perspective view of the anode holder assembly viewed from below in a state where the anode fixing plate is made transparent.

[0024] Fig.12 It is a bottom view of the diaphragm support portion.

[0025] Fig.13A This is a perspective view showing a part of the diaphragm support portion in an enlarged manner.

[0026] Fig. 13B This is a perspective view further enlarging a part of the diaphragm support portion. DETAILED DESCRIPTION

[0027] Hereinafter, the plating device 1000 according to the embodiment of the present invention will be described with reference to the accompanying drawings. In addition, the accompanying drawings are schematically illustrated for easy understanding of the characteristics of the object, and the size ratio of each component may be different from the actual situation. In addition, in some drawings, the orthogonal coordinates of X-Y-Z are illustrated for reference. In the orthogonal coordinates, the Z direction is equivalent to the top, and the -Z direction is equivalent to the bottom (the direction in which gravity acts).

[0028] Figure 1 It is a perspective view showing the overall structure of the plating apparatus 1000 according to the present embodiment. Figure 2 1 is a top view showing the overall structure of the plating device 1000 of this embodiment. Figure 1 as well as Figure 2 As shown, the plating apparatus 1000 includes a loading port 100 , a transfer robot 110 , an aligner 120 , a pre-wet module 200 , a pre-preg module 300 , a plating module 400 , a cleaning module 500 , a spin cleaning and drying device 600 , a transfer device 700 , and a control module 800 .

[0029] The loading port 100 is a module for loading wafers (substrates) contained in a box such as a FOUP (not shown) into the plating device 1000, or for unloading substrates from the plating device 1000 to the box. In the present embodiment, four loading ports 100 are arranged in a horizontal direction, but the number and arrangement of the loading ports 100 are arbitrary. The transport robot 110 is a robot for transporting substrates, and is configured to transfer substrates between the loading port 100, the aligner 120, the pre-wetting module 200, and the spin cleaning dryer 600. When the transport robot 110 and the transport device 700 transfer substrates between the transport robot 110 and the transport device 700, the substrates can be transferred via a temporary placement table (not shown).

[0030] The aligner 120 is a module for aligning the orientation plane, notch, etc. of the substrate in a specified direction. In the present embodiment, two aligners 120 are arranged in a horizontal direction, but the number and configuration of the aligners 120 are arbitrary. The pre-wet module 200 wets the plated surface of the substrate before the plating process with a treatment liquid such as pure water or degassed water, thereby replacing the air inside the pattern formed on the surface of the substrate with the treatment liquid. The pre-wet module 200 is configured to replace the treatment liquid inside the pattern with the plating liquid during plating, thereby implementing a pre-wet treatment that makes it easy to supply the plating liquid to the inside of the pattern. In the present embodiment, two pre-wet modules 200 are arranged in a vertical direction, but the number and configuration of the pre-wet modules 200 are arbitrary.

[0031] The prepreg module 300 is configured to perform a prepreg treatment, and the prepreg treatment, for example, uses a treatment solution such as sulfuric acid and hydrochloric acid to etch away a high-resistance oxide film existing on the surface of the seed layer formed on the plated surface of the substrate before the plating treatment, and cleans or activates the surface of the plated base. In the present embodiment, two prepreg modules 300 are arranged in the vertical direction, but the number and arrangement of the prepreg modules 300 are arbitrary. The plating module 400 performs a plating treatment on the substrate. In the present embodiment, there are two groups of 12 plating modules 400 arranged in three in the vertical direction and four in the horizontal direction, and a total of 24 plating modules 400 are provided, but the number and arrangement of the plating modules 400 are arbitrary.

[0032] The cleaning module 500 is configured to perform cleaning on the substrate in order to remove the plating liquid and the like remaining on the substrate after the plating treatment. In the present embodiment, two cleaning modules 500 are arranged in the vertical direction, but the number and configuration of the cleaning modules 500 are arbitrary. The spin cleaning dryer 600 is a module for rotating the substrate after the cleaning treatment at high speed to dry the substrate. In the present embodiment, two spin cleaning dryers 600 are arranged in the vertical direction, but the number and configuration of the spin cleaning dryers 600 are arbitrary. The transport device 700 is a device for transporting substrates between multiple modules in the plating device 1000. The control module 800 is configured to control multiple modules of the plating device 1000, and can be composed of, for example, a conventional computer or a dedicated computer having an input / output interface for input / output with an operator.

[0033] An example of a series of plating processes performed by the plating device 1000 is described. First, a substrate contained in a box is loaded at the loading port 100. Next, the transport robot 110 takes out the substrate from the box at the loading port 100 and transports the substrate to the aligner 120. The aligner 120 aligns the orientation plane, notch, etc. of the substrate in a predetermined direction. The transport robot 110 delivers the substrate aligned by the aligner 120 to the pre-wet module 200.

[0034] The pre-wet module 200 performs a pre-wet treatment on the substrate. The transport device 700 transports the substrate subjected to the pre-wet treatment to the pre-preg module 300. The pre-preg module 300 performs a pre-preg treatment on the substrate. The transport device 700 transports the substrate subjected to the pre-preg treatment to the plating module 400. The plating module 400 performs a plating treatment on the substrate.

[0035] The transport device 700 transports the substrate subjected to the plating process to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The transport device 700 transports the substrate subjected to the cleaning process to the spin cleaning and drying device 600. The spin cleaning and drying device 600 performs a drying process on the substrate. The transport robot 110 receives the substrate from the spin cleaning and drying device 600 and transports the substrate subjected to the drying process to the box of the loading port 100. Finally, the box containing the substrate is unloaded from the loading port 100.

[0036] also, Figure 1 , Figure 2 The structure of the plating device 1000 described in the above is only an example, and the structure of the plating device 1000 is not limited to Figure 1 , Figure 2 structure.

[0037] [Plating Module]

[0038] Next, the plating module 400 will be described. In addition, since the plurality of plating modules 400 included in the plating apparatus 1000 according to the present embodiment have the same structure, one plating module 400 will be described.

[0039] Figure 3 This is a perspective view of the plating module viewed from the front and bottom. Figure 4 It is a perspective view of a longitudinal section of a plating module. Figure 5 is a perspective view of a cross section of a plating module. Fig. 6A It is an enlarged perspective view showing a part of the anode holder assembly. Figure 6B It is an explanatory diagram for explaining the mounting structure of the separator and the anode. Figure 7 It is a perspective view of a longitudinal section of a plating module at the cathode liquid inlet. Figure 8 is a top view of the anode holder assembly. Fig. 9 is a perspective view of the anode holder assembly as viewed from above. Fig.10 This is a perspective view of the anode holder assembly from below. Figure 3 The direction indicated by the arrow Y in refractory 2 represents the front-rear direction of the plating module 400 , with the front plate (cover) 640 side of the anode holder 610 being the front side and the opposite side being the rear side.

[0040] like Figure 4As shown, the plating device 1000 involved in this embodiment is a type of plating device called a face-down type or cup type that holds the substrate Wf horizontally for plating. The plating module 400 of the plating device 1000 involved in this embodiment mainly includes: a plating tank 10; a substrate holder 20, also called a plating head that holds the substrate Wf; a rotating mechanism, a tilting mechanism, and a lifting mechanism (omitted from the figure) that rotate, tilt, and lift the substrate holder 20; a diaphragm 50 that divides the inside of the plating tank 10 into a cathode chamber Cc and an anode chamber Ca; and an anode 60 that is arranged below the substrate Wf and opposite to the substrate Wf. Among them, the tilting mechanism can also be omitted.

[0041] The plating tank 10 involved in the present embodiment is composed of a bottomed container with an opening at the top. The plating tank 10 involved in the present embodiment includes an upper tank 11 and a lower tank 12. The plating tank 10 forms a substantially cylindrical internal space for storing a plating solution by the upper tank 11 and the lower tank 12. The plating solution may be a solution containing ions of metal elements constituting a plated film, and its specific example is not particularly limited. In the present embodiment, as an example of a plating treatment, a copper plating treatment is used, and as an example of a plating solution, a copper sulfate solution is used. In addition, in the present embodiment, a prescribed additive is contained in the plating solution. However, it is not limited to this structure, and the plating solution may also be configured not to contain an additive.

[0042] Inside the plating tank 10, a paddle 30 is arranged near the substrate Wf. The paddle 30 reciprocates in a direction substantially parallel to the plated surface of the substrate Wf, causing a strong flow of the plating solution on the surface of the substrate Wf. Thus, the ions in the plating solution near the surface of the substrate Wf are uniformed, and the in-plane uniformity of the plated film formed on the surface of the substrate Wf is improved.

[0043] A porous resistor 40 is arranged below the paddle 30 inside the plating tank 10. Specifically, the resistor 40 is composed of a porous plate member having a plurality of holes (pores). The plating solution on the lower side of the resistor 40 can pass through the resistor 40 and flow on the upper side of the resistor 40. The resistor 40 is a member provided to achieve uniformity of the electric field formed between the anode 60 and the substrate Wf. By arranging such a resistor 40 in the plating tank 10, it is possible to easily achieve uniformity of the film thickness of the plating film (plating layer) formed on the substrate Wf. In addition, the resistor 40 is not a necessary structure in the present embodiment, and the present embodiment can also be configured without the resistor 40.

[0044] In the present embodiment, the anode holder assembly 6 is arranged in the lower tank 12 of the plating tank 10, and the anode holder assembly 6 includes a diaphragm 50, an anode 60, and a variable anode mask 650. That is, by inserting and installing the anode holder assembly 6 in the plating tank 10, the diaphragm 50, the anode 60, and the variable anode mask 650 are arranged in the plating tank 10.

[0045] In this embodiment, the diaphragm 50 and the anode 60 are arranged below the variable anode mask 650 in the plating tank 10 ( Figure 5 , Fig. 6A ). In the present embodiment, a structure is adopted in which the anode 60 is closely arranged under the diaphragm 50. The diaphragm 50 divides the interior of the plating tank 10 into an anode chamber Ca (a chamber on the lower side of the diaphragm 50) and a cathode chamber Cc (a chamber on the upper side of the diaphragm 50) from top to bottom. The diaphragm 50 is composed of, for example, overlapping neutral membranes and ion exchange membranes. The structure of the diaphragm 50 is an example, and other structures may be adopted. The diaphragm 50 is fixed to the holder body 620 (annular portion 621) from below by means of a sealing pressure ring 51 at its outer periphery, while the sealing member 704 is sandwiched between it and the outer periphery of the holder body 620 / anode holder 610. Fig. 6A , Figure 6B ). A sealing surface 704A is formed between the lower surface of the outer periphery (annular portion 621) of the holder body 620 / anode holder 610 and the upper surface of the outer periphery of the diaphragm 50. The seal 704 can be arranged, for example, in a sealing groove that is provided in an annular shape over the entire circumference of the lower surface of the annular portion 621 of the holder body 620 / anode holder 610. In this way, in the present embodiment, it is possible to construct a structure in which the plating tank 10 in the anode holder assembly 6 can be divided into an upper and lower part by the diaphragm 50. Therefore, if the outer periphery (annular portion 621) of the holder body 620 / anode holder 610 and the plating tank 10 are sealed, the inside of the plating tank 10 becomes a structure divided into an anode chamber Ca and a cathode chamber Cc with the diaphragm 50 as the boundary.

[0046] In the anode chamber Ca, the anode liquid (plating solution) is supplied from the anode liquid inlet 12C provided on the bottom wall of the plating tank 10, and the anode liquid is discharged from the anode liquid outlet (not shown) provided on the side wall of the plating tank 10. In the cathode chamber Cc, the cathode liquid (plating solution) is supplied from the cathode liquid inlet 680 and discharged from the cathode liquid outlet (not shown). The plating liquid (cathode liquid) containing additives such as an accelerator is supplied to the cathode chamber Cc, and the plating liquid (cathode liquid) containing no additives or having a low concentration of additives is introduced into the anode chamber Ca. The diaphragm 50 allows metal ions in the plating solution to pass from the anode chamber Ca to the cathode chamber Cc, and prevents additives in the plating solution from passing from the cathode chamber Cc to the anode chamber Ca.

[0047] The anode 60 is closely arranged on the lower surface of the diaphragm 50. The specific type of the anode 60 is not particularly limited, and a soluble anode or an insoluble anode can be used. In the present embodiment, an insoluble anode is used as the anode 60. The specific type of the insoluble anode is not particularly limited, and platinum, iridium oxide, etc. can be used.

[0048] In this embodiment, a variable anode mask 650 is provided on the upper surface side (substrate Wf side) of the anode 60 and the diaphragm 50. The variable anode mask 650 has an opening portion that exposes the anode 60 inside the blade 651, and is an electric field adjustment component that adjusts the electric field from the anode 60 toward the substrate Wf by adjusting the exposed range of the anode 60 using the blade 651. Figure 5 As shown, the variable anode mask 650 of this embodiment includes a plurality of blades 651, and the opening size of the opening that exposes the anode 60 is adjusted by a mechanism similar to the aperture of a camera.

[0049] <Anode holder assembly>

[0050] The following describes the details of the anode holder assembly (also referred to as a pull-out unit) 6. In this embodiment, the diaphragm 50, the anode 60, and the variable anode mask 650 are mounted on the anode holder 610, and these are integrally formed as the anode holder assembly 6 ( Figure 3 , Figure 4 In other embodiments, the variable anode mask 650 may be omitted or may be provided separately from the anode holder assembly 6. The anode holder assembly 6 is installed in the plating tank 10 (lower tank 12) in a removable manner. Figure 3 as well as Figure 4 As shown, the anode holder assembly 6 is inserted into the plating tank 10 from the opening 12B provided on the front side of the plating tank 10, and is installed in the plating tank 10. The opening 12B of the plating tank 10 is blocked by the front plate (cover) 640 of the anode holder 610, and is sealed liquid-tightly by seals 702 and 703 (described later).

[0051] The anode holder assembly 6 includes an anode holder 610, a diaphragm 50 attached to the anode holder 610, an anode 60, and a variable anode mask 650. In other embodiments, the variable anode mask 650 may be omitted or provided separately from the anode holder assembly 6.

[0052] (Anode Holder)

[0053] The anode holder 610 includes a holder body 620 and a front plate 640. The holder body 620 is a member that holds the diaphragm 50, the anode 60, and the variable anode mask 650. The front plate 640 is a member that blocks the opening 12B of the plating tank 10 and seals the inside of the plating tank 10 liquid-tightly from the outside. The holder body 620 is a portion that constitutes the main part of the anode holder 610, so the outer peripheral portion of the anode holder 610 means the outer peripheral portion of the holder body 620, and the outer peripheral portion of the holder body 620 means the outer peripheral portion of the anode holder 610.

[0054] Retainer body

[0055] The holder body 620 includes: an annular portion 621; a diaphragm support portion 622 integrally provided inside the annular portion 621; and a flange 623 provided on the upper surface of the annular portion 621. The annular portion 621 and the flange 623 constitute the outer periphery of the holder body 620 / anode holder 610. The annular portion 621 and the flange 623 may be collectively referred to as the outer periphery of the holder body 620 / anode holder 610, or may be separately referred to as the outer periphery of the holder body 620 / anode holder 610.

[0056] like Figure 4 As shown, the annular portion 621 is formed as the lower portion of the outer periphery of the holder body 620 / anode holder 610, and a diaphragm support portion 622 is arranged inside the annular portion 621, and the diaphragm support portion 622 has a plurality of openings that expose the diaphragm 50 (the region corresponding to the anode 60). In other embodiments, the diaphragm support portion 622 may be omitted, and the portion of the diaphragm support portion 622 may be a single opening.

[0057] like Figure 8 as well as Fig. 9 As shown, the diaphragm support portion 622 is a mesh portion including a plurality of openings, such as Figure 4 as well as Figure 5 As shown in FIG. 1 , the upper surface of the diaphragm 50 is contacted and the diaphragm 50 is supported from above. Figure 4 as well as Figure 5 As shown, the diaphragm supporting portion 622 comprises: a honeycomb structure (inside the circumscribed circle Rm), in which beams 622A arranged in a hexagonal shape are arranged in a honeycomb shape and have a plurality of openings in a honeycomb shape; and a plurality of beams 622B extending radially, connected from the outermost vertex of the honeycomb structure to the annular portion 621 of the retainer body 620 / anode retainer 610. Figure 8 Rm in FIG. 1 represents the circumscribed circle of the honeycomb structure, and the inner side of the circumscribed circle Rm represents the approximate honeycomb structure. The circumscribed circle Rm corresponds to the approximate outer shape (projected shape) of the substrate Wf. Figure 8As shown, the center of the honeycomb structure, that is, the center Cm of the circumscribed circle Rm, is eccentric from the rotation center / rotation center axis Cw of the substrate holder 20 (substrate Wf). This structure prevents the plated film formed on the substrate Wf from picking up the pattern of the diaphragm support portion 622, thereby suppressing or preventing the reduction in the uniformity of the plated film thickness. When the center Cm of the honeycomb structure is not eccentric (offset) from the rotation center Cw of the substrate Wf, even if the substrate Wf is rotated, there is a high possibility that an area with a high proportion of electric field blocked by the beam 622A is formed.

[0058] The flange 623 constitutes the upper portion of the outer periphery of the holder body 620 / anode holder 610, and constitutes an installation portion for installation into the plating tank 10. Figure 8 as well as Fig. 9 As shown, the flange 623 is an annular component having an opening in the center portion that exposes the diaphragm 50 (the area corresponding to the anode 60). The flange 623 is firmly and liquid-tightly fixed to the annular portion 621 of the holder body 620 / anode holder 610 by using a fixing method using a fastening component, welding, bonding, or the like. A seal may be arranged between the flange 623 and the annular portion 621 to liquid-tightly fix the two. In the present embodiment, although the flange 623 and the annular portion 621 are provided independently, the flange 623 and the annular portion 621 may be provided integrally with each other when the variable anode mask 650 is not mounted on the anode holder 610. An annular sealing groove is formed on the upper surface of the flange 623 over the entire circumference, and an annular seal 701 is arranged in the sealing groove. In the present embodiment, as Figure 4 As shown in FIGS. 1 and 10 , an annular protrusion slightly higher than other portions is provided on the inner portion of the upper surface of the flange 623 , and a seal 701 is arranged on the annular protrusion.

[0059] ·Front panel

[0060] like Figure 3 as well as Figure 4 As shown, the front plate 640 includes a front plate body 641 and a frame member 642. The frame member 642 is fitted to the outer peripheral surface of the front plate body 641 so as to be movable in the front-rear direction relative to the front plate body 641. The front plate body 641 and the frame member 642 are fitted with a strength that does not fall off from each other. Figure 4As shown, on the outer peripheral surface of the front plate body 641, for example, an annular seal 703 is arranged throughout the entire circumference, and the seal 703 seals the front plate body 641 and the frame member 642 in a liquid-tight manner. The seal 703 is, for example, arranged in a sealing groove arranged in an annular shape on the outer peripheral surface of the front plate body 641 throughout the entire circumference. The seal 703 can also be arranged in a sealing groove arranged in an annular shape on the inner peripheral surface of the frame member 642 throughout the entire circumference. A flange 12A protruding downward and in the left and right directions is arranged around the opening 12B of the lower groove 12 of the plating tank 10. An annular seal 702 is arranged around the opening 12B of the front surface of the flange 12A throughout the entire circumference, and the seal 702 seals between the flange 12A and the front plate 640 (frame member 642). The seal 702 is, for example, arranged in an annular sealing groove arranged around the opening 12B of the front surface of the flange 12A throughout the entire circumference. The flange 12A constitutes a part of the lower groove 12, but may be integrally provided in the lower groove 12, or may be provided independently of other parts of the lower groove 12, and be fixed to other parts in a liquid-tight manner by a fixing method using a fastening member, welding, bonding, etc. In addition, the seal 702 may be arranged in a sealing groove provided in an annular shape over the entire circumference of the back surface of the frame member 642.

[0061] In addition, the flange 12A may be omitted on the side wall (front surface) of the lower groove 12 as long as a sufficient area for the frame member 642 of the front plate 640 to abut against is ensured.

[0062] like Figure 3 as well as Figure 4 As shown, the front plate 640 is fixed to the flange 12A of the lower tank 12 by a plurality of fastening components 802 that penetrate the frame member 642. The fastening component 802 can be a bolt, a screw, or other arbitrary fastening components. However, from the viewpoint of maintaining the anode holder assembly 6 (anode holder 610), it is preferably a component that is easily disassembled. The frame member 642 of the front plate 640 is fixed to the flange 12A of the plating tank 10 by the fastening component 802, and the frame member 642 and the flange 12A are sealed by the sealing member 702. At this time, the frame member 642 moves in the front-back direction relative to the front plate body 641, so that the sealing member 702 can be appropriately elastically deformed, and the sealing performance of the sealing member 702 can be fully utilized. As a result, when the anode holder 610 (anode holder assembly 6 ) is mounted in the plating tank 10 , the inside of the plating tank 10 is sealed liquid-tightly from the outside by the seal 702 between the front plate 640 of the anode holder 610 and the flange 12A of the plating tank 10 .

[0063] (Diaphragm)

[0064] On the lower surface of the outer peripheral portion (annular portion 621) of the holder body 620 / anode holder 610, as shown in FIG. Figure 4 , Fig. 6A As shown, the outer periphery of the diaphragm 50 is mounted via the seal 704. Fig. 6A As shown, a plurality of fastening components 803 penetrate the sealing ring 51, the diaphragm 50 and the seal 704 and are screwed with the annular portion 621, whereby the outer peripheral portion of the diaphragm 50 is mounted on the outer peripheral portion (annular portion 621) of the holder body 620 / anode holder 610 in a state of being sealed by the seal 704. The seal 704 can be arranged, for example, in a sealing groove ( Fig. 6A ). The plurality of fastening members 803 may be bolts, screws, or any other fastening members, and may be evenly arranged over the entire circumference of the sealing ring 51. The diaphragm support portion 622 and the annular portion 621 may also be collectively referred to as a diaphragm support portion.

[0065] (anode)

[0066] like Figure 6B As shown, the anode 60 is mounted on the outer periphery (annular portion 621) of the holder body 620 / anode holder 610 in such a manner that the anode fixing plate 62 and the diaphragm pressing piece 810 are in close contact with the lower surface of the diaphragm 50. The anode 60 is supported from below and held at a predetermined position by a plurality of diaphragm pressing pieces 810 that penetrate the anode fixing plate 62 and abut against the lower surface of the anode 60 and press the anode 60 against the diaphragm 50. At this time, although Fig. 6A as well as Figure 6B However, since the upper surface of the diaphragm 50 is supported by the diaphragm support portion 622 ( Figure 5 The anode fixing plate 62 is pressed from above by the diaphragm support 622 at the top and the diaphragm pressing piece 810 at the bottom, so that the diaphragm 50 and the anode 60 are sandwiched and held. The anode fixing plate 62 is also called a back plate.

[0067] The diaphragm pressing member 810 can be a bolt, a spacer, or any other supporting member. Figure 6B In order to emphasize the gap between the anode 60 and the anode fixing plate 62 formed by the plurality of diaphragm pressing members 810 , a schematic diagram is shown.

[0068] like Fig. 6A As shown, the anode fixing plate 62 is on the outside of the sealing pressure ring 51, through a plurality of spacers 804A (in Fig. 6AThe anode fixing plate 62 is fixed to the outer periphery (annular portion 621) of the holder body 620 / anode holder 610 by a plurality of fastening components 804 that penetrate the anode fixing plate 62 and the spacer 804A and are screwed with the annular portion 621. As a result, gaps are formed between the outer periphery of the holder body 620 / anode holder 610 and the anode fixing plate 62 (between the sealing pressure ring 51 and the anode fixing plate 62, and between the annular component 621 and the anode fixing plate 62). Through these gaps, the gas (for example, oxygen) generated at the anode 60 can move to the outside of the holder body 620 / anode holder 610.

[0069] The plurality of fastening components 804 may be bolts, screws, or any other fastening components, and may be evenly arranged on the outer side of the sealing ring 51 over the entire circumference, for example.

[0070] like Figure 6B As shown, a predetermined gap is formed between the lower surface of the anode 60 and the anode fixing plate 62 by the front end side of the diaphragm pressing piece 810. In addition, on the outer peripheral side of the anode 60, gaps are provided between the sealing pressure ring 51 and the anode fixing plate 62, and between the annular component 621 and the anode fixing plate 62 at one or more locations in the circumferential direction, and through these gaps, the gas accumulated between the lower surface of the anode 60 and the anode fixing plate 62 is discharged to the outside. The anode fixing plate (back plate) 62 has the function of adjusting the accumulated amount of gas accumulated on the lower surface of the anode 60 to a predetermined amount, and suppressing a large amount of gas from simultaneously escaping from the lower surface of the anode, resulting in a voltage change of the anode. In this way, it is possible to suppress the reduction in the uniformity of the plating film thickness.

[0071] In the present embodiment, the anode 60 is a plate-like component having a plurality of through holes (not shown). The anode 60 can be a lath (metal mesh) structure, or a plate-like component provided with a plurality of through holes (refer to International Publication No. 2023 / 188371). Since the anode 60 has a plurality of through holes, the upper surface of the anode 60 is always kept wet even during the electrode reaction due to the plating solution (anode solution) supplied through the through holes. Since the diaphragm 50 is an ion-permeable membrane that can be permeated and wetted by the plating solution, the surface of the anode 60 on the substrate side (the portion to which the diaphragm 50 is in close contact or its vicinity) reacts with the plating solution, and cations (such as hydrogen ions H +) is transferred to the cathode chamber Cc, that is, the substrate side, through the diaphragm 50. Therefore, an ion conduction path (current path) is formed from the surface of the substrate side of the anode 60 (the part to which the diaphragm 50 is in close contact or its vicinity) through the inside of the diaphragm 50 to the substrate Wf. On the other hand, the bubbles of gas generated on the surface of the anode 60 cannot pass through the diaphragm 50, and move to the back side (lower surface) of the anode 60 through the multiple through holes of the anode 60. After the bubbles accumulate on the lower surface of the anode 60 (between the anode 60 and the back plate 62), they move to the outside of the sealing pressure ring 51 and are discharged to the outside of the plating tank 10 through the exhaust passage (not shown).

[0072] Since the upper surface of the anode 60 is in close contact with the lower surface of the diaphragm 50, the gas generated from the anode 60 is suppressed or prevented from accumulating between the anode 60 and the diaphragm 50, and the gas generated from the anode 60 is suppressed or prevented from moving to the cathode chamber, affecting the electric field between the anode 60 and the substrate Wf, and can suppress or prevent the uniformity of the thickness of the plating film formed on the substrate Wf from being reduced.

[0073] (Variable Anode Mask)

[0074] like Figure 4 As shown, the variable anode mask 650 is mounted on the annular portion 621 of the holder body 620 / anode holder 610, which is smaller than the diaphragm support portion 622 ( Figure 5 The variable anode mask 650 includes: a plurality of blades 651; and a circular drive component 652, which is equipped with a plurality of blades 651 and adjusts the aperture (opening diameter) formed by these blades 651. Figure 3 , Figure 5 The drive shaft 670 shown in the figure moves in the front-to-back direction through an actuator (not shown), thereby driving the component 652 to rotate and adjust the aperture (opening diameter) formed by the plurality of blades 651. In one example, an actuator (not shown) is arranged on the side of the lower groove 12 of the plating tank 10 adjacent to the front plate 640 (opening 12B of the lower groove 12) of the anode holder 610, and the axis of the actuator extends parallel to the drive shaft 670. Through the connecting component 671, the axis of the actuator and the drive shaft 670 can be configured to be connected between their front ends (refer to International Publication No. 2003 / 079684 (Patent Document 1)). The drive shaft 670 and the front plate 640 (front plate body 641) are sealed by an appropriate seal (not shown, for example, refer to Patent Document 1). The actuator can be composed of a known linear actuator (for example, a motor and a ball screw).

[0075] (1st sealing surface)

[0076] like Fig. 9As shown, the flange 623 of the holder body 620 / anode holder 610 is an annular member having an opening in the center to expose the diaphragm 50 (the region corresponding to the anode 60). Figure 4 , Figure 5 , Figure 8 as well as Fig. 9 As shown, the seal 701 is arranged over the entire circumference. The seal 701 seals between the outer periphery (flange 623) of the retainer body 620 / anode retainer 610 and the lower surface of the flange 12D of the plating tank 10. A sealing surface 701A (see FIG. 1 ) is formed between the upper surface of the outer periphery (flange 623) of the retainer body 620 / anode retainer 610 and the lower surface of the flange 12D of the plating tank 10, which are opposite to each other with the seal 701 sandwiched therebetween, and between the lower surface of the flange 12D of the plating tank 10. Figure 4 ).like Figure 4 , Figure 5 As shown, a plurality of fastening members 801 are fastened to the flange 623 of the holder body 620 / anode holder 610 by penetrating the flange 11A of the upper tank 11 and the flange 12D of the lower tank 12 of the plating tank 10. When the outer peripheral portion (flange 623) of the holder body 620 / anode holder 610 is fixed to the flange 12D of the plating tank 10, the seal 701 is configured to elastically deform due to appropriate pressure to exert sealing performance. For example, the plurality of fastening members 801 are evenly arranged over the entire circumference. The fastening members 801 can be bolts, screws, or any other fastening members.

[0077] (Second sealing surface)

[0078] On the front surface of the flange 12A of the lower tank 12 of the plating tank 10, as shown in FIG. Figure 4 As shown in FIG. 1 , an annular seal 702 is arranged around the entire circumference of the opening 12B. The seal 702 seals between the flange 12A of the plating tank 10 and the frame member 642 of the front plate 640. In other words, the opening 12B of the plating tank 10 is sealed liquid-tightly. A sealing surface 702A (see FIG. 1 ) is formed between the front surface of the flange 12A of the plating tank 10 and the back surface of the frame member 642 of the front plate 640, which are mutually opposed with the seal 702. Figure 4 ).like Figure 3 , Figure 4As shown, when the front plate 640 of the anode holder 610 is fixed to the flange 12A of the plating tank 10 by a plurality of fastening members 802, the seal 702 is configured to elastically deform due to appropriate pressure to exert sealing properties. At this time, since the frame member 642 of the front plate 640 can move in the front-to-back direction relative to the front plate body 641, the frame member 642 can move relative to the front plate body 641, and the frame member 642 causes the seal 702 to elastically deform with appropriate pressure according to the degree of fastening of the plurality of fastening members 802. Figure 4 As shown in FIG. 1 and FIG. 2 , the plurality of fastening members 802 can be evenly arranged over the entire circumference, for example.

[0079] Here, when the flange 623 of the holder body 620 / anode holder 610 is fixed to the flange 12D of the plating tank 10 by the fastening member 801, that is, when the seal 701 is elastically deformed, the flange 12D of the plating tank 10 is subjected to a force in the up-down direction by the fastening member 801, and thus the seal 702 disposed on the flange 12A of the plating tank 10 is subjected to a force in the up-down direction, and may not be in a state of properly sealing the flange 12A and the frame member 642. Therefore, in the present embodiment, in the front plate 640, the frame member 642 can be moved in the front-back direction relative to the front plate body 641, and the frame member 642 is pressed against the flange 12A independently of the front plate body 641 by fastening with the fastening member 802, thereby appropriately compressing and elastically deforming the seal 703 to achieve a properly sealed state. For example, by changing the degree of fastening of the fastening members 802 at the upper and lower parts, the seal 702 can be elastically deformed with appropriate pressing forces at the upper and lower parts.

[0080] (3rd sealing surface)

[0081] In addition, in the front plate 640, the front plate body 641 and the frame member 642 are sealed by an annular seal 703. A sealing surface 703A (see FIG. 7A ) is formed between the outer peripheral surface of the front plate body 641 and the inner peripheral surface of the frame member 642, which are opposed to each other with the seal 703 sandwiched therebetween, to seal the front plate body 641 and the frame member 642. Figure 4 ). As a result, the inside of the plating tank 10 is properly sealed relative to the outside. The frame member 642 is fitted to the front plate body 641 with a strength that does not fall off the front plate body 641. The seal 703 is, for example, arranged in an annular sealing groove provided over the entire circumference of the outer circumference of the front plate body 641. In addition, the seal 703 can also be arranged in an annular sealing groove provided over the entire circumference of the inner circumference of the frame member 642.

[0082] (Cathode liquid path)

[0083] like Figure 7 as well as Fig.10As shown, in the anode holder 610, a cathode liquid passage 681 connected to the cathode liquid inlet 680 of the front plate 640 is provided at the lower part of the holder body 620 / anode holder 610. The cathode liquid passage 681 is divided by the lower surface of the thin-walled portion of the annular portion 621 of the holder body 620 / anode holder 610, the front plate body 641, the bottom wall 613, and the side walls 614 to 617 by removing a portion of the wall thickness at the lower part of the outer periphery (annular portion 621) of the holder body 620 / anode holder 610. The side wall 614 is provided in a shape along the outer periphery of the diaphragm support portion 622 ( Figure 7 , Fig.10 ), one or more cutouts 614a are provided on the upper portion of the side wall 614 ( Figure 7 ). The cutout 614a constitutes the outlet of the cathode liquid passage 681. That is, the cathode liquid passage 681 has an inlet connected to the cathode liquid inlet 680 and an outlet (cutout 614a) opened above the diaphragm 50. The cathode liquid flowing in from the cathode liquid inlet 680 passes through the cathode liquid passage 681 and is supplied from the cutout 614a to the top of the diaphragm support portion 622 (that is, the cathode chamber Cc located above the diaphragm 50).

[0084] like Figure 7 As shown, the cathode liquid inlet 680 is located at the bottom of the holder body 620 / anode holder 610, and is arranged at the lowest part of the cathode chamber Cc, so that the amount of residual cathode liquid remaining in the cathode chamber Cc can be minimized. The bottom surface (bottom wall 613) of the cathode liquid passage 681 is also located below the anode fixing plate 62, and is located at the lowest part of the cathode chamber Cc.

[0085] (Bus Bar)

[0086] A bus bar 660 ( Figure 3 , Figure 5 ).like Fig.10 As shown, the bus bar 660 extends backward from the front plate 640 (front plate body 641) to the vicinity of the center of the lower surface of the anode 60, and is electrically and mechanically connected to the anode 60 near the center of the lower surface of the anode 60, for example, electrically and mechanically connected to the boss 60A (terminal portion) protruding downward through the fastening component 805. The bus bar 660 and the front plate 640 (front plate body 641) are sealed by an appropriate seal (omitted from the figure, for example, refer to Patent Document 1). The fastening component 805 can be a bolt, a screw, or any other fastening component.

[0087] Fig.11 It is a bottom perspective view of the anode holder assembly 6 in a state where the anode fixing plate 62 is made transparent. Fig.12 It is a bottom view of the diaphragm support portion 622 . Fig.13AIt is a perspective view which enlarges a part of the diaphragm support part 622. Fig. 13B It is a perspective view which further enlarges a part of the diaphragm support part 622.

[0088] When the anode holder assembly 6 is viewed from below, the diaphragm support member 622 is arranged deep between the anode 60 and the diaphragm 50 ( Figure 4 , Figure 5 ), but in Fig.11 In the figure, for the convenience of explanation, the diaphragm support member 622 is shown to be visible through the position of the anode 60. Fig.11 In the figure, it is also possible to see the fastening member 803 ( Fig. 6A ), the fastening member 804 for fastening the anode fixing plate 62 ( Fig. 6A ), the diaphragm pressing piece 810 pressing the diaphragm 50 from below through the anode 60 ( Figure 6B ) configuration example.

[0089] like Fig.12 , Fig.13A as well as Fig. 13B As shown in FIG. 1 , the lower surface side of the beam 622A of the diaphragm support portion 622, that is, the side in contact with the diaphragm 50, is chamfered to form a chamfered portion 624A. In addition, the upper surface and the lower surface of the diaphragm support portion 622 are sometimes referred to as the front surface and the back surface, respectively. In this example, the chamfered portion 624A is a C-chamfered structure. In addition, as shown in FIG. Fig.12 As shown, the chamfered portion 624A provided on the outermost beam 622A of the honeycomb structure may be formed only on the side facing the honeycomb structure. In other words, the chamfered portion 624A provided on the outermost beam 622A of the honeycomb structure may be provided only on the side facing the honeycomb structure. In other words, the chamfered portion 624A may be provided on the diaphragm contact side of the beam 622A of the diaphragm support portion 622 and on the side facing the honeycomb opening. In other embodiments, the chamfered portion 624A provided on the outermost beam 622A of the honeycomb structure may be provided on the side facing the honeycomb structure and on the side not facing the honeycomb structure.

[0090] The chamfered portion 624A is provided to improve the problem that, when the liquid enters the cathode chamber Cc, bubbles are enclosed in the portion of the beam in contact with the diaphragm 50 (between the diaphragm and the beam), which may cause bubbles to remain. Such bubbles may adhere to the substrate, resulting in poor plating quality such as uneven local plating.

[0091] As described above, by providing the chamfered portion 624A on the lower surface side of the beam 622A disposed on the cathode chamber Cc side of the diaphragm 50, the contact area between the beam 622A and the diaphragm 50 can be reduced, and the residual bubbles in the cathode chamber Cc can be reduced. This can prevent the bubbles from adhering to the substrate, and the plating quality can be poor, such as uneven local plating. In addition, by providing the chamfered portion 624A only on the lower surface of the beam 622A, both the beam strength and the reduction of residual bubbles can be achieved.

[0092] because Figure 8 The circumscribed circle Rm shown roughly corresponds to the projection of the substrate Wf. Therefore, if the chamfered portion 624B is provided on the beam 622A of the honeycomb structure inside the circumscribed circle Rm, it is expected to prevent bubbles from adhering to the substrate Wf, local uneven plating and other poor plating quality effects, but the same chamfered portion can also be provided on the beam 622B. In addition, regardless of whether the center Cm of the honeycomb structure is eccentric with the rotation center / rotation center axis Cw of the substrate holder 20 (substrate Wf), the above-mentioned chamfered portion can reduce the bubble residue. The above-mentioned chamfered portion can also be applied to the diaphragm support portion of the vertical plating device. In addition, the above-mentioned chamfer is not limited to the C chamfer, as long as it can achieve the effect of bubble adhesion, it can also be a chamfer of any shape.

[0093] According to the above-described embodiment, the following effects are achieved.

[0094] (1) In the anode holder 610 , the seal 704 can appropriately seal the outer peripheral portion of the diaphragm 50 and the outer peripheral portion of the holder body 620 / anode holder 610 .

[0095] (2) The seal 701 can appropriately seal the space between the outer periphery of the anode holder 610 and the interior of the plating tub 10 so as to partition the interior of the plating tub 10 into upper and lower chambers (anode chamber and cathode chamber).

[0096] (3) According to the above configurations (1) and (2), by attaching the anode holder 610 to the plating tank 10 , the interior of the plating tank 10 can be partitioned and sealed into the cathode chamber and the anode chamber above and below the diaphragm 50 .

[0097] (4) The seal 702 can appropriately seal the area around the opening 12B of the plating tank 10 and the front plate 640 of the anode holder 610. At this time, the seal 702 can be appropriately elastically deformed by moving the frame member 642 of the front plate 640 in the front-rear direction.

[0098] (5) The seal 703 can appropriately seal between the frame member 642 of the front plate 640 and the front plate main body 641 .

[0099] (6) According to the above-described structures (4) and (5), by attaching the anode holder 610 to the plating tank 10 , the inside of the plating tank 10 can be appropriately sealed from the outside.

[0100] (Other embodiments)

[0101] (1) When the inside of the plating tank 10 can be sealed liquid-tightly relative to the outside by the seal 704 by designing the structure of the seal 704 between the front plate 640 and the plating tank 10, the front plate body 641 and the frame member 642 may be provided as an integrated front plate 640 and the seal 703 may be omitted.

[0102] (2) In the above-mentioned embodiment, a back plate 62 for adjusting the amount of gas accumulation is provided on the lower surface side of the anode 60, but a bubble buffer ring may be provided instead of the back plate 62, and the bubble buffer ring is provided to surround the anode 60, and the amount of bubbles generated from the anode and accumulated on the lower surface is adjusted by the height of the bubble buffer ring (International Publication No. 2023 / 188371).

[0103] At least the following aspects can be understood from the above-mentioned embodiments.

[0104] [1] According to one embodiment, a plating device is provided, the plating device comprising: a plating tank for holding a plating solution; a substrate holder for holding a substrate with a plated surface facing downward; an anode holder assembly mounted in the plating tank through an opening in a side wall of the plating tank so as to be freely withdrawn in a horizontal direction, the anode holder assembly comprising: an anode holder having one or more openings in a central portion; an anode mounted in the anode holder; and a diaphragm mounted in the anode holder above the anode, wherein the anode holder assembly comprises one or more sealing surfaces for sealing the inside of the plating tank relative to the outside, and one or more sealing surfaces for dividing the inside of the plating tank into upper and lower chambers. For the sake of convenience, the one or more sealing surfaces for sealing the inside of the plating tank relative to the outside are sometimes referred to as sealing surfaces for closing the plating tank, and the one or more sealing surfaces for dividing the inside of the plating tank into upper and lower chambers are sometimes referred to as sealing surfaces for dividing the inside of the plating tank.

[0105] According to this method, in a face-down plating device, the diaphragm and the anode that need to be regularly maintained can be integrated with the anode holder that can be pulled out freely, so that the diaphragm and the anode can be easily maintained. That is, the anode holder assembly that holds the anode and the diaphragm arranged at the bottom of the plating tank is taken out of the plating tank, and the anode and the diaphragm are replaced outside the plating tank (including replacing the entire anode holder assembly).

[0106] According to this method, by installing the anode holder assembly (anode holder) in the plating tank, the inside of the plating tank can be sealed relative to the outside, and the inside of the plating tank can be divided into upper and lower chambers (anode chamber, cathode chamber). That is, the inside of the plating tank can be sealed relative to the outside by one or more sealing surfaces for closing the plating tank, and the inside of the plating tank can be divided into upper and lower chambers (anode chamber, cathode chamber) by another one or more sealing surfaces for dividing the inside of the plating tank.

[0107] Furthermore, since the diaphragm is also attached to the plating tank by attaching the anode holder to the plating tank, the diaphragm can be easily attached to the plating tank.

[0108] [2] According to one embodiment, one or more sealing surfaces that divide the interior of the plating tank into upper and lower chambers include: a first sealing surface that seals between the diaphragm and the anode holder, and a second sealing surface that seals between the outer periphery of the anode holder and the plating tank.

[0109] According to this method, since the diaphragm is installed in the anode holder in a sealed state before the anode holder assembly is installed in the plating tank, when the anode holder assembly is installed in the plating tank, if the outer periphery of the anode holder and the plating tank are sealed, the inside of the plating tank can be divided into upper and lower chambers.

[0110] [3] According to one embodiment, the diaphragm is attached to the outer periphery of the anode holder via a first sealing member at the outer periphery of the diaphragm, and the first sealing surface is formed between the outer periphery of the diaphragm and the outer periphery of the anode holder.

[0111] According to this aspect, the space between the diaphragm and the anode holder can be sealed with a simple structure.

[0112] [4] According to one embodiment, the plating tank has a first flange having a lower surface exposed in the space within the plating tank, and the anode holder has a second flange provided on the upper portion of the outer periphery of the anode holder. The anode holder is mounted on the upper surface of the second flange to the lower surface of the first flange of the plating tank via an annular second seal, and the second sealing surface is formed between the upper surface of the second flange of the anode holder and the lower surface of the first flange of the plating tank.

[0113] According to this method, the anode holder and the plating tank can be reliably sealed over the entire circumference via the surfaces of the anode holder and the plating tank that are opposed in the vertical direction. Thus, the anode holder and the plating tank can be reliably sealed over the entire circumference without being affected by the sealing surface that blocks the opening of the side wall of the plating tank.

[0114] [5] According to one embodiment, the second flange of the anode holder is mounted to the first flange of the plating tank via one or more fastening components, and the second sealing component is elastically deformed between the first flange and the second flange by fastening the fastening components.

[0115] According to this aspect, the outer periphery of the anode holder can be fixed at a predetermined position in the plating bath by one or more fastening members, and the second sealing member can be elastically deformed to reliably seal between the outer periphery of the anode holder and the plating bath.

[0116] [6] According to one embodiment, one or more sealing surfaces for sealing the inside of the plating tank relative to the outside include a third sealing surface, and the third sealing surface seals the anode holder and the periphery of the opening of the plating tank.

[0117] According to this aspect, the inside of the plating tank can be sealed from the outside around the opening of the side wall of the plating tank into which the anode holder assembly is inserted.

[0118] [7] According to one embodiment, the anode holder has a front plate, which is provided at one end of the anode holder and blocks the opening of the plating tank. The front plate has: a front plate body; and a frame member, which is slidably fitted to the front plate body around the front plate body. The frame member is mounted to the side wall around the opening of the plating tank or to the third flange provided around the opening of the plating tank via a third seal. A third sealing surface is formed between the frame member and the side wall around the opening of the plating tank or between the frame member and the third flange provided around the opening of the plating tank. The frame member is fitted to the front plate body via a fourth seal. A fourth sealing surface is formed between the inner peripheral surface of the frame member and the outer peripheral surface of the front plate body. When the third flange is provided, the third flange is a part of the plating tank.

[0119] According to this method, even if the third sealing member is offset by the force in the up-down direction, the frame member can be pushed against the plating tank side wall / the third flange in the front-back direction, and the third sealing member can be reliably elastically deformed between the plating tank and the frame member to exert sealing performance. Thus, the plating tank and the frame member can be reliably sealed by the third sealing member. In addition, the front plate body and the frame member can be sealed by the fourth sealing member. As a result, the inside of the plating tank can be reliably sealed relative to the outside.

[0120] [8] According to one embodiment, the frame member is mounted to the side wall around the opening of the plating tank, or to the third flange provided around the opening of the plating tank, through one or more fastening members, and the third sealing member is elastically deformed between the frame member and the side wall or the third flange by fastening the fastening members.

[0121] According to this aspect, the front plate can be attached to the side wall of the plating tank by one or more fastening members, and the third sealing member can be deformed so as to reliably seal between the opening of the plating tank and the front plate.

[0122] [9] According to one embodiment, the frame member is fitted into the front plate main body, whereby the fourth sealing member is elastically deformed between the frame member and the front plate main body.

[0123] According to this aspect, by fitting the frame member to the front plate main body, the fourth sealing member can be elastically deformed so as to reliably seal between the frame member and the front plate main body.

[0124]

[10] According to one embodiment, the anode holder includes: an outer peripheral portion; and a diaphragm supporting portion having a plurality of openings inside the outer peripheral portion and supporting an upper surface of the diaphragm.

[0125] According to this aspect, the upper surface of the diaphragm can be appropriately pressed by the diaphragm support portion of the anode holder, and upward deflection of the diaphragm can be suppressed.

[0126]

[11] According to one embodiment, the multiple openings of the diaphragm supporting portion include: a plurality of openings of a first shape; and a plurality of openings of a second shape, which are arranged on the outside of the plurality of openings of the first shape, and the center of the circumscribed circle including the plurality of openings of the first shape is eccentric from the rotation center of the substrate holder.

[0127] According to this aspect, since the center of the pattern of the diaphragm support portion is eccentric from the rotation center / rotation center axis of the substrate, the transfer of the shape of the pattern of the diaphragm support portion by the plated film can be suppressed, thereby improving the uniformity of the film thickness of the plated film.

[0128]

[12] According to one embodiment, the structure formed by the plurality of openings of the first shape is a honeycomb structure.

[0129] According to this aspect, the diaphragm support portion can support the central portion of the diaphragm, which is likely to bend greatly, with sufficient strength while ensuring a large opening area. That is, it is possible to suppress the deflection of the diaphragm while suppressing the influence on the electric field between the substrate and the anode.

[0130]

[13] According to one embodiment, the plurality of openings of the second shape are formed between a plurality of beams extending radially from the apex of the outermost periphery of the honeycomb structure to the outer periphery.

[0131] According to this aspect, it is possible to ensure a large opening area while ensuring necessary support strength in the vicinity of the outer peripheral portion of the diaphragm where the possibility of large deflection is low.

[0132]

[14] According to one method, the anode is a plate-like component having a plurality of through holes, which is closely arranged on the lower surface of the diaphragm, and also has a back plate, which is separated from the bottom of the anode by a predetermined distance, and the amount of gas generated from the anode retained on the lower surface of the anode is adjusted by the back plate.

[0133] According to this aspect, since the anode and the separator are in close contact with each other, the height dimension of the anode holder assembly in which the anode and the separator are integrated can be suppressed, and the anode holder assembly can be compactly configured.

[0134] According to this method, since the anode is in close contact with the diaphragm, it is possible to suppress or prevent the gas generated at the anode from accumulating between the diaphragm and the anode, and to suppress or prevent the electric field between the anode and the substrate from being affected by the gas and affecting the uniformity of the plating film thickness. In addition, by using the back panel to adjust the amount of gas retained on the lower surface through the multiple through holes of the anode, it is possible to suppress or prevent a large amount of gas from escaping from the lower surface of the anode at the same time and causing the anode voltage to change. Thus, it is possible to suppress or prevent the uniformity of the film thickness of the plating film from decreasing.

[0135]

[15] According to one embodiment, the anode holder has a cathode liquid inlet for supplying a plating liquid serving as a cathode liquid to the cathode chamber.

[0136] According to this aspect, since the cathode liquid inlet is provided in the anode holder, the structure of the plating tank can be made more compact.

[0137]

[16] According to one method, the cathode liquid inlet is arranged at a position lower than the diaphragm, and a cathode liquid passage is provided in the anode holder, wherein the cathode liquid passage has: an inlet connected to the cathode liquid inlet below the diaphragm; and an outlet opening above the diaphragm.

[0138] According to this method, the cathode liquid inlet is located below the diaphragm and at the lowest part of the cathode chamber, so the residual cathode liquid remaining in the cathode chamber can be minimized. In addition, since the cathode liquid is introduced from the lower part of the anode holder and supplied to the upper part of the diaphragm (cathode chamber), it is easy to form a sealing surface for sealing the plating tank at the upper part of the outer periphery of the anode holder. According to this structure, it is easy to form a sealing surface between the outer periphery of the anode holder and the plating tank with a simple structure, and it is easy to ensure that the volume of the anode chamber is large enough.

[0139]

[17] According to one embodiment, a variable anode mask is further provided above the diaphragm.

[0140] According to this aspect, the variable anode mask can also be integrated with the removable anode holder, making it easy to maintain the variable anode mask.

[0141]

[18] According to one embodiment, there is provided a method for dividing a plating tank into an anode chamber and a cathode chamber, comprising: preparing an anode holder, the anode holder being equipped with an anode and a diaphragm, and having one or more sealing surfaces for sealing the inside of the plating tank relative to the outside, and one or more sealing surfaces for dividing the inside of the plating tank into upper and lower chambers; and installing the anode holder in the plating tank via an opening of a side wall of the plating tank, the anode holder blocking the opening of the plating tank to seal the inside of the plating tank relative to the outside, and dividing the inside of the plating tank into the anode chamber and the cathode chamber above and below the diaphragm.

[0142] [A1] According to one embodiment, a plating device is provided, which comprises: a plating tank for holding a plating liquid; a substrate holder for holding a substrate with a plated surface facing downward; an anode arranged opposite to the substrate; a diaphragm arranged between the substrate and the anode; and a diaphragm support portion for pressing an upper surface of the diaphragm, the diaphragm support portion having a plurality of openings of a first shape and a plurality of openings of a second shape arranged outside the plurality of openings of the first shape, the center of a circumscribed circle including the plurality of openings of the first shape being eccentric from a rotation center of the substrate holder.

[0143] According to this aspect, since the center of the pattern of the diaphragm support portion is eccentric from the rotation center / rotation center axis of the substrate, the transfer of the shape of the pattern of the diaphragm support portion by the plated film can be suppressed, thereby improving the uniformity of the film thickness of the plated film.

[0144] [A2] According to one embodiment, the structure formed by the plurality of openings of the first shape is a honeycomb structure.

[0145] According to this aspect, the diaphragm support portion can support the central portion of the diaphragm, which is likely to bend greatly, with sufficient strength while ensuring a large opening area. That is, it is possible to suppress the deflection of the diaphragm while suppressing the influence on the electric field between the substrate and the anode.

[0146] [A3] According to one embodiment, the plurality of openings of the second shape are formed between a plurality of beams extending radially from vertices of the outermost periphery of the honeycomb structure to the outer periphery.

[0147] According to this aspect, it is possible to ensure a large opening area while ensuring necessary support strength in the vicinity of the outer peripheral portion of the diaphragm where the possibility of large deflection is low.

[0148] [A4] According to one method, the anode is a plate-like component having a plurality of through holes, which is closely arranged on the lower surface of the diaphragm, and also has a back plate, which is separated from the bottom of the anode by a predetermined distance, and the amount of gas generated from the anode retained on the lower surface of the anode is adjusted by the back plate.

[0149] According to this aspect, since the anode and the separator are in close contact with each other, the height dimension of the anode holder assembly in which the anode and the separator are integrated can be suppressed, and the anode holder assembly can be compactly configured.

[0150] According to this method, since the anode is in close contact with the diaphragm, it is possible to suppress or prevent the gas generated at the anode from accumulating between the diaphragm and the anode, and to suppress or prevent the electric field between the anode and the substrate from being affected by the gas and affecting the uniformity of the plating film thickness. In addition, by using the back panel to adjust the amount of gas retained on the lower surface through the multiple through holes of the anode, it is possible to suppress or prevent a large amount of gas from escaping from the lower surface of the anode at the same time and causing the anode voltage to change. Thus, it is possible to suppress or prevent the uniformity of the film thickness of the plating film from decreasing.

[0151] [A5] According to one embodiment, a variable anode mask is further provided, and the variable anode mask is arranged above the diaphragm.

[0152] According to this aspect, the exposed area of ​​the anode is adjusted by the variable anode mask, and the uniformity of the plated film thickness is also improved.

[0153] [A6] According to one embodiment, the plurality of openings of the first shape and the plurality of openings of the second shape are defined by a plurality of beams, and at least a portion of the beams are chamfered on a side in contact with the diaphragm.

[0154] According to this method, by providing a chamfer on the shape of the beam disposed on the cathode chamber side of the diaphragm, the contact area between the beam and the diaphragm can be reduced, and the residual bubbles in the cathode chamber can be reduced. This can prevent bubbles from adhering to the substrate, local uneven plating, and other poor plating quality. In addition, by providing a chamfer only on the lower surface of the beam, both the beam strength and the reduction of residual bubbles can be taken into account.

[0155] [A7] According to one embodiment, the beam defining the plurality of openings of the first shape is chamfered.

[0156] In the region of the plurality of openings of the first shape roughly corresponding to the projection of the substrate, residual bubbles can be effectively reduced, and poor plating quality such as adhesion of bubbles to the substrate and local uneven plating can be prevented.

[0157] [A8] According to one method, a plating device is provided, which comprises: a plating tank for holding a plating liquid; a substrate holder for holding a substrate; an anode arranged opposite to the substrate; a diaphragm arranged between the substrate and the anode; and a diaphragm support portion for pressing the diaphragm, the diaphragm support portion having a surface and a back surface, and having a plurality of beams for defining a plurality of openings passing through the surface and the back surface, and at least a portion of the beams are chamfered on the back surface side in contact with the diaphragm.

[0158] The diaphragm support portion can be arranged on the substrate side and / or the anode side with respect to the diaphragm.

[0159] According to this method, by providing a chamfer on the contact side of the beam of the diaphragm support portion with the diaphragm, the contact area between the beam and the diaphragm can be reduced, and the residual bubbles in the plating solution can be reduced. This can prevent the bubbles from adhering to the substrate, the plating quality from being poor, and the like, such as local uneven plating. In addition, by providing a chamfer only on the contact side of the beam, both the beam strength and the reduction of residual bubbles can be achieved.

[0160] [A9] Provided is a plating method, which is a plating method for plating a substrate with a plated surface facing downward, wherein a plating tank is prepared, the plating tank comprising: an anode opposite to the substrate; a diaphragm arranged between the substrate and the anode; and a diaphragm support portion for pressing the upper surface of the diaphragm, the diaphragm support portion having a plurality of openings of a first shape and a plurality of openings of a second shape arranged outside the plurality of openings of the first shape, and the substrate is plated while being rotated in a state where the rotation center of the substrate is eccentric from the center of a circumscribed circle of the plurality of openings of the first shape including the diaphragm support portion.

[0161] According to this aspect, since the center of the pattern of the diaphragm support portion is eccentric from the rotation center / rotation center axis of the substrate, the transfer of the shape of the pattern of the diaphragm support portion by the plated film can be suppressed, thereby improving the uniformity of the film thickness of the plated film.

[0162] [A10] According to one embodiment, a plating method is provided, which is a plating method for plating a substrate, wherein a plating tank is prepared, the plating tank comprising: an anode opposite to the substrate; a diaphragm arranged between the substrate and the anode; and a diaphragm support portion for pressing the diaphragm, the diaphragm support portion having a plurality of beams with predetermined plurality of openings, at least a portion of the beams being chamfered on a side in contact with the diaphragm, and the substrate is plated using the plating tank.

[0163] The diaphragm support portion can be arranged on the substrate side and / or the anode side with respect to the diaphragm.

[0164] According to this method, by providing a chamfer on the contact side of the beam of the diaphragm support portion with the diaphragm, the contact area between the beam and the diaphragm can be reduced, and the residual bubbles in the plating solution can be reduced. This can prevent the bubbles from adhering to the substrate, the plating quality from being poor, and the like, such as local uneven plating. In addition, by providing a chamfer only on the contact side of the beam, both the beam strength and the reduction of residual bubbles can be achieved.

[0165] The above has described the embodiments of the present invention, but the embodiments of the above invention are for easy understanding of the present invention and are not intended to limit the present invention. The present invention can be changed and improved without departing from its main purpose, and it is self-evident that the present invention includes its equivalents. In addition, within the scope of being able to solve at least part of the above-mentioned problems or within the scope of achieving at least part of the effect, the embodiments and modifications can be arbitrarily combined, and the various constituent elements described in the claims and the specification can be arbitrarily combined or omitted.

[0166] The entire disclosure of International Publication No. 2003 / 079684 (Patent Document 1) and International Publication No. 2023 / 188371 including the specification, claims, drawings and abstract is incorporated herein by reference in its entirety.

[0167] Description of Reference Numerals

[0168] 6...anode holder assembly; 10...plating tank; 11...upper tank; 12...lower tank; 12A...flange; 12B...opening; 12C...anolyte inlet; 12D...flange; 20...substrate holder; 30...paddle; 40...resistor; 50...diaphragm; 51...seal ring; 60...anode; 60A...boss; 62...anode fixing plate; 400...plating module; 610...anode holder; 613...bottom wall; 614-617...side wall; 614a...cutout; 620...holder body; 621...ring; 622...diaphragm support; 622A...beam; 622B. ..beam; 623...flange; 640...front plate; 641...front plate body; 642...frame member; 650...variable anode mask; 651...blade; 652...driving member; 660...bus bar; 670...driving shaft; 671...connecting member; 680...cathodic liquid inlet; 681...cathodic liquid passage; 701~704...seal; 701A~704A...sealing surface; 801~805...fastening member; 804A...spacer; 810...diaphragm pressing member; 1000...plating device; Rm...circumscribed circle; Cm...center of circumscribed circle; Cw...rotation center (rotation center axis); Wf...substrate.

Claims

1. A plating device, wherein: The plating device comprises: A plating tank for holding a plating solution; a substrate holder for holding the substrate with the plated surface facing downward; an anode, arranged opposite to the substrate; A diaphragm is disposed between the substrate and the anode; as well as a diaphragm support portion that presses the upper surface of the diaphragm, the diaphragm support portion having a plurality of openings of a first shape and a plurality of openings of a second shape disposed outside the plurality of openings of the first shape, The center of a circumscribed circle including the plurality of openings of the first shape is eccentric from the rotation center of the substrate holder.

2. The plating device according to claim 1, wherein: The structure formed by the plurality of openings of the first shape is a honeycomb structure.

3. The plating device according to claim 2, wherein: The plurality of openings of the second shape are formed between a plurality of beams extending radially from the apex of the outermost periphery of the honeycomb structure to the outer periphery.

4. The plating device according to claim 1, wherein: The anode is a plate-shaped member having a plurality of through holes and is arranged closely to the lower surface of the diaphragm. A back plate is also provided, the back plate being separated from the anode by a predetermined distance below the anode. The amount of gas generated from the anode and retained on the lower surface of the anode is adjusted by the rear plate.

5. The plating device according to any one of claims 1 to 4, wherein: A variable anode mask is further provided, and the variable anode mask is arranged above the diaphragm.

6. The plating device according to claim 1, wherein: The plurality of openings of the first shape and the plurality of openings of the second shape are defined by a plurality of beams, At least a portion of the beam is chamfered on a side in contact with the diaphragm.

7. The plating device according to claim 6, wherein: The beam defining the plurality of openings of the first shape is chamfered.

8. A plating device, wherein: The plating device comprises: A plating tank for holding a plating solution; a substrate holder for holding a substrate; an anode, arranged opposite to the substrate; A diaphragm is disposed between the substrate and the anode; as well as A diaphragm support portion presses the diaphragm, the diaphragm support portion having a front surface and a back surface, and having a plurality of beams defining a plurality of openings penetrating between the front surface and the back surface, wherein at least a portion of the beams are chamfered on the back surface side contacting the diaphragm.

9. A plating method, wherein a substrate is plated with the plated surface facing downward, wherein: A plating tank is prepared, the plating tank having: an anode facing the substrate; A diaphragm is disposed between the substrate and the anode; and a diaphragm support portion that presses the upper surface of the diaphragm, the diaphragm support portion having a plurality of openings of a first shape and a plurality of openings of a second shape disposed outside the plurality of openings of the first shape, The substrate is plated while rotating the substrate in a state where the rotation center of the substrate is eccentric from the center of a circumscribed circle including the plurality of openings of the first shape of the diaphragm support member.

10. A plating method for plating a substrate, wherein: A plating tank is prepared, the plating tank having: an anode facing the substrate; A diaphragm is disposed between the substrate and the anode; and a diaphragm support portion for pressing the diaphragm, the diaphragm support portion having a plurality of beams defining a plurality of openings, at least a portion of the beams being chamfered on a side in contact with the diaphragm, The substrate is plated using the plating bath.

Images