Foldable electronic device including flexible printed circuit board

Abstract

Disclosed is a foldable electronic device according to an exemplary embodiment of the present disclosure, including: a foldable case including a first case, a second case, and a hinge portion connecting the first case and the second case to each other; and a flexible printed circuit board electrically connecting a first element provided in the first housing and a second element provided in the second housing to each other and arranged across the hinge portion, in which the flexible printed circuit board includes: a first region including a first connector end electrically connected to the first element; a second region including a second connector end electrically connected to the second element and disposed across the hinge portion; a third region disposed between the first region and the second region, the third region including a first portion extending in a first direction and a second portion extending to the second region in a second direction different from the first direction, and the first region and the third region being disposed in the first housing; and a rigid portion configured to connect the first region or the third region extending toward the hinge portion to the first housing.

Description

Technical Field

[0001] The present disclosure relates to a foldable electronic device including a flexible printed circuit board. Background Art

[0002] A foldable electronic device has a screen (or display) that can be folded.

[0003] The above information may be provided as related art for the purpose of enhancing understanding of the present disclosure. No argument or determination is made as to whether the above may be applicable as prior art related to the present disclosure. Summary of the invention

[0004] Technical issues

[0005] A foldable electronic device may include a flexible printed circuit board (FPCB) disposed in an inner space of the foldable electronic device across a folding portion. Due to assembly deviation (or assembly position deviation), for example, deviation or inaccuracy of value, position or orientation during assembly, a structure including the flexible printed circuit board and other component elements connected, coupled or fixed to the flexible printed circuit board may be difficult to be reliably positioned.

[0006] Example embodiments of the present disclosure may provide a foldable electronic device including a flexible printed circuit board, which can stably position a structure including the flexible printed circuit board and other constituent elements connected, coupled, or fixed to the flexible printed circuit board.

[0007] The technical problems to be solved by the present disclosure are not limited to the above-mentioned technical problems, and those skilled in the art to which the present disclosure belongs may understand other technical problems not mentioned above from the following description.

[0008] Solution to the problem

[0009] According to an exemplary embodiment of the present disclosure, a foldable electronic device includes a foldable housing and a flexible printed circuit board. The foldable housing includes a first housing, a second housing, and a hinge portion connecting the first housing and the second housing. The flexible printed circuit board electrically connects a first element disposed in the first housing and a second element disposed in the second housing, and is disposed across the hinge portion. The flexible printed circuit board includes a first region, a second region, a third region, and a rigid portion. The first region extends from a first connector end electrically connected to the first element. The second region extends from a second connector end electrically connected to the second element and is disposed across the hinge portion. The third region is disposed between the first region and the second region. The third region includes a first portion extending in a first direction and a second portion extending to the second region in a second direction. The second direction is different from the first direction. The first region and the third region are disposed in the first housing. The rigid portion is configured to connect the first region or the third region extending toward the hinge portion to the first housing.

[0010] Advantageous Effects of the Invention

[0011] Since the foldable electronic device including the flexible printed circuit board according to the example embodiment of the present disclosure stably sets the structure including the flexible printed circuit board and / or other constituent elements connected, coupled or fixed to the flexible printed circuit board, the yield and reliability of the foldable electronic device can be improved.

[0012] Other effects that can be obtained or expected by various embodiments of the present disclosure will be disclosed directly or implicitly in the detailed description of the embodiments of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Through the attachment Figure 1 The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following detailed description provided herein.

[0014] Figure 1 is a block diagram of an electronic device in a network environment according to an embodiment of the present disclosure.

[0015] Figure 2 is a view showing a foldable electronic device in an unfolded state according to an embodiment of the present disclosure.

[0016] Figure 3 is a view showing a foldable electronic device in a folded state according to an embodiment of the present disclosure.

[0017] Figure 4 is an exploded perspective view of a foldable electronic device in an unfolded state according to an embodiment of the present disclosure.

[0018] Figure 5 is a view showing a portion of a foldable electronic device in an unfolded state according to an embodiment of the present disclosure.

[0019] Figure 6 FIG. 1 is a diagram showing an embodiment of the present disclosure. Figure 5 A cross-sectional view of a portion of a foldable electronic device cut along line CC' in FIG.

[0020] Figure 7 is a view illustrating a process of disposing a first flexible printed circuit board according to an embodiment of the present disclosure.

[0021] Figure 8 and Fig. 9 is an exploded perspective view of a foldable electronic device according to an embodiment of the present disclosure.

[0022] Fig.10 is a perspective view of a foldable electronic device in an unfolded state according to an embodiment of the present disclosure.

[0023] Fig.11 is a view showing a foldable electronic device in an unfolded state according to an embodiment of the present disclosure.

[0024] Fig.12 is a view showing a foldable electronic device in an unfolded state according to an embodiment of the present disclosure.

[0025] Fig.13 is a view showing the foldable electronic device with a connection member separated. DETAILED DESCRIPTION

[0026] Hereinafter, various exemplary embodiments of the present disclosure disclosed herein will be described in more detail with reference to the accompanying drawings.

[0027] Figure 1 is a block diagram of an electronic device 101 in a network environment 100 according to an embodiment of the present disclosure.

[0028] refer to Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the external electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). The electronic device 101 may communicate with the external electronic device 104 via the server 108. The electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, and / or an antenna module 197. In some embodiments of the present disclosure, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments of the present disclosure, some components may be implemented as a single integrated circuit. For example, the sensor module 176, the camera module 180, or the antenna module 197 may be implemented as embedded in a single component (eg, the display module 160).

[0029] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. As at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the obtained data in the non-volatile memory 134. The processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 121 in operation. In addition or alternatively, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121 , or as part of the main processor 121 .

[0030] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. The auxiliary processor 123 (e.g., an image signal processor (ISP) or a communication processor (CP)) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment of the present disclosure, the auxiliary processor 123 (e.g., a neural network processing device) may include a hardware structure designated to process an artificial intelligence model. The artificial intelligence model may be created through machine learning. For example, learning can be performed in the electronic device 101 itself that can execute the artificial intelligence model, or can be performed by a separate server (e.g., server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to this. The artificial intelligence model may include multiple artificial neural network layers, and the artificial neural network may be any of a deep neural network (DNN), a convolutional neural network (CNN), a recursive neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recursive DNN (BRDNN), a deep Q network, or a combination of two or more of the above networks, but is not limited to the above examples. In addition to the hardware structure, the artificial intelligence model may additionally or optionally include a software structure.

[0031] Various data used by the memory 130 or non-volatile memory 101H (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 and / or a non-volatile memory 134.

[0032] The program 140 may be stored as software in the memory 130, and may include, for example, an operating system (OS) 142, middleware 144, and / or applications 146.

[0033] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0034] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as playing multimedia or playing a recording, and the receiver can be used for incoming calls. The receiver can be implemented as a separate speaker or as a part of the speaker.

[0035] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. The display module 160 may include a touch circuit (e.g., a touch sensor) suitable for detecting a touch, or a sensor circuit (e.g., a pressure sensor) suitable for measuring the force generated by a touch.

[0036] The audio module 170 can convert sound into an electrical signal, or vice versa. The audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., external electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0037] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. The sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0038] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., external electronic device 102). The interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface.

[0039] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the external electronic device 102) via the connector. The connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, and / or an audio connector (e.g., a headphone connector).

[0040] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. The haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0041] The camera module 180 may capture still images or moving images. The camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

[0042] The power management module 188 may manage power provided to or consumed by the electronic device 101. The power management module 188 may be implemented as, for example, at least part of a power management integrated circuit (PMIC).

[0043] The battery 189 may power at least one component of the electronic device 101. The battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, and / or a fuel cell.

[0044] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., external electronic device 102, external electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. The communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0045] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 of the present disclosure can support various requirements specified in the electronic device 101, an external electronic device (e.g., an external electronic device 104), or a network system (e.g., a second network 199). Depending on the embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0046] The antenna module 197 may transmit a signal or power to the outside of the electronic device 101 (e.g., an external electronic device) or receive a signal or power from the outside of the electronic device 101 (e.g., an external electronic device). The antenna module 197 may include an antenna including a radiating element, the radiating element being composed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. Additional components other than the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

[0047] According to various embodiments of the present disclosure, the antenna module 197 may form a millimeter wave antenna module. According to embodiments of the present disclosure, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or is adjacent to the first surface and is capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or is adjacent to the second surface and is capable of transmitting or receiving signals of the specified high frequency band.

[0048] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0049] A command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. All or some operations to be executed on the electronic device 101 may be executed on one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute the requested at least part of the function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request when the result is further processed or when the result is not further processed. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment of the present disclosure, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment of the present disclosure, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0050] The electronic device according to the embodiment of the present disclosure may be one of various types of electronic devices. The electronic device may include a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. However, the electronic device is not limited to any of the above.

[0051] The various embodiments of the present disclosure and the terms used herein are not intended to limit the technical features set forth herein to specific embodiments, and include various changes, equivalents or replacements of the corresponding embodiments. With regard to the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It should be understood that, unless otherwise clearly stated in the relevant context, the singular form of the noun corresponding to the project may include one or more things. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together in the corresponding phrase in the phrase. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). If an element (e.g., a first element) is referred to as being “coupled,” “coupled to,” “connected to,” or “connected to” another element (e.g., a second element) with or without the term “operably” or “communicatively,” the element may be coupled to the other element directly (e.g., by wire), wirelessly, or via a third element.

[0052] The term "module" may include a unit implemented in hardware, software or firmware or any combination thereof, and may be used interchangeably with other terms (e.g., "logic", "logic block", "component" or "circuit"). A module may be a single integrated component or its smallest unit or part suitable for performing one or more functions. For example, according to an embodiment of the present disclosure, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0053] Various embodiments as described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) readable by a machine (e.g., electronic device 101). For example, a processor (e.g., processor 120) of a machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute it with or without one or more other components under the control of the processor. This allows the machine to be operated to perform at least one function according to at least one instruction called. One or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between a location where data is semi-permanently stored in the storage medium and a location where data is temporarily stored in the storage medium.

[0054] The method according to the embodiment of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)), or via an application store (e.g., PLAYSTORE TM ) online distribution (e.g., download or upload), or directly between two user devices (e.g., smartphones). If distributed online, at least a portion of the computer program product may be temporarily generated or at least temporarily stored in a machine-readable storage medium, such as a memory of a manufacturer's server, an application store's server, or a relay server.

[0055] Each component (e.g., module or program) in the above-mentioned components can include a single entity or multiple entities. One or more of the above-mentioned components can be omitted, or one or more other components can be added. Alternatively or additionally, multiple components (e.g., module or program) can be integrated into a single component. In this case, the integrated component can perform one or more functions of each of the multiple components in the same or similar manner as performed by a corresponding one of the multiple components before integration. The operations performed by a module, program or another component can be performed sequentially, in parallel, repeatedly or heuristically, or one or more of the operations can be performed or omitted in a different order, or one or more other operations can be added.

[0056] Figure 2 is a view showing the foldable electronic device 2 in an unfolded state (or an unfolded state or a flat state) according to an embodiment of the present disclosure. Figure 3is a view showing a foldable electronic device 2 in a folded state (or a folded state) according to an embodiment of the present disclosure.

[0057] See also Figure 2 and 3 The foldable electronic device 2 includes a foldable housing 20. In addition, the foldable electronic device 2 may include a first display module (eg, a flexible display module or a foldable display module) 24 and / or a second display module 25. In various embodiments, the foldable electronic device 2 may be Figure 1 The electronic device 101 in.

[0058] The foldable housing 20 includes a first housing (or a first housing portion or a first housing structure) 21, a second housing (or a second housing portion or a second housing structure) 22, and a hinge portion. In addition, according to an embodiment, the foldable housing 20 may include a hinge housing 23. The first housing 21 and the second housing 22 are connected by means of a hinge portion and can rotate relative to the hinge portion. The hinge portion may include one or more hinge modules (or hinge components), for example, Figure 4 The first hinge module 5A and / or the second hinge module 5B in.

[0059] According to an embodiment, the display area 24A of the first display module 24 is an active area of ​​the first display module 24 capable of displaying an image, and may include a first display area (or a first active area or a first screen area) ①, a second display area (or a second active area or a second screen area) ②, and a third display area (or a third active area or a third screen area) ③ connecting the first display area ① and the second display area ②. The first display area ① can be positioned corresponding to the first shell 21. The second display area ② can be positioned corresponding to the second shell 22. The third display area ③ can be positioned corresponding to the hinge portion. The first display area ① is arranged in the first shell 21, and the shape of the first display area ① can be maintained by the support of the first shell 21. The second display area ② is arranged in the second shell 22, and the shape of the second display area ② can be maintained by the support of the second shell 22. The first display area ① and the second display area ② can be set to be, for example, substantially flat. The unfolded state of the foldable electronic device 2 (see Figure 2) may be a state in which the third display area ③ is substantially flatly arranged. In the unfolded state of the foldable electronic device 2, the first display area ① and the second display area ② may form an angle of approximately 180 degrees, and the display area 24A including the first display area ①, the second display area ② and the third display area ③ may be provided (or arranged) in a substantially planar form. Due to the relative position between the first display area ① arranged in the first shell 21 and the second display area ② arranged in the second shell 22 in the unfolded state of the foldable electronic device 2, the third display area ③ connecting the first display area ① and the second display area ② may be arranged flatly. In the unfolded state of the foldable electronic device 2, the third display area ③ may be pulled from both sides by the first display area ① and the second display area ②, and a pulling force may be provided to set the third display area ③ flatly and reduce the damage of the third display area ③. In the unfolded state of the foldable electronic device ②, the third display area ③ may be pulled by the first display area ① and the second display area ② and be arranged to have an increased width, which allows the third display area ③ to be arranged flatly with reduced stress. In the unfolded state of the foldable electronic device 2, the hinge portion may support the third display area ③. In the unfolded state of the foldable electronic device 2, when an external force (e.g., external pressure such as touch input using a user's finger or touch input using an electronic pen) is applied to the third display area ③, the hinge portion may help reduce the sagging phenomenon of the third display area ③, so that the third display area ③ remains flat. In the unfolded state of the foldable electronic device 2, when an external impact such as falling is applied, the hinge portion may be constructed to reduce the impact of the external impact on the third display area ③. In the unfolded state of the foldable electronic device 2, the hinge portion supports the third display area ③, so that the third display area ③ can be set flatly without sagging, thereby reducing the crease phenomenon. The illustrated coordinate axes are illustrated relative to the first shell 21. For example, the +z axis direction can be interpreted as the direction of the plane orientation provided by the flat first display area ①.

[0060] According to an embodiment, the foldable electronic device 2 may be provided in an inwardly foldable manner, wherein the display area 24A of the first display module 24 is folded inwardly. Figure 3The fully folded state of the foldable electronic device 2 is shown, wherein the first shell 21 and the second shell 22 are arranged so that the first shell is no longer close to the second shell. In the fully folded state of the foldable electronic device 2, the first display area ① and the second display area ② can be arranged to face each other, and the third display area ③ can be arranged in a curved form. In the fully folded state of the foldable electronic device 2, the angle between the first shell 21 and the second shell 22 (or the angle between the first display area ① and the second display area ②) can be from about 0 degrees to about 10 degrees, and the display area 24A can be substantially invisible. Although not shown, the intermediate state of the foldable electronic device 2 can be a state between the unfolded state and the fully folded state, or a state that is less folded than the fully folded state. In the case of an intermediate state where the angle between the first shell 21 and the second shell 22 is equal to or greater than any angle, a use environment in which the user has substantially no difficulty in using the display area 24A can be provided. In the following, the folded state of the foldable electronic device 2 as described in the present disclosure may refer to a fully folded state compared to an intermediate state of a less folded state.

[0061] According to an embodiment, the unfolded state of the foldable electronic device 2 (see Figure 2 ), the display area 24A of the first display module 24 can be provided in a symmetrical form relative to the center line A of the foldable electronic device 2. With reference to the unfolded state of the foldable electronic device 2, the center line A can correspond to the middle of the width extending from the first boundary between the first display area ① and the third display area ③ to the second boundary between the second display area ② and the third display area ③. In various embodiments, the center line A of the foldable electronic device 2 can be the "folding axis" of the foldable housing 20 or the foldable electronic device 2. The folding axis can be provided (or formed) by the hinge portion.

[0062] According to an embodiment, in the folded state of the foldable electronic device 2 (see Figure 3), the third display area ③ provided in a curved form may have a shape that is substantially symmetrical with respect to the center line A of the foldable electronic device 2. With reference to the unfolded state of the foldable electronic device 2, the display area 24A may be substantially rectangular. The display area 24A may include a first edge E1, a second edge E2, a third edge E3, and a fourth edge E4. The first edge E1 and the second edge E2 may be substantially parallel to the center line A. The third edge E3 may connect one end of the first edge E1 and one end of the second edge E2, and the fourth edge E4 may connect the other end of the first edge E1 and the other end of the second edge E2. The first display area ① may include the first edge E1, a portion of the third edge E3, and a portion of the fourth edge E4. The second display area ② may include the second edge E2, a portion of the third edge E3, and a portion of the fourth edge E4. The third display area ③ may include a portion of the third edge E3 and a portion of the fourth edge E4. In the folded state of the foldable electronic device 2, the first edge E1 and the second edge E2 may overlap to align. In the folded state of the foldable electronic device 2, a portion of the third edge E3 included in the first display area ① and a portion of the third edge E3 included in the second display area ② may overlap to be aligned. In the folded state of the foldable electronic device 2, a portion of the fourth edge E4 included in the first display area ① and a portion of the fourth edge E4 included in the second display area ② may overlap to be aligned.

[0063] According to an embodiment, the first housing 21 may include a first frame (or a first frame structure or a first frame) 211 and / or a first cover 212 disposed on the first frame 211. The first frame 211 may include a first side (or a first side surface portion, a first cross member, a first side surface structure, or a first side surface frame structure) (e.g., Figure 4 The first side may be arranged along an edge of the first display region ① of the first display module 24. The first side may provide a first side surface of the foldable electronic device 2 corresponding to the first display region ① of the foldable electronic device 2. The first frame 211 may include a first support portion (e.g., Figure 4The first display area ① may be disposed on the first support portion, and the first support portion may support the first display area ①. The first display area ① and the first cover 212 may be positioned relative to each other, with the first support portion of the first frame 211 being inserted between the first display area ① and the first cover 212. The first side of the first frame 211 may be configured to at least partially surround the space between the first display area ① and the first cover 212. The first display area ① may provide one surface of the outer surface of the foldable electronic device 2, and the first cover 212 may provide another surface of the outer surface of the foldable electronic device 2 pointing in a direction substantially opposite to the first display area ①. Various electrical components (or electronic components or elements), such as a printed circuit board or a battery, may be disposed on the first support portion between the first support portion of the first frame 211 and the first cover 212.

[0064] According to an embodiment, the second housing 22 may include a second frame (or a second frame structure or a second framework) 221 and / or a second cover 222 disposed on the second frame 221. The second frame 221 may include a second side (or a second side surface portion, a second cross member, a second side surface structure or a second side surface frame structure) (e.g., Figure 4 The second side 422 in the figure). The second side can be arranged along the edge of the second display area ② of the first display module 24. The second side can provide a second side surface of the foldable electronic device 2 corresponding to the second display area ② of the foldable electronic device 2. In the folded state of the foldable electronic device 2 (see Figure 3 ), the first side of the first frame 211 and the second side of the second frame 221 may overlap to align. The second frame 221 may include a second support portion (eg, Figure 4 The second support portion 421 in the foldable electronic device 2). The second display area ② can be arranged on the second support portion, and the second support portion can support the second display area ②. The second display area ② and the second cover 222 can be positioned relative to each other, with the first support portion of the second frame 221 inserted therebetween. The second side of the second frame 221 can be configured to at least partially surround the space between the second display area ② and the second cover 222. The second display area ② can provide one surface of the outer surface of the foldable electronic device 2, and the second cover 222 can provide another surface of the outer surface of the foldable electronic device 2, the other surface pointing in a direction substantially opposite to the second display area ②. Various electrical components (or electronic components or elements), such as a printed circuit board or a battery, can be arranged on the second support portion between the second support portion of the second frame 221 and the second cover 222.

[0065] According to one embodiment, the hinge housing (or hinge cover) 23 may be connected to the first hinge module 5A, the second hinge module 5B and / or the guide rail assembly 6. Figure 2 ) to the collapsed state (see Figure 3 ), the gap between the first shell 21 and the second shell 22 can be opened on the opposite side of the third display area ③, and the hinge shell 23 can be exposed to the outside through the opened gap due to the change in the relative position between the first shell 21 and the second shell 22 connected to each other by the hinge part and due to the change in the state of the hinge part connected to the hinge shell 23. In the folded state of the foldable electronic device 2, the hinged shell 23 can be a part of the appearance of the inside of the foldable electronic device 2 hidden by the opened gap between the first shell 21 and the second shell 22. The hinge shell 23 can be opened in the folded state. Figure 3 When the foldable electronic device 2 is converted from the folded state to the unfolded state, due to the change in the relative position between the first shell 21 and the second shell 22 connected to each other by the hinge portion, and due to the change in the state of the hinge portion connected to the hinge shell 23, the gap between the first shell 21 and the second shell 22 on the opposite side of the third display area ③ is closed, and the hinge shell 23 can be located in the internal space caused by the combination of the first shell 21 and the second shell 22, and may not be exposed to the outside.

[0066] According to an embodiment, the first housing 21 may include a first hinge housing cover 213 coupled to the first support portion 411 of the first frame 211 (see Figure 6 The second housing 22 may include a second hinge housing cover 223 coupled to the second support portion 421 of the second frame 221 (see Figure 6). In the unfolded state of the foldable electronic device 2, the first hinge housing cover 213 and the second hinge housing cover 223 may each cover both sides of the hinge housing 23, and the hinge housing 23 may not be exposed to the outside. In the folded state of the foldable electronic device 2, the hinge housing 23 may be exposed to the outside through the first hinge housing cover 213 and the second hinge housing cover 223 to provide a part of the appearance of the foldable electronic device 2. In the folded state of the foldable electronic device 2, one surface exposed to the outside of the hinge housing 23 may include a curved surface, and the first hinge housing cover 213 and the second hinge housing cover 223 may be provided with a curved shape including a curved surface portion corresponding to the curved surface. In various embodiments, the first frame 211 (or the first support portion 411) may be provided in the form of further including a portion corresponding to the first hinge housing cover 213. In this case, the first hinge housing cover 213 may be omitted. In various embodiments, the second frame 221 (or the second support portion 421) may be provided in the form of further including a portion corresponding to the second hinge housing cover 223. In this case, the second hinge housing cover 223 may be omitted.

[0067] According to an embodiment, the second display module 25 may be located between the second frame 221 and the second cover 222. The second cover 222 may be substantially transparent, and the second display module 25 may be visible through the second cover 222. In the folded state, the foldable electronic device 2 may be configured to display an image through the second display module 25 instead of the first display module 24.

[0068] According to an embodiment, the first cover 212 may include a first curved surface area 212a that is curved toward a first display area ① corresponding to a first edge E1 of the display area 24A and extends seamlessly. The second cover 222 may include a second curved surface area 222a that is curved toward a second display area ② corresponding to a second edge E2 of the display area 24A and extends seamlessly. The first curved surface area 212a and the second curved surface area 222a may be in an unfolded state (see Figure 2 ) or folded state (see Figure 3 ) are symmetrically arranged on opposite sides of the foldable electronic device 2, thereby contributing to the aesthetic appearance. In an embodiment, the second display module 25 may include a flexible display that may be arranged corresponding to the second curved area 222a. In various embodiments, the first cover 212 may be arranged substantially flat without the first curved area 212a. In various embodiments, the second cover 222 may be arranged substantially flat without the second curved area 222a. In this case, the second display module 25 may include a rigid display.

[0069] According to one embodiment, the foldable electronic device 2 may include one or more audio modules (eg, Figure 1 audio module 170 in the example), one or more sensor modules (e.g., Figure 1 sensor module 176 in), one or more camera modules (e.g., Figure 1 , a camera module 180 in the example, one or more lighting modules, one or more input modules (e.g., Figure 1 150) and / or one or more connection terminal modules (e.g., Figure 1 In various embodiments, the foldable electronic device 2 may omit at least one of the constituent elements, or may additionally include other constituent elements. The position or number of constituent elements included in the foldable electronic device 2 may vary, and is not limited to the example shown.

[0070] Any of the one or more audio modules may include, for example, a microphone located inside the foldable electronic device 2, which corresponds to a microphone hole 301 provided in the exterior of the foldable electronic device 2. In the example shown, the microphone hole 301 may be provided on a first side of the first frame 211, and the microphone may be located in the interior space of the first shell 21. The position or number of the microphone and the microphone hole may vary and is not limited to the example shown. In various embodiments, the foldable electronic device 2 may include a plurality of microphones for detecting the direction of sound.

[0071] Any of the one or more audio modules may include, for example, a first speaker for multimedia playback (or for recording playback) located inside the foldable electronic device 2, which corresponds to a first speaker hole 302 provided on the exterior of the foldable electronic device 2. In the example shown, the first speaker hole 302 may be provided on the second side of the second frame 221, and the first speaker may be positioned in the interior space of the second housing 22. Any of the one or more audio modules may include, for example, a second speaker for calling located inside the foldable electronic device 2 (e.g., a receiver for calling), which corresponds to a second speaker hole (e.g., a receiver hole) 303 provided on the exterior of the foldable electronic device 2. In the example shown, the second speaker hole 303 may be adjacent to the second cover 222 and provided in the second frame 221, and the second speaker may be positioned in the interior space of the second housing 22. The position or number of the speaker and the speaker hole may vary and is not limited to the example shown. In various embodiments, the microphone hole and the speaker hole may be implemented in a single hole. In various embodiments, a piezoelectric speaker may be provided in which the speaker hole is omitted.

[0072] The one or more sensor modules may, for example, generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the foldable electronic device 2. In an embodiment, any one of the one or more sensor modules may include an optical sensor 304, which is positioned in the internal space of the second shell 22, corresponding to the second cover 222. The optical sensor 304 may be positioned to align with an opening provided in the second display module 25 or at least partially inserted into the opening. External light may reach the optical sensor through an opening provided in the second cover 222 and the second display module 25. The optical sensor 304 may include, for example, a proximity sensor or an illumination sensor. The number or position of the optical sensors may vary and is not limited to the examples shown.

[0073] According to various embodiments, when viewed from the top of the second cover 222, the optical sensor 304 may overlap at least a portion of the display area of ​​the second display module 25 and be located in the internal space of the second housing 22. In this case, the optical sensor 304 or the position of the optical sensor 304 may not be visually distinguishable (or exposed) or visible, but the sensing function of the optical sensor 304 may be performed. In an embodiment, the optical sensor 304 may be positioned on the back surface of the second display module 25 or below or under the second display module 25, and the optical sensor 304 or the position of the optical sensor 304 may not be visually distinguishable (or exposed). In various embodiments, the optical sensor 304 may be positioned to align with or at least partially insert into a groove provided in the back surface of the second display module 25. Some areas of the second display module 25 that at least partially overlap with the optical sensor 304 may include a pixel structure and / or wiring structure that is different from other areas. For example, some areas of the second display module 25 that at least partially overlap with the optical sensor 304 may have a pixel density that is different from other areas. The pixel structure and / or wiring structure formed in some areas of the second display module 25 at least partially overlapping with the optical sensor 304 can reduce light loss between the outside and the optical sensor 304. In another example, the plurality of pixels may not be arranged in some areas of the second display module 25 at least partially overlapping with the optical sensor 304.

[0074] According to various embodiments, the optical sensor 304 is not limited to the proximity sensor or the illumination sensor, but various other sensors may be positioned corresponding to the opening provided in the second display module 25, or may be positioned on the back surface of the second display module 25, or positioned below or under the second display module 25. For example, an optical, capacitive, or ultrasonic biometric sensor (e.g., a fingerprint sensor) may be positioned to correspond to the opening provided in the second display module 25, or positioned on the back surface of the second display module 25, or below or under the second display module 25.

[0075] According to various embodiments, various sensors may be positioned corresponding to openings provided in the first display module 24 , or on a rear surface of the first display module 24 , or below or under the first display module 24 .

[0076] According to various embodiments, the foldable electronic device 2 may include various other sensors (e.g., a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a temperature sensor, or a humidity sensor), the positions of which may vary.

[0077] According to an embodiment, one or more camera modules may include one or more lenses, image sensors and / or image signal processors. One or more camera modules may include, for example, a first camera module 305, a second camera module 306, a third camera module 307 and / or a fourth camera module 308.

[0078] According to an embodiment, the first camera module 305 may be located in an internal space of the second housing 22 corresponding to the second cover 222. The first camera module 305 may be positioned to align with an opening provided in the second display module 25 or at least partially inserted into the opening. External light may reach the first camera module 305 through the second cover 222 and the opening in the second display module 25. The opening in the second display module 25 aligned with or overlapping the first camera module 305 may be provided in the form of a through hole, as in the example shown. In various embodiments, the opening of the second display module 25 aligned with or overlapping the first camera module 305 may be provided in the form of a recess.

[0079] According to various embodiments, when viewed from the top of the second cover 222, the first camera module 305 may overlap at least some display areas of the second display module 25 and be located in the internal space of the second housing 22. In this case, the first camera module 305 or the position of the first camera module 305 may not be visually distinguished (or exposed) or visually visible, and the shooting function of the first camera module 305 may be performed. In an embodiment, the first camera module 305 may be positioned on the rear surface of the second display module 25 or under or below the second display module 25, and the first camera module 305 or the position of the first camera module 305 may not be visually distinguishable (or exposed) or invisible. In various embodiments, the first camera module 305 may be positioned to align with or at least partially insert into a groove provided in the back surface of the second display module 25. The first camera module 305 may include, for example, a hidden display back camera (e.g., an under-display camera (UDC)). Some areas of the second display module 25 that at least partially overlap with the first camera module 305 may include a pixel structure and / or wiring structure that is different from other areas. For example, some areas of the second display module 25 that at least partially overlap with the first camera module 305 may have a different pixel density from other areas. The pixel structure and / or wiring structure formed in some areas of the second display module 25 that at least partially overlap with the first camera module 305 may reduce light loss between the outside and the optical sensor. In another example, a plurality of pixels may not be provided in some areas of the second display module 25 that at least partially overlap with the first camera module 305.

[0080] According to an embodiment, the second camera module 306, the third camera module 307, or the fourth camera module 308 may be located in the internal space of the first housing 21 corresponding to the first cover 212. The first cover 212 may include a camera cover portion (e.g., a camera decoration portion) provided corresponding to the second camera module 306, the third camera module 307, and the fourth camera module 308. The camera cover portion may include a camera hole (or light transmission area) provided corresponding to the second camera module 306, a camera hole (or light transmission area) provided corresponding to the third camera module 307, and a camera hole (or light transmission area) provided corresponding to the fourth camera module 308. The number or position of the camera modules provided corresponding to the first cover 212 may vary without being limited to the example shown. The second camera module 306, the third camera module 307, and the fourth camera module 308 may have different properties (e.g., viewing angles) or functions. The second camera module 306, the third camera module 307, and the fourth camera module 308 may provide different viewing angles (or lenses with different viewing angles), and the foldable electronic device 2 may selectively use the corresponding camera modules based on the user's selection of the viewing angle. Any of the second camera module 306, the third camera module 307, and the fourth camera module 308 may include a wide-angle camera module, a telephoto camera module, a color camera module, a monochrome camera module, or an infrared (IR) camera (e.g., a time-of-flight (TOF) camera, a structured light camera) module. In various embodiments, the IR camera module may operate as at least a part of the sensor module.

[0081] According to an embodiment, any one of the one or more light emitting modules may include a flash 309 positioned in the inner space of the first housing 21, corresponding to a flash hole (or light transmission area) provided in the camera cover portion of the first cover 212. The flash 309 may include a light source for the second camera module 306, the third camera module 307, and / or the fourth camera module 308. The flash 309 may include, for example, a light emitting diode (LED) or a xenon lamp.

[0082] According to various embodiments, any one of the one or more light emitting modules (e.g., LED, IR LED, or Xenon lamp) may be configured to provide status information about the foldable electronic device 2 in the form of light. In various embodiments, the light emitting module may provide a light source in combination with the operation of the first camera module 305.

[0083] According to an embodiment, one or more input modules may include a first key input device 310 and / or a second key input device 311. In the example shown, the first key input device 310 or the second key input device 311 may be located in an opening provided in a first side of the first frame 211. The position or number of the input modules may vary and is not limited to the example shown. In various embodiments, the foldable electronic device 2 may not include some or all of the key input devices, and the key input devices not included may be implemented as soft keys by means of the first display module 24 or the second display module 25. In various embodiments, the input module or the key input device may include at least one sensor module.

[0084] Any one of the one or more connection terminal modules (or, connector modules or interface terminal modules) may include a connector (or interface terminal) located inside the foldable electronic device 2, for example, corresponding to a connector hole 312 formed in the appearance of the foldable electronic device 2. In the example shown, the connector hole 312 may be provided on the first side of the first frame 211. The position or number of the connection terminal modules may vary and is not limited to the example shown. The foldable electronic device 2 may send and / or receive power and / or data with an external electronic device electrically connected to the connector. In an embodiment, the connector may include a USB connector or an HDMI connector. In various embodiments, any one of the one or more connection terminal modules may include an audio connector (e.g., a headphone connector or an earphone connector), and a connector hole corresponding to the audio connector provided in the appearance of the foldable electronic device 2. In various embodiments, any one of the one or more connection terminal modules may include a connector for a memory card located inside the foldable electronic device 2, and a connector hole corresponding to the connector for the memory card formed in the appearance of the foldable electronic device 2.

[0085] According to various embodiments, the foldable electronic device 2 may include a detachable pen input device (e.g., an electronic pen, a digital pen, or a stylus pen) (not shown). The pen input device may be implemented, for example, so that the pen input device can be inserted into the internal space of the first housing 21 or the second housing 22. In another example, the pen input device may be removably attached to the hinge housing 23. The hinge housing 23 may include a recess, and the pen input device may be fitted into the recess.

[0086] The foldable electronic device 2 may further include various constituent elements, depending on the form in which the foldable electronic device is provided. These constituent elements are not all listed because there are many changes according to the integration trend of the foldable electronic device 2, but additional constituent elements equivalent to the above-mentioned constituent elements may be included in the foldable electronic device 2. In various embodiments, specific constituent elements may be excluded from the above-mentioned constituent elements or replaced by other constituent elements, depending on the form in which the constituent elements are provided.

[0087] Figure 4 is an exploded perspective view showing a foldable electronic device 2 in an unfolded state according to an embodiment of the present disclosure. Figure 5 is a view showing a portion of the foldable electronic device 2 in an unfolded state according to an embodiment of the present disclosure. Figure 6 The embodiment according to the present disclosure is shown along Figure 5 0 is a cross-sectional view of a portion of the foldable electronic device 2 cut along the line CC′ in FIG.

[0088] refer to Figure 4 , Figure 5 and Figure 6 , the foldable electronic device 2 includes a foldable housing 20 and a (first) flexible printed circuit board 81. According to an embodiment, the foldable electronic device 2 may include a first display module 24 and / or a second flexible printed circuit board 82. In another embodiment, a first sealing portion (or a first sealing member or a first sealing material) 91 and / or a second sealing portion (or a second sealing member or a second sealing material) 92 may be included.

[0089] The foldable housing 20 includes a first housing 21 and a second housing 22. The foldable housing 20 also includes a hinge portion H. The foldable housing 20 may further include a first hinge module (or a first hinge assembly) 5A, a second hinge module (or a second hinge assembly) 5B, a guide rail assembly (or a third hinge module) 6, a hinge housing 23, a first plate (or a first wing plate) 71 and / or a second plate (or a second wing plate) 72. In an embodiment, the hinge portion H may include a first hinge module 5A, a first plate 71 and a second plate 72. The hinge portion H may further include a second hinge module 5B, a guide rail assembly 6 and / or a hinge housing 23.

[0090] According to an embodiment, the first housing 21 may include a first frame 211. The first frame 211 may include a first support portion 411 and a first side 412. The first frame 211 may be provided in any form, including the first support portion 411 and the first side 412. The first support portion 411 is an internal structure positioned inside the foldable electronic device 2 corresponding to the first housing 21, and may be referred to by various other terms, such as "first bracket", "first support", "first support member" or "first support structure". The second housing 22 may include a second frame 221. The second frame 221 may include a second support portion 421 and a second side 422. The second frame 221 may be provided in any form, including a second support portion 421 and a second side 422. The second support portion 421 is an internal structure positioned inside the foldable electronic device 2 corresponding to the second housing 22, and may be referred to by various other terms, such as "second bracket", "second support", "second support member" or "second support structure". At least a portion of the first frame 211 and / or at least a portion of the second frame 221 may be formed of a metal material and / or a non-metal material (e.g., a polymer). Electrical components (or electronic parts) or various components related to electrical components may be disposed on the first frame 211 or the first support portion 411, or may be supported by the first frame 211 or the first support portion 411. The first support portion 411 may include a first support region 411A pointing to the first display region ①, and a third support region 411B pointing in a direction substantially opposite to the first support region 411A (see Figure 6 ). The first display area ① of the first display module 24 may be disposed in the first support area 411A of the first support portion 411. Various components such as a printed circuit board or a battery may be disposed in the third support area 411B (see Figure 6 The second support portion 421 may include a second support region 421A directed toward the second display region ②, and a fourth support region 421B directed toward a direction substantially opposite to the second support region 421A (see Figure 6 ). The second display area ② of the first display module 24 may be disposed in the second support area 421A of the second support portion 421. Various components such as a printed circuit board or a battery may be disposed in the fourth support area 421B (see Figure 6 ). With the aid of various adhesive materials (or bonding materials), the first display area ① can be set on the first support portion 411, and the second display area ② can be set on the second support portion 421. For example, the adhesive material may include a heat-reactive adhesive material (or a heat-reactive bonding material), a photoreactive adhesive material (or a photoreactive bonding material), a general adhesive (or a general glue) and / or a double-sided tape.

[0091] According to the embodiment (see Figure 5 ), the foldable housing 20 may include a first frame B1, a second frame B2, a third frame B3, a fourth frame B4, a fifth frame B5 and / or a sixth frame B6. The first frame B1, the third frame B3 and the fifth frame B5 may be included on the first side 412 of the first frame 211. The second frame B2, the fourth frame B4 and the sixth frame B6 may be included on the second side 422 of the second frame 221. The first frame B1 and the second frame B2 may extend in a direction parallel to the center line A of the foldable electronic device 2 (for example, in the y-axis direction). The first frame B1 may be aligned with the first edge E1 of the display area 24A (see Figure 2 ) and the second frame B2 may be positioned corresponding to the second edge E2 of the display area 24A (see Figure 2 ) are positioned correspondingly. The third frame B3 can extend from one end of the first frame B1 in a direction perpendicular to the direction of the center line A of the electronic device 2. The fifth frame B5 can extend from the other end of the first frame B1 to a direction perpendicular to the direction of the center line A of the electronic device 2, and is substantially parallel to the third frame B3. The fourth frame B4 can extend from one end of the second frame B2 in a direction perpendicular to the direction of the center line A of the electronic device 2. The sixth frame B6 can extend from the other end of the second frame B2 to a direction perpendicular to the direction of the center line A of the electronic device 2, and is substantially parallel to the fifth frame B5. In the unfolded state of the foldable electronic device 2, the third frame B3 and the fourth frame B4 can be positioned corresponding to the third edge E3 of the display area 24A (see Figure 2 In the unfolded state of the foldable electronic device 2, the fifth frame B5 and the sixth frame B6 may be positioned corresponding to the fourth edge E4 of the display area 24A (see Figure 2 ). In the folded state of the foldable electronic device 2 (see Figure 3 ), the first frame B1 and the second frame B2 can be aligned. In the folded state of the foldable electronic device 2, the third frame B3 and the fourth frame B4 can be aligned. In the folded state of the foldable electronic device 2, the fifth frame B5 and the sixth frame B6 can be aligned.

[0092] According to various embodiments, the foldable electronic device 2 may include a first inner support member (not shown) located in the first housing 21 (see Figure 2 ) in the inner space corresponding to (or facing) the first cover 212 (see Figure 2). The first inner support may, for example, cover and protect a constituent element such as a printed circuit board or a battery disposed between the first support portion 411 and the first cover 212. In various embodiments, the first inner support may include a non-metallic material, and a non-conductive pattern serving as an antenna radiator may be disposed on the first inner support. The first frame 211 may be referred to as a "first front shell", and the first inner support may be referred to as a "first rear shell".

[0093] According to various embodiments, the foldable electronic device 2 may include a second housing 22 (see Figure 2 ) in the inner space of the second inner support member (not shown), which corresponds to (or faces) the second cover 222 (see Figure 2 ). The second inner support member may, for example, cover and protect constituent elements such as a printed circuit board or a battery disposed between the second support portion 421 and the first cover 212. The second frame 221 may be referred to as a "second front shell", and the second inner support member may be referred to as a "second rear shell".

[0094] According to an embodiment, referring to the cross-sectional view 24S of the first display module 24, the first display module 24 may include a flexible display 240, a transparent cover 245, an optically transparent adhesive member (or an optically transparent bonding member) 246, and / or a supporting sheet 247. The flexible display 240 may be coupled to the transparent cover 245 by means of an optically transparent adhesive member 246 (e.g., an optically transparent adhesive (OCA), an optically transparent resin (OCR), or a super view resin (SVR)). The transparent cover 245 (e.g., a window) may cover the flexible display 240 to protect the flexible display 240 from external influences. The transparent cover 245 may be in the form of a thin film (e.g., a thin film layer) having bendability. The transparent cover 245 may include, for example, a plastic film (e.g., a polyimide (PI) film) or a thin film glass (e.g., an ultra-thin glass (UTG)). In various embodiments, the transparent cover 245 may include a plurality of layers. For example, the transparent cover 245 may be in the form of a plastic film or a thin film glass on which various coatings are provided. The transparent cover 245 may be in the form of at least one protective layer or coating including a polymer material (e.g., polyester (PET), polyimide (PI), or thermoplastic polyurethane (TPU)) disposed on a plastic film or a thin film glass. In various embodiments, the transparent cover 245 and the optically transparent adhesive member 246 may be defined or interpreted as a part of the flexible display 240. In various embodiments, the transparent cover 245 may be interpreted as a part of the foldable housing 20 (see Figure 2) instead of the first display module 24. The flexible display 240 may include, for example, a display panel 241, a base film 242, a lower panel 243, and / or an optical layer 244. The display panel 241 may be positioned between the optical layer 244 and the base film 242. The base film 242 may be located between the display panel 241 and the lower panel 243. The optical layer 244 may be positioned between the optically transparent adhesive member 246 and the display panel 241. Various polymers of adhesive materials (or adhesive members) or bonding materials (or bonding members) may be provided between the display panel 241 and the base film 242, between the base film 242 and the lower panel 243, and / or between the display panel 241 and the optical layer 244. The display panel 241 may include, for example, a light emitting layer 241a, a thin film transistor (TFT) film (or TFT substrate) 241b, and / or an encapsulation layer (e.g., a thin film encapsulation (TFE)) 241c. The light-emitting layer 241a may include a plurality of pixels implemented as light-emitting devices, such as, for example, organic light-emitting diodes (OLEDs) or micro-LEDs. The light-emitting layer 241a may be disposed on the TFT film 241b by organic vapor deposition (e.g., evaporation). The TFT film 241b may be located between the light-emitting layer 241a and the base film 242. The TFT film 241b may refer to a film structure in which at least one TFT is disposed on a flexible substrate (e.g., a PI film) by a series of processes such as deposition, patterning, and / or etching. At least one TFT may control the current of the light-emitting element relative to the light-emitting layer 241a to turn on or off the pixel, or adjust the brightness of the pixel. At least one TFT may be implemented as, for example, an amorphous silicon (a-Si) TFT, a liquid crystal polymer (LCP) TFT, a low temperature polycrystalline oxide (LTPO) TFT, or a low temperature polycrystalline silicon (LTPS) TFT. In an embodiment, the display panel 241 may include a storage capacitor that may maintain a voltage signal to a pixel, maintain a voltage on a pixel within a frame, or reduce a change in the gate voltage of the TFT caused by a leakage current during the light-emitting time. The storage capacitor can maintain the voltage applied to the pixel for a predetermined time interval by controlling a routine (e.g., initialization, data writing) of at least one TFT. In an embodiment, the display panel 241 can be implemented on the basis of an OLED, and the encapsulation layer 241c can cover the light-emitting layer 241a. The organic materials and electrodes that generate light in the OLED are very sensitive to oxygen and / or moisture and may lose the light-emitting properties. In order to reduce or prevent the loss of light-emitting properties, the encapsulation layer 241c can seal the light-emitting layer 241a to prevent oxygen and / or moisture from penetrating into the OLED. The base film 242 may include a flexible film made of a polymer or plastic such as polyimide or polyester (PET). The base film 242 may be used to support and protect the display panel 241. In various embodiments, the base film 242 may be referred to as a protective film, a back film, or a backplane. The lower panel 243 may include multiple layers for various functions.Adhesive members (or bonding members) (not shown) made of various polymers may be provided between the multiple layers included in the lower panel 243. The lower panel 243 may include, for example, a light shielding layer 243a, a shock absorbing layer 243b and / or a lower layer 243c. The light shielding layer 243a may be positioned between the base film 242 and the shock absorbing layer 243b. The shock absorbing layer 243b may be positioned between the light shielding layer 243a and the lower layer 243c. The light shielding layer 243a may block at least some of the light incident from the outside. For example, the light shielding layer 243a may include an embossed layer. The embossed layer may be a black layer including a concave-convex pattern. The shock absorbing layer 243b may reduce external impacts on the flexible display 240. For example, the shock absorbing layer 243b may include a sponge layer or a cushioning layer. The lower layer 243c may diffuse, disperse or dissipate the heat generated by the foldable electronic device 2 or the flexible display 240. The lower layer 243c may absorb or shield electromagnetic waves. The lower layer 243c can reduce the external impact on the foldable electronic device 2 or the flexible display 240. For example, the lower layer 243c may include a composite sheet 243d or a copper sheet 243e. In an embodiment, the composite sheet 243d may be a sheet processed by combining layers or sheets with different properties. For example, the composite sheet 243d may include at least one of polyimide or graphite. The composite sheet 243d may also be replaced by a single sheet including a single material (e.g., polyimide or graphite). The composite sheet 243d may be positioned between the shock absorbing layer 243b and the copper sheet 243e. The copper sheet 243e may be replaced by various other metal sheets. In some embodiments, at least a portion of the lower layer 243c is a conductive member (e.g., a metal plate), which can be used to help enhance the rigidity of the foldable electronic device 2, shield environmental noise, and dissipate heat emitted from nearby heat dissipation components (e.g., display driver circuits) (e.g., display driver integrated circuits (DDI)). The conductive member may include, for example, at least one of copper (Cu), aluminum (Al), stainless steel, or CLAD (e.g., a layered member in which stainless steel and aluminum are alternately arranged). The lower layer 243c may include various other layers for various other functions. In various embodiments (not shown), in addition to the base film 242, at least one additional polymer layer (e.g., a layer including PI, PET, or TPU) may be provided on the rear surface of the display panel 241. In various embodiments, at least one of the multiple layers included in the lower panel 243 (e.g., a light shielding layer 243a, a shock absorbing layer 243b, a composite sheet 243d, and a copper sheet 243e) may be omitted. In various embodiments, the arrangement order of the multiple layers included in the lower panel 243 may vary, without being limited to the embodiments shown. The optical layer 244 may include, for example, a polarizing layer, or a polarizer, or a phase delay layer, or a delay. The polarizing layer and the phase delay layer may improve the outdoor visibility of the screen. For example, the optical layer 244 may selectively allow light generated from the light source of the display panel 241 and oscillating in a predetermined direction to pass.In various embodiments, a single layer combining a polarizing layer and a phase delay layer may be provided, and such a single layer may be interpreted as a "circular polarizing layer". An optically transparent adhesive member 246 may be positioned between the transparent cover 245 and the optical layer 244. In various embodiments, the polarizing layer (or circular polarizing layer) may be omitted. In this case, a black pixel defining layer (PDL) and / or a color filter may be provided instead of the polarizing layer. The foldable electronic device 2 may include a touch sensing circuit (e.g., a touch sensor) (not shown). The touch sensing circuit may be implemented as a transparent conductive layer (or film) based on various conductive materials such as indium tin oxide (ITO). In an embodiment, the touch sensing circuit may be disposed between the transparent cover 245 and the optical layer 244 (e.g., an additional type). In an embodiment, the touch sensing circuit may be disposed between the optical layer 244 and the display panel 241 (e.g., a box-on type). In an embodiment, the display panel 241 may include a touch sensing circuit or a touch sensing function (e.g., a box-in type). In various embodiments, the display panel 241 may be based on an OLED and include an encapsulation layer 241c disposed between the light emitting layer 241a and the optical layer 244. The encapsulation layer 241c can be used as a pixel protection layer to protect the multiple pixels of the light-emitting layer 241a. In an embodiment (not shown), the flexible display 240 may include a conductive pattern, such as a metal mesh (e.g., an aluminum metal mesh), as a touch sensing circuit, disposed on the encapsulation layer 241c between the encapsulation layer 241c and the optical layer 244. For example, the metal mesh may have greater durability than a transparent conductive layer implemented with ITO in response to the bending of the flexible display 240. In various embodiments, the flexible display 240 may also include a pressure sensor (not shown) capable of measuring the intensity (pressure) of the touch. The multiple layers included in the display panel 241 or the lower panel 243 and the layered structure or layered order of the layers may vary. The flexible display 240 may be implemented by omitting some of the constituent elements, or by adding other constituent elements, depending on the form of providing the flexible display, or the trend of fusion.

[0095] According to an embodiment, a support sheet (or support plate or support layer) 247 may be provided on the rear surface of the flexible display 240. The rear surface of the flexible display 240 may be a side positioned opposite to a side from which light is emitted from a display panel 241 including a plurality of pixels. The support sheet 247 may be provided (e.g., attached) to the rear surface of the lower panel 243 of the flexible display 240 by covering at least a portion of the lower panel 243. The support sheet 247 may be coupled to the lower panel 243 by means of an adhesive or a bonding material. The adhesive material (or bonding material) between the flexible display 240 and the support sheet 247 may include, for example, a thermosensitive adhesive material (or thermosensitive bonding material), a photoresponsive adhesive material (or photoresponsive bonding material), a conventional adhesive (or conventional glue) or a double-sided tape. In another example, the adhesive material (or bonding material) may include various polymers, such as triazine thiol, dithiopyrimidine or silane compounds, or an organic adhesive material (or organic bonding material), such as a sealant. The support sheet 247 may contribute to the durability (eg, enhanced rigidity) of the first display module 24. The support sheet 247 may reduce the size of the foldable housing 20 (see Figure 2 ) in the folding process. The support sheet 247 can reduce or prevent the first display module 24 from breaking due to the force transmitted when the foldable housing 20 is folded. In an embodiment, the support sheet 247 may include a metal material. The support sheet 247 may include, for example, stainless steel. The support sheet 247 may include various other metal materials. In various embodiments, the support sheet 247 may include engineering plastics.

[0096] According to an embodiment, the support sheet 247 may include a lattice structure (not shown) at least partially overlapping the third display area ③ of the first display module 24. The lattice structure may include, for example, a plurality of openings (or slits) arranged in the support sheet 247. The lattice structure may refer to a pattern structure having a plurality of openings arranged regularly. The plurality of openings may be formed periodically, may have substantially the same shape, and may be repeatedly arranged at predetermined intervals. The lattice structure may reduce the degradation of the flexibility of the third display area ③. In various embodiments, the lattice structure including a plurality of openings may be referred to as other terms such as "opening pattern", "hole pattern" or "lattice pattern". In various embodiments, the support sheet 247 may include a recessed pattern (not shown) including a plurality of recesses instead of the lattice structure. The recessed pattern may refer to, for example, a pattern structure in which a plurality of recesses are regularly arranged in a recessed form and arranged on a first surface of the lower panel 243 of the support sheet 247 facing the flexible display 240 or a second surface of the support sheet 247 positioned opposite to the first surface. In various embodiments, the lattice structure or the concave pattern may extend to a portion of the support sheet 247 corresponding to the first display area ① and / or the second display area ② of the first display module 24. In various embodiments, the support sheet 247 including the lattice structure or the concave pattern or a conductive member corresponding thereto may be provided in a plurality of layers.

[0097] According to various embodiments, the support sheet 247 may reduce electromagnetic interference (EMI) with respect to the flexible display 240 .

[0098] According to various embodiments, the support sheet 247 may diffuse or spread heat dissipated from a heat dissipation component (eg, a display driving circuit such as a display driver integrated circuit (DDI) or a DDI chip).

[0099] According to various embodiments, the support sheet 247 may be omitted.

[0100] According to various embodiments, the support sheet 247 may be interpreted as an element separated from the first display module 24 .

[0101] According to an embodiment, the first hinge module 5A, the second hinge module 5B and the guide rail assembly 6 may connect the first frame 211 and the second frame 221. The first frame 211 and the second frame 221 may be rotatably connected to each other by means of the first hinge module 5A, the second hinge module 5B and the guide rail assembly 6. The first hinge module 5A, the second hinge module 5B and the guide rail assembly 6 may be arranged along the center line A of the foldable electronic device 2, and the guide rail assembly 6 may be located between the first hinge module 5A and the second hinge module 5B. In an embodiment, the guide rail assembly 6 may be positioned to correspond to the center between the first hinge module 5A and the second hinge module (e.g., a point on the center line A substantially equidistant from the first hinge module 5A and the second hinge module 5B).

[0102] According to an embodiment, the first hinge module 5A may include a first bracket 51A, a second bracket 52A, and a bracket connector 53A. The first bracket 51A may be provided or coupled to the first support area 411A of the first frame 211, for example, by screw fastening. The second bracket 52A may be provided or coupled to the second support area 421A of the second frame 221, for example, by screw fastening. The bracket connector 53A may connect the first bracket 51A and the second bracket 52A. The first bracket 51A and the second bracket 52A may rotate relative to the bracket connector 53A.

[0103] According to an embodiment, the bracket connector 53A of the first hinge module 5A may be configured so that the first frame 211 to which the first bracket 51A is fixed and the second frame 221 to which the second bracket 52A is fixed can rotate at the same angle in opposite directions. The bracket connector 53A may be configured so that the first frame 211 to which the first bracket 51A is fixed and the second frame 221 to which the second bracket 52A is fixed can rotate and remain at one or more predetermined angles. The bracket connector 53A may also have a free stop function, for example. The bracket connector 53A may be configured to provide a force that allows the first frame 211 to which the first bracket 51A is fixed and the second frame 221 to which the second bracket 52A is fixed to rotate with each other. The bracket connector 53A may be composed of a combination of at least one shaft, at least one cam gear and / or at least one compression spring providing elasticity.

[0104] The second hinge module 5B may be arranged substantially the same as the first hinge module 5A, and may include, for example, a first bracket 51B, a second bracket 52B, and / or a bracket connector 53B. In an embodiment, the second hinge module 5B may be arranged on the foldable electronic device 2 in an arrangement direction opposite to the first hinge module 5A. The first bracket 51B of the second hinge module 5B may be arranged or coupled to the second support area 421A of the second frame 221, and the second bracket 52B of the second hinge module 5B may be arranged or coupled to the first support area 411A of the first frame 211.

[0105] According to an embodiment, the first hinge module 5A, the second hinge module 5B and the guide rail assembly 6 may be coupled to the hinge housing 23, and may be coupled, for example, by means of screws. The hinge housing 23 may be connected to the first frame 211 and the second frame 221 by means of the first hinge module 5A, the second hinge module 5B and the guide rail assembly 6. The hinge housing 23 may include a recess provided on another surface opposite to a surface exposed to the outside in the folded state of the foldable electronic device 2 (see Figure 3). The bracket connector 53A of the first hinge module 5A, the bracket connector 53B of the second hinge module 5B and the guide rail assembly 6 can be fastened in the recess of the hinge housing 23 by screws.

[0106] According to an embodiment, the first plate (e.g., the first wing plate) 71 may be positioned corresponding to the first frame 211, and the second plate (e.g., the second wing plate) 72 may be positioned corresponding to the second frame 221. The first plate 71 and the second plate 72 may each be shaped such that a first width in the direction of the centerline A (e.g., in the y-axis direction) is relatively greater than a second width in a direction perpendicular to the direction of the centerline A, and may overlap with the first hinge module 5A, the second hinge module 5B, and / or the guide rail assembly 6. The first plate 71 and the second plate 72 may be coupled to the first hinge module 5A, the second hinge module 5B, and the guide rail assembly 6.

[0107] According to an embodiment, the first plate 71 may be connected to the bracket connector 53A of the first hinge module 5A and the bracket connector 53B of the second hinge module 5B. The second plate 72 may be connected to the bracket connector 53A of the first hinge module 5A and the bracket connector 53B of the second hinge module 5B. In an embodiment, the first plate 71 and the second plate 72 may be arranged to be substantially symmetrical to each other with respect to the center line A of the foldable electronic device 2.

[0108] According to an embodiment, the first plate 71 may include a first surface 71A disposed corresponding to the third display area ③ of the first display module 24. The second plate 72 may include a second surface 72A disposed corresponding to the third display area ③ of the first display module 24. Figure 2 ), the first surface 71A of the first plate 71 may support a portion of the third display area ③, and the second surface 72A of the second plate 72 may support a portion of the third display area ③. The first surface 71A of the first plate 71 may include a flat surface capable of supporting a side area of ​​the third display area ③ relative to the center line A of the foldable electronic device 2 in the unfolded state of the foldable electronic device 2. The second surface 72A of the second plate 72 may include a flat surface capable of supporting the other side area of ​​the third display area ③ relative to the center line A of the foldable electronic device 2 in the unfolded state of the foldable electronic device 2. In the unfolded state of the foldable electronic device 2, the first surface 71A of the first plate 71 and the second surface 72A of the second plate 72 may form an angle of substantially about 180 degrees and be arranged without a substantial height difference. In the unfolded state of the foldable electronic device 2, even when an external force (e.g., external pressure such as a touch input using a user's finger or a touch input using an electronic pen) is applied to the third display area ③, the third display area ③ may be kept flat by the support of the first plate 71 and the second plate 72.

[0109] According to an embodiment, the bracket connector 53A of the first hinge module 5A may include a center plate 54A aligned with the center line A of the foldable electronic device 2. The bracket connector 53B of the second hinge module 5B may include a center plate 54B aligned with the center line A of the foldable electronic device 2. In the unfolded state of the foldable electronic device 2, the center plate 54A of the first hinge module 5A and the center plate 54B of the second hinge module 5B may support a portion of the third display area ③ of the first display module 24 corresponding to a portion between the first surface 71A of the first plate 71 and the second surface 72A of the second plate 72. In the unfolded state of the foldable electronic device 2, the center plate 54A of the first hinge module 5A and the center plate 54B of the second hinge module 5B may reduce or prevent a sagging phenomenon or a creeping phenomenon of a portion of the third display area ③ corresponding to a gap between the first surface 71A of the first plate 71 and the second surface 72A of the second plate 72.

[0110] According to an embodiment, the guide rail assembly 6 may include a first sliding member 61, a second sliding member 62 and a guide rail 63. The guide rail 63 may be disposed or coupled to the hinge housing 23. Figure 3 ), the hinge housing 23 may include a recess provided on the other surface opposite to the one surface exposed to the outside, and the guide rail 63 may be provided in the recess of the hinge housing 23 by screw fastening. The first slider 61 may be slidably provided on the guide rail 63 relative to the guide rail 63, and coupled to the first plate 71, for example, by means of screws. The second slider 62 may be slidably provided on the guide rail 63 relative to the guide rail 63, and coupled to the second plate 72, for example, by means of screws. The guide rail 63 may include a first guide rail that is a sliding pair with the first slider 61 and a second guide rail that is a sliding pair with the second slider 62. In response to the relative position of the first plate 71 relative to the first frame 211 and the relative position of the second plate 72 relative to the second frame 221 changing due to the movement (or state change) of the first hinge module 5A and the second hinge module 5B when the angle between the first frame 211 and the second frame 221 changes, the first guide rail may be configured to guide the path of the first sliding member 61 connected to the first plate 71 to move relative to the guide rail 63, and the second guide rail may be configured to guide the path of the second sliding member 62 connected to the second plate 72 to move relative to the guide rail 63. The structure of the guide rail assembly 6 between the first hinge module 5A and the second hinge module 5B and the first plate 71 and the second plate 72 can reduce or prevent the first plate 71 and the second plate 72 from lifting. In an embodiment, in the unfolded state of the foldable electronic device 2, the guide rail assembly 6 can support a portion of the third display area ③ of the first display module 24 corresponding to a portion between the first surface 71A of the first plate 71 and the second surface 72A of the second plate 72.

[0111] According to an embodiment, when the foldable electronic device 2 is in the unfolded state (see Figure 2 ) to the collapsed state (see Figure 3 ), the hinge portion H may be constructed to provide a space in which the third display area ③ of the first display module 24 may be arranged in a curved form that can reduce bending stress. When the foldable electronic device 2 is converted from the unfolded state to the folded state, the hinge portion H may be constructed to provide a space in which the third display area ③ may be arranged in a curved form that can reduce buckling. In one embodiment, when the foldable electronic device 2 is switched from the unfolded state to the folded state, the third display area ③ may be arranged in a teardrop form or a dumbbell form, which may reduce breakage or permanent deformation. In the folded state of the foldable electronic device 2, relative to a neutral surface (neutral plane) inside the third display area ③, the third display area ③ may be arranged in a curved form that may reduce the conflict (e.g., bending stress) between the compressive stress generated in a side area of ​​the third display area ③ and the tensile stress generated in a side area of ​​the third display area ③.

[0112] The first flexible printed substrate 81 is configured in a manner spanning the hinge portion H. In one embodiment, in the case where an additional second flexible printed circuit board 82 is provided, the second flexible printed circuit board 82 may also be arranged across the hinge portion H. The first end 8101 of the first flexible printed circuit board 81 includes a first connector (e.g., a first FPCB connector), and the second end 8102 of the first flexible printed circuit board 81 includes a second connector (e.g., a second FPCB connector). The first end 8101 of the first flexible printed circuit board 81 may be referred to as a "first connector end", and the second end 8102 of the flexible printed circuit board 81 may be referred to as a "second connector end". The first connector is electrically connected to a first element (e.g., a connector) located or accommodated in the first housing 21. The second connector is electrically connected to a second element (e.g., a connector) located or accommodated in the second housing 22. The third end 8201 of the second flexible printed circuit board 82 may include a third connector (e.g., a third FPCB connector), and the fourth end 8202 of the second flexible printed circuit board 82 may include a fourth connector (e.g., a fourth FPCB connector). The third connector may be electrically connected to a third element (e.g., a connector) located or accommodated in the first housing 21. The fourth connector may be electrically coupled to a fourth element (e.g., a connector) located or housed in the second housing 22. The first flexible printed circuit board 81 may be in the form of a film having a thickness between the first substrate surface 81A and the second substrate surface 81B, the second substrate surface 81B pointing in a direction opposite to the first substrate surface 81A, and may include a signal line (or electrical path) electrically connecting the first end 8101 and the second end 8102, and a conductive pattern for constituting a grounding area to reduce electromagnetic interference (EMI) associated with the signal line. The second flexible printed circuit board 82 may be in the form of a film having a thickness between the third substrate surface 82A and a fourth substrate surface (not shown) pointing in a direction opposite to the third substrate surface 82A, and may include a signal line (or electrical path) electrically connecting the third end 8201 and the fourth end 8202, and a conductive pattern for constituting a grounding area to reduce electromagnetic interference (EMI) associated with the signal line.

[0113] The first end 8101 of the first flexible printed circuit board 81 is electrically connected to an electrical component, such as a printed circuit board. The printed circuit board may be disposed in the third support region 411B of the first support portion 411 included in the first frame 211. The second end 8102 of the first flexible printed circuit board 81 is electrically connected to an electrical component, such as a printed circuit board. The printed circuit board may be disposed in the fourth support region 421B of the second support portion 421 included in the second frame 221. The third end 8201 of the second flexible printed circuit board 82 may be electrically connected to an electrical component, such as a printed circuit board disposed in the third support region 411B of the first support portion 411 included in the first frame 211. The fourth end 8202 of the second flexible printed circuit board 82 may be electrically connected to an electrical component, such as a printed circuit board disposed in the fourth support region 421B of the second support portion 421 included in the second frame 221.

[0114] The first flexible printed circuit board 81 includes a first area 811, a second area 812, a third area 813, and a fourth area 814. The third area 813 is a portion of the first flexible printed circuit board 81 that connects the first area 811 and the second area 812, and may be in a bent form (or an elbow or angled form). The first area 811 may extend from the third area 813 to the first end 8101. The second area 812 may extend from the third area 813 to the second end 8102. The fourth area 814 may extend from the first area 811. Although not shown separately, the fourth area 814 may extend from the second area 812 or the third area 813.

[0115] According to an embodiment, the first support portion 411 of the first frame 211 may include a first opening (or a first hole or a first through hole) 401. The second support portion 421 of the second frame 221 may include a second opening (or a second hole or a second through hole) 402. The second region 812 of the first flexible printed circuit board 81 may penetrate the first opening 401 and the second opening 402. In an embodiment, the first opening 401 and the second opening 402 may overlap and align with each other in the folded state of the foldable electronic device 2 (see Figure 3). The second region 812 of the first flexible printed circuit board 81 may include a first fixing portion F1 and a second fixing portion F2. Further, the first flexible printed circuit board 81 may include a first extension portion 812a, a second extension portion 812b and / or a third extension portion 812c. The first fixing portion F1 of the second region 812 may be positioned between the first plate (e.g., the first wing plate) 71 and the first hinge housing cover 213 (or the first support portion 411). The first fixing portion F1 of the second region 812 may be coupled to the first hinge housing cover 213 (or the first support portion 411 of the first frame 211) or the first plate 71 by various coupling methods (such as coupling with an adhesive material or a bonding material, or screw fastening). The second fixing portion F2 of the second region 812 may be positioned between the second plate (e.g., the second wing plate) 72 and the second hinge housing cover 223 (or the second support portion 421). The second fixing portion F2 of the second region 812 may be coupled to the second hinge housing cover 223 (or the second support portion 421 of the second frame 221) or the second plate 72 by various coupling methods (such as bonding with an adhesive material or a bonding material, or screw fastening). The first extension portion 812a of the second region 812 may be a portion between the first fixing portion F1 and the second fixing portion F2 of the first flexible printed circuit board 81. When the foldable electronic device 2 is converted between the unfolded state and the folded state, the relative position between the first fixing portion F1 and the second fixing portion F2 may be changed, and the first extension portion 812a may be arranged in a form corresponding to the relative position between the first fixing portion F1 and the second fixing portion F2. When the foldable electronic device 2 is converted between the unfolded state and the folded state, the hinge housing 23 may include a recess that helps to allow the first extension portion 812a of the second region 812 to be arranged with reduced stress. The second extension portion 812b of the second region 812 may be a portion between the first fixing portion F1 of the first flexible printed circuit board 81 and the third region 813. The second extension portion 812b of the second region 812 may penetrate the first opening 401 included in the first support portion 411 of the first frame 211. The first region 811, a portion of the second extension portion 812b included in the second region 812, the third region 813, and the fourth region 814 may be positioned between the first support portion 411 of the first frame 211 and the first cover 212 (see Figure 2). The first area 811 of the first substrate surface 81A of the first flexible printed circuit board 81, a portion of the second extension portion 812b included in the second area 812, the third area 813, and some areas included in the fourth area 814 may at least partially face the third support area 411B of the first support portion 411. The third extension portion 812c of the second area 812 may be a portion between the second fixing portion F2 and the second end 8102 of the first flexible printed circuit board 81. The third extension portion 812c may penetrate the second opening 402 included in the second support portion 421 of the second frame 221. A portion of the third extension portion 812c may be positioned between the second support portion 421 of the second frame 221 and the second cover 222 (see Figure 2 Some areas included in a portion of the third extension portion 812 c of the first substrate surface 81A of the first flexible printed circuit board 81 may at least partially face the fourth supporting area 421B of the second supporting portion 421 .

[0116] According to an embodiment, the first fixing portion F1 and / or the second fixing portion F2 included in the second area 812 of the first flexible printed circuit board 81 may be configured to be less flexible than other portions of the first flexible printed circuit board 81. The first fixing portion F1 and / or the second fixing portion F2 may be substantially rigid. The first fixing portion F1 may be rigid, including a first reinforcing portion (or a first reinforcing member or a first reinforcing structure) 815, such as a reinforcing member. The second fixing portion F2 may be rigid, including a second reinforcing portion (or a second reinforcing member or a second reinforcing structure) 816, such as a reinforcing member.

[0117] In one embodiment, the first reinforcing portion 815 may include a screw hole for threaded fastening with the first hinge housing cover 213 (or the first support portion 411 of the first frame 211) or the first plate (e.g., the first wing plate) 71. In an embodiment, the second reinforcing portion 816 may include a screw hole for threaded fastening with the second hinge housing cover 223 (or the second support portion 421 of the second frame 221) or the second plate (e.g., the second wing plate) 72. In various embodiments, the first reinforcing portion 815 may include a plate or a film disposed on the first substrate surface 81A or the second substrate surface 81B, without being limited to the example shown, and the first fixing portion F1 may be less flexible than other portions of the first flexible printed circuit board 81 through the first reinforcing portion 815. In various embodiments, the second reinforcing portion 816 may include a plate or a film disposed on the first substrate surface 81A or the second substrate surface 81B, without being limited to the example shown, and the second fixing portion F2 may be less flexible than other portions of the first flexible printed circuit board 81 through the second reinforcing portion 816. In various embodiments, the first flexible printed circuit board 81 may be implemented as a rigid FPCB (RFPCB), and the first fixing portion F1 may be substantially rigid without the first reinforcing portion 815, and the second fixing portion F2 may be substantially rigid without the second reinforcing portion 816. In various embodiments, the first fixing portion F1 and / or the second fixing portion F2 may be provided in a form in which a reinforcing portion such as a reinforcing member is omitted and thus is flexible.

[0118] According to an embodiment, the fourth region (or fixing region) 814 of the first flexible printed circuit board 81 may be disposed, fixed, or coupled to the first support portion 411 of the first frame 211. The third support region 411B of the first support portion 411 may include a fixing region corresponding to the fourth region 814. The fixing region included in the third support region 411B of the first support portion 411 may allow the fourth region 814 of the first flexible printed circuit board 81 to be stably positioned on the first support portion 411.

[0119] According to an embodiment, the fourth region 814 of the first flexible printed circuit board 81 may include a third fixing portion F3. The third fixing portion F3 may be configured to be less flexible than other parts of the fourth region 814. The third fixing portion F3 may be substantially rigid. The third fixing portion F3 may be referred to as a "rigid portion" of the fourth region 814. The third fixing portion F3 may be rigid, for example including a third reinforcing portion (or a third reinforcing member or a third reinforcing structure), such as a reinforcing member. In various embodiments, the third reinforcing portion may include a plate or a film disposed on the first substrate surface 81A or the second substrate surface 81B, and the third fixing portion F3 may be less flexible than other parts of the fourth region 814 through the third reinforcing portion. The first flexible printed circuit board 81 may be implemented as an RFPCB, and the third fixing portion F3 may be rigid without a third reinforcing portion. In various embodiments, the third fixing portion F3 may be provided in the form of omitting the third reinforcing portion, and thus may be flexible.

[0120] According to an embodiment, the third fixing part F3 can be implemented substantially rigidly and flatly. The third fixing part F3 can, for example, include a reinforcing plate (or a reinforcing film or a reinforcing layer) (e.g., a reinforcing member) so as to be substantially rigid and flat. The reinforcing plate can, for example, include a glass reinforced epoxy resin laminate (FR4) or polyimide (PI).

[0121] According to an embodiment, the third fixing portion F3 may have a thickness thicker than another portion of the fourth region 814. In an embodiment, the third fixing portion F3 may have more laminated layers than another portion of the fourth region 814. This may enable the third fixing portion F3 to be configured to be less flexible than other portions of the fourth region 814.

[0122] According to an embodiment, the first support portion 411 may include a recessed-shaped fixing area, and the third fixing portion F3 of the fourth area 814 may be stably positioned in the recessed-shaped fixing area.

[0123] According to an embodiment, the third fixing portion F3 of the fourth region 814 may include one or more openings 818 and 819. For example, one opening 818 of the one or more openings 818 and 819 may be a through hole, and the other opening 819 may be a notch. The first support portion 411 of the first frame 211 may include one or more protrusions inserted into the one or more openings 818 and 819, respectively. The number or position of the openings (e.g., through holes or notches) included in the third fixing portion F3 for coupling with the first support portion 411 of the first frame 211 may vary, without being limited to the example shown.

[0124] According to an embodiment, an adhesive material or a bonding material may be provided between the third fixing portion F3 of the fourth region 814 and the first supporting portion 411 of the first frame 211. The third fixing portion F3 may be coupled to the first supporting portion 411 by means of the adhesive material or the bonding material.

[0125] According to various embodiments (not shown), the third fixing portion F3 of the fourth region 814 may be connected to the first support portion 411 of the first frame 211, for example, by screw fastening. The third fixing portion F3 of the fourth region 814 may include one or more screw holes for screw fastening, and the first support portion 411 of the first frame 211 may include one or more screw fastening portions aligned one-to-one with the one or more screw holes. The screw fastening portion may be a boss including a female thread corresponding to a male thread of the screw.

[0126] According to various embodiments (not shown), the third fixing portion F3 of the fourth region 814 may be fastened to the first supporting portion 411 of the first frame 211 by snap-fitting. For example, the third fixing portion F3 of the fourth region 814 may include one or more hooks, and the first supporting portion 411 of the first frame 211 may include one or more hook fastening portions (capturing portions) corresponding one to one with the one or more hooks.

[0127] According to an embodiment, the first flexible printed circuit board 81 includes at least one signal line electrically connecting the first end 8101 and the second end 8102. In an embodiment, the at least one signal line may not be provided or included in the fourth region 814 or the third fixing portion F3.

[0128] According to an embodiment, the first flexible printed circuit board 81 includes a ground region (or a ground pattern) (eg, a ground plane). In an embodiment, the ground region may not be provided or included in the fourth region 814 or the third fixing portion F3.

[0129] According to an embodiment, in the operation of setting (or connecting) the constituent elements to the foldable housing 20, in the operation of giving priority to the position of the first flexible printed circuit board 81 relative to the first frame 211, a setting guide structure (or setting guide) including the fourth area 814 (or the third fixing portion F3) and the fixing area of ​​the first support portion 411 (or the first frame 211) of the first flexible printed circuit board 81 can be used (for example: Figure 7 After the operation of prioritizing the position of the first flexible printed circuit board 81 relative to the first frame 211 is performed by the setting guide structure between the first flexible printed circuit board 81 and the first frame 211, the operation of connecting the first flexible printed circuit board 81 to at least one of the other components may be performed.

[0130] According to an embodiment, the first support portion 411 of the first frame 211 may include a third opening (or a third hole or a third through hole) 403. The second support portion 421 of the second frame 221 may include a fourth opening (or a fourth hole or a fourth through hole) 404. The second flexible printed circuit board 82 may penetrate the third opening 403 and the fourth opening 404. The third opening 403 and the fourth opening 404 may overlap and align with each other in the folded state of the foldable electronic device 2 (see Figure 3 ). The first opening 401 and the third opening 403 may be spaced apart from each other in the direction of the center line A of the foldable electronic device 2 (e.g., in the y-axis direction). The second opening 402 and the fourth opening 404 may be spaced apart from each other in the direction of the center line A of the foldable electronic device 2. The second flexible printed circuit board 82 may be at least partially configured identically or similarly to the first flexible printed circuit board 81. The second flexible printed circuit board 82 may include a first region (e.g., a first region 811), a second region (e.g., a second region 812) including a first fixing portion F11 (e.g., a first fixing portion F1) and a second fixing portion F21 (e.g., a second fixing portion F2), and a third region (e.g., a third region 813). The second region of the second flexible printed circuit board 82 may penetrate the third opening 403 and the second opening 402. The first fixing portion F11 can be connected to the first hinge housing cover 213 (or the first support portion 411 of the first frame 211) or the first plate 71, and the second fixing portion F21 can be connected to the second hinge housing cover 223 (or the second support portion 421 of the second frame 221) or the second plate 72 by various connection methods (such as bonding including adhesive material or bonding material, or screw fastening).

[0131] According to an embodiment, the first sealing portion 91 may be disposed in the first opening 401 included in the first support portion 411 of the first frame 211. The third sealing portion (or third sealing member or third sealing material) (eg, see Fig.11 The third sealing portion 93 in the first frame 211 may be disposed in the third opening 403 in the first support portion 411 included in the first frame 211. The foldable electronic device 2 may include a first waterproof area (or a first waterproof space) and a second waterproof area (or a second waterproof space). The first waterproof area may be the space between the first support area 411A of the first support portion 411, the first side 412, and the first display area ① of the first display module 24. The second waterproof area may be the space between the third support area 411B of the first support portion 411, the first side 412, and the first cover 212 (see Figure 2). A plurality of electrical components may be positioned in the first waterproof area and the second waterproof area. The first sealing portion 91 configured at the first opening 401 and the third sealing portion configured at the third opening 403 may also separate the first waterproof area from the second waterproof area. The first sealing portion 91 and / or the third sealing portion 93 may reduce or prevent moisture introduced from the outside into the foldable electronic device 2 from flowing (or moving) from the first waterproof area to the second waterproof area through the first opening 401, or from flowing (or moving) from the second waterproof area to the first waterproof area. The first sealing portion 91 and / or the third sealing portion 93 may, for example, include a waterproof member or a waterproof material.

[0132] According to an embodiment, the first flexible printed circuit board 81 may penetrate the first sealing portion 91 provided in the first opening 401. The second extension portion 812b of the second region 812 of the first flexible printed circuit board 81 may be connected to the first support portion 411 of the first frame 211 by means of the first sealing portion 91. The first sealing portion 91 may be formed, for example, by filling the first opening 401 with an adhesive material (e.g., a liquid gasket (curable in-situ formed gasket (CIPG))) and then curing the filled adhesive material (e.g., curing by means of photoreaction or thermal reaction). The second flexible printed circuit board 82 may penetrate the third sealing portion (e.g., Fig.11 The second flexible printed circuit board 82 can be connected to the first support portion 411 of the first frame 211 by means of the third sealing portion. The third sealing portion can be formed, for example, by filling the third opening 403 with an adhesive material (e.g., a liquid gasket) and then curing the filled adhesive material (e.g., curing by means of a photoreaction or a thermal reaction). In various embodiments, the first sealing portion 91 can be an elastic member or a flexible member that is elastically disposed in the first opening 401 through which the first flexible printed circuit board 81 passes. In various embodiments, the third sealing portion can be an elastic member or a flexible member elastically disposed in the third opening 403 through which the second flexible printed circuit board 82 passes. In various embodiments, the first sealing portion 91 or the third sealing portion may include various adhesive materials or bonding materials of a polymer.

[0133] According to an embodiment, the second sealing portion 92 may be disposed in the second opening 402 included in the second support portion 421 of the second frame 221. The fourth sealing portion (or fourth sealing member or fourth sealing material) (eg, see Fig.11The fourth sealing portion 94 in the second support portion 421) can be disposed in the fourth opening 404 included in the second support portion 421 of the second frame 221. The foldable electronic device 2 may include a third waterproof area (or a third waterproof space) and a fourth waterproof area (or a fourth waterproof space). The third waterproof area may be the space between the second support area 421A of the second support portion 421, the second side 422, and the second display area ② of the first display module 24. The fourth waterproof area may be the space between the fourth support area 421B of the second support portion 421, the second side 422, and the second cover 222 (see Figure 2 ). A plurality of electrical components may be positioned in the third waterproof area and the fourth waterproof area. The second sealing portion 92 disposed in the second opening 402 and the fourth sealing portion disposed in the fourth opening 404 may separate the third waterproof area and the fourth waterproof area. The second sealing portion 92 and / or the fourth sealing portion 94 may reduce or prevent moisture introduced from the outside into the interior of the foldable electronic device 2 from flowing (or moving) from the third waterproof area to the fourth waterproof area through the second opening 402, or from flowing (or moving) from the fourth waterproof area to the third waterproof area. The second sealing portion 92 and / or the fourth sealing portion 94 may, for example, include a waterproof member or a waterproof material.

[0134] According to an embodiment, the first flexible printed circuit board 81 may penetrate the second sealing portion 92 provided in the second opening 402. The third extension portion 812c of the second region 812 of the first flexible printed circuit board 81 may be connected to the second support portion 421 of the second frame 221 by means of the second sealing portion 92. The second sealing portion 92 may be formed, for example, by filling the second opening 402 with an adhesive material (e.g., a liquid gasket) and then curing the filled adhesive material (e.g., curing by means of a photoreaction or a thermal reaction). The second flexible printed circuit board 82 may penetrate the fourth sealing portion (e.g., Fig.11 The second flexible printed circuit board 82 may be connected to the second support portion 421 of the second frame 221 by the fourth sealing portion. The fourth sealing portion may be formed, for example, by filling the fourth opening 404 with an adhesive material (e.g., a liquid gasket) and then curing the filled adhesive material (e.g., curing by means of a photoreaction or a thermal reaction). In various embodiments, the second sealing portion 92 may be an elastic member or a flexible member elastically disposed in the second opening 402 through which the first flexible printed circuit board 81 passes. In various embodiments, the fourth sealing portion may be an elastic member or a flexible member elastically disposed in the fourth opening 404 through which the second flexible printed circuit board 82 passes. In various embodiments, the second sealing portion 92 or the fourth sealing portion may include various adhesive materials or bonding materials of a polymer.

[0135] Figure 7is a view illustrating a process of disposing a first flexible printed circuit board 81 according to an embodiment of the present disclosure.

[0136] refer to Figure 7 In operation 701, the first flexible printed circuit board 81 may be disposed through the first opening 401 of the first frame 211. In operation 701, the third fixing portion F3 of the first flexible printed circuit board 81 may be disposed in the fixing region of the first support portion 411 of the first frame 211. The first protrusion P1 and the second protrusion P2 included in the fixing region of the first support portion 411 may be respectively inserted into the openings 818 and 819 included in the third fixing portion F3 (see Figure 4 ). The first flexible printed circuit board 81 can be set at a designated position relative to the first frame 211 by means of a setting guide structure 710, and the setting guide structure 710 includes a third fixing portion F3 of the first flexible printed circuit board 81 and a fixing area of ​​the first support portion 411. In the operation of forming the first sealing portion 91 set in the first opening 401, the operation of electrically connecting the first end 8101 of the first flexible printed circuit board 81 to the first element set on the first frame 211, and the operation of electrically connecting the second end 8102 of the first flexible printed circuit board 81 (see Figure 4 ) before the operation of electrically connecting the first flexible printed circuit board 81 to the second element set on the second frame 221, the position of the first flexible printed circuit board 81 relative to the first frame 211 can be determined preferentially (or mainly) by setting a guide structure 710 between the first flexible printed circuit board 81 and the first frame 211.

[0137] According to an embodiment, in operation 702, the first flexible printed circuit board 81 may be stably positioned relative to the first frame 211 by attaching a guide sheet 720. In operation 702, the first opening 401 may be filled with a liquid type adhesive material (e.g., gasket (CIPG)). In operation 702, a first sealing portion 91 disposed in the first opening 401 may be formed by curing (e.g., curing by photoreaction or curing by thermal reaction) the liquid type adhesive material filled in the first opening 401. The first flexible printed circuit board 81 may be connected to the first frame 211 by means of the first sealing portion 91 disposed in the first opening 401. The setting guide structure 710 between the first flexible printed circuit board 81 and the first frame 211 and the guide sheet 720 attached based on the setting guide structure 710 may reduce or prevent poor curing of the liquid type adhesive material filled in the first opening 401. The setting guide structure 710 between the first flexible printed circuit board 81 and the first frame 211 and the guide sheet 720 attached based on the setting guide structure 710 can enable the first flexible printed circuit board 81 to be stably positioned relative to the first opening 401 in response to vibration or shaking that may occur during the assembly process (such as a transfer operation), so that reliable curing of the liquid adhesive material filled in the first opening 401 is possible.

[0138] According to an embodiment, in operation 703 , the guide piece 720 may be detached.

[0139] Figure 8 and Fig. 9 is an exploded perspective view of a foldable electronic device 2 according to an embodiment of the present disclosure. Fig.10 is a perspective view of a foldable electronic device 2 in an unfolded state according to an embodiment of the present disclosure. Fig.11 is a view showing a foldable electronic device 2 in an unfolded state according to an embodiment of the present disclosure.

[0140] Reference Figure 8 , Fig. 9 , Fig.10 and Fig.11 The foldable electronic device 2 may include a first frame 211, a second frame 221, a first flexible printed circuit board 81, a second flexible printed circuit board 82, a first sealing portion 91, a second sealing portion 92, a third sealing portion 93, a fourth sealing portion 94, a first printed circuit board 1010, a second printed circuit board 1020, a third printed circuit board 1030, a first battery 1110 and / or a second battery 1120.

[0141] According to an embodiment, the first side 412 of the first frame 211 may include a seventh frame B7, which connects one end of the third frame B3 and one end of the fifth frame B5. The second side 422 of the second frame 221 may include an eighth frame B8, which connects one end of the fourth frame B4 and one end of the sixth frame B6. The seventh frame B7 and the eighth frame B8 may be located at the center line A (see FIG. 2 ) of the foldable electronic device 2. Figure 2 ) and are parallel to each other. In various embodiments, the seventh frame B7 may include Figure 6 In various embodiments, the eighth frame B8 may include a portion corresponding to the first hinge housing cover 213. In this case, the first hinge housing cover 213 may be omitted. Figure 6 The second hinge housing cover 223 may correspond to the portion of the second hinge housing cover 223. In this case, the second hinge housing cover 223 may be omitted.

[0142] According to an embodiment, the third supporting area 411B (see FIG. 4B ) of the first supporting portion 411 included in the first frame 211 Figure 4 ) may include a first setting area 4111, a second setting area 4112 and / or a third setting area 4113. The first setting area 4111 may be positioned closer to the third frame B3 than the fifth frame B5, and the second setting area 4112 may be positioned closer to the fifth frame B5 than the third frame B3. The third setting area 4113 may be located between the first setting area 4111 and the second setting area 4112. The first printed circuit board 1010 may be disposed in the first setting area 4111. The third printed circuit board 1030 may be disposed in the second setting area 4112. The first battery 1110 may be disposed in the third setting area 4113.

[0143] According to an embodiment, when viewed from the top of the first cover 212 (see Figure 2 ) (for example, when viewed in the +z-axis direction), the first opening 401 may be disposed between the third disposition area 4113 (or the first battery 1110) and the seventh frame B7. When viewed from the top of the first cover 212, the third opening 403 may be disposed between the first disposition area 4111 (or the first printed circuit board 1010) and the seventh frame B7 (see Figure 2 ).

[0144] According to an embodiment, the fourth supporting area 421B (see FIG. 4B ) of the second supporting portion 421 included in the second frame 221 Figure 4) may include a fourth setting area 4211 and a fifth setting area 4212. The fourth setting area 4211 may include a first partial setting area 4211a and a second partial setting area 4211b. The first partial setting area 4211a may be positioned closer to the fourth frame B4 than the sixth frame B6, and at least partially positioned between the fourth frame B4 and the fifth setting area 4212. The second partial setting area 4211b may be located between the eighth frame B8 and the fifth setting area 4212. The fifth setting area 4212 may be located between the second partial setting area 4211b and the second frame B2. The second printed circuit board 1020 may be disposed in the fourth setting area 4211. The second printed circuit board 1020 may include a first substrate area disposed in the first partial setting area 4211a, and a second substrate area extending from the first substrate area and disposed in the second partial setting area 4211b. The second battery 1120 may be disposed in the fifth setting area 4212.

[0145] According to an embodiment, as viewed from the top of the second cover 222 (see Figure 2 ), the second opening 402 and / or the fourth opening 404 may be disposed between the second local setting area 4211b (or a second substrate area disposed in the second local setting area 4211b of the second printed circuit board 1020) and the fifth setting area 4212 (or the second battery 1020).

[0146] According to an embodiment, when the first cover 212 (see Figure 2 ), when viewed from the top of the first flexible printed circuit board 81 and the first frame 211 (for example, when viewed in the +z-axis direction), the setting guide structure 710 between the first flexible printed circuit board 81 and the first frame 211 may be located between the first battery 1110 (or the third setting area 4113) and the seventh frame B7 (see Figure 2 ).

[0147] According to an embodiment, a first end 8101 of the first flexible printed circuit board 81 may be electrically connected to a connector (or first element) C1 provided on the first printed circuit board 1010. A second end 8102 of the first flexible printed circuit board 81 may be electrically connected to a connector (or second element) C2 provided on the second printed circuit board 1020. In an embodiment including a second flexible printed circuit board 82, a third end 8201 of the second flexible printed circuit board 82 may be electrically connected to a connector C3 provided on the first printed circuit board 1010. A fourth end 8202 of the second flexible printed circuit board 82 may be electrically connected to a connector C4 provided on the second printed circuit board 1020.

[0148] According to an embodiment, a portion of the second region 812 of the first flexible printed circuit board 81 may be a fourth fixing portion F4 (see FIG. 4 ) coupled to the first sealing portion 91 provided in the first opening 401. Fig.11 ). The third region 813 of the first flexible printed circuit board 81 may connect the first region 811 of the first flexible printed circuit board 81 with a portion extending from the fourth fixing portion F4 of the second region 812 to the third region 813 of the first flexible printed circuit board 81. The third region 813 may be provided in a curved form, for example, an elbow or angled form. When viewed from the top of the first cover 212 (see Figure 2 ) (for example, when viewed in the +z-axis direction), the third region 813 of the first flexible printed circuit board 81 may at least partially overlap with the first battery 1110. When viewed from the top of the first cover 212, a portion of the first region 811 and a portion of the second region 812 of the first flexible printed circuit board 81 may overlap with the first battery 1110 (see Figure 2 For example, the first substrate surface 81A included in the first flexible printed circuit board 81 (see Figure 6 ) may face the first battery 1110.

[0149] According to an embodiment, when the first cover 212 (see Figure 2 ), the first end 8101 of the first flexible printed circuit board 81 and the third area 813 may be spaced apart from each other in a first direction (e.g., in a y-axis direction) along a center line A of the foldable electronic device 2. When viewed from the top of the first cover 212 (see Figure 2 ), the first end 8101 of the first flexible printed circuit board 81 and the fourth fixing portion F4 may be spaced apart from each other in a second direction perpendicular to the center line A of the foldable electronic device 2 (eg, in the x-axis direction).

[0150] According to the embodiment, the first flexible printed circuit board 81 includes a first portion 8131 (see Figure 8 ) and Part II 8132 (see Figure 8 ). The first portion 8131 may extend the first region 811 of the first flexible printed circuit board 81. The second portion 8132 may extend the second region 812 of the first flexible printed circuit board 81. The first portion 8131 extends the first region 811 and the second portion 8132. The second portion 8132 extends the first portion 8131 and the second region 812.

[0151] According to an embodiment, the first portion 8131 and the second portion 8132 of the third region 813 may extend in different directions. The first portion 8131 may extend in a first direction (e.g., in the y-axis direction), and the second portion 8132 may extend in a second direction different from the first direction (e.g., in the x-axis direction).

[0152] According to an embodiment, a first direction in which the first portion 8131 of the third region 813 is extended and a second direction in which the second portion 8132 of the third region 813 is extended may be substantially perpendicular to each other.

[0153] According to an embodiment, the third region 813 may be provided in the form of a 90-degree elbow.

[0154] According to an embodiment, although not separately illustrated, a first direction in which the first portion 8131 of the third region 813 extends may form an acute angle or an obtuse angle with a second direction in which the second portion 8132 of the third region 813 extends.

[0155] According to an embodiment, although not separately shown, the third region 813 may be provided (or formed) in a curved shape extending the first region 811 and the second region 812 .

[0156] According to an embodiment, the first flexible printed circuit board 81 may include a first notch N1 and / or a second notch N2. The first notch N1 and / or the second notch N2 may reduce the stress that may occur in the first flexible printed circuit board 81 due to assembly deviation (or assembly position deviation) (e.g., the degree to which the figure, position, or orientation deviates from a predetermined standard or is inaccurate during assembly). The first notch N1 and / or the second notch N2 may reduce or prevent stress concentration on at least a portion of the first flexible printed circuit board 81 due to assembly deviation. The first notch N1 and / or the second notch N2 may reduce or prevent the first flexible printed circuit board 81 from breaking due to assembly deviation. The first notch N1 and / or the second notch N2 may reduce or prevent the first flexible printed circuit board 81 from wrinkling or creasing due to assembly deviation. The operation of setting (or connecting) the constituent elements to the foldable housing 20 may include a first operation and a second operation on the first flexible printed circuit board 81. In the first operation, the third fixing portion F3 of the first flexible printed circuit board 81 may be fixed to the first support portion 411 of the first frame 211, and the fourth fixing portion F4 of the first flexible printed circuit board 81 may be fixed to the first sealing portion 91 provided in the first opening 401 of the first support portion 411. In the second operation after the first operation, the first end 8101 of the first flexible printed circuit board 81 may be connected to the connector C1 of the first printed circuit board 1010 provided in the first frame 211. The first notch N1 and / or the second notch N2 may reduce stress that may occur in a portion of the first flexible printed circuit board 81 located between the first end 8101, the third fixing portion F3, and the fourth fixing portion F4 after the second operation due to assembly deviation. The first notch N1 and / or the second notch N2 may reduce or prevent stress concentration on at least a portion of a portion between the first end 8101, the third fixing portion F3, and the fourth fixing portion F4 of the first flexible printed circuit board 81 due to assembly deviation after the second operation. The first notch N1 and / or the second notch N2 can reduce or prevent the first end 8101 of the first flexible printed circuit board 81, the portion between the third fixing portion F3 and the fourth fixing portion F4 from being broken due to assembly deviation after the second operation. The first notch N1 and / or the second notch N2 can reduce or prevent the portion of the first flexible printed circuit board 81 between the first end 8101, the third fixing portion F3 and the fourth fixing portion F4 from being wrinkled or creased due to assembly deviation after the second operation.

[0157] According to an embodiment, the third region 813 of the first flexible printed circuit board 81 may include a first notch N1. The first notch N1 may reduce stress that may occur in the third region 813 due to assembly deviation or reduce or prevent stress from being concentrated in any portion of the third region 813. The position, number, or shape of the notch included in the third region 813 may vary without being limited to the example shown.

[0158] According to an embodiment, the first region 811 of the first flexible printed circuit board 81 may include a second notch N2. The second notch N2 may reduce stress that may occur in the first region 811 due to assembly deviation or reduce or prevent stress from being concentrated in any portion of the first region 811. The position, number, or shape of the notch included in the first region 811 may vary without being limited to the example shown.

[0159] The first flexible printed circuit board 81 may include a first substrate surface 81A (see Figure 4 ) and the second substrate surface 81B (see Figure 4 ) between the thickness of the first edge 81C (see Fig.11 ) and the second edge 81D (see Fig.11 ), and a length extending from the first end 8101 to the second end 8102. The first edge 81C may be closer to the third fixing portion F3 than the second edge 81D. In an embodiment, the first notch N1 may be provided on the first edge 81C, and the second notch N2 may be provided on the second edge 81D.

[0160] According to various embodiments, the second region 812 may include at least one notch.

[0161] Fig.12 is a view showing a foldable electronic device 2 in an unfolded state according to an embodiment of the present disclosure. Fig.13 is a view showing the foldable electronic device 2 with the connection member separated.

[0162] Reference Fig.12 and Fig.13 The foldable electronic device 2 may include a first frame 211, a second frame 221, a first flexible printed circuit board 81, a second flexible printed circuit board 82, a first sealing portion 91, a second sealing portion 92, a third sealing portion 93, a fourth sealing portion 94, a first printed circuit board 1010, a second printed circuit board 1020, a third printed circuit board 1030, a first battery 1110, a second battery 1120, a third fixing portion (or rigid portion) F3 and / or a connecting member 1200. Figure 8 , Fig. 9 , Fig.10 and Fig.11 Detailed description of some components shown in the drawings with the same reference numerals.

[0163] According to an embodiment, the third fixing portion (or rigid portion) F3 may be implemented to be separated from the first flexible printed circuit board 81. The first flexible printed circuit board 81 and the third fixing portion F3 may be separated from each other. Fig.11Compared to the example of FIG. 8 , the first flexible printed circuit board 81 does not include the third fixing portion F3 and the portion extending the third fixing portion F3 .

[0164] According to an embodiment, the connecting member 1200 may connect the first flexible printed circuit board 81 and the third fixing portion F3. The third fixing portion F3 may be connected to the first region 811 of the first flexible printed circuit board 81 via the connecting member 1200. Although not separately illustrated, the connecting member 1200 may be configured to connect the third region 813 of the first flexible printed circuit board 81 and the third fixing portion F3. The connecting member 1200 may be configured to connect the first flexible printed circuit board 81 and the third fixing portion F3 so that the relative position between the first flexible printed circuit board 81 and the third fixing portion F3 is fixed or maintained.

[0165] According to an embodiment, the connection member 1200 may include a plate or a film.

[0166] According to an embodiment, the connection member 1200 may be a rigid plate or a film.

[0167] According to an embodiment, the connection member 1200 may be flexible.

[0168] According to an embodiment, when viewed from the top of the second cover 212 (see Figure 2 ), the connecting member 1200 may overlap the first flexible printed circuit board 81 and the third fixing portion F3. For example, a portion of the connecting member 1200 may be located between the first flexible printed circuit board 81 and the first cover 212 (see Figure 2 ), and is coupled to the first flexible printed circuit board 81. For example, another portion of the connecting member 1200 may be located between the third fixing portion F3 and the first cover 212 (see Figure 2 ), and is connected to the third fixing portion F3.

[0169] According to an embodiment, the connection member 1200 may be coupled with the first flexible printed circuit board 81 via an adhesive material (not separately shown) disposed between the connection member 1200 and the first flexible printed circuit board 81 .

[0170] According to an embodiment, the connection member 1200 may be coupled with the third fixing portion F3 via an adhesive material (not separately shown) disposed between the connection member 1200 and the third fixing portion F3.

[0171] According to an embodiment, the connecting member 1200 may be an adhesive tape or a bonding tape. For example, the connecting member 1200 may include an adhesive surface (or bonding surface) and a non-adhesive surface (or non-bonding surface) opposite to the adhesive surface. The adhesive surface of the connecting member 1200 may face the first flexible printed circuit board 81 and the third fixing portion F3, and be coupled to the first flexible printed circuit board 81 and the third fixing portion F3. The non-adhesive surface of the connecting member 1200 may face the first cover 212 (see Figure 2 ).

[0172] According to an embodiment, when viewed from the top of the second cover 212, the connection member 1200 may overlap at least one element between the first flexible printed circuit board 81 and the third fixing portion F3 (see FIG. 21 ). Figure 2 For example, when viewed from the top of the second cover 212, the connecting member 1200 may overlap the first battery 1110 between the first flexible printed circuit board 81 and the third fixing portion F3 (see FIG. 21A ). Figure 2 ).

[0173] According to an embodiment, an adhesive surface (eg, an adhesive tape) of the connection portion 1200 may be coupled to the first battery 1100 between the first flexible printed circuit board 81 and the third fixing portion F3 .

[0174] According to an exemplary embodiment of the present disclosure, a foldable electronic device 2 includes a foldable housing 20 and a flexible printed circuit board 81. The foldable housing 20 includes a first housing 21, a second housing 22, and a hinge portion H connecting the first housing 21 and the second housing 22. The flexible printed substrate 81 electrically connects a first element (e.g., a connector C1) configured in the first housing 21 and a second element (e.g., a connector C2) configured in the second housing 22, and is configured in a manner spanning the hinge portion H. The flexible printed circuit board 81 includes a first region 811, a second region 812, a third region 813, and a fourth region 814. The first region 811 extends from a first end 8101 electrically connected to the first element C1 and is positioned to correspond to the first housing 21. The second region 812 extends from a second end 8102 electrically connected to the second element C2, and may be disposed to span the hinge portion H. The third region 813 is positioned to correspond to the first housing 21, and may connect the first region 811 and the second region 812. The third region 813 may include a first portion of the first region 811 extending in a first direction, and a second portion of the second region 812 extending in a second direction different from the first direction and connected to the first portion. The fourth region 814 extends from the first region 811 or the third region 813 and may be fixed to the first housing 21. Therefore, the flexible printed circuit board 81 is stably connected across the hinge portion H and supported by the hinge portion H to allow a stable connection during the assembly process. In addition, the flexible printed circuit board 81 may be set at a specified position by means of the fourth region 814. The position of the flexible printed circuit board 81 relative to the first housing 21 may be preferably (or primarily) determined by means of the fixation of the fourth region 814, which further enables the flexible printed circuit board 81 to be stably positioned in response to vibrations or shakes that may occur during the assembly process.

[0175] According to an exemplary embodiment of the present disclosure, the first housing 21 may include a first support area 411A, a third support area 411B disposed opposite to the first support area 411A, and a first opening 401 penetrating the first support area 411A and the third support area 411B. The second housing 22 may include a second support area 421A, a fourth support area 421B disposed opposite to the second support area 421A, and a second opening 402 penetrating the second support area 421A and the fourth support area 421B. In the folded state of the foldable housing 20, the first support area 411A and the second support area 421A may face each other, and the third support area 411B and the fourth support area 421B may point to opposite directions. The first element C1 may be disposed in the third support area 411B, and the second element C2 may be disposed in the fourth support area 421B. The second area 812 of the flexible printed circuit board 81 may penetrate the first opening 401 and the second opening 402. The openings 401, 402 allow the second area 812 of the flexible printed circuit board 81 to be stably connected across the hinge portion H. The foldable electronic device 2 may further include a first sealing portion 91 disposed in the first opening 401 and a second sealing portion 92 disposed in the second opening 402. The second region 812 of the flexible printed circuit board 81 may penetrate the first sealing portion 91 and the second sealing portion 92. The sealing portions 91, 92 may reduce or prevent moisture introduced from the outside into the foldable electronic device 2 from flowing through (or moving) the openings 401, 402. In addition, the second region 812 of the flexible printed circuit board 81 may be further stably connected by the contribution of the sealing portions 91, 92.

[0176] According to an example embodiment of the present disclosure, the flexible printed circuit board 81 may further include a first notch N1 disposed in the third region 813. The first notch N1 may reduce stress that may occur in the flexible printed circuit board 81 due to assembly deviation (or assembly position deviation) (e.g., the degree to which a pattern, position, or orientation deviates from a predetermined standard or is inaccurate during assembly). The first notch N1 may reduce or prevent stress concentration on at least a portion of the flexible printed circuit board 81, and reduce or prevent breakage, wrinkling, or creases of the flexible printed circuit board 81 due to assembly deviation.

[0177] According to an example embodiment of the present disclosure, the flexible printed circuit board 81 may further include a second notch N2 disposed in the first region 811. The second notch N2 may further reduce stress that may occur in the flexible printed circuit board 81 due to assembly deviation (or assembly position deviation) (e.g., the extent to which a pattern, position, or orientation deviates from a predetermined standard or is inaccurate during assembly), and may reduce or prevent stress concentration on at least a portion of the flexible printed circuit board 81 due to assembly deviation. The second notch N2 may reduce or prevent the flexible printed circuit board 81 from breaking, wrinkling, or creasing due to assembly deviation.

[0178] According to an example embodiment of the present disclosure, the fourth region 814 of the flexible printed circuit board 81 may further include one or more openings 818 and 819. The first housing 21 may include one or more protrusions P1, P2 inserted into the one or more openings 818 and 819. This may enable the flexible printed circuit board 81 to be stably positioned relative to the first opening 401 in response to vibration or shaking that may occur during the assembly process.

[0179] According to an exemplary embodiment of the present disclosure, the portion F3 of the flexible printed circuit board 81 fixed to the fourth region 814 of the first housing 21 may be rigidly configured. This may ensure that the flexible printed circuit board 81 is stably positioned during the assembly process.

[0180] According to an example embodiment of the present disclosure, the fourth region 814 of the flexible printed circuit board substrate 81 may include a reinforcement portion. The reinforcement portion may further fix the flexible printed circuit board 81 to be stably positioned during the assembly process.

[0181] According to an example embodiment of the present disclosure, the third region 813 of the flexible printed circuit board 81 may be provided in the form of a 90-degree elbow.

[0182] According to an exemplary embodiment of the present disclosure, the second region 812 of the flexible printed circuit board 81 may further include a first fixing portion F1 coupled to the hinge portion H corresponding to the first housing 21 and a second fixing portion F2 coupled to the hinge portion H corresponding to the second housing 22. This may further ensure that the flexible printed circuit board 81 is stably positioned, particularly during the assembly process.

[0183] According to an exemplary embodiment of the present disclosure, the hinge portion H may include a hinge module 5A and a first plate 71 and a second plate 72 coupled to the hinge module 5A. The hinge module 5A may include a first bracket 51A fixed to the first housing 21, a second bracket 52A fixed to the second housing 22, and a bracket connector 53A connecting the first bracket 51A and the second bracket 52A. The first plate 71 may be coupled to the bracket connector 53A corresponding to the first housing 21, and the second plate 72 may be coupled to the bracket connector 53A corresponding to the second housing 22. In the folded state of the foldable housing 20, the first surface 71A of the first plate 71 and the second surface 72A of the second plate 72 may face each other. In the unfolded state of the foldable housing 20, the angle formed by the first surface 71A and the second surface 72A may be 180 degrees. In the expanded state, even when external force (e.g., external pressure, such as touch input using a user's finger or touch input using an electronic pen, but not limited to) is applied to the area corresponding to the hinge portion H, the area corresponding to the hinge portion H, such as the third display area, can be maintained flat by the support of the first plate 71 and the second plate 72.

[0184] According to an embodiment, the bracket connector 53A of the first hinge module 5A may include a center plate 54A aligned with the center line A of the foldable electronic device 2. The center plate 54A may reduce or prevent a sagging phenomenon or a creeping phenomenon of a portion of an area corresponding to a gap between the first surface 71A of the first plate 71 and the second surface 72A of the second plate 72 in the unfolded state of the foldable electronic device 2.

[0185] According to an exemplary embodiment of the present disclosure, the foldable electronic device 2 may further include a battery 1110 disposed in the first housing 21. The flexible printed circuit board 81 may include a first substrate surface 81A and a second substrate surface 81B disposed opposite to the first substrate surface 81A. A portion of the first substrate surface 81A may face the battery 1110.

[0186] According to an exemplary embodiment of the present disclosure, the foldable electronic device 2 may further include a flexible display module (eg, Figure 2The first display module 24 in the flexible display module 24 may include a first display area ①, a second display area ② and a third display area ③. The first display area ① may be arranged in the first shell 21. The second display area ② may be arranged in the second shell 22. The third display area ③ may connect the first display area ① and the second display area ②, and may be positioned corresponding to the hinge portion H. The hinge portion H may support the third display area ③. For example, when an external force (e.g., external pressure such as touch input using a user's finger or touch input using an electronic pen) is applied to the third display area ③, the hinge portion H reduces the sagging phenomenon of the third display area ③, so that the third display area ③ remains flat. In the unfolded state, when an external impact such as a fall is applied, the hinge portion H is configured to reduce the impact of the external impact on the third display area ③. Therefore, the hinge portion H supports the third display area ③, so that the third display area ③ can be set flat without sagging, thereby reducing the crease phenomenon.

[0187] According to an exemplary embodiment of the present disclosure, a foldable electronic device 2 includes a foldable housing 20 and a flexible printed circuit board 81. The foldable housing 20 includes a first housing 21, a second housing 22, and a hinge portion H connecting the first housing 21 and the second housing 22. The flexible printed circuit board 81 electrically connects a first element C1 configured in the first housing 21 and a second element C2 configured in the second housing 22. The flexible printed circuit board 81 is configured in a manner spanning the hinge portion H. The flexible printed circuit board 81 includes a first region 811, a second region 812, a third region 813, and a rigid portion F3. The first region 811 includes a first connector end 8101 electrically connected to the first element C1. The second region 812 includes a second connector end 8102 electrically connected to the second element C2. The second region 812 is configured across the hinge portion H. The third region 813 is disposed between the first region 811 and the second region 812. The third region 813 includes a first portion 8131 extending in a first direction and a second portion 8132 extending to the second region 812 in a second direction. The second direction is different from the first direction. The first region 811 and the third region 813 are provided in the first housing 21. The rigid portion F3 is configured to connect the first region 811 or the third region 813 extending toward the hinge portion H to the first housing 21.

[0188] According to an example embodiment of the present disclosure, at least one signal line included in the flexible printed circuit board 81 may not be provided in the rigid portion F3 .

[0189] According to an exemplary embodiment of the present disclosure, the first housing 21 may include a first support area 411A, a third support area 411B disposed opposite to the first support area 411A, and a first opening 401 configured to penetrate the first support area 411A and the third support area 411B. The second housing 22 may include a second support area 421A, a fourth support area 421B disposed opposite to the second support area 421A, and a second opening 402 configured to penetrate the second support area 421A and the fourth support area 421B. In the folded state of the foldable housing 20, the first support area 411A and the second support area 421A may face each other, and the third support area 411B and the fourth support area 421B may point to opposite directions from each other. The first element C1 may be disposed on the third support area 411B. The second element C2 may be disposed on the fourth support area 421B. The second area 812 of the flexible printed circuit board 81 may penetrate the first opening 401 and the second opening 402. The rigid portion F3 may be fixed to the third support area 411B.

[0190] According to an exemplary embodiment of the present disclosure, the foldable electronic device 2 may further include a first sealing member 91 disposed in the first opening 401 and a second sealing member 92 disposed in the second opening 402. The second region 812 of the flexible printed circuit board 81 may be fixed to the first housing 21 via the first sealing member 91. The second region 812 of the flexible printed circuit board 81 may be fixed to the second housing 22 via the second sealing member 92. The rigid portion F3 and the first opening 401 may be disposed in the direction of the folding axis A of the foldable electronic device 2.

[0191] According to an exemplary embodiment of the present disclosure, the foldable electronic device 2 may further include a battery 1110 disposed on the third support area 411B. The third area 813 of the flexible printed circuit board 81 may overlap the battery 1110. With reference to the unfolded state of the foldable electronic device 2, the rigid portion F3 may be disposed on a fixed area between the battery 1110 and the second housing 22.

[0192] According to an example embodiment of the present disclosure, the foldable electronic device 2 may further include another flexible printed circuit board 82, which electrically connects the third element C3 disposed in the first housing 21 and the fourth element C4 disposed in the second housing 22. The other flexible printed circuit board 82 may be disposed across the hinge portion H. The first housing 21 may include a third opening 403, which is configured to penetrate the first support area 411A and the third support area 411B. The second housing 22 may include a fourth opening 404, which is configured to penetrate the second support area 421A and the fourth support area 421B. The other flexible printed circuit board 82 may penetrate the third opening 403 and the fourth opening 404. The rigid portion F3 may be fixed to a fixed area of ​​the third support area 411B between the first opening 401 and the third opening 403.

[0193] According to an example embodiment of the present disclosure, the flexible printed circuit board 81 may include a first edge 81C and a second edge 81D. The flexible printed circuit board 81 may have a width between the first edge 81C and the second edge 81D. The first edge 81C may be closer to the rigid portion F3 than the second edge 81D. The flexible printed circuit board 81 may also include a first notch N1 disposed in the third region 813. The first notch N1 may be formed at the first edge 81C.

[0194] According to an example embodiment of the present disclosure, the flexible printed circuit board 81 may further include a second notch N2 disposed in the first region 811. The second notch N2 may be formed at the second edge 81D.

[0195] According to an exemplary embodiment of the present disclosure, the rigid portion F3 of the flexible printed circuit board 81 may further include one or more openings 818 and 819. The first housing 21 may include one or more protrusions P1 and P2 inserted into the one or more openings 818 and 819.

[0196] According to an example embodiment of the present disclosure, the flexible printed circuit board 81 may include a fourth region 814 extending from the first region 811 or the third region 813. The rigid portion F3 may include a reinforcement portion and a portion of the fourth region 814 where the reinforcement portion is disposed.

[0197] According to an example embodiment of the present disclosure, the rigid portion F3 may be connected to the first region 811 or the third region 813 via a connection member 1200 .

[0198] According to an example embodiment of the present disclosure, the third region 813 of the flexible printed circuit board 81 may be provided in the form of a 90-degree elbow.

[0199] According to an exemplary embodiment of the present disclosure, the second region 812 of the flexible printed circuit board 81 may further include a first fixing portion F1 coupled to the hinge portion H corresponding to the first housing 21 and a second fixing portion F2 coupled to the hinge portion H corresponding to the second housing 22. The first fixing portion F1 and / or the second fixing portion F2 may be rigid.

[0200] According to an exemplary embodiment of the present disclosure, the hinge portion H may include a hinge module 5A and a first plate 71 and a second plate 72 coupled to the hinge module 5A. The hinge module 5A may include a first bracket 51A fixed to the first housing 21, a second bracket 52A fixed to the second housing 22, and a bracket connector 53A configured to connect the first bracket 51A and the second bracket 52A. The first plate 71 may be coupled to the bracket connector 53A corresponding to the first housing 21. The second plate 72 may be coupled to the bracket connector 53A corresponding to the second housing 22. In the folded state of the foldable housing 20, the first surface 71A of the first plate 71 and the second surface 72A of the second plate 72 may face each other. The angle formed by the first surface 71A and the second surface 72A in the unfolded state of the foldable housing 20 may be 180 degrees. The first fixing portion F1 of the flexible printed circuit board 81 may be coupled to the first plate 71. The second fixing portion F2 of the flexible printed circuit board 81 may be coupled to the second plate 72.

[0201] According to an exemplary embodiment of the present disclosure, the foldable electronic device 2 may further include a flexible display module 24 disposed in the foldable housing 20. The flexible display module 24 may include a first display area ① disposed in the first housing 21, a second display area ② disposed in the second housing 22, and a third display area ③, the third display area ③ being positioned corresponding to the hinge portion H and extending the first display area ① and the second display area ②.

[0202] The embodiments of the present disclosure disclosed in the present disclosure and shown in the accompanying drawings are provided as specific examples to more easily explain the technical content according to the present disclosure and help understand the present disclosure, but are not intended to limit the scope of the present disclosure. Therefore, the scope of the various embodiments of the present disclosure should be interpreted as including changes or modifications other than the disclosed embodiments. In addition, it should be understood that any embodiment described herein can be used in combination with any other embodiment described herein.

Claims

1. A foldable electronic device, comprising: A foldable housing (20) comprising a first housing (21), a second housing (22) and a hinge portion (H) connecting the first housing (21) and the second housing (22); and a flexible printed circuit board (81) electrically connecting a first element (C1) disposed in the first housing (21) and a second element (C2) disposed in the second housing (22), wherein the flexible printed circuit board (81) is disposed across the hinge portion (H), Wherein, the flexible printed circuit board (81) comprises: a first region (811) comprising a first connector end (8101) electrically connected to the first element (C1); a second region (812) comprising a second connector end (8102) electrically connected to the second element (C2), the second region (812) being disposed across the hinge portion (H); a third region (813) disposed between the first region (811) and the second region (812), the third region (813) comprising a first portion (8131) extending along a first direction and a second portion (8132) extending to the second region (812) along a second direction, the second direction being different from the first direction, wherein the first region (811) and the third region (813) are disposed in the first housing (21); and The rigid portion (F3) is configured to connect the first region (811) or the third region (813) extending toward the hinge portion (H) to the first shell (21).

2. The foldable electronic device according to claim 1, wherein: At least one signal line included in the flexible printed circuit board (81) is not provided in the rigid portion (F3).

3. The foldable electronic device according to claim 1 or 2, wherein: The first housing (21) includes a first supporting area (411A), a third supporting area (411B) arranged opposite to the first supporting area (411A), and a first opening (401) configured to penetrate the first supporting area (411A) and the third supporting area (411B). The second housing (22) includes a second supporting area (421A), a fourth supporting area (421B) arranged opposite to the second supporting area (421A), and a second opening (402) configured to penetrate the second supporting area (421A) and the fourth supporting area (421B). wherein, in the folded state of the foldable shell (20), the first support area (411A) and the second support area (421A) face each other, and the third support area (411B) and the fourth support area (421B) point in opposite directions to each other, wherein the first element (C1) is arranged on the third supporting area (411B), and the second element (C2) is arranged on the fourth supporting area (421B), wherein the second area (812) of the flexible printed circuit board (81) passes through the first opening (401) and the second opening (402), and Wherein, the rigid part (F3) is fixed to the third supporting area (411B).

4. The foldable electronic device according to claim 3, wherein: The foldable electronic device (2) further comprises a first sealing member (91) arranged in the first opening (401) and a second sealing member (92) arranged in the second opening (402). wherein the second region (812) of the flexible printed circuit board (81) is fixed to the first housing (21) via the first sealing member (91), wherein the second region (812) of the flexible printed circuit board (81) is fixed to the second housing (22) via the second sealing member (92), Wherein, the rigid portion (F3) and the first opening (401) are arranged in the direction of the folding axis (A) of the foldable electronic device.

5. The foldable electronic device according to claim 3 or 4, further comprising a battery (1110) arranged on the third supporting area (411B), in, The third region (813) of the flexible printed circuit board (81) overlaps with the battery (1110), and Wherein, referring to the unfolded state of the foldable electronic device, the rigid portion (F3) is arranged on a fixed area between the battery (1110) and the second shell (22).

6. The foldable electronic device according to any one of claims 3 to 5, further comprising another flexible printed circuit board (82) electrically connecting the third element (C3) arranged in the first shell (21) and the fourth element (C4) arranged in the second shell (22), wherein the other flexible printed circuit board (82) is arranged across the hinge portion (H). in, The first housing (21) includes a third opening (403) configured to penetrate the first supporting area (411A) and the third supporting area (411B), The second housing (22) includes a fourth opening (404) configured to penetrate the second support area (421A) and the fourth support area (421B), wherein the other flexible printed circuit board (82) passes through the third opening (403) and the fourth opening (404), and Wherein, the rigid portion (F3) is fixed on a fixing area of ​​the third supporting area (411B) located between the first opening (401) and the third opening (403).

7. The foldable electronic device according to any one of claims 1 to 6, in, The flexible printed circuit board (81) includes a first edge (81C) and a second edge (81D), and the flexible printed circuit board (81) has a width between the first edge (81C) and the second edge (81D). wherein the first edge (81C) is closer to the rigid portion (F3) than the second edge (81D), and Wherein, the flexible printed circuit board (81) further includes a first notch (N1) arranged in the third area (813), and the first notch (N1) is formed at the first edge (81C).

8. The foldable electronic device according to claim 7, wherein: The flexible printed circuit board (81) further includes a second notch (N2) disposed in the first region (811), the second notch (N2) being formed at the second edge (81D).

9. The foldable electronic device according to any one of claims 1 to 8, wherein: The rigid portion (F3) of the flexible printed circuit board (81) further includes one or more openings (818, 819), and the first housing (21) includes one or more protrusions (P1, P2) inserted into the one or more openings (818, 819).

10. The foldable electronic device according to any one of claims 1 to 9, in, The flexible printed circuit board (81) includes a fourth region (814) extending from the first region (811) or the third region (813), The rigid portion (F3) includes a reinforcement portion and a portion of the fourth region (814) where the reinforcement portion is disposed.

11. The foldable electronic device according to any one of claims 1 to 9, wherein: The rigid portion (F3) is connected to the first region (811) or the third region (813) via a connecting member (1200).

12. The foldable electronic device according to any one of claims 1 to 11, wherein: The third area (813) of the flexible printed circuit board (81) is provided in the form of a 90-degree elbow.

13. The foldable electronic device according to any one of claims 1 to 12, wherein: The second region (812) of the flexible printed circuit board (81) further includes a first fixing portion (F1) and a second fixing portion (F2), the first fixing portion (F1) being coupled to the hinge portion (H) corresponding to the first housing (21), the second fixing portion (F2) being coupled to the hinge portion (H) corresponding to the second housing (22), and Wherein, the first fixing portion (F1) and / or the second fixing portion (F2) are rigid.

14. The foldable electronic device according to claim 13, wherein: The hinge part (H) includes a hinge module (5A), and a first plate (71) and a second plate (72) coupled to the hinge module (5A). The hinge module (5A) includes a first bracket (51A) fixed to the first shell (21), a second bracket (52A) fixed to the second shell (22), and a bracket connector (53A) configured to connect the first bracket (51A) and the second bracket (52A). wherein the first plate (71) is connected to the bracket connector (53A) corresponding to the first shell (21), and the second plate (72) is connected to the bracket connector (53A) corresponding to the second shell (22), wherein, in the folded state of the foldable housing (20), the first surface (71A) of the first plate (71) and the second surface (72A) of the second plate (72) face each other, wherein, in the unfolded state of the foldable housing (20), the angle formed by the first surface (71A) and the second surface (72A) is 180 degrees, wherein the first fixing portion (F1) of the flexible printed circuit board (81) is coupled to the first board (71), and Wherein, the second fixing portion (F2) of the flexible printed circuit board (81) is coupled to the second board (72).

15. The foldable electronic device according to any one of claims 1 to 14, further comprising a flexible display module (24) arranged in the foldable housing (20), in, The flexible display module (24) comprises: A first display area (①) arranged in the first housing (21); a second display area (②) disposed in the second housing (22); and The third display area (③) is located corresponding to the hinge portion (H) and extends the first display area (①) and the second display area (②).

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