Heating structure with local heating function and using method thereof

Abstract

The invention discloses a heating structure with a local heating function, the heating structure with the local heating function comprises a heating component and a power supply component, the power supply component provides energy for the heating component, the heating component comprises at least two clamping pieces (11), and the clamping pieces (11) are arranged on the heating component. The plurality of clamping pieces (11) are close to each other near a to-be-disassembled element and can heat the to-be-disassembled element; the power supply component comprises a temperature control assembly, and the temperature control assembly controls the heating power of the heating component. The heating structure with the local heating function is provided with the heating structure, so that local heating can be carried out around the to-be-detached component, and the to-be-detached component is very easy to detach.

Description

Technical Field

[0001] The invention relates to the field of manufacturing electronic components, and in particular to a heating structure with a local heating function and a use method thereof. Background Art

[0002] During the welding process of electronic components, it is often necessary to disassemble some electronic components. The tools commonly used for disassembly are electric soldering irons and hot air guns. For example, the soldering iron tip is heated to an appropriate temperature to melt the solder wire so that the component is separated from the pad, or high-temperature air is blown to separate the component from the pad.

[0003] However, when using a soldering iron to remove electronic components, only the pads on one side can be heated at the same time. If the printed circuit board has a heat dissipation pad, the pads on the other side will have cooled down when one side is heated, which makes it difficult to remove the electronic components. Although using a hot air gun to remove electronic components can heat the pads at the same time, it may cause damage to some components that are not resistant to high temperatures and are located around the components to be removed. Summary of the invention

[0004] In order to overcome the problem of difficulty in disassembling electronic components in the prior art, the present invention provides a heating structure with a local heating function. The heating structure with a local heating function is provided with a heating structure capable of performing local heating around the detachable components, making the detachable components very easy to disassemble.

[0005] In order to achieve the above-mentioned object, the present invention provides a heating structure with a local heating function, the heating structure with a local heating function comprises a heating component and a power supply component, the power supply component provides energy for the heating component, the heating component comprises at least two clamping members, and the plurality of clamping members are close to each other near a component to be disassembled and can heat the component to be disassembled;

[0006] The power supply component includes a temperature control component, and the temperature control component controls the heating power of the heating component.

[0007] Preferably, the heating component includes two position states: a working state and a waiting state. When the plurality of clamping members are away from each other, the heating component is in the waiting state. When the plurality of clamping members are close to each other, the heating component is in the working state.

[0008] Preferably, when the heating component is in working state, the plurality of clamping members are close to each other and enclosed to form a clamping position.

[0009] Preferably, at least one clamping position is provided.

[0010] The present invention also provides a method for using a heating structure with a local heating function, the method comprising:

[0011] Step 1, starting the temperature-controlled soldering station and the heating structure;

[0012] Step 2, moving the heating structure to the vicinity of the component to be disassembled, so that the heating component is in a waiting state;

[0013] Step 3: After the solder near the component to be removed is melted, pull the component to be removed upward.

[0014] Preferably, in step 2, the heating structure can select to use different types of the clamping members according to the number and position status of the components to be disassembled.

[0015] Preferably, in step 3, the heating component is controlled to be in a working state, the component to be disassembled is located in the clamping position, and the component to be disassembled is extracted by controlling the clamping member.

[0016] Preferably, in step 3, a sleeve is sleeved on the plurality of clamping members, and the sleeve is moved to drive the plurality of clamping members to approach each other and clamp the component to be disassembled.

[0017] Preferably, in step 3, after the solder near the component to be removed is melted, the component to be removed is extracted using tools such as tweezers.

[0018] Preferably, the temperature control component includes a sensor, a control chip and a display, the sensor detects the temperature of the clamping member, the display is used to display the temperature detected by the sensor, and the control chip controls the heating power of the clamping member according to the temperature detected by the sensor.

[0019] According to the above technical solution, the heating component of the present invention is configured to include at least two clamping members, and the multiple clamping members can surround the component to be disassembled along the periphery of the component to be disassembled. The power supply component provides energy to the heating component, so that the multiple clamping members start to heat up, heating the solder at the bottom of the component to be disassembled until the solder melts. After the solder melts, the component to be disassembled can be easily pulled out.

[0020] In the above technical solution, the heating component is configured to include multiple clamping members, and the multiple clamping members can be as close to the component to be disassembled as possible, thereby minimizing the impact on other electrical components near the component to be disassembled, thereby avoiding other components near the component to be disassembled from being damaged by high temperature.

[0021] Since multiple clamping members can be arranged around the periphery of the component to be disassembled, the multiple clamping members can achieve surrounding heating of the bottom solder of the component to be disassembled, so that the bottom solder of the component to be disassembled can be melted evenly and reliably, thereby conveniently realizing the disassembly of the component to be disassembled.

[0022] The power supply component includes a temperature control component, which controls the heating power of the heating component. The heating power of the heating component can be controlled by the temperature control component according to the actual production needs. In the initial stage of heating, a larger heating power can be set for the heating component so that the solder at the bottom of the component to be removed can quickly increase the temperature. When the solder at the bottom of the component to be removed begins to melt, the heating power of the heating component can be appropriately reduced to avoid too much energy provided by the heating component, causing a large range of temperature rise around the component to be removed, affecting other components that do not need to be removed. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a heating component;

[0024] Figure 2 It is a variety of gripping parts;

[0025] Figure 3 It is a kind of clamping piece;

[0026] Figure 4 It is another type of clamping piece.

[0027] Description of Reference Numerals

[0028] 11 clamping piece 12 clamping position

[0029] 13 sleeve DETAILED DESCRIPTION

[0030] In the present invention, unless otherwise stated, directional words such as "away from, up, down, sideways, both ends" generally refer to the orientation of the term in normal use, or are common names understood by those skilled in the art, and should not be regarded as limitations on the term.

[0031] A heating structure with a local heating function, the heating structure comprises a heating component and a power supply component, the power supply component provides energy for the heating component, the heating component comprises at least two clamping members 11, and the plurality of clamping members 11 are close to each other near a component to be disassembled and can heat the component to be disassembled;

[0032] The power supply component includes a temperature control component which controls the heating power of the heating component.

[0033] Through the implementation of the above technical solution, the heating component is configured to include at least two clamping members 11, and the multiple clamping members 11 can surround the component to be disassembled along the periphery of the component to be disassembled. The power supply component provides energy to the heating component, so that the multiple clamping members 11 start to heat up, heating the solder at the bottom of the component to be disassembled until the solder melts. After the solder melts, the component to be disassembled can be easily pulled out.

[0034] In the above technical solution, the heating component is configured to include a plurality of clamping members 11, and the plurality of clamping members 11 can be as close to the component to be disassembled as possible, thereby minimizing the impact on other electrical components near the component to be disassembled, thereby preventing other components near the component to be disassembled from being damaged by high temperature.

[0035] Since the plurality of clamping members 11 can be arranged around the periphery of the component to be disassembled, the plurality of clamping members 11 can realize surrounding heating of the bottom solder of the component to be disassembled, so that the bottom solder of the component to be disassembled can be melted evenly and reliably, thereby conveniently realizing the disassembly of the component to be disassembled.

[0036] The power supply component includes a temperature control component, which controls the heating power of the heating component. The heating power of the heating component can be controlled by the temperature control component according to the actual production needs. In the initial stage of heating, a larger heating power can be set for the heating component so that the solder at the bottom of the component to be removed can quickly increase the temperature. When the solder at the bottom of the component to be removed begins to melt, the heating power of the heating component can be appropriately reduced to avoid too much energy provided by the heating component, causing a large range of temperature rise around the component to be removed, affecting other components that do not need to be removed.

[0037] In this embodiment, preferably, the heating component includes two position states: a working state and a waiting state. When the multiple clamping members 11 are away from each other, the heating component is in the waiting state. When the multiple clamping members 11 are close to each other, the heating component is in the working state.

[0038] Multiple clamping members 11 can be distributed around the periphery of the component to be disassembled. The multiple clamping members 11 are far away from each other but are all near the component to be disassembled, and heat the solder at the bottom of the component to be disassembled. At this time, the heating component is in a waiting state until the solder at the bottom of the component to be disassembled is completely melted. At this time, the heating component completes the heating work of the component to be disassembled, and the component to be disassembled can be disassembled.

[0039] Preferably, the plurality of clamping members 11 are controlled to be close to each other to clamp the component to be disassembled, and the component to be disassembled is pulled out after the plurality of clamping members 11 are clamped, so that the disassembly work of the component to be disassembled can be achieved.

[0040] In one embodiment, two clamping members 11 are provided, such as Figure 1 As shown, the two clamping members 11 are arranged opposite to each other. When the heating component is in a waiting state, the two clamping members 11 are respectively located on both sides of the component to be disassembled to heat the component to be disassembled. When the solder at the bottom of the component to be disassembled is completely melted, the operator pinches the two clamping members 11 so that the ends of the two clamping members 11 are closed and the component to be disassembled is clamped between the two clamping members 11, thereby realizing the clamping effect of the two clamping members 11 on the component to be disassembled. At this time, the operator can lift the heating component upwards to realize the disassembly of the component to be disassembled.

[0041] In a real-time mode, a plurality of clamping members 11 are provided, such as Figure 4 As shown, a plurality of clamping members 11 enclose an area. When the heating component is in a waiting state, the plurality of clamping members 11 can melt the solder at the bottom of a larger component to be disassembled. After the solder is melted, tightening the plurality of clamping members 11 can achieve the clamping effect on the component to be disassembled and extract the component to be disassembled.

[0042] In this embodiment, preferably, when the heating component is in working state, the plurality of clamping members 11 are close to each other and enclosed to form a clamping position 12 .

[0043] When the heating component is in working state, the multiple clamping members 11 are close to each other, and the multiple clamping members 11 close to each other enclose a clamping position 12, and the component to be disassembled is located in the clamping position 12. Therefore, the multiple clamping members 11 clamp the component to be disassembled through the clamping position 12.

[0044] Preferably, for components to be disassembled of different shapes, the shapes of the clamping position 12 can also be set to be different, such as Figure 3 As shown, the two clamping members 11 can form a serrated clamping position 12 when they are close to each other. The clamping position 12 can correspond to a plurality of small components to be disassembled arranged side by side, and can also be used to disassemble components to be disassembled having a wavy surface.

[0045] In this embodiment, preferably, at least one clamping position 12 is provided.

[0046] When the heating component is in working state, the clamping position 12 can realize reliable disassembly of the component to be disassembled. In one embodiment, only one clamping position 12 is provided, and only one component to be disassembled is disassembled at a time. In another embodiment, multiple clamping positions 12 can be provided. When the heating component is in waiting state, multiple components to be disassembled are heated. When the heating component is in working state, multiple clamping positions 12 can realize the disassembly of the multiple components to be disassembled at the same time.

[0047] In this embodiment, preferably, multiple types of clamping members 11 are provided.

[0048] like Figure 2 As shown, the shape of the clamping member 11 varies according to the actual situation such as the position and shape of the component to be disassembled. Reasonable selection of the clamping member 11 according to the actual situation of the component to be disassembled can improve work efficiency.

[0049] A method for using a heating structure with a local heating function, the method comprising:

[0050] Step 1, start the heating structure;

[0051] Step 2, move the heating structure to the vicinity of the component to be disassembled, so that the heating component is in a waiting state;

[0052] Step 3: After the solder near the component to be removed melts, pull the component to be removed upwards.

[0053] The heating structure can be started by turning on the power component. After the power component is turned on, the heating component starts to heat. At this time, the heating component is moved to the vicinity of the component to be disassembled, and the clamping member 11 surrounds the solder at the bottom of the component to be disassembled, so that the welder at the bottom of the component to be disassembled can be evenly melted, so that the component to be disassembled can be reliably pulled out.

[0054] In this embodiment, preferably, in step 2, the heating structure can select to use different types of clamping members 11 according to the number and position status of the components to be disassembled.

[0055] According to the spatial position of the component to be removed, a clamping member 11 that can extend into the vicinity of the solder of the component to be removed can be selected, so the clamping member 11 has various shapes.

[0056] Preferably, if there are multiple components to be disassembled, a suitable clamping piece 11 can be selected for each component to be disassembled, and these clamping pieces 11 can be placed around the multiple components to be disassembled, and these components to be disassembled can be heated at the same time. After the solder of these components to be disassembled is melted, these components to be disassembled can be disassembled in turn.

[0057] In this embodiment, preferably, in step 3, the heating component is controlled to be in a working state, the component to be disassembled is located in the clamping position 12, and the component to be disassembled is extracted by controlling the clamping member 11.

[0058] By controlling the heating component to be in a working state, the clamping and disassembly of the clamping member 11 can be achieved.

[0059] In this embodiment, preferably, in step 3, a sleeve 13 is sleeved on the plurality of clamping members 11, and the sleeve 13 is moved to drive the plurality of clamping members 11 to approach each other and clamp the component to be disassembled.

[0060] If the number of the clamping members 11 exceeds two, the operator can manually control the plurality of clamping members 11 to approach each other. In this case, the sleeve 13 can be pushed or pulled to control the plurality of clamping members 11 .

[0061] When the sleeve 13 is pushed toward the end of the clamping member 11, the multiple clamping members 11 can be driven to approach each other, so that the heating component is in a working state; conversely, when the sleeve 13 is pulled back in a direction away from the end of the clamping member 11, the multiple clamping members 11 can be separated from each other, and at this time, the heating component is in a waiting state.

[0062] Preferably, if the position of the sleeve 13 is set to be lockable, the degree of separation of the clamping members 11 from each other can be controlled by controlling the length of the sleeve 13 pushed out, so as to meet the heating requirements for components to be disassembled with different degrees of discreteness.

[0063] In one embodiment, the bottom of the clamping member 11 is fixed to the installation position, a thread is provided inside the sleeve 13, and a thread matching the thread inside the sleeve 13 is provided on the outside of the installation position. Through this screw connection, the length of the sleeve 13 can be controlled and the position of the sleeve 13 can be locked.

[0064] In this embodiment, preferably, in step 3, after the solder near the component to be removed is melted, the component to be removed is extracted using a tool such as tweezers.

[0065] If it is not possible to select a suitable clamping member 11 to clamp the component to be disassembled, then other tools such as tweezers can be used to assist in extracting the component to be disassembled. This is particularly suitable when multiple components to be disassembled are heated at the same time and the clamping members 11 cannot extract the components to be disassembled by approaching each other or approaching each other. In this case, this method of using an auxiliary workpiece to extract the components to be disassembled can be used.

[0066] In one embodiment, multiple clamping members 11 heat multiple components to be disassembled at the same time. The multiple clamping members 11 cannot extract the components to be disassembled by approaching each other or approaching each other two by two. In this case, the operator can use tweezers or similar tools to remove the components to be disassembled whose bottom solder has melted one by one.

[0067] In this embodiment, preferably, the temperature control component includes a sensor, a control chip and a display, the sensor detects the temperature of the clamping member 11, the display is used to display the temperature detected by the sensor, and the control chip controls the heating power of the clamping member 11 according to the temperature detected by the sensor.

[0068] The sensor is used to detect the temperature of the clamping member 11. After detecting the temperature, the sensor will transmit the temperature value to the control chip. The control chip is set with the target temperature of the heating structure. The target temperature can be manually input into the control chip by the operator. The control chip determines whether to continue heating the clamping member 11 based on the difference between the detected temperature value and the target temperature, and determines the heating power at the same time.

[0069] When the temperature of the clamping member 11 is significantly different from the target temperature, the control chip will heat the clamping member 11 with a higher power so that the clamping member 11 is heated quickly. When the heating starts, the control chip will provide the clamping member 11 with a greater heating power.

[0070] As the temperature of the clamping member 11 gradually increases, the heating power provided by the control chip to the clamping member 11 gradually decreases so that the clamping member 11 is heated to overheating. The closer the temperature of the clamping member 11 is to the target temperature, the smaller the heating power provided by the control chip to the clamping member 11, thereby avoiding overheating of the clamping member 11.

[0071] Preferably, the heating component further comprises a mounting position, a quick-insert hole is arranged on the mounting position, a quick-insert rod is arranged at the bottom of the clamping member 11, and the clamping member 11 and the quick-installation base can be fixed to each other through the cooperation of the quick-insert hole and the quick-insert rod. The quick-insert hole can not only provide a fixed position for the clamping member 11, but also connect the circuit for the clamping member 11.

[0072] Preferably, the sensor is disposed at the mounting position of the clamping member 11 , so that the temperature of the clamping member 11 can be detected no matter which clamping member 11 is used, thereby avoiding the problem of separately installing a temperature sensor for each clamping member 11 .

[0073] In one implementation, one clamping member 11 corresponds to one quick-insertion rod, and an installation position is provided for each clamping member 11 , so that each clamping member 11 can be moved independently, and the control of each clamping member 11 is very convenient.

[0074] In another embodiment, in order to ensure that the relative positions of the multiple clamping members 11 are fixed, the bottoms of the multiple clamping members 11 are fixedly connected to the top of the same quick-insertion rod. This makes it necessary for the multiple clamping members 11 to move simultaneously, which is very convenient when the clamping members 11 are needed to extract the components to be disassembled. The relatively dispersed multiple clamping members 11 can be brought closer to each other by the operator pinching or using tools such as sleeves 13, thereby clamping the components to be disassembled and finally completing the extraction of the components to be disassembled.

[0075] The preferred embodiments of the present invention are described in detail above in conjunction with the accompanying drawings. However, the present invention is not limited to the specific details in the above embodiments. Within the technical concept of the present invention, a variety of simple modifications can be made to the technical solution of the present invention, and these simple modifications all belong to the protection scope of the present invention.

[0076] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present invention will not further describe various possible combinations.

[0077] In addition, various embodiments of the present invention may be arbitrarily combined, and as long as they do not violate the concept of the present invention, they should also be regarded as the contents disclosed by the present invention.

Claims

1. A heating structure with local heating function, characterized in that: The heating structure with local heating function comprises a heating component and a power supply component, the power supply component provides energy for the heating component, the heating component comprises at least two clamping members (11), and a plurality of the clamping members (11) are close to each other near the component to be disassembled and can heat the component to be disassembled; The power supply component includes a temperature control component, and the temperature control component controls the heating power of the heating component.

2. The heating structure with local heating function according to claim 1, characterized in that: The heating component comprises two position states: a working state and a waiting state. When the plurality of clamping members (11) are away from each other, the heating component is in the waiting state. When the plurality of clamping members (11) are close to each other, the heating component is in the working state.

3. The heating structure with local heating function according to claim 2, characterized in that: When the heating component is in the working state, the plurality of clamping members (11) are close to each other and enclosed to form a clamping position (12).

4. The heating structure with local heating function according to claim 3, characterized in that: At least one clamping position (12) is provided.

5. A method for using the heating structure with local heating function according to claim 4, characterized in that: The method of use includes: Step 1, starting the temperature-controlled soldering station and the heating structure; Step 2, moving the heating structure to the vicinity of the component to be disassembled, so that the heating component is in a waiting state; Step 3: After the solder near the component to be removed is melted, pull the component to be removed upward.

6. The method of use according to claim 5, characterized in that: In step 2, the heating structure can select and use different types of the clamping members (11) according to the number and position status of the components to be disassembled.

7. The method of use according to claim 5, characterized in that: In step 3, the heating component is controlled to be in a working state, the component to be disassembled is located in the clamping position (12), and the component to be disassembled is extracted by controlling the clamping member (11).

8. The method of use according to claim 7, characterized in that: In step 3, a sleeve (13) is sleeved on the plurality of clamping members (11), and the sleeve (13) is moved to drive the plurality of clamping members (11) to move closer to each other and clamp the component to be disassembled.

9. The method of use according to claim 5, characterized in that: In step 3, after the solder near the component to be removed is melted, the component to be removed is extracted using tools such as tweezers.

10. The method of use according to claim 5, characterized in that: The temperature control component comprises a sensor, a control chip and a display, the sensor detecting the temperature of the clamping member (11), the display being used to display the temperature detected by the sensor, and the control chip controlling the heating power of the clamping member (11) according to the temperature detected by the sensor.

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