Laser processing head and laser processing equipment

Abstract

The invention is suitable for the technical field of laser processing, and provides a laser processing head and laser processing equipment. The processing light path lens group is arranged on the processing head shell; the first circuit board is arranged on the processing head shell; the camera is arranged on the first circuit board and is positioned around the processing light path lens group; the power supply main circuit board is arranged on the machining head shell and connected to the first circuit board so as to supply power to the first circuit board. According to the laser machining head provided by the embodiment of the invention, the reliability can be improved.

Description

Technical Field

[0001] The present application belongs to the field of laser processing technology, and more specifically, relates to a laser processing head and laser processing equipment. Background Art

[0002] With the development of manufacturing industry, laser processing has been widely used. Laser processing head is an important part of laser processing equipment. Laser processing head can emit laser to process workpiece. In order to detect the processing status or workpiece, a camera is used to take pictures. Usually, the camera is powered by exposed cables, which are easily damaged and reduce the reliability of laser processing head. Summary of the invention

[0003] The embodiments of the present application provide a laser processing head and a laser processing device, which can improve reliability.

[0004] In a first aspect, an embodiment of the present application provides a laser processing head, comprising:

[0005] Processing head housing;

[0006] A processing light path lens assembly is arranged on the processing head housing;

[0007] A first circuit board, disposed on the processing head housing;

[0008] A camera, arranged on the first circuit board and located around the processing light path lens group;

[0009] The power supply main circuit board is arranged in the processing head housing and connected to the first circuit board to supply power to the first circuit board.

[0010] In some possible implementations of the first aspect, the processing light path lens assembly has at least one optical device;

[0011] The laser processing head also includes:

[0012] Connecting parts;

[0013] The mobile driving assembly comprises a mobile component and a driving component, wherein the driving component is connected to the mobile component to drive the mobile component to move, thereby driving the connecting component to push at least one of the optical devices relative to the processing head housing.

[0014] In some possible implementations of the first aspect, the moving component is fixedly connected to or held against the connecting component, and the connecting component is fixedly connected to or held against at least one of the optical devices.

[0015] In some possible implementations of the first aspect, the moving component is a screw rod, and the driving component can drive the screw rod to move along the length direction of the screw rod.

[0016] In some possible implementations of the first aspect, the processing light path lens assembly includes:

[0017] A spectroscope, arranged on the processing head housing;

[0018] A focusing mirror is processed, which is located around the beam splitter to focus the light passing through the beam splitter;

[0019] A camera focusing lens, located around the beam splitter, to focus the light reflected by the beam splitter;

[0020] The camera is located around the camera focusing lens to receive light transmitted through the camera focusing lens.

[0021] In some possible implementations of the first aspect, the processing light path lens assembly further includes:

[0022] The camera protection lens is located between the camera focusing lens and the camera.

[0023] In some possible implementations of the first aspect, the processing light path lens assembly further includes:

[0024] A processing protection mirror is located on a side of the processing focusing mirror away from the beam splitter.

[0025] In some possible implementations of the first aspect, the laser processing head further includes:

[0026] A nozzle, disposed on the processing head housing and located on a side of the processing focusing mirror away from the beam splitter;

[0027] The camera can photograph the molten pool of the workpiece through the inside of the nozzle to obtain an image of the molten pool and an internal image of the nozzle, so as to control the mobile driving component to drive the connecting component to push at least one of the optical devices so that the light beam emitted from the processing light path lens group is coaxial with the nozzle.

[0028] In some possible implementations of the first aspect, the number of the connecting components and the number of the mobile drive components are the same and are multiple; different connecting components are fixedly connected to or maintained at different positions of at least one of the optical devices.

[0029] In a second aspect, an embodiment of the present application provides a laser processing device, comprising a laser processing head as described in any one of the above items.

[0030] The beneficial effects of the embodiments of the present application are:

[0031] The processing light path mirror group is arranged on the processing head shell, and the camera is located around the processing light path mirror group to receive light from the processing light path mirror group. The camera is arranged on the processing head shell through the first circuit board, and the power supply main circuit board arranged on the processing head shell is connected to the first circuit board to supply power to the first circuit board, so that the camera is powered uniformly through the power supply main circuit board, which can reduce exposed cables, make the overall structure more concise, and improve reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0033] Figure 1 A schematic diagram of the structure of a laser processing head provided by an embodiment of the present application at one angle;

[0034] Figure 2 A schematic structural diagram of a laser processing head provided in an embodiment of the present application from another angle;

[0035] Figure 3 A schematic diagram of a partial structure of a laser processing head provided at one angle according to an embodiment of the present application;

[0036] Figure 4 A schematic diagram of a portion of the structure of a laser processing head provided by an embodiment of the present application from another angle;

[0037] Figure 5 A schematic diagram of the structure of a first circuit board and a camera of a laser processing head provided in one embodiment of the present application;

[0038] Figure 6 A schematic diagram of the structure of a processing optical path lens group, a connecting component and a moving drive component of a laser processing head provided in one embodiment of the present application;

[0039] Figure 7 A schematic diagram of the structure of a processing light path lens group and a camera of a laser processing head provided in one embodiment of the present application;

[0040] Figure 8 A three-dimensional diagram of a portion of the structure of a laser processing head provided in one embodiment of the present application. DETAILED DESCRIPTION

[0041] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application clearer, the following Figures 1 to 8It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0042] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0043] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0044] It should be understood that the term “and / or” used in the specification and appended claims of this application refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0045] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0046] The embodiment of the present application provides a laser processing head for laser processing, which can be a laser cutting head, a laser welding head, or a laser marking head.

[0047] Figure 1 A schematic diagram of the structure of a laser processing head provided by an embodiment of the present application at one angle; Figure 2 A schematic structural diagram of a laser processing head provided in an embodiment of the present application from another angle; Figure 3 A schematic diagram of a partial structure of a laser processing head provided at one angle according to an embodiment of the present application; Figure 4 A schematic diagram of a portion of the structure of a laser processing head provided by an embodiment of the present application from another angle; Figure 5 This is a schematic diagram of the structure of the first circuit board and camera of the laser processing head provided in one embodiment of the present application. Figures 1 to 5The laser processing head provided in the embodiment of the present application includes a processing head housing 1, a processing light path lens group 2, a first circuit board 3, a camera 4 and a power supply main circuit board 5.

[0048] The processing head housing 1 is the frame of the laser processing head.

[0049] The processing light path lens group 2 is used to access the laser, focus the laser or shape the laser. The processing light path lens group 2 is arranged on the processing head housing 1.

[0050] The processing optical path lens group 2 includes one or more optical devices. The optical device may specifically include an optical element (such as a lens or a protective lens) and a lens seat, and the optical element is arranged on the lens seat; wherein the aforementioned lens seat is optional.

[0051] At least one optical device of the processing light path lens group 2 is movably arranged on the processing head housing 1 , that is, at least one optical device of the processing light path lens group 2 is arranged on the processing head housing 1 and can move relative to the processing head housing 1 .

[0052] refer to Figure 2 and Figure 4 , the first circuit board 3 is arranged on the processing head housing 1.

[0053] refer to Figure 2 , Figure 4 and Figure 5 The camera 4 is disposed on the first circuit board 3 and located around the processing light path lens group 2 to receive light from the processing light path lens group 2.

[0054] The camera 4 is specifically electrically connected to the first circuit board 3 , and the first circuit board 3 supplies power to the camera 4 .

[0055] The camera 4 may be a CCD (Charge Coupled Device) camera. According to actual needs, the camera 4 may also be a CMOS (Complementary Metal Oxide Semiconductor) camera.

[0056] The power supply main circuit board 5 is used to centrally supply power to various electrical components of the laser processing head (such as the camera 4). The power supply main circuit board 5 is disposed in the processing head housing 1 and connected to the first circuit board 3 to supply power to the first circuit board 3.

[0057] The power supply main circuit board 5 can be connected to the first circuit board 3 through contact pins, and can also be connected to the first circuit board 3 through leads located inside the laser processing head, so as to supply power to the first circuit board 3.

[0058] According to the above content, it can be known that the processing light path mirror group 2 is arranged in the processing head shell 1, and the camera 4 is located around the processing light path mirror group 2 to receive light from the processing light path mirror group 2. The camera 4 is arranged in the processing head shell 1 through the first circuit board 3, and the power supply main circuit board 5 arranged in the processing head shell 1 is connected to the first circuit board 3 to supply power to the first circuit board 3, so that the camera 4 is supplied with power uniformly through the power supply main circuit board 5, which can reduce exposed cables, make the overall structure more concise, improve reliability, and make the structure compact.

[0059] refer to Figure 2 The above-mentioned laser processing head may further include a first cover body 6 .

[0060] The first cover 6 is disposed on the processing head housing 1 and covers the first circuit board 3 and the camera 4, so that the first circuit board 3 and the camera 4 are located inside the laser processing head, which can prevent the first circuit board 3 and the camera 4 from being exposed and damaged, and can protect the first circuit board 3 and the camera 4.

[0061] refer to Figure 1 The above-mentioned laser processing head may further include a second cover body 7 .

[0062] The second cover 7 is disposed on the processing head housing 1 and covers the main power supply circuit board 5 , so that the main power supply circuit board 5 is located inside the laser processing head, which can prevent the main power supply circuit board 5 from being exposed and damaged, and can protect the main power supply circuit board 5 .

[0063] Figure 6 This is a schematic diagram of the structure of the processing optical path lens group, connecting components and mobile drive components of the laser processing head provided in one embodiment of the present application. Figures 1 to 4 ,as well as Figure 6 The above-mentioned laser processing head may further include a connecting component 8 and a moving driving component 9.

[0064] The connecting component 8 can be specifically fixedly connected to the mobile driving assembly 9 , or can be fixedly connected to at least one optical device of the processing optical path lens group 2 .

[0065] The connecting member 8 may specifically be a rod or a block.

[0066] The mobile driving component 9 can be a stepping screw motor or a linear motor.

[0067] refer to Figure 6 The moving driving component 9 has a moving part 91 and a driving part 92.

[0068] The driving component 92 is disposed on the machining head housing 1 .

[0069] The driving component 92 is connected to the moving component 91 to drive the moving component 91 to move, specifically to drive the moving component 91 to move along the length direction L of the moving component 91, thereby driving the connecting component 8 to push at least one optical device of the processing light path lens group 2 relative to the processing head housing 1 along the length direction L, thereby adjusting the position of the optical device.

[0070] The moving part 91 is fixedly connected to or held against the connecting part 8, and the connecting part 8 is fixedly connected to or held against at least one optical device, so that the gap between the moving part 91 and the connecting part 8 can be eliminated or substantially eliminated, and the gap between the connecting part 8 and the optical device can be eliminated or substantially eliminated. Specifically, the moving part 91 is fixedly connected to one end of the connecting part 8, or held against one end of the connecting part 8; the other end of the connecting part 8 is fixedly connected to at least one optical device, or the other end of the connecting part 8 is held against at least one optical device.

[0071] The specific method of maintaining the abutment is to press the movable component 91 and the connecting component 8 together by an elastic component, and to press the connecting component 8 and the optical device together by an elastic component; or, to suck the movable component 91 and the connecting component 8 together by an adsorption method (such as magnetic attraction or vacuum attraction), and to suck the connecting component 8 and the optical device together by an adsorption method (such as magnetic attraction or vacuum attraction).

[0072] The movable component 91 is fixedly connected to or maintained against the connecting component 8, and the connecting component 8 is fixedly connected to or maintained against at least one optical device, so that the gap between the movable component 91 and the connecting component 8 can be zero or almost zero, and the gap between the connecting component 8 and the optical device can be zero or almost zero. The movable component 91 is driven to move by the driving component 92, thereby pushing the connecting component 8, and then the connecting component 8 pushes at least one optical device of the processing light path lens group 2. The optical device is pushed in a moving manner, and the optical device can be pushed instantly, so that the position of the optical device of the processing light path lens group 2 can be accurately adjusted.

[0073] In addition, the connecting component 8 and the moving component 91 are independent components, and the surface roughness of the connecting component 8 can be smaller than the surface roughness of the moving component 91, which can more accurately push the optical device and further improve the adjustment accuracy.

[0074] The moving component 91 can be a screw rod, and the driving component 92 can drive the screw rod to move along the length direction of the screw rod. The moving accuracy of the screw rod is higher, which can further improve the adjustment accuracy.

[0075] In some other embodiments, the movable component 91 can be moved to abut against the connecting component 8 and can be moved to be separated from the connecting component 8; driven by the movable component 91, the connecting component 8 can be moved to abut against at least one optical device and can be moved to be separated from at least one optical device.

[0076] The number of the connecting components 8 and the number of the moving driving components 9 can be the same or multiple.

[0077] Different connecting components 8 are fixedly connected to or maintained against different positions of at least one optical device to push the optical device from different directions, so that the position of the optical device can be adjusted from different positions, which is convenient for adjustment.

[0078] Figure 7 This is a schematic diagram of the structure of the processing light path lens group and camera of the laser processing head provided in one embodiment of the present application. Figure 7 The processing light path lens group 2 may include a plurality of optical devices, namely a beam splitter 21, a processing focusing lens 22 and a camera focusing lens 23.

[0079] The beam splitter 21 is disposed on the processing head housing 1. The beam splitter 21 is a semi-transmissive and semi-reflective beam splitter, which can allow light to pass through and also reflect light.

[0080] The beam splitter 21 can be a coated beam splitter that can withstand light of relatively high power. Of course, the beam splitter 21 can also be a beam splitter that can withstand light of common power.

[0081] The processing focusing mirror 22 is located around the beam splitter 21 to focus the light passing through the beam splitter 21 .

[0082] The camera focusing lens 23 is located around the beam splitter 21 to focus the light reflected by the beam splitter 21 .

[0083] The camera 4 is located around the camera focusing lens 23 to receive the light passing through the camera focusing lens 23 .

[0084] The processing focusing mirror 22 is arranged on the processing head housing 1 and can move relative to the processing head housing 1. The optical device pushed by the connecting component 8 is the processing focusing mirror 22. Since the processing focusing mirror 22 is far from the initial position where the laser enters the processing optical path mirror group 2, a larger adjustment range can be provided. Of course, according to actual needs, other optical devices (such as the beam splitter 21) can also be pushed to achieve adjustment.

[0085] refer to Figure 7 The above-mentioned processing light path lens group 2 can also include a camera protection lens 24.

[0086] The camera protection lens 24 is located between the camera focusing lens 23 and the camera 4 and can play a dustproof role to protect the camera focusing lens 23 .

[0087] The number of the camera protection mirror 24 can be one or more layers.

[0088] refer to Figure 7 The above-mentioned processing light path mirror group can also include a processing protection mirror 25.

[0089] The processing protection mirror 25 is located on a side of the processing focusing mirror 22 away from the beam splitter 21 , and can play a role in preventing dust and ensuring air tightness, so as to protect the processing focusing mirror 22 .

[0090] The number of the processed protection mirror 25 can be one layer or multiple layers.

[0091] refer to Figure 7 The above-mentioned processing light path lens group may also include a collimating lens 26.

[0092] The collimator 26 is located at one side of the beam splitter 21 to maintain the collimation of the light beam irradiated to the beam splitter 21 .

[0093] refer to Figure 7 The above-mentioned processing light path mirror assembly may also include an upper protective mirror 27.

[0094] The upper protective mirror 27 is located on a side of the collimating mirror 26 away from the beam splitter 21 to prevent dust from entering the processing optical path mirror assembly 2 .

[0095] The number of the upper protective mirror 27 can be one or more layers.

[0096] In actual application, in the height direction H of the laser processing head, the laser first irradiates the upper protective mirror 27 and irradiates the collimator 26 through the upper protective mirror 27, and then irradiates the beam splitter 21 through the collimator 26, and then irradiates the processing focusing mirror 22 through the beam splitter 21, is focused by the processing focusing mirror 22 and passes through the processing protective mirror 25, and then irradiates the workpiece to process the workpiece, so that a molten pool is formed on the surface of the workpiece. The light reflected by the molten pool passes through the processing protective mirror 25 and the processing focusing mirror 22 in turn, irradiates the beam splitter 21, is reflected by the beam splitter 21 to the camera focusing mirror 23, and then passes through the camera protective mirror 24 to be received by the camera 4.

[0097] Figure 8 A three-dimensional diagram of a portion of the structure of a laser processing head provided in one embodiment of the present application. Figure 8 The above-mentioned laser processing head may further include an elastic component 11.

[0098] The elastic component 11 is used to press the connecting component 8 and the optical device. Specifically, the elastic component 11 is connected to the connecting component 8 and at least one optical device of the processing optical path lens group 2, so that after the optical device is pushed, it can move back to its original position under the action of the restoring force of the elastic component 11, and can press the connecting component 8 and the optical device to further eliminate the gap.

[0099] In some other embodiments, the elastic component 11 is connected to the processing head housing 1 and at least one optical device of the processing light path lens assembly 2 .

[0100] Since the driving component 92 of the mobile driving assembly 9 is arranged on the processing head housing 1, and the moving component 91 is fixedly connected to or maintained against the connecting component 8, the elastic component 11 is connected to the processing head housing 1 and at least one optical device of the processing optical path lens group 2, and the connecting component 8 can also be pressed against the optical device.

[0101] refer to Figures 1 to 4 The laser processing head may further include a nozzle 10 .

[0102] refer to Figures 1 to 4 ,as well as Figure 7 The nozzle 10 is disposed in the processing head housing 1 and is located on a side of the processing focusing mirror 22 away from the beam splitter 21 .

[0103] As mentioned above, when the laser processes the workpiece, a molten pool is formed on the surface of the workpiece.

[0104] The camera 4 can photograph the molten pool of the workpiece through the inside of the nozzle 10 to obtain an image of the molten pool and an internal image of the nozzle 10 to control the mobile drive component 9 to drive the connecting component 8 to push at least one optical device so that the light beam emitted from the processing light path lens group 2 is coaxial with the nozzle 10.

[0105] The inside of the nozzle 10 has a hole for the laser to pass through. The camera 4 photographs the molten pool of the workpiece through the hole inside the nozzle 10. It can photograph both the molten pool of the workpiece and the hole inside the nozzle 10, thereby obtaining images of the molten pool of the workpiece and the hole inside the nozzle 10.

[0106] The camera 4 can obtain the image of the molten pool and the internal image of the nozzle 10 at the same time by taking a single shot.

[0107] Based on the image of the molten pool and the internal image of the nozzle 10, the coaxiality of the light beam emitted from the processing light path lens group 2 and the nozzle 10 can be determined, thereby determining the offset of the aforementioned light beam relative to the nozzle 10. The offset is used to generate a signal to control the mobile drive component 9 to drive the connecting component 8 to push at least one optical device.

[0108] When the workpiece is processed by laser, the light reflected by the molten pool of the workpiece is transmitted to the beam splitter 21, reflected by the beam splitter 21 to the camera focusing lens 23, and then received by the camera 4 through the camera focusing lens 23. Since the camera 4 is arranged on the processing head housing 1 through the first circuit board 3, it can move with the processing head housing 1. The camera 4 photographs the molten pool of the workpiece through the inside of the nozzle 10, thereby obtaining an image of the molten pool and an internal image of the nozzle 10, which can avoid the laser used for processing from irradiating the camera 4 and causing damage to the camera 4 or hindering the operation of the camera 4, and can realize real-time detection and real-time adjustment of the position of at least one optical device, so that the light beam emitted from the processing light path lens group 2 is coaxial with the nozzle 10.

[0109] The above-mentioned laser processing head may also include a detection probe (not shown in the figure).

[0110] The detection probe is arranged on the processing head housing 1 and is connected to the power supply main circuit board 5 , and the power supply main circuit board 5 supplies power to the detection probe.

[0111] The number of the detection probes can be one or more.

[0112] The laser processing head may further include a focusing motor (not shown).

[0113] The focusing motor is arranged in the processing head housing 1 and is connected to the main power supply circuit board 5 , and the main power supply circuit board 5 supplies power to the focusing motor.

[0114] The embodiment of the present application further provides a laser processing device, which includes the laser processing head provided by any of the above embodiments. The laser processing device can specifically be a laser cutting machine, a laser welding machine, or a laser marking machine.

[0115] The above-mentioned laser processing equipment may further include a computer.

[0116] The computer is used to send a signal to control the mobile drive component 9 to drive the connecting component 8 to push at least one optical device based on the image of the molten pool and the internal image of the nozzle 10, so that the light beam emitted from the processing light path lens group 2 is coaxial with the nozzle 10.

[0117] The laser processing equipment provided in the embodiment of the present application can realize remote automatic calibration of the coaxiality of the laser beam and the nozzle 10 .

[0118] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A laser processing head, characterized in that: include: Processing head housing; A processing light path lens assembly is arranged on the processing head housing; A first circuit board, disposed on the processing head housing; A camera, arranged on the first circuit board and located around the processing light path lens group; The power supply main circuit board is arranged in the processing head housing and connected to the first circuit board to supply power to the first circuit board.

2. The laser processing head according to claim 1, characterized in that The processing light path lens assembly has at least one optical device; The laser processing head also includes: Connecting parts; The mobile driving assembly comprises a mobile component and a driving component, wherein the driving component is connected to the mobile component to drive the mobile component to move, thereby driving the connecting component to push at least one of the optical devices relative to the processing head housing.

3. The laser processing head according to claim 2, characterized in that The moving component is fixedly connected to or held against the connecting component, and the connecting component is fixedly connected to or held against at least one of the optical devices.

4. The laser processing head according to claim 2, characterized in that: The moving component is a screw rod, and the driving component can drive the screw rod to move along the length direction of the screw rod.

5. The laser processing head according to claim 2, characterized in that: The processing light path mirror assembly comprises: A spectroscope, arranged on the processing head housing; A focusing mirror is processed, which is located around the beam splitter to focus the light passing through the beam splitter; A camera focusing lens, located around the beam splitter, to focus the light reflected by the beam splitter; The camera is located around the camera focusing lens to receive light transmitted through the camera focusing lens.

6. The laser processing head according to claim 5, characterized in that The processing light path mirror assembly also includes: The camera protection lens is located between the camera focusing lens and the camera.

7. The laser processing head according to claim 5, characterized in that The processing light path mirror assembly also includes: A processing protection mirror is located on a side of the processing focusing mirror away from the beam splitter.

8. The laser processing head according to claim 5, characterized in that The laser processing head also includes: A nozzle, disposed on the processing head housing and located on a side of the processing focusing mirror away from the beam splitter; The camera can photograph the molten pool of the workpiece through the inside of the nozzle to obtain an image of the molten pool and an internal image of the nozzle, so as to control the mobile driving component to drive the connecting component to push at least one of the optical devices so that the light beam emitted from the processing light path lens group is coaxial with the nozzle.

9. The laser processing head according to any one of claims 2 to 8, characterized in that: The connecting components and the moving drive components are the same in number and are multiple; different connecting components are fixedly connected to or maintained against different positions of at least one of the optical devices.

10. A laser processing device, characterized in that: The method comprises a laser processing head as claimed in any one of claims 1 to 9.

Images