Auxiliary polishing system based on electromagnetic microwaves

Abstract

The invention discloses an auxiliary polishing system based on electromagnetic microwaves, which relates to the technical field of polishing, and comprises a polishing machine upper machine head, a polishing machine main shaft, a conductive slip ring, a loading disc, a microwave transmitting device, a polishing machine lower disc and a controller, the polisher spindle is arranged at the bottom of the polisher upper machine head; the conductive slip ring is arranged at the bottom of the polisher spindle; the controller is electrically connected with the conductive slip ring through a wire. The conductive slip ring is electrically connected with the microwave transmitting device; the polishing machine main shaft is fixedly arranged with the carrying disc through the main shaft joint; the polishing machine lower disc is arranged at the bottom of the carrying disc. The microwave emitting device is arranged in an inner cavity of the carrying disc and is used for increasing the temperature of water molecules in a processing area through friction; and a carrying groove is formed in the bottom of the carrying disc, and a plurality of carrying groove open holes are formed in the carrying groove, so that water molecules in a machining area are subjected to friction vibration, the temperature of the machining area is changed, and the dispersity of grinding materials is improved to a certain extent.

Description

Technical Field

[0001] The invention relates to the technical field of polishing, and more particularly to an electromagnetic microwave-assisted polishing system. Background Art

[0002] In the process of polishing hard and brittle materials, temperature is an important factor affecting the final polishing effect, and temperature changes will affect the performance of the polishing process. The polishing temperature has a certain influence on the processing efficiency and surface quality of sapphire. In the polishing process, the increase in temperature will accelerate the chemical reaction between the chemical components in the polishing liquid and the processing material, improve the removal rate, and obtain better surface quality. Too high or too low temperature will affect the processing effect. The low temperature in the processing area will reduce the chemical generation rate, and the mechanical removal effect will be higher than the chemical reaction effect, which will cause damage to the surface of the polished workpiece; if the temperature in the processing area is too high, the chemical reaction rate will be higher than the mechanical removal effect, which will cause corrosion on the surface of the polished workpiece, the product removal residue, and the surface quality will be reduced. The appropriate temperature can keep the chemical and mechanical effects balanced, thereby achieving a better polishing effect.

[0003] The abrasive in the polishing liquid is also one of the main factors affecting the processing effect. The abrasive in the polishing liquid may agglomerate during processing, causing scratches on the workpiece surface. The workpiece is usually fixed on the carrier plate with paraffin wax during polishing. However, when the processing temperature is too high, the polishing pad is easy to deform, and the paraffin wax becomes soft and the fixing effect decreases, causing the polished workpiece to fall off, causing damage to the workpiece surface or even cracking.

[0004] Based on the above problems, we provide an electromagnetic microwave-assisted polishing system.

[0005] The above information disclosed in this background technology is only used to increase the understanding of the background technology of the present invention and therefore, it may include information that does not constitute the prior art known to a person of ordinary skill in the art. Summary of the invention

[0006] In order to solve the problems raised in the above background technology, the present invention provides an electromagnetic microwave assisted polishing system.

[0007] The electromagnetic microwave assisted polishing system provided by the present invention adopts the following technical solution:

[0008] A polishing system based on electromagnetic microwave assistance comprises an upper head of a polishing machine, a main shaft of the polishing machine, a conductive slip ring, a loading plate, a microwave transmitting device, a lower plate of the polishing machine and a controller; the main shaft of the polishing machine is arranged at the bottom of the upper head of the polishing machine, and the conductive slip ring is arranged at the bottom of the main shaft of the polishing machine; the controller is electrically connected to the conductive slip ring through a wire; the conductive slip ring is electrically connected to the microwave transmitting device; the main shaft of the polishing machine is fixed to the loading plate through a main shaft joint; the lower plate of the polishing machine is arranged at the bottom of the loading plate; the microwave transmitting device is arranged in the inner cavity of the loading plate, and is used to increase the temperature of water molecules in the processing area by friction; a loading groove is provided at the bottom of the loading plate, and a plurality of loading groove openings are provided on the loading groove.

[0009] Preferably, the microwave transmitting device comprises a magnetron, a magnetron transmitting port and a magnetron outlet terminal; an inner wire groove is provided inside the carrier plate, and the magnetron outlet terminal is mounted at the outlet of the inner wire groove; the magnetron is mounted in the inner cavity of the carrier plate, the magnetron outlet terminal is electrically connected to the magnetron through a magnetron power line, and the magnetron transmitting port is mounted at the bottom of the magnetron; the magnetron outlet terminal is electrically connected to the conductive slip ring.

[0010] Preferably, the outer side surface of the magnetron is wrapped with waterproof and heat-insulating material.

[0011] Preferably, a waveguide is provided at the bottom of the magnetron, and the magnetron transmitting port is arranged in the waveguide.

[0012] Preferably, an anti-microwave infrared temperature sensor is also installed in the inner cavity of the loading plate, and the anti-microwave infrared temperature sensor is electrically connected to the conductive slip ring through an infrared temperature sensor signal line.

[0013] Preferably, the detection end of the microwave-resistant infrared temperature measuring sensor is arranged in the waveguide.

[0014] Preferably, a heat insulating ring is installed between the spindle joint and the carrier plate.

[0015] Preferably, the spindle joint and the loading plate are assembled and connected by a plurality of M6 screws.

[0016] Preferably, the loading tray includes two connecting trays, and the two connecting trays are assembled and connected by a plurality of M10 screws.

[0017] Preferably, the controller is provided with a temperature display, an operation indicator light, a power adjustment knob and a controller switch button.

[0018] In summary, the present invention includes the following beneficial technical effects:

[0019] 1. By placing hard and brittle materials (such as sapphire) on the lower plate of the polishing machine and covering it with the loading groove at the bottom of the loading plate, and then adjusting the microwave power of the microwave transmitting device through the controller (the transmission of electric power and electrical signals is completed by the conductive slip ring and the wire), the controller controls the microwave transmitting device to make the water molecules in the processing area frictionally increase the temperature. Through this structural design, it is possible to make the water molecules in the processing area frictionally vibrate, change the temperature of the processing area, and improve the dispersion of the abrasive to a certain extent, solving the problem of slow heating and low heating rate relying on the friction between the workpiece and the polishing pad in the existing grinding and polishing process, and solving the problems of poor processing quality and low material removal rate.

[0020] 2. It provides a more efficient grinding and polishing method, solving the problems of traditional paraffin wax fixing of workpieces and instability at high temperatures.

[0021] 3. It can meet the needs of high-speed rotation processing of polishing workpieces and effectively improve the surface quality and material removal rate of polishing workpieces.

[0022] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present invention will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of an electromagnetic microwave assisted polishing system according to an embodiment of the present invention;

[0024] Figure 2 Schematic diagram of the structure of the object in the embodiment of the present invention.

[0025] Explanation of the reference numerals in the accompanying drawings: 1. upper head of the polishing machine; 2. main shaft of the polishing machine; 3. conductive slip ring; 4. main shaft joint; 5. loading plate; 6. lower plate of the polishing machine; 7. wire; 8. controller; 9. M6 screw; 10. outlet terminal of the magnetron; 11. signal line of the infrared temperature sensor; 12. thermal insulation ring; 13. M10 screw; 14. opening of the loading groove; 15. loading groove; 16. wire groove in the loading plate; 17. power line of the magnetron; 18. anti-microwave infrared temperature sensor; 19. waveguide; 20. magnetron; 21. transmitting port of the magnetron. DETAILED DESCRIPTION

[0026] The following is combined with Figure 1 to Figure 2 The present invention is described in further detail.

[0027] It should be noted that the drawings are schematic and not to scale. For the sake of clarity and convenience, the relative sizes and proportions of the parts shown in the drawings are exaggerated or reduced in size, and any size is only illustrative and not restrictive. In addition, the same reference symbol is used for the same structure, element or accessory appearing in more than two figures to reflect similar features.

[0028] The embodiment of the present invention discloses an electromagnetic microwave assisted polishing system. Figure 1 to Figure 2 , a polishing system based on electromagnetic microwave assisted polishing, including a polishing machine upper head 1, a polishing machine spindle 2, a conductive slip ring 3, a loading plate 5, a microwave transmitting device, a polishing machine lower plate 6 and a controller 8; the polishing machine spindle 2 is arranged at the bottom of the polishing machine upper head 1, and the conductive slip ring 3 is arranged at the bottom of the polishing machine spindle 2; the controller 8 is electrically connected to the conductive slip ring 3 through a wire 7; the conductive slip ring 3 is electrically connected to the microwave transmitting device; the polishing machine spindle 2 is fixed to the loading plate 5 through a spindle joint 4; the polishing machine lower plate 6 is arranged at the bottom of the loading plate 5; the microwave transmitting device is arranged in the inner cavity of the loading plate 5, which is used to increase the temperature of the water molecules in the processing area by friction; a loading groove 15 is opened at the bottom of the loading groove 15, and a plurality of loading groove openings 14 are opened on the loading groove 15, and the loading plate 5 is made of high-hardness steel material.

[0029] Specifically, a hard and brittle material (such as sapphire) is placed on the lower plate 6 of the polishing machine and covered by the loading groove 15 at the bottom of the loading plate 5. Then, the microwave power of the microwave transmitting device is adjusted by the controller 8 (the transmission of electric power and electrical signals is completed by the conductive slip ring 3 and the wire 7). The controller 8 controls the microwave transmitting device to make the water molecules in the processing area frictionally increase the temperature. Through this structural design, it is possible to achieve frictional vibration of the water molecules in the processing area, change the temperature of the processing area, and improve the dispersion of the abrasive to a certain extent, thereby solving the problem of slow heating and low heating rate in the existing grinding and polishing process relying on the friction between the workpiece and the polishing pad, and solving the problems of poor processing quality and low material removal rate.

[0030] It provides a more efficient grinding and polishing method, solving the problems of traditional paraffin wax fixing of workpieces and instability at high temperatures;

[0031] It can meet the high-speed rotation processing needs of the polishing workpiece and effectively improve the surface quality and material removal rate of the polishing workpiece.

[0032] like Figure 2As shown, in one embodiment of the present invention, the microwave transmitting device includes a magnetron 20, a magnetron transmitting port 21 and a magnetron outlet terminal 10; a carrier plate inner wire groove 16 is provided inside the carrier plate 5, and the magnetron outlet terminal 10 is assembled at the outlet of the carrier plate inner wire groove 16; the magnetron 20 is assembled in the inner cavity of the carrier plate 5, the magnetron outlet terminal 10 is electrically connected to the magnetron 20 through a magnetron power line 17, and the magnetron transmitting port 21 is assembled at the bottom of the magnetron 20; the magnetron outlet terminal 10 is electrically connected to the conductive slip ring 3.

[0033] Specifically, microwaves are generated by the magnetron 20 and sent to the object-carrying groove 15 through the magnetron emission port 21, thereby causing the friction of water molecules in the processing area to increase the temperature.

[0034] like Figure 2 As shown, in one embodiment of the present invention, the outer side of the magnetron 20 is wrapped with a waterproof and heat-insulating material.

[0035] like Figure 2 As shown, in one embodiment of the present invention, a waveguide tube 19 is provided at the bottom of the magnetron 20 , and the magnetron emission port 21 is arranged in the waveguide tube 19 . The waveguide tube 19 can ensure that microwaves are benignly conducted to the carrier groove 15 .

[0036] like Figure 2 As shown, in one embodiment of the present invention, an anti-microwave infrared temperature sensor 18 is also installed in the inner cavity of the loading plate 5. The anti-microwave infrared temperature sensor 18 is electrically connected to the conductive slip ring 3 through the infrared temperature sensor signal line 11. By setting the anti-microwave infrared temperature sensor 18, the temperature of the processing area can be detected in real time, and the controller 8 can adjust the microwave power in time according to the displayed temperature.

[0037] like Figure 2 As shown, in one embodiment of the present invention, the detection end of the microwave-resistant infrared temperature measurement sensor 18 is arranged in the waveguide 19 .

[0038] like Figure 2 As shown, in one embodiment of the present invention, a heat insulation ring 12 is installed between the spindle joint 4 and the carrier plate 5 .

[0039] like Figure 2 As shown, in one embodiment of the present invention, the spindle joint 4 and the carrier plate 5 are assembled and connected by a plurality of M6 screws 9 .

[0040] like Figure 2 As shown, in one embodiment of the present invention, the loading tray 5 includes two connecting trays, and the two connecting trays are assembled and connected by a plurality of M10 screws 13 .

[0041] like Figure 1As shown, in one embodiment of the present invention, the controller 8 is provided with a temperature display, an operation indicator light, a power adjustment knob and a controller switch button.

[0042] The standard parts used in the present invention can all be purchased from the market, and special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part adopt conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here.

[0043] The implementation principle of an electromagnetic microwave assisted polishing system according to an embodiment of the present invention is as follows: a hard and brittle material (such as sapphire) is placed on the lower plate 6 of the polishing machine and covered by the loading groove 15 at the bottom of the loading plate 5, and then the microwave power of the microwave transmitting device is adjusted by the controller 8 (the transmission of electric power and electrical signals is completed by the conductive slip ring 3 and the wire 7). The controller 8 controls the microwave transmitting device to increase the temperature of water molecules in the processing area by friction. Through this structural design, it is possible to achieve frictional vibration of water molecules in the processing area, change the temperature of the processing area, and improve the dispersion of the abrasive to a certain extent.

[0044] The microwave transmitting device is used to generate microwaves through the magnetron 20 and transmit them to the object-carrying groove 15 through the magnetron transmitting port 21, thereby causing the friction of water molecules in the processing area to increase the temperature.

[0045] By providing an anti-microwave infrared temperature measuring sensor 18, the temperature of the processing area can be detected in real time, and the microwave power can be adjusted in time by the controller 8 according to the displayed temperature.

[0046] In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0047] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0048] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0049] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0050] In the drawings of the embodiments disclosed in the present invention, only the structures related to the embodiments disclosed in the present invention are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present invention can be combined with each other.

[0051] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An electromagnetic microwave assisted polishing system, characterized in that: include: A polishing machine upper head (1), a polishing machine main shaft (2), a conductive slip ring (3), a loading plate (5), a microwave transmitting device, a polishing machine lower plate (6) and a controller (8); The polishing machine main shaft (2) is arranged at the bottom of the upper head (1) of the polishing machine, and the conductive slip ring (3) is arranged at the bottom of the polishing machine main shaft (2); The controller (8) is electrically connected to the conductive slip ring (3) via a wire (7); The conductive slip ring (3) is electrically connected to the microwave transmitting device; The polishing machine spindle (2) is fixedly arranged with the loading plate (5) via a spindle joint (4); The polishing machine lower plate (6) is arranged at the bottom of the loading plate (5); The microwave emitting device is arranged in the inner cavity of the carrier plate (5) and is used to increase the temperature of water molecules in the processing area by friction; The bottom of the loading tray (5) is provided with a loading groove (15), and the loading groove (15) is provided with a plurality of loading groove openings (14).

2. The electromagnetic microwave assisted polishing system according to claim 1, characterized in that: The microwave emitting device comprises a magnetron (20), a magnetron emitting port (21) and a magnetron outlet terminal (10); The loading tray (5) is provided with an internal loading tray wire groove (16), and the magnetron outlet terminal (10) is mounted at the exit of the internal loading tray wire groove (16); The magnetron (20) is mounted in the inner cavity of the object carrier (5); the magnetron outlet terminal (10) is electrically connected to the magnetron (20) via a magnetron power line (17); and the magnetron emission port (21) is mounted at the bottom of the magnetron (20); The magnetron outlet terminal (10) is electrically connected to the conductive slip ring (3).

3. The electromagnetic microwave assisted polishing system according to claim 2, characterized in that: The outer side surface of the magnetron (20) is wrapped with a waterproof and heat-insulating material.

4. The electromagnetic microwave assisted polishing system according to claim 2, characterized in that: A waveguide tube (19) is provided at the bottom of the magnetron (20), and the magnetron emission port (21) is arranged in the waveguide tube (19).

5. The electromagnetic microwave assisted polishing system according to claim 1, characterized in that: An anti-microwave infrared temperature measurement sensor (18) is also installed in the inner cavity of the loading plate (5), and the anti-microwave infrared temperature measurement sensor (18) is electrically connected to the conductive slip ring (3) via an infrared temperature sensor signal line (11).

6. The electromagnetic microwave assisted polishing system according to claim 4 or 5, characterized in that: The detection end of the microwave-resistant infrared temperature measuring sensor (18) is arranged in the waveguide tube (19).

7. The electromagnetic microwave assisted polishing system according to claim 1, characterized in that: A heat insulation ring (12) is installed between the spindle joint (4) and the carrier plate (5).

8. The electromagnetic microwave assisted polishing system according to claim 7, characterized in that: The spindle joint (4) and the loading plate (5) are assembled and connected via a plurality of M6 screws (9).

9. The electromagnetic microwave assisted polishing system according to claim 1, characterized in that: The loading plate (5) comprises two connecting plates, and the two connecting plates are assembled and connected via a plurality of M10 screws (13).

10. The electromagnetic microwave assisted polishing system according to claim 1, characterized in that: The controller (8) is provided with a temperature display, an operation indicator light, a power adjustment knob and a controller switch button.

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