Machining device and machining method

Abstract

The invention provides a machining device and a machining method. The machining device is applied to the optical element comprising a to-be-ground part and comprises a pretreatment module, an accurate grinding module and a polishing module. The pretreatment module comprises a heater and a rough grinding piece, the heater is used for heating a to-be-ground part, and the rough grinding piece is used for carrying out rough grinding treatment on the heated to-be-ground part; the fine grinding module comprises a plurality of fine grinding parts, the mesh number of the fine grinding parts is larger than that of the coarse grinding parts, the fine grinding parts have different mesh numbers, and the fine grinding parts are used for conducting fine grinding treatment on the roughly-ground parts to be ground; the polishing module comprises a polishing piece, and the polishing piece is used for polishing the to-be-ground part obtained after accurate grinding. According to the machining device and the machining method, grinding and polishing integration can be achieved, the treatment difficulty of the to-be-ground part is reduced, the roughness of the optical element is reduced, the machining precision and the machining efficiency are improved, and high-precision and high-efficiency precision machining is achieved.

Description

Technical Field

[0001] The present application belongs to the field of precision machining technology, and specifically relates to a machining device and a machining method. Background Art

[0002] Optical components usually need to undergo rough grinding, fine grinding, polishing and other precision processing to obtain ultra-smooth, low-defect and low-damage optical surfaces. However, in the related art, the fine grinding processes for optical components are separated and independent of each other, resulting in low processing efficiency of optical components. Summary of the invention

[0003] In view of this, the first aspect of the present application provides a processing device, which is applied to an optical element including a portion to be ground, and the processing device includes:

[0004] A pre-processing module, comprising a heater and a rough grinding piece, wherein the heater is used to heat the portion to be ground, and the rough grinding piece is used to perform rough grinding on the heated portion to be ground;

[0005] A fine grinding module, comprising a plurality of fine grinding pieces, wherein the mesh number of the plurality of fine grinding pieces is greater than the mesh number of the rough grinding pieces, and each of the fine grinding pieces has a different mesh number, and the plurality of fine grinding pieces are used to respectively perform fine grinding on the to-be-grinded portion after rough grinding;

[0006] The polishing module comprises a polishing piece, and the polishing piece is used to polish the part to be ground after fine grinding.

[0007] Wherein, the fine grinding module also includes a bracket, the multiple fine grinding parts are arranged on the same side of the bracket, each of the fine grinding parts has a fine grinding surface arranged away from the bracket, the vertical distance from the fine grinding surface to the bracket is a preset height, and the multiple fine grinding parts have different preset heights.

[0008] Wherein, along an arrangement direction perpendicular to the support to the plurality of fine grinding pieces, the plurality of fine grinding pieces are arranged at intervals, and the mesh counts of the plurality of fine grinding pieces increase sequentially, and the preset heights of the plurality of fine grinding pieces increase sequentially.

[0009] Wherein, the plurality of fine grinding parts satisfy at least one of the following conditions:

[0010] The mesh difference between two adjacent fine grinding pieces is 100 mesh to 5000 mesh;

[0011] The mesh difference between two adjacent fine grinding pieces is equal;

[0012] The preset height difference between two adjacent fine grinding pieces is 5 μm to 10 μm;

[0013] The preset height differences between two adjacent refining members are equal.

[0014] Wherein, the preprocessing module further includes a detector and a marker, wherein the detector is used to detect the morphology of the optical element to obtain the position information of the portion to be ground on the optical element, and the marker is used to mark the portion to be ground.

[0015] Wherein, the polishing module further includes a polishing liquid having polishing particles, the polishing liquid is used to assist the polishing member in performing a polishing process, and the particle size of the polishing particles is 10 nm to 100 nm.

[0016] The surface roughness Ra of the optical element after rough grinding is 1 ≤1000nm; the surface roughness Ra of the optical element after fine grinding 2 ≤50nm; the surface roughness Ra of the optical element after polishing 3 ≤1nm.

[0017] Wherein, the processing device further includes a fixing module, and the fixing module includes:

[0018] A workbench, used to carry the optical element, the workbench can rotate to drive the optical element placed on the workbench to rotate;

[0019] A plurality of clamping members are used to clamp the optical element, the clamping members are slidably connected to the workbench, and the plurality of clamping members can slide relative to the workbench to adjust the distance between the plurality of clamping members.

[0020] Wherein, the processing device also includes a cleaning module, and the cleaning device is used to clean the optical element.

[0021] A second aspect of the present application provides a processing method, which is applied to an optical element including a portion to be ground, and the processing method comprises:

[0022] Providing a processing device as provided in the first aspect of the present application;

[0023] Controlling the heater of the pretreatment module to heat the portion to be ground;

[0024] Controlling the rough grinding piece of the pre-treatment module to perform rough grinding on the heated portion to be ground;

[0025] Controlling a plurality of fine grinding pieces of the fine grinding module to perform fine grinding on the portion to be ground after rough grinding;

[0026] The polishing member of the polishing module is controlled to perform polishing on the part to be polished after fine grinding.

[0027] The processing device and processing method provided by the present application first utilize a pretreatment module to heat the portion to be ground to soften the portion to be ground and reduce the difficulty of processing the portion to be ground, and then perform a rough grinding treatment on the portion to be ground, which can reduce the wear of the rough grinding parts and improve the processing efficiency; then, use a plurality of fine grinding parts of a fine grinding module to perform a fine grinding treatment on the portion to be ground, further reduce the roughness of the optical element, and further improve the processing accuracy and processing efficiency; subsequently, use a polishing part of a polishing module to polish the portion to be ground, further reduce the roughness of the optical element, and further improve the processing accuracy and processing efficiency.

[0028] Therefore, the processing device and processing method provided in the present application can realize the integration of grinding and polishing, and achieve high-precision and high-efficiency precision processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the implementation modes of the present application, the drawings required for use in the implementation modes of the present application will be described below.

[0030] Figure 1 A three-dimensional structural diagram of a processing device provided in one embodiment of the present application.

[0031] Figure 2 A schematic diagram of the structure of a pre-processing module processing an optical element provided in one embodiment of the present application.

[0032] Figure 3 A partially enlarged view of a preprocessing module provided in one embodiment of the present application.

[0033] Figure 4 A schematic diagram of the structure of a fine grinding module processing an optical element provided in one embodiment of the present application.

[0034] Figure 5 A partially enlarged view of a fine grinding module provided in one embodiment of the present application.

[0035] Figure 6 This is a schematic structural diagram of a polishing module provided in one embodiment of the present application processing an optical element.

[0036] Figure 7 A partially enlarged view of a polishing module provided in one embodiment of the present application.

[0037] Figure 8 A three-dimensional structural diagram of a fixing module provided in one embodiment of the present application.

[0038] Fig. 9 A schematic diagram of the structure of a cleaning module provided in one embodiment of the present application processing an optical element.

[0039] Fig.10A schematic flow chart of a processing method provided in one embodiment of the present application.

[0040] Explanation of reference numerals: processing device 1, pretreatment module 11, heater 111, rough grinding part 112, first movable part 113, fine grinding module 12, fine grinding part 121, fine grinding surface 1211, second movable part 122, bracket 123, polishing module 13, polishing part 131, third movable part 132, fixing module 14, workbench 141, clamping part 142, cleaning module 15, nozzle 151, fourth movable part 152, optical element 2. DETAILED DESCRIPTION

[0041] The following are preferred implementations of the present application. It should be noted that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application, and these improvements and modifications are also considered to be within the scope of protection of the present application.

[0042] In view of this, in order to solve the above problems, please refer to Figure 1-Figure 7 The present embodiment provides a processing device 1, which is applied to an optical element 2 including a portion to be ground, and the processing device 1 includes a pre-processing module 11, a fine grinding module 12, and a polishing module 13. The pre-processing module 11 includes a heater 111 and a rough grinding piece 112, wherein the heater 111 is used to heat the portion to be ground, and the rough grinding piece 112 is used to perform a rough grinding process on the heated portion to be ground. The fine grinding module 12 includes a plurality of fine grinding pieces 121, wherein the mesh number of the plurality of fine grinding pieces 121 is greater than the mesh number of the rough grinding piece 112, and each of the fine grinding pieces 121 has a different mesh number, and the plurality of fine grinding pieces 121 are used to respectively perform a fine grinding process on the portion to be ground after the rough grinding. The polishing module 13 includes a polishing piece 131, and the polishing piece 131 is used to perform a polishing process on the portion to be ground after the fine grinding.

[0043] The processing device 1 provided in this embodiment is applied to an optical element 2, and the optical element 2 can be a lens, a reflector, a prism, a filter, a grating, an aperture, etc. The optical element 2 includes a portion to be ground, and the portion to be ground can be understood as a protrusion located on the surface of the optical element 2. By using the processing device 1 provided in this embodiment to process the part to be ground, at least part of the part to be ground is removed to reduce the surface roughness of the optical element 2, and an optical element 2 with an ultra-smooth, low-defect and low-damage optical surface is obtained.

[0044] The pretreatment module 11 can also be understood as a heating and rough grinding module, and the heater 111 is used to heat the part to be ground. The heater 111 and the rough grinding piece 112 can move relative to the optical element 2. Specifically, the heater 111 can emit a laser beam, and the laser power of the laser beam is 10W-1000W; the heater 111 is controlled to focus the laser beam on the part to be ground, and the laser energy is absorbed by the optical element 2 and converted into heat energy, so that the part to be ground is rapidly heated up to achieve the heating of the part to be ground. It can also be understood that the part to be ground on the surface of the hard and brittle optical element 2 is thermally softened by laser heat treatment. The heated part to be ground is easier to remove, which reduces the difficulty of processing the part to be ground and is conducive to improving processing efficiency. The rough grinding piece 112 is used to perform rough grinding on the part to be ground. Optionally, during the rough grinding process, the rotation speed of the rough grinding piece 112 is 1000rpm-20000rpm. Optionally, the number of rough grinding pieces 112 is one or more. Optionally, the heater 111 is indirectly connected to the rough grinding piece 112 through a connecting piece, and the heater 111 is adjacent to the rough grinding piece 112. Optionally, the mesh number of the rough grinding piece 112 is 50 mesh to 100 mesh. Optionally, the pre-processing module 11 further includes a first moving member 113, the first moving member 113 connects the heater 111 and the rough grinding piece 112, and the first moving member 113 can drive the heater 111 and the rough grinding piece 112 to move relative to the optical element 2.

[0045] The fine grinding module 12 includes a plurality of fine grinding pieces 121. The fine grinding pieces 121 are used to perform fine grinding on the portion to be ground, so as to further reduce the surface roughness of the optical element 2. The fine grinding pieces 121 can move relative to the optical element 2. Optionally, the number of fine grinding pieces 121 is 2-10, and specifically, 2, 3, 4, 5, 6, 7, 8, 9, 10, etc. can be exemplified. The mesh number of each fine grinding piece 121 is greater than the mesh number of the rough grinding piece 112, so as to achieve finer processing of the optical element 2. Moreover, each fine grinding piece 121 has a different mesh number. Optionally, the mesh number of the fine grinding piece 121 is 100 mesh to 5000 mesh. For example, the fine grinding piece 121 includes a first fine grinding head, a second fine grinding head, and a third fine grinding head, the mesh number of the first fine grinding head is 200 mesh, the mesh number of the second fine grinding head is 1000 mesh, and the mesh number of the third fine grinding head is 2000 mesh. Optionally, the fine grinding module 12 also includes a second moving member 122, the second moving member 122 is connected to the plurality of fine grinding pieces 121, and the second moving member 122 can drive the plurality of fine grinding pieces 121 to move relative to the optical element 2.

[0046] Optionally, during the fine grinding process, the fine grinding pieces 121 with mesh numbers from small to large are used in sequence to process the part to be ground respectively. For example, the fine grinding piece 121 includes a first fine grinding head, a second fine grinding head, and a third fine grinding head, the mesh number of the first fine grinding head is smaller than the mesh number of the second fine grinding head, and the mesh number of the second fine grinding head is smaller than the mesh number of the third fine grinding head; during the fine grinding process, the first fine grinding head is used to process the part to be ground first, then the second fine grinding head is used to process the part to be ground, and then the third fine grinding head is used to process the part to be ground. In this embodiment, by using fine grinding pieces 121 with mesh numbers from small to large to process the part to be ground respectively, a step-by-step fine grinding process of the optical element 2 is achieved, which reduces the difficulty of fine grinding the optical element 2, reduces the wear of the fine grinding piece 121, and improves the processing efficiency.

[0047] The polishing module 13 includes a polishing member 131, which is used to polish the portion to be ground, further reducing the surface roughness of the optical element 2. The polishing member 131 can move relative to the optical element 2. Optionally, during the polishing process, a polishing liquid is used in conjunction with the polishing member 131 to polish the portion to be ground. The polishing member 131 can be a polishing head, a polishing disk, etc. Optionally, the polishing module 13 also includes a third moving member 132, which is connected to the polishing member 131, and the third moving member 132 can drive the polishing member 131 to move relative to the optical element 2.

[0048] Specifically, the pretreatment module 11 is first used to heat the portion to be ground to soften it and reduce the difficulty of processing the portion to be ground, and then the portion to be ground is roughly ground, which can reduce the wear of the rough grinding piece 112 and improve the processing efficiency; then, the plurality of fine grinding pieces 121 of the fine grinding module 12 are used to fine grind the portion to be ground, so as to further reduce the roughness of the optical element 2 and further improve the processing accuracy and processing efficiency; subsequently, the polishing piece 131 of the polishing module 13 is used to polish the portion to be ground, so as to further reduce the roughness of the optical element 2 and further improve the processing accuracy and processing efficiency.

[0049] Therefore, this embodiment realizes the integration of grinding and polishing by adopting a processing setting consisting of a pretreatment module 11, a fine grinding module 12, and a polishing module 13, thereby greatly improving the processing efficiency of the optical element 2; and, the pretreatment module 11 can significantly reduce the wear of the grinding tool and improve the processing efficiency, and the fine grinding module 12 can achieve the layered removal of the part to be ground of the optical element 2 at one time, thereby further improving the processing efficiency of the optical element 2 and realizing high-precision and high-efficiency precision processing.

[0050] Please refer to Figure 1-Figure 5In one embodiment, the fine grinding module 12 further includes a bracket 123, and the multiple fine grinding pieces 121 are arranged on the same side of the bracket 123, each of the fine grinding pieces 121 has a fine grinding surface 1211 arranged away from the bracket 123, and the vertical distance from the fine grinding surface 1211 to the bracket 123 is a preset height, and the multiple fine grinding pieces 121 have different preset heights.

[0051] The bracket 123 is used to carry and fix the fine grinding piece 121. The bracket 123 has a mounting surface, and the multiple fine grinding pieces 121 are arranged on the mounting surface. Optionally, the multiple fine grinding pieces 121 are arranged at intervals along a preset direction. Each fine grinding piece 121 has a fine grinding surface 1211, and the fine grinding surface 1211 is used to contact the part to be ground to perform fine grinding on the part to be ground to reduce the surface roughness of the optical element 2. Each fine grinding piece 121 has a different preset height. The preset height is as follows: Figure 5 As shown in H.

[0052] For example, the fine grinding piece 121 includes a first fine grinding head, a second fine grinding head, and a third fine grinding head. The vertical distance from the first fine grinding surface of the first fine grinding head to the bracket 123 is a first preset height, the vertical distance from the second fine grinding surface of the second fine grinding head to the bracket 123 is a second preset height, and the vertical distance from the third fine grinding surface of the third fine grinding head to the bracket 123 is a third preset height. The first preset height is not equal to the second preset height, and the second preset height is not equal to the third preset height.

[0053] More specifically, along an arrangement direction perpendicular to the bracket 123 to the plurality of fine grinding pieces 121 , the plurality of fine grinding pieces 121 are arranged at intervals, and the mesh counts of the plurality of fine grinding pieces 121 increase sequentially, and the preset heights of the plurality of fine grinding pieces 121 increase sequentially.

[0054] For example, the first fine grinding head, the second fine grinding head, and the third fine grinding head are arranged at intervals along the arrangement direction perpendicular to the bracket 123 to the plurality of fine grinding pieces 121, the mesh number of the first fine grinding surface in the first fine grinding head is smaller than the mesh number of the second fine grinding surface in the second fine grinding head, the mesh number of the second fine grinding surface in the second fine grinding head is smaller than the mesh number of the third fine grinding surface in the third fine grinding head, the first preset height is smaller than the second preset height, and the second preset height is smaller than the third preset height. In the process of fine grinding, the first fine grinding head is first used to process the part to be ground, the second fine grinding head is then used to process the part to be ground, and then the third fine grinding head is used to process the part to be ground.

[0055] As the fine grinding pieces 121 with mesh sizes increasing from small to large are used to process the portion to be ground respectively, the height of the portion to be ground gradually decreases. Therefore, it is necessary to adjust the distance between the fine grinding surface 1211 of each fine grinding piece 121 and the portion to be ground to match the changed portion to be ground. However, in this embodiment, the mesh sizes of the fine grinding pieces 121 are arranged from small to large, and the preset heights of the fine grinding pieces 121 are gradually increased, so as to accurately match the changed portion to be ground. This can reduce the adjustment of the height of the fine grinding module 12 in the vertical direction and improve the processing efficiency.

[0056] In summary, this embodiment limits the vertical distance between the fine grinding surface 1211 and the bracket 123 and the arrangement of the fine grinding pieces 121 so that each fine grinding piece 121 corresponds to the different heights of the part to be ground, thereby reducing the adjustment of the height of the fine grinding module 12 in the vertical direction, thereby improving the processing efficiency.

[0057] Please refer to Figure 1-Figure 5 In one embodiment, the plurality of fine grinding pieces 121 satisfy at least one of the following conditions:

[0058] The mesh difference between two adjacent fine grinding pieces 121 is 100 mesh to 5000 mesh. Specifically, the mesh difference between two adjacent fine grinding pieces 121 can be 100 mesh, 500 mesh, 1000 mesh, 1500 mesh, 2000 mesh, 2500 mesh, 3000 mesh, 3500 mesh, 4000 mesh, 4500 mesh, 5000 mesh, etc.

[0059] Optionally, the mesh difference between any two adjacent fine grinding pieces 121 is the same; or, the mesh difference between any two adjacent fine grinding pieces 121 is different; or, the mesh difference between some two adjacent fine grinding pieces 121 is the same, and the mesh difference between another part of two adjacent fine grinding pieces 121 is different.

[0060] For example, the fine grinding piece 121 includes a first fine grinding head, a second fine grinding head, and a third fine grinding head. The first fine grinding head is adjacent to the second fine grinding head, and the second fine grinding head is adjacent to the third fine grinding head. The mesh number of the first fine grinding head is A mesh, the mesh number of the second fine grinding head is A+2000 mesh, and the mesh number of the third fine grinding head is A+2800 mesh.

[0061] Optionally, as the mesh numbers of the plurality of fine grinding pieces 121 increase in sequence, the mesh number difference between two adjacent fine grinding pieces 121 decreases in sequence. During the fine grinding process, the fine grinding piece 121 with a larger mesh number difference is first used to perform a relatively rough grinding of the portion to be ground, and then the fine grinding piece 121 with a smaller mesh number difference is used to perform a relatively fine grinding of the portion to be ground, which can reduce the difficulty of fine grinding of the optical element 2 and improve the processing efficiency.

[0062] In summary, this embodiment limits the mesh difference between two adjacent fine grinding pieces 121 to achieve a step-by-step fine grinding process for the optical element 2, thereby reducing the difficulty of fine grinding the optical element 2, reducing the wear on the fine grinding pieces 121, and improving the processing efficiency.

[0063] And / or, the mesh difference between two adjacent fine grinding pieces 121 is equal. For example, the fine grinding piece 121 includes a first fine grinding head, a second fine grinding head, and a third fine grinding head, the first fine grinding head is adjacent to the second fine grinding head, the second fine grinding head is adjacent to the third fine grinding head, the mesh number of the first fine grinding head is A mesh, the mesh number of the second fine grinding head is A+1000 mesh, and the mesh number of the third fine grinding head is A+2000 mesh.

[0064] And / or, the preset height difference between two adjacent fine grinding pieces 121 is 5 μm to 10 μm. Specifically, the preset height difference between two adjacent fine grinding pieces 121 can be 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, or 10 μm, etc.

[0065] Optionally, the preset height difference between any two adjacent fine grinding pieces 121 is the same; or, the preset height difference between any two adjacent fine grinding pieces 121 is different; or, the preset height difference between some adjacent two fine grinding pieces 121 is the same, and the preset height difference between another part of adjacent two fine grinding pieces 121 is different.

[0066] For example, the fine grinding piece 121 includes a first fine grinding head, a second fine grinding head, and a third fine grinding head. The first fine grinding head is adjacent to the second fine grinding head, the second fine grinding head is adjacent to the third fine grinding head, the preset height difference between the first fine grinding head and the second fine grinding head is 8 μm, and the preset height difference between the second fine grinding head and the third fine grinding head is 5 μm.

[0067] Optionally, as the mesh numbers of the plurality of fine grinding pieces 121 increase successively, the preset height difference between two adjacent fine grinding pieces 121 decreases successively. In the process of fine grinding, it is easier to remove the part to be ground in the early stage, and the height change of the part to be ground in the early stage is greater, so the fine grinding piece 121 with a larger preset height is used first; while the removal of the part to be ground is slower in the later stage, and the height change of the part to be ground in the later stage is smaller, so the fine grinding piece 121 with a smaller preset height is used later, so that the different height changes of the part to be ground can be matched more accurately, further reducing the adjustment of the height of the fine grinding module 12 in the vertical direction, and improving the processing efficiency.

[0068] In summary, this embodiment limits the preset height difference between two adjacent fine grinding pieces 121 so that each fine grinding piece 121 corresponds to the different heights of the part to be ground, thereby reducing the adjustment of the height of the fine grinding module 12 in the vertical direction, thereby improving the processing efficiency.

[0069] And / or, the preset height difference between two adjacent fine grinding pieces 121 is equal. For example, the fine grinding piece 121 includes a first fine grinding head, a second fine grinding head, and a third fine grinding head, the first fine grinding head is adjacent to the second fine grinding head, the second fine grinding head is adjacent to the third fine grinding head, the preset height difference between the first fine grinding head and the second fine grinding head is 6 μm, and the preset height difference between the second fine grinding head and the third fine grinding head is 6 μm.

[0070] In one embodiment, the preprocessing module 11 further includes a detector and a marker, wherein the detector is used to detect the morphology of the optical element 2 to obtain position information of the portion to be ground on the optical element 2, and the marker is used to mark the portion to be ground.

[0071] The detector can detect the morphology of the optical element 2, thereby obtaining the position information of the part to be ground, and the detector also sends the position information of the part to be ground to the marker, which receives the position information of the part to be ground and marks the part to be ground. The detector can be a 3D scanner, a surface profiler, etc., and the marker can be a laser marker, etc.

[0072] Specifically, a detector is first used to detect the surface morphology of the optical element 2, and a marker is used to mark the protrusion position as 1, 2, 3, ... n; the protrusion position is the part to be ground. Then, the movable heater 111 is aimed at the protrusion position, and the heater 111 can emit a laser beam. The laser energy is absorbed by the material and converted into heat energy, so that the protrusion position is rapidly heated. Subsequently, the movable rough grinding piece 112 is used to grind the protrusion position after laser heat treatment.

[0073] In summary, this embodiment can accurately confirm the position of the part to be ground by setting up a detector and a marker, reduce the difficulty of heating and rough grinding the part to be ground, improve the accuracy of heating and rough grinding the part to be ground, and further improve the processing efficiency.

[0074] In one embodiment, the polishing module 13 further includes a polishing liquid having polishing particles, and the polishing liquid is used to assist the polishing member 131 in performing a polishing process, and the particle size of the polishing particles is 10 nm to 100 nm.

[0075] The polishing liquid is used to assist the polishing member 131 in processing the grinding portion, so as to further improve the processing accuracy and processing efficiency; and the polishing liquid contains polishing particles, so as to further improve the processing accuracy and processing efficiency. The particle size of the polishing particles is 10nm to 100nm, and the specific particle size of the polishing particles can be exemplified as 10nm, or 20nm, or 30nm, or 40nm, or 50nm, or 60nm, or 70nm, or 80nm, or 90nm, or 100nm, etc.

[0076] In summary, in this embodiment, the polishing liquid is used in combination with the polishing piece 131 to polish the portion to be polished, thereby further improving the machining accuracy and efficiency, and achieving high-precision and high-efficiency precision machining.

[0077] In one embodiment, the surface roughness Ra of the optical element 2 after rough grinding is 1 ≤1000nm; the surface roughness Ra of the optical element 2 after fine grinding 2 ≤50nm; the surface roughness Ra of the optical element 2 after polishing 3 ≤1nm.

[0078] The surface roughness Ra of the optical element 2 after rough grinding is as follows: 1 Examples thereof include 1000 nm, 900 nm, 800 nm, 700 nm, 600 nm, 500 nm, 400 nm, 300 nm, 200 nm, 100 nm, and the like.

[0079] The surface roughness Ra of the optical element 2 after fine grinding is as follows: 2 Examples include 50 nm, 45 nm, 40 nm, 35 nm, 30 nm, 25 nm, 20 nm, 15 nm, 10 nm, 5 nm, etc.

[0080] The surface roughness Ra of the optical element 2 after polishing is 3 Examples thereof include 1 nm, 0.9 nm, 0.8 nm, 0.7 nm, 0.6 nm, 0.5 nm, 0.4 nm, 0.3 nm, 0.2 nm, 0.1 nm, and the like.

[0081] In summary, this embodiment adopts a processing setting consisting of a pretreatment module 11, a fine grinding module 12, and a polishing module 13, which can achieve layer removal of the to-be-grinded portion of the optical element 2 at one time, improve the processing efficiency of the optical element 2, and achieve high-precision and high-efficiency precision processing.

[0082] Please refer to Figure 8 In one embodiment, the processing device 1 further includes a fixing module 14, and the fixing module 14 includes a workbench 141 and a plurality of clamping members 142. The workbench 141 is used to carry the optical element 2, and the workbench 141 can rotate to drive the optical element 2 placed on the workbench 141 to rotate. The plurality of clamping members 142 are used to clamp the optical element 2, and the clamping members 142 are slidably connected to the workbench 141, and the plurality of clamping members 142 can slide relative to the workbench 141 to adjust the distance between the plurality of clamping members 142.

[0083] The workbench 141 can rotate along its own axial direction, thereby driving the optical element 2 to rotate, so as to cooperate with the pre-processing module 11, the fine grinding module 12, and the polishing module 13 to improve the processing efficiency of the optical element 2. Optionally, a plurality of clamping members 142 are arranged at intervals along the circumferential direction of the workbench 141; optionally, the spacing between any two adjacent clamping members 142 is equal. Optionally, the number of clamping members 142 is 2-6, and the specific number of clamping members 142 can be, for example, 2, 3, 4, 5, 6, etc.

[0084] For example, one of the workbench 141 and the clamping member 142 has a slide rail, and the other of the workbench 141 and the clamping member 142 has a slider, at least part of the slider is disposed in the slide rail, and the slider is slidably connected to the slide rail. Optionally, the slide rail is extended along the radial direction of the workbench 141.

[0085] In summary, this embodiment can not only firmly fix the optical element 2 by setting the workbench 141 and the clamping member 142, but also quickly cooperate with the pretreatment module 11, the fine grinding module 12, and the polishing module 13 to move the optical element 2, thereby improving the processing efficiency of the optical element 2.

[0086] Please refer to Fig. 9 In one embodiment, the processing device 1 further includes a cleaning module 15 , and the cleaning device is used to clean the optical element 2 .

[0087] The cleaning module 15 can move relative to the optical element 2, the pretreatment module 11, the fine grinding module 12, the polishing module 13, and the fixed module 14. Among them, the cleaning module 15 includes a nozzle 151, and the nozzle 151 is used to spray a cleaning liquid. Specifically, the movable nozzle 151 is moved to the surface of the polished optical element 2, and the surface of the polished optical element 2 is cleaned to effectively remove the polishing residue and ensure the quality and performance of the optical element 2. The nozzle 151 can also clean the rough grinding part 112, the fine grinding part 121, and the polishing part 131 to remove the grinding residue and the polishing residue, thereby improving the quality and performance of the optical element 2. Optionally, the cleaning module 15 also includes a fourth movable member 152, and the fourth movable member 152 is connected to the nozzle 151, and the fourth movable member 152 can drive the nozzle 151 to move relative to the optical element 2.

[0088] Optionally, the pre-treatment module 11 , the fine grinding module 12 , the polishing module 13 , and the cleaning module 15 are arranged at intervals around the fixing module 14 along the circumferential direction of the fixing module 14 .

[0089] For example, for small optical components 2, the flow rate of the cleaning liquid is usually in the range of 0.1L / min to 1L / min; for medium-sized optical components 2, the flow rate of the cleaning liquid is usually in the range of 1L / min to 5L / min; for large optical components 2, the flow rate of the cleaning liquid is usually in the range of L / min to 10L / min.

[0090] In summary, the present embodiment also removes residues in a timely manner by providing a cleaning module 15 , thereby improving the quality and performance of the optical element 2 during high-precision and high-efficiency precision machining.

[0091] Please refer to Figure 1-Figure 10 The present application also provides a processing method, which is applied to an optical element 2 including a portion to be ground, and the processing method comprises:

[0092] S100, providing a processing device 1 as provided above in the present application.

[0093] S200, controlling the heater 111 of the pre-processing module 11 to heat the portion to be ground.

[0094] S300, controlling the rough grinding piece 112 of the pre-processing module 11 to perform rough grinding on the heated portion to be ground.

[0095] S400, controlling the plurality of fine grinding pieces 121 of the fine grinding module 12 to perform fine grinding on the portion to be ground after rough grinding.

[0096] S500, controlling the polishing member 131 of the polishing module 13 to perform polishing on the portion to be polished after fine grinding.

[0097] Optionally, the processing device 1 further includes a fixing module 14 . After S100 , the optical element 2 is placed on the fixing module 14 , and the fixing module 14 fixes the optical element 2 .

[0098] Optionally, the processing device 1 further includes a cleaning module 15 , and after S500 , the cleaning module 15 cleans the optical element 2 in the air.

[0099] Specifically, the optical element 2 is first fixed on the clamping member 142 of the fixing module 14, and then the surface morphology of the optical element 2 is detected by a detector, and the part to be ground is marked as 1, 2, 3, ...n. Then, the heater 111 is controlled to emit a laser with a power of 10W-1000W. The laser is focused on the part to be ground on the surface of the optical element 2. The laser energy is absorbed by the material and converted into heat energy, causing the protruding position to heat up rapidly. Subsequently, the part to be ground that has been heat-treated by the laser is rough-ground using a movable rough-grinding member 112. The amount of rough-grinding removal is determined according to the height of the part to be ground. The rotation speed of the rough-grinding member 112 during the rough-grinding process is 1000rpm-20000rpm. After the rough-grinding treatment, the surface roughness Ra of the optical element 2 is 1 Reaching 1000nm and below.

[0100] Then, the mobile fine grinding module 12 is moved to the surface of the rough-ground optical element 2 for precision processing. The fine grinding module 12 includes 1 to N fine grinding heads arranged in sequence, the mesh numbers of the N fine grinding heads increase in sequence (100 mesh to 5000 mesh), the height decreases in sequence, and the overall height difference is controlled within 10μm, thereby achieving one-time layer removal of the optical element 2. Compared with the traditional sequential grinding method, the processing efficiency is significantly improved. After fine grinding, the surface roughness Ra of the optical element 2 is 2 Reach 50nm and below.

[0101] Afterwards, the mobile polishing module 13 is moved to the surface of the optical element 2 to polish the optical element 2 after fine grinding, so as to further reduce the surface roughness of the optical element 2. The polishing particles in the polishing liquid used in the polishing process have a particle size range of 10nm to 100nm; after polishing, the surface roughness Ra of the optical element 2 3 Reach 1nm and below.

[0102] Finally, the movable cleaning module 15 is moved to the polished surface of the optical element 2 to clean the optical element 2 to effectively remove polishing residues and ensure the quality and performance of the optical element 2.

[0103] The processing method provided in this embodiment first utilizes the pretreatment module 11 to heat the part to be ground to soften the part to be ground and reduce the processing difficulty of the part to be ground, and then performs a rough grinding treatment on the part to be ground, which can reduce the wear of the rough grinding piece 112 and improve the processing efficiency; then, the part to be ground is finely ground by using multiple fine grinding pieces 121 of the fine grinding module 12 to further reduce the roughness of the optical element 2 and further improve the processing accuracy and processing efficiency; subsequently, the part to be ground is polished by using the polishing piece 131 of the polishing module 13 to further reduce the roughness of the optical element 2 and further improve the processing accuracy and processing efficiency.

[0104] Therefore, the processing method provided in this embodiment can realize the integration of grinding and polishing, and achieve high-precision and high-efficiency precision processing.

[0105] Unless otherwise specified or there is a contradiction, the terms and phrases used in this application have the following meanings:

[0106] In this application, "first", "second", etc. are used only for descriptive purposes and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0107] In this application, "one or several" refers to any one, any two or more of the listed items. Among them, "several" refers to any two or more of the listed items.

[0108] In the present application, it is necessary to understand that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0109] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated. It can be mechanically connected or electrically connected. It can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0110] Mentioning "embodiment" and "implementation method" in this application means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrases in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments. In addition, it should also be understood that the features, structures or characteristics described in the various embodiments of the present application can be arbitrarily combined to form another embodiment that does not deviate from the spirit and scope of the technical solution of the present application, provided that there is no contradiction between them.

[0111] The above is part of the implementation methods of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications are also considered to be within the scope of protection of the present application.

Claims

1. A processing device, characterized in that: Applicable to an optical element including a portion to be ground, the processing device comprising: A pre-processing module, comprising a heater and a rough grinding piece, wherein the heater is used to heat the portion to be ground, and the rough grinding piece is used to perform rough grinding on the heated portion to be ground; A fine grinding module, comprising a plurality of fine grinding pieces, wherein the mesh number of the plurality of fine grinding pieces is greater than the mesh number of the rough grinding pieces, and each of the fine grinding pieces has a different mesh number, and the plurality of fine grinding pieces are used to respectively perform fine grinding on the to-be-grinded portion after rough grinding; The polishing module comprises a polishing piece, and the polishing piece is used to polish the part to be ground after fine grinding.

2. The processing device according to claim 1, characterized in that: The fine grinding module also includes a bracket, the multiple fine grinding parts are arranged on the same side of the bracket, each of the fine grinding parts has a fine grinding surface arranged away from the bracket, the vertical distance from the fine grinding surface to the bracket is a preset height, and the multiple fine grinding parts have different preset heights.

3. The processing device according to claim 2, characterized in that: Along an arrangement direction perpendicular to the support to the plurality of fine grinding pieces, the plurality of fine grinding pieces are arranged at intervals, and the mesh counts of the plurality of fine grinding pieces increase sequentially, and the preset heights of the plurality of fine grinding pieces increase sequentially.

4. The processing device according to claim 3, characterized in that: The plurality of fine grinding parts satisfy at least one of the following conditions: The mesh difference between two adjacent fine grinding pieces is 100 mesh to 5000 mesh; The mesh difference between two adjacent fine grinding pieces is equal; The preset height difference between two adjacent fine grinding pieces is 5 μm to 10 μm; The preset height differences between two adjacent refining members are equal.

5. The processing device according to claim 1, characterized in that: The pre-processing module further includes a detector and a marker, wherein the detector is used to detect the morphology of the optical element to obtain position information of the portion to be ground on the optical element, and the marker is used to mark the portion to be ground.

6. The processing device according to claim 1, characterized in that: The polishing module further includes a polishing liquid having polishing particles, wherein the polishing liquid is used to assist the polishing member in performing a polishing process, and the particle size of the polishing particles is 10 nm to 100 nm.

7. The processing device according to any one of claims 1 to 6, characterized in that: The surface roughness Ra1 of the optical element after the rough grinding treatment is ≤1000nm; the surface roughness Ra2 of the optical element after the fine grinding treatment is ≤50nm; the surface roughness Ra3 of the optical element after the polishing treatment is ≤1nm.

8. The processing device according to claim 1, characterized in that: The processing device also includes a fixing module, and the fixing module includes: A workbench, used to carry the optical element, the workbench can rotate to drive the optical element placed on the workbench to rotate; A plurality of clamping members are used to clamp the optical element, the clamping members are slidably connected to the workbench, and the plurality of clamping members can slide relative to the workbench to adjust the distance between the plurality of clamping members.

9. The processing device according to claim 1, characterized in that: The processing device also includes a cleaning module, and the cleaning device is used to clean the optical element.

10. A processing method, characterized in that: Applied to an optical element including a portion to be ground, the processing method comprises: Providing a processing device as described in any one of claims 1 to 9; Controlling the heater of the pretreatment module to heat the portion to be ground; Controlling the rough grinding piece of the pre-treatment module to perform rough grinding on the heated portion to be ground; Controlling a plurality of fine grinding pieces of the fine grinding module to perform fine grinding on the portion to be ground after rough grinding; The polishing member of the polishing module is controlled to perform polishing on the part to be polished after fine grinding.

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