Silicon optical module of efficient light source

Abstract

The invention relates to the technical field of optical modules, and discloses a silicon optical module with a high-efficiency light source, which comprises a PCB (printed circuit board) substrate, a silicon optical chip, a continuous wave laser, an optical fiber array and a lens assembly, and is characterized in that the silicon optical chip and the continuous wave laser are electrically connected with the PCB substrate, and the continuous wave laser is arranged on the PCB substrate and far away from the silicon optical chip; a composite waveguide, a transmitting waveguide and a receiving waveguide are arranged in the silicon optical chip, the composite waveguide is optically connected with the transmitting waveguide, and the receiving waveguide and the transmitting waveguide are distributed at intervals; a composite optical fiber is connected between the continuous wave laser and the composite waveguide; the silicon optical chip is also integrated with a demultiplexer, a modulator and a PD element, and the demultiplexer is arranged between the composite waveguide and the transmitting waveguide so as to separate the composite optical signal into a plurality of independent optical signals; the modulator is arranged in the transmitting waveguide and is used for modulating and changing the characteristics of the optical signal; the lens assembly is arranged among the optical fiber array, the transmitting waveguide and the receiving waveguide; the PD element is optically connected with the receiving waveguide to convert a received optical signal into an electrical signal.

Description

Technical Field

[0001] The present invention relates to the technical field of optical modules, and in particular to a silicon optical module with a high-efficiency light source. Background Art

[0002] At present, in data centers and network communication systems, optical modules are core components that realize the conversion function between optical signals and electrical signals. Optical modules have an important impact on transmission rate, signal loss and anti-interference.

[0003] For example, the Chinese invention patent application with application publication number CN115598777A and application publication date 2023.01.13 discloses a multi-channel parallel optical module assembly, which specifically includes a PCBA board and a silicon photonic chip, a FA assembly, an array lens, an array isolator, a coupling lens group and a laser group that are sequentially coupled and connected above the PCBA board. The silicon photonic chip includes multiple input waveguides and output waveguides, and the FA assembly has multiple optical fibers with gradient mode fields. Among them, the input part of the optical path includes a laser group, a coupling lens group, an array isolator, an array lens, four intermediate optical fibers of the FA assembly, and four input waveguides of the silicon photonic chip. The optical transmission path is: the laser chip emits a DC light wave, which enters the four optical fibers of the FA assembly after passing through the coupling lens group, the array isolator, and the array lens, and then enters the input waveguide of the silicon photonic chip. The energy output of the laser chip can be controlled by monitoring the feedback of the detector.

[0004] The multi-channel parallel optical module assembly in the prior art adopts a design in which multiple laser chips correspond one to one with multiple channels. The multiple laser chips generate a lot of heat, causing the optical module to be prone to high temperature problems. In addition, the multiple laser chips occupy a large area, and the integration of the optical module is low. Summary of the invention

[0005] The technical problem to be solved by the present invention is that: the heat generated by multiple laser chips of the existing optical module is large, which makes the optical module prone to high temperature; and the multiple laser chips occupy a large area, and the integration of the optical module is low.

[0006] In order to solve the above technical problems, the present invention provides a technical solution for a silicon photonic module with a high-efficiency light source:

[0007] The silicon photonic module of the high-efficiency light source comprises a PCB substrate, and a silicon photonic chip, a continuous wave laser, an optical fiber array and a lens assembly mounted on the PCB substrate, wherein the silicon photonic chip and the continuous wave laser are electrically connected to the PCB substrate respectively, and the continuous wave laser is arranged on the PCB substrate and away from the silicon photonic chip;

[0008] A composite waveguide, a transmitting waveguide and a receiving waveguide are arranged inside the silicon photonic chip, the composite waveguide is optically connected to the transmitting waveguide, and the receiving waveguide and the transmitting waveguide are spaced apart; a composite optical fiber is connected between the continuous wave laser and the composite waveguide, and the continuous wave laser is used to continuously emit a composite optical signal to the composite optical fiber;

[0009] The silicon photonic chip further integrates a demultiplexer, a modulator and a PD element. The demultiplexer is arranged between the composite waveguide and the transmitting waveguide, and is used to separate the composite optical signal into a plurality of separate optical signals. The modulator is arranged in the transmitting waveguide and is used to modulate and change the characteristics of the optical signal.

[0010] The optical fiber array and the transmitting waveguide and the receiving waveguide are spaced apart along the length direction of the optical fiber, and the lens assembly is arranged between the optical fiber array and the transmitting waveguide and the receiving waveguide; the PD element is optically connected to the receiving waveguide for converting the received optical signal into an electrical signal.

[0011] Furthermore, the PCB substrate is in the shape of a long strip, the optical fiber array extends parallel to the length direction of the PCB substrate and is connected to one end of the PCB substrate, the silicon photonic chip is arranged in the middle of the PCB substrate, and the continuous wave laser is distributed on the edge of one end of the PCB substrate corresponding to the optical fiber array.

[0012] Furthermore, the composite waveguide, the transmitting waveguide, and the receiving waveguide are spaced apart in sequence in the width direction of the PCB substrate, the PD elements are spaced apart on a side of the transmitting waveguide away from the optical fiber array, and the receiving waveguide is semi-enclosed on the outside of the transmitting waveguide away from the composite waveguide.

[0013] Furthermore, the composite optical fiber and the composite waveguide are spaced apart in the optical fiber length direction of the optical fiber array, the lens assembly is also disposed between the composite optical fiber and the composite waveguide, and the lens assembly is extended along the width direction of the PCB substrate.

[0014] Furthermore, the composite waveguide, the transmitting waveguide, and the receiving waveguide extend to one side edge of the silicon photonic chip respectively, the composite waveguide forms a first optical interface at one side edge of the silicon photonic chip, the transmitting waveguide forms a second optical interface at one side edge of the silicon photonic chip, and the receiving waveguide forms a third optical interface at one side edge of the silicon photonic chip;

[0015] The lens assembly includes a first lens, a second lens, and a third lens spaced apart along one side edge of the silicon photonic chip, wherein the first lens is located on an optical path between the composite waveguide and the first optical interface, the second lens is located on an optical path between the transmitting waveguide and the second optical interface, and the third lens is located on an optical path between the receiving waveguide and the third optical interface.

[0016] Further, the path of the transmitting waveguide is L-shaped, comprising a first section spaced apart and parallel to the composite waveguide, and a second section vertically connected to the first section, the second section is optically connected to the demultiplexer, and the first optical interface is provided at an end of the first section away from the second section;

[0017] An MPD element is also integrated inside the silicon photonic chip. The MPD element is arranged on a side of the first section away from the first optical interface. A monitoring waveguide is connected between the first section and the MPD element, and the monitoring waveguide is arranged to avoid the second section.

[0018] Furthermore, an optical fiber alignment structure is provided at the end of the composite optical fiber close to the lens assembly and at the end of the optical fiber array close to the lens assembly. The optical fiber alignment structure includes a bottom plate and a cover plate. The bottom plate is fixedly connected to the upper side of the PCB substrate. A plurality of guide grooves are provided on the upper surface of the bottom plate. The plurality of guide grooves are spaced apart in the width direction of the PCB substrate.

[0019] The guide groove extends parallel to the length direction of the optical fiber of the optical fiber array, and the guide groove is positioned and matched with the bare fiber of the composite optical fiber and the bare fiber of the optical fiber array; the cover plate is bonded to the upper side of the base plate to fix the bare fiber of the composite optical fiber and the bare fiber of the optical fiber array.

[0020] Furthermore, the ratio of the number of the composite waveguides to the number of the transmitting waveguides is any one of 1:2, 1:3, 1:4, 1:5, and 1:6, and the number of the receiving waveguides is equal to the number of the transmitting waveguides.

[0021] Furthermore, a driver and a cross-group amplifier are provided on the upper side of the silicon photonic chip, and a DSP component is also installed on the PCB substrate. The PCB substrate is electrically connected to the driver, the cross-group amplifier, and the DSP component respectively.

[0022] Furthermore, the silicon photonic chip is provided with through silicon vias along the thickness direction thereof, and the through silicon vias correspond to the driver and the cross-group amplifier respectively. The through silicon vias are also filled with conductors, and the conductors are electrically connected between the driver and the PCB substrate, and between the cross-group amplifier and the PCB substrate.

[0023] Compared with the prior art, the silicon photonic module of the high-efficiency light source of the present invention has the following beneficial effects: the silicon photonic module of the high-efficiency light source adopts the design form of PCB substrate, silicon photonic chip, continuous wave laser, optical fiber array and lens assembly, the silicon photonic chip, continuous wave laser, optical fiber array and lens assembly are all installed on the PCB substrate, and the silicon photonic chip and continuous wave laser are electrically connected to the PCB substrate respectively. The PCB substrate provides an installation basis for the silicon photonic chip, continuous wave laser, optical fiber array and lens assembly, the silicon photonic chip is used to process the composite optical signal emitted by the continuous wave laser, and send the processed optical signal to the optical fiber array; and the silicon photonic chip is also used to receive the optical signal sent by the optical fiber array, and convert the optical signal into an electrical signal, and finally transmit the data signal to the outside through the circuit of the PCB substrate.

[0024] Among them, the continuous wave laser is arranged at a position on the PCB substrate far away from the silicon photonic chip, which effectively extends the distance between the continuous wave laser and the silicon photonic chip, reduces the thermal impact of the heat generated by the laser working on the silicon photonic chip, and prevents the optical module from having high temperature. The silicon photonic chip is equipped with a composite waveguide, a transmitting waveguide and a receiving waveguide. The composite waveguide is optically connected to the transmitting waveguide, and the receiving waveguide is spaced apart from the transmitting waveguide. A composite optical fiber is connected between the continuous wave laser and the composite waveguide, and the continuous wave laser is used to continuously send a composite optical signal to the composite optical fiber. A continuous optical path can be constructed between the continuous wave laser and the silicon photonic chip by using the composite optical fiber and the composite waveguide. The continuous wave laser can continuously generate composite optical signals of different wavelengths in time, and the output efficiency of the optical signal is higher, which avoids multiple laser chips occupying a large area, thereby improving the integration of the optical module.

[0025] In addition, the silicon photonic chip also integrates a demultiplexer, a modulator and a PD element. The demultiplexer is arranged between the composite waveguide and the transmitting waveguide, and the modulator is arranged in the transmitting waveguide. The transmission path of the optical signal is: from the continuous wave laser, the composite optical fiber, the composite waveguide, the transmitting waveguide to the optical fiber array in sequence. The composite optical signal in the composite waveguide is separated and processed by the demultiplexer. The demultiplexer adopts the wavelength division multiplexing (WDM) technology, which can separate the multiple optical signals of different wavelengths that are combined into separate optical signals, achieving the purpose of high-efficiency and high-capacity data transmission. Then, the optical signal is modulated by the modulator so that the intensity, frequency, phase, polarization state and other characteristics of the optical signal meet the output requirements, ensuring that it can be smoothly sent to the optical fiber array through the transmitting waveguide.

[0026] In addition, the PD element is optically connected to the receiving waveguide to convert the received optical signal into an electrical signal. The receiving path of the optical signal is: from the optical fiber array, the receiving waveguide to the PD element in sequence. The PD element converts the received optical signal into an electrical signal through the photoelectric effect, and further processes the electrical signal to obtain the corresponding data signal. The optical fiber array and the transmitting waveguide and the receiving waveguide are spaced apart along the length of the optical fiber, and the lens assembly is arranged between the optical fiber array and the transmitting waveguide and the receiving waveguide. The optical signal can be accurately coupled and transmitted between the optical fiber and the waveguide through the lens assembly, ensuring the low loss and reliability of the transmission of the optical signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a three-dimensional schematic diagram of a silicon photonic module of a high-efficiency light source in an embodiment of the present invention;

[0028] Figure 2 is a schematic diagram of the internal optical path of a silicon photonic chip in an embodiment of the present invention;

[0029] Figure 3 is a schematic cross-sectional view of the alignment structure of the silicon photonic chip and the optical fiber in an embodiment of the present invention;

[0030] In the figure: 1-PCB substrate, 2-silicon photonic chip, 20-silicon through via, 21-composite waveguide, 22-transmitting waveguide, 221-first section, 222-second section, 223-monitoring waveguide, 23-receiving waveguide, 24-demultiplexer, 25-modulator, 26-PD element, 27-MPD element, 3-continuous wave laser, 4-optical fiber array, 40-composite optical fiber, 5-lens assembly, 6-optical fiber alignment structure, 60-guide groove, 61-bottom plate, 62-cover plate, 7-driver, 8-cross-group amplifier, 9-DSP element. DETAILED DESCRIPTION

[0031] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0032] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like used in the present invention to indicate the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0034] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] like Figures 1 to 3 As shown, a silicon photonic module of a high-efficiency light source according to an embodiment of the present invention comprises a PCB substrate 1, and a silicon photonic chip 2, a continuous wave laser 3, an optical fiber array 4 and a lens assembly 5 mounted on the PCB substrate 1. The silicon photonic chip 2 and the continuous wave laser 3 are electrically connected to the PCB substrate 1 respectively, and the continuous wave laser 3 is arranged on the PCB substrate 1 and away from the silicon photonic chip 2; a composite waveguide 21, an emitting waveguide 22 and a receiving waveguide 23 are arranged inside the silicon photonic chip 2, the composite waveguide 21 is optically connected to the emitting waveguide 22, and the receiving waveguide 23 is spaced apart from the emitting waveguide 22; a composite optical fiber 40 is connected between the continuous wave laser 3 and the composite waveguide 21, and the continuous wave laser 3 is used to continuously emit a composite optical signal to the composite optical fiber 40.

[0036] The silicon photonic chip 2 also integrates a demultiplexer 24, a modulator 25 and a PD element 26. The demultiplexer 24 is arranged between the composite waveguide 21 and the transmitting waveguide 22, and is used to separate the composite optical signal into multiple separate optical signals; the modulator 25 is arranged in the transmitting waveguide 22 to modulate and change the characteristics of the optical signal; the optical fiber array 4 and the transmitting waveguide 22 and the receiving waveguide 23 are spaced apart along the length direction of the optical fiber, and the lens assembly 5 is arranged between the optical fiber array 4 and the transmitting waveguide 22 and the receiving waveguide 23; the PD element 26 is optically connected to the receiving waveguide 23, and is used to convert the received optical signal into an electrical signal.

[0037] The silicon photonic module of the high-efficiency light source adopts the design form of PCB substrate 1, silicon photonic chip 2, continuous wave laser 3, optical fiber array 4 and lens assembly 5. The silicon photonic chip 2, continuous wave laser 3, optical fiber array 4 and lens assembly 5 are all installed on the PCB substrate 1, and the silicon photonic chip 2 and continuous wave laser 3 are electrically connected to the PCB substrate 1 respectively. The PCB substrate 1 provides an installation basis for the silicon photonic chip 2, continuous wave laser 3, optical fiber array 4 and lens assembly 5. The silicon photonic chip 2 is used to process the composite optical signal emitted by the continuous wave laser 3 and send the processed optical signal to the optical fiber array 4; and the silicon photonic chip 2 is also used to receive the optical signal sent by the optical fiber array 4, and convert the optical signal into an electrical signal, and finally transmit the data signal to the outside through the circuit of the PCB substrate 1.

[0038] Among them, the continuous wave laser 3 is arranged at a position far away from the silicon photonic chip 2 on the PCB substrate 1, which effectively extends the distance between the continuous wave laser 3 and the silicon photonic chip 2, reduces the thermal impact of the heat generated by the laser working on the silicon photonic chip 2, and prevents the optical module from having a high temperature. The silicon photonic chip 2 is provided with a composite waveguide 21, a transmitting waveguide 22 and a receiving waveguide 23. The composite waveguide 21 is optically connected to the transmitting waveguide 22, and the receiving waveguide 23 is spaced apart from the transmitting waveguide 22; a composite optical fiber 40 is connected between the continuous wave laser 3 and the composite waveguide 21, and the continuous wave laser 3 is used to continuously send a composite optical signal to the composite optical fiber 40. A continuous optical path can be constructed between the continuous wave laser 3 and the silicon photonic chip 2 by using the composite optical fiber 40 and the composite waveguide 21. The continuous wave laser 3 can continuously generate composite optical signals of different wavelengths in time, and the output efficiency of the optical signal is higher, which avoids multiple laser chips from occupying a large area, thereby improving the integration of the optical module.

[0039] In addition, the silicon photonic chip 2 is also integrated with a demultiplexer 24, a modulator 25 and a PD element 26. The demultiplexer 24 is arranged between the composite waveguide 21 and the transmitting waveguide 22, and the modulator 25 is arranged in the transmitting waveguide 22. The transmission path of the optical signal is: from the continuous wave laser 3, the composite optical fiber 40, the composite waveguide 21, the transmitting waveguide 22 to the optical fiber array 4 in sequence. The composite optical signal in the composite waveguide 21 is separated and processed by the demultiplexer 24. The demultiplexer 24 adopts the wavelength division multiplexing (WDM) technology, which can separate the multiple optical signals of different wavelengths that are combined into separate optical signals, thereby achieving the purpose of high-efficiency and high-capacity data transmission. Then, the optical signal is modulated by the modulator 25 so that the intensity, frequency, phase, polarization state and other characteristics of the optical signal meet the output requirements, ensuring that it can be smoothly sent to the optical fiber array 4 through the transmitting waveguide 22.

[0040] In addition, the PD element 26 is optically connected to the receiving waveguide 23, and is used to convert the received optical signal into an electrical signal. The receiving path of the optical signal is: from the optical fiber array 4, the receiving waveguide 23 to the PD element 26 in sequence. The PD element 26 converts the received optical signal into an electrical signal through the photoelectric effect, and further processes the electrical signal to obtain a corresponding data signal. The optical fiber array 4 and the transmitting waveguide 22 and the receiving waveguide 23 are spaced apart along the length direction of the optical fiber, and the lens assembly 5 is arranged between the optical fiber array 4 and the transmitting waveguide 22 and the receiving waveguide 23. The optical signal can be accurately coupled and transmitted between the optical fiber and the waveguide through the lens assembly 5, thereby ensuring low transmission loss and reliability of the optical signal.

[0041] In this embodiment, the PCB substrate 1 is in the shape of a long strip, the optical fiber array 4 extends parallel to the length direction of the PCB substrate 1 and is connected to one end of the PCB substrate 1, the silicon photonic chip 2 is arranged in the middle of the PCB substrate 1, and the continuous wave laser 3 is distributed at one end edge of the PCB substrate 1 corresponding to the optical fiber array 4. The silicon photonic chip 2 is in the middle of the PCB substrate 1, and the continuous wave laser 3 is at one end of the length of the PCB substrate 1, so that the continuous wave laser 3 and the silicon photonic chip 2 are distributed at a larger straight-line distance on the PCB substrate 1, ensuring the high integration of the optical module and avoiding the thermal influence caused by the laser.

[0042] It should be noted that the composite waveguide 21, the transmitting waveguide 22, and the receiving waveguide 23 are sequentially spaced apart in the width direction of the PCB substrate 1, the PD element 26 is spaced apart on the side of the transmitting waveguide 22 away from the optical fiber array 4, and the receiving waveguide 23 is semi-enclosed on the outer side of the transmitting waveguide 22 and away from the composite waveguide 21. It is precisely because the receiving waveguide 23 is semi-enclosed relative to the transmitting waveguide 22 and the composite waveguide 21 in the silicon photonic chip 2 that the purpose of arranging multiple groups of waveguides with high density and without mutual interference is achieved.

[0043] Furthermore, the composite optical fiber 40 and the composite waveguide 21 are spaced apart in the optical fiber length direction of the optical fiber array 4, and the lens assembly 5 is also disposed between the composite optical fiber 40 and the composite waveguide 21, and the lens assembly 5 is extended along the width direction of the PCB substrate 1. The lens assembly 5 enables the composite optical signal to be accurately coupled and transmitted between the composite optical fiber 40 and the composite waveguide 21, thereby ensuring low transmission loss and reliability of the composite optical signal.

[0044] Among them, the composite waveguide 21, the transmitting waveguide 22, and the receiving waveguide 23 extend to one side edge of the silicon photonic chip 2 respectively, the composite waveguide 21 forms a first optical interface on one side edge of the silicon photonic chip 2, the transmitting waveguide 22 forms a second optical interface on one side edge of the silicon photonic chip 2, and the receiving waveguide 23 forms a third optical interface on one side edge of the silicon photonic chip 2; the lens assembly 5 includes a first lens, a second lens, and a third lens spaced apart along one side edge of the silicon photonic chip 2, the first lens is on the optical path between the composite waveguide 21 and the first optical interface, the second lens is on the optical path between the transmitting waveguide 22 and the second optical interface, and the third lens is on the optical path between the receiving waveguide 23 and the third optical interface.

[0045] As a further preferred solution, the path of the transmitting waveguide 22 is L-shaped, such as Figure 2 As shown, it includes a first section 221 that is parallel and spaced apart from the composite waveguide 21, and a second section 222 that is vertically connected to the first section 221. The second section 222 is optically connected to the demultiplexer 24, and the first optical interface is arranged at the end of the first section 221 away from the second section 222. The silicon photonic chip 2 also integrates an MPD element 27, which is arranged on the side of the first section 221 away from the first optical interface. A monitoring waveguide 223 is also connected between the first section 221 and the MPD element 27, and the monitoring waveguide 223 is arranged to avoid the second section 222. The demultiplexer 24 separates and processes the optical signal between the composite waveguide 21 and the second section 222. The MPD element 27 can monitor the optical signal in the first section 221 through the monitoring waveguide 223 and feedback information, so that the power and quality of the output optical signal meet the requirements, so as to ensure the stability of the modulated output optical signal.

[0046] In the present embodiment, a fiber alignment structure 6 is further provided at the end of the composite optical fiber 40 near the lens assembly 5 and the end of the optical fiber array 4 near the lens assembly 5. The fiber alignment structure 6 includes a base plate 61 and a cover plate 62. The base plate 61 is fixedly connected to the upper side of the PCB substrate 1. A plurality of guide grooves 60 are provided on the upper surface of the base plate 61. The plurality of guide grooves 60 are spaced apart in the width direction of the PCB substrate 1. The guide grooves 60 extend parallel to the optical fiber length direction of the optical fiber array 4. The guide grooves 60 are positioned and matched with the bare fibers of the composite optical fiber 40 and the bare fibers of the optical fiber array 4. The cover plate 62 is bonded and connected to the upper side of the base plate 61 to fix the bare fibers of the composite optical fiber 40 and the bare fibers of the optical fiber array 4.

[0047] Specifically, the guide groove 60 is a V-shaped groove, and the groove walls on both sides of the guide groove 60 can guide and position the bare fiber, ensuring that the bare fiber of the composite optical fiber 40 and the bare fiber of the optical fiber array 4 can be accurately fixed in the optical fiber alignment structure 6, thereby achieving the purpose of aligning the composite optical fiber 40 with the first lens and the composite waveguide 21, aligning the optical fiber array 4 with the second lens and the transmitting waveguide 22, and aligning the optical fiber array 4 with the third lens and the receiving waveguide 23.

[0048] In this embodiment, the number of the composite waveguides 21 is two, the number of the transmitting waveguides 22 is eight, the ratio of the two is 1:4, and the number of the receiving waveguides 23 is equal to the number of the transmitting waveguides 22. In order to meet different usage requirements, the ratio of the number of composite waveguides to the number of transmitting waveguides can also be any one of 1:2, 1:3, 1:5, and 1:6 to adapt to the actual situation of different numbers of channels.

[0049] In addition, a driver 7 and a cross-group amplifier 8 are arranged on the upper side of the silicon photonic chip 2, and a DSP component 9 is also installed on the PCB substrate 1. The PCB substrate 1 is electrically connected to the driver 7, the cross-group amplifier 8, and the DSP component 9 respectively. As a further preferred solution, a silicon through-hole via 20 is opened through the silicon photonic chip 2 along its thickness direction. Figure 3 As shown, the through silicon vias 20 correspond to the driver 7 and the cross-group amplifier 8 respectively, and the through silicon vias 20 are also filled with conductors, which are electrically connected between the driver 7 and the PCB substrate 1, and between the cross-group amplifier 8 and the PCB substrate 1. The through silicon vias 20 and the internal waveguides of the silicon photonic chip 2 are staggered. The driver 7 and the cross-group amplifier 8 can pass through the silicon photonic chip 2 and form an electrical connection with the PCB substrate 1 through the through silicon vias 20 and the conductors, thereby reducing the bearing area required for the PCB substrate 1, thereby improving the integration of the silicon photonic module.

[0050] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A silicon photonic module with high efficiency light source, characterized in that: It includes a PCB substrate, and a silicon photonic chip, a continuous wave laser, an optical fiber array and a lens assembly mounted on the PCB substrate, wherein the silicon photonic chip and the continuous wave laser are electrically connected to the PCB substrate respectively, and the continuous wave laser is arranged on the PCB substrate and away from the silicon photonic chip; A composite waveguide, a transmitting waveguide and a receiving waveguide are arranged inside the silicon photonic chip, the composite waveguide is optically connected to the transmitting waveguide, and the receiving waveguide and the transmitting waveguide are spaced apart; a composite optical fiber is connected between the continuous wave laser and the composite waveguide, and the continuous wave laser is used to continuously emit a composite optical signal to the composite optical fiber; The silicon photonic chip further integrates a demultiplexer, a modulator and a PD element. The demultiplexer is arranged between the composite waveguide and the transmitting waveguide, and is used to separate the composite optical signal into a plurality of separate optical signals. The modulator is arranged in the transmitting waveguide and is used to modulate and change the characteristics of the optical signal. The optical fiber array and the transmitting waveguide and the receiving waveguide are spaced apart along the length direction of the optical fiber, and the lens assembly is arranged between the optical fiber array and the transmitting waveguide and the receiving waveguide; the PD element is optically connected to the receiving waveguide for converting the received optical signal into an electrical signal.

2. The silicon photonic module of the high-efficiency light source according to claim 1 is characterized in that: The PCB substrate is in the shape of a long strip, the optical fiber array extends parallel to the length direction of the PCB substrate and is connected to one end of the PCB substrate, the silicon photonic chip is arranged in the middle of the PCB substrate, and the continuous wave laser is distributed on the edge of one end of the PCB substrate corresponding to the optical fiber array.

3. The silicon photonic module of the high-efficiency light source according to claim 2 is characterized in that: The composite waveguide, the transmitting waveguide, and the receiving waveguide are sequentially spaced apart in the width direction of the PCB substrate, the PD elements are spaced apart on a side of the transmitting waveguide away from the optical fiber array, and the receiving waveguide is semi-enclosed on the outer side of the transmitting waveguide away from the composite waveguide.

4. The silicon photonic module of the high-efficiency light source according to claim 1 is characterized in that: The composite optical fiber and the composite waveguide are spaced apart in the optical fiber length direction of the optical fiber array, the lens assembly is also arranged between the composite optical fiber and the composite waveguide, and the lens assembly is extended along the width direction of the PCB substrate.

5. The silicon photonic module of the high-efficiency light source according to claim 4 is characterized in that: The composite waveguide, the transmitting waveguide, and the receiving waveguide extend to one side edge of the silicon photonic chip respectively, the composite waveguide forms a first optical interface at one side edge of the silicon photonic chip, the transmitting waveguide forms a second optical interface at one side edge of the silicon photonic chip, and the receiving waveguide forms a third optical interface at one side edge of the silicon photonic chip; The lens assembly includes a first lens, a second lens, and a third lens spaced apart along one side edge of the silicon photonic chip, wherein the first lens is located on an optical path between the composite waveguide and the first optical interface, the second lens is located on an optical path between the transmitting waveguide and the second optical interface, and the third lens is located on an optical path between the receiving waveguide and the third optical interface.

6. The silicon photonic module of the high-efficiency light source according to claim 5 is characterized in that: The path of the transmitting waveguide is L-shaped, comprising a first section spaced apart and parallel to the composite waveguide, and a second section vertically connected to the first section, the second section being optically connected to the demultiplexer, and the first optical interface being provided at an end of the first section away from the second section; An MPD element is also integrated inside the silicon photonic chip. The MPD element is arranged on a side of the first section away from the first optical interface. A monitoring waveguide is connected between the first section and the MPD element, and the monitoring waveguide is arranged to avoid the second section.

7. The silicon photonic module of the high-efficiency light source according to claim 1 is characterized in that: An optical fiber alignment structure is also provided at the end of the composite optical fiber close to the lens assembly and the end of the optical fiber array close to the lens assembly. The optical fiber alignment structure includes a bottom plate and a cover plate. The bottom plate is fixedly connected to the upper side of the PCB substrate. A plurality of guide grooves are provided on the upper surface of the bottom plate. The plurality of guide grooves are spaced apart in the width direction of the PCB substrate. The guide groove extends parallel to the length direction of the optical fiber of the optical fiber array, and the guide groove is positioned and matched with the bare fiber of the composite optical fiber and the bare fiber of the optical fiber array; the cover plate is bonded to the upper side of the base plate to fix the bare fiber of the composite optical fiber and the bare fiber of the optical fiber array.

8. The silicon photonic module of the high-efficiency light source according to claim 1 is characterized in that: The ratio of the number of the composite waveguides to the number of the transmitting waveguides is any one of 1:2, 1:3, 1:4, 1:5, and 1:6, and the number of the receiving waveguides is equal to the number of the transmitting waveguides.

9. The silicon photonic module of the high-efficiency light source according to claim 1, characterized in that: A driver and a cross-group amplifier are arranged on the upper side of the silicon photonic chip, and a DSP component is also installed on the PCB substrate. The PCB substrate is electrically connected to the driver, the cross-group amplifier, and the DSP component respectively.

10. The silicon photonic module of the high-efficiency light source according to claim 9, characterized in that: The silicon photonic chip is provided with through silicon vias along its thickness direction, and the through silicon vias correspond to the driver and the cross-group amplifier respectively. The through silicon vias are also filled with conductors, and the conductors are electrically connected between the driver and the PCB substrate, and between the cross-group amplifier and the PCB substrate.

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