Liquid cooling server and data center
By using liquid-cooled server technology in high-power servers, using coolant to liquid-cooled GPUs, the problem that air-cooled cooling method is difficult to meet the cooling requirements of high-power servers is solved, and higher computing performance and lower vibration are achieved, which extends the service life of the components and improves the reliability of the entire machine.
Patent Information
- Application Number
- CN202411688579.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-03-14
AI Technical Summary
In the prior art, air-cooled heat dissipation method is difficult to meet the heat dissipation requirements of high-power servers, resulting in increased vibration and noise and reduced reliability of the entire machine.
Using a liquid-cooled server, the GPU is liquid-cooled and cooled through the diversity liquid components and the cold plate in the GPU components, which improves the heat dissipation efficiency, and sets up more GPU components in the limited space of the chassis.
It achieves higher computing performance and lower vibration, extends the service life of the components and improves the reliability of the entire machine.
Smart Images

Figure CN119620836A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of servers, and in particular to a liquid cooling server and a data center. Background Art
[0002] The advent of the era of big data centers has led to a surge in demand for AI GPU servers in all walks of life. Faced with a variety of training and pushing scenarios, there is a pursuit of higher computing performance. The heat and power consumption of higher-performance chips continue to rise, posing a huge challenge to the heat dissipation of components and AI GPU servers.
[0003] In the prior art, air cooling is used to dissipate heat for servers. High-power servers require a larger chassis to provide more heat dissipation space, and then stack fans to increase air volume and pressure. This will cause huge vibration and noise, reducing the reliability of the entire machine, especially the reliability of components such as mechanical hard drives.
[0004] Therefore, air cooling can no longer meet the heat dissipation requirements of high-power servers. Summary of the invention
[0005] The object of the present invention is to provide a liquid cooling server to solve the technical problem that the air cooling heat dissipation method in the prior art is difficult to meet the heat dissipation requirements of high power consumption servers.
[0006] The liquid cooling server provided by the present invention comprises a chassis, a distribution liquid component and a GPU component;
[0007] The liquid distribution assembly includes a plurality of liquid inlet interfaces and a plurality of liquid outlet interfaces; the plurality of liquid inlet interfaces and the plurality of liquid outlet interfaces are all arranged on the chassis;
[0008] The GPU assembly includes a first cold plate, an inlet of the first cold plate is connected to the liquid inlet interface, and an outlet of the first cold plate is connected to the liquid outlet interface.
[0009] Furthermore, the liquid distribution and collection assembly includes a liquid distribution block, a liquid collection block, a liquid inlet channel and a liquid outlet channel;
[0010] The liquid separation block is communicated with the liquid inlet channel, and the liquid collection block is communicated with the liquid outlet channel; a plurality of the liquid inlet interfaces are arranged on the liquid inlet channel, and a plurality of the liquid outlet interfaces are arranged on the liquid outlet channel.
[0011] Furthermore, an extension direction of the liquid inlet channel is parallel to an extension direction of the liquid outlet channel, and a separation groove is provided between the liquid inlet channel and the liquid outlet channel.
[0012] Furthermore, the liquid cooling server also includes a second cold plate, an inlet of the second cold plate is connected to the liquid inlet interface, and an outlet of the second cold plate is connected to the liquid outlet interface.
[0013] Furthermore, the inlet of the first cold plate is detachably connected to the liquid inlet interface, and the outlet of the first cold plate is detachably connected to the liquid outlet interface;
[0014] The inlet of the second cold plate is detachably connected to the liquid inlet interface, and the outlet of the second cold plate is detachably connected to the liquid outlet interface.
[0015] Furthermore, a damper is provided in the liquid distribution assembly.
[0016] Furthermore, a liquid leakage detection rope is wound around the pipelines of the liquid cooling server and the connections of various components.
[0017] Furthermore, the liquid cooling server also includes a water receiving tray.
[0018] The bottom end of the liquid leakage detection rope is arranged above the water receiving tray. The bottom of the water receiving tray is provided with a guide groove, and the bottom wall of the guide groove is inclined with respect to the horizontal plane.
[0019] Furthermore, the chassis is provided with a fan wall.
[0020] The present invention also aims to provide a data center, including the liquid cooling server provided by the present invention.
[0021] The liquid cooling server provided by the present invention comprises a chassis, a liquid distribution component and a GPU component; the liquid distribution component comprises a plurality of liquid inlet interfaces and a plurality of liquid outlet interfaces; the plurality of liquid inlet interfaces and the plurality of liquid outlet interfaces are all arranged on the chassis; the GPU component comprises a first cold plate, the inlet of the first cold plate is connected to the liquid inlet interface, and the outlet of the first cold plate is connected to the liquid outlet interface. Cooling liquid flows into the first cold plate, thereby performing liquid cooling on the GPU. The heat dissipation efficiency of liquid cooling is higher than that of air cooling. More GPU components can be arranged in the limited space of the preset chassis, so that the computing power of a single liquid cooling server is enhanced, and the high-power heat dissipation problem caused by the increase in the number of GPU components is solved, so that the power consumption of a single liquid cooling server is improved, and the vibration problem caused by the fan in the air cooling heat dissipation is reduced, so that each component in the liquid cooling server can stably operate at the optimal working temperature, extend the service life, and improve the reliability of the liquid cooling server. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0023] Figure 1 is a schematic diagram of the structure of a liquid cooling server provided by an embodiment of the present invention;
[0024] Figure 2 It is a schematic diagram of the structure of a liquid distribution assembly of a liquid cooling server provided in an embodiment of the present invention.
[0025] Icons: 1-second cold plate; 2-chassis; 3-first cold plate; 4-liquid outlet pipeline; 5-liquid guide tube; 6-liquid inlet interface; 7-liquid inlet pipeline; 8-liquid separator block; 9-liquid outlet interface; 10-dividing groove; 11-liquid inlet channel; 12-liquid outlet channel; 13-liquid collecting block. DETAILED DESCRIPTION
[0026] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0027] The present invention provides a liquid cooling server and a data center. A plurality of embodiments are given below to describe the liquid cooling server and the data center provided by the present invention in detail.
[0028] Example 1
[0029] The liquid cooling server provided in this embodiment is as follows: Figure 1 to Figure 2 As shown, it includes a chassis 2, a liquid distribution assembly and a GPU assembly; the liquid distribution assembly includes multiple liquid inlet interfaces 6 and multiple liquid outlet interfaces 9; the multiple liquid inlet interfaces 6 and the multiple liquid outlet interfaces 9 are all arranged on the chassis 2; the GPU assembly includes a first cold plate 3, the inlet of the first cold plate 3 is connected to the liquid inlet interface 6, and the outlet of the first cold plate 3 is connected to the liquid outlet interface 9.
[0030] Cooling liquid flows into the first cold plate 3, thereby performing liquid cooling on the GPU. The heat dissipation efficiency of liquid cooling is higher than that of air cooling. In the limited space of the preset chassis 2, a larger number of GPU components can be arranged, so that the computing power of a single liquid-cooled server is enhanced, and the high-power heat dissipation problem caused by the increase in the number of GPU components is solved, so that the power consumption of a single liquid-cooled server is improved, and the vibration problem caused by the fan in the air cooling is reduced, so that each component in the liquid-cooled server can stably operate at the optimal working temperature, extend the service life, and improve the reliability of the liquid-cooled server.
[0031] The liquid distribution assembly includes a plurality of liquid inlet interfaces 6 and a plurality of liquid outlet interfaces 9, and the plurality of liquid inlet interfaces 6 and the plurality of liquid outlet interfaces 9 are arranged in a one-to-one correspondence, and each group of liquid inlet interfaces 6 and the plurality of liquid outlet interfaces 9 arranged in a one-to-one correspondence can be connected to a heat source. Each group of liquid inlet interfaces 6 and the plurality of liquid outlet interfaces 9 arranged in a one-to-one correspondence can be connected to a first cold plate 3, and can also be connected to other heat sources for heat dissipation of other heat sources, and other heat sources can include any suitable heat sources such as CPU, DIMM, VR and hard disk.
[0032] The traditional double-width GPU card uses the liquid cooling server provided by this embodiment to dissipate heat from the PCB bare board using the first cold plate 3 instead of air cooling, so that the GPU card can be made into a single-width size. Compared with 8 double-width GPUs, 16 double-width GPUs with the same performance can be supported, doubling the computing power. In view of more topological architectures in the future, up to 19 single-width GPUs can be supported for interconnection according to the structural form.
[0033] The GPU assembly includes a GPU bare board, a first cold plate 3 and a GPU tray. The GPU bare board and the first cold plate 3 are both arranged on the GPU tray, and the GPU bare board and the first cold plate 3 are fixed together by the GPU tray. The GPU tray is provided with a blind-insertion quick-connect locking buckle, and the blind-insertion quick-connect locking buckle is fixed to the GPU rear window in the system. The GPU assembly is arranged in the chassis 2.
[0034] Furthermore, the liquid separation and collection component includes a liquid separation block 8, a liquid collection block 13, a liquid inlet channel 11 and a liquid outlet channel 12; the liquid separation block 8 is connected to the liquid inlet channel 11, and the liquid collection block 13 is connected to the liquid outlet channel 12; a plurality of liquid inlet interfaces 6 are arranged on the liquid inlet channel 11, and a plurality of liquid outlet interfaces 9 are arranged on the liquid outlet channel 12.
[0035] The liquid separation block 8 , the liquid collection block 13 , the liquid inlet channel 11 and the liquid outlet channel 12 are all arranged in the chassis 2 .
[0036] Specifically, the liquid separator block 8 is provided with a liquid inlet pipeline 7, the coolant enters the liquid separator block 8 through the liquid inlet pipeline 7, and then enters the liquid inlet channel 11 through the liquid separator block 8, a plurality of liquid inlet interfaces 6 are evenly spaced along the extension direction of the liquid inlet channel 11, the coolant in the liquid inlet channel 11 flows into the first cold plate 3 through the liquid inlet interface 6, the coolant flowing out of the first cold plate 3 flows into the liquid outlet channel 12 through the liquid outlet interface 9, a plurality of liquid outlet interfaces 9 are evenly spaced along the extension direction of the liquid outlet channel 12, the coolant in the liquid outlet channel 12 flows into the liquid collecting block 13, the liquid collecting block 13 is provided with a liquid outlet pipeline 4, and the coolant in the liquid collecting block 13 flows out of the chassis 2 through the liquid outlet pipeline 4. Both the liquid inlet pipeline 7 and the liquid outlet pipeline 4 pass through the outside of the chassis 2.
[0037] The liquid distributing block 8 and the liquid collecting block 13 perform multi-path parallel branch distribution.
[0038] Furthermore, an extension direction of the liquid inlet channel 11 is parallel to an extension direction of the liquid outlet channel 12 , and a separation groove 10 is provided between the liquid inlet channel 11 and the liquid outlet channel 12 .
[0039] Specifically, the extension direction of the liquid inlet channel 11 is arranged parallel to the extension direction of the liquid outlet channel 12, and the liquid inlet channel 11 and the liquid outlet channel 12 are arranged adjacent to each other, but the liquid inlet channel 11 and the liquid outlet channel 12 are not connected. The liquid inlet channel 11 and the liquid outlet channel 12 are separated by the partition groove 10, and the air in the partition groove 10 is sandwiched between the liquid inlet channel 11 and the liquid outlet channel 12 to isolate heat from cold, reduce mixing of heat and cold, and effectively avoid wasting system cooling capacity.
[0040] Furthermore, the liquid cooling server further comprises a second cold plate 1 , an inlet of the second cold plate 1 is connected to the liquid inlet interface 6 , and an outlet of the second cold plate 1 is connected to the liquid outlet interface 9 .
[0041] The second cold plate 1 is used to cool the CPU, and the CPU bare board is attached to the second cold plate 1 .
[0042] The first cold plate 3 and the second cold plate 1 are both arranged in the chassis 2. The first cold plate 3 is arranged in the chassis 2 on one side of the liquid inlet channel 11 and the liquid outlet channel 12. Multiple first cold plates 3 are arranged in the chassis 2 in sequence along the extension direction of the liquid inlet channel 11. The second cold plate 1 is arranged in the chassis 2 on the other side of the liquid inlet channel 11 and the liquid outlet channel 12.
[0043] The liquid inlet interface 6 connected to the inlet of the second cold plate 1 is arranged on the liquid separation block 8 , and the liquid outlet interface 9 connected to the outlet of the second cold plate 1 is arranged on the liquid collection block 13 .
[0044] The coolant flows into the liquid inlet through the liquid inlet pipeline 7 , and then flows into the liquid inlet interface 6 to enter the second cold plate 1 . The coolant flowing out of the second cold plate 1 flows into the liquid collecting block 13 through the liquid outlet interface 9 , and then flows out of the chassis 2 through the liquid outlet pipeline 4 .
[0045] Furthermore, the inlet of the first cold plate 3 is detachably connected to the liquid inlet interface 6, and the outlet of the first cold plate 3 is detachably connected to the liquid outlet interface 9; the inlet of the second cold plate 1 is detachably connected to the liquid inlet interface 6, and the outlet of the second cold plate 1 is detachably connected to the liquid outlet interface 9.
[0046] The detachable connection may be a threaded connection, or a snap-fit connection or any other suitable manner, which enables flexible configuration of the heat source and facilitates assembly and disassembly of the first cold plate 3 and the second cold plate 1 .
[0047] During actual product use, the heat source (such as the second cold plate 1) and the liquid inlet interface 6 and the liquid outlet interface 9 adopt drip-free hot-swappable quick-connects, which can be configured on demand and hot-swapped through quick connections. They are installed when in use and used as plugs when not in use.
[0048] The first cold plate 3 is connected to the liquid inlet interface 6 and the liquid outlet interface 9 by blind plug-in quick connection, and manual plug-in and pull-out are not required, so assembly and maintenance are more convenient.
[0049] Furthermore, a damper is provided in the liquid distribution assembly.
[0050] Multiple heat sources are connected in parallel on the liquid distribution component. The multi-way parallel system faces the problem of flow distribution uniformity under different power consumption conditions. A damper is provided in the liquid distribution component. The damper is used to change the flow resistance of the flow path between each group of liquid inlet channels 11 and liquid outlet channels 12 to adjust the flow and achieve the heat dissipation conditions required by different power components.
[0051] Furthermore, a leakage detection rope is wound around the pipelines of the liquid cooling server and the connections of various components.
[0052] The pipelines of the liquid cooling server include a liquid inlet pipeline 7, a liquid outlet pipeline 4, a pipeline connecting the liquid separation block 8 and the second cold plate 1, a pipeline connecting the second cold plate 1 and the liquid collecting block 13, and other pipelines for the coolant to flow through.
[0053] The connections of the various components include the connection between the liquid inlet interface 6 and the first cold plate 3, the connection between the liquid outlet interface 9 and the first cold plate 3, the connection between the pipeline and the second cold plate 1, the connection between the pipeline and the liquid separation block 8, the connection between the pipeline and the second cold plate 1, the connection between the pipeline and the liquid collecting block 13, the connection between the liquid inlet pipeline 7 and the liquid separation block 8, the connection between the liquid outlet pipeline 4 and the liquid collecting block 13, and other connections of various components through which the coolant flows in the liquid-cooled server.
[0054] The pipes of the liquid-cooled server and the joints of each component are wrapped with a leakage detection rope, which is used for leakage alarm. If there is leakage in the pipes of the liquid-cooled server and the joints of each component, the liquid at the corresponding position will make the leakage detection rope wet, prompting the operation and maintenance personnel to handle it.
[0055] Furthermore, the liquid cooling server also includes a water collecting tray, the bottom end of the leakage detection rope is arranged above the water collecting tray, a guide groove is arranged at the bottom of the water collecting tray, the bottom wall of the guide groove is inclined to the horizontal plane, and a leakage rope is arranged at the bottom of the guide groove.
[0056] As the running time increases, if the operation and maintenance personnel do not arrive in time, such as the system does not shut down, the liquid in the leakage detection rope can flow into the water receiving tray through the bottom end of the leakage detection rope. The water receiving tray is arranged in the chassis 2. After the liquid flows into the water receiving tray, it will gather in the guide groove. A leakage rope is laid at the bottom of the guide groove. The guide groove is provided with a liquid guide pipe 5. One end of the liquid guide pipe 5 is connected to the guide groove, and the other end of the liquid guide pipe 5 passes through the outside of the chassis 2, so that the liquid in the guide groove flows to the outside of the chassis 2 to protect the liquid-cooled server.
[0057] Multi-level leakage monitoring and risk avoidance are carried out through multiple components such as leakage detection ropes and water collection trays.
[0058] Furthermore, the chassis 2 is provided with a fan wall.
[0059] The fan wall allows liquid-cooled servers to also be air-cooled, thereby sharing air cooling and liquid cooling.
[0060] The liquid cooling strategy sets the energy-saving mode and limits the maximum fan speed of the fan wall. At this time, the high-power components (such as GPU and CPU, etc.) in the chassis 2 are cooled by liquid cooling, and the low-power components are cooled by air cooling. The system fan can be adjusted according to the ambient temperature Open Loop linear speed and component PID speed, and the speed can be adjusted on demand in the partition. It can solve the energy-saving problem of high-power density servers. The proportion of heat dissipation using liquid cooling exceeds 80%, which enhances the heat exchange efficiency and greatly reduces the proportion of heat dissipation using air cooling.
[0061] Example 2
[0062] The data center provided in this embodiment includes the liquid-cooled server provided in Embodiment 1. Coolant flows into the first cold plate 3, thereby performing liquid cooling on the GPU. The heat dissipation efficiency of liquid cooling is higher than that of air cooling. In the limited space of the preset chassis 2, a larger number of GPU components can be arranged, so that the computing power of the single-machine liquid-cooled server is enhanced, and the high-power heat dissipation problem caused by the increase in the number of GPU components is solved, so that the power consumption of the single-machine liquid-cooled server is improved, and the vibration problem caused by the fan in the air-cooled heat dissipation is reduced, so that each component in the liquid-cooled server can stably operate at the optimal working temperature, extend the service life, and improve the reliability of the liquid-cooled server.
[0063] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A liquid cooling server, characterized in that: Includes chassis, manifold assembly and GPU assembly; The liquid distribution assembly includes a plurality of liquid inlet interfaces and a plurality of liquid outlet interfaces; the plurality of liquid inlet interfaces and the plurality of liquid outlet interfaces are all arranged on the chassis; The GPU assembly includes a first cold plate, an inlet of the first cold plate is connected to the liquid inlet interface, and an outlet of the first cold plate is connected to the liquid outlet interface.
2. The liquid cooling server according to claim 1, characterized in that: The liquid distribution and collection assembly comprises a liquid distribution block, a liquid collection block, a liquid inlet channel and a liquid outlet channel; The liquid separation block is communicated with the liquid inlet channel, and the liquid collection block is communicated with the liquid outlet channel; a plurality of the liquid inlet interfaces are arranged on the liquid inlet channel, and a plurality of the liquid outlet interfaces are arranged on the liquid outlet channel.
3. The liquid cooling server according to claim 2, characterized in that: The extension direction of the liquid inlet channel is parallel to the extension direction of the liquid outlet channel, and a separation groove is provided between the liquid inlet channel and the liquid outlet channel.
4. The liquid cooling server according to claim 1, characterized in that: The liquid cooling server further includes a second cold plate, an inlet of the second cold plate is connected to the liquid inlet interface, and an outlet of the second cold plate is connected to the liquid outlet interface.
5. The liquid cooling server according to claim 4, characterized in that: The inlet of the first cold plate is detachably connected to the liquid inlet interface, and the outlet of the first cold plate is detachably connected to the liquid outlet interface; The inlet of the second cold plate is detachably connected to the liquid inlet interface, and the outlet of the second cold plate is detachably connected to the liquid outlet interface.
6. The liquid cooling server according to claim 1, characterized in that: A damper is arranged in the liquid distribution component.
7. The liquid cooling server according to any one of claims 1 to 6, characterized in that: The pipelines of the liquid cooling server and the connections of various components are wound with liquid leakage detection ropes.
8. The liquid cooling server according to claim 7, characterized in that: The liquid cooling server also includes a water receiving tray. The bottom end of the liquid leakage detection rope is arranged above the water receiving tray. The bottom of the water receiving tray is provided with a guide groove, and the bottom wall of the guide groove is inclined with respect to the horizontal plane.
9. The liquid cooling server according to claim 1, characterized in that: The chassis is provided with a fan wall.
10. A data center, characterized in that: A liquid cooling server comprising any one of claims 1 to 9.