Semiconductor processing equipment with magnetic suspension rotor and wafer positioning method

Abstract

The invention provides semiconductor processing equipment with a magnetic suspension rotor and a wafer positioning method, and belongs to the technical field of semiconductor equipment, a reflecting plate in the semiconductor processing equipment is provided with a positioning hole, a manipulator is provided with an alignment hole, and the alignment hole corresponds to the positioning hole in position. The manipulator is provided with a bearing area for placing a wafer, the alignment hole is located in the bearing area, the positioning piece is provided with a marking line, and one surface, bearing the wafer, of the manipulator is a bearing surface; during positioning, the alignment hole is located above the positioning hole, the positioning piece penetrates through the alignment hole and the positioning hole, the bearing face of the mechanical arm is flush with the marking line, the size of current is controlled through magnetic suspension, the position of the rotor is finely adjusted, and accurate positioning of the wafer in the cavity is achieved. According to the invention, the manipulator can be quickly positioned in place by an operator, so that the target position of a wafer is positioned, the operation difficulty is reduced, the operation efficiency is remarkably improved, and the positioning accuracy is further improved by controlling the magnitude of current through magnetic suspension to adjust the position of a rotor.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor equipment, and more specifically relates to a semiconductor processing equipment with a magnetic suspension rotor and a wafer positioning method. Background Art

[0002] In the rapid thermal processing (RTP) process, a robot is often used to transfer the wafer from the transfer chamber to the process chamber and place the wafer at the process position. Figure 1 As shown, a film transfer port 12 connected to a transfer chamber is provided on one side of a process chamber 11, a magnetic suspension rotor 13 is provided in the process chamber 11, a support tube 14 is provided above the magnetic suspension rotor 13, the support tube 14 is used to carry an edge ring 15, a support platform 16 is provided on the inner side of the magnetic suspension rotor 13, a reflective plate 17 is provided on the upper surface of the support platform 16, the reflective plate 17 is arranged below the edge ring 15 at intervals and is arranged concentrically with the edge ring 15, a plurality of lifting pins 18 can pass through the support platform 16 and the reflective plate 17 to move up and down, and a magnetic suspension stator 19 is arranged outside the process chamber 11 and surrounds the magnetic suspension rotor 13. During the process, the top of the lifting pin 18 is positioned above the edge ring 15, and the wafer 10 is placed on the robot 20. The robot 20 enters the process chamber 11 through the wafer transfer port 12 and positions the wafer 10 above the plurality of lifting pins 18. The wafer 10 is visually observed to see if it is concentric with the edge ring 15. If it is concentric, the robot 20 places the wafer 10 on the top of the plurality of lifting pins 18. After the robot 20 is removed, the wafer 10 is placed at the center of the edge ring 15 by lowering the lifting pins 18. If it is not concentric, the position of the robot 20 is adjusted until the wafer 10 is observed to be concentric with the edge ring 15. The offset of the center position of the wafer 10 at the edge ring 15 directly affects the process results of the machine. Therefore, it is extremely important to ensure the concentricity of the wafer 10 and the edge ring 15. In the above process, the position of the wafer 10 is determined by visual observation. This positioning method mainly depends on the technical level and proficiency of the operator, is time-consuming and labor-intensive, and has low positioning accuracy. Summary of the invention

[0003] Based on the technical problems existing in the prior art, the present invention provides a semiconductor processing equipment with a magnetically suspended rotor and a wafer positioning method, aiming to solve the problem that the positioning method of determining the wafer position by visual observation in the prior art is time-consuming and labor-intensive, and has low positioning accuracy.

[0004] To achieve the above object, the technical solution adopted by the present invention is: In the first aspect, the present invention provides a semiconductor processing equipment with a magnetic levitation rotor, which includes a wafer positioning assembly, the wafer positioning assembly includes a manipulator, a reflective plate and a positioning piece, the reflective plate is provided with a positioning hole, the manipulator is provided with an alignment hole and the alignment hole corresponds to the position of the positioning hole, the manipulator is provided with a bearing area for placing the wafer, the alignment hole is located in the bearing area, the positioning piece is provided with a marking line, and the side of the manipulator that bears the wafer is the bearing surface; during positioning, the alignment hole is located above the positioning hole, the positioning piece is penetrated through the alignment hole and the positioning hole, and the bearing surface of the manipulator is flush with the marking line.

[0005] Optionally, the positioning hole is located at the center of the reflector, and the alignment hole is located at the center of the bearing area. The positioning hole is a circular hole. The positioning member is a positioning pin. The marking line extends along the circumference of the positioning pin to form a ring. The positioning pin is respectively matched with the positioning hole and the alignment hole. The matching accuracy of the positioning pin with the positioning hole and the alignment hole is within 0.05 mm.

[0006] In a second aspect, the present invention provides a wafer positioning method, which is applied to the semiconductor processing equipment with a magnetic suspension rotor provided in the first aspect, and the wafer positioning method comprises: Step S1. Insert the positioning member into the positioning hole of the reflector; Step S2. Align the alignment hole of the manipulator with the positioning member, and place the manipulator on the positioning member through the alignment hole; Step S3. Control the manipulator to move relative to the positioning member until the bearing surface of the manipulator is flush with the marking line of the positioning member; Step S4. Obtain and record the position information of the manipulator; Step S5. Place the wafer on the robot arm, transfer the wafer to the target position according to the position information, and place the wafer on the lifting pins.

[0007] Optionally, step S4 includes: obtaining the extension length, rotation angle and Z-axis displacement of the manipulator relative to the initial position through a sensor.

[0008] Compared with the prior art, the semiconductor processing equipment with a magnetic suspension rotor provided by the present invention has the following beneficial effects: 1. The present invention provides a positioning hole on the reflective plate and an alignment hole at a corresponding position of the wafer carrying area of ​​the robot. During positioning, the alignment hole is located above the positioning hole, the positioning piece is passed through the alignment hole and the positioning hole, and the carrying surface of the robot is flush with the marking line.

[0009] 2. The present invention has a simple structure and operation method, so that the operator can quickly position the robot arm, thereby locating the target position of the wafer, reducing the difficulty of operation, significantly improving the operating efficiency, and achieving accurate positioning. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0011] Figure 1 It is a schematic diagram of the structure of the RTP device; Figure 2 A schematic diagram of the structure of the reflector provided by the present invention; Figure 3 A schematic diagram of the structure of the manipulator provided by the present invention; Figure 4 A schematic diagram of the structure of the positioning member provided by the present invention; Figure 5 A schematic diagram of the structure of a wafer positioning assembly provided by the present invention; Figure 6 A schematic flow chart of a wafer positioning method provided in some embodiments of the present invention; Figure 7 A schematic flow chart of a wafer positioning method provided for some other embodiments of the present invention.

[0012] The reference numerals in the above drawings are as follows: 10. Wafer; 11. Process chamber; 12. Wafer transfer port; 13. Magnetic levitation rotor; 14. Support tube; 15. Edge ring; 16. Support platform; 17. Reflection plate; 171. Positioning hole; 18. Lifting pin; 19. Magnetic levitation stator; 20. Robot; 201. Alignment hole; 202. Carrying area; 203. Carrying surface; 204. Base; 205. Carrying part; 206. Stopper; 21. Positioning piece; 211. Marking line. DETAILED DESCRIPTION

[0013] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0014] It should be noted that when an element is referred to as being "fixed to" or "arranged on" another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or indirectly connected to the other element. In the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0015] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0016] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0017] As described in the background technology, currently, in the rapid thermal processing process, a robot is often used to transfer the wafer from the transfer chamber to the process chamber and place the wafer at the process position. In the above process, the position of the wafer is observed by naked eyes. This adjustment method mainly depends on the technical level and proficiency of the operator, which is time-consuming and labor-intensive, and has low positioning accuracy.

[0018] The present invention provides a semiconductor processing equipment with a magnetic suspension rotor, which includes a wafer positioning component, the wafer positioning component includes a manipulator, a reflective plate and a positioning member, a positioning hole is provided on the reflective plate, an alignment hole is provided on the manipulator and the alignment hole corresponds to the position of the positioning hole, a bearing area for placing wafers is provided on the manipulator, the alignment hole is located in the bearing area, a marking line is provided on the positioning member, and a side of the manipulator bearing the wafer is a bearing surface; during positioning, the alignment hole is located above the positioning hole, the positioning member is penetrated through the alignment hole and the positioning hole, and the bearing surface of the manipulator is flush with the marking line. The positioning hole is located at the center of the reflective plate, and the alignment hole is located at the center of the bearing area. In a preferred embodiment, the positioning hole is a circular hole, the positioning member is a positioning pin, the marking line extends circumferentially along the positioning pin to form a ring, and the positioning pin is respectively matched with the positioning hole and the alignment hole; the matching accuracy of the positioning pin with the positioning hole and the alignment hole is within 0.05mm.

[0019] In another embodiment, the present invention provides a wafer positioning method, which is applied to the above-mentioned semiconductor processing equipment with a magnetic suspension rotor, and the positioning method includes: Step S1. Insert the positioning member into the positioning hole of the reflector; Step S2. Align the alignment hole of the manipulator with the positioning piece, and place the manipulator glove on the positioning piece through the alignment hole; Step S3. Control the manipulator to move relative to the positioning member until the bearing surface of the manipulator is flush with the marking line of the positioning member; Step S4. Obtain and record the position information of the manipulator; Step S4 further includes obtaining the elongated length, rotation angle and Z-axis displacement of the manipulator relative to the initial position through a sensor.

[0020] Step S5. Place the wafer on the robot arm, transfer the wafer to the target position according to the position information, and place the wafer on the lifting pins.

[0021] The present invention will be further described below with reference to the accompanying drawings. Figures 2 to 5 As shown, in order to solve the above problems, the first aspect of the present invention provides a semiconductor processing equipment with a magnetic levitation rotor, which includes a wafer positioning assembly, the wafer positioning assembly includes a manipulator 20, a reflective plate 17 and a positioning member 21, the reflective plate 17 is provided with a positioning hole 171, the manipulator 20 is provided with an alignment hole 201 and the alignment hole 201 corresponds to the position of the positioning hole 171, the manipulator 20 is provided with a carrying area 202 for placing the wafer 10, the alignment hole 201 is located in the carrying area 202, the positioning member 21 is provided with a marking line 211, and the side of the manipulator 20 that carries the wafer 10 is a carrying surface 203; during positioning, the alignment hole 201 is located above the positioning hole 171, the positioning member 21 is penetrated through the alignment hole 201 and the positioning hole 171, and the carrying surface 203 of the manipulator 20 is flush with the marking line 211. The marking line 211 is the set height position of the robot 20 . For example, the height of the marking line 211 is the height at which the robot 20 places the wafer 10 on the lifting pins 18 .

[0022] It is understandable that the carrying area 202 is used to place wafers, for example, Figure 3 As shown, the robot 20 includes a base 204 and two supporting parts 205 connected to the base 204 and arranged at intervals. Blocks 206 are respectively arranged on the base 204 and the two supporting parts 205. The block blocks 206 are distributed on the same circumference at intervals from each other, thereby forming a supporting area 202 for positioning the wafer 10. The radius of the circle where each block block 206 is located is equal to the radius of the wafer 10.

[0023] In some optional embodiments, a plurality of positioning holes 171 are provided on the reflective plate 17, and alignment holes 201 corresponding to the number and positions of the positioning holes 171 are provided on the manipulator 20. The number of positioning members 21 is the same as the number of positioning holes 171. During positioning, each positioning member 21 is correspondingly inserted into the alignment hole 201 and the positioning hole 171. By providing a plurality of positioning holes 171, alignment holes 201, and positioning members 21, respectively, the accuracy of positioning can be further ensured.

[0024] By applying the above technical solution provided by the present invention, compared with the prior art, the wafer positioning assembly in the semiconductor processing equipment with a magnetic suspension rotor is provided with a positioning hole 171 on the reflective plate 17, and an alignment hole 201 is provided at a corresponding position of the bearing area 202 of the wafer 10 of the robot 20. During positioning, the alignment hole 201 is located on the positioning hole 171, the positioning member 21 is passed through the alignment hole 201 and the positioning hole 171, and the bearing surface 203 of the robot 20 is flush with the marking line 211. The present invention has a simple structure and operation method, so that the operator can quickly position the robot 20 in place, thereby positioning the target position of the wafer 10, reducing the difficulty of operation, significantly improving the operation efficiency, and accurate positioning.

[0025] See also Figure 2 and Figure 3 As shown, in some embodiments, the positioning hole 171 is located at the center of the reflective plate 17, and the alignment hole 201 is located at the center of the carrying area 202. In this way, it is only necessary to provide the positioning hole 171 at the center of the reflective plate 17 and the alignment hole 201 at the center of the carrying area 202, so that the two centers can be aligned, and the robot 20 is easily aligned with the reflective plate 17, and at the same time, it is conducive to accurately positioning the center position of the wafer.

[0026] See also Figure 2 and Figure 3 As shown, in some embodiments, the positioning hole 171 is a circular hole. A circular hole is easy to process. Of course, the positioning hole 171 can also be a hole of other shapes. Similarly, the alignment hole 201 is also a circular hole or a circular hole with one side open. For example, the center of the bearing area 202 is located at the connection between the two bearing parts 205 of the robot 20, such as Figure 3 As shown, the center of the alignment hole 201 is the center of the bearing area 202 , and the alignment hole 201 is an open semicircular hole, and the diameter is generally within 10 mm. It can be understood that the size and tolerance of the positioning hole 171 are consistent with those of the alignment hole 201 .

[0027] In some embodiments, the positioning member 21 is a positioning pin. The positioning member 21 is used to keep the wafer carrying area 202 of the robot 20 coaxial with the reflector 17, reduce the difficulty of positioning and improve the positioning accuracy. There are many ways to implement the positioning member 21. Demonstratively, the positioning member 21 is a positioning pin. The positioning pin has a cylindrical pin, a conical pin, etc. In this embodiment, the positioning pin is a cylindrical pin.

[0028] In some embodiments, the marking line 211 extends along the circumference of the positioning pin to form a ring. The marking line 211 is arranged as above to facilitate checking whether the bearing surface 203 of the manipulator 20 is flush with the marking line 211 on the positioning pin, and to ensure the accuracy of positioning.

[0029] In some embodiments, the positioning pin is loosely matched with the positioning hole 171 and the alignment hole 201 respectively.

[0030] In some embodiments, the matching accuracy of the positioning pin with the positioning hole 171 and the alignment hole 201 is within 0.05 mm, so as to ensure that the error is within 0.05 mm. The matching accuracy of the positioning pin with the positioning hole 171 is the same as the matching accuracy of the positioning pin with the alignment hole 201.

[0031] The semiconductor processing equipment with a magnetic suspension rotor of the present invention is further as follows Figure 5 As shown, a film transfer port 12 communicating with a transfer chamber is provided on one side of the process chamber 11, a magnetic suspension rotor 13 is provided in the process chamber 11, a support cylinder 14 is provided above the magnetic suspension rotor 13, the support cylinder 14 is used to carry an edge ring 15, a support platform 16 is provided inside the magnetic suspension rotor 13, a reflector 17 is provided on the upper surface of the support platform 16, the reflector 17 is provided below the edge ring 15 at intervals and is arranged concentrically with the edge ring 15, a plurality of lifting pins 18 can pass through the support platform 16 and the reflector 17 to move up and down, and a magnetic suspension stator 19 is provided outside the process chamber 11 and surrounds the magnetic suspension rotor 13. When positioning, the positioning hole 171 of the reflector 17 is located above the alignment hole 201 of the manipulator 20, the positioning member 21 passes through the alignment hole 201 and the positioning hole 171, and the bearing surface 203 of the manipulator 20 is flush with the marking line 211. Through the above-mentioned wafer positioning assembly, the wafer 10 can be positioned quickly and accurately, which reduces the difficulty of operation, significantly improves the operating efficiency, and makes the positioning of the wafer 10 more accurate. The lifting pin 18 has three working positions, which are high, middle and low from top to bottom. When the lifting pin 18 drops from the high position to the low position, the wafer 10 falls on the edge ring 15; when the lifting pin 18 rises from the low position to the middle position, the lifting pin 18 waits for the robot 20 to transfer the wafer 10 and place the wafer 10 on the lifting pin 18; when the lifting pin 18 rises from the middle position to the high position, the lifting pin 18 lifts the wafer 10 upward, and at this time, the robot 20 is removed.

[0032] See also Figure 6 As shown, the present invention provides a wafer positioning method, which is applied to semiconductor processing equipment with a magnetic suspension rotor, and the positioning method includes the following steps: Step S1. Insert the positioning member 21 into the positioning hole 171 of the reflector 17; First, the reflective plate 17 is placed on the upper surface of the support platform 16, and the reflective plate 17 is coaxially arranged with the support platform 16, and then the positioning member 21 is inserted into the positioning hole 171 of the reflective plate 17. Step S2. Align the alignment hole 201 of the manipulator 20 with the positioning member 21, and set the manipulator 20 on the positioning member 21 through the alignment hole 201; The robot arm 20 is moved from the initial position to the process chamber 11 , and the position of the robot arm 20 is adjusted until the positioning member 21 is inserted into the alignment hole 201 of the robot arm 20 .

[0033] Step S3. Control the manipulator 20 to move relative to the positioning member 21 until the bearing surface 203 of the manipulator 20 is flush with the marking line 211 of the positioning member 21; Specifically, move the manipulator 20 upward or downward along the positioning piece 21, and observe whether the bearing surface 203 of the manipulator 20 is flush with the marking line 211 of the positioning height. If not, control the manipulator 20 to continue moving upward or downward until the bearing surface 203 of the manipulator 20 is flush with the marking line 211 of the positioning height.

[0034] Step S4: Obtain and record the position information of the robot 20.

[0035] Specifically, the elongated length, rotation angle, and Z-axis displacement of the robot 20 relative to the initial position are acquired through sensors.

[0036] In some optional embodiments, the positioning member 21 is a positioning pin, the positioning hole 171 is arranged at the center of the reflective plate 17, and the alignment hole 201 is arranged at the center of the bearing area 202 of the manipulator 20. The matching accuracy of the positioning pin with the positioning hole 171 and the alignment hole 201 is within 0.05 mm.

[0037] Step S5. Place the wafer 10 on the robot 20, transfer the wafer 10 to the target position according to the position information, and place the wafer 10 on the lifting pins 18. Specifically, place the wafer 10 on the carrying area 202 of the robot 20, the diameter of the carrying area 202 is the same as the diameter of the wafer 10, so as to position the wafer 10.

[0038] Furthermore, in order to ensure the accuracy of positioning the wafer 10 and the concentricity of the wafer 10 and the edge ring 15, the following steps may be performed: Step S6. Remove the robot 20 and lower the lifting pins 18 to allow the wafer 10 to fall into the groove of the edge ring 15; Step S7. Make the lifting pin 18 do lifting motion, and make the robot 20 take and place the wafer 10 back and forth, perform AWC learning, and obtain and record the center deviation value of the wafer 10; Step S8 . adjusting the position of the magnetic suspension rotor 13 according to the center deviation value of the wafer 10 .

[0039] In some optional implementations, the control current required to change the magnetic flux of each electromagnetic winding of the magnetic suspension rotor 13 is calculated by the center deviation value of the wafer 10, specifically including: The robot 20 repeats AWC (wafer automatic correction) learning, records AWC data, reads the center deviation value of the wafer 10 in the X-axis and Y-axis directions according to AWC, and inputs the center deviation value into the magnetic suspension control interface of the upper computer. The control interface includes: the deviation value of the wafer in the X and Y directions, and the built-in calculation control program of the relationship between the deviation value in the X and Y directions and the magnetic suspension stator Y and Y directions. The specific relationship formula is shown in the following derivation relationship. Through the input of the deviation value, the internal control program calculates the control current that needs to be changed for each electromagnetic winding, thereby applying the corresponding control current change to finally realize the corresponding displacement change of the electromagnetic winding. The magnetic suspension rotor 13 generates a corresponding radial displacement according to the input center deviation value, thereby adjusting the position of the magnetic suspension rotor 13, ensuring the concentricity of the wafer 10 and the edge ring 15, improving the stability of the wafer 10 during the rotor rotation process, and is conducive to improving the uniformity of the process.

[0040] The magnetic flux of the electromagnetic winding can be changed according to the change of the current, and finally the displacement of the magnetic suspension rotor 13 at the preset position can be adjusted. The relationship between the displacement, magnetic force and bias current is as follows: In the X-axis direction, the resultant force of the i-th pair of electromagnetic windings is:

[0041] In the Y-axis direction, the resultant force of the i-th pair of electromagnetic windings is:

[0042] In the above formula: , ——The force components of the i-th pair of electromagnetic windings in the X-axis and Y-axis directions respectively; ——Magnetic force of the ith pair of electromagnetic windings in the +X axis direction; ——Magnetic force of the ith pair of electromagnetic windings in the -X axis direction; ——Magnetic force of the ith pair of electromagnetic windings in the +Y axis direction; ——Magnetic force of the ith pair of electromagnetic windings in the -Y direction; ——vacuum magnetic permeability; n——Number of turns of a single electromagnetic winding; A——air gap cross-sectional area; ——Balance point position; ——Bias current; ——Control current in the X-axis direction; ——Control current in the Y-axis direction; ——Displacement of the magnetically suspended rotor in the X-axis direction; ——Displacement of the magnetically suspended rotor in the Y-axis direction; The resultant forces exerted by multiple pairs of magnetically suspended rotors in the X-axis direction and the Y-axis direction are zero, that is, =0 =0 In the above formula: ——m is the resultant force exerted on the magnetic suspension rotor on the X-axis, m is a positive integer; ——m is the resultant force exerted on the magnetic suspension rotor on the Y-axis, where m is a positive integer.

[0043] After the magnetic levitation rotor makes the corresponding displacement change, the robot takes the wafer and records the deviation value of the wafer. After the deviation radius of the wafer is <0.1mm, the adjustment action of the magnetic levitation rotor is completed. If the deviation radius of the wafer is >0.1mm, the position of the rotor is adjusted by repeatedly entering the wafer deviation in the control interface until the deviation value is <0.1mm. After the wafer deviation is <0.1mm, the position of the robot is recorded, and the film is repeatedly transmitted for AWC learning to record the movement trajectory of the robot. The calibration action is completed.

[0044] In summary, the semiconductor processing equipment with a magnetic suspension rotor and the wafer positioning method provided in this embodiment have at least the following beneficial technical effects: (1) The present invention provides a positioning hole 171 on the reflective plate 17, and an alignment hole 201 at a corresponding position of the wafer 10 bearing area 202 of the robot 20. During positioning, the alignment hole 201 is located above the positioning hole 171, and the positioning member 21 is passed through the alignment hole 201 and the positioning hole 171, and the bearing surface 203 of the robot 20 is flush with the marking line 211. The present invention has a simple structure and is easy to operate, so that the operator can quickly position the robot 20 in place, thereby positioning the target position of the wafer 10, significantly improving the operating efficiency, and the positioning is accurate; (2) The present invention utilizes AWC learning to obtain and record AWC data to improve the accuracy of wafer 10 positioning; (3) The present invention ensures the concentricity of the wafer 10 and the edge ring 15 through the positioning method of combining the manipulator 20 with the magnetic suspension system, improves the stability of the wafer 10 during the rotation of the magnetic suspension rotor 13, and is conducive to improving the uniformity of the process.

[0045] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor processing device with a magnetically suspended rotor, comprising a wafer positioning assembly, characterized in that: The wafer positioning assembly includes a manipulator, a reflective plate and a positioning member, wherein the reflective plate is provided with a positioning hole, the manipulator is provided with an alignment hole and the alignment hole corresponds to the position of the positioning hole provided on the reflective plate, the manipulator is provided with a bearing area for placing the wafer, the alignment hole is located in the bearing area, the positioning member is provided with a marking line, and the side of the manipulator that bears the wafer is a bearing surface; During positioning, the alignment hole is located above the positioning hole, the positioning member is passed through the alignment hole and the positioning hole, and the bearing surface of the manipulator is flush with the marking line.

2. The semiconductor processing equipment with a magnetically suspended rotor according to claim 1, characterized in that: The positioning hole is located at the center of the reflective plate, and the alignment hole is located at the center of the bearing area.

3. The semiconductor processing equipment with a magnetically suspended rotor according to claim 1, characterized in that: The positioning hole is a round hole.

4. The semiconductor processing equipment with a magnetically suspended rotor according to claim 1, characterized in that: The positioning piece is a positioning latch.

5. The semiconductor processing equipment with a magnetically suspended rotor according to claim 4, characterized in that: The marking line extends along the circumference of the positioning pin to form a ring.

6. The semiconductor processing equipment with a magnetically suspended rotor according to claim 4, characterized in that: The positioning pin is respectively matched with the positioning hole and the alignment hole in a clearance.

7. The semiconductor processing equipment with a magnetically suspended rotor according to claim 5, characterized in that: The matching accuracy between the positioning pin and the positioning hole and the alignment hole is within 0.05mm.

8. A wafer positioning method, characterized in that: The method is applied to a semiconductor processing device with a magnetically suspended rotor as claimed in any one of claims 1 to 7, wherein the wafer positioning method comprises the following steps: Step S1, inserting the positioning piece into the positioning hole of the reflective plate; Step S2, aligning the alignment hole of the manipulator with the positioning member, and placing the manipulator on the positioning member through the alignment hole; Step S3, controlling the manipulator to move relative to the positioning member until the bearing surface of the manipulator is flush with the marking line of the positioning member; Step S4, obtaining and recording the position information of the manipulator; Step S5, placing the wafer on the robot arm, transferring the wafer to the target position according to the position information, and placing the wafer on the lifting pins.

9. The wafer positioning method according to claim 8, characterized in that: Step S4 includes: obtaining the extension length, rotation angle and Z-axis displacement of the manipulator relative to the initial position through sensors.

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