Plug-in hole stepped pattern circuit board and manufacturing method thereof

Abstract

The invention provides a plug-in hole step pattern circuit board and a manufacturing method thereof, and the method comprises the steps: setting at least one circuit pattern on at least one side of a dielectric layer, and obtaining a first inner layer part; arranging a separation layer on the at least one circuit pattern to obtain a second inner layer component; arranging a bonding layer on at least one side of the second inner-layer component, and pressing the second inner-layer component with the first inner-layer component to obtain a circuit board intermediate product; a plurality of via holes are formed in the circuit board intermediate product to obtain a circuit board; wherein the via hole is arranged on the circuit pattern; and stripping the part provided with the separation layer from the circuit board to form the plug-in hole stepped pattern circuit board with the exposed part. According to the manufacturing method, the manufacturing process is short, the manufacturing time is saved, the plug-in hole step pattern without copper on the groove wall can be realized, and the performance and the reliability of the circuit board are improved.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board manufacturing, and in particular to a plug-in hole stepped pattern circuit board and a manufacturing method thereof. Background Art

[0002] In recent years, with the development of miniaturization, compact structure and high-density layout of electronic devices, the structure of circuit boards has become more complex and the thickness has continued to increase. The actual space to accommodate the entire electronic circuit is very limited, so circuit boards with local thin steps have appeared to ensure that the height of the connector after connection is consistent with the rest of the components.

[0003] In order to manufacture the above-mentioned circuit board with a staircase pattern, the existing manufacturing method is mostly to use two pressings followed by opening the cover. However, this manufacturing method has the disadvantages of a long manufacturing process and time-consuming processing. Summary of the invention

[0004] The embodiment of the present application provides a plug-in hole stepped pattern circuit board and a manufacturing method thereof, so as to solve the technical problems in the prior art of manufacturing a plug-in hole stepped pattern circuit board, such as a long manufacturing process and time-consuming processing.

[0005] In a first aspect, an embodiment of the present application provides a method for manufacturing a plug-in hole stepped pattern circuit board, comprising:

[0006] Disposing at least one circuit pattern on at least one side of the dielectric layer to obtain a first inner layer component;

[0007] Disposing a separation layer on at least one of the circuit patterns to obtain a second inner layer component;

[0008] Providing an adhesive layer on at least one side of the second inner layer component and pressing it with the first inner layer component to obtain an intermediate circuit board product;

[0009] Arranging a plurality of via holes on the intermediate circuit board product to obtain a circuit board; wherein the via holes are arranged on the circuit pattern;

[0010] The portion provided with the separation layer is peeled off from the circuit board to form a circuit board with a stepped pattern of plug-in holes having a leaking portion.

[0011] In a possible implementation manner, the step of providing a separation layer on at least one of the circuit patterns to obtain a second inner layer component includes:

[0012] On the dielectric layer provided with a plurality of the circuit patterns, a first separation layer is provided on any of the circuit patterns to obtain an intermediate inner layer component;

[0013] On the intermediate inner layer component, a second separation layer is disposed on at least one of the circuit patterns adjacent to the first separation layer, and a third separation layer is disposed in a spatial position between the first separation layer and the second separation layer to obtain the second inner layer component.

[0014] In a possible implementation manner, providing an adhesive layer on at least one side of the second inner layer component and laminating the second inner layer component with the first inner layer component to obtain a circuit board intermediate product includes:

[0015] The adhesive layer is provided on at least one side of the second inner layer component, and the first inner layer component is bonded to the second inner layer component provided with the adhesive layer;

[0016] The first inner layer component and the second inner layer component that have been bonded are pressed together to obtain the circuit board intermediate product.

[0017] In a possible implementation manner, providing an adhesive layer on at least one side of the second inner layer component and laminating the second inner layer component with the first inner layer component to obtain a circuit board intermediate product includes:

[0018] The bonding layer is provided on at least one side of the first inner layer component and is bonded to a side of the second inner layer component on which the separation layer is provided;

[0019] The first inner layer component and the second inner layer component that have been bonded are pressed together to obtain the circuit board intermediate product.

[0020] In a possible implementation manner, a plurality of via holes are provided on the intermediate circuit board product to obtain a circuit board; wherein the via holes are provided on the circuit pattern, including:

[0021] A first conducting hole is provided at the position of the first separation layer of the intermediate circuit board product;

[0022] According to the size of the leakage portion, a second plug hole is provided at the position of the second separation layer to obtain the circuit board.

[0023] In a possible implementation manner, after the second plug hole is provided at the position of the second separation layer according to the size of the leakage portion and the circuit board is obtained, the method includes:

[0024] The parts of the circuit board located at the first conductive hole and the second conductive hole are peeled off from the separation layer to obtain the plug-in hole stepped pattern circuit board.

[0025] In a possible implementation manner, the separation layer is selected from any one or more combinations of an ink layer, a gasket, a copper foil or a high temperature resistant film layer.

[0026] In a possible implementation manner, the difference between the size of the separation layer and the size of the leakage portion ranges from 0 to 0.3 mm.

[0027] In a possible implementation manner, the second plug hole is provided at the position of the second separation layer according to the size of the leakage portion, and further includes:

[0028] A metal layer is disposed on the first plugging hole and the second plugging hole, respectively; wherein the thickness of the metal layer is smaller than the hole radius of the first plugging hole or the second plugging hole.

[0029] In a second aspect, an embodiment of the present application provides a plug-in hole stepped pattern circuit board, which is manufactured by the manufacturing method in any one of the embodiments provided in the first aspect of the present application.

[0030] The embodiment of the present application provides a plug-in hole step pattern circuit board and its manufacturing method, by setting at least one circuit pattern on at least one side of the dielectric layer to obtain a first inner layer component; setting a separation layer on at least one circuit pattern to obtain a second inner layer component; setting an adhesive layer on at least one side of the second inner layer component and pressing it with the first inner layer component to obtain a circuit board intermediate product; setting a plurality of via holes on the circuit board intermediate product to obtain a circuit board; wherein the via holes are set on the circuit pattern; peeling off the part where the separation layer is set from the circuit board to form a plug-in hole step pattern circuit board with a leaking part. The plug-in hole step pattern circuit board manufacturing method of the present application has a short manufacturing process, saves manufacturing time, and can realize a plug-in hole step pattern without copper on the slot wall, thereby improving the performance and reliability of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0032] Figure 1 A schematic diagram of a process flow of a method for manufacturing a circuit board with a stepped via pattern provided in an embodiment of the present application;

[0033] Figure 2 A schematic diagram of the cross-sectional structure of each manufacturing stage when manufacturing a plug-in hole stepped pattern circuit board provided in an embodiment of the present application;

[0034] Figure 3 A schematic diagram of the cross-sectional structure of the first inner layer component of the plug-in hole stepped pattern circuit board provided in an embodiment of the present application;

[0035] Figure 4 A schematic cross-sectional structure diagram of a second inner layer component of a plug-in hole stepped pattern circuit board provided in an embodiment of the present application;

[0036] Figure 5 A schematic diagram of a circuit board cross-sectional structure of a plug-in hole stepped pattern circuit board provided in an embodiment of the present application;

[0037] Figure 6 A schematic diagram of the cross-sectional structure of a plug-in hole stepped pattern circuit board provided in an embodiment of the present application.

[0038] Description of reference numerals:

[0039] 10————Dielectric layer;

[0040] 20————Line graphics;

[0041] 30————Separation layer;

[0042] 40————adhesive layer;

[0043] 50————conducting hole;

[0044] 60————Leakage part.

[0045] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0046] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0047] In the description of the present application, it should be understood that the terms "counterclockwise", "clockwise", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0048] The design of the plug-in hole ladder pattern circuit board is to ensure that the height of the plug-in component after connection is consistent with other devices, so that the entire assembled circuit board can be accurately placed in a space of limited size, meeting the requirements of modern electronic equipment for compactness and high-density integration.

[0049] In order to make this kind of circuit board with plug-in hole step pattern, there are currently two main commonly used production methods. The first method is to open the cover after two pressings. Although this method can achieve the desired structural effect, its process flow is complicated and time-consuming, resulting in high overall processing costs and difficulty in meeting the economic requirements of large-scale production. The second method is to use tin burning for processing. This method can simplify the process flow in some cases, but there is a significant defect, that is, it is impossible to achieve a plug-in hole step pattern without copper on the slot wall. This may affect the electrical performance and reliability of the circuit board, especially in applications that require strict electrical isolation.

[0050] Therefore, a new manufacturing process is developed to simplify the process, reduce costs, and at the same time achieve a copper-free plug-in hole step pattern on the slot wall to improve production efficiency and improve the performance and reliability of the final product, thereby meeting the market demand for high-performance, miniaturized electronic products.

[0051] The embodiments of the present application provide a plug-in hole step pattern circuit board and a method for manufacturing the same, which are intended to solve the technical problems in the prior art of manufacturing a plug-in hole step pattern circuit board, such as a long manufacturing process, high cost, and difficulty in achieving a plug-in hole step pattern without copper in the slot wall, which affects the performance and reliability of the circuit board.

[0052] The technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0053] Figure 1 This is a schematic diagram of the process flow of the manufacturing method of the plug-in hole stepped pattern circuit board provided in the embodiment of the present application. Figure 1 As shown, the production method comprises the following steps:

[0054] S101, disposing at least one circuit pattern 20 on at least one side of a dielectric layer 10 to obtain a first inner layer component.

[0055] As an important component of the circuit board, the dielectric layer 10 not only provides mechanical support, but also plays the role of electrical insulation in the circuit board. The dielectric layer 10 can be selected from materials such as polytetrafluoroethylene (PTFE), polyimide, ceramics, etc. The material selection of the dielectric layer 10 directly affects the thermal management performance of the circuit board, especially in high-power and high-frequency applications, the thermal conductivity and thermal expansion coefficient of the dielectric layer 10 are crucial. By using ceramics or other high thermal conductivity materials, the heat dissipation efficiency of the circuit board can be effectively improved, and the impact of thermal stress on the circuit board can be reduced. The dielectric constant and loss factor of the dielectric layer 10 are key parameters that affect signal integrity. For high-speed and high-frequency circuits, selecting low-loss dielectric materials, such as PTFE or specially treated polyimide, can significantly reduce signal attenuation and distortion, and ensure high-speed transmission and integrity of the signal.

[0056] The thickness and uniformity of the dielectric layer 10 need to be precisely controlled to ensure the flatness of the circuit board and the accuracy of inter-layer alignment. This is particularly important for the manufacture of multi-layer boards, because any slight deviation may cause signal transmission delay or short circuit. The environmental performance and recyclability of the dielectric layer 10 are also gradually becoming the focus of design considerations.

[0057] The circuit pattern 20 is a key functional part arranged on the dielectric layer 10. The circuit pattern 20 on the dielectric layer 10 can be one or more, which is responsible for realizing the electrical connection and signal transmission of the circuit board, and can affect the performance and reliability of the circuit board. The design of the circuit pattern 20 requires precise consideration of electrical performance and physical layout. The wire width, spacing and path must be optimized during design to ensure signal integrity, minimize electromagnetic interference (EMI) and reduce signal delay. For high-frequency applications, designs such as microstrip and stripline may be adopted.

[0058] The method for making the circuit pattern 20 can be through a subtractive etching method or a semi-additive etching method. The subtractive etching method can be carried out by coating the entire copper foil surface with photoresist, and after exposure and development, the unprotected copper layer is removed to leave the desired circuit pattern. It is suitable for large-scale production and has a relatively low cost. It is suitable for the manufacture of circuit boards of conventional density and complexity. The processing etching method involves directly processing the desired circuit pattern on the substrate, and then removing the excess material by chemical etching. It is usually used for precision processing and can achieve high-precision and high-resolution circuit patterns. It is suitable for complex and high-density circuit designs. The semi-additive etching method combines the advantages of additive and subtractive processes. Usually, a thin layer of copper is first formed on the substrate, and then the copper thickness is increased by electroplating, and finally etching is performed to form a circuit pattern.

[0059] By choosing the right graphics processing method, you can optimize the performance, cost and production efficiency of the circuit board. You can also choose the most suitable process route according to the specific needs of the product and market trends.

[0060] S102, disposing a separation layer 30 on at least one circuit pattern 20 to obtain a second inner layer component.

[0061] The separation layer 30 can be covered on any one or more circuit patterns 20. The separation layer 30 can play a temporary bonding role. After a period of time, its bonding effect fails and can be removed from the separation layer 30. For example, the separation layer 30 can be made of controllable viscosity materials, which provide sufficient bonding force in the initial stage to ensure that it remains stable during the manufacturing or assembly process. However, the bonding force of these materials will gradually weaken under set time or conditions, eventually allowing the separation layer 30 to be easily removed. For example, the material of the separation layer 30 may be selected from reversible polymers, thermosensitive adhesives or photosensitive adhesives. The temporary bonding properties of the separation layer 30 are particularly suitable for circuit board manufacturing processes that require multiple processing or assembly. For example, in the lamination process of a multi-layer circuit board, the separation layer 30 can be used to temporarily fix the layers to ensure alignment accuracy. During the assembly process, it can also be used to temporarily fix components for welding or other processing.

[0062] S103, providing an adhesive layer 40 on at least one side of the second inner layer component, and pressing it with the first inner layer component to obtain an intermediate circuit board product.

[0063] The adhesive layer 40 can be flexibly arranged on one side or both sides of the dielectric layer 10, depending on the design requirements and structural complexity of the circuit board. When applied on one side, the adhesive layer 40 can provide sufficient bonding force, and when applied on both sides, it can enhance the stability and durability of the overall structure. The adhesive layer 40 can be starch, epoxy resin, rubber, organic silicone adhesive, polyacrylic acid adhesive, etc.

[0064] In order to achieve the best lamination effect, the thickness of the bonding layer 40 should be consistent with the thickness of the separation layer 30, or differ within a controllable range, which helps to achieve uniform pressure distribution during the lamination process and prevent warping, stress concentration or other structural defects caused by uneven thickness. When the bonding layer 40 is placed in the dielectric layer 10, it must accurately avoid the separation layer 30 that has been set on the dielectric layer 10. Detailed planning should be carried out in the design stage, and precise coating or lamination technology should be used in the manufacturing process to ensure that the bonding layer 40 only covers the area that requires long-term bonding without interfering with the function of the separation layer 30. The bonding layer 40 needs to bond the multi-layer dielectric layer 10 for a long time. Therefore, the bonding layer 40 is usually made of a material with high bonding strength and durability, such as epoxy resin or polyimide, which not only provides strong bonding force, but also has good heat resistance and chemical stability to ensure reliability in various operating environments.

[0065] like Figure 2 As shown, set multiple Figure 3The first inner layer component of the circuit pattern 20 and the separation layer 30 shown, and the arrangement as shown Figure 4 The circuit pattern 20, the separation layer 30 and the bonding layer 40 are laminated to obtain a circuit board intermediate product. The number of layers of the inner layer components can be flexibly designed according to specific application requirements, from simply laminating multiple first inner layer components and multiple second inner layer components to obtain a complex multi-layer structure (such as 4 layers, 6 layers or even more). This allows designers to optimize the layout and performance of the circuit board according to circuit functions, signal transmission requirements and space limitations.

[0066] During the lamination process, it is critical to ensure the precise alignment and positioning of each inner layer component, which is usually achieved by using positioning pins, alignment marks or automated alignment systems to ensure that the circuit patterns 20 between layers are accurately matched to avoid signal transmission errors or short circuits.

[0067] S104 , setting a plurality of via holes 50 on the intermediate circuit board product to obtain a circuit board; wherein the via holes 50 are set on the circuit pattern 20 .

[0068] Continue as Figure 2 As shown, a plurality of via holes 50 are provided on the intermediate product of the circuit board, so as to obtain Figure 5 The circuit board shown in the figure is provided with metal layers in the via holes of the circuit board for electrical connection and mechanical fixation. The via holes 50 need to be precisely planned according to the functional requirements of the circuit board and the specifications of the components. The position, size and spacing of the holes must match the pins or connectors of the components to ensure good electrical connection and mechanical fixation.

[0069] Mechanical drilling or laser drilling technology is usually used to open the via hole 50 on the intermediate product of the circuit board. Mechanical drilling is suitable for holes with larger diameters, while laser drilling is suitable for precision processing of small apertures, and the accuracy and smoothness of the holes need to be guaranteed. The metal layer is usually placed in the via hole 50 through electroplating or chemical plating. The electroplating process forms a conductive channel by depositing a layer of metal (such as copper) on the hole wall. Chemical plating deposits metal on the hole wall through chemical reaction, which is suitable for smaller apertures and more complex structures. The inserted metal layer not only provides electrical connection, but also enhances the mechanical strength of the via hole, ensuring that the components remain stable during welding and use. The thickness and uniformity of the metal layer need to be strictly controlled to ensure good conductivity and reliability.

[0070] Among them, among the multiple via holes 50, the multiple via holes 50 located at the separation layer 30 can be used as plug-in holes, and then made into a circuit board with a stepped pattern of plug-in holes; the multiple via holes 50 located at other positions can be used as plug-in holes, or can be used as positioning holes, screw holes, etc. for fixation, or as POFV holes to meet the welding requirements and the conduction inside the via holes. Through the resin plug hole electroplating filling process, POFV can fill the hole with resin and electroplate copper on it, thereby meeting both the internal conduction requirements and the welding needs.

[0071] S105 , peeling off the portion provided with the separation layer 30 from the circuit board, thereby forming a circuit board with a via-hole step pattern having a leakage portion 60 .

[0072] like Figure 2 As shown, the circuit board obtained in step S104 is made into a stepped circuit board, and the separation layer 30 and the dielectric layer 10 disposed on the separation layer 30 need to be peeled off from the circuit board to obtain a stepped circuit board as shown in FIG. Figure 6 The conductive hole step pattern circuit board shown in the figure; since the bonding effect of the separation layer 30 is temporary, this provides convenient conditions for the subsequent peeling operation. Before peeling, ensure that the bonding effect of the separation layer 30 has weakened, and this process can be accelerated by controlling time, temperature or other environmental conditions. In order to form a conductive hole step pattern circuit board with a leakage portion 60, precise cutting technology, such as laser cutting or CNC milling, can be used, which can provide high-precision processing effects and ensure neat edges and complete structures during the peeling process. After cutting, use appropriate tools and techniques to peel the separation layer 30 and the dielectric layer 10 above it from the circuit board, while avoiding damage to the underlying circuit pattern 20 and other functional layers. Mechanical peeling, chemical dissolution or thermal peeling can be used, and the most suitable process is selected according to material properties and design requirements.

[0073] The embodiment of the present application provides a plug-in hole step pattern circuit board and its manufacturing method, by setting at least one circuit pattern on at least one side of the dielectric layer to obtain a first inner layer component; setting a separation layer on at least one circuit pattern to obtain a second inner layer component; setting an adhesive layer on at least one side of the second inner layer component and pressing it with the first inner layer component to obtain a circuit board intermediate product; setting a plurality of via holes on the circuit board intermediate product to obtain a circuit board; wherein the via holes are set on the circuit pattern; the part with the separation layer is peeled off from the circuit board to form a via hole step pattern circuit board with a leaking part. The via hole step pattern circuit board manufacturing method of the present application has a short manufacturing process, saves manufacturing time, and can realize a via hole step pattern without copper on the slot wall, thereby improving the performance and reliability of the circuit board.

[0074] Further, based on the above embodiment, the manufacturing steps are explained and described in more detail, and a separation layer 30 is provided on at least one of the circuit patterns 20 to obtain a second inner layer component, including:

[0075] On the dielectric layer 10 provided with a plurality of the circuit patterns 20, a first separation layer is provided on any circuit pattern 20 to obtain an intermediate inner layer component.

[0076] On the middle inner layer component, a second separation layer is disposed on at least one circuit pattern 20 adjacent to the first separation layer, and a third separation layer is disposed in a spatial position between the first separation layer and the second separation layer to obtain a second inner layer component.

[0077] In order to provide greater flexibility and complexity for the functional realization and signal transmission of the circuit board, the number of line patterns 20 set on the dielectric layer 10 is greater than or equal to 2. At the same time, the presence of multiple line patterns 20 can optimize the signal path, thereby reducing signal delay and loss, ensuring signal integrity and fast transmission. Multiple line patterns 20 provide circuit redundancy and improve the reliability of the system. If a line fails, the backup line can take over the function to ensure the continuity and stability of the system. Moreover, by rationally laying out multiple line patterns 20, the thermal management of the circuit board can be optimized. Heat can be distributed and dissipated more evenly, avoiding local overheating and extending the service life of the circuit board.

[0078] On a dielectric layer 10 having a plurality of circuit patterns 20, a first separation layer is firstly arranged on any circuit pattern 20, thereby forming an intermediate inner layer component. Next, on the intermediate inner layer component, at least one circuit pattern 20 adjacent to the first separation layer is selected, and a second separation layer is arranged thereon. Then, a third separation layer is arranged in the space region between the first separation layer and the second separation layer, thereby obtaining a more complex second inner layer component. In this way, accurate separation and protection of the circuit patterns can be achieved, and the stability and functionality of the overall structure can be enhanced.

[0079] Furthermore, an adhesive layer 40 is provided on at least one side of the second inner layer component and pressed together with the first inner layer component to obtain an intermediate circuit board product, including:

[0080] A bonding layer 40 is provided on at least one side of the second inner layer component, and the first inner layer component is bonded to the second inner layer component provided with the bonding layer 40;

[0081] The bonded first inner layer component and the second inner layer component are pressed together to obtain an intermediate circuit board product.

[0082] On at least one side surface of the second inner layer component, a bonding layer 40 is evenly coated or laminated to provide a solid foundation for subsequent assembly bonding. Next, the first inner layer component prepared in advance is carefully aligned and placed on the second inner layer component provided with the bonding layer 40, ensuring that the circuit patterns and separation layers of the two can be accurately aligned. In this way, the first inner layer component and the second inner layer component are preliminarily bonded and fixed.

[0083] Subsequently, the bonded first inner layer component and the second inner layer component are placed in a laminating device, and appropriate pressure and temperature are applied to ensure that the adhesive layer 40 can be fully cured and form a strong bonding interface. During the laminating process, the process parameters need to be controlled to avoid material deformation or performance degradation caused by excessive pressure or temperature. After this series of operations, a circuit board intermediate product with a multilayer structure is finally obtained, which lays a solid foundation for subsequent processing steps. The circuit board intermediate product not only has good mechanical strength, but also ensures the stability and reliability of electrical performance.

[0084] Furthermore, an adhesive layer 40 is provided on at least one side of the second inner layer component and pressed together with the first inner layer component to obtain an intermediate circuit board product, including:

[0085] The adhesive layer 40 is provided on at least one side of the first inner layer member, and is bonded to the side of the second inner layer member provided with the separation layer 30 .

[0086] The bonded first inner layer component and the second inner layer component are pressed together to obtain an intermediate circuit board product.

[0087] On at least one side of the surface of the first inner layer component, a bonding layer 40 is carefully coated or laminated to ensure the firmness and reliability of the subsequent bonding process. The selection and application of this bonding layer 40 need to consider the compatibility and adhesion properties of the materials to achieve the best bonding effect. Next, the treated first inner layer component is precisely docked and bonded with the side of the second inner layer component where the separation layer 30 is provided. This step requires the alignment of the circuit patterns and separation layers of the two components to avoid any misalignment or mismatch, thereby ensuring the functional integrity of the circuit board.

[0088] After the initial bonding is completed, the combined first inner layer component and the second inner layer component are placed in a professional laminating device and subjected to appropriate pressure and temperature conditions. This laminating process not only helps the curing of the adhesive layer 40, but also enhances the mechanical strength and stability of the entire structure. By precisely controlling the laminating process parameters such as pressure, temperature and time, the uniformity and firmness of the bonding interface are ensured to avoid bubbles, delamination or other defects.

[0089] Finally, after lamination, the resulting circuit board intermediate product has a multi-layer structure with excellent mechanical and electrical properties. This intermediate product provides a solid foundation for subsequent processing steps such as drilling, pattern transfer and surface treatment, and ensures the high quality and reliability of the final product.

[0090] Furthermore, a plurality of via holes 50 are provided on the intermediate product of the circuit board to obtain the circuit board; wherein the via holes 50 are provided on the circuit pattern 20, including:

[0091] A first conducting hole is provided at the position of the first separation layer of the intermediate circuit board product.

[0092] According to the size of the leakage portion 60, a second plug hole is provided at the position of the second separation layer to obtain a circuit board.

[0093] In the manufacturing process of the intermediate product of the circuit board, in order to achieve specific functional connections and component installation, it is necessary to set the via hole at a specific position. First, the first via hole is accurately drilled at the position of the first separation layer of the intermediate product. The size and position of the hole need to be strictly controlled according to the design requirements to ensure the smooth insertion of the subsequent components and the reliability of the electrical connection. During the drilling process, high-precision drilling equipment is required to avoid damage to the surrounding materials and ensure the smoothness of the hole wall and the accuracy of the hole diameter.

[0094] Next, according to the specific size and position requirements of the leakage portion 60 in the circuit board design, a second plug hole is set at the position of the second separation layer. This step also requires high-precision processing technology to ensure that the size of the plug hole matches the specifications of the leakage portion 60, so as to achieve good mechanical and electrical connection. The setting of the second plug hole should not only take into account the current functional requirements, but also provide a certain degree of flexibility for possible future expansion and upgrades.

[0095] By setting the first conductive hole and the second plug hole at the first separation layer and the second separation layer respectively, the final circuit board has the complexity and functionality of the multi-layer structure. The setting of these holes not only enhances the connection performance of the circuit board, but also provides the necessary channels for the installation of components and signal transmission. After this series of fine processing, the final circuit board product can meet the needs of high-performance and high-reliability applications, providing a solid foundation for the normal operation of various electronic devices.

[0096] Further, according to the size of the leakage portion 60, a second plug hole is provided at the position of the second separation layer, and after the circuit board is obtained, the method includes:

[0097] The portion of the circuit board located at the first conducting hole and the second plugging hole is peeled off from the separation layer to obtain a conducting hole step pattern circuit board.

[0098] In the process of processing the circuit board, in order to achieve the stepped structure of the via hole, the parts located at the first via hole and the second plug hole need to be further processed. First, the area to be stripped is determined to ensure that the area accurately covers the surrounding parts of the first via hole and the second plug hole. Then, the excess material is carefully removed from the separation layer using precise stripping technology. This process requires special attention to the depth and range of stripping to ensure that the final stepped structure meets the design requirements.

[0099] During the stripping process, laser stripping, chemical etching or mechanical milling can be used. The most suitable process is selected according to the characteristics of the circuit board material and the requirements of processing accuracy. No matter which method is used, it is necessary to ensure the uniformity and accuracy of the stripping process to avoid affecting the surrounding functional areas.

[0100] After the stripping operation is completed, the resulting via-step pattern circuit board not only has a complex three-dimensional structure, but also provides an optimized interface for specific component installation and electrical connection. This stepped design helps to improve the integration and functionality of the circuit board, while also enhancing its mechanical strength and durability. Ultimately, after this series of fine processing, the circuit board can meet the needs of high-precision and high-performance applications, providing reliable support for the realization of various complex electronic systems.

[0101] Furthermore, the separation layer 30 is selected from any one or more combinations of ink layer, gasket, copper foil or high temperature resistant film layer.

[0102] As a separation layer material, ink has good processability and easy coating characteristics. It can be precisely applied to specific areas by screen printing or spraying technology. Gaskets are usually made of flexible materials and can provide physical isolation and buffering. They can be pre-cut into specific shapes to suit different circuit board designs. Copper foil, as a separation layer, provides excellent electrical and thermal conductivity. It can be used for electromagnetic shielding and thermal management, providing additional electrical functions such as shielding and grounding, suitable for high-performance and high-frequency applications. High-temperature resistant film materials can remain stable under high temperature conditions and are suitable for hot pressing and other high-temperature processes. By selecting and combining different separation layer materials, the performance and manufacturing process of the circuit board can be optimized. The diverse selection allows the most suitable separation layer solution to be customized according to specific application needs and process requirements.

[0103] Furthermore, the difference between the size of the separation layer 30 and the size of the leakage portion 60 is in the range of 0 to 0.3 mm.

[0104] Controlling the difference between the separation layer size and the leakage part size within the range of 0 to 0.3 mm reflects the high precision requirements for the manufacturing process. This precision control can ensure accurate alignment between the layers and avoid functional failure or structural defects caused by dimensional errors. By strictly controlling the size difference, unnecessary gaps or overlaps in the electrical path can be effectively reduced, thereby optimizing the integrity of signal transmission. This is especially important for high-frequency signal transmission and the design of sensitive circuits, which can significantly reduce signal loss and electromagnetic interference. Precise control of the size difference helps to improve the mechanical stability of the circuit board. Appropriate size differences can provide the necessary buffering and support to prevent warping or delamination under thermal cycles or mechanical stress.

[0105] Setting the size of the leakage portion to be greater than or equal to 5mm×5mm ensures sufficient space for installing and connecting various electronic components. It can provide sufficient area for stable installation and reliable connection of components, reducing errors and uncertainties during installation. Larger leakage portion sizes help improve the thermal management performance of the circuit board. By providing a larger heat dissipation area, heat can be more effectively dispersed and discharged, preventing local overheating, thereby improving the overall reliability and life of the circuit board. Leakage portions with a size greater than or equal to 5mm×5mm can provide better mechanical strength and stability. This is especially important for applications that need to withstand mechanical stress or vibration, such as automotive electronics and industrial equipment, to prevent damage or failure during use.

[0106] Further, according to the size of the leakage portion 60, a second plug hole is provided at the position of the second separation layer, and further comprising:

[0107] A metal layer is disposed on the first plugging hole and the second plugging hole, respectively; wherein the thickness of the metal layer is smaller than the hole radius of the first plugging hole or the second plugging hole.

[0108] A metal layer is placed on the surface of the via hole by a wet method or a dry method. The wet method includes chemical deposition of metal by liquid or physical adsorption of conductive material by liquid.

[0109] The wet method usually involves chemical plating or electroplating process. On the surface of the via hole, a layer of metal (such as copper, nickel or gold) is deposited through chemical reaction or electrochemical reaction. The wet method can form a uniform and continuous metal layer on the hole wall, providing good conductivity and adhesion. It is suitable for processing complex shapes and small apertures.

[0110] The dry method usually uses physical vapor deposition (PVD) or chemical vapor deposition (CVD) technology to physically deposit the metal layer on the surface of the via. The dry method can achieve precise thickness control and high-purity metal layers, and is suitable for applications that require special material properties or high-temperature stability.

[0111] The embodiment of the present application also provides a plug-in hole stepped pattern circuit board, which is manufactured by the manufacturing method in any one of the above-mentioned embodiments.

[0112] It should be noted that, for the aforementioned method embodiments, for the sake of simplicity, they are all expressed as a series of action combinations, but those skilled in the art should be aware that the present application is not limited by the described order of actions, because according to the present application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily required by the present application.

[0113] The various embodiments or implementation methods in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referenced to each other.

[0114] It should be noted that the phrases "in specific implementation", "in some embodiments", "in this embodiment", "exemplarily" and the like mentioned in the specification indicate that the described embodiment may include specific features, structures or characteristics, but not every embodiment may include the specific features, structures or characteristics. In addition, such phrases do not necessarily refer to the same embodiment. In addition, when describing specific features, structures or characteristics in conjunction with an embodiment, it is within the knowledge of those skilled in the art to implement such features, structures or characteristics in conjunction with other embodiments that are explicitly or not explicitly described.

[0115] In general, terms should be understood, at least in part, by the context in which they are used. For example, the term "one or more" as used herein may be used to describe any feature, structure, or characteristic in a singular sense, or may be used to describe a combination of features, structures, or characteristics in a plural sense, depending, at least in part, on the context. Similarly, terms such as "a," "an," or "the" may also be understood to convey singular usage or to convey plural usage, depending, at least in part, on the context.

[0116] It should be easily understood that “on,” “above,” and “over” in the present disclosure should be interpreted in the broadest manner, so that “on” not only means “directly on something,” but also includes the meaning of “on something” with intervening features or layers therebetween, and “above” or “over” not only includes the meaning of “above” or “over,” but also may include the meaning of “above” or “over something” with no intervening features or layers therebetween (i.e., directly on something).

[0117] In addition, spatially relative terms may be used herein for ease of explanation, for example, "below", "below", "below", "above", "above", etc., to describe the relationship of one element or feature relative to other elements or features as shown in the figure. Spatially relative terms are intended to include different orientations of the device in use or operation other than the orientation shown in the drawings. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein may also be interpreted accordingly. In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, please refer to the relevant description of other embodiments. The technical features of the above embodiments can be combined arbitrarily. In order to make the description concise, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0118] Furthermore, in the description of the present invention, it should be noted that the terms "front", "rear", etc. indicate positions or positional relationships based on positions or positional relationships, or the positions or positional relationships in which the invention product is usually placed when in use, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used to distinguish descriptions, and cannot be understood as indicating or implying relative importance.

[0119] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the invention disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the following claims.

[0120] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A method for manufacturing a circuit board with a stepped pattern of plug-in holes, characterized in that: The steps include: Arranging at least one circuit pattern (20) on at least one side of the dielectric layer (10) to obtain a first inner layer component; Disposing a separation layer (30) on at least one of the circuit patterns (20) to obtain a second inner layer component; A bonding layer (40) is provided on at least one side of the second inner layer component and pressed together with the first inner layer component to obtain an intermediate circuit board product; Arranging a plurality of via holes (50) on the intermediate circuit board product to obtain a circuit board; wherein the via holes (50) are arranged on the circuit pattern (20); The portion provided with the separation layer (30) is peeled off from the circuit board to form a plug-in hole stepped pattern circuit board having a leakage portion (60).

2. The method according to claim 1, characterized in that: The step of providing a separation layer (30) on at least one of the circuit patterns (20) to obtain a second inner layer component comprises: On the dielectric layer (10) provided with a plurality of the circuit patterns (20), a first separation layer is provided on any of the circuit patterns (20) to obtain an intermediate inner layer component; On the intermediate inner layer component, a second separation layer is arranged on at least one of the circuit patterns (20) adjacent to the first separation layer, and a third separation layer is arranged at a spatial position between the first separation layer and the second separation layer, thereby obtaining the second inner layer component.

3. The method according to claim 1, characterized in that: The bonding layer (40) is provided on at least one side of the second inner layer component and pressed together with the first inner layer component to obtain an intermediate circuit board product, comprising: The bonding layer (40) is provided on at least one side of the second inner layer component, and the first inner layer component is bonded to the second inner layer component provided with the bonding layer (40); The first inner layer component and the second inner layer component that have been bonded are pressed together to obtain the circuit board intermediate product.

4. The method according to claim 3, characterized in that: The bonding layer (40) is provided on at least one side of the second inner layer component and pressed together with the first inner layer component to obtain an intermediate circuit board product, comprising: The bonding layer (40) is provided on at least one side of the first inner layer component, and is bonded to a side of the second inner layer component on which the separation layer (30) is provided; The first inner layer component and the second inner layer component that have been bonded are pressed together to obtain the circuit board intermediate product.

5. The method according to claim 2, characterized in that: The circuit board is obtained by providing a plurality of via holes (50) on the intermediate circuit board product; wherein the via holes (50) are provided on the circuit pattern (20), comprising: A first conducting hole is provided at the position of the first separation layer of the intermediate circuit board product; According to the size of the leakage portion (60), a second plug hole is provided at the position of the second separation layer to obtain the circuit board.

6. The method according to claim 5, characterized in that: According to the size of the leakage portion (60), a second plug hole is arranged at the position of the second separation layer, and after the circuit board is obtained, the method comprises: The parts of the circuit board located at the first conductive hole and the second conductive hole are peeled off from the separation layer to obtain the plug-in hole stepped pattern circuit board.

7. The production method according to any one of claims 1 to 6, characterized in that: The separation layer (30) is selected from any one or more combinations of an ink layer, a gasket, a copper foil or a high temperature resistant film layer.

8. The production method according to any one of claims 1 to 6, characterized in that: The difference between the size of the separation layer (30) and the size of the leakage portion (60) is in the range of 0 to 0.3 mm.

9. The manufacturing method according to claim 5, characterized in that: The second plug hole is arranged at the position of the second separation layer according to the size of the leakage portion (60), and further comprises: A metal layer is disposed on the first plugging hole and the second plugging hole, respectively; wherein the thickness of the metal layer is smaller than the hole radius of the first plugging hole or the second plugging hole.

10. A plug-in hole stepped pattern circuit board, characterized in that: The circuit board is manufactured according to the manufacturing method according to any one of claims 1 to 9.

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