Image sensing module

Abstract

An image sensing module includes: a substrate; the light sensing element is arranged on the substrate; the light guide part is arranged on the light sensing element and is provided with a first light adjusting layer and a second light adjusting layer, the second light adjusting layer is arranged on the first light adjusting layer, the first light adjusting layer is provided with a first light transmitting area, and the second light adjusting layer is provided with a second light transmitting area. The first light-transmitting area and the second light-transmitting area respectively correspond to the light sensing element.

Description

Technical Field

[0001] The present invention relates to a sensing module, and more particularly to an image sensing module. Background Art

[0002] Contact Image Sensor (CIS) is a linear image sensor used to scan flat images or documents into electronic format for storage, display or transmission. It is mainly used in scanners, fax machines and multi-function printers.

[0003] The working principle of a contact image sensor is to irradiate the light generated by a light source onto the document to be scanned, and the light is reflected by the document. A lens group is used to focus the reflected light onto a photosensitive element such as a charge-coupled device (CCD) or a complementary metal oxide semiconductor (CMOS). The photosensitive element is used to convert the light signal into an electrical signal, thereby generating analog or digital pixel data.

[0004] Most existing contact image sensors use a rod lens to focus the image illuminated by the light source and image it on a charge-coupled device, and then obtain analog or digital data after the conversion of the photoelectric signal. However, the imaging principle of the rod lens will limit the imaging depth of field, and the scanned object must be placed very flat in a specific position. Furthermore, in order to increase the depth of field, the volume of the rod lens or the image distance will be greatly increased, or the aperture will be reduced, which will greatly increase the volume of the image sensing module and the finished product, and increase the cost.

[0005] Therefore, how to provide an image sensing module that can improve the imaging depth of field and reduce the size and cost is one of the current problems that need to be solved urgently. Summary of the invention

[0006] An object of the present invention is to provide an image sensing module which can improve the imaging depth of field and reduce the volume and cost.

[0007] The present invention discloses an image sensing module, which comprises: a substrate; a light sensing element disposed on the substrate; and a light guide disposed on the light sensing element and having a first light adjustment layer and a second light adjustment layer, wherein the second light adjustment layer is disposed on the first light adjustment layer, the first light adjustment layer has a first light-transmitting area, and the second light adjustment layer has a second light-transmitting area. The first light-transmitting area and the second light-transmitting area correspond to the light sensing element respectively.

[0008] In some embodiments, the image sensing module further includes: a lens layer disposed on the light guide component and having a plurality of lens elements, wherein the lens elements correspond to the light sensing elements respectively.

[0009] In some embodiments, each lens element corresponds to a light sensing element.

[0010] In some embodiments, the lens elements are arranged in a staggered manner, and the light sensing element corresponds to at least two of the lens elements.

[0011] In some embodiments, the first light-transmitting region has a first aperture, the second light-transmitting region has a second aperture, and the second aperture is greater than or equal to the first aperture.

[0012] In some embodiments, the first light-adjusting layer and the second light-adjusting layer are spaced apart by a first distance.

[0013] In some embodiments, the light guide element further includes a third light adjustment layer disposed on the second light adjustment layer, the third light adjustment layer has a third light-transmitting area, and the third light-transmitting area corresponds to the light sensing element.

[0014] In some embodiments, the first light-transmitting region has a first aperture, the second light-transmitting region has a second aperture, and the third light-transmitting region has a third aperture. The second aperture is greater than or equal to the first aperture, and the third aperture is greater than or equal to the second aperture.

[0015] In some embodiments, the first light adjustment layer and the second light adjustment layer are spaced apart by a first distance, and the second light adjustment layer and the third light adjustment layer are spaced apart by a second distance.

[0016] The present invention discloses another image sensing module, which includes: a substrate; a light sensing element disposed on the substrate; a light guide disposed on the light sensing element and having a light adjustment structure, the light adjustment structure having a plurality of light-transmitting areas corresponding to the light sensing element. An aperture of each light-transmitting area gradually decreases along a light incident direction.

[0017] In some embodiments, the light adjustment structure has a plurality of light adjustment layers, the light adjustment layers are arranged along the light incident direction, and the light-transmitting regions are disposed on the light adjustment layers.

[0018] In some embodiments, two adjacent light-adjusting layers are spaced apart by a distance. In some embodiments, a plurality of the distances are in a predetermined ratio to each other.

[0019] The present invention discloses an image sensing module, which comprises: a substrate; a light sensing element disposed on the substrate; a light guide disposed on the light sensing element and having a light adjustment layer, wherein the light adjustment layer has a plurality of light-transmitting areas and a light-shielding area, wherein the light-shielding area is disposed around the light-transmitting areas, and each light-transmitting area corresponds to the light sensing element.

[0020] In summary, the light guide of the image sensing module of the present invention has a light adjustment layer or a light adjustment structure, and the light adjustment layer or the light adjustment structure has a light-transmitting area corresponding to the light sensing element. Through the light adjustment layer or the light adjustment structure, only light at a specific angle can be allowed to enter the light sensing element. In other words, the image sensing module of the present invention can shield stray light through the light adjustment layer or the light adjustment structure and only allow light at a specific angle to be imaged on the light sensing element through the light adjustment layer or the light adjustment structure. Thereby, the image sensing module of the present invention can effectively improve the imaging depth of field on the light sensing element. In addition, the light adjustment layer or the light adjustment structure of the present invention can be formed on the light sensing element, for example, by a semiconductor process, thereby further reducing the overall volume and manufacturing cost.

[0021] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 FIG. 4 is a schematic diagram showing an image sensor device according to the present invention.

[0023] Figure 2 To indicate the Figure 1 FIG. 2 is a cross-sectional view of the image sensing module according to the first embodiment of the present invention taken along line AA.

[0024] Figure 3 FIG. 4 is a cross-sectional view of an image sensor module according to a second embodiment of the present invention.

[0025] Figure 4 It is a cross-sectional view showing a variation of the image sensing module of the present invention.

[0026] Figure 5 It is a cross-sectional view showing a variation of the image sensing module of the present invention.

[0027] Fig. 6A FIG. 4 is a cross-sectional view of an image sensor module according to a third embodiment of the present invention.

[0028] Figure 6B FIG. 4 is a top view of an image sensing module according to a third embodiment of the present invention.

[0029] Fig. 7A The image sensing module according to the fourth embodiment of the present invention is shown in FIG. Figure 7B Cross-sectional view of the BB line.

[0030] Figure 7B FIG. 4 is a top view of an image sensor module according to a fourth embodiment of the present invention.

[0031] Figure 8 It is a top view showing a variation of the image sensor module of the present invention.

[0032] Wherein, the reference numerals are:

[0033] 1, 2, 2A, 2B, 3, 4: Image sensing module

[0034] 11: Substrate

[0035] 12, 22, 32, 42: Light sensing elements

[0036] 13, 23, 23A, 33: Light guide

[0037] 131, 231: First light adjustment layer

[0038] 131A, 231A: First light-transmitting area

[0039] 131B, 132B: Shading area

[0040] 132, 232: Second light adjustment layer

[0041] 132A, 232A: Second light-transmitting area

[0042] 14: Translucent materials

[0043] 15, 25: Protective layer

[0044] 233: Third Light Adjustment Layer

[0045] 233A: The third light transmission area

[0046] 234: Fourth Light Adjustment Layer

[0047] 234A: Fourth light transmission area

[0048] 235: Side

[0049] 24, 34: opaque layer

[0050] 26, 36: Basal layer

[0051] 321: Spacing

[0052] 331, 332, 333, 334: Light adjustment layer

[0053] 331A, 332A, 333A, 334A: light-transmitting area

[0054] 37, 47: Lens layer

[0055] 371, 471, 471A: Lens elements

[0056] 9: Image sensor device

[0057] 91: Shell

[0058] 92: Light source module

[0059] 93: Circuit Board

[0060] A1: Long axis

[0061] AP1~AP4: Aperture

[0062] D: Arc diameter

[0063] D1: First spacing

[0064] D2: Second spacing

[0065] D3: The third spacing

[0066] H: Height

[0067] L: Light incident direction

[0068] LA1, LA2: Light adjustment structure DETAILED DESCRIPTION

[0069] The structural principle and working principle of the present invention are described in detail below in conjunction with the accompanying drawings:

[0070] As used herein, terms such as "first", "second", "third", "fourth", and "fifth" describe various elements, components, regions, layers, and / or portions, which should not be limited by these terms. These terms may only be used to distinguish one element, component, region, layer, or portion from another. Unless the context clearly indicates otherwise, terms such as "first", "second", "third", "fourth", and "fifth" as used herein do not imply a sequence or order.

[0071] Figure 1 FIG. 1 is a schematic diagram showing an image sensor device 9 according to the present invention. Figure 2 To indicate the Figure 1 The cross-sectional view of the image sensing module 1 according to the first embodiment of the present invention is taken along line AA.

[0072] like Figure 1 and Figure 2As shown, the image sensor device 9 may include, for example, a housing 91, a light source module 92, a circuit board 93 and an image sensing module 1, but this is not limiting. The light source module 92, the circuit board 93 and the image sensing module 1 are disposed in the housing 91, and the light source module 92 and the image sensing module 1 are both electrically connected to the circuit board 93. In some embodiments, the light source module 92 may include a light emitting element 921 and a light guide element 922, and the light emitting element is, for example, disposed on one side of the light guide element, and the light guide element can convert the light emitted by the light emitting element into a linear light source. Furthermore, the image sensor device 9 may be, for example, a linear contact image sensing device. The contact image sensing device is used to scan a flat document with an image or text into a specific electronic format for subsequent storage, display or transmission. The main application scope of the contact image sensing device may include desktop scanners, portable scanners, fax machines and multi-function printers.

[0073] The image sensor module 1 includes a substrate 11, a light sensing element 12 and a light guide 13. The substrate 11 is, for example, a strip-shaped substrate having a long axis A1 corresponding to the long axis of the light source module 92. The substrate 11 can be a semiconductor substrate, for example, a silicon substrate, but it is not limiting.

[0074] The light sensing element 12 is disposed on the substrate 11. The image sensing module 1 may include one light sensing element 12 or multiple light sensing elements 12, which is not restrictive. In the present embodiment, the image sensing module 1 having multiple light sensing elements 12 is used as an example for illustration, but it is not intended to limit the present invention. In some embodiments, the light sensing elements 12 are linearly disposed on the substrate 11, that is, the light sensing elements 12 are arranged along the long axis A1 of the substrate 11. It is worth mentioning that the spacing between the light sensing elements 12 is not restrictive, and different spacings may be required. The light sensing element 12 may be, for example, a photosensitive element such as a photodiode, but it is not restrictive.

[0075] The light guide 13 is disposed on the light sensing elements 12. The light guide 13 has a first light adjustment layer 131 and a second light adjustment layer 132, and the second light adjustment layer 132 is disposed on the first light adjustment layer 131. Furthermore, the first light adjustment layer 131 and the second light adjustment layer 132 together constitute a light adjustment structure LA1. The first light adjustment layer 131 has a first light-transmitting area 131A, and the second light adjustment layer 132 has a second light-transmitting area 132A.

[0076] The first light-transmitting area 131A and the second light-transmitting area 132A correspond to the light sensing elements 12, respectively. It is worth mentioning that the first light adjustment layer 131 and the second light adjustment layer 132 have light-shielding areas 131B and 132B in addition to the light-transmitting areas 131A and 132A. The light-shielding areas 131B and 132B are arranged around the light-transmitting areas 131A and 132A. The first light-transmitting area 131A is, for example, a plurality of openings arranged on the first light adjustment layer 131, and the second light-transmitting area 132A is, for example, a plurality of openings arranged on the second light adjustment layer 132, and the openings of the first light-transmitting area 131A and the openings of the second light-transmitting area 132A are aligned with each other. For example, the openings of the first light-transmitting area 131A and the openings of the second light-transmitting area 132A are aligned with each other by the central axis. In some other embodiments, the central axes of the openings of the first light-transmitting area and the openings of the second light-transmitting area may be slightly offset from each other, but they are all based on the principle of corresponding to the positions of the light sensing elements 12. The light shielding regions 131B and 132B are portions of the first light adjustment layer 131 and the second light adjustment layer 132 excluding the openings.

[0077] In addition, in this embodiment, one opening of the first light-transmitting region 131A and one opening of the second light-transmitting region 132A correspond to one light-sensing element 12, but this is not limiting. For example, more than two openings of the first light-transmitting region 131A and more than two openings of the second light-transmitting region 132A may correspond to one light-sensing element 12.

[0078] In some embodiments, the light adjustment structure LA1 can be formed on the substrate 11 using a semiconductor process. For example, a first light adjustment layer 131 of an opaque material is formed by coating on the substrate 11 and the light sensing element 12, and then an opening of the first light-transmitting area 131A is formed by etching. Next, after forming a light-transmitting material 14 on the first light adjustment layer 131, a second light adjustment layer 132 of an opaque material is formed by coating on the light-transmitting material 14. Similarly, an opening of the second light-transmitting area 132A is formed by etching. Finally, a light-transmitting material 14 can be formed on the second light adjustment layer 132, and a flattening process or a thinning process is used to make the upper surface of the light-transmitting material 14 and the upper surface of the second light adjustment layer 132 coplanar, and then a protective layer 15 is formed on the light-transmitting material 14 and the second light adjustment layer 132. The above process is not intended to limit the present invention, and different processes can be used according to different requirements. Furthermore, the thicknesses of the first light adjustment layer 131 , the second light adjustment layer 132 , and the light-transmitting material 14 are not limited.

[0079] In some embodiments, the first light-transmitting area 131A has a first aperture AP1, and the second light-transmitting area 132A has a second aperture AP2, which is greater than or equal to the first aperture AP1. In this embodiment, the second aperture AP2 is greater than the first aperture AP1, which is not restrictive.

[0080] Therefore, when light is incident on the light guide 13 along the light incident direction L, the light-transmitting regions 131A and 132A of the first light adjustment layer 131 and the second light adjustment layer 132 can only allow light of a specific angle (e.g., perpendicular to the light incident surface) to enter the light sensing element 12 along the light incident direction L, and the light-shielding regions 131B and 132B can shield stray light. In other words, the light guide 13 can act as a collimator, and the light-transmitting regions 131A and 132A of the first light adjustment layer 131 and the second light adjustment layer 132 can form a structure such as an aperture.

[0081] As described above, the image sensor module 1 of the present embodiment can shield stray light by using the light guide 13 to act as a collimator, and only allow light of a specific angle to be imaged on the light sensing element 12 through the light-transmitting areas 131A and 132A. Furthermore, the light-transmitting areas 131A and 132A of the light adjustment layers 131 and 132 act as small aperture structures to increase the imaging range of the light sensing element 12, thereby effectively improving the imaging depth of field on the light sensing element 12. In addition, the light adjustment layers 131 and 132 of the present embodiment can be formed on the light sensing element 12 by, for example, a semiconductor process, thereby further reducing the overall volume and manufacturing cost.

[0082] Figure 3 2 is a cross-sectional view showing an image sensor module 2 according to a second embodiment of the present invention. The difference between the image sensor module 2 according to the second embodiment and the image sensor module 1 according to the first embodiment is that the light guide 23 further includes a third light adjustment layer 233 disposed on the second light adjustment layer 232, and a fourth light adjustment layer 234 disposed on the third light adjustment layer 233. The third light adjustment layer 233 includes a third light-transmitting region 233A, and the fourth light adjustment layer 234 includes a fourth light-transmitting region 234A. The third light-transmitting region 233A and the fourth light-transmitting region 234A correspond to the light sensing elements 22, respectively. It should be noted that the light adjustment structure LA2 of this embodiment is described by taking four light adjustment layers 231, 232, 233, and 234 as an example, but this is not restrictive. For example, the light adjustment structure LA2 may also include only three light adjustment layers, or may include more than five light adjustment layers.

[0083] Similarly, the third light-transmitting region 233A is, for example, a plurality of openings disposed on the third light-adjusting layer 233, and the fourth light-transmitting region 234A is, for example, a plurality of openings disposed on the fourth light-adjusting layer 234, and the openings of the third light-transmitting region 233A and the openings of the fourth light-transmitting region 234A are aligned with each other. For example, the openings of the first light-transmitting region 231A, the second light-transmitting region 232A, the third light-transmitting region 233A, and the openings of the fourth light-transmitting region 234A are aligned with the central axis. In some other embodiments, the central axes of the openings may also be slightly offset, but in principle, they all correspond to the positions of the light sensing elements 12.

[0084] In some embodiments, the third light-transmitting area 233A has a third aperture AP3, the fourth light-transmitting area 234A has a fourth aperture AP4, the second aperture AP2 is greater than or equal to the first aperture AP1, the third aperture AP3 is greater than or equal to the second aperture AP2, and the fourth aperture AP4 is greater than or equal to the third aperture AP3. In this embodiment, the second aperture AP2 is greater than the first aperture AP1, the third aperture AP3 is greater than the second aperture AP2, and the fourth aperture AP4 is greater than the third aperture AP3. That is, the apertures AP1, AP2, AP3, and AP4 of the light-transmitting areas 231A, 232A, 233A, and 234A gradually decrease along the light incident direction L, but this is not restrictive.

[0085] In some embodiments, if the apertures AP1, AP2, AP3, and AP4 gradually decrease along the light incident direction L, the apertures AP1, AP2, AP3, and AP4 may be in a preset ratio, for example, the ratio of aperture AP1: aperture AP2: aperture AP3: aperture AP4 may be 1.0-4.0: 10.0-15.0: 15.0-20.0: 30.0-40.0. For example, the ratio of aperture AP1: aperture AP2: aperture AP3: aperture AP4 may be 1.0: 10.0: 15.0: 30.0. For another example, the ratio of aperture AP1: aperture AP2: aperture AP3: aperture AP4 may also be 2.0: 11.0: 16.0: 31.0. For another example, the ratio of aperture AP1: aperture AP2: aperture AP3: aperture AP4 may also be 2.1: 12.0: 17.0: 32.0. For another example, the ratio of aperture AP1: aperture AP2: aperture AP3: aperture AP4 may also be 2.5: 13.0: 18.0: 35.0. For another example, the ratio of aperture AP1: aperture AP2: aperture AP3: aperture AP4 may also be 2.4: 12.0: 18.0: 37.0. For another example, the ratio of aperture AP1: aperture AP2: aperture AP3: aperture AP4 may also be 3.5: 14.0: 19.0: 38.0. For another example, the ratio of aperture AP1: aperture AP2: aperture AP3: aperture AP4 may also be 4.0: 15.0: 20.0: 40.0. The above are only examples of some aspects, which are not intended to limit the present invention. The ratios between apertures AP1, AP2, AP3, and AP4 may be adjusted in other different ways according to needs.

[0086] Figure 4 FIG. 2 is a cross-sectional view showing a variation of the image sensing module 2A of the present invention. Figure 4As shown, the apertures AP1, AP2, AP3, and AP4 may also be the same. That is, the second aperture AP2 is equal to the first aperture AP1, the third aperture AP3 is equal to the second aperture AP2, and the fourth aperture AP4 is equal to the third aperture AP3. In this way, the imaging depth of field on the light sensing element 22 can also be effectively improved.

[0087] Please refer to Figure 3 As shown, in some embodiments, the aperture AP1 and the height H (the overall height of the light guide 23, the protective layer 25 and the base layer 26. It should be noted that if the protective layer 25 and the base layer 26 are not provided, the height H is the overall height of the light guide 23) may be a preset ratio, for example, the ratio of the aperture AP1:height H may be 1.0-2.0:80.0-90.0. For example, the ratio of the aperture AP1:height H may be 1.0:80.0. For another example, the ratio of the aperture AP1:height H may be 1.2:85.0. For another example, the ratio of the aperture AP1:height H may be 1.0:87.0. For another example, the ratio of the aperture AP1:height H may be 1.0:88.3. For another example, the ratio of the aperture AP1:height H may be 1.7:89.5. For another example, the ratio of the aperture AP1:height H may be 2.0:90.0. The above are merely examples and are not intended to limit the present invention. The ratio between the aperture AP1 and the height H may be adjusted in other ways as required.

[0088] Furthermore, the first light adjustment layer 231 and the second light adjustment layer 232 may be spaced apart by a first distance D1, the second light adjustment layer 232 and the third light adjustment layer 233 may be spaced apart by a second distance D2, and the third light adjustment layer 233 and the fourth light adjustment layer 234 may be spaced apart by a third distance D3. The distances D1, D2, and D3 (i.e., the thickness of the light-transmitting material between the light adjustment layers) may be the same or different. In some embodiments, if the distances D1, D2, and D3 are different, the distances D1, D2, and D3 may be in a preset ratio to each other, for example, the ratio of distance D1: distance D2: distance D3 may be 50.0-70.0: 40.0-60.0: 120.0-140.0. For example, the ratio of distance D1: distance D2: distance D3 may be 50.0: 40.0: 120.0. For another example, the ratio of distance D1: distance D2: distance D3 may be 60.0: 45.0: 125.0. For another example, the ratio of spacing D1: spacing D2: spacing D3 may be 68.4:42.2:137.0. For another example, the ratio of spacing D1: spacing D2: spacing D3 may be 70.0:55.6:130.5. For another example, the ratio of spacing D1: spacing D2: spacing D3 may be 58.0:60.0:140.0. The above are only examples and are not intended to limit the present invention. The ratios of spacings D1, D2, and D3 may be adjusted differently as needed.

[0089] Figure 5 FIG. 2 is a cross-sectional view showing a variation of the image sensor module 2B of the present invention. Figure 5 As shown, there may be no spacing between the light adjustment layers 231, 232, 233, and 234. That is, the spacing between the light adjustment layers 231, 232, 233, and 234 is zero. The light adjustment layers 231, 232, 233, and 234 may be formed in different process stages (formed separately) or formed in a single process stage (formed continuously). In this way, the process difficulty of the light guide 23B can be reduced while effectively improving the imaging depth of field on the light sensing element 22.

[0090] Please refer to Figure 3 As shown, in some embodiments, the image sensor module 2 may further include a light-proof layer 24 disposed on two side surfaces 235 of the light guide 23. The light-proof layer 24 is, for example, a black coating or spray paint, which may be disposed on two side surfaces 235 of the light guide 23 to shield lateral stray light. In this way, the imaging depth of field on the light sensing element 22 may be further improved.

[0091] In some embodiments, the image sensing module 2 may also have a base layer 26 disposed between the light guide 23 and the substrate 21. The base layer 26 is, for example, a light-transmitting material. The base layer 26 can be used to divide the process of the image sensing module 2 into a front section and a back section. That is, after the process of disposing the light sensing elements 22 on the substrate 21, the base layer 26 is first formed on the substrate 21 and the light sensing elements 22, and then the light guide 23 is formed on the base layer 26. Of course, a protective layer 25 can also be formed on the light guide 23. In this way, the light sensing elements 22 and the light guide 23 can be formed using different semiconductor processes. The above process is not intended to limit the present invention, and different processes can be used according to different requirements.

[0092] As described above, the image sensor module 2 of the present embodiment can shield the stray light by the light guide 23 acting as a collimator, and only allow the light of a specific angle to be imaged on the light sensing element 22 through the light-transmitting areas 231A, 232A, 233A, 234A. Furthermore, the light-transmitting areas 231A, 232A, 233A, 234A of the light adjustment layers 231, 232, 233, 234 act as small aperture structures to increase the imaging range of the light sensing element 22, so as to effectively improve the imaging depth of field on the light sensing element 22. In addition, the light adjustment layers 231, 232, 233, 234 of the present embodiment can be formed on the light sensing element 22 by, for example, a semiconductor process, thereby further reducing the overall volume and manufacturing cost. Furthermore, the image sensor module 2 can shield the lateral stray light by the light-impermeable layer 24, so as to further improve the imaging depth of field on the light sensing element 22. Furthermore, the image sensor module 2 may also include the base layer 26 so that the light sensing element 22 and the light guide member 23 may be formed by using different semiconductor processes.

[0093] Fig. 6A FIG. 4 is a cross-sectional view of an image sensor module 3 according to a third embodiment of the present invention. Figure 6B FIG. 2 is a top view of an image sensing module 3 according to a third embodiment of the present invention. Fig. 6A and Figure 6B As shown, the difference between the image sensing module 3 of the third embodiment and the image sensing module 2 of the second embodiment is that the image sensing module 3 further includes a lens layer 37 disposed on the light guide 33. The lens layer 37 has a plurality of lens elements 371, and the lens elements 371 correspond to the light sensing elements 32 or the light-transmitting areas 331A, 332A, 333A, and 334A, respectively. In other words, each lens element 371 can be disposed corresponding to each light sensing element 32, but not corresponding to the light-transmitting areas 331A, 332A, 333A, and 334A. Alternatively, each lens element 371 can be disposed corresponding to the light-transmitting areas 331A, 332A, 333A, and 334A, but not corresponding to each light sensing element 32. Of course, each lens element 371 can also be disposed corresponding to each light sensing element 32 and the light-transmitting areas 331A, 332A, 333A, and 334A at the same time.

[0094] The lens element 371 and the openings of the light-transmitting areas 331A, 332A, 333A, 334A are aligned with each other. For example, the lens element 371 and the openings of the light-transmitting areas 331A, 332A, 333A, 334A are aligned with the central axis. Furthermore, in this embodiment, one lens element 371 and one opening of the light-transmitting areas 331A, 332A, 333A, 334A correspond to one light sensing element 32, but this is not limiting. For example, more than two lens elements 371 and more than two openings of the light-transmitting areas 331A, 332A, 333A, 334A may be used to correspond to one light sensing element 32.

[0095] In some embodiments, the curvature diameter RoC and the height H (the overall height of the light guide 23, the protective layer 25 and the base layer 26) of the lens element 371 may be a preset ratio, for example, the ratio of the curvature diameter RoC: the height H may be 1.00-2.00: 2.00-3.00. For example, the ratio of the curvature diameter RoC: the height H may be 1.00: 2.00. For another example, the ratio of the curvature diameter RoC: the height H may be 1.15: 2.50. For another example, the ratio of the curvature diameter RoC: the height H may be 1.00: 2.70. For another example, the ratio of the curvature diameter RoC: the height H may be 1.00: 2.83. For another example, the ratio of the curvature diameter RoC: the height H may be 1.50: 3.00. For another example, the ratio of the curvature diameter RoC: the height H may be 2.00: 3.00. The above are merely examples and are not intended to limit the present invention. The ratio between the curvature diameter RoC and the height H may be adjusted in other different ways as required.

[0096] In some embodiments, the arc diameter D and the maximum aperture (e.g., aperture AP4) of the lens element 371 are less than or equal to the spacing 321 between adjacent light sensing elements 32. For example, the arc diameter D of the lens element 371 may be 30.0 μm to 40.0 μm, and the spacing 321 between adjacent light sensing elements 32 may be 40.0 to 50.0 μm. For another example, the arc diameter D of the lens element 371 may be 30.0 μm, and the spacing 321 between adjacent light sensing elements 32 may be 40.0 μm. For another example, the arc diameter D of the lens element 371 may be 35.2 μm, and the spacing 321 between adjacent light sensing elements 32 may be 43.7 μm. For another example, the arc diameter D of the lens element 371 may be 40.0 μm, and the spacing 321 between adjacent light sensing elements 32 may be 40.0 μm. For another example, the arc diameter D of the lens element 371 may be 39.0 μm, and the spacing 321 between adjacent light sensing elements 32 may be 42.3 μm. For another example, the arc diameter D of the lens element 371 may be 38.5 μm, and the spacing 321 between adjacent light sensing elements 32 may be 44.6 μm. The above are only examples, and are not intended to limit the present invention. The arc diameter D and the spacing 321 may be adjusted in other different ways according to needs.

[0097] As described above, the image sensor module 3 of the present embodiment can shield the stray light by the light guide 33 acting as a collimator, and only allow the light of a specific angle to be imaged on the light sensing element 32 through the light-transmitting areas 331A, 332A, 333A, 334A. Furthermore, the light-transmitting areas 331A, 332A, 333A, 334A of the light adjustment layers 331, 332, 333, 334 act as small aperture structures to increase the imaging range of the light sensing element 32, so as to effectively improve the imaging depth of field on the light sensing element 32. In addition, the light adjustment layers 331, 332, 333, 334 of the present embodiment can be formed on the light sensing element 32 by, for example, a semiconductor process, thereby further reducing the overall volume and manufacturing cost. Furthermore, the image sensor module 3 can shield the lateral stray light by the light-impermeable layer 34, so as to further improve the imaging depth of field on the light sensing element 32. Furthermore, the image sensor module 3 can also use the base layer 36 so that the light sensing element 32 and the light guide 33 can be formed using different semiconductor processes. Furthermore, the lens element 371 of the lens layer 37 can aggregate the incident light, further increasing the amount of incident light and improving the imaging depth of field on the light sensing element 32 without significantly increasing the overall volume and manufacturing cost.

[0098] Fig. 7A The image sensing module 4 according to the fourth embodiment of the present invention is shown in FIG. Figure 7B Cross-sectional view of the BB line. Figure 7B FIG. 4 is a top view of an image sensing module 4 according to a fourth embodiment of the present invention. Fig. 7A and Figure 7B As shown, the difference between the image sensing module 4 of the fourth embodiment and the image sensing module 3 of the third embodiment is that the multiple lens elements 471 of the lens layer 47 are arranged in a staggered manner, and each light sensing element 42 corresponds to at least two of the lens elements 471. The staggered arrangement is, for example, that the lens elements 471 are divided into two rows, upper and lower, and the central axes of the lens elements 471 in the upper and lower rows are staggered. Furthermore, in this embodiment, an example of one light sensing element 42 corresponding to two lens elements 471 is used for illustration, but it is not restrictive. It should be noted that some lens elements may not correspond to light sensing elements.

[0099] Thus, by converging incident light through a plurality of lens elements 471 , the amount of incident light can be further increased, thereby improving the imaging depth of field on the light sensing element 42 without significantly increasing the overall volume and manufacturing cost.

[0100] Figure 8 FIG. 4 is a top view showing a variation of the image sensing module 4A of the present invention. Figure 8As shown, one light sensing element 42 may correspond to three lens elements 471A. Of course, according to different designs, one light sensing element 42 may correspond to more than four lens elements. It should be noted that some lens elements may not correspond to light sensing elements.

[0101] In summary, the image sensing module of the present invention can shield stray light by using the light guide as a collimator, and only allow light of a specific angle to be imaged on the light sensing element through the light-transmitting area. Furthermore, by using the light-transmitting area of ​​the light adjustment layer as a small aperture structure to limit (reduce) the angle of light entering the light sensing element, the effect is equivalent to reducing the angle of light entering the light sensing element by reducing the aperture design of a general lens, thereby increasing the imaging range of the light sensing element, so as to effectively improve the imaging depth of field on the light sensing element. In addition, the light adjustment layer of the present invention can be formed on the light sensing element by a semiconductor process, for example, to further reduce the overall volume and manufacturing cost. Furthermore, the image sensing module of the present invention can further shield lateral stray light by using an opaque layer to further improve the imaging depth of field on the light sensing element. In addition, the image sensing module of the present invention can also use a base layer so that the light sensing element and the light guide can be formed by different semiconductor processes. Furthermore, the image sensing module of the present invention can aggregate incident light through the lens elements of the lens layer, thereby further increasing the amount of incident light and improving the imaging depth of field on the light sensing element without significantly increasing the overall volume and manufacturing cost.

[0102] As used herein and not otherwise defined, the terms "substantially" and "approximately" are used to describe and describe small variations. When applied to an event or circumstance, the term may include the exact moment the event or circumstance occurred, as well as the event or circumstance occurring to a close approximation point. For example, when applied to a numerical value, the term may include a range of variation less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.

[0103] Of course, the present invention may have many other embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art may make various corresponding changes and modifications based on the present invention, but these corresponding changes and modifications should all fall within the scope of protection of the claims attached to the present invention.

Claims

1. An image sensing module, characterized in that: Include: a substrate; a light sensing element disposed on the substrate; and a light guide disposed on the light sensing element and having a first light adjustment layer and a second light adjustment layer, wherein the second light adjustment layer is disposed on the first light adjustment layer, the first light adjustment layer has a first light-transmitting area, and the second light adjustment layer has a second light-transmitting area, The first light-transmitting area and the second light-transmitting area correspond to the light sensing element respectively.

2. The image sensing module according to claim 1, wherein: Also includes: A lens layer is disposed on the light guide component and has a lens element. The lens element corresponds to the light sensing element, or the first light-transmitting area and the second light-transmitting area.

3. The image sensing module according to claim 2, wherein: Each lens element corresponds to the light sensing element.

4. The image sensing module according to claim 2, wherein: The lens elements are arranged in a staggered manner, and the light sensing element corresponds to at least two of the lens elements.

5. The image sensing module according to claim 1, wherein: The first light-transmitting area has a first aperture, the second light-transmitting area has a second aperture, and the second aperture is greater than or equal to the first aperture.

6. The image sensing module according to claim 1, wherein: The first light adjustment layer and the second light adjustment layer are spaced apart by a first distance.

7. The image sensing module according to claim 1, wherein: The light guide component further comprises a third light adjustment layer disposed on the second light adjustment layer. The third light adjustment layer has a third light-transmitting area corresponding to the light sensing element.

8. The image sensing module according to claim 7, wherein: The first light-transmitting area has a first aperture, the second light-transmitting area has a second aperture, and the third light-transmitting area has a third aperture. The second aperture is greater than or equal to the first aperture, and the third aperture is greater than or equal to the second aperture.

9. The image sensing module according to claim 7, wherein: The first light adjustment layer and the second light adjustment layer are spaced apart by a first distance, and the second light adjustment layer and the third light adjustment layer are spaced apart by a second distance.

10. An image sensing module, characterized in that: Include: a substrate; A light sensing element is disposed on the substrate; A light guide is disposed on the light sensing element and has a light adjustment structure. The light adjustment structure has a plurality of light-transmitting areas corresponding to the light sensing element. Wherein, an aperture of each light-transmitting area gradually decreases along a light incident direction.

11. The image sensing module according to claim 10, wherein: Also includes: A lens layer is disposed on the light guide component and has a plurality of lens elements, and the lens elements correspond to the light sensing elements respectively.

12. The image sensing module according to claim 11, wherein: Each lens element corresponds to the light sensing element.

13. The image sensing module according to claim 11, wherein: The lens elements are arranged in a staggered manner, and the light sensing element corresponds to at least two of the lens elements.

14. The image sensing module according to claim 11, wherein: The light adjustment structure has a plurality of light adjustment layers, the light adjustment layers are arranged along the incident direction of the light, and the light-transmitting regions are disposed on the light adjustment layers.

15. The image sensing module according to claim 14, wherein: Two adjacent light adjustment layers are spaced apart by a distance.

16. The image sensing module according to claim 15, wherein: A plurality of the intervals are in a preset ratio with respect to each other.

17. An image sensing module, characterized in that: Include: a substrate; A light sensing element is disposed on the substrate; A light guide is arranged on the light sensing element and has a light adjustment layer. The light adjustment layer has a plurality of light-transmitting areas and a light-shielding area. The light-shielding area is arranged around the light-transmitting areas. Each light-transmitting area corresponds to the light sensing element.

18. The image sensing module according to claim 17, wherein: Also includes: A lens layer is disposed on the light guide component and has a plurality of lens elements, and the lens elements correspond to the light sensing elements respectively.

19. The image sensing module according to claim 18, wherein: Each lens element corresponds to the light sensing element.

20. The image sensing module according to claim 18, wherein: The lens elements are arranged in a staggered manner, and the light sensing element corresponds to at least two of the lens elements.

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