Insulation sealant and preparation method thereof

Abstract

The invention discloses an insulating sealant and a preparation method thereof, and belongs to the technical field of sealants, and the insulating sealant comprises the following components in parts by weight: 100 parts of organic silicon resin, 5-10 parts of simethicone, 10-30 parts of a reinforcing filler, 50-100 parts of a functional filler, 0-3 parts of a coloring agent, 3-10 parts of a cross-linking agent, 1-3 parts of a catalyst, 1-2 parts of a water removal agent and 2-6 parts of a functional auxiliary agent. The organic silicon resin is prepared from phenyl MQ resin, first alpha, omega-dihydroxy polydimethylsiloxane and second alpha, omega-dihydroxy polydimethylsiloxane according to the weight ratio of 1: (2 to 3): (1 to 2); the viscosity of the first alpha, omega-dihydroxy polydimethylsiloxane at the temperature of 25 DEG C is 1000 to 20000 mPa.s; and the viscosity of the second alpha, omega-dihydroxy polydimethylsiloxane at the temperature of 25 DEG C is 80000 to 800000 mPa * s. The insulating sealant disclosed by the invention has excellent water resistance, aging resistance, insulating property and adhesive property, and has a wide application prospect.

Description

Technical Field

[0001] The invention relates to the technical field of sealants, and in particular to an insulating sealant and a preparation method thereof. Background Art

[0002] Sealant is a material that can deform with the shape of the substrate surface and has certain bonding properties. It is an adhesive used to fill the gap of the configuration to achieve the effect of isolation and sealing. It has the functions of anti-leakage, waterproof, anti-vibration, sound insulation, and heat insulation. It is widely used in the sealing of construction, transportation, electronic instruments and parts. In order to ensure the stability and reliability of the electrical properties and mechanical strength of motors and electrical components, it is necessary to not only seal between conductors, gaps, and outlet leads, but also have corresponding insulation properties. At present, epoxy resin, phenolic resin, unsaturated polyester resin, and water glass glue are the most commonly used insulating sealants, and are widely used in various electrical components.

[0003] The disadvantage of the insulating sealant made of the above materials is that the construction performance is not good. The method of using water glass for sealing mentioned in patent CN10126989A has the problem that the viscosity is too low and it is not easy to construct due to the flow, which easily leads to sealing failure. The sealant prepared by epoxy resin disclosed in patent CN 105385364 A has the characteristics of hardness and brittleness, which limits their use in some parts that may twist and bend easily. In addition, the above materials also have the disadvantages of insufficient weather resistance, temperature change resistance, and aging resistance. With the increase of service life, cracking and powdering will occur, resulting in insulation failure.

[0004] In view of this, this application is filed. Summary of the invention

[0005] The purpose of the present invention is to overcome the shortcomings of the prior art and provide an insulating sealant and a preparation method thereof. The insulating sealant of the present invention has excellent water resistance, aging resistance, insulation and bonding properties and has broad application prospects.

[0006] To achieve the above object, the technical solution adopted by the present invention is:

[0007] An insulating sealant comprises the following components in parts by weight: 100 parts of organic silicone resin, 5 to 10 parts of dimethyl silicone oil, 10 to 30 parts of reinforcing filler, 50 to 100 parts of functional filler, 0 to 3 parts of colorant, 3 to 10 parts of crosslinking agent, 1 to 3 parts of catalyst, 1 to 2 parts of dewatering agent, and 2 to 6 parts of functional additive;

[0008] The silicone resin includes a phenyl MQ resin, a first α,ω-dihydroxy polydimethylsiloxane, and a second α,ω-dihydroxy polydimethylsiloxane in a weight ratio of 1:(2-3):(1-2);

[0009] The viscosity of the first α,ω-dihydroxy polydimethylsiloxane at 25° C. is 1000-20000 mPa·s; the viscosity of the second α,ω-dihydroxy polydimethylsiloxane at 25° C. is 80000-800000 mPa·s.

[0010] The present invention creatively adopts high and low viscosity α, ω-dihydroxy polydimethylsiloxane and phenyl MQ resin as silicone resin, wherein the viscosity of the first α, ω-dihydroxy polydimethylsiloxane and the second α, ω-dihydroxy polydimethylsiloxane is greatly different, which can effectively improve the processing performance and curing performance of the sealant, promote the formation of a denser cross-linked network structure, promote the uniform dispersion of other ingredients, and improve the compatibility and compatibility of the formula, thereby significantly improving the performance of the sealant, making construction more convenient, and the material has elasticity and a wider application scenario after cross-linking molding. The compounded silicone resin makes the product's resistance to temperature changes, weather resistance, and aging resistance improved compared to traditional insulating sealants.

[0011] As a preferred embodiment of the present invention, the phenyl MQ resin is obtained by reacting methylphenylethoxysilane and tetraethoxysilane at an M / Q ratio of (0.5-1).

[0012] As a preferred embodiment of the present invention, the viscosity of the first α,ω-dihydroxy polydimethylsiloxane at 25° C. is 10000-15000 mPa·s.

[0013] As a preferred embodiment of the present invention, the viscosity of the second α,ω-dihydroxypolydimethylsiloxane at 25° C. is 200,000 to 400,000 mPa·s.

[0014] As a preferred embodiment of the present invention, the viscosity of the dimethyl silicone oil at 25° C. is 200 to 1000 mPa·s.

[0015] As a preferred embodiment of the present invention, the reinforcing filler is white carbon black.

[0016] As a preferred embodiment of the present invention, the functional filler includes at least one of aluminum hydroxide, magnesium hydroxide, ammonium polyphosphate, anhydrous zinc borate, decabromodiphenylethane, ammonium polyphosphate, pentaerythritol, melamine, silica aerogel, hollow glass microspheres, hollow ceramic microspheres, nano-calcium carbonate, nano-silicon powder, nano-talc, nano-zinc oxide, nano-aluminum oxide, nano-silicon carbide, and graphene.

[0017] As a preferred embodiment of the present invention, the colorant includes at least one of carbon black, iron oxide pigment, titanium dioxide, chromium oxide pigment, and cobalt chrome green;

[0018] The crosslinking agent includes at least one of methyltrimethoxysilane, ethyltrimethoxysilane, isopropyltrimethoxysilane, methyltriethoxysilane, dichloromethyltriethoxysilane, anilinomethyltriethoxysilane, diethylaminomethyltriethoxysilane, isopropyltriethoxysilane, isobutyltriethoxysilane, tetramethoxysilane and tetraethoxysilane.

[0019] As a preferred embodiment of the present invention, the catalyst comprises at least one of an organic tin catalyst and an organic titanium catalyst;

[0020] The dewatering agent includes at least one of vinyl trimethoxy silane, vinyl triethoxy silane, silazane, and isocyanate triethoxy silane;

[0021] The functional auxiliary agent includes polyamide wax.

[0022] The present invention also provides a method for preparing an insulating sealant, comprising the following steps:

[0023] (1) mixing a silicone resin, dimethyl silicone oil, a reinforcing filler, and a functional filler uniformly at 120 to 140° C., and then removing low-boiling substances at a vacuum degree of -0.15 MPa to -0.05 MPa for 3 to 5 hours to obtain a mixed material;

[0024] (2) After the mixture is cooled to a temperature of ≤40°C under nitrogen protection, a cross-linking agent, a catalyst, a dehydrating agent, and a functional additive are added in sequence and mixed evenly to obtain an insulating sealant.

[0025] The beneficial effects of the present invention are as follows: the present invention adopts high and low viscosity α, ω-dihydroxy polydimethylsiloxane and phenyl MQ resin as silicone resin, wherein the viscosity difference between the first α, ω-dihydroxy polydimethylsiloxane and the second α, ω-dihydroxy polydimethylsiloxane is large, which can effectively improve the processing performance and curing performance of the sealant, promote the formation of a denser cross-linked network structure, promote the uniform dispersion of other components, improve the compatibility and compatibility of the formula, thereby significantly improving the performance of the sealant, making the construction more convenient, and the material has elasticity and wider application scenarios after cross-linking molding. The compounded silicone resin makes the product's resistance to temperature changes, weather resistance, and aging resistance improved compared to traditional insulating sealants. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application are described clearly and completely below. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0027] In the present application, the technical features described in an open manner include closed technical solutions composed of the listed features, and also include open technical solutions containing the listed features.

[0028] In this application, when it comes to numerical ranges, unless otherwise specified, the above numerical ranges are deemed to be continuous and include the minimum and maximum values ​​of the range, as well as each value between such minimum and maximum values. Further, when a range refers to an integer, each integer between the minimum and maximum values ​​of the range is included. In addition, when multiple ranges are provided to describe features or characteristics, the ranges can be merged. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all subranges included therein.

[0029] In the present application, there is no particular limitation on the specific dispersion and stirring treatment methods.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0031] Unless otherwise specified, the components, raw materials or instruments used in the embodiments and comparative examples of the present invention are all commercially available raw materials or instruments, and the components and raw materials used in each parallel experiment are all of the same kind.

[0032] Wherein, the raw materials of the embodiments and comparative examples are from the following sources:

[0033] α,ω-dihydroxypolydimethylsiloxane-1: viscosity 15000 mPa·s at 25°C, sourced from Dow Corning.

[0034] α,ω-dihydroxypolydimethylsiloxane-2: Viscosity at 25°C is 10000 mPa·s, sourced from Dow Corning.

[0035] α,ω-dihydroxypolydimethylsiloxane-3: Viscosity at 25°C is 20,000 mPa·s, sourced from Dow Corning.

[0036] α,ω-dihydroxypolydimethylsiloxane-4: Viscosity at 25°C is 1000 mPa·s, sourced from Dow Corning.

[0037] α,ω-dihydroxypolydimethylsiloxane-5: Viscosity at 25°C is 40,000 mPa·s, sourced from Dow Corning.

[0038] α,ω-Dihydroxypolydimethylsiloxane-6: Viscosity 500 mPa·s at 25°C, sourced from Dow Corning.

[0039] α,ω-dihydroxypolydimethylsiloxane-7: viscosity 400000 mPa·s at 25°C, sourced from Dow Corning.

[0040] α,ω-dihydroxypolydimethylsiloxane-8: Viscosity at 25°C is 200,000 mPa·s, sourced from Dow Corning.

[0041] α,ω-dihydroxypolydimethylsiloxane-9: Viscosity at 25°C is 80,000 mPa·s, sourced from Dow Corning.

[0042] α,ω-dihydroxy polydimethylsiloxane-10: The viscosity at 25°C is 800,000 mPa·s, and it is sourced from Dow Corning.

[0043] Methylphenylethoxysilane: from Wuhan Proloff Biotechnology Co., Ltd., CAS No. 1825-58-7.

[0044] The preparation method of phenyl MQ resin is as follows: methylphenylethoxysilane and tetraethoxysilane are weighed in a ratio of M / Q ratio of 1, methylphenylethoxysilane and water are first added to a reaction container, concentrated hydrochloric acid is added to adjust the pH to 1, and then an appropriate amount of xylene solvent is added. The mixture is refluxed and stirred at 70°C, and tetraethoxysilane is added dropwise for 3 hours to carry out a hydrolysis reaction, and then the mixture is allowed to stand for stratification, the acid water is poured out, and the mixture is washed with water until neutral, filtered, and the temperature is raised to 120°C, and xylene is distilled off under reduced pressure to obtain phenyl MQ silicone resin.

[0045] Dimethyl silicone oil: The viscosity at 25° C. is 500 mPa·s and is commonly available on the market.

[0046] White carbon black: from Cabot, brand TS-720.

[0047] Nano zinc oxide: from Jiyuan Lutai Nanomaterials Co., Ltd., brand It-a01.

[0048] Graphene: Sourced from Henan Liugong Graphite Co., Ltd., brand LG-1401.

[0049] Cross-linking agent: phenylaminomethyl triethoxysilane, from Guangzhou Shuangtao, brand DP-811.

[0050] Catalyst: an organic tin catalyst (dibutyltin dilaurate) and an organic titanium catalyst (tetraisobutyl titanate) in a weight ratio of 1:2.

[0051] Dewatering agent: vinyl trimethoxysilane and isocyanate triethoxysilane are composed in a weight ratio of 1:1.

[0052] Functional additives: polyamide wax, core chemistry, brand PAMID D75.

[0053] The following examples are provided to facilitate understanding of the present invention. These examples are not provided to limit the scope of the claims.

[0054] Example 1

[0055] An insulating sealant comprises the following components in parts by weight: 100 parts of silicone resin, 8 parts of dimethyl silicone oil, 20 parts of white carbon black, 40 parts of nano zinc oxide, 40 parts of graphene, 2 parts of titanium dioxide, 5 parts of a cross-linking agent, 2 parts of a catalyst, 1.5 parts of a dehydrating agent, and 5 parts of a functional additive;

[0056] The silicone resin includes phenyl MQ resin, α,ω-dihydroxy polydimethylsiloxane-1 and α,ω-dihydroxy polydimethylsiloxane-7 in a weight ratio of 1:2:2;

[0057] The preparation method of the insulating sealant comprises the following steps:

[0058] (1) mixing silicone resin, dimethyl silicone oil, white carbon black, nano zinc oxide and graphene at 130° C., and then removing low boiling points at a vacuum degree of -0.05 MPa for 4 hours to obtain a mixture;

[0059] (2) After the mixture is cooled to a temperature of ≤40°C under nitrogen protection, a cross-linking agent, a catalyst, a dehydrating agent, and a functional additive are added in sequence and mixed evenly to obtain an insulating sealant.

[0060] Example 2

[0061] The difference between Example 2 and Example 1 is that the amount of raw materials used is different, and the other aspects are the same.

[0062] An insulating sealant comprises the following components in parts by weight: 100 parts of organic silicone resin, 5 parts of dimethyl silicone oil, 30 parts of white carbon black, 25 parts of nano zinc oxide, 25 parts of graphene, 3 parts of titanium dioxide, 3 parts of cross-linking agent, 3 parts of catalyst, 1 part of dewatering agent and 6 parts of functional additives.

[0063] Example 3

[0064] The difference between Example 3 and Example 1 is that the amount of raw materials used is different, and the other aspects are the same.

[0065] An insulating sealant comprises the following components in parts by weight: 100 parts of organic silicone resin, 10 parts of dimethyl silicone oil, 10 parts of white carbon black, 50 parts of nano zinc oxide, 50 parts of graphene, 10 parts of cross-linking agent, 1 part of catalyst, 2 parts of dewatering agent and 2 parts of functional additive.

[0066] Example 4

[0067] The difference between Example 4 and Example 1 is that the organic silicone resin in Example 4 is different from that in Example 1, and the other parts are the same.

[0068] The organic silicone resin includes phenyl MQ resin, α,ω-dihydroxy polydimethylsiloxane-1 and α,ω-dihydroxy polydimethylsiloxane-7 in a weight ratio of 1:3:1.

[0069] Example 5

[0070] The difference between Example 5 and Example 1 is that Example 5 uses an equal amount of α,ω-dihydroxypolydimethylsiloxane-2 to replace α,ω-dihydroxypolydimethylsiloxane-1, and the rest are the same.

[0071] Example 6

[0072] The difference between Example 6 and Example 1 is that Example 6 uses an equal amount of α,ω-dihydroxypolydimethylsiloxane-3 to replace α,ω-dihydroxypolydimethylsiloxane-1, and the rest are the same.

[0073] Example 7

[0074] The difference between Example 7 and Example 1 is that Example 7 uses an equal amount of α,ω-dihydroxypolydimethylsiloxane-4 to replace α,ω-dihydroxypolydimethylsiloxane-1, and the rest are the same.

[0075] Example 8

[0076] The difference between Example 8 and Example 1 is that Example 8 uses an equal amount of α,ω-dihydroxy polydimethylsiloxane-8 to replace α,ω-dihydroxy polydimethylsiloxane-7, and the rest are the same.

[0077] Example 9

[0078] The difference between Example 9 and Example 1 is that Example 9 uses an equal amount of α,ω-dihydroxy polydimethylsiloxane-9 to replace α,ω-dihydroxy polydimethylsiloxane-7, and the rest are the same.

[0079] Example 10

[0080] The difference between Example 10 and Example 1 is that Example 10 uses an equal amount of α,ω-dihydroxy polydimethylsiloxane-10 to replace α,ω-dihydroxy polydimethylsiloxane-7, and the rest are the same.

[0081] Comparative Example 1

[0082] The difference between Comparative Example 1 and Example 1 is that the silicone resin in Comparative Example 1 is a single α,ω-dihydroxypolydimethylsiloxane-1, and the other parts are the same.

[0083] Comparative Example 2

[0084] The difference between Comparative Example 2 and Example 1 is that the silicone resin in Comparative Example 2 is a single α,ω-dihydroxypolydimethylsiloxane-7, and the other parts are the same.

[0085] Comparative Example 3

[0086] The difference between Comparative Example 3 and Example 1 is that the silicone resin in Comparative Example 3 is different from that in Example 1, and the other parts are the same.

[0087] The organic silicone resin described in this comparative example includes phenyl MQ resin and α,ω-dihydroxypolydimethylsiloxane-1 in a weight ratio of 1:2.

[0088] Comparative Example 4

[0089] The difference between Comparative Example 4 and Example 1 is that the organic silicone resin in Comparative Example 4 is different from that in Example 1, and the other parts are the same.

[0090] The organic silicone resin in this comparative example includes phenyl MQ resin and α,ω-dihydroxypolydimethylsiloxane-7 in a weight ratio of 1:2.

[0091] Comparative Example 5

[0092] The difference between Comparative Example 5 and Example 1 is that the silicone resin in Comparative Example 5 is different from that in Example 1, and the other parts are the same.

[0093] The organic silicone resin in this comparative example includes α,ω-dihydroxypolydimethylsiloxane-1 and α,ω-dihydroxypolydimethylsiloxane-7 in a weight ratio of 2:2.

[0094] Comparative Example 6

[0095] The difference between Comparative Example 6 and Example 1 is that the silicone resin in Comparative Example 6 is different from that in Example 1, and the other parts are the same.

[0096] The organic silicone resin in this comparative example includes phenyl MQ resin, α,ω-dihydroxy polydimethylsiloxane-5 and α,ω-dihydroxy polydimethylsiloxane-7 in a weight ratio of 1:2:2.

[0097] Comparative Example 7

[0098] The difference between Comparative Example 7 and Example 1 is that the silicone resin in Comparative Example 7 is different from that in Example 1, and the other parts are the same.

[0099] The organic silicone resin in this comparative example includes phenyl MQ resin, α,ω-dihydroxy polydimethylsiloxane-6 and α,ω-dihydroxy polydimethylsiloxane-7 in a weight ratio of 1:2:2.

[0100] Comparative Example 8

[0101] The difference between Comparative Example 8 and Example 1 is that the silicone resin in Comparative Example 8 is different from that in Example 1, and the other parts are the same.

[0102] The organic silicone resin in this comparative example includes phenyl MQ resin, α,ω-dihydroxy polydimethylsiloxane-1 and α,ω-dihydroxy polydimethylsiloxane-5 in a weight ratio of 1:2:2.

[0103] Comparative Example 9

[0104] The difference between Comparative Example 9 and Example 1 is that the silicone resin in Comparative Example 9 is different from that in Example 1, and the other parts are the same.

[0105] The organic silicone resin includes phenyl MQ resin, α,ω-dihydroxy polydimethylsiloxane-1 and α,ω-dihydroxy polydimethylsiloxane-7 in a weight ratio of 1:1:3.

[0106] Comparative Example 10

[0107] The difference between Comparative Example 10 and Example 1 is that the silicone resin in Comparative Example 10 is different from that in Example 1, and the other parts are the same.

[0108] The organic silicone resin includes phenyl MQ resin, α,ω-dihydroxy polydimethylsiloxane-1 and α,ω-dihydroxy polydimethylsiloxane-7 in a weight ratio of 1:3.5:0.5.

[0109] Test Case

[0110] Tensile strength: GB / T528-2009.

[0111] Volume resistivity: GB / T1692-2008.

[0112] Breakdown voltage: GB / T1692-2008.

[0113] After UV aging for 1000h, the electrical connectors were sealed with insulating sealant to form connector protection parts and tested with a water immersion experiment (25°C, 1m, 24h).

[0114] After high and low temperature cycles (-40℃*12h, 80℃*12h, 6 cycles), the electrical connectors are sealed with insulating sealant to make connector protection parts and tested with water immersion experiments (25℃, 1m, 24h).

[0115] Table 1

[0116]

[0117]

[0118] It can be seen from Table 1 that the insulating sealant of the present invention has excellent water resistance, aging resistance, insulation and bonding properties, and has broad application prospects.

[0119] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the present invention.

Claims

1. An insulating sealant, characterized in that: The invention comprises the following components in parts by weight: 100 parts of organic silicone resin, 5 to 10 parts of dimethyl silicone oil, 10 to 30 parts of reinforcing filler, 50 to 100 parts of functional filler, 0 to 3 parts of colorant, 3 to 10 parts of crosslinking agent, 1 to 3 parts of catalyst, 1 to 2 parts of dewatering agent, and 2 to 6 parts of functional additive; The silicone resin includes a phenyl MQ resin, a first α,ω-dihydroxy polydimethylsiloxane, and a second α,ω-dihydroxy polydimethylsiloxane in a weight ratio of 1:(2-3):(1-2); The viscosity of the first α,ω-dihydroxy polydimethylsiloxane at 25° C. is 1000-20000 mPa·s; the viscosity of the second α,ω-dihydroxy polydimethylsiloxane at 25° C. is 80000-800000 mPa·s.

2. The insulating sealant according to claim 1, characterized in that: The phenyl MQ resin is obtained by reacting methylphenylethoxysilane and tetraethoxysilane according to an M / Q ratio of (0.5-1).

3. The insulating sealant according to claim 1, characterized in that: The viscosity of the first α,ω-dihydroxy polydimethylsiloxane at 25° C. is 10000 to 15000 mPa·s.

4. The insulating sealant according to claim 1, characterized in that: The viscosity of the second α,ω-dihydroxy polydimethylsiloxane at 25° C. is 200,000 to 400,000 mPa·s.

5. The insulating sealant according to claim 1, characterized in that: The viscosity of the dimethyl silicone oil at 25° C. is 200 to 1000 mPa·s.

6. The insulating sealant according to claim 1, characterized in that: The reinforcing filler is white carbon black.

7. The insulating sealant according to claim 1, characterized in that: The functional filler includes at least one of aluminum hydroxide, magnesium hydroxide, ammonium polyphosphate, anhydrous zinc borate, decabromodiphenylethane, ammonium polyphosphate, pentaerythritol, melamine, silica aerogel, hollow glass microspheres, hollow ceramic microspheres, nano calcium carbonate, nano silicon powder, nano talc, nano zinc oxide, nano aluminum oxide, nano silicon carbide, and graphene.

8. The insulating sealant according to claim 1, characterized in that: The colorant includes at least one of carbon black, iron oxide pigment, titanium dioxide, chromium oxide pigment, and cobalt chrome green; The crosslinking agent includes at least one of methyltrimethoxysilane, ethyltrimethoxysilane, isopropyltrimethoxysilane, methyltriethoxysilane, dichloromethyltriethoxysilane, anilinomethyltriethoxysilane, diethylaminomethyltriethoxysilane, isopropyltriethoxysilane, isobutyltriethoxysilane, tetramethoxysilane and tetraethoxysilane.

9. The insulating sealant according to claim 1, characterized in that: The catalyst comprises at least one of an organic tin catalyst and an organic titanium catalyst; The dewatering agent includes at least one of vinyl trimethoxy silane, vinyl triethoxy silane, silazane, and isocyanate triethoxy silane; The functional auxiliary agent includes polyamide wax.

10. The method for preparing the insulating sealant according to any one of claims 1 to 9, characterized in that: The following steps are involved: (1) mixing a silicone resin, dimethyl silicone oil, a reinforcing filler, and a functional filler uniformly at 120 to 140° C., and then removing low-boiling substances at a vacuum degree of -0.15 MPa to -0.05 MPa for 3 to 5 hours to obtain a mixed material; (2) After the mixture is cooled to a temperature of ≤40°C under nitrogen protection, a cross-linking agent, a catalyst, a dehydrating agent, and a functional additive are added in sequence and mixed evenly to obtain an insulating sealant.

Images