Quick heat dissipation device for embedded computer

Abstract

The invention relates to the technical field of computer equipment, and particularly discloses an embedded computer rapid heat dissipation device which comprises a mounting frame, the middle of the mounting frame is U-shaped, a mounting hole is formed in the upper surface of the outer end of the mounting frame in a penetrating mode, and a bolt is arranged in the mounting hole. According to the quick heat dissipation device for the embedded computer, after the insertion frame is reset, the buckling plate is reset, so that the outer surface of the upper side of the embedded computer is clamped on a sliding rod on the buckling plate, and the installation of the embedded computer is completed; the embedded computer can be rapidly installed on the mobile device in an elastic insertion mode, the use convenience is greatly improved, meanwhile, the embedded computer can be rapidly disassembled, and the embedded computer can be conveniently taken out for maintenance after being damaged.

Description

Technical Field

[0001] The invention relates to the technical field of computer equipment, in particular to a fast heat dissipation device for an embedded computer. Background Art

[0002] An embedded computer is a special-purpose computer designed for a specific application or system. Unlike general-purpose computers, embedded computers are usually embedded in the device they serve rather than being used as a standalone device.

[0003] In the field of modern computer equipment technology, embedded computers are widely used as a key component in various mobile devices. These devices generate a lot of heat during operation. If the heat is not dissipated in time, the performance of the device will be reduced, and the hardware may even be damaged, affecting the stability and service life of the device. Therefore, providing an effective heat dissipation solution for embedded computers is an important condition to ensure their normal operation.

[0004] Traditional heat dissipation methods usually include the use of heat sinks, fans, or thermal paste, but these methods are limited in application on mobile devices because they may take up too much space, increase the weight of the device, or have poor performance in mobile environments. In addition, these heat dissipation devices are usually complicated to install and are not easy to install and remove quickly, which causes inconvenience in situations that require rapid deployment or maintenance. Summary of the invention

[0005] The present invention provides a fast heat dissipation device for an embedded computer, which solves the problems mentioned in the above background technology.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: an embedded computer rapid heat dissipation device, comprising a mounting frame, the middle portion of the mounting frame is set in a U shape, a mounting hole is formed through the upper surface of the outer end of the mounting frame, a bolt is arranged in the mounting hole, and further comprising:

[0007] A mounting mechanism, the mounting mechanism is fixedly mounted on the inner surface of the mounting frame, and the mounting mechanism is used to fix the embedded computer;

[0008] A heat dissipation mechanism, the heat dissipation mechanism is fixedly connected to the mounting mechanism, and the heat dissipation mechanism is used to dissipate heat for the embedded computer;

[0009] The mounting mechanism comprises a carrying frame, which is arranged in a U-shape, the outer surface of the carrying frame is fixedly connected to the inner surface of the mounting frame, the opening and closing surface of the carrying frame is fitted with a buckling plate, the outer surface of the buckling plate is fixedly connected to a plug-in frame, the plug-in frame is elastically slidably plugged into the inside of the mounting frame on one side close to the carrying frame, the plug-in frame and the mounting frame are mutually clamped, a sliding groove is provided on the inner surface of the buckling plate, and the sliding groove is also symmetrically arranged on the inner surface of the carrying frame, a sliding rod is elastically slidably connected in the sliding groove, and the outer end of the sliding rod is fixedly connected to a baffle The baffle does not contact the bearing frame and the snap-fit ​​plate. The device is fixedly installed on the mobile device by bolts on the mounting frame. When the device is installed, the embedded computer can be installed. At this time, the snap-fit ​​plate can be driven to move outward by pulling the plug-in frame outward. When the snap-fit ​​plate is pulled open, it means that the gap between the snap-fit ​​plate and the bearing frame increases. At this time, the embedded computer is placed in the bearing frame, and the lower outer surface of the embedded computer is clamped on the sliding rod on the bearing frame. After completion, the pulling force on the plug-in frame is gradually loosened to cause the plug-in frame to reset under the action of elastic force.

[0010] Preferably, the heat dissipation mechanism comprises an adsorption frame, which is arranged on the inner side of the supporting frame and is made of a magnet. A side of the adsorption frame away from the supporting frame is fixedly connected to a bellows, and a cross-section of the bellows is arranged to be a rectangular shape.

[0011] Preferably, the side of the bellows away from the adsorption frame is fixedly connected to a base plate, the base plate is arranged on the bottom side of the mounting frame, the surface of the base plate away from the side of the bellows is fixedly connected to a fixing frame, and the two ends of the fixing frame are symmetrically fixedly connected to the outer surfaces of both sides of the supporting frame.

[0012] Preferably, a limiting plate is fixedly connected to the bottom inner surface of the adsorption frame, and ventilation holes are symmetrically opened on the upper surfaces of both sides of the limiting plate, and a plug-in groove is opened on the middle upper surface of the limiting plate, and the plug-in groove is arranged on the inner side of the ventilation hole.

[0013] Preferably, a limiting cover is slidably connected in the plug-in slot, the bottom of the limiting cover is fixedly connected to the middle inner surface of the bottom plate, the top outer surface of the limiting cover is symmetrically fixedly connected to a limiting rod, and the limiting rod is arranged on the upper side of the limiting plate.

[0014] Preferably, a through hole is formed in the middle upper surface of the base plate, a support rod is fixedly connected to the inner bottom surface of the limit cover, one end of the support rod away from the limit cover is fixedly connected to the middle upper surface of the base plate, and a drive plate is slidably sleeved on the support rod.

[0015] Preferably, a sealing plate is fixedly connected to the lower surface of the driving plate, and the sealing plate is arranged above the through hole on the bottom plate. Limiting grooves are symmetrically provided on both sides of the limiting cover, and connecting rods are symmetrically fixedly connected to the side surfaces of both ends of the driving plate, and the top of the connecting rod is fixedly connected to the bottom surface of the limiting plate, and the connecting rod is arranged in the limiting groove.

[0016] Preferably, two side outer surfaces of the adsorption frame are symmetrically fixedly connected with clamping blocks, the outer surfaces of the clamping blocks are in close contact with clamping rods, and the ends of the clamping rods are fixedly connected to the two side inner surfaces of the buckling plate.

[0017] Preferably, the interior of the adsorption frame is configured to be hollow, a rubber ring is slidably connected to the interior of the adsorption frame, and connecting holes are symmetrically provided on the inner surface of the adsorption frame, and the connecting holes are connected to the internal cavity of the adsorption frame.

[0018] The present invention provides a fast heat dissipation device for an embedded computer. It has the following beneficial effects:

[0019] 1. The embedded computer rapid heat dissipation device, when the plug-in frame is reset, it means that the buckle plate is reset, so that the upper outer surface of the embedded computer is snapped onto the slide bar on the buckle plate, thereby completing the installation of the embedded computer. The embedded computer can be quickly installed on the mobile device by elastic plugging, which greatly improves the convenience of use. At the same time, the embedded computer can be quickly dismantled, so that it can be taken out for repair after the embedded computer is damaged.

[0020] 2. This embedded computer rapid heat dissipation device When the embedded computer is installed, it means that the upper surface of the adsorption frame is magnetically adsorbed on the bottom surface of the embedded computer. At this time, as the mobile device moves, the embedded computer will shake, and then the adsorption frame will be squeezed intermittently, prompting the adsorption frame to squeeze the bellows, thereby increasing the air pressure in the internal cavity of the bellows, which is then input into the interior of the embedded computer through the vents on the limit plate to cool the computer. The continuous movement of the mobile device achieves continuous and rapid cooling, thereby increasing the service life of the computer. When the adsorption frame is squeezed, it will also drive the drive plate on the support rod close to the bottom plate through the connecting rod. The adsorption frame moves sideways, thereby causing the sealing plate at the bottom of the driving board to move closer to one side of the bottom plate, and finally blocks the through-holes on the bottom plate. At this time, as the adsorption frame continues to squeeze, the computer begins to cool down. When the computer moves up with the adsorption frame, the sealing plate will be separated from the seal of the through-holes on the bottom plate. At this time, the interior of the bellows is in a negative pressure state, that is, it absorbs air from the outside through the through-holes on the bottom plate, and draws air from the computer side through the air holes. The computer side is relatively closed, so the air pressure is mainly replenished into the bellows through the through-holes on the bottom plate and released through the computer side. By mainly drawing air from the outside to replenish the air pressure, the cooling effect on the computer is greatly improved.

[0021] 3. In the embedded computer rapid heat dissipation device, when the air pressure enters the cavity on one side of the adsorption frame through the air vents, a part of the air pressure will be separated and enter the internal cavity of the adsorption frame through the connecting holes, thereby increasing the air pressure in the internal cavity of the adsorption frame, thereby pushing the rubber ring to move to the outside of the adsorption frame, so that the rubber ring is firmly attached to the bottom surface of the computer, thereby achieving the maximum avoidance of air leakage through the gap between the adsorption frame and the computer to reduce the cooling effect on the computer when cooling the computer, and when pulling the plug-in rack, it will also prompt the positioning rod to move, thereby squeezing the card block, thereby driving the adsorption frame to move downward through the card block, thereby achieving the drive of the adsorption frame away from the mounting frame when installing the computer, avoiding the problem that the adsorption frame is adsorbed on the computer too early when installing the computer, resulting in loose adsorption between the adsorption frame and the computer and reducing the cooling effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a front view of the present invention;

[0023] Figure 2 is a back view of the present invention;

[0024] Figure 3 It is a structural schematic diagram of the installation mechanism of the present invention;

[0025] Figure 4 It is a structural schematic diagram of the heat dissipation mechanism of the present invention;

[0026] Figure 5 It is a structural schematic diagram of the locking rod of the present invention;

[0027] Figure 6 It is a structural schematic diagram of the limiting cover of the present invention;

[0028] Figure 7 It is a structural schematic diagram of the adsorption frame of the present invention;

[0029] Figure 8 It is a structural schematic diagram of the sealing plate of the present invention.

[0030] In the figure: 1. mounting frame; 2. mounting hole; 3. bolt; 4. mounting mechanism; 41. bearing frame; 42. snap-fit ​​plate; 43. plug-in frame; 44. slide groove; 45. slide rod; 46. baffle; 5. heat dissipation mechanism; 51. adsorption frame; 52. bellows; 53. bottom plate; 54. fixing frame; 55. limit plate; 56. vent hole; 57. plug-in groove; 58. limit cover; 59. limit rod; 510. support rod; 511. drive plate; 512. sealing plate; 513. limit groove; 514. connecting rod; 515. block; 516. clamping rod; 517. rubber ring; 518. connecting hole. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] First embodiment: Figures 1 to 8 As shown, the present invention provides a technical solution: a fast heat dissipation device for an embedded computer, comprising a mounting frame 1, the middle portion of the mounting frame 1 is set in a U shape, a mounting hole 2 is formed through the upper surface of the outer end of the mounting frame 1, a bolt 3 is arranged in the mounting hole 2, and further comprising:

[0033] A mounting mechanism 4, the mounting mechanism 4 is fixedly mounted on the inner surface of the mounting frame 1, and the mounting mechanism 4 is used to fix the embedded computer;

[0034] A heat dissipation mechanism 5, which is fixedly connected to the mounting mechanism 4 and is used for dissipating heat for the embedded computer;

[0035] The mounting mechanism 4 includes a carrying frame 41, which is arranged in a U-shape. The outer surface of the carrying frame 41 is fixedly connected to the inner surface of the mounting frame 1. A snap-fit ​​plate 42 is fitted on the opening and closing surface of the carrying frame 41. A plug-in frame 43 is fixedly connected to the outer surface of the snap-fit ​​plate 42. The plug-in frame 43 is elastically slidably plugged into the inside of the mounting frame 1 on the side close to the carrying frame 41. The plug-in frame 43 and the mounting frame 1 are mutually clamped. A slide groove 44 is provided on the inner surface of the snap-fit ​​plate 42. The slide groove 44 is also symmetrically arranged on the inner surface of the carrying frame 41. A slide rod 45 is elastically slidably connected in the slide groove 44. A baffle 46 is fixedly connected to the outer end of the slide rod 45. The baffle 46 does not contact the carrying frame 41 and the snap-fit ​​plate 42.

[0036] When working, the device can be fixedly installed on the mobile device by the bolts 3 on the mounting frame 1. When the device is installed, the embedded computer can be installed. At this time, the plug-in frame 43 can be pulled outward to drive the snap-fit ​​plate 42 to move outward. When the snap-fit ​​plate 42 is pulled open, it means that the gap between the snap-fit ​​plate 42 and the carrier frame 41 is increased. At this time, the embedded computer is placed in the carrier frame 41, and the lower outer surface of the embedded computer is clamped on the slide bar 45 on the carrier frame 41. After completion, the pulling force on the plug-in frame 43 is gradually loosened to cause the plug-in frame 43 to reset under the action of elastic force. When the plug-in frame 43 is reset, it means that the snap-fit ​​plate 42 is reset, so that the upper outer surface of the embedded computer is clamped on the slide bar 45 on the snap-fit ​​plate 42, thereby completing the installation of the embedded computer. The embedded computer can be quickly installed on the mobile device by elastic plug-in, which greatly improves the convenience of use. At the same time, the embedded computer can be quickly removed to facilitate the removal and repair of the embedded computer after it is damaged.

[0037] Second embodiment: Figures 1 to 8 As shown, the heat dissipation mechanism 5 includes an adsorption frame 51, which is arranged on the inner side of the supporting frame 41. The adsorption frame 51 is made of a magnet. A bellows 52 is fixedly connected to the side of the adsorption frame 51 away from the supporting frame 41, and the cross-section of the bellows 52 is set to a rectangular shape.

[0038] A bottom plate 53 is fixedly connected to the side of the bellows 52 away from the adsorption frame 51. The bottom plate 53 is arranged on the bottom side of the mounting frame 1. A fixing frame 54 is fixedly connected to the surface of the bottom plate 53 away from the bellows 52. Both ends of the fixing frame 54 are symmetrically fixedly connected to the outer surfaces of both sides of the supporting frame 41.

[0039] The bottom inner surface of the adsorption frame 51 is fixedly connected to a limiting plate 55 , and ventilation holes 56 are symmetrically penetrated through the upper surfaces of both sides of the limiting plate 55 , and a plug-in groove 57 is penetrated through the middle upper surface of the limiting plate 55 , and the plug-in groove 57 is arranged on the inner side of the ventilation hole 56 .

[0040] A limit cover 58 is slidably connected in the plug-in slot 57 , the bottom of the limit cover 58 is fixedly connected to the middle inner surface of the bottom plate 53 , and the top outer surface of the limit cover 58 is symmetrically fixedly connected to a limit rod 59 , which is arranged on the upper side of the limit plate 55 .

[0041] A through hole is formed in the middle upper surface of the bottom plate 53, and a support rod 510 is fixedly connected to the inner bottom surface of the limit cover 58. One end of the support rod 510 away from the limit cover 58 is fixedly connected to the middle upper surface of the bottom plate 53, and a driving plate 511 is slidably sleeved on the support rod 510.

[0042] A sealing plate 512 is fixedly connected to the lower surface of the driving plate 511, and the sealing plate 512 is arranged above the through hole on the bottom plate 53. Limiting grooves 513 are symmetrically provided on both sides of the limiting cover 58. Connecting rods 514 are symmetrically fixedly connected to the side surfaces of both ends of the driving plate 511. The top of the connecting rod 514 is fixedly connected to the bottom surface of the limiting plate 55, and the connecting rod 514 is arranged in the limiting groove 513.

[0043] The outer surfaces of both sides of the adsorption frame 51 are symmetrically fixedly connected with clamping blocks 515 , and the outer surfaces of the clamping blocks 515 are in contact with clamping rods 516 , and the ends of the clamping rods 516 are fixedly connected to the inner surfaces of both sides of the buckling plate 42 .

[0044] The interior of the adsorption frame 51 is configured to be hollow, a rubber ring 517 is slidably connected to the interior of the adsorption frame 51 , and connecting holes 518 are symmetrically opened on the inner surface of the adsorption frame 51 , which are connected to the internal cavity of the adsorption frame 51 .

[0045] During operation, when the embedded computer is installed, the upper surface of the adsorption frame 51 is magnetically adsorbed on the bottom surface of the embedded computer. At this time, as the mobile device moves, the embedded computer will shake, and then the adsorption frame 51 will be squeezed intermittently, causing the adsorption frame 51 to squeeze the bellows 52, thereby increasing the air pressure in the internal cavity of the bellows 52, and then input into the interior of the embedded computer through the air vents 56 on the limit plate 55, cooling the computer, and achieving continuous and rapid cooling through the continuous movement of the mobile device, thereby increasing the service life of the computer. When the adsorption frame 51 is squeezed, the driving plate 511 is driven to move on the support rod 510 close to the bottom plate 53 through the connecting rod 514, so that the sealing plate 512 at the bottom of the driving plate 511 moves close to the bottom plate 53, and finally blocks the through hole on the bottom plate 53. At this time, with the continuous squeezing of the adsorption frame 51, the computer begins to cool down. When the computer moves up with the adsorption frame 51, the sealing plate 512 will be separated from the seal of the through hole on the bottom plate 53. At this time, the interior of the bellows 52 is in a negative pressure state, that is, it will absorb air from the outside through the through hole on the bottom plate 53, and through the ventilation The hole 56 draws air from one side of the computer, and the computer side is relatively closed, so the air pressure is mainly supplemented into the bellows 52 through the through hole on the bottom plate 53, and released through the computer side. By mainly drawing air from the outside to supplement the air pressure, the cooling effect on the computer is greatly improved. When the air pressure enters the cavity on one side of the adsorption frame 51 through the air hole 56, a part of it will enter the internal cavity of the adsorption frame 51 through the connecting hole 518, thereby increasing the air pressure in the internal cavity of the adsorption frame 51, and then pushing the rubber ring 517 to move to the outside of the adsorption frame 51, so that the rubber ring 517 fits tightly. On the bottom surface of the computer, it is possible to minimize the leakage of air through the gap between the adsorption frame 51 and the computer when cooling the computer, thereby reducing the cooling effect on the computer. When the plug-in rack 43 is pulled, the positioning rod 516 is also prompted to move, thereby squeezing the blocking block 515, thereby driving the adsorption frame 51 to move downward through the blocking block 515, thereby driving the adsorption frame 51 away from the mounting frame 1 when installing the computer, thereby avoiding the problem that the adsorption frame 51 is adsorbed on the computer too early when installing the computer, resulting in the adsorption frame 51 and the computer being not firmly adsorbed, reducing the cooling effect.

[0046] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions. The sentence "includes an element defined by... does not exclude the existence of other identical elements in the process, method, article or device including the element".

Claims

1. A fast heat dissipation device for an embedded computer, comprising a mounting frame (1), characterized in that: The middle part of the mounting frame (1) is arranged in a U shape, a mounting hole (2) is provided through the upper surface of the outer end of the mounting frame (1), a bolt (3) is arranged in the mounting hole (2), and further comprises: A mounting mechanism (4), the mounting mechanism (4) being fixedly mounted on the inner surface of the mounting frame (1), the mounting mechanism (4) being used to fix the embedded computer; A heat dissipation mechanism (5), the heat dissipation mechanism (5) is fixedly connected to the mounting mechanism (4), and the heat dissipation mechanism (5) is used to dissipate heat from the embedded computer; The mounting mechanism (4) comprises a carrying frame (41), the carrying frame (41) is arranged in a U-shape, the outer surface of the carrying frame (41) is fixedly connected to the inner surface of the mounting frame (1), the opening and closing surface of the carrying frame (41) is fitted with a snap-fit ​​plate (42), the outer surface of the snap-fit ​​plate (42) is fixedly connected with a plug-in frame (43), the plug-in frame (43) is elastically slidably plugged into the inside of the mounting frame (1) on the side close to the carrying frame (41), the plug-in frame (43) and the mounting frame (1) are mutually clamped, the inner surface of the snap-fit ​​plate (42) is provided with a slide groove (44), the slide groove (44) is also symmetrically arranged on the inner surface of the carrying frame (41), a slide rod (45) is elastically slidably connected in the slide groove (44), the outer end of the slide rod (45) is fixedly connected with a baffle (46), and the baffle (46) does not contact the carrying frame (41) and the snap-fit ​​plate (42).

2. The fast heat dissipation device for an embedded computer according to claim 1, characterized in that: The heat dissipation mechanism (5) comprises an adsorption frame (51), the adsorption frame (51) is arranged on the inner side of the supporting frame (41), the adsorption frame (51) is made of a magnet, and a bellows (52) is fixedly connected to the side of the adsorption frame (51) away from the supporting frame (41), and the cross section of the bellows (52) is arranged to be a rectangular shape.

3. The fast heat dissipation device for an embedded computer according to claim 2, characterized in that: A bottom plate (53) is fixedly connected to the side of the bellows (52) away from the adsorption frame (51); the bottom plate (53) is arranged on the bottom side of the mounting frame (1); a fixing frame (54) is fixedly connected to the surface of the bottom plate (53) away from the bellows (52); and two ends of the fixing frame (54) are symmetrically fixedly connected to the outer surfaces of both sides of the supporting frame (41).

4. The fast heat dissipation device for an embedded computer according to claim 3, characterized in that: The bottom inner surface of the adsorption frame (51) is fixedly connected to a limiting plate (55), and ventilation holes (56) are symmetrically opened through the upper surfaces of both sides of the limiting plate (55), and a plug-in groove (57) is opened through the middle upper surface of the limiting plate (55), and the plug-in groove (57) is arranged on the inner side of the ventilation hole (56).

5. The fast heat dissipation device for an embedded computer according to claim 4, characterized in that: A limiting cover (58) is slidably connected in the insertion slot (57), the bottom of the limiting cover (58) is fixedly connected to the middle inner surface of the bottom plate (53), and the top outer surface of the limiting cover (58) is symmetrically fixedly connected to a limiting rod (59), and the limiting rod (59) is arranged on the upper side of the limiting plate (55).

6. The fast heat dissipation device for an embedded computer according to claim 5, characterized in that: A through hole is formed through the middle upper surface of the bottom plate (53); a support rod (510) is fixedly connected to the inner bottom surface of the limit cover (58); one end of the support rod (510) away from the limit cover (58) is fixedly connected to the middle upper surface of the bottom plate (53); and a driving plate (511) is slidably sleeved on the support rod (510).

7. The embedded computer rapid heat dissipation device according to claim 6, characterized in that: The lower surface of the driving plate (511) is fixedly connected to a sealing plate (512), and the sealing plate (512) is arranged above the through hole on the bottom plate (53). The limiting grooves (513) are symmetrically provided on both sides of the limiting cover (58). The two end sides of the driving plate (511) are symmetrically fixedly connected to connecting rods (514), and the top of the connecting rod (514) is fixedly connected to the bottom surface of the limiting plate (55), and the connecting rod (514) is arranged in the limiting groove (513).

8. The fast heat dissipation device for an embedded computer according to claim 7, characterized in that: The outer surfaces of both sides of the adsorption frame (51) are symmetrically fixedly connected with clamping blocks (515), the outer surfaces of the clamping blocks (515) are in close contact with clamping rods (516), and the ends of the clamping rods (516) are fixedly connected to the inner surfaces of both sides of the buckle plate (42).

9. The fast heat dissipation device for an embedded computer according to claim 8, characterized in that: The interior of the adsorption frame (51) is arranged to be hollow, a rubber ring (517) is slidably connected to the interior of the adsorption frame (51), and connecting holes (518) are symmetrically provided on the inner surface of the adsorption frame (51), wherein the connecting holes (518) are connected to the internal cavity of the adsorption frame (51).

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