Multifunctional detection system and method for automatic production of chips

Abstract

The invention relates to the technical field of chip automatic production, in particular to a multifunctional detection system and method for chip automatic production, and the system comprises a rack. A chip feeding module, a dispensing module, a curing module, a secondary feeding module, a surface detection module, an electrical detection module, a marking module, a PIN detection module and a packaging module are sequentially arranged on the rack; the method uses the multifunctional detection system for automatic production of the chip, and comprises the following steps: sequentially carrying out dispensing, curing, surface detection, electrical detection, marking and PIN detection on the chip; and braiding and packaging the chips with qualified dispensing, appearance, power-on detection, marking and PINs. By adopting the scheme, the transfer time between procedures can be shortened, and the production efficiency can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of automated chip production, and in particular to a multifunctional detection system and method for automated chip production. Background Art

[0002] In the modern electronic manufacturing industry, improving production efficiency and product quality has become the research goal of chip automation production. The traditional chip automatic production process usually includes multiple steps such as pinning, spot welding, glue dispensing, testing, capping, marking, cleaning, packaging, etc. These processes each undertake different production tasks and together constitute the production process of chips from raw materials to finished products.

[0003] However, in the traditional automatic chip production process, the above processes are often set up separately, and different processes are produced and processed by setting up independent equipment. Different processes need to be connected through transfer. This transfer process not only increases the time cost in the production process and reduces the overall production efficiency, but also requires the corresponding transfer equipment and personnel, further increasing the production cost. In addition, since each process requires separate equipment, the entire production line occupies a large amount of production space, which is not conducive to the optimal use of production resources.

[0004] Therefore, how to optimize the automatic production process of chips, reduce the transfer time between processes, and improve production efficiency has become an urgent problem to be solved in the current automated chip production. Summary of the invention

[0005] One of the purposes of the present invention is to provide a multifunctional detection system for automated chip production, which can reduce the transfer time between processes and improve production efficiency.

[0006] The basic scheme 1 provided by the present invention: a multifunctional detection system for automated chip production, comprising a rack, on which a chip loading module, a dispensing module, a curing module, a secondary loading module, a surface detection module, an electrical detection module, a marking module, a PIN foot detection module and a packaging module are sequentially arranged; The chip loading module is used to transport the chips to the dispensing module in sequence; the dispensing module is used to dispense glue on the chips; the curing module is used to cure the chips after dispensing glue; the secondary loading module is used to transport the cured chips to the surface inspection module in sequence; the surface inspection module is used to collect the surface image of the chip, judge whether the dispensing and appearance of the chip are qualified according to the surface image, and transport the chips with qualified dispensing and appearance to the electrical inspection module; the electrical inspection module is used to perform power-on inspection on the chips with qualified dispensing and appearance in batches, and transport the chips with qualified power-on inspection to the marking module; the marking module is used to mark the chips with qualified power-on inspection; the PIN foot inspection module is used to collect the marking image and PIN foot image of the chip after marking, judge whether the marking of the chip is qualified according to the marking image, judge whether the PIN foot distribution of the chip is qualified according to the PIN foot image, and transport the chips with qualified marking and PIN foot distribution to the packaging module; the packaging module is used to package the chips with qualified marking and PIN foot distribution.

[0007] Furthermore, a material tray loading module is also provided on the frame, and the material tray loading module is used to move the material tray to the chip loading position, and the chip loading position is opposite to the glue dispensing module; the glue dispensing module is used to transport the glued chip to the material tray at the chip loading position.

[0008] Furthermore, the tray loading module is used to move the material tray filled with chips to the tray moving position; the curing module is used to transport the material tray located at the tray moving position and to cure the chips on the material tray during the movement of the material tray.

[0009] Furthermore, a rejection module is also provided on the rack, and the rejection module is used to reject chips that are unqualified in any of the following aspects: dispensing, appearance, power-on detection, marking, and PIN foot distribution.

[0010] Furthermore, the chip loading module includes a loading flipper and a plurality of material distributors, the glue dispensing module includes a glue dispenser and a plurality of glue dispensing channels for chip movement, the glue dispenser is located above the glue dispensing channel, the material distributor corresponds to the glue dispensing channel one by one, and when used in conjunction, the plurality of material distributors can be aligned with the loading flipper in sequence; The loading flipper is used to flip the chip and place the flipped chips on the distributor in sequence. The distributor is used to move from a position facing the loading flipper to a position facing the dispensing channel. The chip loading module is used to move the chip on the distributor to the dispensing channel.

[0011] Further, the surface detection module includes a diverter, a detection flipper, a first image collector and a second image collector, and the surface image includes an end surface image, a top surface image and a bottom surface image; The diverter is used to change the orientation of the chip, the first image collector is located on two opposite sides of the diverter, and the first image collector is used to collect end surface images of the chip before and after the orientation is changed; The detection flipper is used to flip the chip. The second image collector is located above the detection flipper. The second image collector is used to collect the bottom surface image and the top surface image of the chip before and after flipping.

[0012] Furthermore, the electrical detection module includes a movable fixture and a plurality of detection seats, the plurality of detection seats are equidistantly arranged, the movable fixture is arranged above the detection seat, a plurality of adsorption heads equidistantly arranged are arranged on the movable fixture, the movable fixture can change the relative distance of the adsorption heads, and the adsorption heads are used to adsorb the chip; The movable fixture is used to increase the relative distance between the adsorption heads after the adsorption heads adsorb the chip, and place the chips in the detection seats respectively; it is also used to reduce the relative distance between the adsorption heads after the chips are placed in the detection seat, and reset to adsorb the next chip.

[0013] Working process and beneficial effects of basic scheme 1: During operation, the chip is clamped and flipped by the loading flipper and placed on the dispenser. At this time, the bottom of the chip faces upward, and the dispenser on which the chip is placed moves to the corresponding dispensing channel. The chip loading module pushes the chip from the dispenser to the dispensing channel. The chip moves on the dispensing channel, and the dispenser dispenses glue on the chip on the dispensing channel. Multiple dispensing channels provide multiple dispensing paths, and parallel processing improves production efficiency. During this process, the tray loading module moves the material tray to the chip loading position, and the material tray is an empty material tray.

[0014] The dispensing module moves the glued chips to the material tray. When the material tray is full of chips, the tray loading module moves the material tray to the tray moving position. The curing module moves the material tray full of chips. During the movement, the curing module cures the glue through ultraviolet rays, wind power, temperature, etc.

[0015] The secondary loading module transports the chips in the material tray to the surface detection module. The first image acquisition module collects the end face images of the two opposite end faces of the chip. The diverter changes the direction of the chip so that the other two opposite end faces of the chip face the first image acquisition module. The first image acquisition module collects the end face images of the other two opposite end faces of the chip to complete the collection of the end face images of the four end faces of the chip. The second image collector collects the bottom surface image of the bottom of the chip. The detection flipper clamps the chip and flips it. The second image collector collects the top surface image of the top of the chip to complete the collection of the chip surface image. The surface detection module determines whether the chip's dispensing and appearance are qualified based on the surface image, and the rejection module rejects chips that do not meet the dispensing or appearance requirements.

[0016] The chips that have passed the dispensing and appearance tests are transported in sequence. The adsorption heads on the movable fixture adsorb multiple chips. The movable fixture changes the relative distance between the adsorption heads to separate the adsorbed chips. The separated chips are placed in multiple parallel test seats. The test seats perform power-on tests on the chips in batches, and the rejection module rejects the chips that fail the power-on test.

[0017] The chips that pass the power-on test are transported to the marking module, which marks the chips. The PIN foot detection module collects the marking image and PIN foot image of the marked chip. The PIN foot detection module determines whether the chip marking is qualified based on the marking image, and determines whether the chip PIN foot distribution is qualified based on the PIN foot image. The rejection module rejects the chips that fail to meet the marking or PIN foot distribution requirements.

[0018] The chips with qualified marking and PIN pin distribution are transported to the packaging module, which packages the chips individually to complete the automated production and processing of the chips.

[0019] In this solution, the chip loading module is set up to automatically load the chip, and the chip is flipped during the loading process so that the part that needs to be glued faces upward, which is convenient for the subsequent glue dispensing module to perform glue dispensing. The glue dispensing module is set up to dispense glue on the chip. At the same time, the glue dispensing module is provided with multiple glue dispensing channels, which can dispense glue on multiple chips in parallel to improve the chip dispensing efficiency. The material tray loading module is set up to load the material tray, which is convenient for collecting the chips after glue dispensing for batch processing and improving the chip production efficiency. The curing module is set up to cure the glue during the movement of the chip, which reduces the transportation time between processes. At the same time, by curing the glue, the glue can cover the designated position on the chip, thereby realizing the protection, insulation, fixation and moisture-proofing of the chip.

[0020] The secondary loading module is set up to re-load the chips on the material tray separately, which is convenient for subsequent production and processing of the chips. The surface inspection module is set up to detect the surface of the chip to ensure that the final chip appearance meets the requirements, and the glue cured on the chip is tested to ensure that the glue of the final chip does not overflow or lack glue. Through surface inspection, unqualified chips are removed in time. The electrical detection module is set up to detect the functions of the chip that need to be powered on to ensure that the performance of the final chip meets the requirements. Through electrical inspection, unqualified chips are further removed. The marking module is set up to mark the surface of the chip to clarify the model, function, etc. of the chip. The PIN foot detection module is set up to detect the skewness and spacing of the chip PIN foot, and at the same time detect the marking pattern to ensure the beauty of the chip appearance. The packaging module is set up to automatically tape and package qualified chip products to complete automatic chip unloading. The setting of the rejection module can timely reject the chips that fail in each inspection process during the chip production process, avoiding useless work on unqualified chips and wasting production resources. It can also avoid wasting production time and improve chip production efficiency.

[0021] A second object of the present invention is to provide a multifunctional detection method for automated chip production.

[0022] The present invention provides basic solution 2: a multifunctional detection method for automated chip production, using the multifunctional detection system for automated chip production.

[0023] Further, the following are included: The chip is sequentially subjected to dispensing, curing, surface inspection, electrical inspection, marking and PIN foot inspection; The chips that have passed the dispensing, appearance, power-on detection, marking, and PIN pin testing are taped and packaged.

[0024] Furthermore, the chip is subjected to dispensing, curing, surface inspection, electrical inspection, marking and PIN foot inspection in sequence, including the following: Collect the surface image of the chip after curing, judge whether the chip's dispensing and appearance are qualified according to the surface image, and remove the chip with unqualified dispensing or appearance; Conduct power-on inspection on batches of chips that have passed the dispensing and appearance tests, and remove chips that fail the power-on inspection. Mark the chips that have passed the power-on test; Collect the marking image and PIN pin image of the chip after marking, judge whether the chip marking is qualified according to the marking image, judge whether the chip PIN pin distribution is qualified according to the PIN pin image, and eliminate the chips with unqualified marking or PIN pin distribution.

[0025] Beneficial effects of basic solution 2: In this solution, improvements are made to the chip production process by setting up multiple inspection items such as appearance, power-on inspection, and PIN pins. Based on the results of multiple inspections, the chips are screened according to their performance and appearance, and unqualified chips are removed in a timely manner to avoid wasting production resources while reducing the waste of production time and improving chip production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A top view of the multifunctional detection system for automated chip production of the present invention; Figure 2 It is a structural schematic diagram of a chip loading module of a multifunctional detection system for chip automated production according to the present invention; Figure 3 This is a schematic structural diagram of a dispensing module of an embodiment of a multifunctional detection system for automated chip production according to the present invention; Figure 4 This is a structural schematic diagram of a tray loading module of an embodiment of a multifunctional detection system for automated chip production of the present invention; Figure 5 It is a structural schematic diagram of a curing module of an embodiment of a multifunctional detection system for automated chip production of the present invention; Figure 6 This is a schematic structural diagram of a secondary loading module of an embodiment of a multifunctional detection system for automated chip production according to the present invention; Figure 7 This is a schematic structural diagram of the surface detection module collecting end face images in an embodiment of the multifunctional detection system for automated chip production of the present invention; Figure 8 It is a structural schematic diagram of collecting end face images from another viewing angle of a surface detection module of an embodiment of a multifunctional detection system for automated chip production of the present invention; Fig. 9 This is a schematic structural diagram of a surface detection module collecting bottom surface images in an embodiment of a multifunctional detection system for automated chip production according to the present invention; Fig.10 It is a structural schematic diagram of an electrical property detection module of an embodiment of a multifunctional detection system for automated chip production of the present invention; Fig.11 It is a structural schematic diagram of the first rejection submodule of an embodiment of the multifunctional detection system for automated chip production of the present invention; Fig.12 It is a structural schematic diagram of the second rejection submodule of an embodiment of the multifunctional detection system for automated chip production of the present invention; Fig.13 This is a schematic diagram of the structure of a marking module of an embodiment of a multifunctional detection system for automated chip production according to the present invention; Fig.14 This is a schematic structural diagram of a PIN detection module of an embodiment of a multifunctional detection system for automated chip production according to the present invention; Fig.15 It is a structural schematic diagram of the third rejection submodule of the embodiment of the multifunctional detection system for chip automated production of the present invention; Fig.16 It is a structural schematic diagram of a packaging module of an embodiment of a multifunctional detection system for automated chip production of the present invention. DETAILED DESCRIPTION

[0027] The following is further described in detail through specific implementation methods: The reference numerals in the drawings of the specification include: Chip loading module 1, loading flipper 101, first material dividing plate 1021, first slider 1022, first bottom plate 1023, rotating wheel 1024, second material dividing plate 103, loading workbench 104, special-shaped groove 105, material receiver 106, pusher 107, dispensing module 2, dispensing device 201, material picker 202, dispensing channel 203, curing module 3, curing transmission mechanism 301, fan 302, curing furnace 303, secondary loading module 4, tray moving plate 401, loader 402, push rod 403, surface detection module 5, diverter 501, surface detection channel 502, detection pusher 503, detection flipper 504, first image collector 505, second image collector 506, electrical detection module 6, fixed fixture 601, movable fixture 602, detection Seat 603, marking module 7, marker 701, marking channel 702, smoke exhaust pipe 703, PIN foot detection module 8, mounting plate 801, positioning seat 802, third image collector 803, fourth image collector 804, packaging module 9, packaging channel 901, packager 902, braiding turntable 903, packaging tape turntable 904, finished product turntable 905, rack 10, material tray 11, material tray loading module 12, first rejection submodule 13, third motor 1301, sixth slide rail 1302, fifth pneumatic finger 1303, first rejection channel 1304, second rejection submodule 14, push plate 1401, second rejection channel 1402, third rejection submodule 15, third rejection channel 1501, fixed block 1502, movable block 1503, eighth slide rail 1504.

[0028] Example Multifunctional testing system for automated chip production, such as the attached Figure 1 As shown, it includes a frame 10, on which a chip loading module 1, a dispensing module 2, a curing module 3, a secondary loading module 4, a surface detection module 5, an electrical detection module 6, a marking module 7, a PINPIN foot detection module 8 and a packaging module 9 are sequentially arranged.

[0029] The chip loading module 1 is used to transport the chips to the glue dispensing module 2 in sequence. The rack 10 is also provided with a tray loading module 12, which is used to move the material tray 11 to the chip loading position, which is opposite to the glue dispensing module 2; and is also used to move the material tray 11 filled with chips to the tray moving position. The glue dispensing module 2 is used to dispense glue on the chips; and is also used to transport the glued chips to the material tray 11 at the chip loading position. Specifically: As attached Figure 2 As shown, the chip loading module 1 includes a loading flipper 101 and a plurality of distributors. The loading flipper 101 is used to flip the chip and place the flipped chip on the distributor in sequence. The loading flipper 101 includes a first motor and a first pneumatic finger. The free end of the first motor is connected to the body of the first pneumatic finger. When the first motor is started, the first pneumatic finger rotates with the first motor as the axis, so that the chip clamped by the first pneumatic finger rotates 180 degrees with the first motor as the axis, that is, the chip is flipped, and the top surface of the chip faces downward.

[0030] A plurality of material dividers can be aligned with the loading flipper 101 in sequence, and the material dividers include a first material divider and a second material divider 103. The first material divider includes a first material divider plate 1021, a first slider 1022 and a first bottom plate 1023 arranged in sequence from top to bottom, and a first material divider channel for chip movement is provided at the top of the first material divider plate 1021, and the loading flipper 101 places the chip at one end of the first material divider channel. The top of the first slider 1022 is fixedly connected to the bottom of the first material divider plate 1021, and the bottom of the first material divider plate 1021 is slidably connected to the top of the first bottom plate 1023 through a first slide rail, and a notch is provided on the first bottom plate 1023, and a connecting rod passing through the notch is provided at the bottom of the first slider 1022, and a rotating wheel 1024 is provided at the free end of the connecting rod, and the connecting rod can be disengaged from the mouth of the notch.

[0031] The chip loading module 1 further includes a loading workbench 104, a second slide rail is provided between the bottom of the first slider 1022 and the top of the loading workbench 104, and the length direction of the second slide rail is perpendicular to the length direction of the first slide rail. A special-shaped groove 105 is also provided on the loading workbench 104, and the distance between the middle of the special-shaped groove 105 and the second slide rail is greater than the distance between the two ends and the second slide rail.

[0032] A second material distribution channel is provided at the top of the second material distributor 103, and the loading flipper 101 places the chip at one end of the second material distribution channel. A third slide rail is provided between the bottom of the second material distributor 103 and the loading workbench 104, and the length direction of the third slide rail is parallel to the length direction of the second slide rail.

[0033] The chip loading module 1 also includes a material receiver 106. A fourth slide rail is provided between the bottom of the material receiver 106 and the loading workbench 104. The length direction of the fourth slide rail is parallel to the length direction of the third slide rail. The top of the material receiver 106 is provided with parallel material receiving channels. The length directions of the material receiving channels are perpendicular to the length direction of the fourth slide rail. The first material distribution channel can face one material receiving channel, and the second material distribution channel can face another material receiving channel. The material receiver 106 is controlled by a cylinder to move along the length direction of the fourth slide rail.

[0034] The chip loading module 1 also includes a pusher 107 installed on the loading workbench 104. The pusher 107 adopts a telescopic rod. The free end of the pusher 107 can extend into the first material distribution channel to push the chip on the first material distribution channel into the opposite material receiving channel. The free end of the pusher 107 can extend into the second material distribution channel to push the chip on the second material distribution channel into the opposite material receiving channel.

[0035] As attached Figure 3 As shown, the glue dispensing module 2 includes a glue dispenser 201, a material distributor 202 and a plurality of glue dispensing channels 203 for chip movement, the glue dispenser 201 is located above the glue dispensing channel 203, and the material distributor corresponds to the glue dispensing channel 203 one by one and is used in conjunction with each other. The glue dispenser 201 is used to dispense glue to the chip on the glue dispensing channel 203, the glue dispensing channels 203 are arranged in parallel, the number of the glue dispensing channels 203 is two, and the two glue dispensing channels 203 are respectively opposite to the two material receiving channels. The material distributor 202 is arranged corresponding to the glue dispensing channel 203, the number of the material distributor 202 is two, and the two material distributors 202 are respectively located on the side of the glue dispensing channel 203 away from each other. The material distributor 202 is provided with a plurality of material distributor teeth on the side facing the glue dispensing channel 203, and the plurality of material distributor teeth are evenly distributed along the length direction of the glue dispensing channel 203. The material tapper 202 can move along the length direction of the glue dispensing channel 203, and can move in a direction perpendicular to the length direction of the glue dispensing channel 203. The position of the chip on the glue dispensing channel 203 is changed by the movement of the material tapper 202. By using the conveyor belt and the cylinder in coordination, the material tapper 202 can move in two directions perpendicular to and parallel to the length direction of the glue dispensing channel 203, thereby shifting the chip and moving it on the glue dispensing channel 203.

[0036] The distributor is used to move from a position facing the loading flipper 101 to a position facing the glue dispensing channel 203, and the chip loading module 1 is used to move the chip on the distributor to the glue dispensing channel 203. When in use, the movement of the first distributor and the second distributor 103 is controlled by the conveyor belt, and the first distributor can move along the length direction of the second slide rail to the first distribution channel of the loading flipper 101. When the loading flipper 101 places the chip in the first distribution channel, the first distributor moves to the connection channel, and the pusher 107 pushes the chip on the first distributor into the connection channel. The second distributor 103 can move along the length direction of the third slide rail to the second distribution channel of the loading flipper 101. When the loading flipper 101 places the chip in the second distribution channel, the second distributor 103 moves to the other connection channel, and the pusher 107 pushes the chip on the second distributor 103 into the connection channel. The setting of the special-shaped groove 105 prevents the first distributor and the second distributor 103 from interfering with each other's movement during the reciprocating movement. The setting of the material distributor 202 moves the chip located in the material receiving channel to the glue dispensing channel 203, and the chip is gradually moved on the glue dispensing channel 203 by the material distributor 202. The distance the chip moves each time depends on the distance between adjacent material distributor teeth. When the chip moves to the specified position, the glue dispenser 201 dispenses glue on the chip. The glue dispensers 201 on the two glue dispensing channels 203 can dispense glue on the chip in parallel, thereby improving production efficiency.

[0037] As attached Figure 4 As shown, the material tray loading module 12 is used to move the material tray 11 to the chip loading position, and the material selector 202 moves the chip from the glue dispensing channel 203 to the material tray 11. The material tray 11 is provided with multiple parallel material slots, and the material slots are opposite to the glue dispensing channel 203. When a material slot is full, the material tray 11 moves, and the next material slot is opposite to the glue dispensing channel 203.

[0038] The curing module 3 is used to cure the chip after dispensing; it is also used to transport the material tray 11 located at the material tray moving position, and to cure the chip on the material tray 11 during the movement of the material tray 11. Specifically: As attached Figure 5 As shown, the curing module 3 includes a curing transmission mechanism 301 and a curing oven 303. When the material slot on the material tray 11 is full of chips, the movement of the material tray 11 is controlled by the curing transmission mechanism 301. The curing transmission mechanism 301 is located in the curing oven 303, that is, the material tray 11 is located in the curing oven 303. Openings are provided at both ends of the curing oven 303. A fan 302 is provided on the curing oven 303. The material tray 11 enters from one end of the curing oven 303 and leaves from the other end.

[0039] As attached Figure 6As shown, the secondary loading module 4 is used to sequentially transport the cured chips to the surface detection module 5. Specifically: the secondary loading module 4 includes a tray moving plate 401 and a loader 402, the curing transmission mechanism 301 is used to transport the material tray 11 to the tray moving plate 401, a fifth slide rail is provided between the bottom of the tray moving plate 401 and the frame 10, the length direction of the fifth slide rail is perpendicular to the curing transmission mechanism 301, and the tray moving plate 401 is controlled to move along the length direction of the fifth slide rail by a conveyor belt. The loader 402 is located above the tray moving plate 401, and a push rod 403 is provided at the bottom of the loader 402, and the push rod 403 is used to push the chips in the material slot on the material tray 11 and push the chips into the surface detection module 5. When all the chips in a material slot are pushed into the surface detection module 5, the material tray 11 is controlled to move, and the chips in the next material slot are continuously pushed into the surface detection module 5. When all the chips on the material tray 11 are pushed into the surface detection module 5, the material tray 11 is unloaded and collected.

[0040] The surface detection module 5 is used to collect the surface image of the chip, determine whether the chip's glue dispensing and appearance are qualified according to the surface image, and transport the chip with qualified glue dispensing and appearance to the electrical detection module 6. Specifically: As attached Figure 7 , 8 As shown in , 9, the surface detection module 5 includes a diverter 501, a surface detection channel 502, a detection pusher 503, a detection flipper 504, a first image collector 505 and a second image collector 506, and the surface image includes an end surface image and a bottom surface image. The diverter 501 is used to change the direction of the chip. The bottom of the diverter 501 is provided with a second pneumatic finger and a third pneumatic finger. The moving direction of the second pneumatic finger when clamping the chip is perpendicular to the moving direction of the second pneumatic finger when clamping the chip. The first image collector 505 is located on the opposite sides of the diverter 501. The first image collector 505 is used to collect the end surface image of the chip before and after the direction is changed. The diverter 501 is rotated 90 degrees in the horizontal direction by a cylinder and a motor, and can be lifted and lowered in the vertical direction. In order to ensure the collection effect of the first image collector 505, the surface detection module 5 also includes a fill light. The number of fill lights is two, and the two fill lights are located on the opposite sides of the diverter 501, that is, on the same side as the first image collector 505.

[0041] When in use, the diverter 501 controls the second and third pneumatic fingers to descend, the second and third pneumatic fingers clamp the chip, and then the second and third pneumatic fingers drive the chip to rise and reset, the diverter 501 controls the second and third pneumatic fingers to rotate 90 degrees and then descend, the second and third pneumatic fingers release the chip, and at this time the first image collector 505 collects the end surface images of both ends of the chip. The diverter 501 controls the second and third pneumatic fingers to rotate 90 degrees in the opposite direction and then descend, the second and third pneumatic fingers clamp the chip, and then the second and third pneumatic fingers drive the chip to rise and reset, the diverter 501 controls the second and third pneumatic fingers to rotate 90 degrees and then descend, the second and third pneumatic fingers release the chip, and at this time a chip is located at the head end of the surface detection channel 502, and the first image collector 505 collects the end surface images of the other two ends of the chip, completing the end surface image acquisition of the four end surfaces of the chip.

[0042] The detection pusher 503 is used to change the position of the chip on the surface detection channel 502. The detection pusher 503 is located on one side of the surface detection channel 502. The detection pusher 503 is provided with two pusher teeth on the side facing the surface detection channel 502. The pusher teeth are used to push the chip to move on the surface detection channel 502. The detection flipper 504 is used to flip the chip. The detection flipper 504 includes a second motor and a fourth pneumatic finger. The free end of the second motor is connected to the body of the fourth pneumatic finger. The fourth pneumatic finger clamps the chip located at the end of the surface detection channel 502. When the second motor is started, the fourth pneumatic finger rotates with the second motor as the axis, so that the chip clamped by the fourth pneumatic finger rotates 180 degrees with the second motor as the axis, that is, the chip is flipped, and the top surface of the chip faces upward.

[0043] The second image collector 506 is located above the detection flipper 504, and the second image collector 506 is used to collect the bottom surface image of the chip before flipping. In other embodiments, the surface image also includes the top surface image, and the number of the second image collectors 506 is two, one second image collector 506 is used to collect the bottom surface image of the chip before flipping, and the other second image collector 506 is used to collect the top surface image of the chip after flipping.

[0044] The surface detection module 5 is also used to perform image analysis based on the collected surface image to determine whether the dispensing and appearance of the corresponding chip are qualified. When the dispensing and appearance are qualified, the chip is transported to the electrical detection module 6.

[0045] The electrical property detection module 6 is used to conduct power-on detection on batches of chips that have passed the glue dispensing and appearance test, and transport the chips that have passed the power-on detection to the marking module 7. Specifically: As attached Fig.10As shown, the electrical detection module 6 includes a fixed clamp 601, a movable clamp 602 and a plurality of detection seats 603, and the plurality of detection seats 603 are equidistantly arranged. The fixed clamp 601 and the movable clamp 602 are arranged above the detection seats 603. The fixed clamp 601 and the movable clamp 602 are both provided with a plurality of equidistantly arranged adsorption heads. The movable clamp 602 can change the relative distance of the adsorption heads, and the adsorption heads are used to adsorb chips; the movable clamp 602 is used to increase the relative distance of the adsorption heads after the adsorption heads adsorb the chips, and place the chips in the detection seats 603 respectively; it is also used to reduce the relative distance of the adsorption heads after the chips are placed in the detection seats 603, and reset to adsorb the next chip.

[0046] The fixed fixture 601 and the movable fixture 602 are installed on the frame 10, and the fixed fixture 601 and the movable fixture 602 are simultaneously lifted and lowered by the cylinder, and the fixed fixture 601 and the movable fixture 602 are simultaneously moved by the fifth slide rail control cylinder. The movable fixture 602 includes an upper movable seat and a lower movable seat arranged in the vertical direction, a guide rod is arranged between the upper movable seat and the lower movable seat, and a limit plate capable of moving in the axial direction of the guide rod is sleeved on the guide rod, the guide rod passes through the limit plate, and the limit plate can move in the axial direction of the guide rod. The movable fixture 602 also includes a connecting plate capable of moving in the horizontal direction, the connecting plate is slidably connected to the frame 10 through the fifth slide rail, the fifth slide rail is arranged horizontally, and the two connecting plates are respectively located on both sides of the guide rod, and the sliding directions of the two connecting plates are opposite. A limit column is arranged on the side of the connecting plate away from the frame 10, and two limit holes are opened on the limit plate, and the two limit holes are respectively located on both sides of the guide rod, and the limit holes are inclined from high to low in the direction away from the guide rod toward the guide rod. The end of the limiting column away from the connecting plate is located in the limiting hole, and the side wall of the free end of the limiting column contacts the hole wall of the limiting hole. The bottom of the connecting plate and the lower movable seat are both provided with an L-shaped plate, and the L-shaped plate is provided with a mounting hole for mounting the adsorption head.

[0047] When in use, the movable fixture 602 is controlled to adsorb the chip, and after the adsorbed chip is placed on the detection seat 603, the detection seat 603 performs batch power-on detection on the chips, and then the fixed fixture 601 adsorbs the chip to enter the next process.

[0048] The frame 10 is also provided with a rejection module, which is used to reject chips that are unqualified in any one of glue dispensing, appearance, power-on detection, marking, and PIN pin distribution. The rejection module includes a first rejection submodule 13, a second rejection submodule 14, and a third rejection submodule 15. The first rejection submodule 13 is used to reject chips that are unqualified in glue dispensing or appearance when the glue dispensing or appearance is unqualified, the second rejection submodule 14 is used to reject chips that are unqualified in power-on detection, and the third rejection submodule 15 is used to reject chips that are unqualified in marking or PIN pin distribution.

[0049] As attached Fig.11As shown, the first rejection submodule 13 includes a third motor 1301, a sixth slide rail 1302, a fifth pneumatic finger 1303 and a first rejection channel 1304. The fifth pneumatic finger 1303 is used to clamp the chip. The length direction of the sixth slide rail 1302 is perpendicular to the moving direction of the chip. The lifting and moving of the fifth pneumatic finger 1303 is controlled by the third motor 1301 and the sixth slide rail 1302, thereby controlling the movement of the chip, and the chip moves to the head end of the first rejection channel 1304. The first rejection channel 1304 is tilted, and chips with unqualified dispensing or appearance fall along the first rejection channel 1304 for rejection.

[0050] As attached Fig.12 As shown, the second rejection submodule 14 includes a push plate 1401 and a second rejection channel 1402. The movement of the push plate 1401 is controlled by a cylinder. The bottom of the push plate 1401 extends to form a protrusion, which can be against the chip to push the chip to the head end of the second rejection channel 1402. The second rejection channel 1402 is tilted, and the chips that fail the power-on detection fall along the second rejection channel 1402 for rejection.

[0051] As attached Fig.13 As shown, the marking module 7 is used to mark the chips that have passed the power-on test. Specifically, the marking module 7 includes a marker 701, a marking channel 702, and a smoke exhaust pipe 703. The conveyor belt controls the chip to move on the marking channel 702. When the chip moves to the marking position, the marker 701 is used to perform laser marking on the chip. At the same time, the smoke exhaust pipe 703 faces the marking position. The smoke exhaust pipe 703 attracts and discharges the smoke, impurities, etc. generated by the laser marking to avoid damage to the chip surface and interference with the chip production process.

[0052] As attached Fig.14 As shown, the PINPIN foot detection module 8 is used to collect the marking image and PIN foot image of the chip after marking, judge whether the marking of the chip is qualified according to the marking image, judge whether the PIN foot distribution of the chip is qualified according to the PIN foot image, and transport the chips with qualified marking and PIN foot distribution to the packaging module 9. Specifically: the PINPIN foot detection module 8 includes a mounting plate 801, a positioning seat 802, a third image collector 803 and a fourth image collector 804, and adsorption heads for adsorbing chips are equidistantly installed on the mounting plate 801. There are two positioning seats 802, and the positioning seats 802 are located below the mounting plate 801 and are arranged in sequence along the length direction of the mounting plate 801. The third image collector 803 is located above a positioning seat 802, and the fourth image collector 804 is two, which are respectively arranged on the opposite sides of another positioning seat 802.

[0053] When in use, the adsorption head adsorbs the chip from the end of the marking channel 702, and the motor and the seventh slide rail control the lifting and movement of the adsorption head, so as to place the chip in a positioning seat 802, and the third image collector 803 collects the marking image of the chip, that is, collects the image of the top surface of the chip. Then, the adsorption head adsorbs the chip again, and the motor and the seventh slide rail control the lifting and movement of the adsorption head, and the fourth image collectors 804 collect the PIN pin image of the chip, that is, collect the image of the long side end face of the chip.

[0054] The PINPIN foot detection module 8 is also used to perform image analysis based on the collected marking image and PIN foot image, to determine whether the marking of the corresponding chip is qualified based on the marking image, and to determine whether the PIN foot distribution of the corresponding chip is qualified based on the PIN foot image. When both the marking and the PIN foot distribution are qualified, the chip is transported to the packaging module 9.

[0055] As attached Fig.15 As shown, the third rejection submodule 15 is used to reject chips with unqualified marking or PIN pin distribution. The third rejection submodule 15 includes a third rejection channel 1501, a fixed block 1502, a movable block 1503 and an eighth slide rail 1504. The fixed block 1502 is arranged at the head end of the third rejection channel 1501, and the movable block 1503 is arranged opposite to the fixed block 1502. The movable block 1503 is slidably connected to the rack 10 through the eighth slide rail 1504. A blocking block is provided at the bottom of the movable block 1503. When the chip is located on the top of the fixed block 1502 and the movable block 1503, the blocking block is used to prevent the chip from falling into the third rejection channel 1501. The PINPIN foot detection module 8 is also used to move the chip to the head end of the third rejection channel 1501. When the chip marking or PIN foot distribution is unqualified, the movable block 1503 moves along the eighth slide rail 1504, and the chip falls into the third rejection channel 1501 between the movable block 1503 and the fixed block 1502 for rejection.

[0056] As attached Fig.16 As shown, the packaging module 9 is used to package the chips with qualified marking and PIN pin distribution. Specifically: the PINPIN pin detection module 8 is also used to move the chip to the packaging channel 901. The packaging module 9 includes a packaging channel 901, a packaging device 902, a braid turntable 903, a packaging tape turntable 904 and a finished product turntable 905. The braid turntable 903 is used to wind the empty braid, the packaging tape turntable 904 is used to wind the braid packaging tape, and the finished product turntable 905 is used to wind the chip after the braid is packaged. The braid moves on the packaging channel 901, and the PINPIN pin detection module 8 is also used to move the chip into the braid on the packaging channel 901, that is, the adsorption head is used to move the chip into the braid on the packaging channel 901. The braid packaging tape aligns the braid, and the encapsulator 902 packages the braid loaded with the chip.

[0057] During operation, the chip is clamped and flipped by the loading flipper 101 and placed on the distributor. At this time, the bottom of the chip faces upward, and the distributor on which the chip is placed moves to the corresponding dispensing channel 203. The chip loading module 1 pushes the chip from the distributor to the dispensing channel 203. The chip moves on the dispensing channel 203, and the dispensing device 201 dispenses glue on the chip on the dispensing channel 203. Multiple dispensing channels 203 provide multiple dispensing paths, and production efficiency is improved through parallel processing. In this process, the tray loading module 12 moves the material tray 11 to the chip loading position, and the material tray 11 is an empty material tray 11.

[0058] The dispensing module 2 moves the dispensed chips to the material tray 11. When the material tray 11 is full of chips, the tray loading module 12 moves the material tray 11 to the tray moving position. The curing module 3 moves the material tray 11 full of chips. During the movement, the curing module 3 cures the glue by ultraviolet rays, wind, temperature, etc.

[0059] The secondary loading module 4 transports the chips in the material tray 11 to the surface detection module 5. The first image acquisition module acquires the end face images of the two opposite end faces of the chip. The diverter 501 changes the direction of the chip so that the other two opposite end faces of the chip face the first image acquisition module. The first image acquisition module acquires the end face images of the other two opposite end faces of the chip, and completes the acquisition of the end face images of the four end faces of the chip. The second image acquisition device 506 acquires the bottom surface image of the bottom of the chip. The detection flipper 504 clamps the chip and flips it. The second image acquisition device 506 acquires the top surface image of the top of the chip, and completes the acquisition of the chip surface image. The surface detection module 5 determines whether the chip's dispensing and appearance are qualified based on the surface image, and the rejection module rejects the chips with unqualified dispensing or appearance.

[0060] The chips that have passed the dispensing and appearance tests are transported in sequence, and the adsorption heads on the movable fixture 602 adsorb multiple chips. The movable fixture 602 changes the relative distance between the adsorption heads to separate the adsorbed chips, and the separated chips are placed in multiple parallel testing seats 603. The testing seats 603 perform power-on tests on the chips in batches, and the rejection module rejects the chips that fail the power-on test.

[0061] The chips that pass the power-on test are transported to the marking module 7, which marks the chips. The PINPIN foot detection module 8 collects the marking image and PIN foot image of the marked chip. The PINPIN foot detection module 8 determines whether the marking of the chip is qualified according to the marking image, and determines whether the PIN foot distribution of the chip is qualified according to the PIN foot image. The rejection module rejects the chips that fail to meet the marking or PIN foot distribution requirements.

[0062] The chips with qualified marking and PIN pin distribution are transported to the packaging module 9, which packages the chips individually with tapes to complete the automated production and processing of the chips.

[0063] The multifunctional detection method for automated chip production uses the multifunctional detection system for automated chip production, including the following contents: The chip is sequentially subjected to dispensing, curing, surface inspection, electrical inspection, marking and PIN foot inspection; The chips that have passed the dispensing, appearance, power-on detection, marking, and PIN pin testing are taped and packaged.

[0064] The chip is sequentially subjected to dispensing, curing, surface inspection, electrical inspection, marking and PIN foot inspection, including the following contents: Collect the surface image of the chip after curing, judge whether the chip's dispensing and appearance are qualified according to the surface image, and remove the chip with unqualified dispensing or appearance; Conduct power-on inspection on batches of chips that have passed the dispensing and appearance tests, and remove chips that fail the power-on inspection. Mark the chips that have passed the power-on test; Collect the marking image and PIN pin image of the chip after marking, judge whether the chip marking is qualified according to the marking image, judge whether the chip PIN pin distribution is qualified according to the PIN pin image, and eliminate the chips with unqualified marking or PIN pin distribution.

[0065] In this solution, improvements are made to the chip production process by setting up multiple inspection items such as appearance, power-on inspection, and PIN pins. Based on the results of multiple inspections, the chips are screened according to their performance and appearance, and unqualified chips are removed in a timely manner to avoid wasting production resources while reducing the waste of production time and improving chip production efficiency.

[0066] The above is only an embodiment of the present invention. The common sense such as the known specific structure and characteristics in the scheme is not described in detail here. The ordinary technicians in the relevant field know all the common technical knowledge in the technical field of the invention before the application date or priority date, can obtain all the existing technologies in the field, and have the ability to apply the conventional experimental means before that date. The ordinary technicians in the relevant field can improve and implement this scheme in combination with their own abilities under the enlightenment given by this application. Some typical known structures or known methods should not become obstacles for ordinary technicians in the relevant field to implement this application. It should be pointed out that for those skilled in the art, without departing from the structure of the present invention, several deformations and improvements can be made, which should also be regarded as the protection scope of the present invention, which will not affect the effect of the implementation of the present invention and the practicality of the patent. The protection scope required by this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.

Claims

1. A multifunctional detection system for automated chip production, characterized in that: It includes a frame, on which a chip loading module, a dispensing module, a curing module, a secondary loading module, a surface detection module, an electrical detection module, a marking module, a PIN foot detection module and a packaging module are sequentially arranged; The chip loading module is used to sequentially transport the chips to the glue dispensing module; the glue dispensing module is used to dispense glue on the chips; the curing module is used to cure the chips after dispensing glue; the secondary loading module is used to sequentially transport the cured chips to the surface inspection module; The surface detection module is used to collect the surface image of the chip, judge whether the chip's dispensing and appearance are qualified according to the surface image, and convey the chips with qualified dispensing and appearance to the electrical detection module; the electrical detection module is used to perform power-on detection on the chips with qualified dispensing and appearance in batches, and convey the chips with qualified power-on detection to the marking module; the marking module is used to mark the chips with qualified power-on detection; the PIN foot detection module is used to collect the marking image and PIN foot image of the chip after marking, judge whether the chip's marking is qualified according to the marking image, judge whether the chip's PIN foot distribution is qualified according to the PIN foot image, and convey the chips with qualified marking and PIN foot distribution to the packaging module; the packaging module is used to package the chips with qualified marking and PIN foot distribution.

2. The multifunctional detection system for automated chip production according to claim 1, characterized in that: The rack is also provided with a tray loading module, which is used to move the material tray to the chip loading position, and the chip loading position is opposite to the glue dispensing module; the glue dispensing module is used to transport the glued chip to the material tray at the chip loading position.

3. The multifunctional detection system for automated chip production according to claim 2, characterized in that: The tray loading module is used to move the tray filled with chips to the tray moving position; the curing module is used to transport the tray located at the tray moving position and to cure the chips on the tray during the movement of the tray.

4. The multifunctional detection system for automated chip production according to claim 3, characterized in that: The rack is also provided with a rejection module, which is used to reject chips that are unqualified in any of the following aspects: dispensing, appearance, power-on detection, marking, and PIN foot distribution.

5. The multifunctional detection system for automated chip production according to claim 4, characterized in that: The chip loading module includes a loading flipper and multiple material distributors. The glue dispensing module includes a glue dispenser and multiple glue dispensing channels for chip movement. The glue dispenser is located above the glue dispensing channel. The material distributor corresponds to the glue dispensing channel one by one and is used in conjunction with the material distributor. The multiple material distributors can be aligned with the loading flipper in sequence. The loading flipper is used to flip the chip and place the flipped chips on the distributor in sequence. The distributor is used to move from a position facing the loading flipper to a position facing the dispensing channel. The chip loading module is used to move the chip on the distributor to the dispensing channel.

6. The multifunctional detection system for automated chip production according to claim 5, characterized in that: The surface detection module includes a diverter, a detection flipper, a first image collector and a second image collector, and the surface image includes an end surface image, a top surface image and a bottom surface image; The diverter is used to change the orientation of the chip, the first image collector is located on two opposite sides of the diverter, and the first image collector is used to collect end surface images of the chip before and after the orientation is changed; The detection flipper is used to flip the chip. The second image collector is located above the detection flipper. The second image collector is used to collect the bottom surface image and the top surface image of the chip before and after flipping.

7. The multifunctional detection system for automated chip production according to claim 6, characterized in that: The electrical detection module includes a movable fixture and a plurality of detection seats, the plurality of detection seats are arranged at equal distances, the movable fixture is arranged above the detection seat, a plurality of adsorption heads arranged at equal distances are arranged on the movable fixture, the movable fixture can change the relative distance of the adsorption heads, and the adsorption heads are used to adsorb the chip; The movable fixture is used to increase the relative distance between the adsorption heads after the adsorption heads adsorb the chip, and place the chips in the detection seats respectively; it is also used to reduce the relative distance between the adsorption heads after the chips are placed in the detection seat, and reset to adsorb the next chip.

8. A multifunctional detection method for automated chip production, characterized in that: A multifunctional detection system for automated chip production using any one of claims 1 to 7.

9. The multifunctional detection method for automated chip production according to claim 8, characterized in that: Includes the following: The chip is sequentially subjected to dispensing, curing, surface inspection, electrical inspection, marking and PIN foot inspection; The chips that have passed the dispensing, appearance, power-on detection, marking, and PIN pin testing are taped and packaged.

10. The multifunctional detection method for automated chip production according to claim 9, characterized in that: The chip is sequentially subjected to dispensing, curing, surface inspection, electrical inspection, marking and PIN foot inspection, including the following: Collect the surface image of the chip after curing, judge whether the chip's dispensing and appearance are qualified according to the surface image, and remove the chip with unqualified dispensing or appearance; Conduct power-on inspection on batches of chips that have passed the dispensing and appearance tests, and remove chips that fail the power-on inspection. Mark the chips that have passed the power-on test; Collect the marking image and PIN pin image of the chip after marking, judge whether the chip marking is qualified according to the marking image, judge whether the chip PIN pin distribution is qualified according to the PIN pin image, and eliminate the chips with unqualified marking or PIN pin distribution.

Images