Preparation method and device of new energy automobile power supply circuit board

Abstract

The invention provides a preparation method and device of a new energy automobile power supply circuit board. The method comprises the following steps: obtaining function demand data, installation data, performance data and cost data of the new energy automobile power supply circuit board; determining circuit board type parameters according to the function demand data, the performance data and the cost data; circuit board specification parameters are determined according to the installation data; determining circuit board processing parameters according to the performance data; determining circuit board preparation parameters according to the circuit board type parameters, the circuit board specification parameters and the circuit board processing parameters; and obtaining the new energy automobile power supply circuit board according to the circuit board preparation parameters. According to the method, the new energy automobile power supply circuit board is prepared and produced through the determined circuit board preparation parameters, the early-stage communication time and cost are greatly saved, and the production efficiency of the circuit board is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and also to a method and device for preparing a new energy vehicle power supply circuit board. Background Art

[0002] Core components such as the battery management system (BMS) and motor controller in new energy vehicles require customized circuit board solutions to meet the requirements of high performance and low power consumption. At present, for circuit boards used in new energy vehicles, circuit board manufacturers and new energy vehicle manufacturers need to go through tedious communication, testing, optimization and other processes to determine the final circuit board design plan. The communication efficiency is low, which seriously affects production efficiency. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a method and device for preparing a new energy vehicle power circuit board to improve the production efficiency of the circuit board.

[0004] In order to solve the above technical problems, the technical solution of the present invention is as follows:

[0005] The first aspect of the present invention provides a method for preparing a new energy vehicle power circuit board, comprising:

[0006] Obtain functional requirement data, installation data, performance data and cost data of new energy vehicle power circuit boards;

[0007] Determining circuit board type parameters according to the functional requirement data, the performance data and the cost data;

[0008] Determine circuit board specification parameters according to the installation data;

[0009] Determining circuit board processing parameters according to the performance data;

[0010] Determining circuit board preparation parameters according to the circuit board type parameters, the circuit board specification parameters and the circuit board processing parameters;

[0011] According to the circuit board preparation parameters, a new energy vehicle power supply circuit board is obtained.

[0012] Optionally, obtain the functional requirement data, installation data, performance data and cost data of the new energy vehicle power circuit board, including:

[0013] Acquire functional requirement data of a new energy vehicle power circuit board; the functional requirement data includes at least one of battery status monitoring data, charge and discharge control data, temperature management data, and communication interface data;

[0014] Acquire installation data of a new energy vehicle power circuit board; the installation data includes layout data and installation space data of the new energy vehicle;

[0015] Obtaining performance data of a new energy vehicle power circuit board; the performance data includes power consumption data, electromagnetic compatibility data, high temperature resistance performance data and safety data;

[0016] Obtain cost data of a new energy vehicle power circuit board; the cost data includes material cost data.

[0017] Optionally, determining a circuit board type parameter according to the functional requirement data, the performance data, and the cost data includes:

[0018] determining keywords according to the functional requirement data, the performance data and the cost data;

[0019] According to the keywords and pre-stored circuit board type data, circuit board type parameters are obtained; the circuit board type parameters include the number of layers of the circuit board.

[0020] Optionally, determining circuit board specification parameters according to the installation data includes:

[0021] Determining circuit board installation space data according to the installation data;

[0022] Determining initial parameters of the circuit board according to the circuit board installation space data and the functional requirement data;

[0023] The circuit board specification parameters are determined according to the preset heat dissipation data and the initial parameters of the circuit board.

[0024] Optionally, determining circuit board processing parameters according to the performance data includes:

[0025] Determining material parameters according to the performance data;

[0026] Based on the performance data and 、A=W×t、 , and obtain the thickness parameters and line width parameters; where I is the maximum current allowed to pass, k is the thermal conductivity coefficient, A is the cross-sectional area, is the allowable temperature rise, W is the line width parameter, J is the current density, and t is the thickness parameter;

[0027] The circuit board processing parameters are determined according to the material parameters, the thickness parameters and the line width parameters.

[0028] Optionally, determining circuit board preparation parameters according to the circuit board type parameters, the circuit board specification parameters and the circuit board processing parameters includes:

[0029] Perform simulation test according to the circuit board type parameter, the circuit board specification parameter and the circuit board processing parameter to obtain test results;

[0030] According to the test results, the circuit board type parameter, the circuit board specification parameter and the circuit board processing parameter are adjusted to obtain adjusted circuit board type parameter, adjusted circuit board specification parameter and adjusted circuit board processing parameter;

[0031] The circuit board preparation parameters are determined according to the adjusted circuit board type parameters, the adjusted circuit board specification parameters and the adjusted circuit board processing parameters.

[0032] Optionally, according to the circuit board preparation parameters, a new energy vehicle power supply circuit board is obtained, including:

[0033] Get the target format;

[0034] Converting the circuit board preparation parameters according to the target format to obtain control parameters;

[0035] The control parameters are input into a circuit board production device to prepare the circuit board, thereby obtaining a new energy vehicle power supply circuit board.

[0036] The second aspect of the present invention provides a device for preparing a new energy vehicle power circuit board, comprising:

[0037] An acquisition module is used to obtain functional requirement data, installation data, performance data and cost data of a new energy vehicle power circuit board;

[0038] A processing module is used to determine circuit board type parameters according to the functional requirement data, the performance data and the cost data; determine circuit board specification parameters according to the installation data; determine circuit board processing parameters according to the performance data; determine circuit board preparation parameters according to the circuit board type parameters, the circuit board specification parameters and the circuit board processing parameters; and obtain a new energy vehicle power supply circuit board according to the circuit board preparation parameters.

[0039] According to a third aspect of the present invention, a computing device is provided, comprising: a processor and a memory storing a computer program, wherein when the computer program is executed by the processor, the method according to the first aspect is executed.

[0040] A fourth aspect of the present invention provides a computer-readable storage medium storing instructions, which, when executed on a computer, causes the computer to execute the method described in the first aspect.

[0041] The above solution of the present invention includes at least the following beneficial effects:

[0042] The above scheme of the present invention obtains the functional requirement data, installation data, performance data and cost data of the new energy vehicle power circuit board, and determines the circuit board type parameters according to the functional requirement data, performance data and cost data, determines the circuit board specification parameters according to the installation data, determines the circuit board processing parameters according to the performance data, and then determines the circuit board preparation parameters, which are used for the preparation and production of the new energy vehicle power circuit board, greatly saving the early communication time and cost, and is conducive to improving the production efficiency of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 It is a schematic flow chart of a method for preparing a new energy vehicle power circuit board in an embodiment of the present invention;

[0044] Figure 2 is a power circuit diagram of a new energy vehicle power circuit board in an embodiment of the present invention;

[0045] Figure 3 It is a structural schematic diagram of a device for preparing a new energy vehicle power circuit board in an embodiment of the present invention. DETAILED DESCRIPTION

[0046] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present invention and to enable the scope of the present invention to be fully communicated to those skilled in the art.

[0047] like Figure 1 As shown, an embodiment of the present invention provides a method for preparing a new energy vehicle power circuit board, comprising the following steps:

[0048] Step 101, obtaining functional requirement data, installation data, performance data and cost data of a new energy vehicle power circuit board;

[0049] Step 102, determining circuit board type parameters according to the functional requirement data, the performance data and the cost data;

[0050] Step 103, determining circuit board specification parameters according to the installation data;

[0051] Step 104, determining circuit board processing parameters according to the performance data;

[0052] Step 105, determining circuit board preparation parameters according to the circuit board type parameters, the circuit board specification parameters and the circuit board processing parameters;

[0053] Step 106, obtaining a new energy vehicle power circuit board according to the circuit board preparation parameters.

[0054] The preparation method of the new energy vehicle power circuit board in the embodiment of the present invention obtains the functional requirement data, installation data, performance data and cost data of the new energy vehicle power circuit board, and determines the circuit board type parameters according to the functional requirement data, performance data and cost data, determines the circuit board specification parameters according to the installation data, determines the circuit board processing parameters according to the performance data, and then determines the circuit board preparation parameters, which is used for the preparation and production of the new energy vehicle power circuit board, greatly saving the early communication time and cost, and is conducive to improving the production efficiency of the circuit board.

[0055] In an optional embodiment of the present invention, step 101 may include:

[0056] Step 101, obtaining functional requirement data of a new energy vehicle power circuit board; the functional requirement data includes at least one of battery status monitoring data, charge and discharge control data, temperature management data, and communication interface data;

[0057] Specifically, the functional requirement data of new energy vehicle power circuit boards include the functional requirements when the circuit boards are used in core components such as battery management systems (BMS) and motor controllers, such as battery status monitoring data, charge and discharge control data, temperature management data, communication interface data, etc. These data affect the subsequent circuit board types, such as the selection and determination of single-layer boards, double-layer boards or multi-layer boards.

[0058] Step 102, obtaining installation data of the new energy vehicle power circuit board; the installation data includes layout data and installation space data of the new energy vehicle;

[0059] Specifically, the installation data of the new energy vehicle power circuit board mainly includes the layout and installation space inside the new energy vehicle, so as to facilitate the subsequent selection of the appropriate circuit board size (such as length, height and width, etc.).

[0060] Step 103, obtaining performance data of the new energy vehicle power circuit board; the performance data includes power consumption data, electromagnetic compatibility data, high temperature resistance performance data and safety data;

[0061] Specifically, the performance data of the new energy vehicle power supply circuit board may include not only power consumption data, electromagnetic compatibility data, high temperature performance data and safety data, but also current data, voltage data, temperature data, etc. that the circuit board needs to withstand, which will affect the subsequent selection of appropriate materials, copper thickness and line width of the circuit board. In a specific embodiment, the performance data includes power consumption data, electromagnetic compatibility data, high temperature performance data, safety data, target current data, target voltage data and target temperature data, etc., so as to more accurately determine the material, copper thickness and line width of the circuit board.

[0062] Step 104, obtaining cost data of the new energy vehicle power circuit board; the cost data includes material cost data.

[0063] Specifically, the purpose of obtaining cost data for new energy vehicle power circuit boards is to understand the cost requirements of new energy vehicle customers for circuit boards, and to select appropriate circuit board types, materials, and manufacturing processes based on their cost expectations. Cost data may include material cost data, manufacturing process cost data, labor cost data, etc. used to prepare circuit boards.

[0064] In an optional embodiment of the present invention, step 102 may include:

[0065] Step 1021, determining keywords according to the functional requirement data, the performance data and the cost data;

[0066] Specifically, keywords can be used to find the corresponding circuit board type from the pre-stored circuit board type data in the future, so that the circuit board type can be quickly determined by using past experience, which is conducive to saving time and improving production efficiency. Here, the functional requirement data, performance data and cost data can be cleaned first to remove irrelevant information, duplicate data or noise data; then the cleaned data is converted into a format and output in the form of a document or table to facilitate subsequent keyword extraction; according to the knowledge and data content in the circuit board field, the keyword range to be extracted is determined, for example, the keywords of the functional requirement data can include "signal processing", "high-speed transmission", etc.; the keywords of the performance data can include "frequency response", "power consumption", etc.; the keywords of the cost data can include "material cost", "manufacturing cost", etc. Extracting representative keywords from a large amount of data is conducive to improving retrieval efficiency and accuracy.

[0067] Step 1022, obtaining circuit board type parameters according to the keyword and pre-stored circuit board type data; the circuit board type parameters include the number of layers of the circuit board.

[0068] Specifically, the pre-stored circuit board type data can be stored in a table, which includes keywords extracted from historical functional requirement data, historical performance data, and historical cost data, and circuit board type parameters corresponding to the keywords. Here, the circuit board type parameter can be a single-layer circuit board, a double-layer circuit board, or a multi-layer circuit board. The circuit board type parameter can be used to determine the number of layers of the circuit board and select an appropriate preparation process.

[0069] In an optional embodiment of the present invention, step 103 may include:

[0070] Step 1031, determining circuit board installation space data according to the installation data;

[0071] Specifically, the installation data includes the size of the installation space reserved inside the new energy vehicle, which includes length, width and height. The circuit board size (length, width and height) must adapt to the installation space inside the new energy vehicle. Here, the circuit board installation space data includes installation length, installation width and installation height, that is, the length, width and height of the circuit board installation reserved inside the new energy vehicle.

[0072] Step 1032, determining initial parameters of the circuit board according to the circuit board installation space data and the functional requirement data;

[0073] Specifically, according to the functional requirement data and the preset component layout conditions, the component layout and wiring density requirements of the circuit board can be determined, and then according to the component layout and wiring density requirements of the circuit board, the initial parameters of the circuit board (including length parameters, width parameters and height parameters) can be preliminarily determined. Here, the preset component layout conditions may include: the battery status monitoring module, the charge and discharge control module, the temperature management module and the communication interface module are placed at the first preset position on the circuit board (this position is easy to dissipate heat and has less interference); the battery status monitoring sensor is placed at the second preset position on the circuit board (this position is close to the battery) to reduce attenuation and interference in signal transmission; the heating elements (such as power elements) are evenly distributed on the circuit board to facilitate heat dissipation, and the distance between the temperature sensitive elements (such as temperature sensors, thermistors, etc.) and the heating elements is greater than the preset value (the temperature sensitive elements are far away from the heating elements). According to the component layout of the circuit board, all components that need to be installed on the circuit board can be obtained, including integrated circuits (ICs), resistors, capacitors, inductors, connectors, sensors, etc. The package data (package size) of each component can be obtained in the component data sheet. The circuit board design software is used to calculate the component layout and the length of each signal line and the number of layers according to the component package data and the relationship between them. After that, a safety margin is reserved around the circuit board according to the preset margin to prevent damage to the circuit board or components during the manufacturing and assembly process. The size measurement tool in the circuit board design software can be used to obtain the initial parameters of the circuit board (i.e., the size of the circuit board) according to the length, number of layers, and reserved safety margin of the component layout. It should be noted that the length in the initial parameters of the circuit board is less than the length in the circuit board installation space data, the width in the initial parameters of the circuit board is less than the width in the circuit board installation space data, and the height in the initial parameters of the circuit board is less than the height in the circuit board installation space data, so as to ensure that the circuit board can be installed in the installation space inside the new energy vehicle.

[0074] Step 1033, determining circuit board specification parameters according to preset heat dissipation data and the circuit board initial parameters.

[0075] Specifically, the preset heat dissipation data includes the position and specifications (such as length, width and height, etc.) of the heat dissipation device (such as heat sink). The initial parameters of the circuit board are adjusted according to the preset heat dissipation data. If the heat dissipation device is installed on the circuit board, the length, width and height of the initial parameters of the circuit board need to be increased. If the heat dissipation device and the circuit board are installed separately in the installation space inside the new energy vehicle, the length, width and height of the initial parameters of the circuit board need to be reduced to ensure that the heat dissipation device and the circuit board can be installed together in the installation space inside the new energy vehicle. The circuit board specification parameters include the adjusted initial parameters of the circuit board (such as the adjusted length, adjusted width and adjusted height). It should be noted that the value increased or reduced during the adjustment can be adjusted according to the preset range or according to the actual situation.

[0076] In an optional embodiment of the present invention, step 104 may include:

[0077] Step 1041, determining material parameters according to the performance data;

[0078] Specifically, the corresponding circuit board substrate can be determined according to the performance data, such as FR-4 epoxy resin glass fiber cloth board, which has good insulation, heat resistance and mechanical strength; or polyimide (PI), ceramic or metal matrix composite materials, which can be used in high power density or high temperature environments. Here, the corresponding material can be selected from the pre-stored material library according to the performance data. The material parameters can include circuit board substrate parameters, copper foil thickness, etc. In a specific embodiment, the material parameters include: ceramic substrate, copper foil thickness is 35μm.

[0079] Step 1042, based on the performance data and 、A=W×t、 , and obtain the thickness parameters and line width parameters; where I is the maximum current allowed to pass, k is the thermal conductivity coefficient, A is the cross-sectional area, is the allowable temperature rise, W is the line width parameter, J is the current density, and t is the thickness parameter;

[0080] Specifically, the performance data may include data such as the maximum current allowed to pass, thermal conductivity coefficient, allowable temperature rise, current density, etc. These data and the above formula can be used to calculate the thickness parameters and line width parameters.

[0081] Step 1043, determining circuit board processing parameters according to the material parameters, the thickness parameters and the line width parameters.

[0082] Specifically, the circuit board processing parameters may include material parameters, thickness parameters, line spacing and line width parameters, which are used for subsequent production and preparation of the circuit board.

[0083] In an optional embodiment of the present invention, step 105 may include:

[0084] Step 1051, performing a simulation test according to the circuit board type parameter, the circuit board specification parameter and the circuit board processing parameter to obtain a test result;

[0085] Specifically, preset simulation parameters (such as power supply voltage of 3.3V or 5V, signal frequency of 100MHz or 1GHz, resistive, inductive or capacitive load, etc.), circuit board type parameters (such as single-layer circuit board or double-layer circuit board or multi-layer circuit board), circuit board specification parameters (such as adjusted length, adjusted width and adjusted height) and circuit board processing parameters (including material parameters, thickness parameters, line spacing and line width parameters) can be input into circuit board simulation software, such as Multisim (a simulation software), and simulation test is performed according to preset counter-proof test scenario, wherein a specific preset counter-proof test scenario includes: signal transmission is distorted under the load in the preset simulation parameters; output performance simulation results of the circuit board (which may include voltage, current, power, efficiency, etc.) as test results, and a specific test result includes: waveform diagrams (such as voltage waveforms or current waveforms), data reports (such as power loss, signal distortion data), and the test results facilitate the subsequent adjustment of various parameters.

[0086] Step 1052, adjusting the circuit board type parameter, the circuit board specification parameter, and the circuit board processing parameter according to the test result to obtain adjusted circuit board type parameter, adjusted circuit board specification parameter, and adjusted circuit board processing parameter;

[0087] Specifically, when adjusting parameters, the material type, circuit board type, length of the circuit board (or height or width, etc.), line width of the circuit board, etc. can be adjusted. After the adjustment, simulation test can be performed again until the test results are consistent with the expected results. The circuit board type parameters, circuit board specification parameters and circuit board processing parameters adjusted for the last time are used as the adjusted circuit board type parameters, adjusted circuit board specification parameters and adjusted circuit board processing parameters.

[0088] In a specific embodiment, if the waveform diagram in the test result shows serious waveform distortion and the distortion exceeds the preset distortion range, it indicates that there is a problem with the circuit board manufactured according to the original circuit board type parameters, the original circuit board specification parameters and the original circuit board processing parameters, and these parameters need to be adjusted by any of the following methods:

[0089] Adjust the single-layer circuit board in the circuit board type parameter to a multi-layer circuit board. The multi-layer circuit board can provide a dedicated power layer and ground layer to effectively reduce power noise and electromagnetic interference. For example, for high-frequency circuits, multi-layer boards can better control the transmission characteristics of signals; or adjust it to a double-layer circuit board to reduce the interference caused by interlayer coupling;

[0090] If the waveform distortion is caused by impedance mismatch during signal transmission, the line width parameter in the circuit board processing parameters can be increased to reduce resistance and inductance and reduce signal loss. For example, for high-current power lines, increasing the line width can effectively reduce line voltage drop.

[0091] Adjust the line spacing parameters in the circuit board processing parameters: Increasing the spacing between signal lines can reduce line coupling and crosstalk. Especially for high-speed signal lines, sufficient line spacing should be ensured. Here, the line spacing parameters in the circuit board processing parameters can be adjusted according to the following formula: S=V / E or S≥3W, where S is the adjusted line spacing in millimeters (mm), indicating the distance between two adjacent traces; V is the maximum potential difference between adjacent traces in volts (V), which refers to the voltage difference between adjacent traces when the circuit is working normally or under possible abnormal conditions; E is the breakdown electric field strength of the circuit board material in volts per millimeter (V / mm). Different circuit board materials have different breakdown electric field strengths. For example, the common FR-4 (a code for a flame-resistant material grade, which means that the resin material must be able to extinguish itself after burning) board has a breakdown electric field strength of approximately 14-22kV / mm; W is the trace width in millimeters (mm).

[0092] Adjust the material parameters in the circuit board processing parameters: For example, adjust the FR-4 board in the circuit board processing parameters to Rogers board. Rogers board is a high-frequency board with better high-frequency characteristics, which can reduce the attenuation and distortion of signals during transmission; or adjust it to a metal substrate or ceramic substrate with good thermal conductivity to improve heat dissipation efficiency and reduce signal distortion caused by increased temperature.

[0093] In specific implementation, any of the above adjustment methods can be used according to the results of actual simulation tests, or other methods can be selected according to actual conditions to adjust the original relevant parameters (at least one of circuit board type parameters, circuit board specification parameters and circuit board processing parameters).

[0094] In a specific embodiment, the trained prediction and correction model can be used to adjust the original relevant parameters:

[0095] Use data acquisition equipment (such as oscilloscope, data acquisition card, etc.) to simulate the power circuit of the new energy vehicle power supply circuit board made according to the circuit board type parameters, circuit board specification parameters and circuit board processing parameters (such as Figure 2 The voltage or current waveform data is collected in the waveform generator (as shown in Figure 1). The sampling frequency should be high enough to capture the distortion characteristics, while recording long enough time series data to cover all possible distortion conditions. Figure 2In the figure, D1, D2, and D3 are infrared transmitting tubes, E1 and E2 are relay control switches, R3, R4, R5, R6, and R7 are resistors, Q1, Q2, and Q3 are infrared receiving tubes, and P1.0 to P5.5 are control output terminals.

[0096] The collected waveform data is used using the formula Normalize to a preset range (such as [0,1] or [-1,1]) to obtain normalized waveform data to speed up the training of the preset network model and improve stability; is the normalized waveform data, y is the collected waveform data, is the maximum value of the acquired waveform data, It is the minimum value of the acquired waveform data.

[0097] The normalized waveform data is divided into a training set, a validation set, and a test set in a ratio of 70%:15%:15%.

[0098] The preset network model is trained using the training set data to obtain the first model; the process includes:

[0099] The training set data is formatted to obtain time series data; time series data is arranged in chronological order.

[0100] Input the time series data into the input layer of the preset network model to obtain the first output result; here, the input layer is calculated by the formula i t =σ( W i ∙[ h t-1 , x t ]+ b i ) The time series data is processed to obtain a first output result, where: is the first output result of the current time step, is the sigmoid function, is the weight matrix of the input layer, is the first bias vector, The time series data input for the current time step, is the hidden state at the previous time step.

[0101] The time series data is input into the processing layer of the preset network model to obtain the second output result; here, the processing layer uses the formula f t =σ( W f ∙[ h t-1 , x t ]+ b f ) The time series data is processed to obtain a first output result, where: is the second output result of the current time step, is the sigmoid function, is the weight matrix of the processing layer, is the second bias vector, The time series data input for the current time step, is the first output result of the current time step input, is the hidden state at the previous time step.

[0102] According to the first output result, the second output result and the cell state, the updated cell state is obtained; wherein, by the formula Get the updated cell state, where is the cell state at the current time step, is the second output result of the current time step, is the cell state at the previous time step, is the first output result of the current time step, is a candidate cell state.

[0103] Input the time series data into the output layer of the preset network model to obtain the predicted value; and Get the predicted value, where is the hidden state at the current moment, is the predicted value at the current moment, is the sigmoid function, is the sigmoid function, is the weight matrix of the output layer, is the hidden state at the previous moment, The time series data input for the current time step, is the third bias vector.

[0104] The validation set data is used for validation and the second model is obtained to prevent overfitting.

[0105] The second model is evaluated using the test set data, and evaluation indicators (such as mean square error, root mean square error, etc.) are calculated to evaluate the performance of the second model. In this embodiment, the formula is used The second model is evaluated, where is the evaluation value, n is the total number of test set data, is the true value of the i-th data in the test set data, is the predicted value of the i-th data output by the second model. When the value of is equal to the preset evaluation value, the training is stopped to obtain the trained prediction and correction model.

[0106] Use data acquisition equipment to collect in real time the distorted waveform data of the power circuit of the new energy vehicle power circuit board simulated according to the circuit board type parameters, circuit board specification parameters and circuit board processing parameters, and perform preprocessing (normalization processing as described above, which will not be repeated here).

[0107] The pre-processed data collected in real time is input into the trained prediction correction model to obtain the predicted distortion correction amount.

[0108] According to the formula The predicted distortion correction amount is added to the real-time collected distortion waveform data to obtain the corrected waveform, where: is the i-th element in the corrected waveform, is the i-th element in the predicted distortion correction, It is the i-th element in the distorted waveform data collected in real time.

[0109] Adjust at least one of the circuit board type parameters (such as a single-layer circuit board or a double-layer circuit board or a multi-layer circuit board), circuit board specification parameters (such as adjusted length, adjusted width and adjusted height) and circuit board processing parameters (including material parameters, thickness parameters, line spacing and line width parameters) until the waveform output by the circuit board simulation software is consistent with the corrected waveform.

[0110] Step 1053: determining circuit board preparation parameters according to the adjusted circuit board type parameters, the adjusted circuit board specification parameters, and the adjusted circuit board processing parameters.

[0111] Specifically, the circuit board preparation parameters may include adjusted circuit board type parameters, adjusted circuit board specification parameters and adjusted circuit board processing parameters. The circuit board preparation parameters will be used for subsequent preparation of the circuit board. The circuit board preparation parameters determined according to the above steps or processes greatly reduce manual participation, save communication costs, and are conducive to improving the production efficiency of the circuit board.

[0112] In an optional embodiment of the present invention, step 106 may include:

[0113] Step 1061, obtaining the target format;

[0114] Specifically, the target format may include formats that can be recognized by multiple devices used to produce circuit boards (such as photolithography machines, electroplating equipment, cutting equipment, etc.). In a specific embodiment, the target format may include multiple formats, which need to be determined according to the production equipment used.

[0115] Step 1062, converting the circuit board preparation parameters according to the target format to obtain control parameters;

[0116] Specifically, the circuit board preparation parameters can be converted into control parameters according to the target format that can be recognized by each device, so that each device can prepare the circuit board according to the control parameters. In a specific embodiment, the control parameters include photolithography machine control parameters, electroplating equipment control parameters, cutting equipment control parameters, etc.

[0117] Step 1063, inputting the control parameters into a circuit board production device to prepare the circuit board to obtain a new energy vehicle power supply circuit board.

[0118] Specifically, the control parameters are input into the circuit board production equipment by type, such as the photolithography machine control parameters are input into the photolithography machine controller, the electroplating equipment control parameters are input into the electroplating equipment controller, and the cutting equipment control parameters are input into the cutting equipment controller. Each device cooperates with each other to complete the production of the circuit board.

[0119] A specific embodiment of the method for preparing the new energy vehicle power circuit board according to the embodiment of the present invention includes:

[0120] Step 111, obtaining data of a new energy vehicle power circuit board;

[0121] The customer provides relevant data of the new energy vehicle power circuit board, such as the functional requirement data, installation data, performance data and cost data of the new energy vehicle power circuit board, which will be used to determine various production parameters of the subsequent circuit board.

[0122] Step 112, determining circuit board type parameters;

[0123] Clean the functional requirement data, performance data and cost data, remove irrelevant information, duplicate data or noise data, and then extract keywords from the cleaned data to improve retrieval efficiency and accuracy. Here, the target keywords can be matched from the cleaned data according to the preset keywords in the preset template, and then the corresponding circuit board type parameters can be found from the pre-stored circuit board type data according to the target keywords, such as single-layer circuit board, double-layer circuit board or multi-layer circuit board.

[0124] Step 113, determining circuit board specification parameters;

[0125] According to the size of the installation space reserved inside the new energy vehicle and the size of the heat sink, the length, width and height of the circuit board specification parameters are jointly determined to ensure that the heat sink and the circuit board can be installed together in the installation space inside the new energy vehicle.

[0126] Step 114, determining circuit board processing parameters;

[0127] According to the performance data, the corresponding material parameters are selected from the pre-stored material library, and the thickness parameters and line width parameters are calculated according to the relevant formulas. These parameters are used as part of the circuit board processing parameters for the subsequent production and preparation of the circuit board.

[0128] Step 115, determining circuit board preparation parameters;

[0129] The test results are obtained through simulation tests, and then the various parameters determined above are adjusted according to the test results so that the test results meet the expected results. At this time, the circuit board type parameters, circuit board specification parameters and circuit board processing parameters adjusted for the last time are used as the adjusted circuit board type parameters, adjusted circuit board specification parameters and adjusted circuit board processing parameters.

[0130] Step 116, preparing a new energy vehicle power circuit board.

[0131] The parameters are converted into corresponding control parameters according to the format of the production equipment, and the control parameters are input into the circuit board production equipment to prepare the circuit board. The various equipment cooperate with each other to complete the production of the circuit board and obtain the new energy vehicle power supply circuit board.

[0132] The method for preparing a new energy vehicle power circuit board of the embodiment of the present invention can automatically obtain production preparation parameters for the circuit board based on the demand data for the circuit board provided by the user, and use them for the production of the circuit board, thereby reducing communication costs and improving the production efficiency of the circuit board.

[0133] like Figure 3 As shown, an embodiment of the present invention provides a preparation device 200 for a new energy vehicle power circuit board, comprising:

[0134] An acquisition module 201 is used to acquire functional requirement data, installation data, performance data and cost data of a new energy vehicle power circuit board;

[0135] The processing module 202 is used to determine the circuit board type parameters according to the functional requirement data, the performance data and the cost data; determine the circuit board specification parameters according to the installation data; determine the circuit board processing parameters according to the performance data; determine the circuit board preparation parameters according to the circuit board type parameters, the circuit board specification parameters and the circuit board processing parameters; and obtain the new energy vehicle power supply circuit board according to the circuit board preparation parameters.

[0136] Optionally, obtain the functional requirement data, installation data, performance data and cost data of the new energy vehicle power circuit board, including:

[0137] Acquire functional requirement data of a new energy vehicle power circuit board; the functional requirement data includes at least one of battery status monitoring data, charge and discharge control data, temperature management data, and communication interface data;

[0138] Acquire installation data of a new energy vehicle power circuit board; the installation data includes layout data and installation space data of the new energy vehicle;

[0139] Obtaining performance data of a new energy vehicle power circuit board; the performance data includes power consumption data, electromagnetic compatibility data, high temperature resistance performance data and safety data;

[0140] Obtain cost data of a new energy vehicle power circuit board; the cost data includes material cost data.

[0141] Optionally, determining a circuit board type parameter according to the functional requirement data, the performance data, and the cost data includes:

[0142] determining keywords according to the functional requirement data, the performance data and the cost data;

[0143] According to the keywords and pre-stored circuit board type data, circuit board type parameters are obtained; the circuit board type parameters include the number of layers of the circuit board.

[0144] Optionally, determining circuit board specification parameters according to the installation data includes:

[0145] Determining circuit board installation space data according to the installation data;

[0146] Determining initial parameters of the circuit board according to the circuit board installation space data and the functional requirement data;

[0147] The circuit board specification parameters are determined according to the preset heat dissipation data and the initial parameters of the circuit board.

[0148] Optionally, determining circuit board processing parameters according to the performance data includes:

[0149] Determining material parameters according to the performance data;

[0150] Based on the performance data and 、A=W×t、 , and obtain the thickness parameters and line width parameters; where I is the maximum current allowed to pass, k is the thermal conductivity coefficient, A is the cross-sectional area, is the allowable temperature rise, W is the line width parameter, J is the current density, and t is the thickness parameter;

[0151] The circuit board processing parameters are determined according to the material parameters, the thickness parameters and the line width parameters.

[0152] Optionally, determining circuit board preparation parameters according to the circuit board type parameters, the circuit board specification parameters and the circuit board processing parameters includes:

[0153] Perform simulation test according to the circuit board type parameter, the circuit board specification parameter and the circuit board processing parameter to obtain test results;

[0154] According to the test results, the circuit board type parameter, the circuit board specification parameter and the circuit board processing parameter are adjusted to obtain adjusted circuit board type parameter, adjusted circuit board specification parameter and adjusted circuit board processing parameter;

[0155] The circuit board preparation parameters are determined according to the adjusted circuit board type parameters, the adjusted circuit board specification parameters and the adjusted circuit board processing parameters.

[0156] Optionally, according to the circuit board preparation parameters, a new energy vehicle power supply circuit board is obtained, including:

[0157] Get the target format;

[0158] Converting the circuit board preparation parameters according to the target format to obtain control parameters;

[0159] The control parameters are input into a circuit board production device to prepare the circuit board, thereby obtaining a new energy vehicle power supply circuit board.

[0160] The preparation device of the new energy vehicle power circuit board in the embodiment of the present invention obtains the functional requirement data, installation data, performance data and cost data of the new energy vehicle power circuit board, and determines the circuit board type parameters according to the functional requirement data, performance data and cost data, determines the circuit board specification parameters according to the installation data, determines the circuit board processing parameters according to the performance data, and then determines the circuit board preparation parameters, which is used for the preparation and production of the new energy vehicle power circuit board, greatly saving the early communication time and cost, and is conducive to improving the production efficiency of the circuit board.

[0161] It should be noted that the device is a device corresponding to the above method, and all implementations in the above method embodiment are applicable to the embodiment of the device and can achieve the same technical effect. This embodiment will not be repeated.

[0162] The embodiment of the present invention further provides a computing device, comprising: a processor, and a memory storing a computer program, wherein when the computer program is executed by the processor, the method described in any one of the above embodiments is executed. All implementations in the above method embodiments are applicable to the embodiments of the device, and can achieve the same technical effects. They will not be described in detail in this embodiment.

[0163] The embodiment of the present invention further provides a computer-readable storage medium on which instructions are stored. When the instructions are executed on a computer, the computer executes the method as described in any one of the above embodiments. All implementations in the above method embodiments are applicable to the embodiments of the device and can achieve the same technical effects. They will not be described in detail in this embodiment.

[0164] It should be noted that in the apparatus and method of the present invention, it is obvious that each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent solutions of the present invention. In addition, the steps of performing the above series of processes can naturally be performed in chronological order according to the order of description, but do not necessarily need to be performed in chronological order. Some steps can be performed in parallel, crosswise or independently of each other.

[0165] It should be noted that, in the above-mentioned embodiments, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "include one..." do not exclude the existence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the implementation of the above-mentioned embodiments is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the opposite order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0166] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for preparing a new energy vehicle power circuit board, characterized in that: include: Obtain functional requirement data, installation data, performance data and cost data of new energy vehicle power circuit boards; Determining circuit board type parameters according to the functional requirement data, the performance data and the cost data; Determine circuit board specification parameters according to the installation data; Determining circuit board processing parameters according to the performance data; Determining circuit board preparation parameters according to the circuit board type parameters, the circuit board specification parameters and the circuit board processing parameters; According to the circuit board preparation parameters, a new energy vehicle power supply circuit board is obtained.

2. The method for preparing the new energy vehicle power circuit board according to claim 1, characterized in that: Obtain functional requirements data, installation data, performance data and cost data for new energy vehicle power circuit boards, including: Acquire functional requirement data of a new energy vehicle power circuit board; the functional requirement data includes at least one of battery status monitoring data, charge and discharge control data, temperature management data, and communication interface data; Acquire installation data of a new energy vehicle power circuit board; the installation data includes layout data and installation space data of the new energy vehicle; Obtaining performance data of a new energy vehicle power circuit board; the performance data includes power consumption data, electromagnetic compatibility data, high temperature resistance performance data and safety data; Obtain cost data of a new energy vehicle power circuit board; the cost data includes material cost data.

3. The method for preparing the new energy vehicle power circuit board according to claim 1, characterized in that: Determining circuit board type parameters according to the functional requirement data, the performance data and the cost data includes: determining keywords according to the functional requirement data, the performance data and the cost data; According to the keywords and pre-stored circuit board type data, circuit board type parameters are obtained; the circuit board type parameters include the number of layers of the circuit board.

4. The method for preparing the new energy vehicle power circuit board according to claim 1, characterized in that: According to the installation data, the circuit board specification parameters are determined, including: Determining circuit board installation space data according to the installation data; Determining initial parameters of the circuit board according to the circuit board installation space data and the functional requirement data; The circuit board specification parameters are determined according to the preset heat dissipation data and the initial parameters of the circuit board.

5. The method for preparing the new energy vehicle power circuit board according to claim 1, characterized in that: According to the performance data, circuit board processing parameters are determined, including: Determining material parameters according to the performance data; Based on the performance data and 、A=W×t、 , and obtain the thickness parameters and line width parameters; where I is the maximum current allowed to pass, k is the thermal conductivity coefficient, A is the cross-sectional area, is the allowable temperature rise, W is the line width parameter, J is the current density, and t is the thickness parameter; The circuit board processing parameters are determined according to the material parameters, the thickness parameters and the line width parameters.

6. The method for preparing the new energy vehicle power circuit board according to claim 1, characterized in that: Determining circuit board preparation parameters according to the circuit board type parameters, the circuit board specification parameters and the circuit board processing parameters includes: Perform simulation test according to the circuit board type parameter, the circuit board specification parameter and the circuit board processing parameter to obtain test results; According to the test results, the circuit board type parameter, the circuit board specification parameter and the circuit board processing parameter are adjusted to obtain adjusted circuit board type parameter, adjusted circuit board specification parameter and adjusted circuit board processing parameter; The circuit board preparation parameters are determined according to the adjusted circuit board type parameters, the adjusted circuit board specification parameters and the adjusted circuit board processing parameters.

7. The method for preparing a new energy vehicle power circuit board according to claim 1, characterized in that: According to the circuit board preparation parameters, a new energy vehicle power supply circuit board is obtained, including: Get the target format; Converting the circuit board preparation parameters according to the target format to obtain control parameters; The control parameters are input into a circuit board production device to prepare the circuit board, thereby obtaining a new energy vehicle power supply circuit board.

8. A device for preparing a new energy vehicle power circuit board, characterized in that: include: An acquisition module is used to obtain functional requirement data, installation data, performance data and cost data of a new energy vehicle power circuit board; A processing module is used to determine circuit board type parameters according to the functional requirement data, the performance data and the cost data; determine circuit board specification parameters according to the installation data; determine circuit board processing parameters according to the performance data; determine circuit board preparation parameters according to the circuit board type parameters, the circuit board specification parameters and the circuit board processing parameters; and obtain a new energy vehicle power supply circuit board according to the circuit board preparation parameters.

9. A computing device, characterized in that include: A processor and a memory storing a computer program, wherein when the computer program is executed by the processor, the method according to any one of claims 1 to 7 is performed.

10. A computer-readable storage medium, characterized in that: Instructions are stored, and when the instructions are executed on a computer, the computer is caused to execute the method according to any one of claims 1 to 7.

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