Heat pipe type radiator

Abstract

The invention discloses a heat pipe type radiator which comprises a base, a plurality of heat pipes and a plurality of radiating tower bodies, and the base is used for being in contact with a heating element and absorbing heat. The heat pipes are arranged in the mode that part of the heat pipes on one side of the base are connected to at least one additional heat dissipation tower body in a bending or extending mode, but not all the heat pipes are connected to the heat dissipation tower body on the corresponding side, and an asymmetrically-distributed structure is formed. In addition, the two ends of the heat pipe are not limited to be connected with the nearest heat dissipation tower body on one side, other heat dissipation tower bodies are allowed to be connected in a crossing mode, and multi-path heat conduction is further achieved. The heat dissipation tower bodies can be provided with hollow structures, so that the heat pipes penetrate through and are connected with a plurality of heat dissipation tower bodies, and meanwhile, the heat pipes can be arranged at a large bending angle so as to avoid components or adapt to different space requirements. The arrangement mode of the heat pipes and the heat dissipation tower body is not limited to the vertical direction, and the heat pipes and the heat dissipation tower body can be horizontally or obliquely placed. The structure improves the heat dissipation area and the heat capacity, optimizes the heat distribution uniformity, is suitable for efficient heat dissipation of high-power heating elements, and is widely applied to the fields of computers, servers, industrial electronic equipment and aerospace.

Description

Technical Field

[0001] The invention relates to the technical field of heat dissipation, and in particular to a heat pipe type radiator suitable for high power. Background Art

[0002] With the popularization of high-performance electronic devices, especially central processing units (CPUs), graphics processing units (GPUs) and high-power power modules, high-power LED lights, and radars, the heat generation is increasing, which puts higher requirements on the efficiency of the cooling system. At present, most air-cooled radiators on the market adopt a single-tower or double-tower structure, and the heat pipes are usually arranged in a U shape, with the base and the cooling tower body connected at both ends. However, this design has many limitations: the heat dissipation structure is fixed, and the heat pipes are usually all connected to the cooling tower body on the corresponding side, resulting in insufficient scalability, limited heat dissipation area and heat capacity, uneven heat distribution, and difficulty in meeting the heat dissipation requirements of ultra-high power equipment; in high-density application scenarios such as servers, in order to compensate for insufficient heat dissipation, the cooling fan needs to run at a high speed, resulting in increased system power consumption and increased noise. Therefore, there is an urgent need for an improved multi-tower heat dissipation structure that can achieve improved heat dissipation efficiency and reduced system power consumption by optimizing the arrangement of heat pipes to meet the actual application needs of high-performance electronic equipment. Summary of the invention

[0003] The present invention provides a heat pipe radiator, which aims to solve the problems of the prior art, such as fixed radiator structure, inflexible heat pipe distribution, limited heat dissipation efficiency and insufficient scalability. The present invention provides an efficient and flexible heat dissipation solution through an innovative heat pipe arrangement method, which is suitable for various high-performance electronic devices and heating scenarios. At the same time, in traditional radiators, in complex layout scenarios, it is difficult for heat pipes to avoid components, resulting in poor compatibility and failure to meet the heat dissipation requirements of high-power consumption equipment in different application environments.

[0004] A heat pipe type radiator comprises a base, a plurality of heat pipes and a plurality of heat dissipation tower bodies. The heat pipes are arranged in such a manner that one end of some of the heat pipes on one side of the base is connected to the heat dissipation tower body on the corresponding side, and the remaining heat pipes are connected to at least one additional heat dissipation tower body by bending or extending. The heat pipe arrangement allows the number of heat pipes on both sides of the base to be asymmetrically distributed when the heat pipes are connected to the heat dissipation tower bodies on both sides. The two ends of the heat pipes are not limited to connecting to the heat dissipation tower body closest to one side. The heat pipe arrangement allows crossing the heat dissipation tower body to connect to other heat dissipation tower bodies. The arrangement does not limit the number of heat dissipation tower bodies and the number of heat pipes connected to each heat dissipation tower body.

[0005] Furthermore, a partial hollow structure is provided on the heat dissipation tower body, which is used to reserve space for the heat pipe to pass through the heat dissipation tower body and connect to other heat dissipation tower bodies.

[0006] Furthermore, the heat pipes are arranged at bending angles to contact multiple heat sources for heat conduction or to avoid components.

[0007] Furthermore, the arrangement of the heat pipe and the heat dissipation tower body is not limited to the vertical direction. The heat pipe and the heat dissipation tower body can be placed horizontally or arranged at an angle. The heat pipe is connected to a plurality of the heat dissipation tower bodies by bending or extending.

[0008] Furthermore, the heat pipe arrangement allows all the heat pipes to be connected to the same heat dissipation tower body.

[0009] Furthermore, the heat pipe of the heat pipe type radiator can directly contact the heat source without passing through the base.

[0010] Furthermore, the two ends of the heat pipe derived from the base may be two ends of the same heat pipe, or respectively come from one end of different heat pipes.

[0011] Furthermore, the number of the heat dissipation tower bodies and the number of the heat pipes on both sides of the base may be the same or one side may be larger than the other side.

[0012] The heat tower body extending from the heat dissipation pipe does not limit its position.

[0013] The heat pipe is not limited to extending from both sides of the base, and can also be extended from the top and bottom directions of the base, and connected to at least one of the heat dissipation tower bodies by bending or extending.

[0014] In response to the shortcomings of the existing technology, the above technical solution proposes innovative designs such as flexible arrangement of heat pipes, asymmetric connection and cross-tower heat conduction, which not only solves the problems of limited heat dissipation area and uneven heat distribution, but also improves the adaptability and scalability of the structure, and can better meet the heat dissipation needs of high-power consumption equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the heat pipe radiator of the present invention, showing the connection relationship between the base, the heat pipe and multiple heat dissipation tower bodies.

[0016] Figure 2 It is a schematic diagram of the three-dimensional structure of the heat pipe type radiator of the present invention, showing the spatial layout of the heat pipe and multiple heat dissipation tower bodies and the design of the heat pipe bending connection.

[0017] Figure 3 It is a top-down structural diagram of the heat pipe radiator, which clearly shows the arrangement path of the heat pipes, especially the technical features of asymmetric distribution and cross-tower connection.

[0018] Figure 4It is a schematic diagram from the bottom perspective of the heat pipe radiator of the present invention, showing the connection relationship between the heat pipe and the base and the structure of the heat pipe being derived to different heat dissipation tower bodies through bending.

[0019] Figure 5 It is a partially enlarged schematic diagram of the heat pipe in the heat pipe type radiator of the present invention passing through the hollow structure of the heat dissipation tower body, highlighting the compatibility design feature of the heat pipe and the tower body.

[0020] Figure 6 It is an exploded schematic diagram of the heat pipe and the heat dissipation tower body in the heat pipe type radiator of the present invention in a disassembled state, showing the arrangement structure and path of the heat pipe when not connected to the heat dissipation tower body.

[0021] The markings of the components in the accompanying drawings are as follows:

[0022] Base 1, first heat dissipation tower body 2, second heat dissipation tower body 3, third heat dissipation tower body 4, heat pipe 5, heat pipe 6, heat pipe 7, heat pipe 8, heat pipe 9, heat pipe 10, heat pipe 11, heat pipe 12. DETAILED DESCRIPTION

[0023] The specific implementation of the present invention is described in detail below in conjunction with the accompanying drawings. The implementation is only an example of the present invention, used to further illustrate the technical solution, and is not intended to limit the present invention. Example

[0024] like Figure 1 As shown, a heat pipe type radiator includes a base 1, a heat dissipation tower body 2, a heat dissipation tower body 3, a heat dissipation tower body 4, a heat pipe 5, a heat pipe 6, a heat pipe 7, a heat pipe 8, a heat pipe 9, a heat pipe 10, a heat pipe 11, and a heat pipe 12, wherein the base 1 is in contact with a heating element for absorbing heat, and the heat is transferred to the heat dissipation tower body 2, the heat dissipation tower body 3, and the heat dissipation tower body 4 through the heat pipe 5, the heat pipe 6, the heat pipe 7, the heat pipe 8, the heat pipe 9, the heat pipe 10, the heat pipe 11, and the heat pipe 12 for heat dissipation.

[0025] like Figure 2-6As shown, the arrangement of the heat pipes is that one end of the heat pipe 5, heat pipe 6, heat pipe 8, heat pipe 11, and heat pipe 12 are connected to the heat dissipation tower body 2 on the corresponding side, and the other end is connected to the heat dissipation tower body 3. The two ends of the remaining heat pipes 7 and 10 are connected to at least one additional heat dissipation tower body 4 by bending or extending, and the two ends of the remaining heat pipe 9 are respectively connected to the heat dissipation tower body 2 and the heat dissipation tower body 4. The arrangement of the heat pipes allows the heat pipe 5 to be connected to the heat dissipation tower body 2 and the heat dissipation tower body 4. , when heat pipe 6, heat pipe 7, heat pipe 8, heat pipe 9, heat pipe 10, heat pipe 11, and heat pipe 12 are connected to the heat dissipation tower body 2, the heat dissipation tower body 3, and the heat dissipation tower body 4 on both sides, the number of heat pipes on both sides of the base 1 is asymmetrically distributed, and the two ends of heat pipe 7, heat pipe 9, and heat pipe 10 are not limited to connecting the heat dissipation tower body 2 and the heat dissipation tower body 3 closest to one side. The two ends of heat pipe 7 and heat pipe 10 are connected to the heat dissipation tower body 4, and the two ends of heat pipe 9 are respectively connected to the heat dissipation tower body 2 and the heat dissipation tower body 4. The arrangement of heat pipe 7, heat pipe 9, and heat pipe 10 allows it to cross the heat dissipation tower body 3 and connect to the heat dissipation tower body 4. The arrangement does not limit the number of the heat dissipation tower bodies and the connection of the heat pipes The number of heat pipes connected to each heat tower body is adjusted accordingly. This layout method realizes the flexible allocation of heat pipes. The number of heat pipes connected to each heat tower body can be selected according to actual conditions. The heat pipes derived from the heat pipes are no longer limited to the two sides of the base, but can reach any number and any position. The increase in the number of heat pipes also increases the heat dissipation area to achieve better heat exchange, meeting the heat dissipation needs of high power consumption, and solving the problem that the heat pipes on the current radiator are limited to connecting only the heat tower bodies on both sides, resulting in insufficient heat dissipation area, and the heat pipes are too concentrated on a single heat tower body, making it impossible to fully utilize the excellent thermal conductivity of the heat pipes, and unable to effectively reduce the temperature when facing high power consumption.

[0026] like Figure 4-5 As shown, the heat dissipation tower body 2 and the heat dissipation tower body 3 are provided with a hollow structure for allowing the heat pipe 7 , the heat pipe 9 , and the heat pipe 10 to pass through and be connected to at least one other heat dissipation tower body 4 .

[0027] like Figure 1 As shown, heat pipes 7, 9 and 10 are arranged at bending angles to contact multiple heat sources for heat conduction or to avoid components.

[0028] like Figure 3 As shown, the number of heat dissipation tower bodies and the number of heat pipes on both sides of the base 1 can be the same or one side can be larger than the other side.

[0029] like Figure 1-6 As shown, the heat tower body 4 from which the heat pipes 7, 9 and 10 extend does not limit their positions.

[0030] It should be noted that the above embodiments are only specific examples of the present invention and should not be regarded as limiting the scope of protection of the present invention. Within the technical framework of the present invention, those skilled in the art can adjust and deform the arrangement of the heat pipes, the number of heat dissipation towers, and the connection method according to actual needs. For example, the heat pipes can extend from the upper and lower directions of the base, or be connected at other angles. These equivalent variations should all be included in the scope of protection of the present invention.

Claims

1. A heat pipe radiator, comprising a base, a plurality of heat pipes and a plurality of heat dissipation tower bodies, characterized in that: The heat pipes are arranged in such a manner that one end of some of the heat pipes on one side of the base is connected to the heat dissipation tower body on the corresponding side, and the remaining heat pipes are connected to at least one additional heat dissipation tower body by bending or extending. The heat pipe arrangement allows the number of heat pipes on both sides of the base to be asymmetrically distributed when the heat pipes are connected to the heat dissipation tower bodies on both sides. The two ends of the heat pipes are not limited to connecting to the heat dissipation tower body closest to one side. The heat pipe arrangement allows crossing the heat dissipation tower body to connect to other heat dissipation tower bodies. The number of heat dissipation tower bodies and the number of heat pipes connected to the heat dissipation tower bodies can be any number.

2. The heat pipe radiator according to claim 1, characterized in that: The heat dissipation tower body is provided with a hollow structure for allowing the heat pipe to pass through and be connected to at least one other heat dissipation tower body.

3. The heat pipe radiator according to claim 1, characterized in that: The heat pipes are arranged at bending angles to contact multiple heat sources for heat conduction or to avoid components.

4. The heat pipe radiator according to claim 1, characterized in that: The arrangement of the heat pipe and the heat dissipation tower body is not limited to the vertical direction. The heat pipe and the heat dissipation tower body can be arranged at any angle. The heat pipe is connected to a plurality of heat dissipation tower bodies by bending or extending.

5. The heat pipe radiator according to claim 1, characterized in that: The heat pipe arrangement method allows all the heat pipes to be connected to the same heat dissipation tower body.

6. The heat pipe radiator according to claim 1, characterized in that: The heat pipe of the heat pipe type radiator can directly contact the heat source without passing through the base.

7. The heat pipe radiator according to claim 1, characterized in that: The two ends of the heat pipe derived from the base may be two ends of the same heat pipe, or respectively come from one end of different heat pipes.

8. The heat pipe radiator according to claim 1, characterized in that: The number of the heat dissipation tower bodies and the number of the heat pipes on both sides of the base may be the same or one side may be larger than the other side.

9. The heat pipe radiator according to claim 1, characterized in that: The heat tower body extending from the heat dissipation pipe does not limit its position.

10. The heat pipe radiator according to claim 1, characterized in that: The heat pipe is not limited to extending from both sides of the base, and can also be selected to extend entirely from the top and bottom directions of the base, and connected to at least one of the heat dissipation tower bodies by bending or extending.

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