Uniform temperature type liquid cooling plate heat dissipation device and liquid cooling circulation heat dissipation system

Abstract

The invention discloses a uniform temperature type liquid cooling plate heat dissipation device and a liquid cooling circulation heat dissipation system, and the device comprises a substrate, the upper surface of the substrate is provided with two groups of micro-channels, and a heat conduction channel is disposed between the micro-channels; the vapor chamber is arranged on the base plate, a cavity with a certain vacuum degree is formed in the vapor chamber, a working medium is arranged in the cavity, one part of the cavity protrudes outwards, a boss is formed on the lower surface of the vapor chamber, the boss is inserted into the heat conduction channel, the part, protruding outwards, of the cavity serves as an evaporation area, and the other part serves as a condensation area; a vertically-through liquid inflow channel is arranged on the uniform temperature plate, the lower end of the liquid inflow channel is communicated with the micro-channel, and the uniform temperature plate and the substrate are at least provided with a liquid backflow channel; and the cover plate is fixedly arranged on the base plate and located above the vapor chamber, and a liquid inlet and a liquid outlet are formed in the cover plate. According to the invention, the heat generated by the hot spot area of the heating element is quickly dissipated, so that the heat distribution is more uniform, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of liquid cooling and heat dissipation technology, and in particular to a temperature-averaging liquid cooling plate heat dissipation device and a liquid cooling circulation heat dissipation system. Background Art

[0002] In the field of modern electronic equipment and high-performance computing, with the continuous advancement of technology and the significant improvement of equipment performance, the demand for high-power, high-heat flux density and high-temperature uniformity heat dissipation has become particularly urgent. Whether it is a server in a data center, a high-performance graphics processor, or cutting-edge aerospace electronic equipment, these devices will generate extremely high heat during operation. If this heat cannot be effectively managed and dispersed, it will not only cause the equipment to overheat and reduce performance, but may also shorten the service life of the equipment and even cause serious safety issues.

[0003] In the related art, liquid cooling is generally used to dissipate heat from high-heat chips. Specifically, a heat dissipation structure such as a liquid cooling plate is arranged on the chip, and the chip exchanges heat with the circulating coolant in the liquid cooling plate. However, since there is a heat-generating area in the chip, and the heat in the heat-generating area is significantly greater than that in other areas, the heat is too concentrated in the liquid cooling plate and cannot be dissipated quickly. Summary of the invention

[0004] The main purpose of the present invention is to provide a temperature-averaging liquid cooling plate heat dissipation device and a liquid cooling circulation heat dissipation system to solve the problem that the liquid cooling heat dissipation device in the related art has heat concentration and cannot dissipate heat quickly.

[0005] In order to achieve the above object, the present invention provides a temperature-uniform liquid cooling plate heat dissipation device, comprising: A substrate, wherein at least two groups of microchannels are disposed on the upper surface of the substrate, a heat conduction channel is disposed between two adjacent groups of microchannels, and the heat conduction channel corresponds to a hot spot area of ​​the heating element; A temperature averaging plate, the temperature averaging plate is arranged on the substrate, a cavity with a certain vacuum degree is arranged in the temperature averaging plate, a working medium is arranged in the cavity, a part of the cavity protrudes outward and forms a boss on the lower surface of the temperature averaging plate, the boss is inserted into the heat conduction channel, the lower surface of the boss is in contact with the surface of the substrate, the part of the cavity protruding outward serves as an evaporation area, and the other part serves as a condensation area; The temperature averaging plate is provided with a liquid inflow channel which passes through from top to bottom, the lower end of the liquid inflow channel is connected with the microchannel, and at least one side of the temperature averaging plate and the substrate are provided with at least a liquid reflux channel; A cover plate is fixed on the substrate and located above the temperature equalizing plate. A liquid inlet and a liquid outlet are provided on the cover plate. The liquid inlet corresponds to the liquid inflow channel, and the liquid outlet corresponds to the liquid reflux channel.

[0006] Furthermore, the lower surface of the temperature equalizing plate corresponding to the condensation area is in contact with the upper end of the microchannel.

[0007] Furthermore, the lower surface of the boss is fixedly connected to the surface of the substrate.

[0008] Furthermore, the base plate includes a bottom plate and a first enclosure fixedly arranged around the bottom plate, the microchannel is arranged on the bottom plate, and the lower surface of the boss is welded and fixed to the bottom plate; At least one pair of sides of the first enclosure is provided with mounting grooves, and two sides of the temperature homogenizing plate are embedded in the corresponding mounting grooves; There is a distance between the other opposite side of the first enclosure and the temperature equalizing plate to form the liquid reflux channel; The lower end surface of the cover plate abuts against and is fixedly connected to the upper end surface of the first enclosure.

[0009] Furthermore, at least two liquid inflow channels are arranged on the temperature equalizing plate, and the two liquid inflow channels correspond to the two groups of microchannels above and below, respectively.

[0010] Furthermore, the length direction of the liquid inflow channel is perpendicular to the length direction of the microchannel and parallel to the length direction of the liquid reflux channel.

[0011] Furthermore, it also includes a second enclosure, which is located between the cover plate and the upper surface of the temperature equalizing plate. The second enclosure surrounds the liquid inlet channel, and a liquid distribution area is formed between the cover plate, the second enclosure and the temperature equalizing plate.

[0012] Furthermore, a turbulent structure is provided on the surface of the temperature uniformity plate located in the liquid distribution area.

[0013] Furthermore, the liquid inlet and the liquid outlet are both connected with joints.

[0014] According to another aspect of the present invention, a liquid cooling circulation heat dissipation system is provided, comprising the above-mentioned temperature-uniform liquid cooling plate heat dissipation device.

[0015] In the embodiment of the present invention, a substrate is provided, and at least two groups of microchannels are provided on the upper surface of the substrate, and a heat conduction channel is provided between two adjacent groups of microchannels, and the heat conduction channel corresponds to the hot spot area of ​​the heating element; a temperature averaging plate is provided on the substrate, and a cavity with a certain vacuum degree is provided in the temperature averaging plate, and a working medium is provided in the cavity, a part of the cavity protrudes outward and forms a boss on the lower surface of the temperature averaging plate, the boss is inserted into the heat conduction channel, and the lower surface of the boss is in contact with the surface of the substrate, the part of the cavity protruding outward serves as an evaporation area, and the other part serves as a condensation area; a liquid inlet channel is provided on the temperature averaging plate, and the lower end of the liquid inlet channel is connected with the microchannel, and at least one side of the temperature averaging plate and the substrate are provided with at least a liquid reflux channel; a cover plate is fixedly provided on the substrate and located above the temperature averaging plate, and a liquid inlet and a liquid outlet are provided on the cover plate, and the liquid inlet corresponds to the liquid inlet channel, and the liquid outlet corresponds to the liquid reflux channel.

[0016] Taking the heating element as a chip as an example, during the heat dissipation process, the heat generated in the hot spot area of ​​the heating element is directly transferred to the boss of the temperature equalizing plate through the substrate. Since the boss is a structure formed by the lower outward protrusion of the cavity, there is a large amount of working fluid in the boss. After the heat is transferred to the boss, the working fluid quickly absorbs the heat and vaporizes into steam and flows into the condensation area of ​​the cavity. After entering the condensation area, it contacts the inner wall of the cavity to release heat and condense into liquid. Through this process, the heat is dissipated to the surroundings. At the same time, the heat generated by the heating element is also transferred to the microchannel through the substrate, and the circulating coolant enters the microchannel through the liquid inflow channel, and flows out from the liquid reflux channel after heat exchange with the microchannel. The present invention achieves the technical effect of quickly dissipating the heat generated in the hot spot area of ​​the heating element, making the heat distribution more uniform and improving the heat dissipation efficiency, thereby solving the problem of heat concentration and inability to quickly dissipate heat in the liquid cooling device in the related art. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings constituting a part of the present invention are used to provide a further understanding of the present invention, so that other features, purposes and advantages of the present invention become more obvious. The accompanying drawings of the exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the accompanying drawings: Figure 1 is a perspective structural schematic diagram of a temperature-uniform liquid cooling plate heat dissipation device according to an embodiment of the present invention; Figure 2 is a schematic cross-sectional view of a temperature-averaging liquid cooling plate heat dissipation device according to an embodiment of the present invention; Figure 3 is another cross-sectional structural schematic diagram of the temperature-uniform liquid cooling plate heat dissipation device according to an embodiment of the present invention; Figure 4 is another cross-sectional structural schematic diagram of a temperature-uniform liquid cooling plate heat dissipation device according to an embodiment of the present invention; Figure 5 is a schematic diagram of the structure of a temperature equalizing plate according to an embodiment of the present invention; Figure 6 is a schematic structural diagram of a substrate and a microchannel according to an embodiment of the present invention; Figure 7 is a schematic diagram of a liquid cooling circulation heat dissipation system according to an embodiment of the present invention; Among them, 1 substrate, 100 heat conduction channel, 101 bottom plate, 102 first enclosure, 2 cover plate, 3 uniform temperature plate, 30 boss, 31 condensation zone, 32 liquid inlet channel, 33 evaporation zone, 34 cavity, 4 liquid inlet, 5 liquid outlet, 6 joint, 7 second enclosure, 70 liquid distribution zone, 8 microchannel, 9 liquid reflux channel, 10 liquid storage tank, 11 first ball valve, 12 filter, 13 pump, 14 flow meter, 15 second ball valve, 16 uniform temperature liquid cold plate heat dissipation device, 17 radiator. DETAILED DESCRIPTION

[0018] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0019] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged under appropriate circumstances to facilitate the embodiments of the present invention described herein.

[0020] In the present invention, the directions or positional relationships indicated by the terms "upper", "lower", "inner", etc. are based on the directions or positional relationships shown in the drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction.

[0021] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in the present invention can be understood according to specific circumstances.

[0022] In addition, the terms "disposed", "provided with", "connected", "fixed" and the like should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0023] In addition, the term "plurality" shall mean two or more.

[0024] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0025] To solve relevant technical problems, such as Figures 1 to 5 As shown, an embodiment of the present invention provides a temperature-uniform liquid cooling plate heat dissipation device, comprising: A substrate 1, wherein at least two groups of microchannels 8 are disposed on the upper surface of the substrate 1, and a heat conduction channel 100 is disposed between two adjacent groups of microchannels 8, and the heat conduction channel 100 corresponds to the hot spot area of ​​the heating element; The temperature averaging plate 3 is disposed on the substrate 1. A cavity 34 with a certain degree of vacuum is disposed in the temperature averaging plate 3. A working medium is disposed in the cavity 34. A portion of the cavity 34 protrudes outward and forms a boss 30 on the lower surface of the temperature averaging plate 3. The boss 30 is inserted into the heat conduction channel 100. The lower surface of the boss 30 is in contact with the surface of the substrate 1. The portion of the cavity 34 protruding outward serves as an evaporation zone 33, and the other portion serves as a condensation zone 31. The temperature balancing plate 3 is provided with a liquid inflow channel 32 which passes through from top to bottom. The lower end of the liquid inflow channel 32 is connected to the microchannel 8. At least one side of the temperature balancing plate 3 and the substrate 1 are provided with at least a liquid reflux channel 9. The cover plate 2 is fixed on the base plate 1 and is located above the temperature equalizing plate 3 . The cover plate 2 is provided with a liquid inlet 4 and a liquid outlet 5 . The liquid inlet 4 corresponds to the liquid inflow channel 32 , and the liquid outlet 5 corresponds to the liquid reflux channel 9 .

[0026] In this embodiment, the lower surface of the substrate 1 is a flat surface that can be attached to the surface of a heating element such as a chip. At least two groups of microchannels 8 are arranged on the upper surface of the substrate 1. The microchannels 8 are composed of a plurality of sheet materials with high thermal conductivity, such as a plurality of copper sheets arranged side by side at intervals, and channels for the flow of coolant are formed between adjacent copper sheets. Each group of microchannels 8 includes a plurality of elongated channels, thereby increasing the heat exchange area between the microchannels 8 and the coolant. In this embodiment, the microchannels 8 are arranged in at least two groups, and there is a certain distance between the two groups of microchannels 8 to form a heat conduction channel 100.

[0027] In one embodiment, if Figure 1 and Figure 6 As shown, two groups of microchannels 8 are arranged on the upper surface of the substrate 1, and the two groups of microchannels 8 are arranged symmetrically, and a heat conduction channel 100 is formed in the middle of the two groups of microchannels 8. It can be understood that the heat conduction channel 100 can also be arranged at other positions as long as it corresponds to the hot spot area of ​​the heating element. In addition, the number of heat conduction channels 100 is not limited, and can be arranged accordingly according to the number of hot spot areas of the heating element.

[0028] In this embodiment, the size of the microchannel 8 is small, and the flow velocity of the fluid in the flow channel is high, which helps to enhance the convective heat transfer capacity of the fluid. In addition, the structure of the microchannel 8 can increase the contact area of ​​the fluid, thereby improving the heat dissipation efficiency. In this embodiment, the form of the microchannel 8 includes but is not limited to a straight channel, a folded fin, a foam copper, etc.

[0029] The temperature plate 3 is used to evenly distribute the heat. Figure 5 As shown, a cavity 34 with a certain degree of vacuum is provided in the temperature homogenizing plate 3. A certain amount of working fluid is contained in the cavity 34, and the working fluid can be degassed pure water. The working fluid in the cavity 34 can be vaporized into steam after being heated. The vaporized steam can diffuse rapidly from the high pressure area (high temperature area) to the low pressure area (low temperature area) under the action of the pressure difference. During the diffusion process, the steam carries a large amount of heat energy, thereby realizing the rapid transfer of heat.

[0030] When steam is cooled, it can release heat and condense into liquid, dissipating the heat quickly in the process. Figures 1 to 3 As shown, in this embodiment, the heat of the heating element is first transferred to the substrate 1. Therefore, in order to quickly disperse the heat generated by the heating element, a part of the temperature equalizing plate 3 in this embodiment needs to directly contact the surface of the substrate 1. To this end, a part of the cavity 34 in this embodiment protrudes outward and forms a boss 30 on the lower surface of the temperature equalizing plate 3. Specifically, in this embodiment, the lower wall of the cavity 34 protrudes outward to form the boss 30, and the boss 30 can be in a square or trapezoidal shape. The lower surface of the boss 30 should be a plane so that it can better contact the upper surface of the substrate 1. The inner space of the boss 30, as a part of the cavity 34, is lower than the other parts of the cavity 34 in a horizontal position. The condensed working fluid in the cavity 34 can naturally gather in the inner space of the boss 30.

[0031] After installation, the boss 30 of the temperature homogenizing plate 3 is inserted into the heat conduction channel 100 between the two groups of microchannels 8, and the lower surface of the boss 30 is in contact with the upper surface of the substrate 1. Since the position of the heat conduction channel 100 is set according to the hot spot area on the heating element, the heat generated in the hot spot area is directly transferred to the boss 30 after passing through the substrate 1. The area corresponding to the boss 30 in the cavity 34 is used as the evaporation area 33, and the other areas are used as the condensation area 31. Liquid working fluid is collected in the evaporation area 33, so the heat of the boss 30 can be directly transferred to the working fluid. After absorbing heat in the evaporation area 33 (high pressure area), the working fluid quickly vaporizes into steam, and diffuses to the condensation area 31 (low pressure area) in the cavity 34, and releases heat and condenses into liquid after contacting the inner walls on both sides of the cavity 34. This condensation process releases the heat accumulated during the previous evaporation, thereby achieving effective heat dissipation. The condensed liquid medium flows back to the evaporation area 33 along the microstructure under the capillary action of the capillary wick, reabsorbs heat and vaporizes into steam again. This process is repeated over and over again, forming a continuous heat conduction cycle. During this process, the heat generated in the hot spot area of ​​the heating element is quickly dispersed, which can prevent the heat from being concentrated in a certain area.

[0032] In this embodiment, the substrate 1 and the microchannel 8 are used as a liquid cooling heat dissipation structure, and heat dissipation needs to be achieved through liquid circulation. For this reason, in this embodiment, a liquid inflow channel 32 is opened on the temperature equalizing plate 3, and the liquid inflow channel 32 corresponds to the microchannel 8 up and down. In order to form a reflux channel, at least one side of the temperature equalizing plate 3 is spaced from the substrate 1 to form a liquid reflux channel 9. In other words, in this embodiment, the external liquid enters the microchannel 8 through the liquid inflow channel 32 on the temperature equalizing plate 3, and flows out through the liquid reflux channel 9 after flowing through the microchannel 8 and exchanging heat with the microchannel 8.

[0033] To achieve the circulation of the entire liquid, Figure 1 and Figure 2 As shown, in this embodiment, a cover plate 2 is also provided, and the cover plate 2 is covered on the temperature equalizing plate 3 and fixedly connected to the substrate 1. A closed chamber is formed by the cover plate 2, one of which is used for liquid inflow and the other is used for liquid reflux. The chamber for liquid inflow corresponds to the liquid inflow channel 32, and the chamber for liquid reflux corresponds to the liquid reflux channel 9. A liquid inlet 4 and a liquid outlet 5 are provided on the cover plate 2, and the liquid inlet 4 corresponds to the liquid inflow channel 32, and the liquid outlet 5 corresponds to the liquid reflux channel 9. The liquid inlet 4 and the liquid outlet 5 can be connected to pipelines respectively to realize liquid circulation.

[0034] It can be seen that during the heat dissipation process, the heat generated by the hot spot area of ​​the heating element is directly transferred to the boss 30 of the temperature equalizing plate 3 through the substrate 1. Since the boss 30 is a structure formed by the lower outward protrusion of the cavity 34, there is a large amount of liquid working medium in the boss 30. After the heat is transferred to the boss 30, the working medium quickly absorbs the heat and vaporizes into steam and flows into the condensation area 31 of the cavity 34. After entering the condensation area 31, it contacts the inner wall of the cavity 34 to release heat and condense into liquid. Through this process, the heat is dissipated to the surroundings. At the same time, the heat generated by the heating element is also transferred to the microchannel 8 through the substrate 1, and the circulating coolant enters the microchannel 8 through the liquid inflow channel 32, and flows out from the liquid reflux channel 9 after heat exchange with the microchannel 8. The present invention realizes the technical effect of quickly dissipating the heat generated by the hot spot area of ​​the heating element, making the heat distribution more uniform, and improving the heat dissipation efficiency, thereby solving the problem of heat concentration and inability to quickly dissipate heat in the liquid cooling device in the related art.

[0035] In the present invention, the substrate 1 and the microchannel 8 form a liquid cooling plate, in which the temperature equalizing plate 3 is embedded, and the temperature equalizing plate 3 also includes liquid cooling, which significantly improves the heat conduction efficiency of the entire system, reduces the energy consumption of the system, and ensures the stability and reliability of the equipment operation. In addition, the liquid cooling plate in the present invention makes full use of the microchannel 8 for efficient heat exchange, which can not only effectively dissipate the heat of hot spots with high heat flux density and improve the overall temperature uniformity of the surface of the heating component, but also provide necessary support and reinforcement for the microchannel 8. At the same time, during the heat dissipation process, the cooling medium does not directly contact the heating element, which has higher safety, low requirements for material compatibility, and strong customizability. It can be relatively easily compatible with computing devices of different manufacturers and models, and adapt to different application scenarios.

[0036] Since the circulation process of the working medium in the temperature equalizing plate 3 is that the liquid working medium absorbs heat and vaporizes into gaseous working medium in the evaporation zone 33, and the gaseous working medium condenses into liquid working medium in the condensation zone 31 and flows back to the evaporation zone 33. Therefore, in order to improve the temperature equalization effect, it is necessary to increase the temperature difference between the evaporation zone 33 and the condensation zone 31, so that the steam can quickly condense and release heat in the condensation zone 31 with a lower temperature.

[0037] For this reason, Figure 2 and Figure 3 As shown, in this embodiment, the lower surface of the temperature equalizer 3 corresponding to the condensation area 31 is attached to the upper end of the microchannel 8. In other words, the lower surface of the temperature equalizer 3 on both sides of the boss 30 in this embodiment is attached to the upper end of the microchannel 8. This part is the area corresponding to the condensation area 31, and cooling it can reduce the temperature of the condensation area 31. For this reason, during the liquid cooling process, the liquid in the microchannel 8 circulates, so while the microchannel 8 is used to dissipate heat from the heating element, it also dissipates heat from the condensation area 31 of the temperature equalizer 3, thereby increasing the temperature difference between the condensation area 31 and the evaporation area 33, and improving the condensation effect.

[0038] Since the external liquid circulates in the microchannel 8, the lower surface of the substrate 1 is easily protruded during the circulation process, especially the heat conduction channel 100 portion of the substrate 1. For this reason, in this embodiment, the lower surface of the boss 30 is fixedly connected to the surface of the substrate 1. In a specific embodiment, the lower surface of the boss 30 and the surface of the substrate 1 can be welded and fixed, and the structural strength of the substrate 1 can be increased after the boss 30 is connected to the substrate 1, and local deformation of the substrate 1 can be effectively prevented.

[0039] In one embodiment of the substrate 1, Figures 2 to 4 As shown, the substrate 1 includes a bottom plate 101 and a first enclosure 102 fixedly arranged around the bottom plate 101, the microchannel 8 is arranged on the bottom plate 101, and the lower surface of the boss 30 is welded and fixed to the bottom plate 101; At least one pair of sides of the first enclosure 102 is provided with mounting grooves, and two sides of the temperature homogenizing plate 3 are embedded in the corresponding mounting grooves; There is a distance between the other opposite side of the first enclosure 102 and the temperature equalizing plate 3 to form a liquid reflux channel 9; The lower end surface of the cover plate 2 abuts against and is fixedly connected to the upper end surface of the first enclosure 102 .

[0040] Specifically, in this embodiment, a certain liquid flow space is formed in the substrate 1 by the arrangement of the first enclosure 102, so that the external liquid can fully contact and heat exchange with the microchannel 8 after entering. At the same time, the first enclosure 102 is also convenient for installing the temperature plate 3. In this embodiment, two step surfaces are arranged on the first enclosure 102, one of which is formed by opening a mounting groove, and the other step surface is the upper end surface of the first enclosure 102, which is used to abut against and connect the lower end surface of the cover plate 2. The cover plate 2 and the upper end surface of the first enclosure 102 can be fixed by welding or by screws.

[0041] In this embodiment, the installation groove is only provided on one of the opposite sides of the first enclosure 102, and the distance between the other opposite sides is greater than the length of the temperature averaging plate 3 in this direction, so that after the temperature averaging plate 3 is installed, there is a distance between the first enclosure 102 and the temperature averaging plate 3 to form a liquid reflux channel 9. In other words, in this embodiment, two liquid reflux channels 9 are provided and located on both sides of the temperature averaging plate 3.

[0042] Since the microchannels 8 are arranged in two groups in the present invention, in order to facilitate external liquid to enter the microchannels 8 through the liquid inflow channel 32 on the temperature equalizing plate 3, in this embodiment, at least two liquid inflow channels 32 are arranged on the temperature equalizing plate 3, and the two liquid inflow channels 32 correspond to the two groups of microchannels 8 above and below, respectively.

[0043] Specifically, in this embodiment, the external liquid flows into the microchannel 8 from top to bottom. Compared with the method of directly flowing the external liquid into and out of the end of the microchannel 8, the temperature difference of the liquid flowing into each microchannel 8 is small, so that the heat dissipation effect is significantly increased. In addition, due to the resistance of the microchannel 8, when the liquid flows in and out of the end of the microchannel 8, the resistance is large, and a greater power needs to be applied to the liquid by the pump 13. In this embodiment, the liquid flows into each microchannel 8 from the upper part of the microchannel 8 at the same time, and the power demand for the liquid is lower.

[0044] In one embodiment, to further facilitate the circulation of liquid in the microchannel 8 , the liquid inlet channel 32 is a long strip opening, and the length direction of the liquid inlet channel 32 is perpendicular to the length direction of the microchannel 8 and parallel to the length direction of the liquid reflux channel 9 .

[0045] Specifically, in this embodiment, two groups of microchannels 8 are taken as an example, and the two liquid inflow channels 32 correspond to the two groups of microchannels 8. Since the liquid inflow channels 32 are perpendicular to the length direction of the microchannels 8, the same liquid inflow channel 32 can simultaneously cover multiple channels in the group of microchannels 8, and can even cover all channels in the group of microchannels 8, so that the liquid in the liquid inflow channel 32 can flow into all channels at the same time, and can be divided into two paths to flow to both sides along the length direction of the microchannel 8, and flow out from the liquid reflux channels 9 at both ends after heat exchange.

[0046] It can be seen that in this embodiment, the flow path of each liquid is relatively short and can be set to about half the length of the channel. When the flow path of the liquid is relatively short, the low-temperature liquid can quickly exchange heat with the channel to improve the heat dissipation efficiency. In addition, since each liquid will not flow through other channels again, the heat dissipation of each channel is more uniform.

[0047] In addition, in this embodiment, the liquid inflow channel 32 is located in the middle of the temperature equalizing plate 3, which can guide the liquid to enter the flow channel smoothly to avoid vortexes and turbulence. The liquid return channels 9 located on both sides of the temperature equalizing plate 3 can ensure that the liquid can flow out of the flow channel smoothly while maintaining the pressure balance in the flow channel.

[0048] Two closed chambers are formed by the cover plate 2, one of which is used for liquid inflow and the other is used for liquid backflow. Figures 1 to 3 As shown, this embodiment also includes a second enclosure 7, which is located between the cover plate 2 and the upper surface of the temperature equalizing plate 3. The second enclosure 7 surrounds the liquid inlet channel 32, and a liquid distribution area 70 is formed between the cover plate 2, the second enclosure 7 and the temperature equalizing plate 3.

[0049] Specifically, in this embodiment, the liquid distribution area 70 is one of the closed chambers, which is only used for liquid inflow. The other chamber is a chamber located outside the liquid distribution area 70, which is used for liquid reflux. The second enclosure 7 is a frame-type structure, and the second enclosure 7 can be used as a part of the cover plate 2 or as a part of the temperature plate 3, or as an independent component to be pressed and fixed on the temperature plate 3 by the cover plate 2. For ease of installation, in this embodiment, it is preferred that the second enclosure 7 is a part of the cover plate 2 or a part of the temperature plate 3.

[0050] In addition, a turbulent structure is provided on the surface of the temperature homogenizing plate 3 in the liquid distribution area 70 to enhance the convective heat exchange effect with the liquid. The turbulent structure can be a cylinder, a fin, a foam copper, etc. To facilitate the connection of pipelines, the liquid inlet 4 and the liquid outlet 5 are both connected with a joint 6.

[0051] According to another aspect of the present invention, Figure 7 As shown, a liquid cooling circulation heat dissipation system is provided, including the above-mentioned uniform temperature liquid cooling plate heat dissipation device 16.

[0052] In this embodiment, the liquid cooling circulation heat dissipation system includes a liquid storage tank 10, a first ball valve 11, a filter 12, a pump 13, a flow meter 14, a second ball valve 15, a temperature-averaging liquid cold plate heat dissipation device 16, and a radiator 17, which are sequentially connected to form a loop. During the heat dissipation process, the pump 13 pushes the cooling liquid (usually water or a special non-conductive liquid) through a closed pipe network, and the pipe network connects a plurality of temperature-averaging liquid cold plate heat dissipation devices 16.

[0053] Heat exchange: The temperature-averaging liquid cold plate heat sink 16 is installed on key heat-generating components, such as CPU, GPU, etc. When the liquid flows through the liquid cold plate of the temperature-averaging liquid cold plate heat sink 16, it absorbs the heat transferred from the heat-generating element to the microchannel 8, so that the temperature of the liquid rises. In this process, the process of evaporation-condensation-evaporation of the working fluid is continuously and cyclically carried out in the temperature-averaging plate 3, so as to diffuse the heat of the heat-generating element.

[0054] Heat dissipation: The liquid that has absorbed heat is then sent to one or more radiators 17 to exchange heat with ambient air or other cooling media to release the absorbed heat. This process is usually assisted by a fan to increase air circulation and improve heat dissipation efficiency.

[0055] Coolant recirculation: The temperature of the liquid after heat dissipation is lowered, and then it is pumped back to the liquid cooling plate by the pump 13 again, starting a new cycle and continuously removing heat.

[0056] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Within the spirit and principle of the present invention, any modification, equivalent replacement, improvement, etc. made shall be included in the protection scope of the present invention.

Claims

1. A temperature-uniform liquid cooling plate heat dissipation device, characterized in that: include: A substrate, wherein at least two groups of microchannels are disposed on the upper surface of the substrate, and a heat conduction channel is provided between two adjacent groups of microchannels, and the heat conduction channel corresponds to the hot spot area of ​​the heating element; A temperature averaging plate, the temperature averaging plate is arranged on the substrate, a cavity with a certain vacuum degree is arranged in the temperature averaging plate, a working medium is arranged in the cavity, a part of the cavity protrudes outward and forms a boss on the lower surface of the temperature averaging plate, the boss is inserted into the heat conduction channel, the lower surface of the boss is in contact with the surface of the substrate, the part of the cavity protruding outward serves as an evaporation area, and the other part serves as a condensation area; The temperature averaging plate is provided with a liquid inflow channel which passes through from top to bottom, the lower end of the liquid inflow channel is connected with the microchannel, and at least one side of the temperature averaging plate and the substrate are provided with at least a liquid reflux channel; A cover plate is fixed on the base plate and is located above the temperature equalizing plate. A liquid inlet and a liquid outlet are provided on the cover plate. The liquid inlet corresponds to the liquid inflow channel, and the liquid outlet corresponds to the liquid reflux channel.

2. The temperature-uniform liquid cooling plate heat dissipation device according to claim 1, characterized in that: The lower surface of the temperature equalizing plate corresponding to the condensation area is in contact with the upper end of the microchannel.

3. The temperature-uniform liquid cooling plate heat dissipation device according to claim 1, characterized in that: The lower surface of the boss is fixedly connected to the surface of the substrate.

4. The temperature-uniform liquid cooling plate heat dissipation device according to claim 3, characterized in that: The base plate comprises a bottom plate and a first enclosure fixedly arranged around the bottom plate, the microchannel is arranged on the bottom plate, and the lower surface of the boss is welded and fixed to the bottom plate; At least one pair of sides of the first enclosure is provided with mounting grooves, and two sides of the temperature homogenizing plate are embedded in the corresponding mounting grooves; There is a distance between the other opposite side of the first enclosure and the temperature equalizing plate to form the liquid reflux channel; The lower end surface of the cover plate abuts against and is fixedly connected to the upper end surface of the first enclosure.

5. The temperature-uniform liquid cooling plate heat dissipation device according to claim 4, characterized in that: At least two liquid inflow channels are arranged on the temperature equalizing plate, and the two liquid inflow channels correspond to the two groups of microchannels up and down, respectively.

6. The temperature-uniform liquid cooling plate heat dissipation device according to claim 5, characterized in that: The length direction of the liquid inflow channel is perpendicular to the length direction of the microchannel and parallel to the length direction of the liquid reflux channel.

7. The temperature-uniform liquid cooling plate heat dissipation device according to claim 1, characterized in that: It also includes a second enclosure, which is located between the cover plate and the upper surface of the temperature-averaging plate. The second enclosure surrounds the liquid inlet channel, and a liquid distribution area is formed between the cover plate, the second enclosure and the temperature-averaging plate.

8. The temperature-uniform liquid cooling plate heat dissipation device according to claim 7, characterized in that: A turbulent structure is arranged on the surface of the temperature equalizing plate located in the liquid distribution area.

9. The temperature-uniform liquid cooling plate heat dissipation device according to claim 8, characterized in that: The liquid inlet and the liquid outlet are both connected with joints.

10. A liquid cooling circulation heat dissipation system, characterized in that: It comprises the temperature-uniform liquid cooling plate heat dissipation device as described in any one of claims 1 to 9.

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