Packaging structure and packaging method of fan-out sensor

Abstract

The invention discloses a packaging structure and a packaging method of a fan-out sensor, relates to the technical field of sensor packaging, and solves the technical problems that a structure manufactured by an existing sensor packaging method is relatively large in size, relatively long in interconnection path and poor in sensor performance. The structure comprises a sensor chip, insulation sealing resin, a metal electrode, glass and a metal solder ball, a first surface of the sensor chip comprises an electrical bonding pad area and an induction area, the glass is matched with the induction area, and the lower surface of the glass is adhered to the induction area; the first end of the metal electrode is electrically connected with the electrical pad area, and the second end of the metal electrode is electrically connected with the metal solder ball; the sensor chip and the metal electrode are coated with the insulation sealing resin, and the upper surface of the insulation sealing resin is flush with the upper surface of the glass. The packaging of the sensor chip and the cooperation of the metal electrodes and the metal solder balls are completed by using the insulating sealing resin and the metal electrodes, so that the path of a packaging circuit is shortened, the response speed of the sensor is improved, and the packaging volume is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of sensor packaging, and in particular to a packaging structure and a packaging method of a fan-out sensor. Background Art

[0002] With the advancement of technology, sensors are attracting more and more attention. Existing electronic products are developing towards thinner, smaller and lighter, and the packaging technology of single sensor chips has gradually failed to meet the needs of the industry.

[0003] Existing sensor packaging usually involves mounting the sensor chip on a PCB substrate and packaging the sensor chip using welding wires and sealing glue. This packaging method has a long packaging circuit, which can easily lead to a large packaging structure, affecting the response speed and heat dissipation of the sensor. In addition, the packaging process is relatively complex, which can easily increase costs.

[0004] In the process of implementing the present invention, the inventors found that there are at least the following problems in the prior art: The structures produced by existing sensor packaging methods are large in size and have long interconnection paths, resulting in poor sensor performance. Summary of the invention

[0005] The purpose of the present invention is to provide a packaging structure and packaging method of a fan-out sensor to solve the technical problem in the prior art that the structure size obtained by the existing sensor packaging method is large and the interconnection path is long, resulting in poor sensor performance.

[0006] The various technical effects that can be produced by the preferred technical solutions among the various technical solutions provided by the present invention are described in detail below.

[0007] To achieve the above object, the present invention provides the following technical solutions: In a first aspect, the present invention provides a packaging method for a fan-out sensor, comprising: Adhere the first surfaces of the plurality of sensor chips to the first carrier, and use an insulating sealing resin to perform a first plastic packaging on the plurality of sensor chips on the first carrier to obtain a packaged sensor chip group, wherein the first surface of each of the sensor chips includes an electrical pad area and a sensing area, and there is a spacing between two adjacent sensor chips; The first carrier board on the packaged sensor chipset is removed to expose the electrical pad area and the sensing area on the first surface of the packaged sensor chipset, and then the second surface of the packaged sensor chipset is adhered to a second carrier board; Each metal electrode penetrates the first surface and the second surface of the packaged sensor chipset and is welded to the corresponding electrical pad area, and a glass is adhered to each sensing area, and the insulating sealing resin is used again to perform a second packaging coating on the first surface of the packaged sensor chipset to obtain a coated sensor chipset; The second carrier board on the coated sensor chipset is removed to expose the metal electrodes on the second surface of the coated sensor chipset, and a metal solder ball is welded on each of the metal electrodes. The coated sensor chipset welded with the metal solder balls is then cut to obtain a packaging structure of multiple fan-out sensors.

[0008] Optionally, the step of adhering the first surfaces of the plurality of sensor chips to a first carrier board, and performing a first plastic packaging on the plurality of sensor chips on the first carrier board using an insulating sealing resin to obtain a packaged sensor chipset includes: Coating a temporary bonding adhesive on the first carrier to form a first temporary bonding layer; Adhere the first surfaces of the plurality of sensor chips to the first temporary bonding layer; The plurality of sensor chips on the first carrier board are firstly plastic-sealed using the insulating sealing resin to obtain a packaged sensor chip group.

[0009] Optionally, removing the first carrier board on the packaged sensor chipset to expose the electrical pad area and the sensing area on the first surface of the packaged sensor chipset, and then adhering the second surface of the packaged sensor chipset to a second carrier board comprises: Removing the first carrier board and the first temporary bonding layer on the packaged sensor chipset to expose the electrical pad area and the sensing area on the first surface of the packaged sensor chipset; The first surface of the packaged sensor chipset is facing upward, and the second surface of the packaged sensor chipset is adhered to the second temporary bonding layer of the second carrier board.

[0010] Optionally, each of the metal electrodes penetrates the first surface and the second surface of the packaged sensor chipset and is welded to the corresponding electrical pad area, and a glass is adhered to each of the sensing areas, and the insulating sealing resin is used again to perform a second packaging coating on the first surface of the packaged sensor chipset to obtain the coated sensor chipset, including: Making a plurality of metal electrodes penetrating the first surface and the second surface of the packaged sensor chipset, and welding the first end of each of the metal electrodes to the corresponding electrical pad area; Adhere one of the glasses to the sensing area of ​​each of the sensor chips; The insulating sealing resin is used to perform a second packaging coating on the side surface of each of the glass and the first surface of the packaged sensor chipset to obtain the packaged sensor chipset, wherein the first surface of the packaged sensor chipset is flush with the upper surface of the glass.

[0011] Optionally, the step of manufacturing a plurality of metal electrodes penetrating the first surface and the second surface of the packaged sensor chipset, and electrically connecting the first ends of the metal electrodes to the corresponding electrical pad areas, comprises: Forming plastic sealing through holes on the insulating sealing resin on both sides of each sensor chip by mechanical or laser means; At least one metal material selected from the group consisting of gold, silver, copper, tungsten and titanium is filled into the plastic package through hole by electroplating, sputtering or deposition, and the first end of the metal electrode is electrically connected to the corresponding electrical pad area.

[0012] Optionally, the second carrier board on the coated sensor chipset is removed, a metal solder ball is welded on each of the exposed metal electrodes, and the coated sensor chipset is cut to obtain a packaging structure of multiple fan-out sensors, including: Removing the second carrier board and the second temporary bonding layer on the coated sensor chipset to expose the second end of the metal electrode; Welding one of the metal solder balls onto the second end of each of the metal electrodes; The coated sensor chipset welded with the metal solder balls is cut to obtain a packaging structure of multiple fan-out sensors.

[0013] In a second aspect, the present invention further provides a packaging structure of a fan-out sensor, which is manufactured by the packaging method of the fan-out sensor described in the first aspect, and comprises: a sensor chip, an insulating sealing resin, a metal electrode, glass and a metal solder ball. The first surface of the sensor chip includes an electrical pad area and a sensing area, the glass matches the sensing area, and the lower surface of the glass adheres to the sensing area; The first end of the metal electrode is electrically connected to the electrical pad area, and the second end of the metal electrode is electrically connected to the metal solder ball; The insulating sealing resin covers the sensor chip and the metal electrode, and the upper surface of the insulating sealing resin is flush with the upper surface of the glass.

[0014] Optionally, the material of the metal electrode includes at least one of gold, silver, copper, platinum, tungsten and titanium, and the material of the metal solder ball includes at least one of gold, silver, copper, tungsten and tin.

[0015] Optionally, the glass is transparent glass or non-transparent glass, and the lower surface of the glass is adhered to the sensing area by an adhesive film or epoxy resin adhesive.

[0016] Optionally, the insulating sealing resin is made of epoxy resin or plastic dry film.

[0017] Implementing one of the above technical solutions of the present invention has the following advantages or beneficial effects: The packaging structure and packaging method of a fan-out sensor of the present invention completes the packaging of the sensor chip by using insulating sealing resin and metal electrodes. The cooperation between the metal electrodes and the metal solder balls can shorten the path of the packaging circuit and improve the response speed of the sensor. Compared with the packaging method using substrate welding wires or through silicon vias, the packaging method of the present invention reduces the manufacturing cost and the complexity of the process flow, reduces the packaging volume, and improves production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. It is obvious that the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work. In the drawings: Figure 1 is a flow chart of Embodiment 1 of the present invention; Figure 2 is a schematic diagram of forming a first temporary bonding layer on a first carrier according to a first embodiment of the present invention; Figure 3 is a schematic diagram of adhering the sensor chip to the first carrier board according to the first embodiment of the present invention; Figure 4 is a schematic diagram of the first plastic packaging of the first embodiment of the present invention; Figure 5 is a schematic diagram of adhering the packaged sensor chipset to the second carrier board according to the first embodiment of the present invention; Figure 6 is a schematic diagram of welding the metal electrode and the electrical pad area according to the first embodiment of the present invention; Figure 7 is a schematic diagram of glass attached to the sensing area of ​​the first embodiment of the present invention; Figure 8 is a schematic diagram of the second packaging and coating of the first embodiment of the present invention; Fig. 9 is a schematic diagram of connecting metal solder balls to the sensor chipset after encapsulation according to the first embodiment of the present invention; Fig.10 is a schematic diagram of a sensor chipset after cutting and welding a metal solder ball package according to the first embodiment of the present invention; Fig.11 It is a structural diagram of embodiment 2 of the present invention.

[0019] In the figure: 100, first carrier; 101, first temporary bonding layer; 200, second carrier; 201, second temporary bonding layer; 2, sensor chip; 21, electrical pad area; 22, sensing area; 3, insulating sealing resin; 4, metal electrode; 5, glass; 6, metal solder ball. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solutions and advantages of the present invention clearer, the various exemplary embodiments to be described below will refer to the corresponding drawings, which constitute a part of the exemplary embodiments, wherein various exemplary embodiments that may be used to implement the present invention are described. Unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation methods described in the following exemplary embodiments do not represent all implementation methods consistent with the present disclosure. It should be understood that they are only examples of processes, methods, devices, etc. that are consistent with some aspects of the present disclosure as detailed in the attached claims, and other embodiments may also be used, or the embodiments listed herein may be modified in structure and function without departing from the scope and essence of the present invention.

[0021] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", etc. indicate the orientation or positional relationship based on the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the elements referred to must have a specific orientation, be constructed and operated in a specific orientation. The terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. The term "multiple" means two or more. The terms "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, an integral connection, a mechanical connection, an electrical connection, a communication connection, a direct connection, an indirect connection through an intermediate medium, and can be the internal connection of two elements or the interaction relationship between two elements. The term "and / or" includes any and all combinations of one or more related listed items. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0022] In order to illustrate the technical solution of the present invention, a specific embodiment is used below for description, and only the parts related to the embodiment of the present invention are shown.

[0023] Embodiment 1: like Figure 1 As shown, an embodiment of the present invention provides a packaging method for a fan-out sensor, including steps S10 to S40. Before executing the packaging method for the fan-out sensor, a first carrier board, a second carrier board, a sensor chip and a temporary bonding adhesive are prepared for use.

[0024] S10, adhering the first surfaces of the plurality of sensor chips to the first carrier, and using an insulating sealing resin to perform a first plastic packaging on the plurality of sensor chips on the first carrier to obtain a packaged sensor chip group, wherein the first surface of each sensor chip includes an electrical pad area and a sensing area, and there is a spacing between two adjacent sensor chips.

[0025] In some embodiments, step S10 may include: like Figure 2 As shown, a temporary bonding adhesive is coated on the first carrier 100 to form a first temporary bonding layer 101, so as to facilitate the sensor chip 2 to adhere to the first carrier 100. The method of coating the temporary bonding adhesive can be selected as a spin coating or a printing method. Preferably, the first temporary bonding layer 101 includes a light-to-heat conversion layer.

[0026] like Figure 3 As shown, the first surfaces of the multiple sensor chips 2 are adhered to the first temporary bonding layer 101, that is, the first surfaces of the multiple sensor chips 2 are adhered to the first temporary bonding layer 101, and the first surface of each sensor chip 2 includes an electrical pad area 21 and a sensing area 22. The first surface of the sensor chip 2 is adhered to the first temporary bonding layer 101, and the first carrier 100 can support the sensor chip 2 when encapsulating the sensor chip 2, and can protect the electrical pad area 21 and the sensing area 22 from being encapsulated during the first plastic encapsulation. Furthermore, the multiple sensor chips 2 pasted on the first carrier 100 have a spacing between two adjacent sensor chips 2, which is convenient for the subsequent installation of each metal electrode 4 and the subsequent cutting. The spacing between two adjacent sensor chips 2 can be adaptively set according to the actual situation and the size requirements required by the packaging structure.

[0027] like Figure 4As shown, the multiple sensor chips 2 on the first carrier board 100 are firstly sealed and packaged using the insulating sealing resin 3 to obtain the packaged sensor chip group. The insulating sealing resin 3 can be selected from epoxy resin molding compound or dry film, etc. If epoxy resin molding compound is used, the sensor chips 2 can be sealed by transfer molding or compression molding; if dry film is used, the sensor chips 2 can be sealed by vacuum pressing process.

[0028] S20, removing the first carrier board on the packaged sensor chipset to expose the electrical pad area and the sensing area on the first surface of the packaged sensor chipset, and then adhering the second surface of the packaged sensor chipset to the second carrier board.

[0029] In some embodiments, such as Figure 5 As shown, step S20 may include: The first carrier 100 and the first temporary bonding layer 101 on the packaged sensor chipset are removed to expose the electrical pad area 21 and the sensing area 22 on the first surface of the packaged sensor chipset, and then the first surface of the packaged sensor chipset is facing upward, and the second surface of the packaged sensor chipset is adhered to the second temporary bonding layer 201 of the second carrier 200. The first carrier 100 and the first temporary bonding layer 101 on the first surface of the packaged sensor chipset are removed to facilitate electrical connection of the electrical pad area 21 and installation of glass on the sensing area 22. The second carrier 200 is adhered to the second surface of the packaged sensor chipset to facilitate support and fixation when the packaged sensor chipset is packaged for the second time after the electrical connection of the electrical pad area 21 is completed and the electrical connection of the electrical pad area 21 and the installation of glass on the sensing area 22 are completed. In addition, this step may also be that after removing the first carrier 100 from the packaged sensor chipset, the first carrier 100 is adhered to the second surface of the packaged sensor chipset by temporary bonding glue, so that the first surface of the packaged sensor chipset faces upward, exposing the electrical pad area 21 and the sensing area 22 of each sensor chip 2.

[0030] S30, each metal electrode penetrates the first surface and the second surface of the packaged sensor chipset and is welded to the corresponding electrical pad area. At the same time, a glass is adhered to each sensing area, and the first surface of the packaged sensor chipset is packaged and coated for the second time using an insulating sealing resin to obtain a coated sensor chipset.

[0031] In some embodiments, step S30 may include: like Figure 6As shown, a plurality of metal electrodes 4 are made to penetrate the first surface and the second surface of the packaged sensor chip group, and the first end of each metal electrode 4 is welded to the corresponding electrical pad area 21. Through molding via (TMV) is formed on the insulating sealing resin 3 on both sides of each sensor chip 2 by mechanical or laser means, and the through molding via penetrates the first surface and the second surface of the insulating sealing resin 3, and then at least one metal material selected from gold, silver, copper, tungsten and titanium is filled into the through molding via by electroplating, sputtering or deposition to form a plurality of metal electrodes 4 penetrating the first surface and the second surface of the packaged sensor chip group, and finally the first end of the metal electrode 4 is welded to the corresponding electrical pad area 21.

[0032] like Figure 7 As shown, a glass 5 is adhered to the sensing area 22 of each sensor chip 2 , and when the glass 5 is adhered, the lower surface of the glass 5 is adhered to the sensing area 22 .

[0033] like Figure 8 As shown, the insulating sealing resin 3 is used to perform a second encapsulation coating on the side surface of each glass 5 and the first surface of the packaged sensor chip group to obtain the packaged sensor chip group, wherein the first surface of the packaged sensor chip group is flush with the upper surface of the glass 5. The second encapsulation coating of the packaged sensor chip group can protect the connection between the sensor chip 2 and the metal electrode 4, and at the same time increase the stability of the fixation of the glass 5.

[0034] S40, removing the second carrier board on the coated sensor chipset to expose the metal electrodes on the second surface of the coated sensor chipset, welding metal solder balls on each metal electrode, and then cutting the coated sensor chipset with the metal solder balls to obtain a packaging structure of multiple fan-out sensors.

[0035] In some embodiments, step S40 may include: like Fig. 9 As shown, the second carrier board 200 and the second temporary bonding layer 201 on the sensor chipset after the coating are removed to expose the second end of the metal electrode 4, and then a metal solder ball 6 is welded on the second end of each metal electrode 4 to facilitate the electrical connection of the package structure of the fan-out sensor obtained by cutting. When the metal solder ball 6 is welded on the second end of the metal electrode 4, the metal solder ball 6 can be formed on the exposed metal electrode 4 by ball planting, electroplating, evaporation or printing. The material of the metal solder ball 6 can be composed of conductive materials such as gold, silver, copper, tungsten, tin, etc. It is preferred to form the metal solder ball 6 on the second end of the metal electrode 4 by solder ball implantation.

[0036] like Fig.10As shown, the sensor chip group after being coated and welded with the metal solder balls 6 is cut to obtain a packaging structure of multiple fan-out sensors. When cutting the sensor chip group after being coated and welded with the metal solder balls 6, laser or other methods can be used for cutting.

[0037] The present invention completes the packaging of the sensor chip 2 by using the insulating sealing resin 3 and the metal electrode 4. The cooperation between the metal electrode 4 and the metal solder ball 6 can shorten the path of the packaging circuit and improve the response speed of the sensor. Compared with the packaging method using substrate welding wire or through silicon via, the packaging method of the present invention reduces the manufacturing cost and the complexity of the process flow, reduces the packaging volume, and improves the production efficiency.

[0038] Embodiment 2: like Fig.11 As shown, the present invention also provides a packaging structure of a fan-out sensor, which is manufactured by the packaging method of the fan-out sensor of the first embodiment, and includes: a sensor chip 2, an insulating sealing resin 3, a metal electrode 4, a glass 5 and a metal solder ball 6. The first surface of the sensor chip 2 includes an electrical pad area 21 and a sensing area 22. The glass 5 and the sensing area 22 match each other, and the lower surface of the glass 5 adheres to the sensing area 22. The first end of the metal electrode 4 is electrically connected to the electrical pad area 21, and the second end of the metal electrode 4 is electrically connected to the metal solder ball 6. The insulating sealing resin 3 covers the sensor chip 2 and the metal electrode 4, and the upper surface of the insulating sealing resin 3 is flush with the upper surface of the glass 5. Specifically, the glass 5 is arranged on the sensing area 22 of the sensor chip 2, and the sensing area 22 can be protected by the glass 5. At the same time, the electrical pad area 21 of the sensor chip 2 is electrically connected to the metal solder ball 6 through the metal electrode 4. The insulating sealing resin 3 covers the sensor chip 2 and the metal electrode 4, so as to realize the packaging protection of the sensor chip 2. The upper surface of the glass 5 is flush with the upper surface of the insulating sealing resin 3, ensuring the stability of the packaging structure and facilitating the user to trigger the sensing area 22. The metal solder balls 6 are exposed outside the insulating sealing resin 3, so that the packaging structure can be connected to the control motherboard through the metal solder balls 6.

[0039] The packaging structure of the present invention uses metal electrodes 4 to replace traditional substrate wire packaging, which can shorten the packaging line path, improve the response speed of the sensor, and reduce the volume of the packaging structure. The fan-out packaging can greatly improve production efficiency and significantly reduce manufacturing costs.

[0040] As an optional embodiment, the material of the metal electrode 4 includes at least one of gold, silver, copper, platinum, tungsten and titanium, and the material of the metal solder ball 6 includes at least one of gold, silver, copper, tungsten and tin. Specifically, the material of the metal electrode 4 includes at least one of gold, silver, copper, platinum, tungsten and titanium, and different metal combinations can be selected according to actual needs. The metal solder ball 6 can be electrically connected to the sensor chip 2 through the metal electrode 4. The material of the metal solder ball 6 can be selected according to actual needs, including but not limited to one or more combinations of metals such as gold, silver, copper, tungsten and tin.

[0041] As an optional embodiment, the glass 5 is a transparent glass 5 or a non-transparent glass 5, and the lower surface of the glass 5 is adhered to the sensing area 22 by an adhesive film or epoxy resin glue. Specifically, the glass 5 is adhered to the sensing area 22 of the sensor chip 2, and its adhesive material includes an adhesive film (DAF) or epoxy resin glue.

[0042] As an optional embodiment, the insulating sealing resin 3 is made of epoxy resin or plastic dry film. Specifically, when the insulating sealing resin 3 covers the sensor chip 2 and the metal electrode 4, transfer molding or other filling processes can be used. The insulating sealing resin 3 covers the sensor chip 2 and the metal electrode 4, which can achieve the insulation packaging of the sensor chip 2 and avoid signal interference. The insulating sealing resin 3 can be made of epoxy resin or plastic dry film.

[0043] The above description is only the preferred embodiment of the present invention. It is known to those skilled in the art that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. In addition, under the teachings of the present invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application belong to the protection scope of the present invention.

Claims

1. A packaging method for a fan-out sensor, characterized in that: include: Adhere the first surfaces of the plurality of sensor chips to the first carrier, and use an insulating sealing resin to perform a first plastic packaging on the plurality of sensor chips on the first carrier to obtain a packaged sensor chip group, wherein the first surface of each of the sensor chips includes an electrical pad area and a sensing area, and there is a spacing between two adjacent sensor chips; The first carrier board on the packaged sensor chipset is removed to expose the electrical pad area and the sensing area on the first surface of the packaged sensor chipset, and then the second surface of the packaged sensor chipset is adhered to a second carrier board; Each metal electrode penetrates the first surface and the second surface of the packaged sensor chipset and is welded to the corresponding electrical pad area, and a glass is adhered to each sensing area, and the insulating sealing resin is used again to perform a second packaging coating on the first surface of the packaged sensor chipset to obtain a coated sensor chipset; The second carrier board on the coated sensor chipset is removed to expose the metal electrodes on the second surface of the coated sensor chipset, and a metal solder ball is welded on each of the metal electrodes. The coated sensor chipset welded with the metal solder balls is then cut to obtain a packaging structure of multiple fan-out sensors.

2. The packaging method of the fan-out sensor according to claim 1, characterized in that: The first surfaces of the plurality of sensor chips are adhered to the first carrier, and the plurality of sensor chips on the first carrier are firstly plastic-sealed with an insulating sealing resin to obtain a packaged sensor chip group, including: Coating a temporary bonding adhesive on the first carrier to form a first temporary bonding layer; Adhere the first surfaces of the plurality of sensor chips to the first temporary bonding layer; The plurality of sensor chips on the first carrier board are firstly plastic-sealed using the insulating sealing resin to obtain a packaged sensor chip group.

3. The packaging method of the fan-out sensor according to claim 2, characterized in that: The method of removing the first carrier board on the packaged sensor chipset to expose the electrical pad area and the sensing area on the first surface of the packaged sensor chipset, and then adhering the second surface of the packaged sensor chipset to a second carrier board comprises: Removing the first carrier board and the first temporary bonding layer on the packaged sensor chipset to expose the electrical pad area and the sensing area on the first surface of the packaged sensor chipset; The first surface of the packaged sensor chipset is facing upward, and the second surface of the packaged sensor chipset is adhered to the second temporary bonding layer of the second carrier board.

4. The packaging method of the fan-out sensor according to claim 3, characterized in that: Each metal electrode penetrates the first surface and the second surface of the packaged sensor chipset and is welded to the corresponding electrical pad area, and a glass is adhered to each sensing area, and the insulating sealing resin is used again to perform a second packaging coating on the first surface of the packaged sensor chipset to obtain the coated sensor chipset, including: Making a plurality of metal electrodes penetrating the first surface and the second surface of the packaged sensor chipset, and welding the first end of each of the metal electrodes to the corresponding electrical pad area; Adhere one of the glasses to the sensing area of ​​each of the sensor chips; The insulating sealing resin is used to perform a second packaging coating on the side surface of each of the glass and the first surface of the packaged sensor chipset to obtain the packaged sensor chipset, wherein the first surface of the packaged sensor chipset is flush with the upper surface of the glass.

5. The packaging method of the fan-out sensor according to claim 4, characterized in that: The step of manufacturing a plurality of metal electrodes penetrating the first surface and the second surface of the packaged sensor chipset and electrically connecting the first ends of the metal electrodes to the corresponding electrical pad areas comprises: Forming plastic sealing through holes on the insulating sealing resin on both sides of each sensor chip by mechanical or laser means; At least one metal material selected from the group consisting of gold, silver, copper, tungsten and titanium is filled into the plastic package through hole by electroplating, sputtering or deposition, and the first end of the metal electrode is electrically connected to the corresponding electrical pad area.

6. The packaging method of the fan-out sensor according to claim 4, characterized in that: The second carrier board on the coated sensor chipset is removed, and a metal solder ball is welded on each of the exposed metal electrodes, and then the coated sensor chipset is cut to obtain a packaging structure of multiple fan-out sensors, including: Removing the second carrier board and the second temporary bonding layer on the coated sensor chipset to expose the second end of the metal electrode; Welding one of the metal solder balls onto the second end of each of the metal electrodes; The coated sensor chipset welded with the metal solder balls is cut to obtain a packaging structure of multiple fan-out sensors.

7. A packaging structure of a fan-out sensor, characterized in that: The fan-out sensor is manufactured by the packaging method of any one of claims 1 to 6, comprising: a sensor chip, an insulating sealing resin, a metal electrode, glass and a metal solder ball, The first surface of the sensor chip includes an electrical pad area and a sensing area, the glass matches the sensing area, and the lower surface of the glass adheres to the sensing area; The first end of the metal electrode is electrically connected to the electrical pad area, and the second end of the metal electrode is electrically connected to the metal solder ball; The insulating sealing resin covers the sensor chip and the metal electrode, and the upper surface of the insulating sealing resin is flush with the upper surface of the glass.

8. The packaging structure of the fan-out sensor according to claim 7, characterized in that: The material of the metal electrode includes at least one of gold, silver, copper, platinum, tungsten and titanium, and the material of the metal solder ball includes at least one of gold, silver, copper, tungsten and tin.

9. The packaging structure of the fan-out sensor according to claim 7, characterized in that: The glass is transparent glass or non-transparent glass, and the lower surface of the glass is adhered to the sensing area by an adhesive film or epoxy resin adhesive.

10. The packaging structure of the fan-out sensor according to claim 7, characterized in that: The insulating sealing resin is made of epoxy resin or plastic sealing dry film.

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