Hot press molding process and equipment for processing ceramic copper-clad plate

Abstract

The invention discloses a hot press molding process and equipment for ceramic copper-clad plate processing, and the hot press molding process comprises the following steps: S1, coating a ceramic substrate with a resin adhesive to prepare a product A, and preparing a copper material at the same time; s2, a copper material is attached to the product A, and a product B is manufactured; and S3, the product B is processed for 1 hour at the temperature of 150-200 DEG C through hot pressing equipment with an elastic module, and a finished product is manufactured. By processing the ceramic copper-clad plate through the process, the bubble discharging efficiency can be greatly improved, and the peeling strength of a finished product is improved. Meanwhile, due to the adoption of a hot pressing mode, the ceramic substrate does not need to be subjected to high-temperature firing, so that the processing temperature is lower than that of a traditional process, the oxidation degree of a finished product is lower, the deoxidation yield is indirectly improved, and the deoxidation time is shortened.

Description

Technical Field

[0001] The present invention relates to the technical field of hot pressing forming, and more particularly to a hot pressing forming process and equipment for processing ceramic copper clad plates. Background Art

[0002] There are two main processes for ceramic copper clad laminates currently used in the field of power semiconductor devices:

[0003] One is Direct Bonded Copper (DBC), which forms a strong bond by reacting high-temperature copper oxide with the oxide on the ceramic surface.

[0004] The other is active metal brazing (AMB), which connects copper foil and ceramics through active metal brazing filler metals (such as Ag-Cu-Ti).

[0005] Both solutions are processed by sintering process (chain furnace sintering and vacuum sintering);

[0006] Traditional sintering processes require temperatures between 1300°C and 1600°C, creating demanding production conditions. Furthermore, these high temperatures can cause deep oxidation in conductors, requiring the use of chemicals to remove the oxidation. This deoxidation process can be time-consuming, yield-poor, and incomplete. Therefore, optimizing the process, shortening the oxidation time, and improving the yield are key technical challenges addressed by this present invention. Summary of the Invention

[0007] The Summary of the Invention introduces a series of simplified concepts that will be further described in the Detailed Description of the Invention. The Summary of the Invention is not intended to limit the key features and essential features of the claimed technical solution, nor is it intended to determine the scope of protection of the claimed technical solution.

[0008] To at least partially solve the above problems, the present invention provides a hot pressing forming process for processing ceramic copper clad laminates, comprising the following steps:

[0009] S1: Coating resin glue on the ceramic substrate to make product A, and making copper material at the same time;

[0010] S2: Attach the copper material to product A to make product B;

[0011] S3: Product B is processed into a finished product through a hot pressing device with an elastic module at 150℃-200℃ for 1 hour.

[0012] Preferably, in step S3, the pressure is increased from 0.5 MPa to 1 MPa, and finally to 2 MPa, and the pressure changes in a gradient. The specific steps include:

[0013] S301: Low-pressure infiltration, the pressure is increased to 0.5 MPa to expel bubbles in the resin glue. After the bubbles are expelled, the temperature is raised to 90°C and optionally maintained at 90°C for 5 minutes;

[0014] S302: medium pressure compaction, temperature raised to 180°C, pressure increased from 0.5 MPa to 1 MPa, curing, when the degree of curing is not less than 30%, temperature raised to 190°C, and optionally maintained at 190°C for 10 minutes;

[0015] S303: High-pressure shaping, maintaining 190°C, increasing the pressure from 1Mpa to 2Mpa. When the degree of solidification is not less than 95%, cool and release the pressure, and take out the finished product.

[0016] Preferably, step S3 further includes:

[0017] S304: Finished product inspection: qualified products enter the next process, and unqualified products are scrapped or reworked;

[0018] When the finished product test result shows that the degree of curing does not meet the standard, the finished product with the degree of curing that does not meet the standard is placed in a hot pressing device for emergency curing at a temperature of 200°C.

[0019] Preferably, step S301 includes:

[0020] S3011: The upper die of the hot pressing equipment moves down to abut against the copper material to prevent horizontal displacement between the copper material and the ceramic substrate. The elastic module contacts the upper die. As the hydraulic system continues to pressurize, the elastic module begins to apply pressure to the center of the upper die. When the pressure reaches 0.1 MPa, the elastic module begins to apply pressure to the center and edges of the upper die simultaneously.

[0021] S3012: As the hydraulic system continues to pressurize, the elastic module continuously applies pressure to the upper die and monitors the center and edge pressures of the copper material in real time.

[0022] S3013: When the pressure reaches 0.5 MPa, the elastic module is compressed to the limit position.

[0023] A hot pressing forming device for processing ceramic copper-clad laminates, comprising a hydraulic system, a heating system, a monitoring system, an upper die, and a lower die arranged on the hot pressing device, wherein an elastic module is arranged between the hydraulic system of the upper die and the upper die, and the elastic module is electrically connected to the monitoring system;

[0024] When the pressure applied by the upper die reaches 0.1 MPa, the elastic module begins to apply pressure to the edge of the upper die;

[0025] When the pressure applied by the upper die reaches 0.5 MPa, the elastic module is compressed to the limit position.

[0026] Preferably, the elastic module is composed of a central pressure module and a flat pressure module, wherein a portion of the central pressure module is located on the top surface of the hydraulic system of the upper mold and is connected to the monitoring system, and another portion of the central pressure module is located on the top surface of the upper mold and at the center of the upper mold, and the flat pressure module is provided on the top surface of the upper mold and is located outside the central pressure module;

[0027] When the upper die abuts the copper material, the two parts of the central pressure module abut;

[0028] When the pressure applied by the central pressure module on the upper die reaches 0.1 MPa, the top of the plane pressure module abuts against the hydraulic system, and the plane pressure module and the central pressure module jointly apply pressure to the upper die.

[0029] Preferably, the central pressure module consists of a lower pressure member connected to the bottom surface of the hydraulic system, and an abutment member arranged at the center of the top surface of the upper mold. The bottom surface of the lower pressure member is an elastic spherical surface, and a plurality of abutment protrusions extending toward the abutment member are provided on the bottom surface. The lower pressure member abuts against the abutment member through the abutment protrusions.

[0030] Preferably, the number of the abutment protrusions is three, namely the first protrusion, the second protrusion and the third protrusion, the first protrusion and the second protrusion are both annular, the second protrusion is located inside the first protrusion, the third protrusion is located inside the second protrusion, and the third protrusion is circular, and the abutment member is composed of a fourth protrusion, a fifth protrusion and a sixth protrusion corresponding to the three abutment protrusions, the shape of the fourth protrusion is the projection of the first protrusion on the top surface of the upper mold, the shape of the fifth protrusion is the projection of the second protrusion on the top surface of the upper mold, and the sixth protrusion is the projection of the third protrusion on the top surface of the upper mold.

[0031] Preferably, the planar pressure module is composed of a plurality of elastic blocks, which are composed of two elastic rings arranged in parallel and a plurality of elastic support strips arranged between the two elastic rings. The support strips are arranged in a vertical direction, and the two ends of the support strips are respectively arranged on two opposite surfaces of the two elastic rings, and the support strips are arc-shaped.

[0032] Preferably, the elastic block also includes an elastic torsion bar, the two ends of which are respectively arranged on two opposite surfaces of the two elastic rings, and one end of the torsion bar is connected to a support bar, and the other end is connected to another adjacent support bar, and the torsion bar is arc-shaped.

[0033] Compared with the prior art, the present invention has at least the following beneficial effects:

[0034] The aforementioned process for processing ceramic copper-clad laminates significantly improves bubble removal efficiency and enhances the peel strength of the finished product. Furthermore, because hot pressing is used, the ceramic substrates no longer require high-temperature firing, allowing for lower processing temperatures compared to traditional processes. This in turn reduces the degree of oxidation in the finished product, indirectly increasing deoxidation yield and shortening deoxidation time.

[0035] The hot pressing forming process and equipment for processing ceramic copper clad laminates described in the present invention, and other advantages, objectives and features of the present invention will be reflected in part through the following description, and in part will be understood by technicians in this field through research and practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0037] Figure 1 Schematic diagram of the hot pressing equipment.

[0038] Figure 2 This is a schematic diagram of the elastic block and the abutment member on the top surface of the upper mold (the elastic block is not fully shown).

[0039] Figure 3 This is a schematic diagram of the lower pressure piece at the bottom of the hydraulic system.

[0040] Figure 4 This is a flow chart of the elastic module from applying force at the center to applying force all over the board.

[0041] Figure 5 for Figure 4 A magnified view of center.

[0042] Figure 6 Schematic diagram of a planar pressure module (not fully shown).

[0043] Figure 7 This is a structural diagram of the elastic block.

[0044] Figure 8 This is the main view of the elastic block.

[0045] Figure 9 Schematic diagram of the cross-sectional structure of the elastic block.

[0046] In the figure: 1 hot pressing equipment, 11 upper mold, 2 lower pressing piece, 21 first protrusion, 22 second protrusion, 23 third protrusion, 3 abutment piece, 31 fourth protrusion, 32 fifth protrusion, 33 sixth protrusion, 4 elastic block, 41a elastic ring, 41b elastic ring, 42 support bar, 42a support bar, 42b support bar, 43 torsion bar. DETAILED DESCRIPTION

[0047] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments so that those skilled in the art can implement the invention with reference to the description.

[0048] It should be understood that terms such as “having”, “including” and “comprising” used herein do not preclude the existence or addition of one or more other elements or combinations thereof.

[0049] like Figures 1-9 As shown, the present invention provides a hot pressing forming process for processing ceramic copper clad laminates, comprising the following steps:

[0050] S1: Coating resin glue on the ceramic substrate to make product A, and making copper material at the same time;

[0051] S2: Attach the copper material to product A to make product B;

[0052] S3: Product B is processed into a finished product by a hot pressing device 1 with an elastic module at 150°C-200°C for 1 hour. During the hot pressing process, the pressure is first increased from 0.5 MPa to 1 MPa and finally to 2 MPa, thereby causing the pressure to change gradually. Step S3 includes:

[0053] S301: Low-pressure infiltration, the pressure is increased to 0.5 MPa to expel bubbles in the resin glue. After the bubbles are expelled, the temperature is raised to 90°C and selectively maintained at 90°C for 5 minutes.

[0054] Wherein, step S301 includes:

[0055] S3011: The upper mold 11 of the hot pressing equipment 1 moves down to contact the copper material to avoid horizontal displacement between the copper material and the ceramic substrate in the initial stage of pressurization, which leads to interlayer misalignment. At this time, the elastic module is in contact with the upper mold 11. As the hydraulic system continues to pressurize, the elastic module begins to gradually apply pressure to the center of the upper mold 11. At this time, the pressure of the upper mold 11 on the copper material diffuses from the center of the copper material to the outside, thereby guiding the resin glue to flow from the center to the edge and reducing residual bubbles at the edge. When the pressure reaches 0.1Mpa, the elastic module begins to apply pressure to the center and edge of the upper mold 11 at the same time, so that the upper mold 11 can act on the copper material as a whole. By gradually increasing the pressure from the center to the edge, the problem of internal stress concentration of the resin glue can be effectively solved;

[0056] S3012: As the hydraulic system continues to pressurize, the elastic module continues to pressurize the upper die 11 and monitors the center pressure and edge pressure of the copper material in real time;

[0057] S3013: When the pressure reaches 0.5 MPa, the elastic module is compressed to the limit position.

[0058] S302: Medium pressure compaction, temperature raised to 180℃, pressure increased from 0.5Mpa to 1Mpa, curing. When the curing degree is not less than 30%, the temperature is raised to 190℃. The curing degree can be monitored by commercially available products or existing technologies such as dielectric sensors. According to production requirements and the thickness of the resin glue, the pressure can be increased to 1Mpa and the temperature can be increased to 190℃ before entering step S303. Alternatively, the temperature can be maintained at 190℃ for 10 minutes to ensure that the curing degree exceeds 30%, thereby improving the yield rate and reducing rework. The curing degree is usually maintained at 30%, because high pressure shaping is required later. If the curing degree exceeds 50%, cracking is likely to occur during high pressure shaping.

[0059] S303: High-pressure shaping, maintaining 190°C, increasing the pressure from 1Mpa to 2Mpa. When the degree of solidification is not less than 95%, cool and release the pressure, and take out the finished product.

[0060] S304: Finished product inspection: qualified products enter the next process, and unqualified products are scrapped or reworked;

[0061] When the finished product test result shows that the curing degree does not meet the standard, the finished product with the curing degree not meeting the standard is placed in the hot pressing device 1 for emergency curing, and the emergency curing temperature is 200°C.

[0062] It should be noted that because the present invention adopts diffused pressure from the center to the edge, compared with the traditional overall pressure of the upper and lower molds, it is necessary to fully consider the structure and material selection of the elastic module, whether the pressure distribution is uniform, and how to control the pressure.

[0063] The elastic module cannot directly use the springs or elastomer materials (such as rubber blocks) used in traditional technologies. If existing technologies are used directly, the center pressure may be too high and the edge pressure may be insufficient. Therefore, if existing technologies are used directly, the resin glue may flow unevenly and even the copper material may be deformed.

[0064] Because the present invention requires the use of elastic modules to apply force to the center and then diffuse it toward the edges (i.e., during the processing, the elastic modules must first be activated, and then converted to overall pressure), a monitoring system is required to monitor the central and edge pressures of the copper material in real time to avoid uneven force distribution. However, these monitoring systems are commercially available or are currently available.

[0065] The aforementioned process for processing ceramic copper-clad laminates significantly improves bubble removal efficiency and enhances the peel strength of the finished product. Furthermore, because hot pressing is used, the ceramic substrates no longer require high-temperature firing, allowing for lower processing temperatures compared to traditional processes. This in turn reduces the degree of oxidation in the finished product, indirectly increasing deoxidation yield and shortening deoxidation time.

[0066] A hot pressing forming device for processing ceramic copper clad laminates, comprising a hydraulic system, a heating system, a monitoring system, an upper die 11, and a lower die arranged on the hot pressing device 1. The hydraulic system of the upper die 11 is provided with an elastic module, which is electrically connected to the monitoring system.

[0067] When the upper mold 11 starts to apply pressure to the copper material, the elastic module applies pressure to the center of the upper mold 11, so that the pressure of the upper mold 11 on the center of the copper material is greater than the pressure on the edge, achieving the effect of squeezing out bubbles;

[0068] When the pressure applied by the upper mold 11 reaches 0.1 MPa, the elastic module begins to apply pressure to the edge of the upper mold 11. At this time, the elastic module 11 applies pressure to the upper mold 11 as a whole, so that the upper mold 11 applies pressure to the entire copper material and presses the resin glue evenly.

[0069] When the pressure applied by the upper die 11 reaches 0.5 MPa, the elastic module is compressed to the limit position, and then the pressure of the upper die 11 on the copper material is provided by the hydraulic system.

[0070] The elastic module is composed of a central pressure module and a flat pressure module. A portion of the central pressure module is located on the top surface of the hydraulic system of the upper mold 11 and is connected to the monitoring system. The other portion of the central pressure module is located on the top surface of the upper mold 11 and is located at the center of the upper mold 11. The flat pressure module is provided on the top surface of the upper mold 11 and is located outside the central pressure module.

[0071] When the upper die 11 contacts the copper material, the upper and lower parts of the central pressure module contact each other; as the hydraulic system moves downward, the central pressure module applies pressure to the center of the upper die 11, and the central pressure gradually increases as the hydraulic system moves downward.

[0072] When the pressure applied by the central pressure module on the upper mold 11 reaches 0.1 MPa, the top of the plane pressure module abuts against the hydraulic system, and the plane pressure module and the central pressure module jointly apply pressure to the upper mold 11 .

[0073] It should be noted that there is a free moving stroke between the upper die 11 and the hydraulic system, that is, when the planar pressure module is pressed to the limit position, the hydraulic system begins to generate downward pressure on the upper die 11.

[0074] In the aforementioned embodiment, we mentioned that the elastic module cannot directly use the existing technology. For this reason, we have carried out structural design and optimization of the elastic module. In this embodiment, the central pressure module is composed of a lower pressure part 2 connected to the bottom surface of the hydraulic system, and an abutment part 3 arranged at the center of the top surface of the upper mold 11. The bottom surface of the lower pressure part 2 is an elastic spherical surface, and the sensor of the detection system is located inside the lower pressure part 2 to monitor parameters such as the downward pressure distance of the lower pressure part 2.

[0075] As one of the many embodiments, the bottom surface of the pressing member 2 is provided with a plurality of abutting protrusions extending toward the abutting member 3, and the pressing member 2 abuts against the abutting member 3 through the abutting protrusions. The number of the abutting protrusions is three, namely a first protrusion 21, a second protrusion 22 and a third protrusion 23. The first protrusion 21 and the second protrusion 22 are both annular, the second protrusion 22 is located inside the first protrusion 21, and the third protrusion 23 is located inside the second protrusion 22. The third protrusion 23 is circular, as shown in FIG. Figure 3 and Figure 5 As shown, the abutment member 3 is composed of a fourth protrusion 31, a fifth protrusion 32 and a sixth protrusion 33 adapted to the three abutment protrusions. The fourth protrusion 31 and the fifth protrusion 32 are both annular. The fifth protrusion 32 is located inside the fourth protrusion 31. The sixth protrusion 33 is circular and located inside the fifth protrusion 32. The top surface of the abutment member 3 is a plane.

[0076] Because the bottom surface of the lower pressing member 2 is a spherical surface, the bottom surfaces of the three abutting protrusions of the lower pressing member 2 are all arc surfaces. In order to ensure that when the lower pressing member 2 abuts against the abutting member 3, the bottom surfaces of the three abutting protrusions of the lower pressing member 2 can all fit on the top surface of the abutting member 3, the shape of the fourth protrusion 31 is the projection of the first protrusion 21 on the top surface of the upper mold 11, the shape of the fifth protrusion 32 is the projection of the second protrusion 22 on the top surface of the upper mold 11, and the sixth protrusion 33 is the projection of the third protrusion 23 on the top surface of the upper mold 11.

[0077] When the upper mold 11 abuts against the surface of the copper material, the bottom surface of the third protrusion 23 abuts against the top surface of the sixth protrusion 33, as shown in FIG. Figure 4 As shown in A;

[0078] As the hydraulic system moves downward, the pressing member 2 moves downward, and the third protrusion 23, the second protrusion 22 and the first protrusion 21 are all attached to the surfaces of the sixth protrusion 33, the fifth protrusion 32 and the fourth protrusion 31 in sequence. Figure 4 As shown in A to E, the force exerted by the upper mold 11 on the copper material is diffused from the center to the edge of the copper material.

[0079] When the pressure applied by the upper die 11 reaches 0.1 MPa, the bottom surface of the hydraulic system abuts against the top surface of the plane pressure module, as shown in FIG. Figure 4As shown in E, as the hydraulic system moves downward, the hydraulic system will simultaneously compress the central pressure module and the plane pressure module, so that the upper mold 11 can apply pressure to the copper material as a whole and press the resin glue evenly.

[0080] When the pressure applied by the upper mold 11 reaches 0.5 MPa, the central pressure module and the plane pressure module both reach their limit positions. At this time, the hydraulic system directly applies force to the upper mold 11, thereby allowing the upper mold 11 to apply greater pressure to the copper material.

[0081] Furthermore, the planar pressure module is composed of a plurality of elastic blocks 4, which are usually connected or abutted against each other, such as Figure 6 As shown, to ensure uniform force.

[0082] As one of many embodiments, the elastic block 4 comprises two parallel elastic rings 41a and 41b, and a plurality of elastic support bars 42 disposed between the two elastic rings 41a and 41b. Elastic ring 41a is positioned above elastic ring 41b; elastic ring 41a abuts the bottom surface of the hydraulic system; and elastic ring 41b abuts or connects to the top surface of the upper mold 11. The annular structure of the elastic ring ensures the overall structural stability of the elastic block 4 while achieving a hollow design of the elastic block 4, thereby facilitating the installation of sensors in the monitoring system.

[0083] The support bar 42 is arranged in the vertical direction, and the two ends of the support bar 42 are respectively arranged on the two opposite surfaces of the two elastic rings 41a and 41b. Figure 7 As shown, the top of the support bar 42 is located on the bottom surface of the elastic ring 41a, and the bottom of the support bar 42 is located on the top surface of the elastic ring 41b. The support bar 42 is arc-shaped and bends toward the central axis of the elastic ring. Figure 7 As shown. Therefore, when the elastic block 4 is squeezed and deformed, the elastic ring 41a moves in the direction of the elastic ring 41b to squeeze the support bar 42. After being squeezed, the support bar 42 will deform toward the central axis of the elastic ring, so that the elastic block 4 will not increase in volume when it is deformed. Usually there are four support bars 42, and the angle between two adjacent support bars 42 is 90°. In order to make the elastic blocks 4 fit tightly with each other, four abutment surfaces are provided on the elastic ring. The four abutment surfaces are all provided on the outer wall of the elastic ring, and the angle between the two abutment surfaces is 90°. As a result, when the elastic blocks 4 form a planar pressure module, there can be sufficient contact area between each other to avoid misalignment.

[0084] Furthermore, the elastic block 4 further includes an elastic torsion bar 43, the two ends of which are respectively arranged on two opposite surfaces of the two elastic rings 41a and 41b (the top end of the torsion bar 43 is located on the bottom surface of the elastic ring 41a, and the bottom end is located on the top surface of the elastic ring 41b), and the top end of the torsion bar 43 is connected to a support bar 42a, and the bottom end is connected to another adjacent support bar 42b, as shown in FIG. Figure 7 、 Figure 8 、 Figure 9 As shown, the torsion bar 43 is arc-shaped and bends toward the central axis of the elastic ring. The torsion bar 43 forms an oblique tie bar that connects the two support bars 42 to each other, thereby increasing the strength of the elastic block 4 in the horizontal direction. Moreover, because the two ends of the torsion bar 43 are connected to the two elastic rings, they can support the two elastic rings. The torsion bar 43 bends toward the central axis of the elastic ring and can deform toward the inside of the elastic ring when deformation occurs, thereby preventing the elastic block 4 from increasing in volume when deformation occurs.

[0085] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0086] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0087] Although the embodiments of the present invention have been disclosed above, they are not limited to the applications listed in the description and implementation methods. They can be fully applied to various fields suitable for the present invention. For those familiar with the art, additional modifications can be easily implemented. Therefore, without departing from the general concept defined by the claims and the scope of equivalents, the present invention is not limited to the specific details and illustrations shown and described herein.

Claims

1. A hot pressing forming process for processing ceramic copper clad laminates, characterized in that: The steps are as follows: S1: Coating resin glue on the ceramic substrate to make product A, and making copper material at the same time; S2: Attach the copper material to product A to make product B; S3: Product B is processed into a finished product by a hot pressing device (1) with an elastic module at 150°C-200°C for 1 hour.

2. The hot pressing forming process for processing ceramic copper clad laminates according to claim 1, characterized in that: In step S3, the pressure is increased from 0.5 MPa to 1 MPa and finally to 2 MPa, and the pressure changes in a gradient. The specific steps include: S301: Low-pressure infiltration, the pressure is increased to 0.5 MPa to expel bubbles in the resin glue. After the bubbles are expelled, the temperature is raised to 90°C and optionally maintained at 90°C for 5 minutes; S302: medium pressure compaction, temperature raised to 180°C, pressure increased from 0.5 MPa to 1 MPa, curing, when the degree of curing is not less than 30%, temperature raised to 190°C, and optionally maintained at 190°C for 10 minutes; S303: High-pressure shaping, maintaining 190°C, increasing the pressure from 1Mpa to 2Mpa. When the degree of solidification is not less than 95%, cool and release the pressure, and take out the finished product.

3. The hot pressing forming process for processing ceramic copper clad laminates according to claim 2, characterized in that: Step S3 further includes: S304: Finished product inspection: qualified products enter the next process, and unqualified products are scrapped or reworked; When the finished product test result shows that the curing degree does not meet the standard, the finished product with the curing degree not meeting the standard is placed in a hot pressing device (1) for emergency curing, and the emergency curing temperature is 200°C.

4. The hot pressing forming process for processing ceramic copper clad laminates according to claim 2, characterized in that: Step S301 includes: S3011: The upper mold (11) of the hot pressing device (1) moves downward to contact the copper material to avoid horizontal displacement between the copper material and the ceramic substrate. The elastic module contacts the upper mold (11). As the hydraulic system continues to pressurize, the elastic module begins to apply pressure to the center of the upper mold (11). When the pressure reaches 0.1 MPa, the elastic module begins to apply pressure to the center and edge of the upper mold (11) at the same time. S3012: As the hydraulic system continues to pressurize, the elastic module continues to pressurize the upper die (11) and monitors the center pressure and edge pressure of the copper material in real time; S3013: When the pressure reaches 0.5 MPa, the elastic module is compressed to the limit position.

5. A hot pressing molding device for processing ceramic copper clad plates, comprising a hydraulic system, a heating system, a monitoring system, an upper mold (11) and a lower mold arranged on the hot pressing device (1), characterized in that: An elastic module is provided between the hydraulic system of the upper die (11) and the upper die (11), and the elastic module is electrically connected to the monitoring system; When the pressure applied by the upper mold (11) reaches 0.1 MPa, the elastic module starts to apply pressure to the edge of the upper mold (11); When the pressure applied by the upper die (11) reaches 0.5 MPa, the elastic module is compressed to the limit position.

6. The hot pressing forming equipment for processing ceramic copper clad laminates according to claim 5, characterized in that: The elastic module is composed of a central pressure module and a plane pressure module, a portion of the central pressure module is located on the top surface of the hydraulic system of the upper mold (11) and is connected to the monitoring system, another portion of the central pressure module is located on the top surface of the upper mold (11) and is located at the center of the upper mold (11), and the plane pressure module is arranged on the top surface of the upper mold (11) and is located outside the central pressure module; When the upper die (11) abuts against the copper material, the two parts of the central pressure module abut against each other; When the pressure applied by the central pressure module to the upper mold (11) reaches 0.1 MPa, the top of the plane pressure module abuts against the hydraulic system, and the plane pressure module and the central pressure module jointly apply pressure to the upper mold (11).

7. The hot pressing forming equipment for processing ceramic copper clad plates according to claim 6, characterized in that: The central pressure module is composed of a lower pressing member (2) connected to the bottom surface of the hydraulic system, and an abutting member (3) arranged at the center of the top surface of the upper mold (11). The bottom surface of the lower pressing member (2) is an elastic spherical surface, and a plurality of abutting protrusions extending toward the abutting member (3) are arranged on the bottom surface. The lower pressing member (2) abuts against the abutting member (3) through the abutting protrusions.

8. The hot pressing forming equipment for processing ceramic copper clad plates according to claim 7, characterized in that: The number of the abutting protrusions is three, namely a first protrusion (21), a second protrusion (22) and a third protrusion (23); the first protrusion (21) and the second protrusion (22) are both annular; the second protrusion (22) is located inside the first protrusion (21); the third protrusion (23) is located inside the second protrusion (22); the third protrusion (23) is circular; the abutting member (3) is composed of a fourth protrusion (31), a fifth protrusion (32) and a sixth protrusion (33) adapted to the three abutting protrusions; the shape of the fourth protrusion (31) is the projection of the first protrusion (21) on the top surface of the upper mold (11); the shape of the fifth protrusion (32) is the projection of the second protrusion (22) on the top surface of the upper mold (11); and the sixth protrusion (33) is the projection of the third protrusion (23) on the top surface of the upper mold (11).

9. The hot pressing forming equipment for processing ceramic copper clad laminates according to claim 6, characterized in that: The planar pressure module is composed of a plurality of elastic blocks (4), and the elastic blocks (4) are composed of two elastic rings (41a, 41b) arranged in parallel, and a plurality of elastic support bars (42) arranged between the two elastic rings (41a, 41b). The support bars (42) are arranged in a vertical direction, and the two ends of the support bars (42) are respectively arranged on two opposite surfaces of the two elastic rings (41a, 41b), and the support bars (42) are arc-shaped.

10. The hot pressing forming equipment for processing ceramic copper clad laminates according to claim 9, characterized in that: The elastic block (4) further comprises an elastic torsion bar (43), the two ends of which are respectively arranged on two opposite surfaces of the two elastic rings (41a, 41b), and one end of the torsion bar (43) is connected to a support bar (42a), and the other end is connected to another adjacent support bar (42b), and the torsion bar (43) is arc-shaped.

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