Fixture for electronic device weldability test

Abstract

The invention discloses a fixture for electronic device solderability test, which is used for being detachably connected with solderability test equipment, the solderability test equipment comprises a working table, and the working table is provided with a solder groove capable of lifting and moving. The base is detachably connected with the working table top, the support is connected with the base in a sliding mode and can move back and forth along the base, the clamping mechanism is connected with the support through a universal connecting assembly, the clamping mechanism is used for clamping a to-be-tested device, and the position of the clamping mechanism can correspond to that of the welding flux groove. The clamping mechanism comprises a clamping space used for clamping the device and a clamping adjusting mechanism used for adjusting the size of the clamping space and clamping the device, a test is completed through the clamp, the device is directly held by hand instead of manual work, safety accidents caused by handheld operation are avoided, the size of the clamping space can be adjusted, and the device is convenient to use. And more devices with different sizes and different shapes can be clamped, and the universality is higher.

Description

Technical Field

[0001] This invention belongs to the field of electronic device solderability testing technology, and specifically relates to a fixture for testing the solderability of electronic devices. Background Technology

[0002] Solderability testing of electronic components is a crucial step in verifying whether the device leads can be successfully soldered into the subsequent assembly using tin-lead eutectic solder, directly impacting the assembly quality and reliability of electronic devices. Through-hole mount devices, commonly used in electronic devices, mainly include dual in-line packages (DIP) and transistor outline (TO) packages. Their solderability testing has specific technical requirements. It must ensure that the device leads remain perpendicular to the solder bath surface during the test, and the solder bath temperature can reach as high as 245°C, imposing strict requirements on the standardization and safety of the test operation.

[0003] Currently, the clamping methods used in solderability testing of through-hole mounted devices are mainly divided into two categories: manual clamping and simple fixture-assisted clamping. Manual clamping requires operators to directly hold the device during testing, which, in a high-temperature environment of 245℃, easily leads to burns and other safety accidents. Furthermore, it is difficult to maintain the vertical position of the device leads for extended periods, resulting in insufficient accuracy of test data and seriously affecting the standardization of testing. While simple fixture-assisted clamping reduces the risks of manual operation to some extent, it has significant drawbacks: poor clamping stability, difficulty in adapting to dual in-line packages and transistor packages of different sizes, insufficient versatility, low testing efficiency, and inability to meet the needs of batch testing. Summary of the Invention

[0004] To address the technical problems existing in the prior art, the present invention provides a fixture for testing the solderability of electronic devices.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A fixture for solderability testing of electronic devices is provided for detachable connection to solderability testing equipment. The solderability testing equipment includes a worktable with a solder tank that can be raised and lowered. The fixture includes a base detachably connected to the worktable, a support slidably connected to the base and capable of reciprocating along the base, and a clamping mechanism connected to the support via a universal joint assembly. The clamping mechanism is used to clamp the device to be tested, and its position corresponds to the solder tank. The clamping mechanism includes a clamping space for clamping the device and a clamping adjustment mechanism for adjusting the size of the clamping space and clamping the device.

[0006] Furthermore, the clamping mechanism also includes an L-shaped base connected to the universal joint assembly and a base block detachably connected to the base. The base and the base block can form a clamping cavity with an opening direction opposite to the universal joint assembly. The base includes a base plate and a positioning block fixed to the lower end of the base plate. The positioning block and the base block are arranged at relative intervals and can surround the base plate to form a clamping cavity for clamping devices and installing the clamping adjustment mechanism.

[0007] Furthermore, the substrate has a plurality of sliding grooves spaced apart along the length of the substrate, and the base block slides into the sliding grooves one by one through a plurality of first sliding parts. The base block is connected to the substrate by bolts to lock the position of the base block.

[0008] Furthermore, the clamping adjustment mechanism includes a clamping block slidably connected to the sliding groove and an operating screw connected to one side of the clamping block and screwed to the positioning block. The space between the base block and the clamping block is defined as the clamping space. Rotating the operating screw drives the clamping block to reciprocate along the sliding groove toward or away from the base block, so that the size of the clamping space can be adjusted.

[0009] Furthermore, the operating screw has a handle portion distributed outside the clamping cavity. Furthermore, the clamping surfaces of both the clamping block and the base block are covered with a flexible contact layer.

[0010] Furthermore, the substrate is embedded with magnetic attracting elements distributed within the clamping cavity, which can be attracted and connected to the device.

[0011] Furthermore, the universal joint assembly includes a first fork screwed to the base plate at one end, a second fork screwed to the bracket at one end, and a cross shaft. The ends of the first fork and the second fork away from the screwed end are each provided with a mounting groove. The two ends of the cross shaft are respectively embedded in the mounting groove to form a rotatable hinge structure, so that the first fork and the second fork can be adjusted in multiple directions around the central axis of the cross shaft.

[0012] Furthermore, the support includes two spaced-apart L-shaped uprights and a crossbar connected between the two uprights and capable of being connected to the universal joint assembly. The uprights can be detachably connected to the base.

[0013] Furthermore, the base includes two spaced-apart sliding components that are connected one-to-one to the lower end of the stand. Each sliding component includes a slide rail that can be detachably connected to the workbench and a slider that is slidably connected to the slide rail. The slider can be detachably connected to the stand. The end face of the slider away from the stand is provided with a groove that cooperates with the slide rail. The slider is slidably connected to the slide rail through the groove.

[0014] In summary, the beneficial effects of this invention are: 1. Completely replaces manual hand operation, allowing operators to stay away from high-temperature solder baths through mechanical clamping and sliding adjustment, eliminating safety accidents such as burns. 2. Stable clamping to avoid test deviations: Initial positioning of the magnetic component + mechanical locking of the clamping adjustment mechanism + anti-slip adhesion of the flexible contact layer provide triple protection against displacement and loosening of the device during testing, ensuring reliable solderability test data. 3. Quick initial positioning of the magnetic component; clamping / unclamping can be completed with a simple rotation of the handle, requiring no additional tools, resulting in high efficiency in clamping and unclamping. 4. Adaptable to multiple device specifications: The base block can be moved and adjusted, while the operating screw can drive the clamping block to approach the base block and clamp the device between them. Changing the position of the clamping block is equivalent to adjusting the clamping space to adapt to the device, compatible with DIP packages, TO packages, and other through-hole mounting devices of different sizes and shapes, eliminating the need for frequent fixture changes and providing strong versatility. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of a fixture for testing the solderability of electronic devices provided by the present invention.

[0016] Figure 2 This is a three-dimensional structural diagram of the slider in this invention.

[0017] Figure 3 This is a schematic diagram of the bottom structure of the clamping mechanism in this invention.

[0018] Figure 4 yes Figure 3 The diagram shows the structure in which the components are clamped.

[0019] Figure 5 This is a schematic diagram of the universal connection component in this invention.

[0020] In the diagram, 100-sliding component, 110-slide rail, 120-slider, 121-screw hole, 122-slide groove, 200-bracket, 210-upright frame, 220-cross frame, 300-universal connection component, 310-first fork section, 320-second fork section, 330-cross shaft, 340-mounting groove, 400-clamping mechanism, 410-base, 411-base plate, 4110-sliding groove, 412-positioning block, 420-base block, 421-first sliding part, 430-clamping adjustment mechanism, 431-clamping block, 432-operating screw, 4320-handle part, 440-bolt, 450-magnetic component, 500-device, 510-pin. Detailed Implementation

[0021] The invention will be further illustrated below with reference to specific figures.

[0022] Please see Figure 1This invention provides a fixture for solderability testing of electronic devices, detachably connected to solderability testing equipment. The solderability testing equipment includes a worktable with a solder tray that can be raised and lowered. The fixture includes a base detachably connected to the worktable, a support 200 slidably connected to the base and capable of reciprocating along the base, and a clamping mechanism 400 connected to the support 200 via a universal joint assembly 300. The clamping mechanism 400 is used to clamp the device 500 to be tested, and its position corresponds to the solder tray. The clamping mechanism 400 includes a clamping space for holding the device 500 and a clamping adjustment mechanism 430 for adjusting the size of the clamping space and clamping the device 500. The base is mounted on the workbench, positioning the bracket 200 above the solder bath. The clamping mechanism 400, mounted on the bracket 200, is aligned with the solder bath. The clamping mechanism 400 is moved closer to or away from the operator via the sliding bracket 200. When clamping the device 500, the angle of the clamping mechanism 400 is adjusted via the universal joint assembly 300 to facilitate clamping. The clamping adjustment mechanism 430 allows for adjustment of the clamping space, accommodating devices 500 of various sizes. After the clamping mechanism 400 clamps the device 500, the sliding bracket 200 moves closer to the solder bath, the device angle is adjusted, and the solder bath is raised or lowered to bring the solder in the bath closer to the device 500 clamped on the clamping mechanism 400, completing the solderability test. The fixture replaces manual handling of the device, avoiding operator contact with the 245°C high-temperature solder. The entire process eliminates the need for manual contact with high-temperature areas, reducing the accident rate and meeting safety regulations for testing operations. The mechanical structure secures the device 500, and the universal joint assembly 300 adjusts the angle to ensure that the pins 510 of the device 500 are perpendicular to the solder bath surface. This stable verticality and clamping effect reduce the impact of operational deviations on test results, improving data accuracy and test standardization. The clamping adjustment mechanism 430 can flexibly adjust the clamping space to accommodate through-hole mounting devices 500 with different external dimensions, such as DIP and TO packages, and various device specifications, reducing fixture replacement costs and expanding the applicability range.

[0023] The base includes two spaced-apart sliding components 100 connected one-to-one to the lower end of the bracket 200. Each sliding component 100 includes a slide rail 110 detachably connected to the worktable surface and a slider 120 slidably connected to the slide rail 110. The two slide rails 110 are located on both sides of the solder bath and are screwed or snapped onto the worktable surface. Please refer to [link / reference]. Figure 2The upper end of the slider 120 has a screw hole 121, and a corresponding connecting hole is provided on the bracket 200. The screw hole 121 and the connecting hole are screwed together by bolts 440, thus securely mounting the bracket 200 on the upper end of the slider 120. The end face of the slider 120 away from the bracket 200 has a groove 122 that mates with the slide rail 110. The slider 120 is slidably connected to the slide rail 110 through the groove 122. The sliding of the slider 120 moves the bracket 200 closer to or further away from the operator, thereby moving the clamping mechanism 400, which is ultimately mounted on the bracket 200, closer to or further away from the operator. The position of the clamping mechanism 400 can be adjusted simply by sliding the slider 120 without moving the entire fixture, facilitating the operator's clamping of the device 500 and avoiding high-temperature areas. The cooperation between the slide rail 110 and the groove 122 restricts the movement direction of the bracket 200, preventing offset and indirectly ensuring the vertical alignment accuracy of the device 500 leads and the solder bath.

[0024] Please continue reading. Figure 1 The bracket 200 includes two spaced-apart L-shaped uprights 210 and a crossbeam 220 connected between the two uprights 210 and capable of connecting to the universal joint assembly 300. The bottom of the L-shaped uprights 210 can be screwed to the slider 120. The right-angle structure of the L-shaped uprights 210 has high rigidity, and with the connection and reinforcement of the crossbeam 220, the overall frame has strong resistance to deformation. After the uprights 210 and the crossbeam 220 are connected, a portal frame is formed. The height and span design of the portal frame facilitates the alignment of the clamping mechanism 400 with the solder groove, while reserving sufficient operating space to facilitate the adjustment of the device 500 angle via the universal joint assembly 300.

[0025] Please see Figure 3 and Figure 4The clamping mechanism 400 also includes an L-shaped base 410 connected to the universal joint assembly 300 and a base block 420 detachably connected to the base 410. The base 410 and the base block 420 can form a clamping cavity with an opening direction opposite to the universal joint assembly 300. The base 410 includes a base plate 411 and a positioning block 412 fixed to the lower end of the base plate 411. The positioning block 412 and the base block 420 are arranged at relative intervals and can surround the base plate 411 to form a clamping cavity for clamping the device 500 and installing the clamping adjustment mechanism 430. The base block 420 and the base 410 are detachably connected. If different sizes of electronic devices 500 are encountered, the size of the clamping cavity can be flexibly changed by replacing the base block 420 with different thicknesses and widths, or by adjusting the distance between the base block 420 and the positioning block 412, without replacing the entire clamping mechanism 400, thus solving the problem of limited adaptability of traditional clamps. When the base block 420 wears out due to long-term contact with the device or slight high-temperature conduction, the base block 420 can be replaced separately without replacing the entire clamping mechanism 400, thus reducing maintenance costs. In addition, for devices 500 with special shapes, base blocks 420 of corresponding shapes can also be customized, and only the parts need to be replaced to meet the test requirements, further expanding the applicable scenarios of the fixture.

[0026] The substrate 411 has a plurality of sliding grooves 4110 spaced apart along its length. The base block 420 slides in contact with the sliding grooves 4110 one by one through a plurality of first sliding parts 421. The base block 420 is connected to the substrate 411 by bolts 440 to lock its position. The clamping adjustment mechanism 430 includes a clamping block 431 slidably connected to the sliding grooves 4110 and an operating screw 432 connected to one side of the clamping block 431 and screwed to the positioning block 412. The space between the base block 420 and the clamping block 431 is defined as the clamping space. Rotating the operating screw 432 drives the clamping block 431 to reciprocate along the sliding grooves 4110 toward or away from the base block 420, thereby achieving an adjustable clamping space. The base block 420 can slide along the sliding groove 4110 to adjust its position as needed. The operating screw 432 drives the clamping block 431 to move, which can finely adjust the distance between the base block 420 and the clamping block 431. The base block 420 and the clamping block 431 can meet the clamping requirements of devices of different sizes. The sliding groove 4110 provides guidance for both the base block 420 and the clamping block 431, eliminating the need for multiple sets of additional guiding mechanisms and making the clamping mechanism 400 more compact. Please continue reading. Figure 3 and Figure 4A magnetic chuck 450 is embedded on the substrate 411 and distributed within the clamping cavity. The magnetic chuck 450 can be magnetically attached to the device 500. Both dual in-line package (DIP) devices and transistor outline (TO) packages can be attached to the magnetic chuck 450. During clamping, the device 500 is initially positioned by the magnetic chuck 500. The magnetic chuck 450 attaches the device 500 between the clamping block 431 and the base block 420. Then, the operating screw 432 is rotated, and the clamping block 431 pushes the device 500 towards the base block 420 until the two clamp the device 500. The leads and shells of DIP and TO packages are mostly made of metal, which can generate an attraction force with the magnetic chuck 450, quickly attaching the device 500 to the preset position between the clamping block 431 and the base block 420, preventing the device from shifting or tipping over during clamping. Adsorption positioning ensures that device 500 remains in the preset position in the clamping space, preventing device 500 from tilting or shifting when the screw is pushed. Mechanical clamping is completed on the basis of precise positioning, further ensuring that the lead wire can be aligned with the solder bath.

[0027] The operating screw 432 has a handle portion 4320 distributed outside the clamping cavity and located on one side of the positioning block 412. The handle portion 4320 is intuitively positioned and does not interfere with the operation point. The operator can quickly find the operation point and simply rotate it to complete the clamping / releasing without having to avoid other parts. It is especially suitable for the rapid clamping of batch devices 500.

[0028] Both the clamping surfaces of clamping block 431 and base block 420 are covered with a flexible contact layer. This flexible contact layer can be made of a high-temperature resistant, wear-resistant, and elastic material, such as silicone rubber or fluororubber. The elasticity of the flexible material absorbs the impact force during mechanical clamping, preventing rigid contact from causing deformation of the device 500's housing or bending damage to the pins 510. Furthermore, the flexible layer has a certain degree of surface roughness, which increases friction with the device 500's surface, preventing the device 500 from slipping due to slight vibrations during high-temperature testing. It can also slightly deform with the surface shape of the device 500, fitting both the planar housing of the dual in-line package (DIP) device 500 and the cylindrical housing of the TO package, ensuring full contact of the clamping surfaces.

[0029] Please see Figure 5The universal joint assembly 300 includes a first fork 310 screwed to the base plate 411 at one end, a second fork 320 screwed to the bracket 200 at one end, and a cross shaft 330. Both the first fork 310 and the second fork 320 have a mounting groove 340 at their ends away from the screwed ends. Both ends of the cross shaft 330 are respectively embedded in the mounting grooves 340 to form a rotatable hinge structure, allowing the first fork 310 and the second fork 320 to be adjusted in multiple directions around the central axis of the cross shaft 330. The hinge mechanism, where the two forks are screwed to the base plate 411 and the bracket 200 respectively, and the cross shaft 330 is embedded in the mounting grooves 340, ensures both rotational flexibility and the ability to support the weight of the clamping mechanism 400 and the device 500, preventing loosening of the connection. Multi-directional adjustment capability allows operators to precisely calibrate the position of device 500, resolving minor deviations caused by the installation of bracket 200 and the movement of sliding component 100, ensuring the accuracy of test data. Without disassembling the components, the clamping mechanism 400 can be manually adjusted to drive the two-section fork to rotate around the cross axis 330. After the angle is adjusted, it can maintain its position through its own friction, without the need for additional locking parts, thus speeding up test preparation. It is suitable for batch testing, with a wide angle adjustment range, which can quickly correct the positional deviation of clamping mechanism 400, ensuring that the pins 510 of device 500 are perpendicular to the solder bath surface, or adjusting the contact angle between device 500 and solder according to test requirements.

[0030] This solderability testing fixture offers the following advantages: 1. Completely replaces manual hand operation. Mechanical clamping and sliding adjustment keep operators away from the high-temperature solder bath, eliminating the risk of burns and other safety accidents. 2. Stable clamping prevents test deviations: The magnetic 450 provides initial positioning, the clamping adjustment mechanism 430 provides mechanical locking, and the flexible contact layer ensures a non-slip fit. These triple safeguards prevent displacement and loosening of component 500 during testing, ensuring reliable solderability test data. 3. The magnetic 450 provides quick initial positioning, and the handle 4320 allows for simple rotation to clamp / release without additional tools, resulting in high efficiency in clamping and retrieval. IV. Adaptable to multiple device specifications 500: The base block 420 can be moved and adjusted in position, while the operating screw 432 can drive the clamping block 431 to approach the base block 420 and clamp the device 500 between the two. The change in the position of the clamping block 431 is equivalent to the clamping space size being adjustable to adapt to the device 500. It is compatible with through-hole mounting devices 500 of different sizes and shapes, such as DIP packages and TO packages, without the need for frequent fixture changes, and has strong versatility.

[0031] The above are merely embodiments of the present invention and do not limit the patent scope of the present invention. Any equivalent structures made using the contents of the present invention specification and drawings, whether directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of the present invention.

Claims

1. A jig for electronic device solderability testing, for detachable connection with a solderability testing apparatus, said solderability testing apparatus comprising a worktable having a solder bath capable of being moved in a lifting motion, characterised in that: The device includes a base detachably connected with a workbench, a support slidably connected with the base and capable of reciprocating along the base, and a clamping mechanism connected with the support through a universal connecting assembly, the clamping mechanism being used for clamping a device to be tested and capable of corresponding to the solder tank, the clamping mechanism including a clamping adjusting mechanism having a clamping space for clamping the device and being capable of adjusting the size of the clamping space and clamping the device.

2. The jig for electronic device solderability testing according to claim 1, characterized by: The clamping mechanism further includes an L-shaped base connected with the universal connecting assembly and a base block detachably connected with the base, the base and the base block being capable of forming a clamping cavity with an opening direction away from the universal connecting assembly; the base includes a base plate and a positioning block fixedly connected with a lower end of the base plate, the positioning block and the base block being oppositely spaced and capable of forming the clamping cavity with the base plate for clamping the device and mounting the clamping adjusting mechanism.

3. The fixture for electronic device solderability testing according to claim 2, characterized in that: A plurality of sliding grooves are formed in the base plate and spaced along a length direction of the base plate, the base block is slidably connected with the sliding grooves through a plurality of first sliding portions, and the base block is connected with the base plate through bolts for locking the position of the base block.

4. The fixture for electronic device solderability testing according to claim 3, characterized by: The clamping adjusting mechanism includes a clamping block slidably connected with the sliding grooves and an operation screw rod connected with one side of the clamping block and screwed with the positioning block, a space between the base block and the clamping block is defined as the clamping space, and the operation screw rod is rotated for driving the clamping block to reciprocate along the sliding grooves in a direction approaching or away from the base block, so that the size of the clamping space can be adjusted.

5. The fixture for electronic device solderability testing of claim 4, wherein: The operation screw rod has a handle portion distributed outside the clamping cavity.

6. The fixture for electronic device solderability testing of claim 3, wherein: Clamping surfaces of the clamping block and the base block are covered with flexible contact layers.

7. The electronic device solderability test fixture of claim 2, wherein: A magnetic member distributed inside the clamping cavity is embedded in the base plate, and the magnetic member is capable of being adsorptively connected with the device.

8. The electronic device solderability test fixture of claim 2, wherein: The universal connecting assembly includes a first joint fork screwed with one end of the base plate, a second joint fork screwed with one end of the support, and a cross shaft, end portions of the first joint fork and the second joint fork away from the screwing ends are each provided with a mounting groove, and two ends of the cross shaft are respectively embedded in the mounting grooves to form a rotatable hinged structure, so that the first joint fork and the second joint fork can realize multidirectional angle adjustment around a central axis of the cross shaft.

9. The fixture for electronic device solderability testing according to any one of claims 1 to 8, characterized in that: The support includes two spaced L-shaped stands and a cross stand connected between the two stands and capable of being connected with the universal connecting assembly, and the stands are capable of being detachably connected with the base.

10. The fixture for electronic device solderability testing of claim 9, wherein: The base includes two spaced sliding assemblies one-to-one correspondingly connected with lower ends of the stands, each of the sliding assemblies includes a sliding rail capable of being detachably connected with the workbench and a sliding block slidably connected with the sliding rail, the sliding block is capable of being detachably connected with the stand, an end surface of the sliding block away from the stand is provided with a sliding groove matched with the sliding rail, and the sliding block is slidably connected with the sliding rail through the sliding groove.

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