Sensor and installation method thereof

Abstract

The invention relates to the technical field of sensors, in particular to a sensor and an installation method thereof. The sensor comprises a base, a circuit board and a thin film assembly, the lower end face of the base is provided with a base cavity, the upper end face of the base is provided with a base through hole communicated with the base cavity, the thin film assembly is arranged on the base, the base is an aluminum base or an aluminum alloy base, and the circuit board is a carbon steel circuit board. The circuit board is in fastening connection with the inner side wall of the concave cavity of the base through sintering processing; the LED lamp further comprises a sealing washer made of glass glaze, and the sealing washer is fixedly connected with the wall body of the concave cavity of the base through sintering processing and is arranged between the bottom surface of the concave cavity of the base and the circuit board. In the invention, the fastening connection between the sealing washer and the bottom surface of the concave cavity of the base as well as between the circuit board and the inner side wall of the concave cavity of the base is realized through two times of sintering processing, and the problem of insufficient sealing performance of the oil cavity caused by welding is avoided, so that the sealing performance of the oil cavity and the reliability of the sensor are improved.

Description

Technical Field

[0001] This invention relates to the field of sensor technology, and in particular to a sensor and its installation method. Background Technology

[0002] To transmit minute deformations, the sensor incorporates an oil cavity between the diaphragm and the sensing element. This oil cavity transmits the diaphragm's deformation to the sensing element, which then detects the deformation and generates a signal. The sensor element is then used to sense the vibration and deformation of the diaphragm. Existing technologies typically use a pressure ring to press and fix the circuit board to the base, with the pressure ring and base connected by welding. However, this method requires welding the pressure ring at high temperatures, and the welding depth must meet certain requirements to ensure the oil cavity's seal. Furthermore, ensuring a complete weld seam is difficult during the welding process. If any part of the weld seam is not tightly sealed, the oil cavity's seal will be insufficient, affecting the sensor's reliability during use. Summary of the Invention

[0003] The purpose of this invention is to solve the above-mentioned technical problems by providing a sensor and its installation method.

[0004] A sensor according to a first aspect of the present invention includes a base, a circuit board, and a thin film assembly. The lower end face of the base has a base cavity, and the upper end face of the base has a base through hole communicating with the base cavity. The circuit board has a circuit board through hole communicating with the base through hole, and a sealing solder ball is provided at the opening of the circuit board through hole. The thin film assembly is disposed on the base. The sensor is characterized in that the base is an aluminum base or an aluminum alloy base, the circuit board is a carbon steel circuit board, and the circuit board is fastened to the inner wall of the base cavity by sintering. The sensor also includes a sealing gasket made of glass glaze, which is fastened to the wall of the base cavity by sintering and is located between the bottom surface of the base cavity and the circuit board.

[0005] Preferably, the thickness of the circuit board is 0.4-0.65 times the depth of the base cavity, and the thickness of the sealing gasket is 0.25-0.5 times the thickness of the circuit board.

[0006] Preferably, the inner diameter of the sealing gasket is 0.95-1.1 times the inner diameter of the through hole in the base, and the outer diameter of the sealing gasket is equal to the inner diameter of the recess in the base.

[0007] Preferably, the sealing gasket has a rectangular cross-section, and the cross-sectional width of the sealing gasket is greater than 1.5 mm.

[0008] Preferably, one side of the base cavity is provided with a side groove, and the circuit board is provided with a circuit board protrusion that matches the side groove.

[0009] Preferably, the outer side wall of the base is provided with an L-shaped recess; the film assembly includes a film and a connecting ring, the film is disposed in the connecting ring, and when the connecting ring is assembled on the L-shaped recess, there is a gap between the film and the upper end face of the base, the gap is connected to the through hole of the base to form a T-shaped oil cavity, and oil is injected into the T-shaped oil cavity.

[0010] Preferably, the outer wall of the diaphragm is further provided with a diaphragm protrusion ring, the extension direction of the diaphragm protrusion ring is opposite to the extension direction of the connecting ring, and the height of the diaphragm protrusion ring is less than the height of the connecting ring.

[0011] According to a second aspect of the present invention, a sensor mounting method includes the following steps:

[0012] S110, uses a base made of aluminum or aluminum alloy, a circuit board made of carbon steel, and a sealing gasket made of glass glaze;

[0013] S120. First, the sealing gasket is assembled into the base cavity on the base, and the sealing gasket is sintered by sintering process so that the sealing gasket is firmly connected to the bottom surface of the base cavity. During the sintering process, the temperature in all directions is equal.

[0014] S130. The circuit board is assembled in the recess of the base and below the sealing gasket, and the circuit board is sintered to make the circuit board and the inner wall of the recess of the base securely connected.

[0015] S140. Press and assemble the connecting ring onto the L-shaped recess of the base, and weld and fix the connecting ring to the L-shaped recess. There is a gap between the thin film inside the connecting ring and the upper end face of the base. The gap is connected to the base through hole on the base to form a T-shaped oil cavity.

[0016] S150. After the connecting ring and the L-shaped recess are engaged, the connecting ring and the L-shaped recess can be fixed by hot welding. The welding operation is laser welding, and the welding temperature is 450°-700°.

[0017] S160. After injecting oil into the T-shaped oil cavity through the through hole on the circuit board, molten solder balls are used to fill the opening of the through hole on the circuit board to form a sealing solder ball.

[0018] The beneficial effects of this invention are as follows: the circuit board is assembled in the base cavity, the sealing gasket is set between the bottom surface of the base cavity and the circuit board, the base is made of aluminum or aluminum alloy, the sealing gasket is made of glass glaze, the circuit board is made of carbon steel, the sealing gasket is sintered to be firmly connected to the wall of the base cavity, and the circuit board is sintered twice to be firmly connected to the inner wall of the base cavity. The two sintering processes achieve a firm connection between the sealing gasket and the bottom surface of the base cavity and between the circuit board and the inner wall of the base cavity, avoiding the problem of insufficient sealing of the oil cavity due to welding, thereby improving the sealing performance of the oil cavity and the reliability of the sensor. Attached Figure Description

[0019] Figure 1 This is an overall structural diagram of the sensor provided in an embodiment of the present invention;

[0020] Figure 2 Another overall structural diagram of the sensor provided in an embodiment of the present invention;

[0021] Figure 3 A cross-sectional structural diagram of the sensor provided in an embodiment of the present invention;

[0022] Figure 4 This is an exploded view of the sensor provided in an embodiment of the present invention.

[0023] Figure label:

[0024] Base 1, base cavity 12, side groove 121, base through hole 13, base flange 14, clearance side 15;

[0025] Circuit board 2, circuit board protrusion 22, circuit board through hole 23;

[0026] Diaphragm 3, connecting ring 31, T-shaped oil cavity 32, diaphragm protrusion ring 33;

[0027] Sealing gasket 4;

[0028] 5. Sealing solder balls. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] This invention discloses a sensor, such as Figure 1-4As shown, the sealing connector includes a base 1, a circuit board 2, a sealing gasket 4, and a thin film assembly. The lower end face of the base 1 has a base cavity 12, and the upper end face of the base 1 has a base through hole 13 communicating with the base cavity 12. The circuit board 2 is assembled inside the base cavity 12, and the sealing gasket 4 is disposed between the bottom surface of the base cavity 12 and the circuit board 2. The base 1 is made of aluminum or aluminum alloy; the sealing gasket 4 is made of glass enamel; the circuit board 2 is made of carbon steel; the sealing gasket 4 is sintered to securely connect with the bottom surface of the base cavity 12; the circuit board 2 is sintered again to securely connect with the inner wall of the base cavity 12.

[0031] The sensor consists of a base 1, a circuit board 2, a sealing gasket 4, and a thin-film assembly. The lower end face of the base 1 has a base cavity 12, and the upper end face of the base 1 has a base through hole 13 communicating with the base cavity 12. The circuit board 2 and the sealing gasket 4 are both assembled within the base cavity 12, with the sealing gasket 4 abutting against the bottom surface of the base cavity 12. The circuit board 2 is made of carbon steel and houses the sensing assembly, which mainly consists of a sensing chip and connecting leads. The sealing gasket 4 is first assembled into the base cavity 12 and then sintered to ensure a tight connection between the sealing gasket 4 and the bottom surface of the base cavity 12. Because the temperature is uniform throughout the sintering process, a tight connection between the sealing gasket 4 and the base cavity 12 is ensured, preventing any sealing defects.

[0032] Furthermore, the circuit board 2 is assembled on the lower side of the sealing gasket 4 and sintered again to ensure a tight connection between the sealing gasket 4 and the inner wall of the base cavity 12, thereby improving the stability of the connection between the ceramic plate and the base cavity 12. The thin film assembly includes a thin film 3 and a connecting ring 31. An L-shaped recess is provided on the outer wall of the base 1, and a connecting ring 31 is provided on the outer wall of the thin film 3. The height of the connecting ring 31 extending toward the L-shaped recess is greater than the depth of the L-shaped recess. The connecting ring 31 is assembled onto the L-shaped recess. The connecting ring 31 is fixedly connected to the base 1. When the connecting ring 31 is assembled on the L-shaped recess, there is a gap between the diaphragm 3 and the upper end face of the base 1. The gap is connected to the through hole 13 of the base to form a T-shaped oil cavity 32, and oil is injected into the T-shaped oil cavity 32. The circuit board 2 is provided with a circuit board through hole 23 connected to the through hole 13 of the base. A sealing solder ball 5 is provided at the opening of the circuit board through hole 23. If the solder ball is melted by resistance welding, it is sealed at the opening of the circuit board through hole 23.

[0033] The connecting ring 31 is pressed onto the base 1, and its inner wall abuts against the L-shaped recess. The connecting ring 31 and the base 1 can be fixedly welded together. The opening of the circuit board through hole 23 is sealed by the sealing solder ball 5, thereby sealing the T-shaped oil cavity 32, which is filled with oil. The connecting ring 31 and the diaphragm 3 can be integrally molded and can be made of aluminum or aluminum alloy. The sealing gasket 4 is assembled into the base cavity 12 and sintered for the first time, thereby firmly connecting the sealing gasket 4 to the bottom surface of the base cavity 12. Then, the circuit board 2 is assembled below the sealing gasket 4 and sintered for the second time, thereby firmly connecting the circuit board 2 to the inner wall of the base cavity 12, thus obtaining a complete sensor.

[0034] In a more specific embodiment, the outer side wall of the diaphragm 3 is further provided with a diaphragm protrusion ring 33, the extension direction of the diaphragm protrusion ring 33 is opposite to the extension direction of the connecting ring 31, and the height of the diaphragm protrusion ring 33 is less than the height of the connecting ring 31.

[0035] To improve the tensile strength of diaphragm 3, a diaphragm protrusion ring 33 can be provided on the outer end face of diaphragm 3. The extending direction of the diaphragm protrusion ring 33 is opposite to the extending direction of the connecting ring 31. The specific structure is as follows: Figures 1 to 3 As shown. The inner diameter of the diaphragm protrusion 33 can be set to be equal to the inner diameter of the connecting ring 31, and the outer diameter of the diaphragm protrusion 33 can be set to be equal to the outer diameter of the connecting ring 31. Since the diaphragm protrusion 33 does not need to be correspondingly set according to the depth of the L-shaped recess, the height of the diaphragm protrusion 33 can be set to be less than the height of the connecting ring 31. The connecting ring 31, diaphragm 3, and diaphragm protrusion 33 can be manufactured by integral molding.

[0036] In a specific embodiment, the height of the diaphragm protrusion 33 can be set to 0.12-0.4 times the height of the connecting ring 31.

[0037] In a more specific embodiment, the thickness of the sealing gasket 4 is 0.25-0.5 times the thickness of the circuit board 2. Specifically, the thickness of the circuit board 2 is 0.4-0.65 times the depth of the base cavity 12.

[0038] Furthermore, to improve the sealing reliability of the sealing gasket 4, the thickness of the sealing gasket 4 should not be too thick or too thin. The thickness of the sealing gasket 4 can be less than the thickness of the circuit board 2. In specific applications, the thickness of the sealing gasket 4 can be set to 0.25-0.5 times the thickness of the circuit board 2. Furthermore, to ensure a stable connection between the side of the circuit board 2 and the inner wall of the base cavity 12, the thickness of the circuit board 2 can be set to 0.4-0.65 times the depth of the base cavity 12. This ensures sufficient contact area between the circuit board 2 and the base cavity 12, thereby improving the stability of the connection between the circuit board 2 and the base cavity 12 during sintering.

[0039] Furthermore, to ensure good sealing performance of the sealing gasket 4, the cross-section of the sealing gasket 4 can be set to rectangular, such as... Figure 3 As shown, the sealing gasket 4 has a large contact area with both the bottom surface of the base cavity 12 and the upper surface of the circuit board 2, thereby improving the sealing effect of the sealing gasket 4 on the oil cavity. In a more preferred embodiment, the cross-sectional width of the sealing gasket 4 can be set to 1.5 mm to ensure the width of the sealing contact between the sealing gasket 4 and the bottom surface of the base cavity 12 and the upper surface of the circuit board 2, further improving the sealing performance.

[0040] In a more specific embodiment, the inner diameter of the sealing gasket 4 is 0.95-1.1 times the inner diameter of the base through hole 13; the outer diameter of the sealing gasket 4 is equal to the inner diameter of the base cavity 12. The base cavity 12 has a side groove 121 on one side; the circuit board 2 has a circuit board protrusion that matches the side groove 121.

[0041] To ensure that the oil in the oil cavity can directly act on the sensor components on the circuit board 2 and to ensure good sealing, the ratio between the inner diameter of the sealing gasket 4 and the inner diameter of the base through hole 13 can be set to 0.95-1.1; preferably, the inner diameter of the sealing gasket 4 can be set to be equal to the inner diameter of the base through hole 13. Furthermore, the outer diameter of the sealing gasket 4 can be set to be equal to the inner diameter of the base cavity 12, thereby ensuring that the sealing gasket 4 can simultaneously abut against the bottom surface and inner wall of the base cavity 12, further improving the sealing performance of the sealing gasket 4. In addition, the outer diameter of the circuit board 2 can also be set to be equal to the inner diameter of the base cavity 12.

[0042] When assembling the circuit board 2 onto the base 1, to improve the tightness of the assembly, a side groove 121 can be provided on one side of the base cavity 12, as shown in the specific structure. Figure 4 As shown; and a circuit board protrusion 22 is provided on circuit board 2, the specific structure of which is as follows. Figure 4As shown. This configuration allows the circuit board 2 to be more tightly and securely mounted within the base cavity 12, preventing rotational displacement of the circuit board 2 during sintering and fixing. Furthermore, during assembly, the circuit board 2 can be positioned by the adaptation of the circuit board protrusion 22 with the side groove 121. Even if the circuit board 2 is rotated to the appropriate position and mounted within the base 1, this method ensures that each circuit board 2 is rotated to the same angle and mounted within the base 1, improving the consistency of the orientation of each sensing component (including the sensing chip and connecting leads) on the circuit board 2. This allows for rapid differentiation of the types of components on the circuit board 2 by obtaining the orientation of different sensing components (especially the connecting leads), improving the efficiency and accuracy of fixing and assembling the circuit board 2.

[0043] Specifically, the outer side wall of the base 1 is also provided with a base flange 14. One side of the base flange 14 is vertically cut to form a clearance side 15; the clearance side 15 and the side groove 121 of the base cavity 12 are located on the same side.

[0044] Specifically, to improve the stability of sensor assembly, a base flange 14 can be provided on the outer side wall of the base 1. The base flange 14 is flush with the bottom surface of the base 1. The specific structure is as follows: Figure 1 and Figure 2 As shown. Furthermore, to improve the accuracy of positioning the connecting leads on the circuit board 2 of the sensor, a clearance side 15 can be provided on one side of the base flange 14. The specific structure of the clearance side 15 is as follows... Figure 1 As shown, the side relief side 15 and the side groove 121 of the base cavity 12 are located on the same side, that is, the direction of the protrusion of the side groove 121 is directly opposite to the side relief side 15. Therefore, the position of the side groove 121 can be accurately determined by the position of the side relief side 15.

[0045] This invention also discloses a sensor mounting method, which is used to manufacture the sensor as described in the above embodiments. The mounting method specifically includes the following steps:

[0046] S110, a base 1 made of aluminum or aluminum alloy, a circuit board 2 made of carbon steel, and a sealing gasket 4 made of glass glaze are selected;

[0047] S120. First, the sealing gasket 4 is assembled into the base cavity 12 on the base 1, and the sealing gasket 4 is sintered by sintering process so that the sealing gasket 4 is firmly connected to the bottom surface of the base cavity 12. During the sintering process, the temperature in all directions is equal.

[0048] S130. The circuit board 2 is assembled in the base cavity 12 and below the sealing gasket 4, and the circuit board 2 is sintered to make the circuit board 2 and the inner wall of the base cavity 12 securely connected.

[0049] S140. Press and assemble the connecting ring 31 onto the L-shaped recess of the base 1, and weld and fix the connecting ring 31 to the L-shaped recess. There is a gap between the thin film 3 inside the connecting ring 31 and the upper end face of the base 1. The gap is connected to the base through hole 13 on the base 1 to form a T-shaped oil cavity 32.

[0050] S150. After the connecting ring 31 is engaged with the L-shaped recess, the connecting ring 31 and the L-shaped recess can be welded and fixed by heat welding. The welding operation is laser welding, and the welding temperature is 450°-700°.

[0051] S160. After injecting oil into the T-shaped oil cavity 32 through the through hole 23 on the circuit board 2, molten solder balls are used to fill the opening of the through hole 23 on the circuit board to form a sealing solder ball 5.

[0052] It should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0053] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A sensor, comprising a base, a circuit board, and a thin-film assembly, wherein the lower end face of the base has a base cavity, the upper end face of the base has a base through hole communicating with the base cavity, the circuit board has a circuit board through hole communicating with the base through hole, a sealing solder ball is provided at the opening of the circuit board through hole, and the thin-film assembly is disposed on the base, characterized in that, The base is an aluminum base or an aluminum alloy base, the circuit board is a carbon steel circuit board, and the circuit board is fixedly connected with the inner side wall of the base cavity through sintering processing; further comprising a sealing gasket made of glass glaze, which is fixedly connected with the wall of the base cavity through sintering processing and between the bottom surface of the base cavity and the circuit board.

2. A sensor according to claim 1, characterised in that: The thickness of the circuit board is 0.4-0.65 times the depth of the base cavity, and the thickness of the sealing gasket is 0.25-0.5 times the thickness of the circuit board.

3. The sensor of claim 1, wherein: The inner diameter of the sealing gasket is 0.95-1.1 times the inner diameter of the base through hole, and the outer diameter of the sealing gasket is equal to the inner diameter of the base cavity.

4. The sensor of claim 1, wherein: The cross section of the sealing gasket is rectangular, and the cross section width of the sealing gasket is greater than 1.5 mm.

5. The sensor of claim 1, wherein: One side of the base cavity is provided with a side edge groove, and the circuit board is provided with a circuit board protrusion matched with the side edge groove.

6. The sensor of claim 1, wherein: The outer side wall of the base is provided with an L-shaped recess; the thin film assembly comprises a thin film and a connecting ring, the thin film is arranged in the connecting ring, and when the connecting ring is assembled on the L-shaped recess, the thin film has a gap between the upper end surface of the base, the gap is communicated with the base through hole to form a T-shaped oil cavity, and the T-shaped oil cavity is filled with oil.

7. A sensor according to claim 6, characterised in that: The outer side wall of the diaphragm is further provided with a diaphragm protruding ring, the extension direction of the diaphragm protruding ring is opposite to the extension direction of the connecting ring, and the height of the diaphragm protruding ring is less than the height of the connecting ring.

8. A sensor mounting method characterized by, The method comprises the following steps: S110, selecting a base made of aluminum or aluminum alloy, a circuit board made of carbon steel and a sealing gasket made of glass glaze; S120, first assemble the sealing gasket in the base cavity on the base, and sinter the sealing gasket by sintering processing, so that the sealing gasket is fixedly connected with the bottom surface of the base cavity, and the temperature of each direction is equal during sintering processing; S130, assemble the circuit board in the base cavity below the sealing gasket, and sinter the circuit board to fixedly connect the circuit board with the inner side wall of the base cavity; S140, press-fit the connecting ring on the L-shaped recess of the base, and weld the connecting ring and the L-shaped recess, the thin film in the connecting ring has a gap between the upper end surface of the base, and the gap is communicated with the base through hole to form a T-shaped oil cavity; S150, after the connecting ring cooperates with the L-shaped recess, the connecting ring and the L-shaped recess can be welded and fixed by heat welding, the welding operation is laser welding, and the welding temperature is 450°-700°; S160, after injecting oil into the T-shaped oil cavity through the through hole on the circuit board, use molten tin balls to fill the opening of the circuit board through hole to form a sealing tin ball.

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